Semiconductor packaging material pressure testing machine

Abstract

The invention relates to the technical field of performance testing, in particular to a semiconductor packaging material pressure testing machine, which comprises a testing driving part, a pressure testing part and a pressure testing part, the pressure distribution part is connected with the test driving part and is used for decomposing single power and synchronously transmitting the single power to a plurality of output ends; the test piece is connected with the pressure distribution piece and is used for applying pressure to the chip and monitoring the chip; the test station is used for placing a chip; the number of the testing pieces is at least two, the number of the testing stations is at least two, and the testing stations correspond to the testing pieces in a one-to-one mode, and the device has the effect of efficiently, accurately and reliably achieving batch parallel pressure and electrical performance integrated testing of semiconductor packaging materials.

Description

Technical Field

[0001] This invention relates to the technical field of performance testing, and in particular to a pressure testing machine for semiconductor packaging materials. Background Technology

[0002] Semiconductor packaging is a critical step in chip manufacturing, and the reliability and integrity of packaging materials directly determine the performance and lifespan of the final product. Stress testing is one of the core methods for evaluating the mechanical strength and interfacial bonding reliability of semiconductor packaging materials.

[0003] Currently, most pressure testing equipment used in the industry adopts a single-station sequential testing mode, where one power drive head applies pressure to only one semiconductor chip at a time and performs the test. This mode has two main drawbacks: firstly, it has extremely low testing efficiency and cannot meet the needs of modern manufacturing for rapid quality screening of large batches of chips, becoming a bottleneck in the production process; secondly, sequential testing makes it difficult to guarantee the consistency of testing conditions for different chips within a batch, which may introduce additional testing errors and affect the comparability and accuracy of the data.

[0004] Furthermore, traditional stress testing equipment is limited in function, typically only capable of mechanical stress testing and unable to simultaneously monitor electrical performance. Operators must transfer the chip to dedicated electrical performance testing equipment for secondary testing after the stress test. This separate testing process not only further reduces overall efficiency but also makes it difficult to capture the dynamic changes in the chip's electrical performance parameters at the moment of pressure application, missing potential instantaneous failure information and hindering a comprehensive assessment of the chip's reliability under real-world operating conditions.

[0005] In terms of pressure control, many existing devices directly control pressure through the displacement of drive components or simple limiting, resulting in a harsh pressure application curve that is prone to pressure shocks, causing unpredictable damage to brittle semiconductor chips. Furthermore, the lack of convenient and precise pressure adjustment mechanisms makes it difficult to quickly set optimal test parameters for different models and specifications of chips. Summary of the Invention

[0006] In view of the shortcomings of the existing technology, the purpose of this invention is to provide a high-efficiency, high-precision, multi-functional integrated, and easy-to-operate pressure testing machine for semiconductor packaging materials.

[0007] The above-mentioned objective of this invention is achieved through the following technical solutions: A semiconductor packaging material pressure testing machine, comprising: Test drivers are used to provide power for testing; A pressure distribution component, connected to the test drive component, is used to decompose a single power source and synchronously transmit it to multiple output terminals; The test piece, connected to the pressure distribution component, is used to apply pressure to the chip and monitor it; The testing station is used to place chips; There are at least two test pieces, and there are at least two test stations, each corresponding to one of the test pieces.

[0008] As one embodiment of a semiconductor packaging material pressure testing machine disclosed in this invention, the test piece includes a test shell connected to the pressure distribution component and a test end for contacting the test material, and a pressure probe is installed on the lower end face of the test end. The test housing has an internal cavity, and the test end can be slidably installed in the cavity relative to the test housing and penetrates the lower end face of the test housing.

[0009] As one embodiment of the semiconductor packaging material pressure testing machine disclosed in this invention, an electrical performance testing probe is also installed on the lower end face of the testing end. The electrical performance testing probe is used to monitor the electrical performance parameters of the chip while applying pressure.

[0010] As one embodiment of the semiconductor packaging material pressure testing machine disclosed in this invention, the testing end is connected to the inner wall of the testing shell through a pre-tightening spring, and the pre-tightening force of the pre-tightening spring is adjustable.

[0011] As one embodiment of the semiconductor packaging material pressure testing machine disclosed in this invention, the test end sidewall has an adjustment hole, the test shell has an adjustment groove, and an adjustment block is fixedly installed at the sidewall of the adjustment groove. The adjustment block is threadedly connected to an adjustment screw, the adjustment screw passes through the adjustment block and abuts against the adjustment hole, and the contact surface between the adjustment block and the adjustment hole is an inclined surface.

[0012] As one embodiment of the semiconductor packaging material pressure testing machine disclosed in this invention, the pressure distribution component includes a guide plate, which is fixedly installed at the output end of the test drive component, and a plurality of guide rods pass through the guide plate. A sliding seat is fixed to the guide plate by bolts. As one embodiment of the semiconductor packaging material pressure testing machine disclosed in this invention, an assembly plate is installed on the lower end face of the guide plate, the test piece is installed on the assembly plate, and the assembly plate is slidable relative to the guide plate.

[0013] As one embodiment of a semiconductor packaging material pressure testing machine disclosed in this invention, the lower end face of the guide plate extends multiple sets of horizontal guide components, the horizontal guide components including; A fixing plate is installed on the lower end face of the guide plate; A sliding rod is fixedly installed on the side of the fixed plate, the sliding rod passes through the assembly plate and is slidably connected to the assembly plate; A horizontal drive component is fixedly installed at the lower end of the guide plate to drive the assembly plate to slide.

[0014] As one embodiment of the semiconductor packaging material pressure testing machine disclosed in this invention, the testing station is equipped with a pressure sensor, which is used to monitor the pressure value applied to the corresponding chip in real time.

[0015] As one embodiment of the semiconductor packaging material pressure testing machine disclosed in this invention, the station layout of the testing station is a linear array.

[0016] In summary, the present invention has at least one of the following beneficial technical effects: 1. The pressure testing machine disclosed in this invention, through its innovative pressure distribution structure, utilizes a single drive source to synchronously drive multiple test pieces, thereby achieving parallel synchronous pressure testing of multiple semiconductor chips and greatly improving testing efficiency; 2. The pressure testing machine disclosed in this invention independently integrates pressure probes and electrical performance testing probes at the lower end of each test piece, realizing the simultaneous performance of mechanical pressure testing and electrical performance monitoring. This firstly avoids the time waste and chip damage risk caused by secondary testing, and secondly captures the dynamic changes in the chip's electrical performance under pressure load, providing richer and more accurate real-time data for reliability analysis. The independent data collection at each station ensures the independence and accuracy of data in batch testing. 3. The pressure testing machine disclosed in this invention uses a pre-tensioned spring as the main pressure application and buffering medium. The spring pre-tension force can be steplessly adjusted via a sloping adjustment mechanism formed by the adjusting screw, adjusting block, and adjusting hole, thereby achieving precise and smooth control of the pressure application curve. This mechanism effectively avoids damage to the chip from pressure shocks and can flexibly adapt to the testing pressure requirements of different products, exhibiting strong versatility. 4. The pressure testing machine disclosed in this invention adopts a linear array layout for its testing station, which is compact and greatly improves the space utilization of the equipment. It also facilitates the operator to quickly load, position, and pick up multiple chips at the same time, further improving the efficiency of the overall testing process. 5. The pressure testing machine disclosed in this invention realizes the overall insertion and removal of the test piece through a horizontal guide component and a horizontal drive component, which facilitates the exposure and operation of the testing station and the testing of different positions of the chip. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of an embodiment of a semiconductor packaging material pressure testing machine disclosed in this invention; Figure 2 This is a schematic diagram of the pressure distribution component and the test piece of an embodiment of a semiconductor packaging material pressure testing machine disclosed in this invention; Figure 3 This is a schematic diagram of the structure of a test piece according to an embodiment of a semiconductor packaging material pressure testing machine disclosed in this invention; Figure 4 yes Figure 3 A sectional view of section AA; Figure 5 This is a schematic diagram of the test platform of an embodiment of a semiconductor packaging material pressure testing machine disclosed in this invention.

[0018] Figure label: 1. Support base; 11. Support leg; 111. Support foot; 12. Support frame; 2. Test driver; 3. Pressure distribution component; 31. Guide plate; 32. Guide rod; 33. Assembly plate; 34. Horizontal guide assembly; 341. Fixing plate; 342. Sliding rod; 343. Horizontal drive component; 4. Test piece; 41. Test housing; 411. Adjustment groove; 412. Mounting block; 413. Adjustment screw; 414. Adjustment block; 42. Test end; 421. Adjustment hole; 43. Preload spring; 5. Testing station. Detailed Implementation

[0019] The present invention will be further described in detail below with reference to the accompanying drawings.

[0020] Please see Figure 1-5 This invention discloses a semiconductor packaging material pressure testing machine, comprising a support base 1, preferably made of cast iron or high-strength alloy steel to ensure overall structural stability and resistance to deformation. Four support legs 11 are bolted to the lower end face of the support base 1, with a double-nut anti-loosening structure at the bolt connections to prevent loosening due to vibration during equipment operation. The lower ends of the support legs 11 are machined into disc-shaped support feet 111 to increase the contact area with the ground, thereby reducing the pressure on the ground, enhancing equipment stability, and preventing the support legs 11 from damaging the ground or themselves due to concentrated pressure.

[0021] The upper surface of the support base 1 forms a horizontal test platform for supporting and positioning the semiconductor chip under test. The surface of the test platform can be ground or fitted with positioning clamps to ensure precise alignment of the test station 5. A frame-type support frame 12, constructed from multiple welded or bolted steel plates, is fixedly installed on the upper surface of the test platform, providing a stable mounting foundation for the upper test drive mechanism. The upper surface of the support frame 12 is equipped with a test drive component 2, which serves as the core power source. In this embodiment, a high-precision cylinder is preferably used, but it can also be replaced with a servo electric cylinder or a hydraulic cylinder depending on the test force range. The output end of the test drive component 2 is connected downward to a pressure distribution component 3. Specifically, the main body of the pressure distribution component 3 is a rigid guide plate 31, which is directly fixed to the end of the piston rod of the cylinder by bolts. Multiple optical axis guide rods 32 are symmetrically installed through the guide plate 31. The two ends of the guide rods 32 are fixed to the support frame 12 to ensure that the guide plate 31 can move stably in the vertical direction under the drive of the cylinder and prevent uneven load.

[0022] A horizontally movable assembly plate 33 is mounted on the lower end face of the guide plate 31. In some feasible embodiments, the assembly plate 33 and the guide plate 31 are connected by a horizontal guide assembly 34. Each horizontal guide assembly 34 includes: a fixing plate 341 vertically fixed to the lower surface of the guide plate 31, a horizontal axis sliding rod 342 that passes through the assembly plate 33, and a horizontal drive component 343, which can be a small cylinder or an electric actuator. The horizontal drive component 343 is fixed to the guide plate 31, and its output end is connected to the assembly plate 33. It is used to drive the assembly plate 33 and the multiple test pieces 4 integrated on it to move in the horizontal direction, which facilitates alignment before testing, reset after testing, and pressure testing of different positions of the chip.

[0023] Multiple test pieces 4 are evenly installed below the assembly plate 33 by bolts or welding, and the number can be set to two or more according to the testing requirements. Each test piece 4 includes a cylindrical test shell 41 fixed to the assembly plate 33, and the test shell 41 has a cavity machined inside. A rod-shaped test end 42 is installed in the cavity by sliding up and down through a linear bearing, and its lower end penetrates the test shell 41 and is exposed to the outside.

[0024] The lower end face of the test terminal 42 is equipped with a pressure probe for applying mechanical pressure and an electrical performance test probe for synchronously monitoring the electrical performance parameters of the chip. The upper part of the test terminal 42 is connected to the inner top wall of the test housing 41 via a preload spring 43, the preload force of which is adjustable.

[0025] In one specific embodiment of the present invention, an inclined adjustment hole 421 is machined on the side wall of the test end 42, and a corresponding elongated adjustment groove 411 is formed on the side wall of the test housing 41. A wedge-shaped adjustment block 414 is inserted into the adjustment groove 411, and its inclined surface matches the inclined surface of the adjustment hole 421. A fixed mounting block 412 is fixed tightly against the outer wall of the test housing 41, and an adjustment screw 413 passes through the mounting block 412 and is threaded into it, with one end of the adjustment screw 413 pressing against the adjustment block 414. By rotating the adjustment screw 413, the adjustment block 414 can be pushed to move along the inclined surface, thereby precisely pushing the test end 42, changing its initial position in the test housing 41, and realizing stepless adjustment of the preload force of the preload spring 43. For ease of operation, a graduated pressure scale can be added to the mounting block 412 or the outer wall of the test housing 41 to visually display the relative magnitude of the current preload force.

[0026] This design ensures that the primary source of pressure on the workpiece comes from the preload spring 43, rather than the test drive component 2. During pressure testing, the test drive component 2 drives the test end 42 towards the chip. When the test end 42 contacts the chip, and as the test end 42 continues to press down, if the applied pressure exceeds the preload force of the preload spring 43 and other basic forces, the preload spring 43 is compressed, thereby increasing the pressure. The pressure increase process is relatively smooth due to the preload spring 43. Adjusting the preload force of the preload spring 43 allows for adjustment of the pressure curve applied to the chip. On the upper surface of the testing platform, there are multiple test stations 5, each corresponding to a test piece 4. These stations are arranged in a compact linear array, facilitating the simultaneous loading and unloading of multiple chips by the operator. Each test station 5 is equipped with a high-precision pressure sensor, used to monitor and provide real-time feedback of the pressure applied to the corresponding chip.

[0027] When the equipment is in operation, the assembly plate 33 and test pieces 4 are first moved to the loading / unloading position by the horizontal drive 343. The operator then precisely places multiple semiconductor chips on each test station 5. Subsequently, the horizontal drive 343 drives the test pieces 4 to reset to directly above the test position. The test drive 2 is activated, pushing the guide plate 31, sliding seat, assembly plate 33, and all test pieces 4 downwards together. When the probes at the lower end of each test end 42 contact the chip, the test drive 2 continues to press down, causing the test end 42 to slide upwards relative to the test shell 41, compressing the preload spring 43. At this time, the actual pressure applied to the chip is mainly provided by the compression force of the preload spring 43. By precisely adjusting the preload force of the preload spring 43, smooth control of the pressure application curve can be achieved. Throughout the pressure application process, the electrical performance test probes collect the electrical signals of the chip in real time, while the pressure sensors on the station collect the pressure data synchronously. All data is transmitted to the external control system for processing, display, and recording, thereby realizing synchronous, independent, and accurate testing of the pressure and electrical performance of batch chips. After the test, the cylinder retracts, and under the reset action of the preload spring 43, the test end 42 automatically returns to its original position. The horizontal drive component 343 can then move again to remove the test piece 4, making it easier to remove the tested chip.

[0028] Through the above implementation method, the equipment realizes synchronous pressure application and electrical performance testing of multiple stations using a single drive source, which greatly improves the testing efficiency; the preload adjustment mechanism of the preload spring 43 ensures the accuracy and adjustability of pressure control; the compact linear station layout optimizes space utilization and ease of operation.

[0029] The embodiments described herein are preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Therefore, all equivalent changes made in accordance with the structure, shape, and principle of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A pressure testing machine for semiconductor packaging materials, characterized in that, include: Test driver (2) is used to provide test power; The pressure distribution component (3) is connected to the test drive component (2) and is used to decompose a single power and transmit it synchronously to multiple output terminals; The test piece (4) is connected to the pressure distribution piece (3) and is used to apply pressure to the chip and monitor it; Test station (5) is used to place chips; At least two test pieces (4) are provided, and at least two test stations (5) are provided, each corresponding to one of the test pieces (4).

2. The semiconductor packaging material pressure testing machine according to claim 1, characterized in that: The test piece (4) includes a test shell (41) connected to the pressure distribution piece (3) and a test end (42) for contacting the test material, wherein a pressure probe is mounted on the lower end face of the test end (42). The test shell (41) has a cavity inside, and the test end (42) can be slidably installed in the cavity relative to the test shell (41) and penetrates the lower end face of the test shell (41).

3. The semiconductor packaging material pressure testing machine according to claim 2, characterized in that: The lower end face of the test end (42) is also equipped with an electrical performance test probe, which is used to monitor the electrical performance parameters of the chip while applying pressure.

4. A semiconductor packaging material pressure testing machine according to claim 2, characterized in that: The test end (42) is connected to the inner wall of the test shell (41) through a pre-tightening spring (43), and the pre-tightening force of the pre-tightening spring (43) is adjustable.

5. A semiconductor packaging material pressure testing machine according to claim 4, characterized in that: The test end (42) has an adjustment hole (421) on its side wall, and the test shell (41) has an adjustment groove (411). An adjustment block (414) is fixedly installed on the side wall of the adjustment groove (411). The adjustment block (414) is threadedly connected to an adjustment screw (413). The adjustment screw (413) passes through the adjustment block (414) and abuts against the adjustment hole (421). The contact surface between the adjustment block (414) and the adjustment hole (421) is an inclined surface.

6. A semiconductor packaging material pressure testing machine according to claim 1, characterized in that: The pressure distribution component (3) includes a guide plate (31), which is fixedly installed at the output end of the test drive component (2). Several guide rods (32) pass through the guide plate (31). A sliding seat is fixed to the guide plate (31) by bolts.

7. A semiconductor packaging material pressure testing machine according to claim 6, characterized in that: An assembly plate (33) is installed on the lower end face of the guide plate (31), and the test piece (4) is installed on the assembly plate (33). The assembly plate (33) is slidable relative to the guide plate (31).

8. A semiconductor packaging material pressure testing machine according to claim 7, characterized in that: The lower end face of the guide plate (31) extends multiple sets of horizontal guide components (34), the horizontal guide components (34) include; A fixing plate (341) is installed on the lower end face of the guide plate (31); A sliding rod (342) is fixedly installed on the side of the fixed plate (341), the sliding rod (342) passes through the assembly plate (33) and is slidably connected to the assembly plate (33); A horizontal drive component (343) is fixedly installed at the lower end of the guide plate (31) to drive the assembly plate (33) to slide.

9. A semiconductor packaging material pressure testing machine according to claim 4, characterized in that: The test station (5) is equipped with a pressure sensor, which is used to monitor the pressure value applied to the corresponding chip in real time.

10. A semiconductor packaging material pressure testing machine according to any one of claims 1-9, characterized in that: The test station (5) is arranged in a linear array.

Images