Diamond fretsaw detection method

Abstract

The invention relates to a diamond fretsaw detection method. The method comprises the steps of carbon quantum dot preparation, carbon quantum dot attachment and fluorescence detection. In the detection process of the diamond fretsaw, the surface abrasion condition of the diamond fretsaw is accurately obtained, and the diamond fretsaw is conveniently replaced in time; the preparation process of the modified fretsaw comprises the steps of preparing the carbon quantum dots, selecting the diamond fretsaw base body, pretreating the diamond fretsaw base body, preplating, sanding, thickening and cleaning and drying. The electroplated layer of the diamond fretsaw contains diamonds and carbon quantum dots at the same time; in the cutting process, the diamond and the carbon quantum dots are abraded at the same time; and in the cutting process, light with the wavelength of 260-500 nm is adopted for online real-time irradiation, so that the carbon quantum dots attached to the surface of the diamond fretsaw generate a fluorescence effect, and the abrasion condition of the diamond fretsaw is judged online in real time according to the fluorescence distribution condition of the fretsaw.

Description

Technical Field

[0001] This invention belongs to the field of diamond wire saw testing, specifically relating to a testing method for diamond wire saws. Background Technology

[0002] Diamond wire saws are cutting saws that use high-hardness diamond as an abrasive. With a wire diameter of tens of micrometers, they can precisely cut hard and brittle materials (such as silicon ingots) with narrow kerfs to achieve shaping. They feature minimal surface damage, minimal flexural deformation, thin slices with good thickness consistency, and high cutting efficiency.

[0003] While diamond wire saw manufacturing technology is becoming increasingly mature, testing technology lags behind. Currently, there are three common testing methods for diamond wire saws: the first is the qualitative method, which primarily relies on a micrometer to measure the outer diameter and uses a stereomicroscope to visually observe the surface of the wire saw and the distribution of diamond abrasive grains, thereby assessing the quality. The second is the quantitative method, which uses relevant methods or equipment to measure and characterize the holding force of the diamond abrasive grains. Analysis is performed by measuring bending strength, tensile strength, etc., to assess the quality. The third is the finite element method, which determines whether the diamond is in a critical state of detachment, thus achieving the purpose of testing the quality of the diamond wire saw.

[0004] Chinese invention patent CN106926375B discloses an online inspection device for diamond wire saws. The inspection method of this device belongs to the first qualitative method. The device includes a back plate vertically mounted on the rear side of a base plate, and the base plate is mounted on the inner wall of the wire feeding chamber of a diamond wire saw slicer via the back plate. A camera is mounted on the front side of the base plate via a camera mounting slide. An imaging tube is mounted on the back plate, with the camera lens facing the imaging tube. The diamond wire saw passes laterally between the camera lens and the imaging tube, and the position of the camera along the axial direction of the diamond wire saw is adjusted by the camera mounting slide. A main light source is mounted on the base plate in front of the diamond wire saw via a bracket, and a backlight source is mounted on the base plate behind the imaging tube via a backlight mounting slide, and the position of the backlight source along the axial direction of the diamond wire saw is adjusted by the backlight mounting slide. The main method involves capturing images of the wire saw with the camera to determine the wear condition of the diamond wire saw. Directly photographing the surface of the diamond wire saw cannot accurately obtain the surface wear condition; when the abrasive grains of the diamond wire saw are severely damaged, timely replacement is not possible. Summary of the Invention

[0005] In the process of inspecting diamond wire saws, accurately obtaining the surface wear condition of the diamond wire saw facilitates timely replacement. This invention provides a diamond wire saw inspection method. To achieve the above objective, the technical solution adopted by this invention is as follows: A method for detecting diamond wire saws includes the preparation process of the diamond wire saw and fluorescence detection; the preparation process is as follows: (1) Preparation of carbon quantum dots: carbon quantum dots with a particle size of less than 20 nm are peeled off from the carbon source; (2) Selection of diamond wire saw matrix: Select steel wire with a carbon content of 0.6%-0.95%; (3) Pretreatment of diamond wire saw substrate: Degreasing, oil removal, and removal of surface oxide film and oxide from diamond wire saw substrate; (4) Pre-plating: A nickel film is pre-plated on the surface of the diamond wire saw substrate by electroplating, and the thickness of the nickel film is 1-3 μm; (5) Sanding process: Diamond powder with a particle size of 5μm-70μm and carbon quantum dots are added to the electroplating solution in step 4. The diamond wire saw substrate pre-plated with a nickel film on one side is set as the cathode. During the electroplating process, diamond powder and carbon quantum dots are electroplated on the surface of the diamond wire saw. (6) Thickening process: The electrode arrangement in the thickening process is the same as that in the sanding process. The diamond wire saw substrate serves as the cathode, and nickel anodes are installed on both sides of the cathode. The thickness of the electroplated layer is controlled between 3 and 30 μm. (7) Cleaning and drying process: The surface of the electroplated thickened diamond wire saw is cleaned with pure water and then dried; Fluorescence detection: When the diamond wire saw prepared above needs to be tested, it is placed in the dark and irradiated with light with a wavelength of 260-500nm. This causes the carbon quantum dots attached to the surface of the diamond wire saw to fluoresce and form a fluorescence image. The wear condition of the diamond to be tested can be determined based on the fluorescence image.

[0006] The beneficial effects of the diamond wire saw testing method of this invention are as follows: By preparing carbon quantum dots, the surface of the diamond wire saw substrate is pretreated to prevent oxide scale, grease, etc. from affecting the surface adhesion of the diamond wire saw substrate; a nickel layer is pre-plated to improve the bonding strength between the diamond wire saw substrate and the electroplated layer containing diamond powder and carbon quantum dots, reducing peeling and extending service life; the electroplated layer is controlled at 3-30μm to prevent the electroplated layer from being too thick and peeling off in pieces; an electroplated layer that is too thin will reduce the service life; washing and drying with pure water effectively removes harmful hydrogen from the coating and reduces the hardness and brittleness of the coating. The diamond wire saw prepared by this invention contains both diamond and carbon quantum dots in its electroplated layer. During the cutting process, both diamond and carbon quantum dots wear down simultaneously. During cutting, light with a wavelength of 260-500 nm can be directly used for real-time online irradiation, causing the carbon quantum dots attached to the surface of the diamond wire saw to fluoresce and form a fluorescence pattern. The wear condition of the diamond wire saw can be judged based on the fluorescence distribution. This allows for real-time detection of the wear condition of the diamond wire saw during cutting, avoiding the need to disassemble the diamond wire saw for inspection, thus improving detection efficiency and reducing detection costs.

[0007] Further improved, the preparation of carbon quantum dots in step 1 specifically involves: using citric acid, cysteine, galactose, and succinic acid as carbon sources, dissolving the carbon sources in a solvent by stirring; adding the filtered solution to a reaction vessel and stirring to react; controlling the temperature at 100-250℃, the stirring speed at 5000-10000 rpm, and the reaction time at 5-35 h; thus preparing carbon quantum dots.

[0008] Beneficial effects: Using inorganic carbon such as citric acid, cysteine, galactose, and succinic acid as carbon sources, the raw materials for carbon sources are widely available, which makes it easier to reduce the cost of carbon source preparation; dissolving inorganic carbon in solvents and reasonably controlling the temperature and stirring speed of the reaction vessel can improve the yield of carbon quantum dots, making the yield of carbon quantum dots above 36%.

[0009] Further improved, the preparation of carbon quantum dots in step 1 specifically involves: using citric acid, cysteine, galactose, and succinic acid as carbon sources, dissolving the carbon sources in a solvent by stirring; adding the filtered solution to a reaction vessel and stirring to react; controlling the temperature at 100-250℃, the stirring speed at 5000-10000 rpm, and the reaction time at 5-35 h; thus preparing carbon quantum dots.

[0010] Beneficial effects: Using inorganic carbon such as citric acid, cysteine, galactose, and succinic acid as carbon sources, the raw materials for carbon sources are widely available, which makes it easier to reduce the cost of carbon source preparation; dissolving inorganic carbon in solvents and reasonably controlling the temperature and stirring speed of the reaction vessel can improve the yield of carbon quantum dots, making the yield of carbon quantum dots above 36%.

[0011] In a further improvement, step 3 involves degreasing and deoiling the diamond wire saw substrate. Specifically, 95% sodium hydroxide and 10% surfactant are mixed evenly and diluted to a solution with a concentration of 20g-60g / L. The surface of the diamond wire saw substrate is then degreased and deoiled.

[0012] Beneficial effects: Adding surfactants to sodium hydroxide increases their activity and dilutes them into a solution of 20g-60g / L; this helps to remove grease from the surface of the diamond wire saw substrate.

[0013] In a further improvement, step 3, the removal of surface oxide film and oxide from the diamond wire saw substrate, specifically involves: diluting sulfuric acid into a sulfuric acid solution with a volume concentration of 5%-15%, and controlling the temperature of the sulfuric acid solution at 25-35℃; and performing surface oxide film and oxide treatment on the surface of the diamond wire saw substrate.

[0014] Beneficial effects: Using a sulfuric acid solution with a concentration of 5%-15% and stabilizing the sulfuric acid solution at 25-35℃ improves the activity of the sulfuric acid solution. During the basic surface treatment of diamond, the oxide film and oxides on the surface are removed, while the corrosion of the diamond substrate by the sulfuric acid solution is reduced.

[0015] In a further improvement, the electroplating solution used in step 4 includes nickel chloride at a concentration of 30 g / L, boric acid at a concentration of 30 g / L, and the remainder is nickel sulfamate solution; the temperature of the electroplating solution is 35-60℃, the pH value is 3.0-4.5, and the current density is 2-3 A / Dm3.

[0016] Beneficial effects: By rationally designing the composition and concentration of the electroplating solution, as well as the temperature of the electroplating solution, it is beneficial to the stable growth and thickness control of the nickel film on the diamond substrate surface; by using boric acid to adjust the pH value of the electroplating solution, the weak acidity of boric acid is beneficial to the stability of the pH value of the electroplating solution, thereby improving the electroplating efficiency and quality. Attached Figure Description

[0017] Figure 1 This is a partial cross-sectional view of the diamond wire saw used in the diamond wire saw testing method of the present invention. Figure 2 This is a fluorescence image of a diamond wire saw detected using the detection method of the diamond wire saw of the present invention; In the figure: 1-Diamond wire saw substrate; 2-Nickel film; 3-Diamond powder; 4-Carbon quantum dots. Detailed Implementation

[0018] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments: The specific steps for detecting the surface wear of the diamond wire saw using the diamond wire saw inspection method of the present invention are as follows: (1) Preparation of carbon quantum dots: Carbon quantum dots with a particle size of less than 20 nm are exfoliated from the carbon source. In this embodiment, the preparation of carbon quantum dots is specifically as follows: 1 g of citric acid and 1.5 g of thiourea are dissolved in 20 mL of deionized water at room temperature; after stirring for 15 min to disperse evenly, the mixture is filtered and added to the reaction system in the reactor; the temperature of the reaction system in the reactor is controlled at 150 °C and the heating time is 15 h; the mixture is centrifuged at 10000 rpm for 30 min and washed three times with water to remove impurities, and then freeze-dried to obtain carbon quantum dots; carbon quantum dots with a particle size of less than 20 nm are screened out. In other embodiments, inorganic carbon can be replaced by cysteine, galactose, and succinic acid instead of citric acid. The carbon source is stirred and dissolved in the solvent; the filtered solution is added to the reactor and stirred for reaction; the temperature is controlled at 100 °C and the heating time is 35 h; or the temperature is controlled at 250 °C and the heating time is 5 h; or the temperature is controlled at 150 °C and the heating time is 15 h. Organic carbon can also be used instead of inorganic carbon as the carbon source.

[0019] (2) Attaching carbon quantum dots: attaching carbon quantum dots to the surface of the diamond wire saw to be tested; using thermal spraying molding technology or vapor deposition method to spray carbon quantum dots onto the surface of the diamond wire saw to be tested; forming a carbon quantum dot layer.

[0020] (3) Fluorescence detection: The diamond wire saw with carbon quantum dots attached is placed in the dark and irradiated with light with a wavelength of 260-500nm. The carbon quantum dots attached to the surface of the diamond wire saw will fluoresce and form a fluorescence image. The wear condition of the diamond to be tested can be determined based on the fluorescence image. In this embodiment, the light wavelength used is 260-230nm.

[0021] The preparation process of the diamond wire saw used in the testing method of this invention is as follows: (1) Preparation of carbon quantum dots 4: Carbon quantum dots 4 with a particle size of less than 20 nm are exfoliated from the carbon source. In this embodiment, the preparation of carbon quantum dots 4 is specifically as follows: 1 g of citric acid and 1.5 g of thiourea are dissolved in 20 mL of deionized water at room temperature; after stirring for 15 min to disperse evenly, the mixture is filtered and added to the reaction system in the reactor; the temperature of the reaction system in the reactor is controlled at 150 °C and the heating time is 15 h; the mixture is centrifuged at 10000 rpm for 30 min and washed three times with water to remove impurities, and then freeze-dried to obtain carbon quantum dots 4; carbon quantum dots 4 with a particle size of less than 20 nm are screened out. In other embodiments, inorganic carbon can be replaced by cysteine, galactose and succinic acid instead of citric acid. The carbon source is stirred and dissolved in the solvent; the filtered solution is added to the reactor and stirred to react; the temperature is controlled at 100 °C and the heating time is 35 h; or the temperature is controlled at 250 °C and the heating time is 5 h; instead of the temperature being controlled at 150 °C and the heating time being 15 h. Organic carbon can also be used instead of inorganic carbon as a carbon source.

[0022] (2) Selection of diamond wire saw base 1: Select steel wire with a carbon content of 0.6%-0.95%. In this embodiment, the diamond wire saw base 1 is selected from piano wire with a diameter of 5-200 mm.

[0023] (3) Pretreatment of diamond wire saw substrate 1: Degreasing, oil removal, and removal of surface oxide film and oxides are performed on diamond wire saw substrate 1.

[0024] Step 3, the degreasing and oil removal treatment of the diamond wire saw substrate 1, specifically involves: first, mixing 95% sodium hydroxide with 10% surfactant evenly, and then diluting it to a solution with a concentration of 20g-60g / L; this process is then used to degrease and remove oil from the surface of the diamond wire saw substrate 1. Adding the surfactant to the sodium hydroxide enhances its activity, and diluting it to a 20g-60g / L solution facilitates the thorough removal of grease from the surface of the diamond wire saw substrate 1. In this embodiment, 95% sodium hydroxide and 10% surfactant are mixed evenly and diluted to a concentration of 40g / L. In other embodiments, 95% sodium hydroxide and 5% surfactant are used to dilute the solution to a concentration of 60g / L; or 80% sodium hydroxide and 20% surfactant are used to dilute the solution to a concentration of 20g / L, thus replacing the method of mixing 95% sodium hydroxide and 10% surfactant evenly and diluting it to a concentration of 40g / L.

[0025] Step 3, the removal of surface oxide film and oxides from the diamond wire saw substrate 1, specifically involves: diluting sulfuric acid to a volume concentration of 5%-15% and controlling the temperature of the sulfuric acid solution at 25-35℃; and treating the surface oxide film and oxides on the diamond wire saw substrate 1. This enhances the activity of the sulfuric acid solution, effectively removing the surface oxide film and oxides while reducing the corrosion of the diamond wire saw substrate 1 by the sulfuric acid solution. In this embodiment, the sulfuric acid is diluted to a volume concentration of 10% and the temperature is controlled at 30℃. In other embodiments, the sulfuric acid is diluted to a volume concentration of 15% at a temperature of 25%; or to a concentration of 5% at a temperature of 35℃, thus replacing a concentration of 10% at a temperature of 30℃.

[0026] (4) Pre-plating: A nickel film 2 is pre-plated on the surface of the diamond wire saw substrate 1 by electroplating. The thickness of the nickel film 2 is 1-3 μm (1 μm). In this embodiment, the thickness of the nickel film 2 is controlled to be around 1.5 μm.

[0027] The electroplating solution used in step 4 includes nickel chloride (30 g / L), boric acid (30 g / L), and nickel sulfonate solution. The temperature of the electroplating solution is 35-60℃, the pH value is 3.0-4.5, and the current density is 2-3 A / Dm³. By rationally designing the composition and concentration of the electroplating solution, as well as its temperature, it is beneficial to the stable growth and thickness control of the nickel film 2 on the surface of the diamond wire saw substrate 1. Boric acid is used to adjust the pH value of the electroplating solution. The weak acidity of boric acid helps stabilize the pH value of the electroplating solution, improving electroplating efficiency and quality. In this embodiment, the temperature of the electroplating solution is 50℃, the pH value is 4, and the current density is 2.5 A / Dm³.

[0028] (5) Sanding process: Diamond powder 3 with a particle size of 5μm-70μm and carbon quantum dots 4 are added to the electroplating solution in step 4 and stirred evenly so that the diamond particles and carbon quantum dots 4 are uniformly in the electroplating solution. The plating solution containing diamond powder and carbon quantum dots 4 is lifted to the working tank by a liquid pump and a stable liquid surface is formed. Nickel anodes are installed on both sides of the baseline of the working tank. The diamond wire saw substrate 1 with a pre-plated layer of nickel film 2 is set as the cathode. During the electroplating process, diamond powder 3 and carbon quantum dots 4 are electroplated on the surface of the diamond wire saw.

[0029] (6) Thickening process: The processing steps are the same as the sandblasting process. The diamond wire saw substrate 1 serves as the cathode, and nickel anodes are installed on both sides of the cathode. The electroplating layer thickness is controlled at 3-30 μm. By thickening the plating on the baseline surface, the diamond micropowder will be firmly fixed on the baseline, and carbon quantum dots 4 will also exist on the diamond micropowder. Depending on the diamond particle size, the nickel plating layer thickness is 3-30 μm. In this embodiment, the electroplating layer thickness is controlled at 18 μm.

[0030] (7) Cleaning and drying process: The surface of the electroplated thickened diamond wire saw is cleaned with pure water and dried; this process is repeated multiple times. The drying process can effectively remove harmful hydrogen from the coating and reduce the hardness and brittleness of the coating.

[0031] When the diamond wire saw prepared using the method of this invention cuts single-crystal SiC, the feed rate is 0.5 mm / min. Every 10 minutes of cutting, the diamond wire saw is illuminated in real time under dark conditions with light of wavelength 260-320 nm to cause the carbon quantum dots 4 attached to the surface of the diamond wire saw to fluoresce and form a fluorescence pattern, such as... Figure 2 As shown, the real-time wear during diamond cutting is determined based on fluorescence images. This avoids the need to disassemble the diamond wire saw before testing, improving testing efficiency and reducing costs.

[0032] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0033] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present invention, and these improvements and substitutions should also be considered within the scope of protection of the present invention.

Claims

1. A method for testing diamond wire saws, characterized in that, This includes the preparation process and fluorescence detection of the diamond wire saw; the preparation process is as follows: (1) Preparation of carbon quantum dots: carbon quantum dots with a particle size of less than 20 nm are peeled off from the carbon source; (2) Selection of diamond wire saw matrix: Select steel wire with a carbon content of 0.6%-0.95%; (3) Pretreatment of diamond wire saw substrate: Degreasing, oil removal, and removal of surface oxide film and oxide from diamond wire saw substrate; (4) Pre-plating: A nickel film is pre-plated on the surface of the diamond wire saw substrate by electroplating, and the thickness of the nickel film is 1-3 μm; (5) Sanding process: Diamond powder with a particle size of 5μm-70μm and carbon quantum dots are added to the electroplating solution in step 4. The diamond wire saw substrate pre-plated with a nickel film on one side is set as the cathode. During the electroplating process, diamond powder and carbon quantum dots are electroplated on the surface of the diamond wire saw. (6) Thickening process: The electrode arrangement in the thickening process is the same as that in the sanding process. The diamond wire saw substrate serves as the cathode, and nickel anodes are installed on both sides of the cathode. The thickness of the electroplated layer is controlled between 3 and 30 μm. (7) Cleaning and drying process: The surface of the electroplated thickened diamond wire saw is cleaned with pure water and then dried; Fluorescence detection: When the diamond wire saw prepared above needs to be tested, it is placed in the dark and irradiated with light with a wavelength of 260-500nm. This causes the carbon quantum dots attached to the surface of the diamond wire saw to fluoresce and form a fluorescence image. The wear condition of the diamond to be tested can be determined based on the fluorescence image.

2. The diamond wire saw testing method according to claim 1, characterized in that, The preparation of carbon quantum dots in step 1 is as follows: Citric acid, cysteine, galactose, and succinic acid are used as carbon sources, and the carbon sources are stirred and dissolved in the solvent; the filtered solution is added to the reaction vessel and stirred for reaction; the temperature is controlled at 100-250℃, the stirring speed is 5000-10000 rpm, and the reaction time is 5-35 h; thus, carbon quantum dots are prepared.

3. The method for preparing a diamond wire saw according to claim 2, characterized in that, The preparation of carbon quantum dots in step 1 is as follows: Citric acid, cysteine, galactose, and succinic acid are used as carbon sources, and the carbon sources are stirred and dissolved in the solvent; the filtered solution is added to the reaction vessel and stirred for reaction; the temperature is controlled at 100-250℃, the stirring speed is 5000-10000 rpm, and the reaction time is 5-35 h; thus, carbon quantum dots are prepared.

4. The method for preparing a diamond wire saw according to claim 2 or 3, characterized in that, In step 3, the diamond wire saw substrate is degreased and deoiled. Specifically, 95% sodium hydroxide and 10% surfactant are mixed evenly and diluted to a solution with a concentration of 20g-60g / L. The diamond wire saw substrate surface is then degreased and deoiled.

5. The method for preparing a diamond wire saw according to claim 4, characterized in that, The removal of surface oxide film and oxide treatment of the diamond wire saw substrate in step 3 specifically involves: diluting sulfuric acid into a sulfuric acid solution with a volume concentration of 5%-15%, and controlling the temperature of the sulfuric acid solution at 25-35℃; and treating the surface oxide film and oxide on the diamond wire saw substrate.

6. The method for preparing a diamond wire saw according to claim 3, characterized in that, The electroplating solution used in step 4 includes nickel chloride at a concentration of 30 g / L, boric acid at a concentration of 30 g / L, and the remainder is nickel sulfamate solution; the temperature of the electroplating solution is 35-60℃, the pH value is 3.0-4.5, and the current density is 2-3 A / dm. 3 .

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