Display panel, preparation method of display panel and display device

Abstract

The embodiment of the invention provides a display panel, a preparation method of the display panel and a display device. The display panel comprises a substrate; the isolation structure is arranged on one side of the substrate, an isolation opening and a light-transmitting opening are defined by the isolation structure, the isolation opening is used for containing the light-emitting unit, and the isolation opening comprises a first isolation opening located in the first display area and a second isolation opening located in the second display area; wherein the isolation structure comprises a first sub-layer and a second sub-layer, the second sub-layer protrudes towards the isolation opening relative to the first sub-layer, and the minimum distance between at least part of the edge, facing the first isolation opening, of the first sub-layer and at least part of the edge, facing the first isolation opening, of the second sub-layer is a first interval; the minimum distance between at least part of the edge, facing the second isolation opening, of the first sub-layer and at least part of the edge, facing the second isolation opening, of the second sub-layer is a second interval, and the absolute value of the difference value between the first interval and the second interval is smaller than or equal to 0.9 mu m.

Description

Technical Field

[0001] This application relates to the field of display device technology, and in particular to a display panel, a method for manufacturing the display panel, and a display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) and flat panel displays based on light-emitting diodes (LEDs) are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide range of applications, becoming the mainstream of display devices.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the Invention

[0004] This application provides a display panel, a method for manufacturing the display panel, and a display device, aiming to improve the performance of the display panel.

[0005] An embodiment of the first aspect of this application provides a display panel, which includes a first display area and a second display area. The light transmittance of the first display area is greater than that of the second display area. The display panel includes: a substrate; an isolation structure disposed on one side of the substrate, the isolation structure enclosing an isolation opening and a light-transmitting opening, the isolation opening being used to accommodate a light-emitting unit, the isolation opening including a first isolation opening located in the first display area and a second isolation opening located in the second display area, the light-transmitting opening being located in the first display area; wherein, the isolation structure includes a first sub-layer and a second sub-layer stacked in a direction away from the substrate, the second sub-layer protruding relative to the first sub-layer toward the isolation opening, the minimum distance between at least a portion of the edge of the first sub-layer toward the first isolation opening and the minimum distance between at least a portion of the edge of the first sub-layer toward the second isolation opening being a first spacing, the minimum distance between at least a portion of the edge of the first sub-layer toward the second isolation opening and the minimum distance between at least a portion of the edge of the second sub-layer toward the second isolation opening being a second spacing, and the absolute value of the difference between the first spacing and the second spacing being less than or equal to 0.9 μm.

[0006] According to an embodiment of the first aspect of this application, a first sub-layer has a first sub-surface facing the light-transmitting opening, and a second sub-layer has a second sub-surface facing the light-transmitting opening, with the first sub-surface and the second sub-surface smoothly transitioning together.

[0007] According to any of the foregoing embodiments of the first aspect of this application, the first sidewall of the isolation structure facing the light-transmitting opening is a plane.

[0008] According to any of the foregoing embodiments of the first aspect of this application, the isolation structure has a first bottom wall surface facing the substrate, and the included angle between the first side wall surface and the first bottom wall surface is less than 90 degrees.

[0009] According to any of the foregoing embodiments of the first aspect of this application, the isolation structure further includes a third sub-layer, which is located on the side of the first sub-layer facing the substrate, and the third sub-layer protrudes relative to the first sub-layer facing the isolation opening.

[0010] According to any of the foregoing embodiments of the first aspect of this application, the first sub-layer has a first sub-surface facing the light-transmitting opening, the second sub-layer has a second sub-surface facing the light-transmitting opening, and the third sub-layer has a third sub-surface facing the light-transmitting opening. The first sub-surface and the second sub-surface are smoothly connected, and / or the first sub-surface and the third sub-surface are smoothly connected.

[0011] According to any of the foregoing embodiments of the first aspect of this application, the minimum distance between at least a portion of the edge of the first sublayer facing the first isolation opening and the minimum distance between at least a portion of the edge of the third sublayer facing the first isolation opening is a third spacing, and the minimum distance between at least a portion of the edge of the first sublayer facing the second isolation opening and the minimum distance between at least a portion of the edge of the third sublayer facing the second isolation opening is a fourth spacing, and the absolute value of the difference between the third spacing and the fourth spacing is less than or equal to 0.9 μm.

[0012] According to any of the foregoing embodiments of the first aspect of this application, the minimum distance between at least a portion of the edge of the first sublayer facing the light-transmitting opening and at least a portion of the edge of the third sublayer facing the light-transmitting opening is an eighth spacing, the eighth spacing being less than the third spacing, and / or, the eighth spacing being less than the fourth spacing.

[0013] According to any of the foregoing embodiments of the first aspect of this application, the minimum distance between at least a portion of the edge of the second sublayer toward the first isolation opening and at least a portion of the edge of the third sublayer toward the first isolation opening is a fifth spacing, and the minimum distance between at least a portion of the edge of the second sublayer toward the second isolation opening and at least a portion of the edge of the third sublayer toward the second isolation opening is a sixth spacing, and the absolute value of the difference between the fifth spacing and the sixth spacing is less than or equal to 0.9 μm.

[0014] According to any of the foregoing embodiments of the first aspect of this application, the minimum distance between at least a portion of the edge of the second sublayer facing the light-transmitting opening and at least a portion of the edge of the third sublayer facing the light-transmitting opening is a ninth spacing, which is less than the fifth spacing, and / or, the ninth spacing is less than the sixth spacing.

[0015] According to any of the foregoing embodiments of the first aspect of this application, the projected area of ​​the light-transmitting opening on the substrate is smaller than the projected area of ​​at least one first isolation opening and / or a second isolation opening on the substrate.

[0016] According to any of the foregoing embodiments of the first aspect of this application, the projected area of ​​the light-transmitting opening on the substrate is smaller than the projected area of ​​the smallest of the plurality of first isolation openings on the substrate.

[0017] According to any of the foregoing embodiments of the first aspect of this application, the projected area of ​​the light-transmitting opening on the substrate is smaller than the projected area of ​​the smallest of the plurality of second isolation openings on the substrate.

[0018] According to any of the foregoing embodiments of the first aspect of this application, the minimum distance between at least a portion of the edge of the first sublayer facing the light-transmitting opening and at least a portion of the edge of the second sublayer facing the light-transmitting opening is a seventh spacing, the seventh spacing being less than the first spacing, and / or, the seventh spacing being less than the second spacing.

[0019] According to any of the foregoing embodiments of the first aspect of this application, the first isolation opening includes two first straight sides disposed opposite to each other along a first direction and two first arcuate sides disposed opposite to each other along a second direction. The two first arcuate sides protrude in directions that are far apart from each other, and the two first straight sides and the two first arcuate sides enclose each other to form the first isolation opening.

[0020] The first spacing is the minimum distance between the edge of the first sub-layer facing the first straight edge and the edge of the second sub-layer facing the first straight edge.

[0021] According to any of the foregoing embodiments of the first aspect of this application, the second isolation opening includes two second straight edges and two second arcuate edges disposed opposite to each other along a first direction, the two second arcuate edges protruding in directions away from each other, and the two second straight edges and the two second arcuate edges enclosing each other to form the first isolation opening;

[0022] The second spacing is the minimum distance between the edge of the first sublayer facing the second straight edge and the edge of the second sublayer facing the second straight edge.

[0023] According to any of the foregoing embodiments of the first aspect of this application, the isolation structure includes a first bottom surface facing the substrate and a first top surface facing away from the substrate. The first spacing includes the minimum distance between at least a portion of the first bottom surface facing the first isolation opening and the second sublayer facing at least a portion of the first isolation opening. The second spacing includes the minimum distance between at least a portion of the first bottom surface facing the second isolation opening and the second sublayer facing at least a portion of the second isolation opening.

[0024] And / or, the first spacing includes the minimum distance between at least a portion of the edge of the first top surface toward the first isolation opening and the minimum distance between at least a portion of the edge of the second sub-layer toward the first isolation opening, and the second spacing includes the minimum distance between at least a portion of the edge of the first top surface toward the second isolation opening and the minimum distance between at least a portion of the edge of the second sub-layer toward the second isolation opening.

[0025] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes a pixel definition layer located on one side of the substrate. The pixel definition layer includes a pixel defining portion and a pixel opening formed by the pixel defining portion. The orthographic projection of the pixel opening onto the substrate and the orthographic projection of the isolation opening onto the substrate at least partially overlap.

[0026] The isolation structure is located on the side of the pixel limiting portion away from the substrate, or the pixel limiting portion also encloses a clearance opening, and the isolation structure is located within the clearance opening.

[0027] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes a light-emitting unit at least partially located in the pixel opening. The light-emitting unit includes a first electrode, a light-emitting structure, and a second electrode stacked in a direction away from the substrate. The material of the isolation structure includes a conductive material, and the second electrode and the isolation structure are electrically connected.

[0028] The second aspect of this application also provides a method for manufacturing a display panel, the method comprising:

[0029] A first insulating material layer is provided on one side of the motherboard. The motherboard includes multiple panel areas and a spacer area located between two adjacent panel areas. The first insulating material layer is located in the panel areas and the spacer area. The panel areas include a first display area and a second display area.

[0030] The first insulating material layer in the interval region is patterned.

[0031] Within the panel area, on the side of the first insulating material layer facing away from the motherboard, a first material layer and a second material layer are sequentially disposed;

[0032] A first material layer and a second material layer are patterned to form an isolation structure. The isolation structure includes an isolation opening, which includes a first isolation opening located in a first display area and a second isolation opening located in a second display area.

[0033] The first and second material layers are further patterned to form a light-transmitting opening, which is located in the first display area.

[0034] According to the implementation method of the second aspect of this application

[0035] According to any of the foregoing embodiments of the second aspect of this application, the motherboard includes detection terminals corresponding to the spacer regions. In the step of patterning the first insulating material layer of the spacer regions, the detection terminals located in the spacer regions are exposed. The detection terminals are used to detect the performance of the motherboard.

[0036] According to any of the foregoing embodiments of the second aspect of this application, the motherboard includes transistors, and the detection terminals are used to detect the performance of the transistors.

[0037] According to any of the foregoing embodiments of the second aspect of this application, the detection terminal is used to detect the lifetime of the transistor.

[0038] According to any of the foregoing embodiments of the second aspect of this application, the motherboard includes a drive circuit, and the detection terminal is used to detect the electrical signal of the drive circuit.

[0039] According to any of the foregoing embodiments of the second aspect of this application, the motherboard includes alignment marks located on the periphery of the spacer region or multiple panel regions, and the alignment marks are exposed during the step of patterning the first insulating material layer of the spacer region.

[0040] According to any of the foregoing embodiments of the second aspect of this application, after the step of further patterning the first material layer and the second material layer to form a light-transmitting opening, the method further includes:

[0041] A light-emitting unit, a second electrode layer, and a first encapsulation layer are fabricated. The light-emitting unit is located at a first isolation opening and a second isolation opening. The second electrode is located on the side of each light-emitting unit away from the mother board. The first encapsulation layer includes an encapsulation part for encapsulating each light-emitting unit.

[0042] The motherboard is cut into sections with intervals to form the display panel.

[0043] According to any of the foregoing embodiments of the second aspect of this application, the step of cutting the mother plate by the interval region to form a display panel by the panel region further includes:

[0044] A second and third encapsulation material layer located in the panel area are prepared on the side of the first encapsulation layer opposite to the motherboard.

[0045] A touch function layer located in the panel area is prepared on the side of the third encapsulation material layer that is away from the substrate.

[0046] In any of the foregoing embodiments of the second aspect of this application, the step of patterning the first material layer and the second material layer to form an isolation structure includes:

[0047] The first and second material layers are patterned to form multiple pre-openings located in the first and second display areas;

[0048] An isolation opening is formed by side-carving the wall surface exposed by the pre-opening of the first material layer and the second material layer. The first material layer forms a first sub-layer, and the second material layer forms a second sub-layer. The second sub-layer protrudes towards the isolation opening relative to the first sub-layer.

[0049] In any of the foregoing embodiments of the second aspect of this application, in the step of further patterning the first material layer and the second material layer to form a light-transmitting opening:

[0050] A photoresist material layer is disposed on the side of the first material layer and the second material layer away from the substrate, and the photoresist material layer is patterned to form a photoresist layer, the photoresist layer including an etched opening that passes through it.

[0051] The first and second material layers exposed by the etched opening are patterned to form a light-transmitting opening.

[0052] According to any of the foregoing embodiments of the second aspect of this application, a photoresist layer covers the isolation opening.

[0053] The third aspect of this application also provides a display device, including a display panel of any of the first aspect embodiments described above, or a display panel prepared by any of the second aspect embodiments described above.

[0054] In the display panel provided in this application embodiment, the display panel has a first display area and a second display area, and the light transmittance of the first display area is greater than that of the second display area. The higher light transmittance of the first display area enables it to achieve the purpose of being both light-transmitting and displayable, facilitating the placement of a photosensitive module on the non-display side of the first display area.

[0055] The display panel also includes an isolation structure that encloses an isolation opening. This opening accommodates light-emitting units, mitigating crosstalk between different light-emitting units. The isolation structure includes a first sub-layer and a second sub-layer. The second sub-layer protrudes relative to the first sub-layer towards the isolation opening, allowing the side of the second sub-layer facing the substrate to form a recess. This recess surrounds the isolation opening, facilitating the breakage of the light-emitting material into independent light-emitting units at that location. The isolation opening includes a first isolation opening located in the first display area and a second isolation opening located in the second display area. The absolute value of the difference between the first spacing and the second spacing is less than or equal to 0.9 μm. The size of the second sublayer protruding relative to the first sublayer toward the first isolation opening and the size of the second sublayer protruding relative to the first sublayer toward the second isolation opening are similar. That is, the concave size of the periphery of the first isolation opening and the concave size of the periphery of the second isolation opening are similar. On the one hand, this makes the shape difference between the light-emitting units in the first isolation opening and the light-emitting units in the second isolation opening smaller. On the other hand, when the second electrode is subsequently fabricated, the overlapping area between the second electrode in the first isolation opening and the isolation structure is similar, thereby making the light emission of the first display area and the light emission of the second display area similar. This can reduce the display difference between the first display area and the second display area and improve the display effect and performance of the display panel. Attached Figure Description

[0056] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings, wherein the same or similar reference numerals denote the same or similar features.

[0057] Figure 1 This is a schematic diagram of the structure of a display panel provided in an embodiment of this application;

[0058] Figure 2 yes Figure 1 A magnified schematic diagram of the local structure at point P;

[0059] Figure 3 One example Figure 2 Schematic diagram of the cross-sectional structure at point AA;

[0060] Figure 4 In another example Figure 2 Schematic diagram of the cross-sectional structure at point AA;

[0061] Figure 5 yes Figure 4 Enlarged view of part of the structure of the first display area;

[0062] Figure 6 yes Figure 4 Enlarged view of part of the structure of the second display area;

[0063] Figure 7 This is a schematic flowchart of a display panel manufacturing method provided in an embodiment of this application;

[0064] Figures 8 to 11 This is a schematic diagram of a display panel manufacturing process provided in an embodiment of this application;

[0065] Figure 12 This is a schematic flowchart of a display panel manufacturing method provided in another embodiment of this application;

[0066] Figure 13 This is a schematic flowchart of a display panel manufacturing method provided in another embodiment of this application;

[0067] Figure 14 This is a schematic flowchart of a display panel manufacturing method provided in another embodiment of this application;

[0068] Figure 15 This is a schematic diagram of a display panel manufacturing process according to another embodiment of this application;

[0069] Figure 16 This is a schematic flowchart of a display panel manufacturing method provided in another embodiment of this application;

[0070] Figure 17 This application also provides a schematic diagram of a display panel manufacturing process according to an embodiment.

[0071] Explanation of reference numerals in the attached figures:

[0072] 100. Substrate;

[0073] 200. Isolation structure; 210. Isolation opening; 211. First isolation opening; 211a. First straight edge; 211b. First rounded edge; 212. Second isolation opening; 212a. Second straight edge; 212b. Second rounded edge; 220. Light-transmitting opening; 230. First side wall; 240. First bottom wall;

[0074] 201, First sub-layer; 201a, First sub-surface; 201b, First bottom surface; 201c, First top surface; 202, Second sub-layer; 202a, Second sub-surface; 203, Third sub-layer; 203a, Third sub-surface;

[0075] 300, Pixel definition layer; 310, Pixel limiting part; 320, Pixel opening; 330, Light-emitting unit; 331, First electrode; 332, Light-emitting structure; 333, Second electrode;

[0076] 400, First encapsulation layer; 410, Encapsulation part; 420, Sealing part;

[0077] X, first direction; Y, second direction; Z, thickness direction Z. Detailed Implementation

[0078] The features and exemplary embodiments of various aspects of this application will now be described in detail. Numerous specific details are set forth in the following detailed description to provide a comprehensive understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without requiring some of these specific details. The following description of embodiments is merely intended to provide a better understanding of this application by illustrating examples. In the accompanying drawings and the following description, at least some well-known structures and techniques are not shown to avoid unnecessarily obscuring the application; and, for clarity, the dimensions of some structures may be exaggerated. Furthermore, the features, structures, or characteristics described below can be combined in any suitable manner in one or more embodiments.

[0079] In the description of this application, it should be noted that, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," etc., indicating orientation or positional relationships are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0080] The directional terms appearing in the following description refer to the directions shown in the figures and are not intended to limit the specific structure of the embodiments of this application. It should also be noted in the description of this application that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0081] In related technologies, a display panel includes a first display area and a second display area, and the display panel includes an isolation structure. The isolation structure includes a first isolation opening and a light-transmitting opening located in the first display area, and a second isolation opening located in the second display area. When the isolation structure is patterned to form the first isolation opening, the light-transmitting opening, and the second isolation opening, it is usually done in the same process step. Because the first display area has the first isolation opening and the light-transmitting opening, the etching degree of the first display area is greater than that of the second display area. This results in a significant difference between the shape of the isolation structure surrounding the first isolation opening in the first display area and the shape of the isolation structure surrounding the second isolation opening in the second display area. Consequently, when the second electrode and the isolation structure are subsequently overlapped, the overlap area of ​​the second electrode differs significantly, leading to a significant difference in brightness between the first display area and the second display area.

[0082] To address the aforementioned technical problems, this application is proposed. For a better understanding of this application, the following is combined with... Figures 1 to 13 The embodiments of this application will be described in detail.

[0083] like Figures 1 to 3As shown, an embodiment of the first aspect of this application provides a display panel, which includes a first display area AA1 and a second display area AA2. The light transmittance of the first display area AA1 is greater than that of the second display area AA2. The display panel includes: a substrate 100; and an isolation structure 200 disposed on one side of the substrate 100. The isolation structure 200 encloses and forms an isolation opening 210 and a light-transmitting opening 220. The isolation opening 210 is used to accommodate a light-emitting unit 330. The isolation opening 210 includes a first isolation opening 211 located in the first display area AA1 and a second isolation opening 212 located in the second display area AA2. The light-transmitting opening 220 is located in the first display area AA1. 200 includes a first sublayer 201 and a second sublayer 202 stacked in a direction away from the substrate 100. The second sublayer 202 protrudes relative to the first sublayer 201 toward the isolation opening 210. The minimum distance between at least a portion of the edge of the first sublayer 201 toward the first isolation opening 211 and the minimum distance between at least a portion of the edge of the second sublayer 202 toward the first isolation opening 211 is a first spacing d1. The minimum distance between at least a portion of the edge of the first sublayer 201 toward the second isolation opening 212 and the minimum distance between at least a portion of the edge of the second sublayer 202 toward the second isolation opening 212 is a second spacing d2. The absolute value of the difference between the first spacing d1 and the second spacing d2 is less than or equal to 0.9 μm.

[0084] In the display panel provided in this application embodiment, the display panel has a first display area AA1 and a second display area AA2, and the light transmittance of the first display area AA1 is greater than that of the second display area AA2. The higher light transmittance of the first display area AA1 enables it to achieve the purpose of being both light-transmitting and displayable, facilitating the placement of a photosensitive module on the non-display side of the first display area AA1.

[0085] The display panel also includes an isolation structure 200, which encloses an isolation opening 210. The isolation opening 210 can accommodate light-emitting units 330, improving the problem of light crosstalk between different light-emitting units 330. The isolation structure 200 includes a first sub-layer 201 and a second sub-layer 202. The second sub-layer 202 protrudes from the first sub-layer 201 toward the isolation opening 210, allowing the side of the second sub-layer 202 facing the substrate 100 to form a concave shape. This concave shape surrounds the isolation opening 210, facilitating the breakage of the light-emitting material into independent light-emitting units 330 at that location. The isolation opening 210 includes a first isolation opening 211 located in the first display area AA1 and a second isolation opening 212 located in the second display area AA2. The absolute value of the difference between the first spacing d1 and the second spacing d2 is less than or equal to 0.9 μm. The size of the second sub-layer 202 protruding relative to the first sub-layer 201 toward the first isolation opening 211 and the size of the second sub-layer 202 protruding relative to the first sub-layer 201 toward the second isolation opening 212 are similar. That is, the concave size of the periphery of the first isolation opening 211 and the concave size of the periphery of the second isolation opening 212 are similar. On the one hand, this makes the shape difference between the light-emitting unit 330 in the first isolation opening 211 and the light-emitting unit 330 in the second isolation opening 212 smaller. On the other hand, when the second electrode 333 is subsequently prepared, the overlapping area of ​​the second electrode 333 in the first isolation opening 211 and the second isolation opening 212 with the isolation structure 200 is similar. This makes the light emission of the first display area AA1 and the light emission of the second display area AA2 similar, which can reduce the display difference between the first display area AA1 and the second display area AA2 and improve the display effect and performance of the display panel.

[0086] The substrate 100 can be configured in various ways. The substrate 100 may include a substrate and a first conductive layer, a second conductive layer, and a third conductive layer stacked on one side of the substrate. An insulating layer is disposed between adjacent conductive layers. Optionally, a driving device layer is disposed on the substrate, and a pixel driving circuit is disposed within the driving device layer. The pixel driving circuit includes a transistor and a storage capacitor. The transistor includes a semiconductor, a gate, a source, and a drain. The storage capacitor includes a first electrode and a second electrode. As an example, the gate and the first electrode may be located on the first conductive layer, the second electrode may be located on the second conductive layer, and the source and drain may be located on the third conductive layer.

[0087] Optionally, the light-emitting unit 330 includes a first electrode 331, a light-emitting structure 332, and a second electrode 333 stacked along a direction away from the substrate 100. The material of the isolation structure 200 includes a conductive material. The second electrode 333 and the isolation structure 200 are electrically connected to each other, for example, the second electrode 333 and the first sub-layer 201 overlap each other. In the embodiments of this application, since the first spacing d1 and the second spacing d2 are close, the overlap area between the second electrode 333 and the first sub-layer 201 in the first isolation opening 211 and the overlap area between the second electrode 333 and the first sub-layer 201 in the second isolation opening 212 are close. This makes the light emission effect of the light-emitting unit 330 in the first isolation opening 211 close to that in the second isolation opening 212, thus improving the difference in light emission effect between the first display area AA1 and the second display area AA2 caused by the different overlap areas between the second electrode 333 and the isolation structure 200.

[0088] Optionally, when the absolute value of the difference between the first spacing d1 and the second spacing d2 is less than or equal to 0.9 μm, the first isolation opening 211 and the second isolation opening 212 can be considered to be formed in the same process step. Optionally, when the absolute value of the difference between the first spacing d1 and the second spacing d2 is less than or equal to 0.9 μm, the first spacing d1 and the second spacing d2 can be considered to be approximately the same, the dimension of the second sublayer 202 protruding relative to the first sublayer 201 toward the first isolation opening 211 is close to the dimension of the second sublayer 202 protruding relative to the first sublayer 201 toward the second isolation opening 212, and the concave dimension of the periphery of the first isolation opening 211 and the concave dimension of the periphery of the second isolation opening 212 are close to each other.

[0089] Due to manufacturing process errors, the first pitch d1 and the second pitch d2 are not equal. However, when the absolute value of the difference between the first pitch d1 and the second pitch d2 is less than or equal to 0.9 μm, it can be considered that in the process steps of preparing the first isolation opening 211 and the second isolation opening 212, the distribution density of the etching solution in the first display area AA1 and the second display area AA2 are close, thereby making the first pitch d1 and the second pitch d2 close.

[0090] Optionally, the first pitch d1 is equal to the second pitch d2, so as to better improve the difference in light emission effect between the first display area AA1 and the second display area AA2 caused by the different overlap area between the second electrode 333 and the isolation structure 200.

[0091] In some alternative embodiments, the first sub-layer 201 has a first sub-surface 201a facing the light-transmitting opening 220, and the second sub-layer 202 has a second sub-surface 202a facing the light-transmitting opening 220, with the first sub-surface 201a and the second sub-surface 202a smoothly transitioning together.

[0092] In these optional embodiments, the smooth transition between the first sub-surface 201a and the second sub-surface 202a means that there are no obvious protrusions or other structures at the connection point between the first sub-surface 201a and the second sub-surface 202a, and the first sub-surface 201a and the second sub-surface 202a are formed in the same process step. This allows light transmission through the first sub-layer 201 and the second sub-layer 202 to be formed in the same process step.

[0093] Optionally, the first sidewall 230 of the isolation structure 200 facing the light-transmitting opening 220 is a plane, which can simplify the shape of the isolation structure 200 and facilitate the fabrication and molding of the isolation structure 200.

[0094] Optionally, the isolation structure 200 has a first bottom wall surface 240 facing the substrate 100, and the angle between the first side wall surface 230 and the first bottom wall surface 240 is less than 90 degrees, which facilitates the fabrication and molding of the light-transmitting opening 220.

[0095] In some alternative embodiments, such as Figure 1 , Figure 2 and Figures 4 to 6 As shown, the isolation structure 200 also includes a third sub-layer 203, which is located on the side of the first sub-layer 201 facing the substrate 100, and the second sub-layer 202 protrudes relative to the first sub-layer 201 towards the isolation opening 210.

[0096] In these alternative embodiments, when the first sublayer 201 is side-etched such that the second sublayer 202 protrudes relative to the first sublayer 201 or the third sublayer 203 protrudes relative to the first sublayer 201 toward the isolation opening 210, the third sublayer 203 can provide protection to the film layer on the substrate 100 side.

[0097] Optionally, when the first sub-layer 201 has a first sub-surface 201a and the second sub-layer 202 has a second sub-surface 202a, the third sub-layer 203 may also have a third sub-surface 203a facing the light-transmitting opening 220, and the first sub-surface 201a and the second sub-surface 202a are smoothly connected, and / or the first sub-surface 201a and the third sub-surface 203a are smoothly connected. This simplifies the shape of the isolation structure 200 and facilitates its fabrication.

[0098] In some optional embodiments, the minimum distance between at least a portion of the edge of the first sublayer 201 toward the first isolation opening 211 and the minimum distance between at least a portion of the edge of the third sublayer 203 toward the first isolation opening 211 is a third spacing d3, and the minimum distance between at least a portion of the edge of the first sublayer 201 toward the second isolation opening 212 and the minimum distance between at least a portion of the edge of the third sublayer 203 toward the second isolation opening 212 is a fourth spacing d4, and the absolute value of the difference between the third spacing d3 and the fourth spacing d4 is less than or equal to 0.9 μm.

[0099] In these optional embodiments, the third pitch d3 and the fourth pitch d4 are close, that is, the size of the third sub-layer 203 protruding relative to the first sub-layer 201 toward the first isolation opening 211 and the size of the third sub-layer 203 protruding relative to the first sub-layer 201 toward the second isolation opening 212 are close, so that the overlap area of ​​the second electrode 333 in the first isolation opening 211 and the second isolation opening 212 with the third sub-layer 203 and the first sub-layer 201 is close, thereby improving the display difference between the first display area AA1 and the second display area AA2.

[0100] Optionally, the minimum distance between at least a portion of the edge of the first sub-layer 201 facing the light-transmitting opening 220 and at least a portion of the edge of the third sub-layer 203 facing the light-transmitting opening 220 is an eighth pitch d8. Optionally, the eighth pitch d8 can be zero, that is, the second sub-layer 202 is not protruding relative to the third sub-layer 203 facing the light-transmitting opening 220, and the first sub-layer 201 and the second sub-layer 202 exposed by the light-transmitting opening 220 do not need to be side-etched, so as to simplify the manufacturing process of the display panel.

[0101] Optionally, the eighth spacing d8 is smaller than the third spacing d3, and / or the eighth spacing d8 is smaller than the fourth spacing d4. The eighth spacing d8 is different from the third spacing d3 and the fourth spacing d4, so that the light-transmitting opening 220 and the isolation opening 210 can be prepared and formed separately, and the preparation of the light-transmitting opening 220 and the isolation opening 210 does not affect each other.

[0102] In some optional embodiments, the minimum distance between at least a portion of the edge of the second sublayer 202 toward the first isolation opening 211 and the minimum distance between at least a portion of the edge of the third sublayer 203 toward the first isolation opening 211 is a fifth spacing d5, and the minimum distance between at least a portion of the edge of the second sublayer 202 toward the second isolation opening 212 and the minimum distance between at least a portion of the edge of the third sublayer 203 toward the second isolation opening 212 is a sixth spacing d6, and the absolute value of the difference between the fifth spacing d5 and the sixth spacing d6 is less than or equal to 0.9 μm.

[0103] In these optional embodiments, the fifth pitch d5 and the sixth pitch d6 are close, that is, the distance by which the second sub-layer 202 protrudes relative to the third sub-layer 203 toward the first isolation opening 211, or the distance by which the third sub-layer 203 protrudes relative to the second sub-layer 202 toward the first isolation opening 211, is close to the distance by which the second sub-layer 202 protrudes relative to the third sub-layer 203 toward the second isolation opening 212, or the distance by which the third sub-layer 203 protrudes relative to the second sub-layer 202 toward the second isolation opening 212. The inner wall shape of the isolation structure 200 toward the first isolation opening 211 is close to the inner wall shape of the isolation structure 200 toward the second isolation opening 212, so as to improve the display difference between the first display area AA1 and the second display area AA2.

[0104] Optionally, the minimum distance between at least a portion of the edge of the second sub-layer 202 facing the light-transmitting opening 220 and at least a portion of the edge of the third sub-layer 203 facing the light-transmitting opening 220 is a ninth spacing d9, which is less than the fifth spacing d5, and / or less than the sixth spacing d6, so that the light-transmitting opening 220 and the isolation opening 210 can be formed separately, and the formation of the light-transmitting opening 220 and the isolation opening 210 does not affect each other.

[0105] Optionally, the minimum distance between at least a portion of the edge of the first sublayer 201 facing the light-transmitting opening 220 and at least a portion of the edge of the second sublayer 202 facing the light-transmitting opening 220 is a seventh spacing d7, which is less than the first spacing d1 and / or less than the second spacing d2, so that the light-transmitting opening 220 and the isolation opening 210 can be formed separately, and the formation of the light-transmitting opening 220 and the isolation opening 210 does not affect each other.

[0106] There are various ways to set the shape of the isolation opening 210. The shape of the isolation opening 210 on the substrate 100 can be circular, elliptical, polygonal, etc.

[0107] In some optional embodiments, the first isolation opening 211 includes two first straight edges 211a arranged opposite each other along a first direction X and two first arc edges 211b arranged opposite each other along a second direction Y. The two first arc edges 211b protrude in directions that are far apart from each other, and the two first straight edges 211a and the two first arc edges 211b enclose each other to form the first isolation opening 211; the first spacing d1 is the minimum distance between the edge of the first sub-layer 201 facing the first straight edge 211a and the edge of the second sub-layer 202 facing the first straight edge 211a.

[0108] In these alternative embodiments, the first isolation opening 211 includes a first straight edge 211a and a first arc edge 211b. When fabricating the second electrode 333, the second electrode 333 is more likely to overlap with the wall surface of the isolation structure 200 facing the first straight edge 211a. The first spacing d1 is defined as the distance between the edge of the first sub-layer 201 facing the first straight edge 211a and the edge of the second sub-layer 202 facing the first straight edge 211a, which can better improve the problem of different overlapping areas of the second electrode 333.

[0109] Optionally, the second isolation opening 212 includes two second straight edges 212a arranged opposite each other along the first direction X and two second arcuate edges 212b arranged opposite each other along the second direction Y. The two second arcuate edges 212b protrude in directions away from each other, and the two second straight edges 212a and the two second arcuate edges 212b enclose to form the first isolation opening 211; the second spacing d2 is the minimum distance between the edge of the first sub-layer 201 facing the second straight edge 212a and the edge of the second sub-layer 202 facing the second straight edge 212a.

[0110] In these alternative embodiments, the second isolation opening 212 includes a second straight edge 212a and a second arc edge 212b. When fabricating the second electrode 333, the second electrode 333 is more likely to overlap with the wall surface of the isolation structure 200 facing the second straight edge 212a. The second spacing d2 is defined as the distance between the edge of the first sub-layer 201 facing the second straight edge 212a and the edge of the second sub-layer 202 facing the second straight edge 212a, which can better improve the problem of different overlapping areas of the second electrode 333.

[0111] In some alternative embodiments, the isolation structure 200 includes a first bottom surface 201b facing the substrate 100 and a first top surface 201c facing away from the substrate 100. The dimensions of the first bottom surface 201b and the first top surface 201c may be different. For example, the orthographic projection of the first bottom surface 201b onto the substrate 100 may lie within the orthographic projection of the first top surface 201c onto the substrate 100.

[0112] Optionally, the first spacing d1 includes the minimum distance between at least a portion of the edge of the first bottom surface 201b toward the first isolation opening 211 and the minimum distance between the second sub-layer 202 toward the first isolation opening 211, and the second spacing d2 includes the minimum distance between at least a portion of the edge of the first bottom surface 201b toward the second isolation opening 212 and the minimum distance between the second sub-layer 202 toward the second isolation opening 212.

[0113] And / or, optionally, the first spacing d1 includes the minimum distance between at least a portion of the edge of the first top surface 201c toward the first isolation opening 211 and the minimum distance between the second sub-layer 202 toward the first isolation opening 211, and the second spacing d2 includes the minimum distance between at least a portion of the edge of the first top surface 201c toward the second isolation opening 212 and the minimum distance between the second sub-layer 202 toward the second isolation opening 212.

[0114] In other words, when the first spacing d1 is taken from the first top surface 201c, the second spacing d2 is also taken from the first top surface 201c. When the first spacing d1 is taken from the first bottom surface 201b, the second spacing d2 is also taken from the first bottom surface 201b, making the objects of comparison more consistent.

[0115] In any of the above embodiments, the projected area of ​​the light-transmitting opening 220 on the substrate 100 is smaller than the projected area of ​​at least one first isolation opening 211 and / or the second isolation opening 212 on the substrate 100. The larger area of ​​the first isolation opening 211 and / or the second isolation opening 212 ensures the display effect of the display panel.

[0116] Optionally, the projected area of ​​the light-transmitting opening 220 on the substrate 100 is smaller than the projected area of ​​the smallest of the plurality of first isolation openings 211 on the substrate 100, so as to further improve the display effect of the display panel.

[0117] Optionally, the projected area of ​​the light-transmitting opening 220 on the substrate 100 is smaller than the projected area of ​​the smallest of the plurality of second isolation openings 212 on the substrate 100, so as to further improve the display effect of the display panel.

[0118] In some optional embodiments, the display panel further includes a pixel definition layer 300 located on one side of the substrate 100. The pixel definition layer 300 includes a pixel defining portion 310 and a pixel opening 320 formed by the pixel defining portion 310. The orthographic projection of the pixel opening 320 onto the substrate 100 and the orthographic projection of the isolation opening 210 onto the substrate 100 at least partially overlap. This allows the pixel opening 320 and the isolation opening 210 to communicate, enabling the light-emitting unit 330 to be located within the pixel opening 320, and allowing the light emitted by the light-emitting unit 330 to exit through the isolation opening 210.

[0119] There are several ways to arrange the relative positions of the isolation structure 200 and the pixel definition layer 300. The isolation structure 200 can be located on the side of the pixel limiting portion 310 away from the substrate 100, or the pixel limiting portion 310 can also have a clearance opening, and the isolation structure 200 is located in the clearance opening.

[0120] Optionally, a first encapsulation layer 400 is provided on the side of each second electrode 333 facing away from the substrate 100. The first encapsulation layer 400 includes an encapsulation portion 410 for encapsulating each light-emitting unit 330. Optionally, the first encapsulation layer 400 also includes a sealing portion 420 located in the light-transmitting opening 220. The sealing portion 420 can provide protection to the surface of the isolation structure 200 exposed through the light-transmitting opening 220.

[0121] like Figure 7 As shown, an embodiment of the second aspect of this application also provides a method for manufacturing a display panel. The display panel can be any of the display panels provided in the first aspect embodiment described above. The display panel has a first county / district area and a second display area AA2. Please refer to the following: Figures 1 to 7 The manufacturing methods for the display panel include:

[0122] Step S01: As Figure 8 and Figure 9 As shown, a first insulating material layer 30 is provided on one side of the motherboard 10. The motherboard 10 includes multiple panel areas PA and a spacing area NA located between two adjacent panel areas PA. The first insulating material layer 30 is located in the panel areas PA and the spacing area NA. The panel areas PA include a first display area AA1 and a second display area AA2.

[0123] Step S02: Pattern the first insulating material layer 30 of the interval region NA.

[0124] Step S03: In the panel area PA, on the side of the first insulating material layer 30 facing away from the motherboard 10, the first material layer and the second material layer are sequentially disposed.

[0125] Step S04: As Figure 10 As shown, the first material layer and the second material layer are patterned to form an isolation structure 200. The isolation structure 200 includes an isolation opening 210, which includes a first isolation opening 211 located in the first display area AA1 and a second isolation opening 212 located in the second display area AA2.

[0126] Step S05: As Figure 11 As shown, the first material layer and the second material layer are further patterned to form a light-transmitting opening 220, which is located in the first display area AA1.

[0127] Optionally, step S03 can be performed before or after step S02.

[0128] In this embodiment, a first insulating material layer 30 is first applied to the motherboard 10, covering the entire panel area PA and the spacing area NA of the motherboard 10. The panel area PA can be used to fabricate a single display panel. Next, in step S02, the first insulating material layer 30 is patterned, and a first material layer and a second material layer are formed on the first insulating material layer 30. Then, in step S04, the first and second material layers are patterned to form a first isolation opening 211 and a second isolation opening 212. That is, the patterning of the first insulating material layer 30 is performed before the patterning of the first and second material layers, and before the patterning of the first and second material layers, a portion of the first insulating material layer 30 is removed, which can improve the problem of the first insulating material layer 30 having an excessively large distribution area, making it prone to cracking in subsequent fabrication processes. Then, in step S05, the first and second material layers are further patterned to form a light-transmitting opening 220. The isolation opening 210 and the light-transmitting opening 220 are formed in different process steps. In step S02, since it is not necessary to prepare the light-transmitting opening 220, the distribution density of the isolation opening 210 in the first display area AA1 and the distribution density of the isolation opening 210 in the second isolation opening 212 are close. The first material layer and the second material layer can be patterned using etching solution of the same density and amount to form the first isolation opening 211 and the second isolation opening 212. This makes the shape of the wall surface of the isolation structure 200 facing the first isolation opening 211 and the shape of the wall surface of the isolation structure 200 facing the second isolation opening 212 close. When the second electrode 333 is subsequently prepared, the overlapping area of ​​the second electrode 333 in the first isolation opening 211 and the second isolation opening 212 with the isolation structure 200 is close. This makes the light emission of the first display area AA1 and the light emission of the second display area AA2 close, which can reduce the display difference between the first display area AA1 and the second display area AA2 and improve the display effect and performance of the display panel.

[0129] Optionally, the mother plate 10 can be used to form the substrate 100 described above.

[0130] Optionally, the first insulating material layer 30 can also be used to form the pixel definition layer 300. The material of the first insulating material layer 30 can be an inorganic material to reduce the thickness of the display panel.

[0131] Optionally, the motherboard 10 includes a driving array layer, which includes driving circuitry. Optionally, the motherboard 10 includes multiple panel regions PA arranged in an array, with a spacing region NA between adjacent panel regions PA. An outer peripheral region WA is provided around each of the multiple panel regions PA.

[0132] In some optional embodiments, the motherboard 10 includes detection terminals corresponding to the spacer region NA. In step S02, by patterning the first insulating material layer 30 of the spacer region NA, the detection terminals located in the spacer region NA can be exposed. The detection terminals are used to detect the performance of the motherboard 10. In this embodiment, by etching away part of the first insulating material layer 30 of the spacer region NA, the detection terminals can be exposed, facilitating electrical connection between the detection terminals and external detection circuits or other components, thereby enabling the detection of the performance of the motherboard 10.

[0133] Optionally, the motherboard 10 includes transistors. For example, the drive circuit includes transistors. Detection terminals can be electrically connected to the transistors, allowing the transistor's performance to be detected via the detection terminals.

[0134] Optionally, the detection terminals can also be used to detect the lifespan of transistors.

[0135] Optionally, the detection terminals can also be used to detect electrical signals of the drive circuit in order to obtain the performance of the drive circuit.

[0136] Optionally, the number of detection terminals can be one or more. When there are multiple detection terminals, the detection terminals can be used as a first detection terminal for detecting transistors, a second detection terminal for detecting transistor lifetime, and a third detection terminal for detecting electrical signals of the drive circuit.

[0137] Optionally, the test terminals can also be used to test other telecommunications performance of the motherboard 10.

[0138] In some alternative embodiments, the motherboard 10 includes alignment marks, which may be located around the spacing region NA or the plurality of panel regions PA, i.e., the alignment marks may be located in the aforementioned peripheral region WA. The alignment marks can be used for process alignment, for example, during the subsequent fabrication of the first and second material layers, the alignment marks can be used to align with the process equipment used to fabricate the first and second material layers. Alternatively, during the subsequent patterning of the first and second material layers using process equipment such as a mask, the alignment marks can be aligned with the process equipment used to pattern the first and second material layers.

[0139] Optionally, in step S02, alignment marks may be exposed to facilitate subsequent alignment with process equipment using the exposed alignment marks.

[0140] Optional, such as Figure 12 As shown, after step S05, the following is also included:

[0141] Step S06: Prepare a light-emitting structure 332, a second electrode 333 and a first encapsulation layer 400. The light-emitting structure 332 is located at the first isolation opening 211 and the second isolation opening 212. The second electrode 333 is located on the side of each light-emitting structure 332 away from the mother plate 10 (i.e., the substrate 100). The first encapsulation layer 400 includes an encapsulation portion 410 for encapsulating each light-emitting structure 332.

[0142] Step S07: The motherboard 10 is cut by the spacing region NA so that the panel region PA forms a display panel. This results in the motherboard 10 forming multiple substrates 100, and the first insulating material layer 30 forming multiple pixel definition layers 300.

[0143] In these optional embodiments, a light-emitting structure 332, a second electrode 333, and a first encapsulation layer 400 can be fabricated. The light-emitting structure 332 is used to realize the light-emitting display of the display panel, the second electrode 333 is used to drive the light-emitting structure 332 to emit light, and the encapsulation portion 410 of the first encapsulation layer 400 is used to provide encapsulation protection for the light-emitting structure 332. After the light-emitting structure 332 is fabricated, the mother plate can be cut in step S07 to form multiple independent display panels.

[0144] Optionally, the display panel includes a first light-emitting structure, a second light-emitting structure, and a third light-emitting structure of different colors. Both the first and second isolation openings include a first opening, a second opening, and a third opening. In step S06, the first light-emitting structure, the second light-emitting structure, and the third light-emitting structure can be fabricated stepwise. For example, a first fabrication material layer can be deposited on the motherboard 10. The first fabrication material layer may include a first light-emitting material layer, a first conductive material layer, and a first encapsulation material layer. The portion falling into the first opening forms the first light-emitting structure, the second electrode 333 located on the first light-emitting structure, and the encapsulation portion 410. Then, the first fabrication material layer in the areas where the second and third openings are located is removed. Then, a second fabrication material layer is deposited on the motherboard 10. The second fabrication material layer may include a second light-emitting material layer, a second conductive material layer, and a second encapsulation material layer. The portion falling into the second opening forms the second light-emitting structure, the second electrode 333 located on the second light-emitting structure, and the encapsulation portion 410. Then, the second fabrication material layer in the areas where the first and third openings are located is removed. Finally, a third fabrication material layer is deposited on the motherboard 10. The third fabrication material layer may include a third light-emitting material layer, a third conductive material layer, and a third encapsulation material layer. The portion falling into the third opening forms a third light-emitting structure, a second electrode 333 located on the third light-emitting structure, and an encapsulation portion 410. Then, the third fabrication material layer in the areas where the second opening and the first opening are located is removed.

[0145] Optionally, such as Figure 13 As shown, the following may be included before step S06:

[0146] Step S051: The first insulating material layer 30 exposed by the isolation opening 210 is patterned to form a pixel opening 320. The pixel opening 320 and the isolation opening 210 are connected and used to accommodate the light-emitting structure. Optionally, the pixel opening 320 may include a first pixel opening, a second pixel opening, and a third pixel opening.

[0147] Optionally, the following may be included after step S06:

[0148] Step S061: Prepare a second and a third encapsulation material layer located in the panel region PA on the side of the first encapsulation material layer away from the motherboard 10.

[0149] Step S061: Prepare a touch function layer located in panel area PA on the side of the third encapsulation material layer opposite to the motherboard 10.

[0150] In these alternative embodiments, the encapsulation effect can be improved by fabricating a second and a third encapsulation material layer. The display panel gains touch functionality by incorporating a touch-sensitive layer.

[0151] After step S061, the motherboard is cut in step S07 so that each independently set display panel has touch function.

[0152] Optionally, when the isolation structure 200 includes a third sub-layer 203, a third material layer is also provided in step S02.

[0153] In some alternative embodiments, such as Figure 14 As shown, step S04 includes:

[0154] Step S041: As Figure 15 As shown, the first material layer and the second material layer are patterned for the first time to form a plurality of pre-openings located in the first display area AA1 and the second display area AA2.

[0155] Step S042: As Figure 10 As shown, the first material layer and the second material layer are side-cut to form an isolation opening 210 on the wall surface exposed by the pre-opening. The first material layer forms a first sub-layer 201, and the second material layer forms a second sub-layer 202. The second sub-layer 202 protrudes toward the isolation opening 210 relative to the first sub-layer 201.

[0156] In these optional embodiments, the first and second material layers are first pre-etched in step S041 to expose their sides. Then, in step S042, the first and second material layers are side-etched to form a first sub-layer 201 and a second sub-layer 202, with the second sub-layer 202 protruding relative to the first sub-layer 201 toward the isolation opening 210. A recess can be formed under the second sub-layer 202, allowing the light-emitting material layer to break along the periphery of the second sub-layer 202 during subsequent fabrication of the light-emitting unit 330, thus forming independent light-emitting structures 332.

[0157] In some alternative embodiments, such as Figure 16 As shown, step S05 includes:

[0158] Step S051: As Figure 17 As shown, a photoresist material layer is disposed on the side of the first material layer and the second material layer away from the substrate 100, and the photoresist material layer is patterned to form a photoresist layer, the photoresist layer including an etched opening that penetrates through it.

[0159] Step S052: As Figure 11 As shown, the first and second material layers exposed by the etched opening are patterned to form a light-transmitting opening 220.

[0160] In this embodiment, a photoresist material layer is first set in step S051, allowing the photoresist layer to cover the first isolation opening 211 and the second isolation opening 212, mitigating the impact on them in step S052. Then, in step S052, the first and second material layers are etched once to form the light-transmitting opening 220. This eliminates the need for further side etching of the first and second material layers exposed through the light-transmitting opening 220, simplifying the display panel manufacturing process.

[0161] Optionally, the photoresist layer covers the isolation opening 210, enabling the photoresist layer to protect the first and second material layers exposed through the isolation opening 210.

[0162] In this embodiment, the fabrication of the isolation opening 210 and the light-transmitting opening 220 are carried out in different process steps. First, the isolation opening 210 is formed by two etching steps. Then, after the isolation opening 210 is covered with photoresist, etching continues to form the light-transmitting opening 220, so that the fabrication of the isolation opening 210 and the light-transmitting opening 220 do not affect each other. Furthermore, when etching to form the first isolation opening 211 and the second isolation opening 212, since the influence of the light-transmitting opening 220 does not need to be considered, the etching solution can be more uniformly distributed in the first display area AA1 and the second display area AA2. This can reduce the shape difference between the wall surface of the isolation structure 200 facing the first isolation opening 211 and the wall surface of the isolation structure 200 facing the second isolation opening 212. When the second electrode 333 is subsequently prepared, the overlapping area of ​​the second electrode 333 in the first isolation opening 211 and the second isolation opening 212 with the isolation structure 200 is close, thereby making the light emission of the first display area AA1 and the light emission of the second display area AA2 close. This can reduce the display difference between the first display area AA1 and the second display area AA2 and improve the display effect and performance of the display panel.

[0163] The third aspect of this application also provides a display device, including a display panel of any of the first aspect embodiments or a display panel prepared by the second aspect embodiments. Since the display device provided by the third aspect of this application includes the display panel of any of the above embodiments, the display device provided by the embodiments of this application has the beneficial effects of the display panel of any of the above embodiments, which will not be elaborated further here.

[0164] The display devices in this application include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0165] Although this application has been described with reference to preferred embodiments, various modifications can be made thereto and components can be replaced with equivalents without departing from the scope of this application. In particular, the technical features mentioned in the various embodiments can be combined in any manner, provided there is no structural conflict. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display panel, characterized in that, The display panel includes a first display area and a second display area, wherein the light transmittance of the first display area is greater than that of the second display area, and the display panel includes: substrate; An isolation structure is disposed on one side of the substrate. The isolation structure encloses and forms an isolation opening and a light-transmitting opening. The isolation opening is used to accommodate a light-emitting unit. The isolation opening includes a first isolation opening located in the first display area and a second isolation opening located in the second display area. The light-transmitting opening is located in the first display area. The isolation structure includes a first sub-layer and a second sub-layer stacked in a direction away from the substrate, wherein the second sub-layer protrudes relative to the first sub-layer toward the isolation opening. The minimum distance between at least a portion of the edge of the first sublayer facing the first isolation opening and at least a portion of the edge of the second sublayer facing the first isolation opening is a first spacing, and the minimum distance between at least a portion of the edge of the first sublayer facing the second isolation opening and at least a portion of the edge of the second sublayer facing the second isolation opening is a second spacing, and the absolute value of the difference between the first spacing and the second spacing is less than or equal to 0.9 μm.

2. The display panel according to claim 1, characterized in that, The first sub-layer has a first sub-face facing the light-transmitting opening, and the second sub-layer has a second sub-face facing the light-transmitting opening, with the first sub-face and the second sub-face smoothly transitioning and connected; Preferably, the first sidewall of the isolation structure facing the light-transmitting opening is a plane; Preferably, the isolation structure has a first bottom wall surface facing the substrate, and the angle between the first side wall surface and the first bottom wall surface is less than 90 degrees.

3. The display panel according to claim 1, characterized in that, The isolation structure further includes a third sub-layer, which is located on the side of the first sub-layer facing the substrate, and the third sub-layer protrudes relative to the first sub-layer facing the isolation opening; Preferably, the first sub-layer has a first sub-surface facing the light-transmitting opening, the second sub-layer has a second sub-surface facing the light-transmitting opening, and the third sub-layer has a third sub-surface facing the light-transmitting opening; the first sub-surface and the second sub-surface are smoothly connected, and / or the first sub-surface and the third sub-surface are smoothly connected; preferably, the minimum distance between at least a portion of the edge of the first sub-layer facing the first isolation opening and at least a portion of the edge of the third sub-layer facing the first isolation opening is a third spacing, and the minimum distance between at least a portion of the edge of the first sub-layer facing the second isolation opening and at least a portion of the edge of the third sub-layer facing the second isolation opening is a fourth spacing, and the absolute value of the difference between the third spacing and the fourth spacing is less than or equal to 0.9 μm; Preferably, the minimum distance between at least a portion of the edge of the first sub-layer facing the light-transmitting opening and at least a portion of the edge of the third sub-layer facing the light-transmitting opening is an eighth spacing, the eighth spacing being less than the third spacing, and / or the eighth spacing being less than the fourth spacing.

4. The display panel according to claim 3, characterized in that, The minimum distance between at least a portion of the edge of the second sublayer facing the first isolation opening and at least a portion of the edge of the third sublayer facing the first isolation opening is a fifth spacing, and the minimum distance between at least a portion of the edge of the second sublayer facing the second isolation opening and at least a portion of the edge of the third sublayer facing the second isolation opening is a sixth spacing, and the absolute value of the difference between the fifth spacing and the sixth spacing is less than or equal to 0.9 μm; Preferably, the minimum distance between at least a portion of the edge of the second sub-layer facing the light-transmitting opening and at least a portion of the edge of the third sub-layer facing the light-transmitting opening is a ninth spacing, the ninth spacing being less than the fifth spacing, and / or, the ninth spacing being less than the sixth spacing.

5. The display panel according to claim 1, characterized in that, The projected area of ​​the light-transmitting opening on the substrate is smaller than the projected area of ​​at least one of the first isolation openings and / or the second isolation opening on the substrate. Preferably, the projected area of ​​the light-transmitting opening on the substrate is smaller than the projected area of ​​the smallest of the plurality of first isolation openings on the substrate. Preferably, the projected area of ​​the light-transmitting opening on the substrate is smaller than the projected area of ​​the smallest of the plurality of second isolation openings on the substrate.

6. The display panel according to claim 1, characterized in that, The minimum distance between at least a portion of the edge of the first sublayer facing the light-transmitting opening and at least a portion of the edge of the second sublayer facing the light-transmitting opening is a seventh spacing, the seventh spacing being less than the first spacing, and / or the seventh spacing being less than the second spacing.

7. The display panel according to claim 1, characterized in that, The first isolation opening includes two first straight edges arranged opposite each other along a first direction and two first arc edges arranged opposite each other along a second direction. The two first arc edges protrude in directions that are far apart from each other, and the two first straight edges and the two first arc edges enclose each other to form the first isolation opening. The first spacing is the minimum distance between the edge of the first sub-layer facing the first straight edge and the edge of the second sub-layer facing the first straight edge; And / or, the second isolation opening includes two second straight edges disposed opposite to each other along the first direction and two second arcuate edges disposed opposite to each other along the second direction, the two second arcuate edges protruding in directions away from each other, and the two second straight edges and the two second arcuate edges enclosing each other to form the first isolation opening; The second spacing is the minimum distance between the edge of the first sub-layer facing the second straight edge and the edge of the second sub-layer facing the second straight edge.

8. The display panel according to claim 1, characterized in that, The first sublayer has a second bottom surface facing the substrate and a first top surface facing away from the substrate. The first spacing includes the minimum distance between at least a portion of the edge of the first bottom surface facing the first isolation opening and at least a portion of the edge of the second sub-layer facing the first isolation opening; the second spacing includes the minimum distance between at least a portion of the edge of the first bottom surface facing the second isolation opening and at least a portion of the edge of the second sub-layer facing the second isolation opening. And / or, the first spacing includes the minimum distance between at least a portion of the edge of the first top surface toward the first isolation opening and at least a portion of the edge of the second sublayer toward the first isolation opening, and the second spacing includes the minimum distance between at least a portion of the edge of the first top surface toward the second isolation opening and at least a portion of the edge of the second sublayer toward the second isolation opening.

9. The display panel according to claim 1, characterized in that, The display panel further includes a pixel definition layer located on one side of the substrate. The pixel definition layer includes a pixel defining portion and a pixel opening formed by the pixel defining portion. The orthographic projection of the pixel opening onto the substrate and the orthographic projection of the isolation opening onto the substrate at least partially overlap. Wherein, the isolation structure is located on the side of the pixel defining portion away from the substrate, or the pixel defining portion further surrounds and forms a clearance opening, and the isolation structure is located within the clearance opening; Preferably, the display panel further includes a light-emitting unit located at least partially in the pixel opening, the light-emitting unit including a first electrode, a light-emitting structure and a second electrode stacked in a direction away from the substrate, the material of the isolation structure including a conductive material, and the second electrode and the isolation structure being electrically connected.

10. A method for manufacturing a display panel, characterized in that, include: A first insulating material layer is provided on one side of the motherboard. The motherboard includes multiple panel areas and a gap area located between two adjacent panel areas. The first insulating material layer is located in the panel areas and the gap area. The panel areas include a first display area and a second display area. The first insulating material layer in the interval region is patterned. In the panel area, on the side of the first insulating material layer facing away from the motherboard, a first material layer and a second material layer are sequentially disposed; The first material layer and the second material layer are patterned to form an isolation structure. The isolation structure includes an isolation opening, which includes a first isolation opening located in the first display area and a second isolation opening located in the second display area. The first material layer and the second material layer are further patterned to form a light-transmitting opening, which is located in the first display area.

11. The method according to claim 10, characterized in that, The motherboard includes detection terminals corresponding to the interval regions. During the step of patterning the first insulating material layer in the interval regions, the detection terminals located in the interval regions are exposed. The detection terminals are used to detect the performance of the motherboard. Preferably, the motherboard includes transistors, and the detection terminals are used to detect the performance of the transistors. Preferably, the detection terminal is used to detect the lifetime of the transistor; Preferably, the motherboard includes a driving circuit, and the detection terminal is used to detect the electrical signal of the driving circuit.

12. The method according to claim 10, characterized in that, The motherboard includes alignment marks located on the periphery of the interval region or the plurality of panel regions. During the step of patterning the first insulating material layer of the interval region, the alignment marks are exposed.

13. The method according to claim 10, characterized in that, After the step of further patterning the first material layer and the second material layer to form a light-transmitting opening, the method further includes: A light-emitting unit, a second electrode layer, and a first encapsulation layer are fabricated. The light-emitting unit is located at the first isolation opening and the second isolation opening. The second electrode is located on the side of each light-emitting unit away from the mother plate. The first encapsulation layer includes an encapsulation portion for encapsulating each light-emitting unit. The motherboard is cut from the interval area so that the panel area forms a display panel; Preferably, the process further includes the following steps before fabricating the light-emitting unit, the second electrode layer, and the first encapsulation layer: The first insulating material layer exposed by the isolation opening is patterned to form pixel openings; In the steps of fabricating the light-emitting unit, the second electrode layer, and the first encapsulation layer, at least a portion of the light-emitting unit is located in the pixel opening; Preferably, the method further includes, prior to the step of cutting the mother plate by the interval region so that the panel region forms a display panel: A second encapsulation material layer and a third encapsulation material layer are prepared on the side of the first encapsulation layer opposite to the motherboard, located in the panel area; A touch function layer located in the panel area is prepared on the side of the third encapsulation material layer opposite to the substrate.

14. The method according to claim 10, characterized in that, In the step of patterning the first material layer and the second material layer to form an isolation structure: The first material layer and the second material layer are first patterned to form a plurality of pre-openings located in the first display area and the second display area; The isolation opening is formed by side-cutting the wall surface exposed by the pre-opening of the first material layer and the second material layer. The first material layer forms a first sub-layer, the second material layer forms a second sub-layer, and the second sub-layer protrudes toward the isolation opening relative to the first sub-layer.

15. The method according to claim 10, characterized in that, In the step of further patterning the first material layer and the second material layer to form a light-transmitting opening: A photoresist material layer is disposed on the side of the first material layer and the second material layer away from the substrate, and the photoresist material layer is patterned to form a photoresist layer, the photoresist layer including a through-etched opening; The light-transmitting opening is formed by patterning the first material layer and the second material layer exposed by the etched opening; Preferably, the photoresist layer covers the isolation opening.

16. A display device, characterized in that, Includes the display surface as described in any one of claims 1-9, or the display panel prepared by the preparation method as described in any one of claims 10-15.

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