Script-based curved surface conformal multilayer interconnected three-dimensional circuit modeling method

Abstract

The invention provides a curved-surface conformal multilayer interconnected three-dimensional circuit modeling method based on scripts, which can quickly realize modeling of a curved-surface conformal multilayer interconnected three-dimensional circuit in three-dimensional modeling software, output a structure model file, provide input for subsequent simulation and processing manufacturing of the curved-surface conformal circuit, and improve the modeling efficiency of the curved-surface conformal multilayer interconnected three-dimensional circuit. And the design efficiency of the curved surface conformal circuit is improved. The established model is completely established by three-dimensional modeling software through scripts and can be output to other various common software for analysis, and the interactivity is good; the parameters on the curved surface can be rapidly extracted, and operations such as arc length calculation and equal-arc-length wiring can be conveniently achieved. The design scheme is particularly suitable for small satellites and deep space exploration tasks, and an effective solution is provided for high-performance and lightweight design of a new generation of spacecrafts.

Description

Technical Field

[0001] This invention relates to the field of antenna and microwave technology, and more specifically to a script-based method for modeling curved conformal multilayer interconnected three-dimensional circuits. Background Technology

[0002] With the continuous development of technology, the integration level of various electronic devices is constantly improving, and conformal design integrating circuits and structures has become an inevitable trend. This approach eliminates the space constraints imposed by planar circuits, greatly improves circuit layout capabilities, saves space, and achieves visual stealth. It has broad application prospects in radar, communication, positioning, navigation, and electronic warfare equipment.

[0003] However, existing commercial circuit design software is primarily developed for planar circuits, with limited applicability to constructing curved conformal multilayer interconnected 3D circuits. Structural modeling software has also not been developed for simulating curved circuits. There is currently no clear method for modeling curved conformal multilayer interconnected 3D circuits. Establishing a complete and accurate geometric model is fundamental for the structural and electromagnetic design, simulation, and fabrication of curved conformal circuits, and is also an important basis for conducting structural-electronic co-design.

[0004] To improve the design efficiency of conformal circuits on curved surfaces, there is an urgent need to provide a modeling method for conformal multilayer interconnected three-dimensional circuits on curved surfaces. Summary of the Invention

[0005] The purpose of this invention is to provide a rapid modeling method for curved conformal multilayer interconnected 3D circuits. This method enables rapid modeling of curved conformal multilayer interconnected 3D circuits in 3D modeling software and outputs structural model files, providing input for subsequent simulation and manufacturing of the curved conformal circuits, thereby improving the design efficiency of curved conformal circuits. The solution of this invention is as follows:

[0006] A script-based method for modeling conformal multilayer interconnected 3D circuits with curved surfaces, comprising the following steps:

[0007] (1) Obtain the point data P on the conformal surface to be conformed. surf ;

[0008] (2) Transfer the point data P surf Rasterization is performed to obtain the raster point data P of the conformal surface to be conformed. gridsurf And based on the grid point data P gridsurf Calculate the tangential vector U of the grid points on the conformal surface in the x-axis and y-axis planes. gridsurf and V gridsurf ;

[0009] (3) Model different circuits and establish modeling scripts for each circuit;

[0010] (4) According to the design requirements of the conformal multilayer interconnected three-dimensional circuit, the modeling scripts of each circuit obtained in step (3) are merged and subtracted to form a comprehensive modeling script;

[0011] (5) Input the above integrated modeling script into the 3D modeling software to complete the modeling of the curved surface conformal multilayer interconnected solid circuit, and save and output the above model for subsequent simulation, processing and manufacturing.

[0012] Preferably, the circuit modeling in step (3) includes four types: interconnect modeling, disk modeling, conformal surface modeling, and via modeling.

[0013] Preferably, the interconnection modeling process is as follows: obtaining each control point L of the interconnection to be modeled. p Only take L p Draw a straight line using the x and y coordinates of the point, and set the z coordinate value to be much higher than the z coordinate value of the highest point of the surface to be conformed. Set the projection direction and line width of the line, and use the projection command to project the line onto the surface to be conformed, thus completing the interconnection modeling.

[0014] Preferably, the process of modeling the disk is as follows: obtaining the control points C of the disk to be modeled. p Only C is taken. p Draw a circle using the x and y coordinates of the point, set the z coordinate value to be much larger than the z coordinate value of the highest point of the surface to be conformed to, set the radius, and use the projection command to project the circle onto the surface to be conformed to complete the disk modeling.

[0015] Preferably, the conformal surface modeling process is as follows: obtaining the control points P of the conformal surface to be modeled. p Take P p Draw a plane using the x and y coordinates of the point, and set the z coordinate value to be much larger than the z coordinate value of the highest point of the surface to be conformed. Use the projection command to project the plane onto the surface to be conformed, thus completing the conformal surface modeling.

[0016] Preferably, the via modeling is divided into vertical via modeling and normal via modeling.

[0017] Preferably, the process of modeling the vertical via is as follows: obtaining the control point H of the vertical via to be modeled. p Only H is taken p Draw a circle using the x and y coordinates of the point, set the z coordinate value to be much larger than the z coordinate value of the highest point of the surface to be conformed to, set the radius of the circle, and use the projection command to project the circle onto the surface to be conformed to; take the same H p Draw a circle using the x and y coordinates of the point, set the z coordinate value to be much smaller than the z coordinate value of the lowest point of the conformal surface, set the radius of the circle, and use the projection command to project the circle onto the conformal surface. Connect the two circles obtained above to form a cylinder, and complete the vertical through hole modeling.

[0018] Preferably, the modeling process for the normal via is as follows: Obtain control point H p Then, by treating the conformal surface grid point data P gridsurf Perform interpolation to obtain the normal control point H of the hole to be modeled. p@S By using the tangential vector U gridsurf and V gridsurf Interpolation is performed to obtain the control point H. p@S Tangential vector information and With control point H p@S With the origin as the origin and the directions of the two tangential vectors as the x-axis and y-axis, establish a local coordinate system. Draw circles at positions much higher and lower than the conformal surface under this local coordinate system. The operation after drawing the circles is the same as that for establishing vertical vias, thus completing the normal via modeling.

[0019] Preferably, the modeling script is written using MATLAB, and the 3D modeling software is HFSS.

[0020] Compared with the prior art, the present invention has the following advantages:

[0021] 1. It provides a rapid modeling method for curved surface conformal multilayer interconnected 3D circuits. By establishing modular functions through programming software, scripts for building the corresponding models can be generated, which can quickly and easily complete the modeling of curved surface conformal circuits.

[0022] 2. The established model is entirely created by 3D modeling software through scripts and can be exported to various other common software for analysis, with good interactivity.

[0023] 3. It enables rapid extraction of parameters from curved surfaces, facilitating operations such as arc length calculation and equal-arc-length wiring. This design scheme is particularly suitable for small satellites and deep space exploration missions, providing an effective solution for the high-performance and lightweight design of next-generation spacecraft. Attached Figure Description

[0024] Figure 1 This is a flowchart of the method of the present invention.

[0025] Figure 2 This is a rasterized conformal surface diagram in an embodiment of the present invention.

[0026] Figure 3 This is a schematic diagram of the conformal interconnection lines on the curved surface drawn by HFSS in an embodiment of the present invention.

[0027] Figure 4 This is a model diagram of the conformal interconnection line of the curved surface drawn by HFSS in an embodiment of the present invention.

[0028] Figure 5 This is a model diagram of a conformal disk surface drawn using HFSS in an embodiment of the present invention.

[0029] Figure 6 This is a model diagram of a conformal patch surface drawn using HFSS in an embodiment of the present invention.

[0030] Figure 7 This is a model diagram of a conformal through-hole on a curved surface drawn using HFSS in an embodiment of the present invention.

[0031] Figure 8 This is a schematic diagram of a one-layer conformal circuit model drawn using HFSS in an embodiment of the present invention.

[0032] Figure 9 This is a 3D schematic diagram of a curved conformal multilayer interconnected solid circuit drawn by HFSS in an embodiment of the present invention.

[0033] Figure 10 This is a schematic diagram of the layered structure of the conformal multilayer interconnected three-dimensional circuit in an embodiment of the present invention. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings.

[0035] The steps of a script-based method for modeling conformal multilayer interconnected 3D circuits are as follows: Figure 1 As shown. This embodiment is based on a multilayer interconnect planar circuit, but with some simplifications compared to the planar circuit to simplify the fabrication process of the curved conformal circuit. The scripting in this embodiment was done using MATLAB, and the 3D modeling software was HFSS.

[0036] Step 1: Obtain point data P on the conformal surface S to be conformed surf In the embodiment, the surface function to be conformed is Where x∈[0,116], y∈[0,128]. Import the surface structure file into FEKO software, perform mesh generation, and export the mesh file. The mesh file contains scattered point data P on the surface. surf information.

[0037] Step 2: Rasterize the surface point data, dividing the surface into 201×201 grids along the x and y axes, and using MATLAB's built-in `griddate` function to obtain the rasterized z-axis data. The rasterized surface S is shown below. Figure 2 As shown. Simultaneously, the tangential vector U of all grid points in the x-axis and y-axis planes can be calculated. gridsurf and V gridsurf .

[0038] Step 3: Model different circuits. In this example, interconnects, disks, conformal surfaces, and vias will be modeled separately.

[0039] Interconnection modeling: Obtaining the control points L of the interconnection to be modeled p To illustrate this more clearly, we first use MATLAB to plot the interconnecting lines formed by each control point on a rasterized surface, as shown below. Figure 3 As shown. Using MATLAB, the following steps generate a script for modeling operations in HFSS: Take L... p Draw a line using the x and y coordinates from the information, and set the z coordinate value to 10000mm. Set the line properties: "Type" to "Rectangle", "Orientation" to "Z", and "Width / Diameter" to 0.2mm. Use the "ProjectSheet" command to project the line onto the surface to be conformed. Running this modeling script separately in HFSS yields the interconnect model as shown below. Figure 4 As shown.

[0040] Disk modeling: Obtaining the control points C of the disk to be modeled p Using MATLAB, the following steps generate a script for modeling operations in HFSS: Take C... p Draw a circle using the x and y coordinates provided in the information, set the z coordinate to 10000mm, and set the circle's properties, with "Radius" set to 0.4mm. Use the "ProjectSheet" command to project the circle onto the conformal surface S to be conformed. Running this modeling script separately in HFSS yields a disk model as shown below. Figure 5 As shown.

[0041] Conformal surface modeling: Obtaining the control points P of the conformal surface to be modeled p Using MATLAB, the following steps generate a script for modeling operations in HFSS: Take P... p Draw a circle using the x and y coordinates from the information, and set the z coordinate value to 10000mm to ensure that the points on the conformal surface are connected end-to-end. Use the "ProjectSheet" command to project the surface onto the conformal surface S. Run this modeling script separately in HFSS to obtain the antenna patch model as shown below. Figure 6 As shown.

[0042] Vertical via modeling: Obtaining the control point H for the vertical via to be modeled. p Using MATLAB, the following steps generate a script for modeling operations in HFSS: The process is as follows: Obtain H... pDraw a circle using the x and y coordinates from the information, set the z coordinate to 10000mm, and set the circle's properties, with "Radius" set to 0.25mm. Use the "ProjectSheet" command to project the circle onto the conformal surface S. The circle will now be projected onto the conformal surface. Then, take the same H... p Draw a circle using the x and y coordinates provided in the information, and set the z coordinate to -10000mm. Set the circle's properties, with "Radius" set to 0.25mm. Use the "ProjectSheet" command to project the circle onto the conformal surface S. The circle will now be projected below the conformal surface. Connect the two circles using the "Connect" command. This completes the drawing of the vertical hole.

[0043] When modeling normal vias, use MATLAB to generate the modeling script in HFSS through the following operations: Obtain control points H. p Then, by analyzing the raster point data P gridsurf Interpolation to obtain control point H p@S By using the tangential vector U gridsurf and V gridsurf Interpolation is performed to obtain the control point H. p@S Tangential vector information and With control point H p@S Using the origin as the origin and the two vector directions as the x-axis and y-axis respectively, establish a local coordinate system using the "RelativeCS" command. Then, within this local coordinate system, draw a circle at coordinates (0,0,10000) and set the circle's "Radius" property to 0.25mm. Use the "ProjectSheet" command to project the circle onto the conformal surface S. The circle will now be projected onto the surface S. Next, within the same local coordinate system, draw another circle at coordinates (0,0,-10000) and set the circle's "Radius" property to 0.25mm. Use the "ProjectSheet" command to project the circle onto the conformal surface S. The circle will now be projected onto the surface S. Connect the two circles using the "Connect" command. This completes the drawing of the normal hole. Running this modeling script separately in HFSS yields the via model as shown below. Figure 7 As shown.

[0044] Step 4: Based on the design requirements of the conformal multilayer interconnected 3D circuit, and combining the modeling methods of the individual models above, merge the disk and interconnects, subtract vias from the surface, and use MATLAB to write the model building control script in HFSS. For models with translational relationships, the modeling control script can be generated in batches using a loop process. The single-layer conformal circuit model obtained by running the modeling control script for a single layer of the surface circuit in HFSS is shown below. Figure 8 As shown.

[0045] Step 5: After all control scripts are generated, open the HFSS software and run the written control scripts. HFSS will automatically complete the model drawing. A conformal multilayer interconnected 3D circuit model with curved surfaces is shown below. Figure 9 As shown, its layered diagram is as follows Figure 10 As shown in the image, this model file contains eleven layers of circuitry, including power supply, control, RF power divider, and radiating antenna components; the outputs can be saved for subsequent simulation and manufacturing.

[0046] The specific embodiments described herein are merely illustrative of the spirit of the invention. Those skilled in the art to which this invention pertains may make various modifications, additions, or similar substitutions to the described specific embodiments without departing from the spirit of the invention or exceeding the scope defined by the appended claims.

Claims

1. A script-based modeling method for a curved conformal multilayer interconnect three-dimensional circuit, characterized in that, The method comprises the following steps: (1) Obtain point data P on the to-be-conformal curved surface surf ; (2) Transfer the point data P surf Rasterization is performed to obtain the raster point data P of the conformal surface to be conformed. gridsurf And based on the grid point data P gridsurf Calculate the tangential vector U of the grid points on the conformal surface in the x-axis and y-axis planes. gridsurf and V gridsurf ; (3) modeling different circuits and establishing modeling scripts of the circuits; (4) according to the design requirements of the curved surface conformal multi-layer interconnection three-dimensional circuit, merging and subtracting the modeling scripts of the circuits obtained in step (3) to form a comprehensive modeling script; (5) inputting the comprehensive modeling script into a three-dimensional modeling software to complete the modeling of the curved surface conformal multi-layer interconnection three-dimensional circuit, and saving and outputting the model for subsequent simulation and manufacturing.

2. The script-based, surface-conformal, multi-layer, interconnect, 3D circuit modeling method of claim 1, wherein, The circuit modeling in step (3) comprises four types of interconnection line modeling, disc modeling, conformal surface modeling and via hole modeling.

3. The script-based, surface-conformal, multi-layer, interconnect, 3D circuit modeling method of claim 2, wherein, The process of modeling the interconnection line is as follows: obtaining each control point L of the interconnection line to be modeled p , drawing a straight line only by taking the x and y coordinates of L p , setting the z coordinate value far beyond the z coordinate value of the highest point of the to-be-conformed curved surface, setting the projection direction and line width of the straight line, projecting the straight line to the to-be-conformed curved surface by using the projection command, and completing the modeling of the interconnection line.

4. The script-based, surface-conformal, multi-layer, interconnect, 3D circuit modeling method of claim 2, wherein, The process of the disc modeling is: obtaining control points C of a disc to be modeled p , only taking x and y coordinates of C p to draw a circle, setting z coordinate value far more than the z coordinate value of the highest point of the to-be-conformed surface, setting a radius, projecting the circle to the to-be-conformed surface by using a projection command, and completing disc modeling.

5. The script-based, surface-conformal, multi-layer, interconnect, 3D circuit modeling method of claim 2, wherein, The process of the conformal surface modeling is: obtaining control points P of a conformal surface to be modeled p , taking x and y coordinates of P p points to draw a plane, setting z coordinate value far more than z coordinate value of the highest point of the conformal surface to be modeled, projecting the plane to the conformal surface to be modeled by using a projection command, and completing the conformal surface modeling.

6. The script-based, surface-conformal, multi-layer, interconnect, 3D circuit modeling method of claim 2, wherein, The via hole modeling is divided into vertical via hole modeling and normal via hole modeling.

7. The script-based, surface-conformal, multi-layer, interconnect, 3D circuit modeling method of claim 6, wherein, The process of the vertical via modeling is: obtaining control points H of the vertical via to be modeled p , only taking x and y coordinates of H p to draw a circle, setting z coordinate value far higher than z coordinate value of the highest point of the to-be-conformed surface, setting the radius of the circle, projecting the circle to the to-be-conformed surface by using a projection command; taking x and y coordinates of the same H p to draw a circle, setting z coordinate value far lower than z coordinate value of the lowest point of the to-be-conformed surface, setting the radius of the circle, projecting the circle to the to-be-conformed surface by using a projection command, connecting the two circles obtained above to form a cylinder, and completing the vertical via modeling.

8. The script-based, surface-conformal, multi-layer, interconnect, 3D circuit modeling method of claim 7, wherein, The modeling process for the normal via is as follows: Obtain control point H p Then, by treating the conformal surface grid point data P gridsurf Perform interpolation to obtain the normal control point H of the hole to be modeled. p@S By using the tangential vector U gridsurf and V gridsurf Interpolation is performed to obtain the control point H. p@S Tangential vector information and With control point H p@S With the origin as the origin and the directions of the two tangential vectors as the x-axis and y-axis, establish a local coordinate system. Draw circles at positions much higher and lower than the conformal surface under this local coordinate system. The operation after drawing the circles is the same as that for establishing vertical vias, thus completing the normal via modeling.

9. The script-based, surface-conformal, multi-layer, interconnect, 3D circuit modeling method of claim 1, wherein, The modeling script is written by using MATLAB, and the three-dimensional modeling software is HFSS.

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