Display device

Abstract

A display device according to an embodiment may include: a display panel including a main area, a sub-area, and a bending area between the main area and the sub-area; a polarizing layer disposed in the main region; a cap layer on the polarizing layer; a bonding layer between the polarizing layer and the capping layer; and a cover layer disposed on the bending area of the display panel. The bonding layer has an end portion that may be farther from the bending region than an end portion of the polarizing layer. The capping layer may be spaced apart from the bonding layer.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2024-0100105, filed on July 29, 2024, the entire contents of which are incorporated herein by reference for all purposes. Technical Field

[0003] This disclosure relates to display devices. Background Technology

[0004] With the advancement of the information society, the demand for display devices that can display images is increasing, and various types of display devices, such as liquid crystal display (LCD) devices and organic light-emitting diode (OLED) display devices, are being used. Summary of the Invention

[0005] The purpose of implementing this disclosure is to provide a display device with a narrow bezel.

[0006] Another object of embodiments of this disclosure is to provide a display device that can reduce the generation of bending (ripples) in the bonding layer that combines the polarizing layer and the capping layer, and improve external visibility defects.

[0007] The purpose of this disclosure is not limited to the above, and other technical purposes can be inferred from the following embodiments.

[0008] A display device according to embodiments of the present disclosure may include: a display panel including a main region, a sub-region, and a curved region between the main region and the sub-region; a polarizing layer disposed in the main region; a capping layer on the polarizing layer; a bonding layer between the polarizing layer and the capping layer; and a cover layer disposed on the curved region of the display panel. The bonding layer may have an end farther from the curved region than the end of the polarizing layer, and the cover layer may be spaced apart from the bonding layer.

[0009] A display device according to another embodiment of the present disclosure may include: a display panel including a main region, a sub-region, and a curved region between the main region and the sub-region; a polarizing layer disposed in the main region; a capping layer on the polarizing layer; a bonding layer between the polarizing layer and the capping layer; and a cover layer disposed in the curved region of the display panel, wherein the bonding layer has an end that protrudes towards the curved region more than the end of the polarizing layer. The cover layer may include: a first cover layer in contact with a side surface of the polarizing layer; and a second cover layer located outside the first cover layer and in contact with the first cover layer. The surface height of the first cover layer may be equal to the surface height of the polarizing layer.

[0010] Specific details of other embodiments are included in the detailed description and accompanying drawings. Attached Figure Description

[0011] Figure 1 This is a plan view of the display device according to the embodiment;

[0012] Figure 2 yes Figure 1 A cross-sectional view of the display panel in a bent state;

[0013] Figure 3 yes Figure 1 A plan view of the display panel in a bent state;

[0014] Figure 4 It is along Figure 3 A cross-sectional view taken from line A-A';

[0015] Figure 5 yes Figure 4 Detailed cross-sectional view of the light-emitting layer;

[0016] Figure 6 This is a detailed cross-sectional view of the light-emitting layer according to the alternative implementation method;

[0017] Figure 7 It is along Figure 3 A cross-sectional view taken from line B-B';

[0018] Figure 8 yes Figure 7 Enlarged cross-sectional view of region Q1;

[0019] Figure 9 It is along Figure 3 A cross-sectional view taken from line C-C';

[0020] Figure 10 yes Figure 9 Enlarged cross-sectional view of region Q2;

[0021] Figure 11 This is a cross-sectional view of the display device according to the embodiment;

[0022] Figures 12 to 15 It is used for explanation Figure 11 A cross-sectional view of the manufacturing method of the display device;

[0023] Figure 16 This is a cross-sectional view of a display device according to another embodiment;

[0024] Figure 17 This is a cross-sectional view of a display device according to another embodiment;

[0025] Figure 18 This is a cross-sectional view of a display device according to another embodiment;

[0026] Figures 19 to 20 It is used for explanation Figure 18 A cross-sectional view of a method for manufacturing a display device; and

[0027] Figure 21 This is a cross-sectional view of a display device according to another embodiment. Detailed Implementation

[0028] In the following description, embodiments will be described with reference to the accompanying drawings.

[0029] The same reference numerals refer to the same parts. Additionally, in the accompanying drawings, the thickness, scale, and dimensions of parts may be exaggerated for the purpose of effectively explaining the technical content. Although parts are drawn at a different scale than their actual size for ease of explanation, the parts are not limited to the scale shown in the drawings.

[0030] In public information, when a component (or area, layer, section, etc.) is mentioned as "on top of another component", "connected to", or "coupled to" another component, it means that it can be directly connected to / coupled to another component, or that a third component can be placed between them.

[0031] The expression “and / or” is considered to include one or more combinations that can be defined by the associated components.

[0032] The terms "first," "second," etc., are used to describe various components, but the components should not be limited by these terms. These terms are only used to distinguish one component from another. For example, without departing from the scope of the invention, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component. Unless the context clearly indicates otherwise, the singular form is intended to include the plural form as well.

[0033] Terms such as “below,” “lower,” “above,” and “upper” are used to describe the relationship between components depicted in the accompanying drawings. These terms are relative concepts and are described based on the directions indicated in the drawings. For example, unless explicitly stated using terms such as “directly” or “immediately”, one or more other components may be located between two described components. Spatially relative terms such as “below,” “below,” “lower,” “above,” and “upper” are used to facilitate the description of the relationship between one component or element shown in the drawings and another component or element. These spatially relative terms should be understood to include terms for different orientations of components during use or operation, in addition to those shown in the drawings. For example, if a component shown in the drawings is flipped, a component described as “below” or “below” another component may be located “above” that component. Thus, the term “below” can, for example, encompass both upward and downward directions.

[0034] It should also be understood that the terms “comprising,” “having,” etc., are intended to specify the presence of the stated features, number, steps, operations, components, parts, or combinations thereof, and are not intended to exclude the presence or possibility of one or more other features, number, steps, operations, components, parts, or combinations thereof.

[0035] The various features of the embodiments of this disclosure may be combined or assembled together in technically different ways, and each embodiment may be implemented independently or in combination with related embodiments.

[0036] In the following description, a display device according to an embodiment of the present disclosure will be described with reference to the accompanying drawings.

[0037] Figure 1 This is a plan view of a display device according to an embodiment.

[0038] Reference Figure 1 The display device 1 according to the embodiment may include a display panel 100. The display panel 100 may include a display area DA comprising a plurality of pixels PX and a non-display area NDA surrounding the display area DA. The display area DA may have a rectangular planar shape. However, the display area DA is not limited to this and may have a square, circular, elliptical or other polygonal planar shape. For example, the display area DA may have a rounded rectangular shape, but is not limited to this, and may also be a rectangular shape with sharp corners.

[0039] In this implementation, the first direction DR1 and the second direction DR2 are different directions that intersect each other, for example, directions that are perpendicular to each other in a plan view. Figure 1 In this embodiment, the first direction DR1 may correspond to the extension direction of the short side of the display panel 100, while the second direction DR2 may correspond to the extension direction of the long side of the display panel 100. However, it should be understood that the directions mentioned in the embodiment are relative and are not limited to the specific directions described.

[0040] The display area DA may include a short side extending along a first direction DR1 and a long side extending along a second direction DR2. The non-display area NDA may surround the display area DA. The non-display area NDA may be disposed on one side and the other side of the display area DA along the first direction DR1, and on one side and the other side of the display area DA along the second direction DR2.

[0041] The display panel 100 may further include a sensor non-display area NDA_S and sensor holes SH surrounded by the sensor non-display area NDA_S. In a plan view, the sensor holes SH may be surrounded by the display area DA. For example, the number of sensor holes SH may be as follows: Figure 1The embodiments shown are one example, but the present disclosure is not limited to this. For example, there are two sensor holes SH, one for an infrared sensor and the other for a camera sensor; however, the embodiments of the present disclosure are not limited to this. The sensor non-display area NDA_S can be disposed between the sensor hole SH and the display area DA. The sensor non-display area NDA_S can completely surround the sensor hole SH. Pixels PX may not be arranged in the sensor non-display area NDA_S.

[0042] The gate driving unit (GIP) can be arranged in the non-display area NDA on each side of the display area DA in the first direction DR1. A low-potential voltage line VSSL can be provided outside the gate driving unit GIP in the non-display area NDA. For example, as... Figure 1 As shown, the low-potential voltage line VSSL can extend from the flexible printed circuit board FPCB, pass through the sub-region SR and the curved region BR, and is located outside the gate drive unit GIP in the non-display region NDA while surrounding the display region DA.

[0043] The non-display area NDA located on the opposite side of the display area DA in the second direction DR2 can extend further in the second direction DR2 from the central portion of that side of the display area DA. The width of the non-display area NDA extending further in the second direction DR2 from the central portion of the opposite side of the display area DA in the second direction DR2 in the first direction DR1 can be smaller than the width of the non-display area NDA adjacent to the non-display area NDA extending further in the second direction DR2 from the central portion of the opposite side of the display area DA in the second direction DR2 in the first direction DR1.

[0044] Display device 1 may include a main region MR, a sub-region SR, and a curved region BR between the main region MR and the sub-region SR. A display region DA and a non-display region NDA surrounding the display region DA on all four sides may form the main region MR, while a portion extending further along a second direction DR2 from the central portion on the other side of the display region DA may constitute the curved region BR and the sub-region SR. The curved region BR may be located between the sub-region SR and the main region MR. The sub-region SR may include a first pad region PA1 and a second pad region PA2 located at opposite ends of the sub-region SR along the second direction DR2.

[0045] The display device 1 may further include a data driver unit (DIC) and a flexible printed circuit board (FPCB). The data driver unit (DIC) may be placed in a first pad area PA1, and the flexible printed circuit board (FPCB) may be disposed to or attached to a second pad area PA2. The first pad area PA1 and the second pad area PA2 may each include a plurality of pads connecting the data driver unit (DIC) and the flexible printed circuit board (FPCB). For example, the data driver unit (DIC) may be provided in the form of a driver chip IC, but is not limited thereto. In one embodiment, the data driver unit (DIC) is disposed using a chip-on-plastic method and directly mounted on the display panel 100, but is not limited thereto, and may also be disposed using a chip-on-glass method or a chip-on-film method.

[0046] The display panel 100 according to the embodiment may further include a covering portion (CLP). The covering portion CLP may be disposed in the main region MR, and may not be disposed in the curved region BR and the sub-region SR. The covering portion CLP may be disposed in the non-display region NDA. The covering portion CLP may be disposed in the non-display region NDA on one side of the first direction DR1, the opposite side of the first direction DR1, and the side of the second direction DR2 of the display region DA. The covering portion CLP disposed in the non-display region NDA on one side of the first direction DR1, the opposite side of the first direction DR1, and the side of the second direction DR2 may be integrally formed; however, the embodiments of the present disclosure are not limited thereto. The covering portion CLP may also partially extend and be disposed in the non-display region NDA on the opposite side of the second direction DR2 of the display region DA; however, the embodiments of the present disclosure are not limited thereto.

[0047] The display panel 100 according to the embodiment may further include a crack detection pattern CRP disposed between the covered portion CLP and the low-potential voltage line VSSL. The crack detection pattern CRP may be arranged to surround or completely enclose the display area DA, such as... Figure 1 As shown. For example, the crack detection pattern CRP can be placed between the covering portion CLP and the low-potential voltage line VSSL. However, embodiments of this disclosure are not limited to this, and the crack detection pattern CRP can be partially disposed in the non-display area NDA on the opposite side of the display area DA in the second direction DR2.

[0048] Figure 2 It shows Figure 1 A cross-sectional view of the display panel in a bent state. Figure 3 yes Figure 1 A plan view of the display panel in a bent state.

[0049] Reference Figure 2 and Figure 3According to the embodiment, the curved region BR of the display panel 100 of the display device 1 can be bent in the thickness direction (or the third direction DR3). Thus, the main region MR and the sub-region SR can overlap in the thickness direction. The display panel 100 can be bent such that the bottom surface of the main region MR and the top surface of the sub-region SR face each other. A flexible printed circuit board (FPCB) can be disposed on or attached to the end of the sub-region SR.

[0050] The curved region BR of the display panel 100 can be bent so that the sub-region SR overlaps with the main region MR. The flexible printed circuit board FPCB and the data driving unit DIC can overlap with the main region MR respectively; however, the embodiments of this disclosure are not limited thereto.

[0051] A housing may also be provided on the outer side of the display panel 100. The housing may be provided along the boundary (or edge) of the display panel 100; however, the embodiments of this disclosure are not limited thereto.

[0052] Figure 4 It is along Figure 3 A cross-sectional view taken from line A-A'.

[0053] Reference Figure 4 The display panel 100 may include a substrate 101, a first thin-film transistor 120, a second thin-film transistor 130, a light-emitting layer 150, an encapsulation layer 170, and a touch layer 180. The display panel 100 may include at least one inorganic layer between the substrate 101 and the light-emitting layer 150. The at least one inorganic layer may include at least one of the following: a buffer layer 102, a first insulating layer 103, a second insulating layer 104, a third insulating layer 105, a fourth insulating layer 106, a fifth insulating layer 108, and a sixth insulating layer 109; however, embodiments of this disclosure are not limited thereto. The at least one inorganic layer constituting the touch layer 180 may include at least one of a touch buffer layer 181 and an insulating layer 184; however, embodiments of this disclosure are not limited thereto.

[0054] Substrate 101 may include one or more plastic materials. For example, substrate 101 may be a multi-substrate comprising various plastic materials such as polyimide; however, embodiments of this disclosure are not limited thereto. For example, substrate 101 may include a first substrate 101a and a second substrate 101b, each comprising a plastic material, and a third substrate 101c comprising an inorganic material between the first substrate 101a and the second substrate 101b; however, embodiments of this disclosure are not limited thereto.

[0055] A first light-blocking layer 126 may be disposed on the substrate 101. The first light-blocking layer 126 can prevent light from passing through the first semiconductor layer 123 of the first thin-film transistor 120. For example, the first semiconductor layer 123 may be disposed overlapping the first light-blocking layer 126. The first light-blocking layer 126 may be a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), nickel (Ni), neodymium (Nd), copper (Cu), or alloys thereof, but the embodiments of this disclosure are not limited thereto.

[0056] A buffer layer 102 may be disposed on the first light-blocking layer 126. The buffer layer 102 may minimize or delay the diffusion of moisture or oxygen that has permeated into the substrate 101. The buffer layer 102 may be formed by stacking silicon nitride (SiNx) and silicon oxide (SiOx) at least once alternately, but embodiments of the present disclosure are not limited thereto.

[0057] A first insulating layer 103 may be disposed on the buffer layer 102. The first insulating layer 103 can prevent short circuits between the configuration of the first thin-film transistor 120 and the first light-blocking layer 126. The first insulating layer 103 may be made of the same material as the buffer layer 102, but embodiments of the present disclosure are not limited thereto. For example, the first insulating layer 103 may be made of inorganic materials such as silicon nitride (SiNx) or silicon oxide (SiOx), but embodiments of the present disclosure are not limited thereto.

[0058] The first thin-film transistor 120 may be disposed on the first insulating layer 103. The first thin-film transistor 120 may include a first source electrode 121, a first gate electrode 122, a first semiconductor layer 123, and a first drain electrode 124.

[0059] The first semiconductor layer 123 may be disposed on the first insulating layer 103. The first semiconductor layer 123 may include a metal oxide semiconductor such as indium gallium zinc oxide (IGZO) or a silicon-based semiconductor material such as amorphous silicon or polycrystalline silicon, but embodiments of the present disclosure are not limited thereto. The first semiconductor layer 123 may include a channel region, a source region, and a drain region.

[0060] Polycrystalline semiconductor layers have higher mobility than amorphous semiconductor layers and oxide semiconductor layers, thus they can have lower power consumption and improved reliability. Therefore, driving transistors can be composed of polycrystalline semiconductor layers; however, embodiments of this disclosure are not limited thereto.

[0061] The second insulating layer 104 may be disposed on the first semiconductor layer 123. The second insulating layer 104 may be made of the same material as the first insulating layer 103 and may prevent short circuits between the first semiconductor layer 123 and other components of the first thin-film transistor 120.

[0062] The first gate electrode 122 may be disposed on the second insulating layer 104. The first gate electrode 122 may be arranged to overlap with the channel region of the first semiconductor layer 123 located on the second insulating layer 104. The first gate electrode 122 may consist of a single-layer or multi-layer structure, which includes materials such as molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), neodymium (Nd), or compounds thereof, but embodiments of this disclosure are not limited to these materials. The first gate electrode 122 may be disposed together with a gate line; however, embodiments of this disclosure are not limited thereto.

[0063] The third insulating layer 105 may be disposed on the first gate electrode 122. The third insulating layer 105 may be made of the same material as the first insulating layer 103 or the second insulating layer 104; however, embodiments of the present disclosure are not limited thereto.

[0064] The first source electrode 121 and the first drain electrode 124 can be disposed on the third insulating layer 105.

[0065] The first source electrode 121 and the first drain electrode 124 can be electrically connected to the first semiconductor layer 123 through contact holes. The first source electrode 121 and the first drain electrode 124 can be made of a metallic material. For example, the first source electrode 121 and the first drain electrode 124 can be composed of a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), or alloys thereof, but the embodiments of this disclosure are not limited thereto.

[0066] The first source electrode 121 and the first drain electrode 124 can be arranged together with the data line. For example, the data line can be formed in the same layer as the first source electrode 121 and the first drain electrode 124 and made of the same material as them, but the embodiments of this disclosure are not limited thereto.

[0067] The storage electrode 140 may be disposed separately from the first thin-film transistor 120. The storage electrode 140 may include a first storage electrode 141, a second storage electrode 142, and a third storage electrode 143.

[0068] The first storage electrode 141 may be disposed in the same layer as the first gate electrode 122 and made of the same material, but the embodiments of the present disclosure are not limited thereto.

[0069] The second storage electrode 142 may be disposed on the first storage electrode 141. The second storage electrode 142 may be disposed on the third insulating layer 105, and a capacitor may be formed by using the third insulating layer 105, which serves as the dielectric between the first storage electrode 141 and the second storage electrode 142. The second storage electrode 142 may be made of the same material as the first storage electrode 141, but embodiments of this disclosure are not limited thereto.

[0070] The second thin-film transistor 130 may be configured to be spaced apart from the first thin-film transistor 120 and the storage electrode 140. The second thin-film transistor 130 may include a second source electrode 131, a second gate electrode 132, a second semiconductor layer 133, and a second drain electrode 134.

[0071] The second light-blocking layer 136 can be disposed in the same layer as the second storage electrode 142.

[0072] Similar to the first light-blocking layer 126, the second light-blocking layer 136 can prevent light from reaching the second semiconductor layer 133, thereby extending the lifetime of the second thin-film transistor 130. For example, the second semiconductor layer 133 can be configured to overlap with the second light-blocking layer 136.

[0073] The fourth insulating layer 106 may be disposed on the second light-blocking layer 136. The fourth insulating layer 106 may be made of the same material as the first insulating layer 103, the second insulating layer 104 or the third insulating layer 105, but the embodiments of the present disclosure are not limited thereto.

[0074] The second semiconductor layer 133 may be disposed on the fourth insulating layer 106. The second semiconductor layer 133 may include a source region, a drain region, and a channel region between the source region and the drain region.

[0075] The second semiconductor layer 133 may include semiconductor materials such as metal oxide semiconductors, such as indium gallium zinc oxide (IGZO), or silicon-based semiconductor materials such as amorphous silicon or polycrystalline silicon, but embodiments of the present disclosure are not limited thereto.

[0076] The fifth insulating layer 108 may be disposed on the second semiconductor layer 133. The fifth insulating layer 108 may be made of the same material as the first insulating layer 103, the second insulating layer 104, the third insulating layer 105 or the fourth insulating layer 106, but the embodiments of the present disclosure are not limited thereto.

[0077] The second gate electrode 132 can be disposed on the fifth insulating layer 108.

[0078] The second gate electrode 132 may be made of the same material as the first gate electrode 122, but embodiments of this disclosure are not limited thereto. For example, the second gate electrode 132 may be formed as a single layer or multiple layers of a material such as molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), neodymium (Nd), or alloys of these materials, but embodiments of this disclosure are not limited thereto.

[0079] The sixth insulating layer 109 may be disposed on the second gate electrode 132. The sixth insulating layer 109 may be made of the same material as the first insulating layer 103, the second insulating layer 104, the third insulating layer 105, the fourth insulating layer 106 or the fifth insulating layer 108, but the embodiments of the present disclosure are not limited thereto.

[0080] The first source electrode 121, the first drain electrode 124, the third storage electrode 143, the second source electrode 131, and the second drain electrode 134 can be disposed on the sixth insulating layer 109.

[0081] The third storage electrode 143, the second source electrode 131, and the second drain electrode 134 may be made of the same material as the first source electrode 121 and the first drain electrode 124, and may be disposed on the same layer; however, embodiments of this disclosure are not limited thereto. For example, the third storage electrode 143, the second source electrode 131, and the second drain electrode 134 may be formed as a single layer or multiple layers, said single layer or multiple layers being made of materials such as molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), or alloys of these materials, but embodiments of this disclosure are not limited thereto. For example, the third storage electrode 143 and the second source electrode 131 may be directly connected, but embodiments of this disclosure are not limited thereto.

[0082] The first thin-film transistor 120 may be a driving transistor, and the second thin-film transistor 130 may be a switching transistor, but the embodiments of this disclosure are not limited thereto.

[0083] The first source electrode 121 and the first drain electrode 124 may have a first protective layer 111 disposed thereon.

[0084] The first protective layer 111 can planarize the upper part of the first thin-film transistor 120 and protect the first thin-film transistor 120. The first protective layer 111 can be made of organic materials. For example, the first protective layer 111 can be made of materials such as acrylic resin, epoxy resin, phenolic resin, polyamide resin or polyimide resin, but the embodiments of this disclosure are not limited thereto.

[0085] A second protective layer 112 may be provided on the first protective layer 111. The second protective layer 112 may be formed of the same material as the first protective layer 111, but the embodiments of the present disclosure are not limited thereto.

[0086] A connecting electrode 145 can be provided between the first protective layer 111 and the second protective layer 112.

[0087] The connection electrode 145 can electrically connect the second thin-film transistor 130 and the light-emitting layer 150. The connection electrode 145 can be made of the same material as the first source electrode 121 and the first drain electrode 124, but the embodiments of this disclosure are not limited thereto.

[0088] The connecting electrode 145 may be a single layer or multiple layers made of materials such as molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), or alloys of these materials, but embodiments of this disclosure are not limited thereto.

[0089] The light-emitting layer 150 may be disposed on the second protective layer 112. The light-emitting layer 150 may include an anode electrode 151, an organic layer 152, and a cathode electrode 153.

[0090] The second protective layer 112 may have an anode electrode 151 disposed thereon. The anode electrode 151 may be electrically connected to the first thin-film transistor 120 through a contact hole formed in the second protective layer 112. The anode electrode 151 may be a reflective electrode that reflects light, but embodiments of the present disclosure are not limited thereto. The anode electrode 151 may include a laminated structure of aluminum (Al) and titanium (Ti) (Ti / Al / Ti), a laminated structure of aluminum (Al) and ITO (ITO / Al / ITO), or a highly reflective metallic material such as APC alloy, and may be formed as a single layer or multiple layers, but embodiments of the present disclosure are not limited thereto.

[0091] An organic layer 152 may be disposed on the anode electrode 151. The organic layer 152 may include one or more light-emitting structures (or light-emitting devices or elements), which are stacked on the anode electrode 151 in a hole transport layer and an electron transport layer, or in reverse order. For example, the hole transport layer may include a hole transport layer, a hole injection layer, an electron blocking layer, or a P-type charge generation layer, but embodiments of this disclosure are not limited thereto. For example, the electron transport layer may include an electron transport layer, an electron injection layer, a hole blocking layer, or an N-type charge generation layer, but embodiments of this disclosure are not limited thereto. The organic layer 152 may be an organic light-emitting layer, an inorganic light-emitting layer, a quantum dot light-emitting layer, a micro-light-emitting diode, or a micro-mini light-emitting diode, but embodiments of this disclosure are not limited thereto. For example, in the display panel 100 according to an embodiment of this disclosure, the organic layer 152 may include an organic light-emitting layer. The organic layer 152 may include a red light-emitting layer, a green light-emitting layer, and a blue light-emitting layer. The organic layer 152 may also include a white light-emitting layer, but embodiments of this disclosure are not limited thereto.

[0092] The cathode electrode 153 may be disposed on the organic layer 152. The cathode electrode 153 may be a transparent electrode that transmits light, but embodiments of the present disclosure are not limited thereto. For example, the cathode electrode 153 may include a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO), or a metal that allows visible light to pass through, but embodiments of the present disclosure are not limited thereto.

[0093] The dam 154 can be configured to expose the anode electrode 151. The dam 154 can define an opening (or light-emitting area) for a sub-pixel and can be configured to cover the edge portion (or boundary portion) of the anode electrode 151. Each sub-pixel can include a red light-emitting area, a green light-emitting area, and a blue light-emitting area. For example, a sub-pixel can be a pixel, but the term is not limited thereto. The dam 154 can be made of a material containing black pigment or an organic material such as benzocyclobutene resin, polyimide resin, acrylic resin, or a photosensitive polymer; however, embodiments of this disclosure are not limited thereto. When the dam 154 is made of a material containing black pigment or black dye, the dam 154 can be a black dam. When the dam 154 is made of a material containing black pigment or black dye, the dam 154 can block light from the outside or block light reflected from the outside, thereby improving the brightness of the display device. A spacer 155 can be further provided on the dam 154. The spacer can be made of the same material as the dam 154, but embodiments of this disclosure are not limited thereto.

[0094] An encapsulation layer 170 may be disposed on the embankment 154 or the light-emitting layer 150. The encapsulation layer 170 may include one or more insulating layers. For example, the encapsulation layer 170 may include a first encapsulation layer 171, a second encapsulation layer 172 located on top of the first encapsulation layer 171, and a third encapsulation layer 173 located on top of the second encapsulation layer 172. The encapsulation layer 170 may include one or more inorganic material layers and one or more organic material layers. For example, the first encapsulation layer 171 and the third encapsulation layer 173 may include inorganic materials, while the second encapsulation layer 172 may include organic materials, but embodiments of this disclosure are not limited thereto.

[0095] A buffer layer 181 may be disposed on the encapsulation layer 170. For example, the buffer layer 181 may be disposed on the third encapsulation layer 173. The buffer layer 181 may be made of the same material as the buffer layer 102, but embodiments of the present disclosure are not limited thereto. An insulating layer 184 may be disposed on the buffer layer 181. The insulating layer 184 can prevent short circuits between the touch electrodes. The insulating layer 184 may be made of silicon oxide (SiOx), silicon nitride (SiNx), or multiples thereof, but embodiments of the present disclosure are not limited thereto. A first touch electrode 185 may be disposed on the insulating layer 184. The first touch electrode 185 may include a first a touch electrode 185a extending in a first direction and a second b touch electrode 185b extending in a second direction different from the first direction.

[0096] A second touch electrode 182 can be disposed between the buffer layer 181 and the insulating layer 184.

[0097] The second touch electrode 182 can be electrically connected to the first a touch electrode 185a through a contact hole formed in the insulating layer 184. For example, the first a touch electrode 185a and the second touch electrode 182 can extend in a first direction.

[0098] The first touch electrode 185 and the second touch electrode 182 may comprise metallic materials. For example, they may be formed of titanium (Ti), nickel (Ni), aluminum (Al), or alloys thereof, and may consist of three layers such as titanium (Ti) / aluminum (Al) / titanium (Ti), but embodiments of this disclosure are not limited thereto.

[0099] Figure 5 yes Figure 4 Detailed cross-sectional view of the light-emitting layer.

[0100] Reference Figure 5 The light-emitting layer 150 can extend across the first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel PX3.

[0101] The thickness of the light-emitting layer 150 may be different in each sub-pixel PX1, PX2 and PX3, but the embodiments of the present disclosure are not limited thereto, and the thickness of the light-emitting layer 150 in each sub-pixel PX1, PX2 and PX3 may also be the same.

[0102] Organic layer 152 may include a first organic layer 152a disposed in the first sub-pixel PX1, a second organic layer 152b disposed in the second sub-pixel PX2, and a third organic layer 152c disposed in the third sub-pixel PX3. The light-emitting layers EML1, EML2, and EML3 in the corresponding organic layers 152a, 152b, and 152c can be physically separated, but the lower and upper layers of the light-emitting layers EML1, EML2, and EML3 can be integrally formed across sub-pixels PX1, PX2, and PX3. The light-emitting layers EML1, EML2, and EML3 may have different thicknesses. For example, the first light-emitting layer EML1 may have the largest thickness, followed by the second light-emitting layer EML2, and the third light-emitting layer EML3 may have the smallest thickness, but the embodiments of this disclosure are not limited thereto.

[0103] A hole injection layer HIL can be formed on the anode electrode 151. The hole injection layer HIL can be positioned between the anode electrode 151 and the light-emitting layers EML1, EML2, and EML3. The hole injection layer HIL can be integrally formed across sub-pixels PX1, PX2, and PX3. For example, the hole injection layer HIL can be made of materials selected from the group consisting of MTDATA, CuPc, TCTA, NPB (NPD), HATCN, TDAPB, PEDOT / PSS, F4TCNQ, and N-(biphenyl-4-yl)-9,9-dimethyl-N-(4-(9-phenyl-9H-carbazol-3-yl)phenyl)-9H-fluorene-2-amine, but the embodiments of this disclosure are not limited thereto.

[0104] A hole transport layer (HTL) can be set on the hole injection layer (HIL). The hole transport layer (HTL) can be positioned between the hole injection layer (HIL) and the light emission layers (EML1, EML2, and EML3). The hole transport layer (HTL) can be integrally formed across sub-pixels (PX1, PX2, and PX3). Made from one or more of the following materials: aromatic amine-based compounds (aromatic amine bases) such as NPB (N,N-naphthyl-N,N'-phenylbenzidine), TPD (N,N'-bis-(3-methylphenyl)-N,N'-bis-(phenyl)-benzidine), PPD, TTBND, FFD, p-dmDPS, TAPC; starburst aromatic amines such as TCTA, PTDATA, TDAPB, TDBA, 4-a, TCTA; spirocyclic and ladder-type materials (spirocyclic and ladder-type) such as spiro-TPD, spiro-mTTB, spiro-2, NPD (N,N-dinaphthyl-N,N'-diphenylbenzidine), s-TAD, and MTDATA (4,4',4”-tris(N-3-methylphenyl-N-phenyl-amino)-triphenylamine); however, embodiments of the present disclosure are not limited thereto.

[0105] Light-emitting layers EML1, EML2, and EML3 can be set on the hole transport layer HTL. The first sub-pixel PX1 can have the first light-emitting layer EML1, the second sub-pixel PX2 can have the second light-emitting layer EML2, and the third sub-pixel PX3 can have the third light-emitting layer EML3.

[0106] The light-emitting layers EML1, EML2, and EML3 can have different thicknesses. For example, the first light-emitting layer EML1 can have... to The thickness of the second light-emitting layer EML2 can be such that... to The thickness, and the third light-emitting layer EML3 can have to The thickness is not limited to this, but the implementation of the present disclosure is not limited thereto.

[0107] The first luminescent layer EML1, the second luminescent layer EML2, and the third luminescent layer EML3 may comprise materials that emit light in the visible spectrum by combining individually transmitted holes and electrons.

[0108] An electron blocking layer (EBL) can be applied to each of the luminescent layers EML1, EML2, and EML3. The electron blocking layer (EBL) can be applied uniformly across sub-pixels PX1, PX2, and PX3.

[0109] An electron transport layer (ETL) can be disposed on the electron blocking layer (EBL). The ETL can be disposed integrally (or jointly) across sub-pixels PX1, PX2, and PX3. The ETL can be made of anthracene derivatives and lithium quinoline (Liq), or one or more of oxadiazole, triazole, phenanthrene, benzoxazole, benzothiazole, or benzimidazole (e.g., 2-[4-(9,10-di-2-naphthyl-2-anthrayl)phenyl]-1-phenyl-1H-benzimidazole); however, embodiments of this disclosure are not limited thereto.

[0110] A cathode electrode 153 can be set on the electron transport layer (ETL).

[0111] Figure 6 This is a detailed cross-sectional view of the light-emitting layer according to an alternative implementation.

[0112] Reference Figure 5 and Figure 6 The organic layer 152_1 may include a first organic layer 152a_1 disposed in the first sub-pixel PX1, a second organic layer 152b_1 disposed in the second sub-pixel PX2, and a third organic layer 152c_1 disposed in the third sub-pixel PX3.

[0113] The light-emitting layers in the corresponding organic layers 152a_1, 152b_1, and 152c_1 can be physically separated, but the lower and upper layers of the light-emitting layers can be integrally formed across sub-pixels PX1, PX2, and PX3. The light-emitting layers can have different thicknesses; however, embodiments of this disclosure are not limited thereto. For example, the first light-emitting layer in the first sub-pixel can have the largest thickness, followed by the second light-emitting layer in the second sub-pixel, and the third light-emitting layer in the third sub-pixel can have the smallest thickness, but embodiments of this disclosure are not limited thereto. Furthermore, the light-emitting layer in each organic layer 152a_1, 152b_1, and 152c_1 can include two or more layers.

[0114] A hole injection layer HIL can be provided on the anode electrode 151. The hole injection layer HIL can be positioned between the anode electrode 151 and the light-emitting layers EML1a, EML2a, and EML3a. The hole injection layer HIL can be integrally formed across sub-pixels PX1, PX2, and PX3. It can be made of materials selected from the group consisting of: MTDATA, CuPc, TCTA, NPB (NPD), HATCN, TDAPB, PEDOT / PSS, F4TCNQ, N-(biphenyl-4-yl)-9,9-dimethyl-N-(4-(9-phenyl-9H-carbazol-3-yl)phenyl)-9H-fluorene-2-amine, but the embodiments of this disclosure are not limited thereto.

[0115] A first hole transport layer HTL1 can be set on the hole injection layer HIL. The first hole transport layer HTL1 can be positioned between the hole injection layer HIL and the light emission layers EML1a, EML2a, and EML3a. The first hole transport layer HTL1 can be integrally formed across sub-pixels PX1, PX2, and PX3. The first hole transport layer (HTL1) may be made of one or more materials selected from the group consisting of: aromatic amine-based compounds such as NPB (N,N-naphthyl-N,N'-phenylbenzidine), TPD (N,N'-bis-(3-methylphenyl)-N,N'-bis-(phenyl)-benzidine), PPD, TTBND, FFD, p-dmDPS, TAPC, star-shaped aromatic amines such as TCTA, PTDATA, TDAPB, TDBA, 4-a, TCTA, spirocyclic and ladder-type materials such as spiro-TPD, spiro-mTTB, spiro-2, and NPD (N,N-dinaphthyl-N,N'-diphenylbenzidine), s-TAD, and MTDATA (4,4',4”-tris(N-3-methylphenyl-N-phenyl-amino)-triphenylamine), but embodiments of the present disclosure are not limited thereto.

[0116] Emissive layers EML1a, EML2a, and EML3a can be disposed on the first hole transport layer HTL1. The first sub-pixel PX1 can have the first-to-first emissive layer EML1a, the second sub-pixel PX2 can have the second-to-first emissive layer EML2a, and the third sub-pixel PX3 can have the third-to-first emissive layer EML3a. The emissive layers EML1a, EML2a, and EML3a can be combined with… Figure 4 The corresponding light-emitting layers EML1, EML2 and EML3 are basically the same.

[0117] The light-emitting layers EML1a, EML2a, and EML3a may have different thicknesses; however, embodiments of this disclosure are not limited thereto. For example, the first-1 light-emitting layer EML1a may be made of... to The thickness of the second-first luminescent layer EML2a can be formed by... to The thickness is formed, and the third-first luminescent layer EML3a can be formed by... to The thickness is formed, but the implementation of the present disclosure is not limited thereto.

[0118] A hole blocking layer HBL can be set on each of the light-emitting layers EML1a, EML2a, and EML3a. The hole blocking layer HBL can be set uniformly across sub-pixels PX1, PX2, and PX3.

[0119] A second hole transport layer HTL2 can be disposed on the hole blocking layer HBL. The second hole transport layer HTL2 can be positioned between the hole blocking layer HBL and the light-emitting layers EML1b, EML2b, and EML3b. The second hole transport layer HTL2 can be integrally formed across sub-pixels PX1, PX2, and PX3. The material of the second hole transport layer HTL2 can be the same as the material of the first hole transport layer HTL1, but the embodiments of this disclosure are not limited thereto.

[0120] Emissive layers EML1b, EML2b, and EML3b can be disposed on the second hole transport layer HTL2. The first sub-pixel PX1 can have the first-second emissive layer EML1b, the second sub-pixel PX2 can have the second-second emissive layer EML2b, and the third sub-pixel PX3 can have the third-second emissive layer EML3b. Emissive layers EML1b, EML2b, and EML3b can be the same as emissive layers EML1a, EML2a, and EML3a, respectively, but the embodiments described herein are not limited to this.

[0121] The light-emitting layers EML1b, EML2b, and EML3b may have different thicknesses; however, embodiments of this disclosure are not limited thereto. For example, the first and second light-emitting layers EML1b may be made of... to The thickness of the second-second light-emitting layer EML2b can be formed by... to The thickness is formed, and the third-second light-emitting layer EML3b can be formed by... to The thickness is formed, but the implementation of the present disclosure is not limited thereto.

[0122] An electron blocking layer (EBL) can be applied to each of the luminescent layers EML1b, EML2b, and EML3b. The electron blocking layer (EBL) can be applied uniformly across sub-pixels PX1, PX2, and PX3.

[0123] An electron transport layer (ETL) can be set on the electron blocking layer (EBL). The ETL can be integrally set across sub-pixels PX1, PX2, and PX3. The ETL can be made of anthracene derivatives and lithium quinoline (Liq), or... diazole, triazole, phenanthrene, benzo[a] It is made from one or more of azoles, benzothiazoles, or benzimidazoles (e.g., 2-[4-(9,10-di-2-naphthyl-2-anthrayl)phenyl]-1-phenyl-1H-benzimidazole); however, the embodiments of this disclosure are not limited thereto.

[0124] A cathode electrode 153 can be disposed on the electron transport layer (ETL). The cathode electrode 153 can be a transparent electrode that transmits light, but the embodiments of this disclosure are not limited thereto. For example, the cathode electrode 153 may include a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO), or a metal that allows visible light to pass through, but the embodiments of this disclosure are not limited thereto.

[0125] Figure 7 It is along Figure 3 The cross-sectional view taken by line B-B'.

[0126] Reference Figure 3 and Figure 7 The display device 1 may include a display panel 100, a polarizing layer 200, a cover layer 300, a back plate layer 600, a plate layer 800, and bonding layers 710, 720, 730, 740, 750 and 760.

[0127] The curved area BR of the display panel 100 can have a curved shape and can be curved in the thickness direction. The main area MR and the sub-area SR of the display panel 100 can overlap each other.

[0128] A polarization layer 200 can be disposed in the main region MR of the display panel 100. The polarization layer 200 can polarize light emitted from the display panel 100 by a polarization angle. The polarization layer 200 can transmit the polarized light to the outside. The polarization layer 200 may include the function of blocking the reflection of light from the outside other than the polarized light. The polarization layer 200 may include a first phase retardation layer, a second phase retardation layer on the first phase retardation layer, and a polarization layer on the second phase retardation layer. Figure 7 In the diagram, the polarization layer 200 and the display panel 100 are shown as separate, but this configuration is not limited to this, and the polarization layer 200 may be included in the display panel 100.

[0129] The cover layer 300 may be disposed on the polarizing layer 200. The cover layer 300 may be made of a glass material such as glass or quartz, but embodiments of this disclosure are not limited thereto, and may also be made of a plastic material. The cover layer 300 may be disposed on top of the display panel 100 to protect components positioned below the cover layer 300 from external influences. The cover layer 300 may be a chemically reinforced cover layer, but embodiments of this disclosure are not limited thereto. The cover layer 300 may be a cover window, a window cover, or a cover member, but embodiments of this disclosure are not limited thereto.

[0130] To improve the durability of the cover layer 300, the display device 1 may also include at least one additional layer on the cover layer 300. For example, the display device 1 may include a film layer or a coating layer on the cover layer 300, but the embodiments of this disclosure are not limited thereto.

[0131] Compared to the side surface of the display panel 100, the side surface of the cover layer 300 can protrude further outward. For example, compared to the end of the curved region BR of the display panel 100, the side surface of the cover layer 300 can protrude further outward, but the embodiments of the present disclosure are not limited thereto.

[0132] A backplate layer 600 may be disposed below the display panel 100. The backplate layer 600 is disposed below the display panel 100 to support the display panel 100. The backplate layer 600 may include a material capable of supporting the display panel 100. For example, the backplate layer 600 may include polyethylene terephthalate (PET), polyimide (PI), or polycarbonate (PC), but embodiments of this disclosure are not limited thereto. The backplate layer 600 may maintain a constant curvature of the display panel 100 during folding of the display device 1 and suppress wrinkles that may occur on the upper surface of the display panel 100.

[0133] The backplate layer 600 may include a first backplate layer 610 on the main region MR and a second backplate layer 620 on the sub-region SR. The first backplate layer 610 may be disposed between the main region MR of the display panel 100 and the plate layer 800, and the second backplate layer 620 may be disposed between the sub-region SR of the display panel 100 and the plate layer 800. The backplate layer 600 may not be disposed on the curved region BR, but the embodiments of this disclosure are not limited thereto.

[0134] The plate layer 800 may be disposed between the first back plate layer 610 and the second back plate layer 620. The plate layer 800 may include metal. For example, the plate layer 800 may include stainless steel, but embodiments of this disclosure are not limited thereto.

[0135] A bonding layer may also be provided between the aforementioned components 100, 200, 300, 600, and 800. The bonding layer may include a first bonding layer 710, a second bonding layer 720, a third bonding layer 730, a fourth bonding layer 740, a fifth bonding layer 750, and a sixth bonding layer 760.

[0136] The first bonding layer 710 can be disposed between the display panel 100 and the polarization layer 200. The first bonding layer 710 can connect or bond the display panel 100 and the polarization layer 200.

[0137] The second bonding layer 720 may be disposed between the polarizing layer 200 and the capping layer 300. The second bonding layer 720 can connect or bond the polarizing layer 200 and the capping layer 300. When the end of the second bonding layer 720 extends into the curved region BR, the end of the polarizing layer 200 may be aligned with the boundary between the main region MR and the curved region BR; however, embodiments of this disclosure are not limited thereto. Compared to the end of the polarizing layer 200, the end of the second bonding layer 720 may protrude (or protrude further) toward the curved region BR.

[0138] The third bonding layer 730 can be disposed between the first back panel layer 610 and the display panel 100. The third bonding layer 730 can connect or bond the first back panel layer 610 and the display panel 100.

[0139] The fourth bonding layer 740 may be disposed between the second backsheet layer 620 and the board layer 800. The fourth bonding layer 740 can connect or bond the second backsheet layer 620 and the board layer 800.

[0140] The fifth bonding layer 750 may be disposed between the first backsheet layer 610 and the board layer 800. The fifth bonding layer 750 can connect or bond the first backsheet layer 610 and the board layer 800.

[0141] The sixth bonding layer 760 may be disposed between the second back panel layer 620 and the display panel 100. The sixth bonding layer 760 can connect or bond the second back panel layer 620 and the display panel 100.

[0142] The first bonding layer 710 and the second bonding layer 720 may each include a transparent adhesive, but embodiments of the present disclosure are not limited thereto. For example, the transparent adhesive may be a transparent resin (OCR) or an optically clear adhesive (OCA), but embodiments of the present disclosure are not limited thereto. The third bonding layer 730, the fourth bonding layer 740, the fifth bonding layer 750 and the sixth bonding layer 760 may each include a pressure-sensitive adhesive (PSA), but embodiments of the present disclosure are not limited thereto.

[0143] A cover layer MCL can be disposed on one surface of the curved region BR of the display panel 100. The cover layer MCL may include a plastic material. The cover layer MCL can be formed or coated on one surface of the curved region BR of the display panel 100 to cover the curved region BR of the display panel 100. Connecting lines (e.g., ...) can be disposed in the curved region BR. Figure 8The cover layer MCL protects the connecting wires LL from external impacts and prevents moisture from penetrating into them. Furthermore, when the bending region BR of the display panel 100 is bent into a curved shape with a constant radius of curvature, the cover layer MCL positions the connecting wires LL in a neutral plane. Within the bending region BR, a neutral plane with zero tensile and compressive forces is formed. Because the connecting wires LL are positioned on this neutral plane, they experience zero bending stress when the display panel 100 bends, thus allowing the display panel 100 to bend without being damaged by bending stress.

[0144] The capping layer MCL may contact the sides of the polarizing layer 200 and the first bonding layer 710. The capping layer MCL may extend partially into the sub-region SR. The capping layer MCL may contact the bottom surface of the second bonding layer 720. The capping layer MCL may overlap with the second bonding layer 720.

[0145] A data driver unit (DIC) can be disposed in the first pad area PA1 of the sub-region SR, and a flexible printed circuit board (FPCB) can be disposed in the second pad area PA2. The flexible printed circuit board FPCB can be electrically connected to the pads on the display panel 100 through an anisotropic conductive film (ACF). The cover layer MCL may not overlap with the data driver unit (DIC), but the embodiments of this disclosure are not limited thereto.

[0146] Figure 8 yes Figure 7 Enlarged cross-sectional view of region Q1. Figure 8 The main area MR and the curved area BR of the display device 1 are shown. Figure 7 The curved region BR in the diagram has a curved shape, but for ease of explanation, the curved region BR is... Figure 8 It is shown as a plane.

[0147] Reference Figure 4 , Figure 7 and Figure 8 Inorganic layers 102, 103, 104, 105, 106, 108, and 109 may not be provided in the bending region BR. Therefore, in the bending region BR, the first protective layer 111 can be in direct contact with the substrate 101.

[0148] A connecting line LL can be provided on the first protective layer 111. The connecting line LL can be used to connect to... Figure 7 The pads (or data pads) of the data drive unit (DIC) are connected to the data lines in the display area (DA). The connecting line LL can be positioned at... Figure 4The connecting line LL is located on the same layer as the first source electrode 145, but embodiments of this disclosure are not limited thereto, and the connecting line LL may also be positioned on the same layer as the first source electrode 121. In the main region MR, the connecting line LL may contact the side of the first protective layer 111 and a portion of the upper surface of the first protective layer 111, but embodiments of this disclosure are not limited thereto. In this disclosure, the same layer may also include the concept of containing the same material.

[0149] A second protective layer 112 can be provided on the connecting line LL. The second protective layer 112 can be provided in both the main region MR and the bending region BR. In the main region MR, the second protective layer 112 can be in direct contact with the end of the connecting line LL.

[0150] Two dams, D1 and D2, can be set in the main region MR adjacent to the curved region BR. The first dam, D1, can be set in the display region DA (see [link to relevant documentation]). Figure 3 The first dam D1 is located between the first dam D1 and the curved area BR, and the second dam D2 can be located between the first dam D1 and the curved area BR. Figure 8 Two dams, D1 and D2, are shown, but the implementation of this disclosure is not limited to this, and one, three or more dams may be set.

[0151] The second protective layer 112 can form the first layer of the second dam D2. The second protective layer 112 can be set across the main region MR and the tortuous region BR.

[0152] A dam 154 can be provided on the second protective layer 112. The dam 154 can be provided on both the main region MR and the curved region BR. In the main region MR, the dam 154 can form a first layer of the first dam D1 and a second layer of the second dam D2. In the second dam D2, the second layer (i.e., the dam 154) can be provided to cover the first layer (i.e., the second protective layer 112), but embodiments of this disclosure are not limited thereto. For example, the second layer (i.e., the dam 154) can cover the upper surface of the first layer (i.e., the second protective layer 112), cover or completely cover one side of the second direction DR2, and partially cover the opposite side of the second direction DR2, but embodiments of this disclosure are not limited thereto. In this disclosure, spacers 155 are shown as constituting dams D1 and D2, but embodiments of this disclosure are not limited thereto. Spacers 155 can be provided on the dam 154. Spacers 155 can be provided in both the main region MR and the curved region BR. Spacer 155 can form a second layer of the first dam D1 and a third layer of the second dam D2, but the embodiments of the present disclosure are not limited thereto.

[0153] An encapsulation layer 170 can be provided on the spacer 155. A first encapsulation layer 171 is provided in the main region MR, but may not be provided in the bending region BR. The first encapsulation layer 171 may be in direct contact with the first dam D1 and the second dam D2. A second encapsulation layer 172 may be provided to reach a portion of the first dam D1, or may overlap with a portion of the first dam D1. A third encapsulation layer 173 is provided in the main region MR, but may not be provided in the bending region BR. The third encapsulation layer 173 may contact or directly contact the first encapsulation layer 171 on the first dam D1 and the second dam D2.

[0154] An inorganic layer may be disposed on the encapsulation layer 170. The inorganic layer is disposed in the main region MR, but may not be disposed in the bending region BR. The inorganic layer may include a buffer layer 181 and an insulating layer 184.

[0155] A first organic layer 190 may be disposed on the insulating layer 184. The first organic layer 190 may be made of a material comprising acrylic resin, epoxy resin, phenolic resin, polyamide resin or polyimide resin, but embodiments of the present disclosure are not limited thereto.

[0156] A first organic layer 190 is disposed in the main region MR and may form a third dam D3 in the curved region BR. The third dam D3 is disposed on the spacer 155 and may be spaced at a predetermined distance from the boundary between the curved region BR and the main region MR, but embodiments of the present disclosure are not limited thereto. The third dam D3 may be an organic layer dam or a touch organic layer dam. In the third dam D3, the second organic layer 195 may extend to the third dam D3.

[0157] A second organic layer 195 may be disposed on the first organic layer 190. The second organic layer 195 may be made of a material comprising acrylic resin, epoxy resin, phenolic resin, polyamide resin or polyimide resin, but the embodiments of the present disclosure are not limited thereto.

[0158] The second organic layer 195 may contact or directly contact the side of the third dam D3. In the curved region BR, the second organic layer 195 may contact or directly contact the side of the third dam D3, the upper surface of the spacer 155, and the side of the first organic layer 190.

[0159] A cover layer MCL can be provided on the second organic layer 195. The cover layer MCL is provided in the bending region BR, and may not be provided in the main region MR. The cover layer MCL may be in contact or in direct contact with the upper and side surfaces of the third dam D3, the upper surface of the second organic layer 195, and the upper surface of the spacer 155.

[0160] Figure 9 It is along Figure 3 A cross-sectional view taken from line C-C'. Figure 9 The main region MR is shown, which includes the display area DA and the non-display area NDA. Figure 9 This is a cross-sectional view of the right region of the display device 1. The cross-sectional view of the right region of the display device 1 may be substantially the same as the cross-sectional views of the left and upper regions of the display device 1, but the embodiments of this disclosure are not limited thereto.

[0161] Reference Figure 9 Compared to the end of the polarization layer 200 (or compared to the end of the polarization layer 200), the end of the display panel 100 may protrude outward (or extend beyond the end of the polarization layer 200). Figure 9 In the illustration, the end of the second bonding layer 720 is shown aligned with the end of the polarization layer 200. However, the embodiments of this disclosure are not limited to this, and the end of the second bonding layer 720 may protrude outward (or extend beyond the end of the polarization layer 200) compared to the end of the polarization layer 200.

[0162] Figure 10 yes Figure 9 Enlarged cross-sectional view of region Q2.

[0163] Reference Figure 9 and Figure 10 The display panel 100 according to the embodiment (see Figure 9 It may also include a covering portion CLP. The covering portion CLP may consist of a first layer (second protective layer 112) and a second layer (embankment 154). However, embodiments of the present disclosure are not limited thereto, and the first protective layer 111 or the spacer 155 may further form the covering portion CLP.

[0164] At least one of the inorganic layers 102, 103, 104, 105, 106, 108, and 109 may not extend to the end of the substrate 101. The second protective layer 112 of the covering portion CLP may contact or directly contact the side surfaces of at least one of the inorganic layers 102, 103, 104, 105, 106, 108, and 109, and may also contact or directly contact the upper surface of the substrate 101. The second substrate portion 101b of the substrate 101 comprises an organic material, and since the covering portion CLP also comprises an organic material, the contact or direct contact between the second protective layer 112 of the covering portion CLP and the second substrate portion 101b can improve the delamination between at least one of the inorganic layers 102, 103, 104, 105, 106, 108, and 109.

[0165] The first encapsulation layer 171 and the third encapsulation layer 173 may extend beyond the covered portion CLP, but may not extend to the end of the substrate 101; however, embodiments of this disclosure are not limited thereto. The first encapsulation layer 171 and the third encapsulation layer 173 may each contact the substrate 101; however, embodiments of this disclosure are not limited thereto. The buffer layer 181 and the insulating layer 184 may extend beyond the covered portion CLP, but may not extend to the end of the substrate 101; however, embodiments of this disclosure are not limited thereto. The buffer layer 181 and the insulating layer 184 may each contact the substrate 101; however, embodiments of this disclosure are not limited thereto.

[0166] Crack-resistant patterns GCP1 and GCP2 can also be provided between the covered portion CLP and the second dam D2. Other crack-resistant patterns GCP1 and GCP2 may include: a first crack-resistant pattern GCP1, which is located at the junction with the first gate electrode 122 (see...). Figure 4 In the same layer as the second anti-crack pattern GCP2, which is located in the same layer as the second barrier layer 136 (see...). Figure 4 In the same layer. Additionally, crack-resistant patterns CRP can be applied to other crack-resistant patterns GCP1 and GCP2. The crack-resistant pattern CRP can be located in the same layer as the second touch electrode 182 (see...). Figure 4 On the same layer, but embodiments of this disclosure are not limited thereto. In some embodiments, other anti-crack patterns GCP1 and GCP2 may be omitted. In this case, the covering portion CLP may extend further toward the second dam D2, which provides an advantage. Other anti-crack patterns GCP1 and GCP2 may be gate anti-crack patterns, but embodiments of this disclosure are not limited thereto.

[0167] Figure 11 This is a cross-sectional view of the display device according to the embodiment; Figure 11 It shows that according to Figure 7 The cross-section of the display device 1 in its unbent state.

[0168] Reference Figure 11 The cover layer MCL of the display device 1 according to the embodiment may include a first cover layer MCL1 and a second cover layer MCL2.

[0169] The first capping layer MCL1 may contact or directly contact the side of the polarizing layer 200 and the first bonding layer 710. The end of the second bonding layer 720 may protrude (or further protrude) toward the bending region BR compared to the end of the polarizing layer 200. In the bending region BR, the first capping layer MCL1 may contact or directly contact the second bonding layer 720. The surface height of the first capping layer MCL1 may be aligned with the surface height of the polarizing layer 200. The surface height of the second capping layer MCL2 may be higher than the surface height of the first capping layer MCL1, but embodiments of this disclosure are not limited thereto.

[0170] The second cover layer MCL2 can contact the first cover layer MCL1.

[0171] The first cover layer MCL1 and the second cover layer MCL2 may comprise different materials. For example, the first cover layer MCL1 and the second cover layer MCL2 may be formed in different processes, but the embodiments of this disclosure are not limited thereto.

[0172] The first capping layer MCL1 and the second capping layer MCL2 are formed in different processes, wherein the first capping layer MCL1 is formed first and then the second capping layer MCL2 is formed, therefore, as Figure 11 As shown, a boundary BL may exist between the first cover layer and the second cover layer. Furthermore, the first cover layer MCL1 and the second cover layer MCL2 may each have a reduced thickness at their boundary BL compared to the central portion of each cover layer (MCL1, MCL2). For example, the first cover layer MCL1 and the second cover layer MCL2 may have a downwardly recessed or concave shape at their boundary.

[0173] The manufacturing process of the first cover layer MCL1 and the second cover layer MCL2 is described below.

[0174] Figures 12 to 15 It is used for explanation Figure 11 A cross-sectional view of the manufacturing method of the display device.

[0175] Reference Figure 11 and Figure 12 A protective film PF can be provided on the polarization layer 200. During the formation... Figure 13 Before the first capping layer MCL1 shown, plasma treatment can be applied to the side surface of the polarization layer 200 to ensure good contact between the first capping layer MCL1 and the polarization layer 200, but the embodiments of this disclosure are not limited thereto.

[0176] Next, as Figure 11 and Figure 13As shown, the first capping layer MCL1 can be formed on the side surfaces of the polarizing layer 200 and the first bonding layer 710 (indicated by the arrow). The first capping layer MCL1 can be formed on the curved region BR to contact the side surfaces of the polarizing layer 200 and the first bonding layer 710.

[0177] like Figure 13 As shown, the surface height H1 of the first cover layer MCL1 can be configured to be the same as the surface height H200 of the polarizing layer 200, but embodiments of this disclosure are not limited thereto. Once the first cover layer MCL1 is formed or applied, it can be cured by thermosetting or UV curing, but embodiments of this disclosure are not limited thereto. In some embodiments, the first cover layer MCL1 can be applied and cured simultaneously, but embodiments of this disclosure are not limited thereto. For example, the first cover layer MCL1 may include components having a surface height H1 of the polarizing layer 200 and a surface height H200 of the polarizing layer 200. Figure 14 The second capping layer MCL2 shown is compared to a material with a higher viscosity of approximately 700 cps to 900 cps, but the embodiments of this disclosure are not limited thereto.

[0178] Next, as Figure 11 and Figure 14 As shown, a second cover layer MCL2 (indicated by the arrow) can be formed. The width W2 of the second cover layer MCL2 can be greater than the width W1 of the first cover layer MCL1, but embodiments of this disclosure are not limited thereto. After curing, the modulus of the second cover layer MCL2 can be less than the modulus of the first cover layer MCL1. For example, the modulus can be Young's modulus. For example, the modulus of the second cover layer MCL2 can be in the range of about 100 MPa to about 250 MPa, and the modulus of the first cover layer MCL1 can be less than about 100 MPa, but embodiments of this disclosure are not limited thereto. The first cover layer MCL1 can prevent the second cover layer MCL2 from overflowing into the display area DA, for example, acting as a dam, and the second cover layer MCL2 can alleviate the bending stress of the display panel 100 at the bending area BR, and therefore, the second cover layer MCL2 can be made of a material that is more flexible than the first cover layer MCL1, but embodiments of this disclosure are not limited thereto.

[0179] In addition, such as Figure 11 and Figure 15 As shown, the protective film PF can be removed, and the capping layer 300 can be placed on the polarizing layer 200 (as indicated by the arrow). A second bonding layer 720 is attached to the bottom surface of the capping layer 300, but embodiments of this disclosure are not limited thereto.

[0180] In the display device 1 according to an embodiment, by configuring the surface height H1 of the first cover layer MCL1 to be the same as the surface height H200 of the polarizing layer 200, forming the first cover layer MCL1 as a dam, and forming the second cover layer MCL2, interference between the second bonding layer 720 and the cover layers MCL1 and MCL2 during the bonding process of the cover layer 300 and the polarizing layer 200 can be minimized. This helps to prevent external visibility problems caused by the second bonding layer 720 in advance. For example, when there is interference between the second bonding layer 720 and the cover layers MCL1 and MCL2 during the bonding process of the cover layer 300 and the polarizing layer 200, an undesirable air gap that may be visible from the outside may be formed between the second bonding layer 720 and the first cover layer MCL1 or between the second bonding layer 720 and the second cover layer MCL2. According to the embodiment, since interference between the second bonding layer 720 and the cover layers MCL1 and MCL2 is prevented, external visibility problems can be improved. In addition, since interference between the second bonding layer 720 and the cover layers MCL1 and MCL2 is prevented, the occurrence of ripples in the second bonding layer 720 during the bending process of the display panel 100 can be reduced or improved.

[0181] In the following description, a display device according to other embodiments is provided. In the following embodiments, references to other embodiments will be omitted. Figures 1 to 15 The accompanying figures or detailed descriptions of the configurations are provided to avoid redundancy.

[0182] Figure 16 This is a cross-sectional view of a display device according to another embodiment.

[0183] Reference Figure 16 According to this embodiment, the display device 2 does not include a first pad area PA1, a second pad area PA2 is attached with a printed circuit film COF, and a printed circuit board PCB can be attached to the end of the printed circuit film COF.

[0184] For example, the data drive unit (DIC) can be placed on the printed circuit board (COF).

[0185] Due to other details and references Figures 11 to 15 The descriptions are the same, so their detailed descriptions will be omitted.

[0186] Figure 17 This is a cross-sectional view of a display device according to another embodiment. Figure 18 This is a cross-sectional view of a display device according to another embodiment. Figures 19 to 20 It is used for explanation Figure 18 A cross-sectional view of the manufacturing method of the display device.

[0187] Reference Figures 17 to 20 According to this embodiment, the display device 3 is relative to Figure 7 The plate layer 800 is omitted, and a seventh bonding layer 770 (or a bent bonding layer) may be placed between the first backing layer 610 and the second backing layer 620. The first backing layer 610 and the second backing layer 620 may be bonded by the seventh bonding layer 770. The seventh bonding layer 770 may include at least one or more of the same materials as the third bonding layer 730, the fourth bonding layer 740, the fifth bonding layer 750, and the sixth bonding layer 760, but embodiments of this disclosure are not limited thereto.

[0188] In this embodiment, the end of the second bonding layer 720_1 can be positioned further from the bending region BR than the end of the polarization layer 200 (or it can be further than the end of the polarization layer 200). For example, the end of the polarization layer 200 can be positioned closer to the bending region BR than the end of the second bonding layer 720_1 (or closer than the end of the polarization layer 200). The end of the second bonding layer 720_1 can be recessed into the main region MR compared to the end of the polarization layer 200 (or further than the end of the polarization layer 200).

[0189] Reference Figure 18 According to this embodiment, the cover layer MCL of the display device 3 may include a first cover layer MCL1 and a second cover layer MCL2. The second cover layer MCL2 may be in contact with the first cover layer MCL1. The first cover layer MCL1 may be in contact with the side surface of the polarization layer 200 and the first bonding layer 710 or in direct contact. The first cover layer MCL1 may be spaced apart from the second bonding layer 720_1. The end of the second bonding layer 720_1 may be recessed into the main region MR compared to the end of the polarization layer 200 (or further away than the end of the polarization layer 200). The surface height H1 of the first cover layer MCL1 may be lower than the surface height H720 of the second bonding layer 720_1 and higher than the surface height H200 of the polarization layer 200, but the embodiments of this disclosure are not limited thereto.

[0190] The first cover layer MCL1 and the second cover layer MCL2 may comprise different materials. For example, the first cover layer MCL1 and the second cover layer MCL2 may be formed in different processes, but the embodiments of this disclosure are not limited thereto.

[0191] The first capping layer MCL1 and the second capping layer MCL2 are formed in different processes, wherein the first capping layer MCL1 is formed first and then the second capping layer MCL2 is formed, therefore, as Figure 18As shown, a boundary BL may exist between the first cover layer and the second cover layer. Furthermore, the first cover layer MCL1 and the second cover layer MCL2 may each have a reduced thickness at their boundary BL compared to the central portions CL1 and CL2 of the cover layers MCL1 and MCL2. For example, the first cover layer MCL1 and the second cover layer MCL2 may each have a downwardly recessed shape (or concave shape) at their boundary.

[0192] The manufacturing process of the first cover layer MCL1 and the second cover layer MCL2 is described below.

[0193] like Figure 18 and Figure 19 As shown, a protective film PF_1 can be provided on the second bonding layer 720_1. This is done during the formation or application of... Figure 13 Before the first capping layer MCL1 is shown, plasma treatment may be applied to the side surface of the polarizing layer 200 to ensure good contact between the first capping layer MCL1 and the polarizing layer 200, but embodiments of this disclosure are not limited thereto. Subsequently, the first capping layer MCL1 may be formed on the side surface of the polarizing layer 200 and the side surface of the first bonding layer 710. The first capping layer MCL1 may be formed in the bending region BR and applied or formed to contact the side surface of the polarizing layer 200 and the side surface of the first bonding layer 710, and the formed or applied first capping layer MCL1 may be cured by thermosetting or UV curing, but embodiments of this disclosure are not limited thereto. In some embodiments, the first capping layer MCL1 may be applied and cured simultaneously, but embodiments of this disclosure are not limited thereto. For example, the first capping layer MCL1 may include a material having a viscosity of approximately 700 cps to 900 cps higher than that of the second capping layer MCL2, but embodiments of this disclosure are not limited thereto. Subsequently, the second capping layer MCL2 is formed. The width of the second cover layer MCL2 can be greater than the width of the first cover layer MCL1, but embodiments of this disclosure are not limited thereto. After curing, the modulus of the second cover layer MCL2 can be less than the modulus of the first cover layer MCL1. For example, the modulus can be Young's modulus. For example, the modulus of the second cover layer MCL2 can be in the range of about 100 MPa to about 250 MPa, and the modulus of the first cover layer MCL1 can be less than about 100 MPa, but embodiments of this disclosure are not limited thereto. The first cover layer MCL1 can prevent the second cover layer MCL2 from overflowing into the display area DA, for example, acting as a dam, and the second cover layer MCL2 can alleviate the bending stress of the display panel 100 at the bending area BR. Therefore, the second cover layer MCL2 can be made of a material that is more flexible than the first cover layer MCL1, but embodiments of this disclosure are not limited thereto.

[0194] Next, as Figure 18 and Figure 20 As shown, the protective film PF_1 can be removed (see...) Figure 19 ), and the cover layer 300 may be disposed on the second bonding layer 720_1 (as indicated by the arrow).

[0195] In the display device 3 according to the embodiment, the end of the second bonding layer 720_1 is recessed inward (or away from the end of the polarization layer 200) compared to the end of the polarization layer 200, and the second cover layer MCL2 is formed after the first cover layer MCL1 is formed, such that the second bonding layer 720_1 and the first cover layer MCL1 are spaced apart, thereby minimizing physical interference. This can improve the attachment defects between the cover layer 300 and the second bonding layer 720_1 during the attachment process of the cover layer 300. For example, when the second cover layer MCL2 overflows onto the upper surface of the protective film PF_1, and the protective film PF_1 is peeled off and the cover layer 300 is attached to the second bonding layer 720_1, the second cover layer MCL2 and the cover layer 300 may interfere with each other. By improving the adhesion defects between the capping layer 300 and the second bonding layer 720_1, the formation of bubbles between the capping layer 300 and the polarizing layer 200 and / or between the capping layer 300 and the second bonding layer 720_1 can be prevented, thereby improving external visibility defects. Furthermore, since the formation of bubbles between the capping layer 300 and the polarizing layer 200 and / or between the capping layer 300 and the second bonding layer 720_1 can be prevented, defects in the display device caused by bubbles can be reduced, and the lifespan of the display device can be increased.

[0196] Due to other details and references Figures 1 to 11 The descriptions are the same, so their detailed descriptions will be omitted.

[0197] Figure 21 This is a cross-sectional view of a display device according to another embodiment.

[0198] Reference Figure 21 According to this embodiment, the display device 4 does not include a first pad area PA1, a second pad area PA2 is attached to a printed circuit film COF, and a printed circuit board PCB can be attached to the end of the printed circuit film COF. Other details are similar to those in the references. Figure 18 The descriptions of display devices 3 are the same as those described, so their detailed descriptions will be omitted.

[0199] The display device according to various embodiments of the present disclosure can be described as follows.

[0200] A display device according to various embodiments of the present disclosure may include: a display panel including a main region, a sub-region, and a curved region between the main region and the sub-region; a polarizing layer disposed in the main region; a capping layer on the polarizing layer; a bonding layer between the polarizing layer and the capping layer; and a cover layer disposed on the curved region of the display panel. The bonding layer may have an end farther from the curved region than the end of the polarizing layer, and the cover layer may be spaced apart from the bonding layer.

[0201] According to various embodiments of this disclosure, the capping layer can be in direct contact with the side surface of the polarizing layer.

[0202] According to various embodiments of this disclosure, the cover layer may include: a first cover layer in contact with the side surface of the polarization layer; and a second cover layer in contact with the first cover layer.

[0203] According to various embodiments of this disclosure, the surface height of the second cover layer may be higher than the surface height of the first cover layer.

[0204] The display device according to various embodiments of the present disclosure may further include: a first backplate layer below the main area of ​​the display panel; and a second backplate layer below a sub-area of ​​the display panel.

[0205] The display device according to various embodiments of the present disclosure may further include another bonding layer between the first back panel layer and the second back panel layer.

[0206] According to various embodiments of this disclosure, the first cover layer and the second cover layer may comprise different materials. According to various embodiments of this disclosure, the modulus of the first cover layer may be greater than the modulus of the second cover layer.

[0207] According to various embodiments of this disclosure, the first cover layer and the second cover layer may each have a thinner thickness at their boundary than at their respective center portions.

[0208] The display device according to various embodiments of the present disclosure may further include: a first transistor on a substrate in the main region and a second transistor spaced apart from the first transistor. According to various embodiments of the present disclosure, the source electrode of the first transistor and the source electrode of the second transistor may be in the same layer.

[0209] The display device according to various embodiments of the present disclosure may further include: a light-emitting layer on a second transistor; a first protective layer between the second transistor and the light-emitting layer; a connection electrode on the first protective layer; and a second protective layer on the connection electrode. According to various embodiments of the present disclosure, the connection electrode can electrically connect the anode electrode of the light-emitting layer and the source electrode or drain electrode of the second transistor.

[0210] According to various embodiments of this disclosure, the first covering layer includes a material having a higher viscosity compared to the second covering layer.

[0211] According to various embodiments of this disclosure, the width of the second overlay layer is greater than the width of the first overlay layer.

[0212] A display device according to various embodiments of the present disclosure may include: a display panel including a main region, a sub-region, and a curved region between the main region and the sub-region; a polarizing layer disposed in the main region; a capping layer on the polarizing layer; a bonding layer between the polarizing layer and the capping layer; and a cover layer disposed on the curved region of the display panel. According to various embodiments of the present disclosure, the bonding layer may have an end that protrudes further toward the curved region than the end of the polarizing layer. According to various embodiments of the present disclosure, the cover layer may include: a first cover layer in contact with a side surface of the polarizing layer; and a second cover layer located outside the first cover layer and in contact with the first cover layer. According to various embodiments of the present disclosure, the surface height of the first cover layer may be equal to the surface height of the polarizing layer.

[0213] According to various embodiments of this disclosure, the surface height of the second cover layer may be higher than the surface height of the first cover layer.

[0214] The display device according to various embodiments of the present disclosure may further include: a first back panel layer below the main area of ​​the display panel; and a second back panel layer below a sub-area of ​​the display panel.

[0215] The display device according to various embodiments of the present disclosure may further include: a plate layer between the first back plate layer and the second back plate layer.

[0216] According to various embodiments of this disclosure, the first cover layer and the second cover layer may include different materials.

[0217] According to various embodiments of this disclosure, the first cover layer and the second cover layer may each have a thinner thickness at their boundary than at their respective center portions.

[0218] According to various embodiments of this disclosure, the second covering layer is made of a material that is more flexible than the first covering layer.

[0219] The display device according to the embodiment incorporates the first and second cover layers into an overall cover structure, thereby preventing the cover layers from encroaching on the display area. This prevention facilitates the expansion of the display area and allows for a reduction in the bezel area (or non-display area). Therefore, a display device with a narrow bezel can be realized.

[0220] The display device according to the embodiment minimizes interference between the bonding layer and the cover layer by making the surface heights of the first cover layer and the polarizing layer equal, thereby helping to prevent external visibility defects caused by the bonding layer. This minimization of interference between the bonding layer and the cover layer can help reduce the occurrence of bending (ripples) in the bonding layer during the bonding process of the display panel.

[0221] The display device according to the embodiment facilitates minimizing physical interference between the bonding layer and the first cover layer by configuring the bonding layer and the first cover layer to be spaced apart. This minimization of physical interference between the bonding layer and the first cover layer helps reduce attachment defects during the process of attaching the cover layer to the bonding layer. The reduction of attachment defects in the cover layer helps prevent bubble formation between the cover layer and the polarizing layer and / or between the cover layer and the bonding layer, thereby improving visibility defects in the display device.

[0222] The display device according to the embodiment improves the lifespan of the display device by configuring a first cover layer and a second cover layer to reduce defects caused by bubbles formed between the bonding layer and the cover layer and / or between the cover layer and the polarizing layer.

[0223] The advantages of this disclosure are not limited to those described above, and those skilled in the art will clearly understand other advantages not described herein based on this disclosure.

[0224] Although embodiments of the present invention have been described above with reference to the accompanying drawings, it should be understood that those skilled in the art can implement the technical configurations of the present invention in other specific forms without altering the technical concept or essential characteristics of the invention. Therefore, it should be understood that the above embodiments are exemplary and not restrictive in all respects. Furthermore, the scope of the present invention is defined by the following description, rather than by the detailed description above. Additionally, it should be understood that all modifications or variations derived from the meaning and scope of the claims and their equivalents are included within the scope of the present invention.

[0225] Description of reference numerals in the attached figures

[0226] 1, 2, 3, 4: Display devices

[0227] 100: Display panel; MCL1: First overlay layer

[0228] MCL2: Second Covering Layer

[0229] CLP: Encapsulated portion

[0230] D1, D1, D2: Dam

Claims

1. A display device, comprising: a display panel including a main area, a sub area, and a curved area between the main area and the sub area; a polarization layer disposed in the main area; a cover layer on the polarization layer; a bonding layer between the polarization layer and the cover layer; and a cover layer disposed on the curved area of the display panel, wherein the bonding layer has an end portion further from the curved area than an end portion of the polarization layer, and the cover layer is spaced apart from the bonding layer. the cover layer is in direct contact with a side surface of the polarization layer.

2. The display device according to claim 1, wherein the cover layer includes:

3. The display device according to claim 2, wherein a first cover layer in contact with a side surface of the polarization layer; and a second cover layer in contact with the first cover layer. a surface height of the second cover layer is higher than a surface height of the first cover layer.

4. The display device according to claim 3, wherein 5.The display device of claim 1, further comprising: a first backplane layer under the main area of the display panel; and a second backplane layer under the sub area of the display panel. another bonding layer between the first backplane layer and the second backplane layer. the first cover layer and the second cover layer include different materials, and a modulus of the first cover layer is greater than a modulus of the second cover layer.

6. The display device of claim 5, further comprising: the first cover layer and the second cover layer each have a thickness that is thinner at a boundary between them than at a respective center portion of them.

7. The display device according to claim 3, wherein 9.The display device of claim 1, further comprising:

8. The display device according to claim 3, wherein a first transistor and a second transistor spaced apart from the first transistor, the first and second transistors disposed in the main area, wherein a source electrode of the first transistor and a source electrode of the second transistor are in a same layer. 10.The display device of claim 9, further comprising: an emission layer on the second transistor; a first protective layer between the second transistor and the emission layer; a connection electrode on the first protective layer; and a second protective layer on the connection electrode, wherein the connection electrode electrically connects an anode electrode of the emission layer and a source electrode or a drain electrode of the second transistor. the first cover layer includes a material having a higher viscosity than the second cover layer. a width of the second cover layer is greater than a width of the first cover layer. 13.A display device, comprising:

11. The display device according to any one of claims 3, 4, 7, and 8, wherein, a display panel including a main area, a sub area, and a curved area between the main area and the sub area; 12. The display device according to any one of claims 3, 4, 7, and 8, wherein, a polarization layer disposed in the main area; a cover layer on the polarization layer; a bonding layer between the polarization layer and the cover layer; and a cover layer disposed on the curved area of the display panel, wherein the bonding layer has an end portion that protrudes further toward the curved area than an end portion of the polarization layer, and the cover layer includes a first cover layer in contact with a side surface of the polarization layer, and a second cover layer outside the first cover layer and in contact with the first cover layer, a surface height of the first cover layer being equal to a surface height of the polarization layer. a surface height of the second cover layer is higher than a surface height of the first cover layer. ​ ​ ​ 14. The display device of claim 13, wherein, ​ 15. The display device of claim 13, further comprising: a first backplane layer under a main area of the display panel; and a second backplane layer under a sub-area of the display panel.

16. The display device of claim 15, further comprising: a plate layer between the first backplane layer and the second backplane layer.

17. The display device of claim 13, wherein, The first and second cover layers comprise different materials.

18. The display device of claim 13, wherein, The first and second cover layers have a thickness at their border between them that is thinner than at their respective central portions.

19. The display device of claim 13, wherein, The second cover layer is made of a material that is more flexible than the first cover layer.

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