Electronic cigarette atomization mesh and preparation method thereof

Abstract

According to the electronic cigarette atomization mesh and the preparation method thereof, material combination is optimized, a nickel plating layer and a gold plating layer are sequentially brushed on the surface layer of a base body layer through an electroplating technology and a local brushing plating technology, or a copper plating layer, the nickel plating layer and the gold plating layer are sequentially brushed on the surface layer of the base body layer, and the bonding force of the base body layer and the electroplating layer is improved; the corrosion resistance and the mechanical strength are enhanced, the adhesive force of the gold-plated layer is remarkably improved, and the gold-plated layer is prevented from being stripped or corroded and damaged in the using process; the resistance stability of the mesh plated with the gold layer is remarkably improved, the precision of temperature control precision can be ensured, the explosion performance of temperature control is optimized, the response speed of the mesh can be shortened, the aroma release reduction degree of tobacco tar is improved, and the problem of taste attenuation caused by corrosion of high-aroma tobacco tar is solved.

Description

Technical Field

[0001] This invention relates to the field of cigarette alternative technology, and in particular to an electronic cigarette atomizing mesh and its preparation method. Background Technology

[0002] Electronic atomizing devices are electronic products that mimic cigarettes, atomizing e-liquid into vapor for users to inhale. Due to their similar taste and ease of use to cigarettes, electronic atomizing devices have been rapidly promoted and used.

[0003] Existing electronic atomizing devices generally include a battery main unit and an atomizer. The atomizer is the vapor-generating part of the electronic atomizing device. It contains an atomizing mesh that generates high temperatures when powered on, causing the e-liquid inside the atomizer to form vapor. The battery main unit is the control center and power supply unit of the electronic atomizing device.

[0004] Typically, electronic cigarette smoke atomizing meshes are made of a single material (such as stainless steel, nickel alloy, etc.) and have their surface plated with gold to improve conductivity and corrosion resistance.

[0005] However, existing technologies have the following shortcomings: 1. Insufficient gold layer adhesion: Traditional gold plating processes are prone to causing the gold layer to peel off under prolonged high-temperature operation or e-liquid corrosion, affecting its service life; 2. Limited corrosion resistance: Ordinary gold plating is easily corroded by acidic components (such as nicotine salts and flavorings) in e-liquids with high aroma and sweetness, leading to a decline in mesh performance and even the production of metallic off-flavors; 3. Poor resistance stability: The resistance changes greatly after gold plating, affecting the accuracy of temperature control, causing fluctuations in atomization temperature, and affecting the consistency of flavor; 4. Too fast temperature control response: The temperature coefficient of some materials (such as iron-chromium-aluminum) is low, making it difficult to meet the market's demand for temperature control and consistent aroma release. Summary of the Invention

[0006] Therefore, it is necessary to provide an electronic cigarette atomizing mesh and its preparation method that can improve the performance of the gold plating layer, adapt to the characteristics of different materials, and solve the performance degradation caused by the high corrosiveness of e-liquid.

[0007] An electronic cigarette atomizing mesh includes a heating element and an electrode lead element connected to the heating element. The heating element includes a substrate layer, a nickel plating layer, and a gold plating layer. The nickel plating layer is attached to the surface of the substrate layer, and the gold plating layer is attached to the surface of the nickel plating layer.

[0008] In one embodiment, a copper plating layer is further included, the copper plating layer being attached to the surface of the substrate layer, and the nickel plating layer being attached to the surface of the copper plating layer.

[0009] In one embodiment, the resistance of the substrate layer is 0.2Ω to 2.0Ω, the thickness of the nickel plating layer is 1 mil to 50 mil, and the thickness of the gold plating layer is 1 mil to 3 mil.

[0010] In one embodiment, the thickness of the copper plating layer is 1 to 30 mils.

[0011] A method for preparing an electronic cigarette atomizing mesh, comprising the following steps:

[0012] Step S10: Clean the substrate layer to remove oil and dirt from the surface of the substrate layer;

[0013] Step S20: Nickel plating layer, using a brush plating head to dip into the nickel plating solution and uniformly brush plating on the surface of the substrate layer;

[0014] Step S30: Gold plating layer. Use a brush plating head to dip into the gold plating solution and evenly brush plating it onto the surface of the nickel plating layer of the heating part.

[0015] Step S40: Cleaning and drying. Rinse the heating element with deionized water after the coating is completed, and then dry it.

[0016] In one embodiment, the step between step S10 and step S20 further includes:

[0017] Step S12: Copper plating layer, using a brush plating head to dip into the copper plating solution and uniformly brush plating on the surface of the substrate layer;

[0018] The nickel plating layer is uniformly brush-plated onto the surface of the copper plating layer in the heating element.

[0019] In one embodiment, the following steps are included between S10 and S12, between S12 and S20, and between S20 and S30:

[0020] Step S50: Activation cleaning. First, rinse the heating element with deionized water, then use acid solution to activate the surface of the heating element, and then rinse with deionized water.

[0021] In one embodiment, step 1 involves ultrasonic cleaning with acetone solution to remove oil stains from the substrate surface, or ultrasonic cleaning with 5%–10% sodium hydroxide solution to remove oil stains from the substrate surface.

[0022] In one embodiment, step S50 between step S10 and step S12 uses a 10% hydrochloric acid solution to acid-wash and activate the substrate layer surface.

[0023] Step S50, between steps S12 and S20, involves acid washing and activating the copper plating surface with a 5% sulfuric acid solution.

[0024] Step S50, between steps S20 and S30, involves acid washing and activating the nickel plating surface using a 5% sulfuric acid solution.

[0025] In one embodiment, the nickel plating solution uses 200 g / L to 320 g / L nickel sulfate as the main salt, 35 g / L to 40 g / L boric acid as the complexing agent, and adds a wetting agent to prevent pinholes, with a pH value of 3.8 to 5.5.

[0026] The gold plating solution uses 4 g / L to 20 g / L potassium gold cyanide as the main salt, 35 g / L to 40 g / L boric acid and 5 g / L to 30 g / L citric acid as complexing agents, and has a pH value of 4.0 to 5.0.

[0027] The copper plating solution uses 40 g / L to 150 g / L copper sulfate as the main salt, 40 g / L to 90 g / L sodium cyanide to cuprous cyanide mixed solution and 20 g / L to 40 g / L citrate as complexing agent, and has a pH value of 6.5 to 7.5.

[0028] The copper plating solution has a temperature range of 25℃ to 35℃, the nickel plating solution has a temperature range of 45℃ to 55℃, and the gold plating solution has a temperature range of 20℃ to 30℃.

[0029] The above-mentioned electronic smoke atomizing mesh and its preparation method have at least the following advantages:

[0030] This method for preparing an e-cigarette atomizing mesh and the resulting mesh optimizes the material combination. Nickel and gold layers are sequentially brush-plated onto the surface of the substrate layer using electroplating and localized brush plating techniques, or copper, nickel, and gold layers are sequentially brush-plated onto the substrate layer. This improves the adhesion between the substrate layer and the electroplated layers, enhances corrosion resistance and mechanical strength, and significantly improves the adhesion of the gold plating layer, preventing peeling or corrosion damage during use. The mesh's resistance stability is significantly improved after gold plating, ensuring precise temperature control and optimizing its burst performance. This shortens the mesh's response time, enhances the aroma release and reproduction of e-liquid, and solves the problem of flavor degradation caused by corrosion of highly aromatic e-liquids. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a schematic diagram of the structure of the electronic smoke atomizing mesh of the present invention;

[0033] Figure 2 This is a cross-sectional view of an embodiment of the electronic smoke atomizing mesh of the present invention;

[0034] Figure 3 This is a cross-sectional view of another embodiment of the electronic smoke atomizing mesh of the present invention;

[0035] Figure 4 This is a simplified flowchart of process route A in the electronic smoke atomizing mesh preparation method of the present invention;

[0036] Figure 5 This is a detailed flow chart of process route A in the electronic smoke atomizing mesh preparation method of the present invention;

[0037] Figure 6 This is a simplified flowchart of process route B in the electronic smoke atomizing mesh preparation method of the present invention;

[0038] Figure 7 This is a detailed flow chart of process route B in the electronic smoke atomizing mesh preparation method of the present invention.

[0039] Notes: 10. Heating element; 12. Substrate layer; 14. Nickel plating layer; 16. Gold plating layer; 18. Copper plating layer; 20. Lead wire section. Detailed Implementation

[0040] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0041] It should be noted that the terms "first," "second," etc., in the specification, claims, and drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or modules is not limited to the listed steps or modules, but may optionally include steps or modules not listed, or may optionally include other steps or modules inherent to these processes, methods, products, or devices.

[0042] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0043] Please see Figure 1 This is a schematic diagram of the structure of an electronic smoke atomizing mesh in one embodiment.

[0044] Please see Figure 1 , Figure 2 An electronic cigarette atomizing mesh includes a heating element and an electrode lead element, the electrode lead element being connected to the heating element. The heating element includes a substrate layer, a nickel plating layer, and a gold plating layer. The nickel plating layer is attached to the surface of the substrate layer, and the gold plating layer is attached to the surface of the nickel plating layer.

[0045] This e-cigarette atomizing mesh utilizes optimized material combinations and a multi-layer plating design with localized brush plating and a gold plating layer sequentially applied to the surface. This enhances the adhesion between the substrate and the electroplated layers, while also improving corrosion resistance and mechanical strength. The gold plating significantly improves adhesion, preventing peeling or corrosion damage during use. The gold plating also significantly improves the mesh's resistance stability, ensuring precise temperature control and optimizing its burst performance. This shortens the mesh's response time, improves the aroma release fidelity of the e-liquid, and solves the problem of flavor degradation caused by corrosion of highly aromatic e-liquids.

[0046] Specifically, the material of the atomizing mesh substrate layer can be: iron-chromium-aluminum alloy, nickel-chromium alloy, 904L stainless steel or 316L stainless steel; iron-chromium-aluminum alloy has a low temperature coefficient of resistance, which is suitable for rapid temperature control response; nickel-chromium alloy is resistant to high temperature and oxidation, which can improve the overall structural strength; 904L stainless steel has high corrosion resistance, which is suitable for harsh environments; 316L stainless steel has good biocompatibility, which can balance corrosion resistance and cost.

[0047] In this embodiment, the resistance range of the bare raw material of the substrate layer is 0.2Ω to 2.0Ω to ensure that the basic conductivity meets the requirements of electronic cigarette operation; the thickness of the nickel plating layer is 1 to 50 mils, which can enhance the corrosion resistance and mechanical strength of the atomizing mesh; the thickness of the gold plating layer is 1 to 3 mils, which can provide excellent corrosion resistance and oxidation resistance; the nickel plating layer and the gold plating layer are attached sequentially on the surface of the substrate layer, which can balance the cost while ensuring the good performance of the atomizing mesh, and ensure that the resistance change of the overall atomizing mesh formed after the substrate layer is brush-plated is ≤0.3Ω and the temperature coefficient of resistance is 0.001℃ to 0.006℃.

[0048] Of course, electroplating is performed on the heating element of the atomizing mesh, but not on the lead wire. During electroplating, multiple atomizing meshes can be placed sequentially in preset positions on the feed strip, and the substrate layer of multiple atomizing meshes can be brush-plated at once, achieving an automated process. After electroplating, the positive and negative leads of the lead wire are soldered to the main body connection and negative connection of the heating element, respectively. The positive and negative leads are both covered with wire sheaths made of materials such as FEP, PFA, and PVDF.

[0049] Please see Figure 1 , Figure 3 In another embodiment, a copper plating layer is further included, which is attached to the surface of the substrate layer, and a nickel plating layer is attached to the surface of the copper plating layer; wherein the thickness of the copper plating layer is 1 mil to 30 mil; the copper plating layer can improve the adhesion between the substrate and the subsequent nickel plating layer, reduce the resistance of the atomizing mesh, and ensure that the resistance change of the overall atomizing mesh formed after the substrate layer is brush plated is ≤0.3Ω and the resistance temperature coefficient is 0.001℃ to 0.006℃.

[0050] This application also provides a method for preparing an electronic cigarette atomizing mesh, which is used to prepare an electronic cigarette atomizing mesh with the above-described structure.

[0051] Please see Figure 4 In this embodiment, process route A is provided, which includes two plating layers, and its specific steps are as follows:

[0052] Step S10: Substrate cleaning to remove oil stains from the substrate surface. Place the atomizing mesh on the conveyor belt and remove oil stains from the substrate surface using ultrasonic cleaning with acetone solution or 5%–10% sodium hydroxide solution to ensure a clean substrate surface and prevent oil stains from affecting the adhesion of subsequent coatings.

[0053] Step S20: Nickel plating. A nickel plating solution is applied evenly to the substrate surface using a brush plating head dipped in the solution. Precision brush plating equipment equipped with an adjustable current density of 5A / dm³ is used. 2 ~20A / dm 2 The plating solution flow rate is 0.5 L / min to 2 L / min, and the brush head pressure is 0.5 N / cm. 2 ~1.5N / cm 2 The control system places the atomizing mesh substrate layer in the nickel plating tank area, and the brush plating head dips into the nickel plating solution to uniformly brush the substrate surface, so that a nickel plating layer of uniform thickness is formed on the substrate surface.

[0054] Step S30: Gold plating layer. Using a brush plating head dipped in gold plating solution, evenly brush plating is applied to the surface of the nickel plating layer on the heating element. Switch the atomizing mesh to the gold plating tank area, and use the brush head in the gold plating tank area to apply gold plating solution evenly to the surface of the nickel plating layer, so that a gold plating layer of uniform thickness is formed on the surface of the substrate layer.

[0055] Step S40: Cleaning and drying. Rinse the heating element after coating with deionized water, dry it at a temperature of ≤50℃, and then roll it up and collect it.

[0056] In this embodiment, the nickel plating solution uses 200g / L to 320g / L nickel sulfate as the main salt, 35g / L to 40g / L boric acid as the complexing agent, and adds a wetting agent to prevent pinholes; the pH value is 3.8 to 5.5; the temperature range of the nickel plating solution is 45℃ to 55℃. The gold plating solution uses 4g / L to 20g / L potassium gold cyanide as the main salt, 35g / L to 40g / L boric acid and 5g / L to 30g / L citric acid as complexing agents; the pH value is 4.0 to 5.0; the temperature range of the gold plating solution is 20℃ to 30℃.

[0057] Please see Figure 5 In this embodiment, step S50, activation cleaning, is included between steps S10 and S20. First, the heating element substrate layer is rinsed with deionized water, then the heating element surface is activated by acid washing, and finally rinsed with deionized water. Specifically, a 10% hydrochloric acid solution is used to activate the substrate layer surface. Step S50, activation cleaning, is also included between steps S20 and S30. First, the heating element is rinsed with deionized water, then the heating element surface is activated by acid washing, and finally rinsed with deionized water. Specifically, a 5% sulfuric acid solution is used to activate the nickel plating layer surface.

[0058] Of course, the plating time for nickel and gold plating layers needs to be set according to the current density and current efficiency based on the plating material and the quality of the plating layer; the deposition rate of nickel plating layer needs to be balanced with the plating quality, and the deposition rate is medium; gold plating layer has a very high cost and the plating layer is very thin, and the quality requirements are high, so the deposition rate is the slowest; for example, it takes about 10 minutes to plating 1 mile of gold.

[0059] In this embodiment, the pH value of the nickel plating solution is generally 3.8–5.5, which is finely adjusted using a 5%–10% sodium hydroxide solution or a 5%–10% sulfuric acid solution, depending on the actual situation. Alternatively, a 10% boric acid solution can be added for fine adjustment. The pH value of the gold plating solution is 4.0–5.0, which is generally finely adjusted using a 5%–10% sodium hydroxide solution or a 5%–10% sulfuric acid solution, depending on the actual situation. The wetting agent is a mixture of dimethylhexynediol with a concentration of 60 g / L–80 g / L and sodium dodecyl sulfate with a concentration of 1 mL / L–2 mL / L.

[0060] Example 1, taking process route A as an example:

[0061] Pretreatment: Substrate cleaning: The surface oil was removed by ultrasonic cleaning with acetone solution, followed by acid washing with 10% HCl to activate the substrate surface.

[0062] Localized brush plating of nickel: The brush plating head is dipped into the nickel plating solution and evenly brush-plated onto the surface of the substrate; the current density of the precision brush plating equipment is 12A / dm². 2 The plating time is 30 minutes, and a 40-mile nickel layer is deposited; the quality inspection shows that a nickel layer thickness of 40±1 mile is acceptable.

[0063] Activation cleaning: Rinse the heating part with deionized water after nickel plating, then use a 5% sulfuric acid solution to acid-wash and activate the surface of the nickel plating, and then rinse with deionized water.

[0064] Gold plating by brush: Switch to the gold plating tank, dip the brush head into the gold plating solution, and evenly brush the nickel plating layer onto the surface. The current density of the precision brush plating equipment is 5A / dm³. 2 The process takes 5 minutes to deposit a 2-mile gold layer; quality inspection shows that the gold layer purity is ≥99.9%, the surface gloss is ≥90%, and the gold layer thickness is 2±0.5 miles to be considered qualified.

[0065] Post-treatment: Cleaning: Rinse with deionized water, drying temperature ≤50℃.

[0066] Please see Figure 6 In another embodiment, process route B is provided, which includes three coating layers, and the specific steps are as follows:

[0067] Step S10: Substrate cleaning to remove oil stains from the substrate surface. Place the atomizing mesh on the conveyor belt and remove oil stains from the substrate surface using ultrasonic cleaning with acetone solution or 5%–10% sodium hydroxide solution to ensure a clean substrate surface and prevent oil stains from affecting the adhesion of subsequent coatings.

[0068] Step S12: Copper plating. A copper plating solution is applied evenly to the substrate surface using a brush plating head. Precision brush plating equipment equipped with an adjustable current density of 5A / dm³ is used. 2 ~20A / dm 2 The plating solution flow rate is 0.5 L / min to 2 L / min, and the brush head pressure is 0.5 N / cm. 2 ~1.5N / cm 2 The control system places the atomizing mesh substrate layer in the copper plating tank area, and the brush plating head dips into the copper-nickel plating solution to uniformly brush the substrate surface, so that a copper plating layer of uniform thickness is formed on the substrate surface.

[0069] Step S20: Nickel plating layer. Using a brush plating head dipped in nickel plating solution, uniformly brush plating is applied to the surface of the copper plating layer in the heating section. Switch the atomizing mesh to the nickel plating tank area, and use the brush plating head dipped in nickel plating solution to uniformly brush plating the surface of the copper plating layer in the heating section, so that a nickel plating layer of uniform thickness is formed on the surface of the copper plating layer.

[0070] Step S30: Gold plating layer. Using a brush plating head dipped in gold plating solution, evenly brush plating is applied to the surface of the nickel plating layer on the heating element. Switch the atomizing mesh to the gold plating tank area, and use the brush head in the gold plating tank area to apply gold plating solution evenly to the surface of the nickel plating layer, so that a gold plating layer of uniform thickness is formed on the surface of the substrate layer.

[0071] Step S40: Cleaning and drying. Rinse the heating element after coating with deionized water, dry it at a temperature of ≤50℃, and then roll it up and collect it.

[0072] In this embodiment, the copper plating solution uses 40 g / L to 150 g / L copper sulfate as the main salt, a mixed solution of 40 g / L to 90 g / L sodium cyanide and cuprous cyanide, and 20 g / L to 40 g / L citrate as the complexing agent, with a pH of 6.5 to 7.5; the temperature range of the copper plating solution is 25℃ to 35℃. The nickel plating solution uses 200 g / L to 320 g / L nickel sulfate as the main salt, 35 g / L to 40 g / L boric acid as the complexing agent, and adds a wetting agent to prevent pinholes, with a pH of 3.8 to 5.5; the temperature range of the nickel plating solution is 45℃ to 55℃. The gold plating solution uses 4 g / L to 20 g / L potassium gold cyanide as the main salt, 35 g / L to 40 g / L boric acid and 5 g / L to 30 g / L citric acid as the complexing agent, with a pH of 4.0 to 5.0; the temperature range of the gold plating solution is 20℃ to 30℃.

[0073] Please see Figure 7 In this embodiment, step S50, activation cleaning, is included between steps S10 and S12. First, the heating element substrate layer is rinsed with deionized water, then the heating element surface is activated by acid washing, and finally rinsed with deionized water. Specifically, a 10% hydrochloric acid solution is used to activate the substrate layer surface. Step S50, activation cleaning, is included between steps S12 and S20. First, the heating element is rinsed with deionized water, then the heating element surface is activated by acid washing, and finally rinsed with deionized water. Specifically, a 5% sulfuric acid solution is used to activate the copper plating layer surface. Step S50, activation cleaning, is included between steps S20 and S30. First, the heating element is rinsed with deionized water, then the heating element surface is activated by acid washing, and finally rinsed with deionized water. Specifically, a 5% sulfuric acid solution is used to activate the nickel plating layer surface.

[0074] Of course, the plating time for copper, nickel, and gold plating layers needs to be set according to the current density and current efficiency based on the plating material and the quality of the plating layer. Generally, copper plating is used as the bottom layer or thickening layer and has the fastest deposition speed. The deposition speed of nickel plating layer needs to be balanced with the plating quality and has a medium deposition speed. Gold plating layer has the slowest deposition speed because gold is very expensive, the plating layer is very thin, and the quality requirements are high. For example, it takes about 10 minutes to plating 1 mile of gold.

[0075] In this embodiment, the pH value of the copper plating solution is generally 6.5–7.5, and is usually adjusted by fine-tuning with 5%–10% sodium hydroxide solution or 5%–10% sulfuric acid solution according to the actual situation; the pH value of the nickel plating solution is generally 3.8–5.5, and is usually adjusted by fine-tuning with 5%–10% sodium hydroxide solution or 5%–10% sulfuric acid solution according to the actual situation, or 10% boric acid solution can be added for fine-tuning; the pH value of the gold plating solution is generally 4.0–5.0, and is usually adjusted by fine-tuning with 5%–10% sodium hydroxide solution or 5%–10% sulfuric acid solution according to the actual situation; the wetting agent is a mixture of dimethylhexynyl glycol with a concentration of 60 g / L–80 g / L and sodium dodecyl sulfate with a concentration of 1 mL / L–2 mL / L.

[0076] Example 2, taking process route B as an example:

[0077] Pretreatment: Substrate cleaning: The surface oil was removed by ultrasonic cleaning with acetone solution, followed by acid washing with 10% HCl to activate the substrate surface.

[0078] Localized brush plating of copper: The brush plating head dips into the copper plating solution and evenly brushes it onto the surface of the substrate layer; the current density of the precision brush plating equipment is 8A / dm³. 2 The plating time is 15 minutes, and a 20-mile copper layer is deposited; the quality inspection shows that a nickel plating layer thickness of 20±1 mile is acceptable.

[0079] Activation cleaning: Rinse the heating part with copper plating with deionized water, then use a 5% sulfuric acid solution to acid-wash and activate the copper plating surface, and then rinse with deionized water.

[0080] Nickel plating by brush: The brush plating head is dipped into the nickel plating solution and evenly brushed onto the surface of the copper plating layer; the current density of the precision brush plating equipment is 12A / dm². 2 The plating time is 30 minutes, and a 40-mile nickel layer is deposited; the quality inspection shows that a nickel layer thickness of 40±1 mile is acceptable.

[0081] Activation cleaning: Rinse the heating part with deionized water after nickel plating, then use a 5% sulfuric acid solution to acid-wash and activate the surface of the nickel plating, and then rinse with deionized water.

[0082] Gold plating by brush: Switch to the gold plating tank, dip the brush head into the gold plating solution, and evenly brush the nickel plating layer onto the surface. The current density of the precision brush plating equipment is 5A / dm³. 2 The process takes 5 minutes to deposit a 2-mile gold layer; quality inspection shows that the gold layer purity is ≥99.9%, the surface gloss is ≥90%, and the gold layer thickness is 2±0.5 miles to be considered qualified.

[0083] Post-treatment: Cleaning: Rinse with deionized water, drying temperature ≤50℃.

[0084] In the embodiments of this application, by sequentially electroplating a copper plating layer, a nickel plating layer, and a gold plating layer on the surface of the substrate layer, the various performance characteristics of the atomizing mesh are greatly improved. This enhances the atomizing mesh's resistance to corrosion in e-liquids with high sweetness and high corrosiveness. The temperature control performance can meet the precise temperature control requirements for high-explosive, large-volume vapor production. At the same time, it has strong process compatibility and can be applied to various substrate layer materials, reducing production costs.

[0085] Specifically:

[0086] Enhanced Gold Coating Adhesion: Atomizing meshes without copper or nickel plating showed coating peeling and corrosion after being immersed in highly corrosive e-liquid for one month; gold-plated atomizing meshes with copper and nickel plating showed a peeling rate of ≤1% after being immersed in highly corrosive e-liquid for one month, and no obvious bubbles or coating peeling were observed on the surface after immersion in 10% hydrofluoric acid for 10 minutes; for highly corrosive e-liquid, atomizing meshes with copper, nickel, and gold plating experienced 30% slower flavor decay than unplated base meshes, while atomizing meshes with only gold plating experienced 20% slower flavor decay than unplated base meshes.

[0087] Breakthrough in corrosion resistance: After immersion in 50% nitric acid at room temperature for 24 hours and in 5% sodium chloride at room temperature for 48 hours, the corrosion rate of this application was 0.02 g / (m²). 2 ·h), traditional process 0.1g / (m 2 •h) The surface corrosion rate is reduced to 1 / 5 of that of traditional gold plating; it is suitable for high-sweetness e-liquid environments and its corrosion resistance is improved by ≥5 times.

[0088] Resistance stability: The resistance of the electroplated atomizing mesh is only 0.05Ω to 0.3Ω lower than that of the unplated substrate. Since the poorly etched areas are covered by the plating after electroplating, the resistance stability of the electroplated atomizing mesh is higher than that of the substrate. The resistance temperature coefficient after electroplating can be controlled within 0.001-0.006℃, meeting the requirements of precision temperature control.

[0089] Optimized temperature control burst performance: When the substrate is iron-chromium-aluminum, the burst time of the electroplated atomizing mesh (time to rise from room temperature to target temperature) is 10ms, while the burst time of the traditional 316L stainless steel substrate is 100ms; the temperature control burst response time is shortened by ≥30% compared with traditional stainless steel, and the aroma release peak is increased by 15%, which is suitable for the rapid atomization of high sweetness e-liquids.

[0090] Solving the problem of flavor degradation: Through the synergistic effect of corrosion-resistant coating and base material, the precipitation of metal ions caused by e-liquid corrosion is effectively inhibited, and the flavor stability is improved by more than 30%.

[0091] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0092] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. An electronic cigarette atomizing mesh sheet comprising a heating portion and an electrode lead portion, the electrode lead portion being connected to the heating portion, characterized in that, The heating part comprises a base layer, a nickel plating layer and a gold plating layer, the nickel plating layer is attached to the surface of the base layer, and the gold plating layer is attached to the surface of the nickel plating layer.

2. The electronic cigarette atomizing mesh of claim 1, wherein, The heating part further comprises a copper plating layer, the copper plating layer is attached to the surface of the base layer, and the nickel plating layer is attached to the surface of the copper plating layer.

3. The electronic cigarette atomizing mesh of claim 1, wherein, The resistance of the base layer is 0.2Ω-2.0Ω, the thickness of the nickel plating layer is 1μm-50μm, and the thickness of the gold plating layer is 1μm-3μm.

4. The electronic cigarette atomizing mesh of claim 2, wherein, The thickness of the copper plating layer is 1μm-30μm.

5. A method of making an electronic cigarette atomizing mesh, the method comprising: The steps are as follows: Step S10: cleaning the base layer to remove oil stains on the surface of the base layer; Step S20: plating the nickel layer, using a brush plating head to dip in a nickel plating solution and uniformly brush plating on the surface of the base layer; Step S30: plating the gold layer, using a brush plating head to dip in a gold plating solution and uniformly brush plating on the surface of the nickel plating layer of the heating part; Step S40: cleaning and drying, using deionized water to rinse the heating part after plating, and then drying.

6. The method of claim 5, wherein the electronic cigarette atomizing mesh is prepared by the steps of: The steps S10 and S20 further comprise: Step S12: plating the copper layer, using a brush plating head to dip in a copper plating solution and uniformly brush plating on the surface of the base layer; The nickel plating layer is uniformly brush plated on the surface of the copper plating layer of the heating part.

7. The method of claim 6, wherein the electronic cigarette atomizing mesh is prepared by the steps of: The steps S10 and S20 further comprise: Step S50: activation cleaning, first using deionized water to rinse the heating part, then using an acid solution to activate the surface of the heating part, and then using deionized water to rinse again.

8. The method of claim 5, wherein the electronic cigarette atomizing mesh is prepared by the steps of: In step 1, the oil stains on the surface of the base layer are removed by ultrasonic cleaning with an acetone solution or by ultrasonic cleaning with a 5%-10% sodium hydroxide solution.

9. The preparation method of the electronic cigarette atomization mesh according to claim 7, wherein, In the step S50 between the steps S10 and S12, the step S50 between the steps S12 and S20, and the step S50 between the steps S20 and S30, the surface of the base layer is activated by pickling with a hydrochloric acid solution with a concentration of 10%; In the step S50 between the steps S12 and S20, the surface of the copper plating layer is activated by pickling with a sulfuric acid solution with a concentration of 5%; In the step S50 between the steps S20 and S30, the surface of the nickel plating layer is activated by pickling with a sulfuric acid solution with a concentration of 5%.

10. The method of claim 6, wherein the electronic cigarette atomizing mesh is prepared by the steps of: The nickel plating solution uses 200g / L-320g / L nickel sulfate as the main salt, 35g / L-40g / L boric acid as the complexing agent, and a wetting agent to prevent pinholes, and the PH value is 3.8-5.5; The gold plating solution uses 4g / L-20g / L potassium cyanide as the main salt, 35g / L-40g / L boric acid and 5g / L-30g / L citric acid as the complexing agent, and the PH value is 4.0-5.0; The copper plating solution uses 40g / L-150g / L copper sulfate as the main salt, 40g / L-90g / L sodium cyanide and cuprous cyanide mixed solution as the complexing agent, and 20g / L-40g / L citrate as the complexing agent, and the PH value is 6.5-7.5; The temperature range of the copper plating solution is 25°C-35°C, the temperature range of the nickel plating solution is 45°C-55°C, and the temperature range of the gold plating solution is 20°C-30°C.

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