Thin film uncovering device and thin film uncovering method

Abstract

The invention provides a thin film uncovering device and a thin film uncovering method. The device comprises a frame operation structure used for placing and moving a transfer frame, a base operation structure used for placing and moving a structure to be uncovered, a gluing operation structure used for forming bonding connection between the transfer frame and a thin film of the structure to be uncovered, and a control frame operation structure. And the control structure is used for automatic operation of the substrate operation structure and the gluing operation structure. Through the frame operation structure, the substrate operation structure and the gluing operation structure, the film of the to-be-peeled structure can be bonded with the transfer frame, the transfer frame and the to-be-peeled structure generate relative displacement, separation of the film and the substrate is achieved through automatic control, stress borne by the film during separation is evenly distributed and flat, and the separation efficiency is improved. The yield of thin film stripping and the repeatability of the process are improved; and meanwhile, the bonding force between the thin film and the transfer frame is improved by rolling the bonding connection position, and the falling risk of the thin film in the uncovering and transferring process is reduced.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor integrated circuit manufacturing technology, and in particular relates to a thin film peeling device and a thin film peeling method. Background Technology

[0002] Photolithography is an indispensable step in semiconductor integrated circuit manufacturing. It transfers the pattern from a photomask onto a photoresist layer on the wafer surface, thus forming the desired pattern on the wafer. As critical dimensions continue to shrink, the requirements for defect control in photomasks become increasingly stringent. Although photolithography is typically performed in a high-cleanliness environment, there is still a risk of dust or other foreign matter settling on the photomask surface. Therefore, protective films are commonly used to reduce defects caused by foreign particles.

[0003] A photomask protective film is typically a transparent thin film suspended a certain distance above a photomask, supported by a frame and attached to the photomask. For photolithography processes with wavelengths of 193 nanometers and above, the aforementioned photomask protective film is usually a flexible film composed of cellulose or fluoropolymer. To produce this type of photomask protective film, the material is usually first coated onto a substrate. After the photomask protective film has cured, the resulting protective film is peeled off from the substrate to obtain a suspended film.

[0004] However, in publicly available technologies, film peeling is generally done manually. During manual peeling, the peeling speed and the film's posture must be manually controlled by the operator, making it difficult to ensure that each film is peeled in the same way. This results in poor film consistency and low quality reliability. Furthermore, because the protective film for the photomask requires high optical transmittance in the ultraviolet band, its thickness is typically no more than 2 micrometers. For such thin films, uneven stress distribution during manual peeling can easily cause localized wrinkles or even damage, thus affecting the yield of the film peeling process.

[0005] Existing methods for automating thin film removal, such as those disclosed in patent CN118062378A, involve an automated thin film cutting device where the film is directly peeled off the glass substrate surface using a suction cup and then laid flat on a processing table. However, due to the thinness of the film, it is still prone to breakage during suction gripping; furthermore, the lack of temporary support after removal makes the film surface susceptible to wrinkles. Therefore, the disclosed method is unsuitable for removing very thin films and is difficult to apply in actual mask protective film removal processes.

[0006] Therefore, there is an urgent need for a structure or method that can improve the yield and consistency of the mask protective film peeling process.

[0007] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of this application and facilitating the understanding of those skilled in the art. It should not be assumed that the above technical solutions are known to those skilled in the art simply because these solutions have been described in the background section of this application. Summary of the Invention

[0008] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a film peeling device and a film peeling method to solve the problems of low yield and poor consistency in the peeling process of mask protective film in the prior art.

[0009] To achieve the above objectives, the present invention provides a film peeling device, which includes: a frame operation structure, a substrate operation structure, an adhesive operation structure, and a control structure;

[0010] The frame operation structure is used to place and move the transfer frame, which is used to peel off the film from the substrate of the structure to be peeled off.

[0011] The base operating structure is used to place and move the structure to be removed;

[0012] The adhesive operation structure is used to set up an adhesive connection between the transfer frame and the film of the structure to be peeled off;

[0013] The control structure is used to control the automated operation of the frame operation structure, the substrate operation structure, and the adhesive operation structure.

[0014] Optionally, the adhesive application structure includes an actuator, which is one or more of a dispensing mechanism, a spraying mechanism, a roller brush mechanism, an adhesive applicator, an adhesive cutting mechanism, or a release paper peeling mechanism.

[0015] Optionally, the film peeling device further includes a monitoring system, which is used to monitor the operation process of the film peeling device and whether the material during the operation is normal. The control structure controls the operation status of the frame operation structure, the substrate operation structure and the adhesive operation structure according to the monitoring results of the monitoring system.

[0016] And / or the film peeling device further includes a storage structure, the storage structure including a storage component for the structure to be peeled, a storage component for the transfer frame, a storage component for the separated substrate, and a storage component for the transfer frame adhesive film.

[0017] And / or the film peeling device further includes a conveying structure for picking up and delivering the structure to be peeled, the transfer frame, the separated substrate, and the film bonded to the transfer frame from the storage structure, and the control structure controls the operating state of the conveying structure.

[0018] The present invention also provides a film peeling method, wherein the film peeling method uses any of the film peeling devices described above to peel the film, and the film peeling method includes:

[0019] The thin film peeling device automatically provides the structure to be peeled and the transfer frame. The structure to be peeled includes a substrate and a thin film covering one surface of the substrate. The thin film peeling device automatically moves the transfer frame to a surface of the thin film away from the substrate, so that the transfer frame coincides with the central axis of the structure to be peeled, and the direction of the central axis is a first direction.

[0020] The adhesive connection between the film and the transfer frame is automatically established by the film peeling device.

[0021] The film peeling device automatically controls the relative displacement of the transfer frame and the structure to be peeled along the first direction, so that the film bonded to the transfer frame is separated from the substrate of the structure to be peeled.

[0022] Optionally, the plane perpendicular to the first direction is the first plane. When the transfer frame is moved to the surface of the film away from the substrate, the projections of the film and the transfer frame on the first plane do not overlap. Before setting the adhesive connection, the vertical distance between the surface of the transfer frame away from the substrate and the surface of the film away from the substrate is controlled to not exceed a preset distance. When setting the adhesive connection, the single-sided adhesive tape is applied to the surface of the transfer frame away from the substrate and the surface of the film away from the substrate, so that the surface of the transfer frame away from the substrate and the surface of the film away from the substrate are both adhered to the single-sided adhesive tape to form an adhesive connection between the transfer frame and the film.

[0023] Optionally, after the single-sided adhesive tape is applied to the surface of the transfer frame away from the substrate and the surface of the film away from the substrate, the position of the single-sided adhesive tape is rolled; and / or the vertical distance between the surface of the transfer frame away from the substrate and the surface of the film away from the substrate is controlled to not exceed a preset distance, so that the central axis of the transfer frame and the structure to be peeled off are kept coincident.

[0024] Optionally, the provided transfer frame is bonded to a double-sided adhesive layer on a surface close to the film. The double-sided adhesive layer includes a first side and a second side that are oppositely disposed and both have adhesive properties. The transfer frame is bonded to the first side of the double-sided adhesive layer. A plane perpendicular to the first direction is a first plane. After the transfer frame is moved to a surface of the film away from the substrate, the projection of the film on the first plane and the projection of the double-sided adhesive layer on the first plane overlap. When setting the adhesive connection, the second side of the double-sided adhesive layer is controlled to contact the surface of the film away from the substrate to form an adhesive connection between the transfer frame and the film.

[0025] Optionally, after controlling the second side of the double-sided adhesive layer to contact the surface of the film away from the substrate, the position of the double-sided adhesive layer on the surface of the transfer frame away from the film is rolled; and / or when controlling the second side of the double-sided adhesive layer to contact the surface of the film away from the substrate, the transfer frame is kept to coincide with the central axis of the structure to be peeled off.

[0026] Optionally, the transfer frame includes an inner peripheral surface and an outer peripheral surface parallel to the first direction;

[0027] After the transfer frame is moved to a surface of the film away from the substrate, the projection of the inner peripheral surface onto the first plane is located within the projection of the film onto the first plane, and the projection of the outer peripheral surface onto the first plane is located outside the projection of the film onto the first plane.

[0028] Alternatively, after the transfer frame is moved to a surface of the film away from the substrate, the projection of the transfer frame on the first plane lies within the projection of the film on the first plane.

[0029] Optionally, when providing the transfer frame, a release paper is provided on the second side of the double-sided adhesive layer; the release paper on the second side is peeled off before the second side of the double-sided adhesive layer comes into contact with the surface of the film away from the substrate.

[0030] As described above, the film peeling device and film peeling method of the present invention have the following beneficial effects:

[0031] This invention enables the bonding of the film to be peeled and the transfer frame through a frame operation structure, a substrate operation structure, and an adhesive operation structure, and causes relative displacement between the transfer frame and the structure to be peeled. The separation of the film and the substrate is achieved through automated control, and the transfer frame ensures that the stress distribution on the film during separation is uniform and flat, thereby improving the yield of film peeling and the repeatability of the process.

[0032] This invention improves the adhesion between the film and the transfer frame by rolling the bonding joint, thereby reducing the risk of the film falling off during the peeling and transfer process. Attached Figure Description

[0033] Figure 1 The diagram shown is a schematic diagram of the thin film peeling device in Embodiment 1 of the present invention.

[0034] Figure 2 This is a schematic diagram of the structure of setting single-sided adhesive tape in step 2 of the film peeling method in Embodiment 2 of the present invention.

[0035] Figure 3 The diagram shows a schematic representation of the separation process between the thin film and the substrate in step 3 of the thin film peeling method in Embodiment 2 of the present invention.

[0036] Figure 4 The diagram shows a schematic representation of the separation process between the thin film and the substrate in step 3 of the thin film peeling method in Embodiment 2 of the present invention.

[0037] Figure 5 The diagram shows a schematic of the structure of the double-sided adhesive layer in step 2 of the film peeling method in Embodiment 3 of the present invention.

[0038] Figure 6 The diagram shows a schematic representation of the separation process between the thin film and the substrate in step 3 of the thin film peeling method in Embodiment 3 of the present invention.

[0039] Figure 7 The diagram shows a schematic representation of the separation process between the thin film and the substrate in step 3 of the thin film peeling method in Embodiment 3 of the present invention.

[0040] Figure 8 This is a schematic diagram of the structure of setting the double-sided adhesive layer in step 2 of the film peeling method in Embodiment 4 of the present invention.

[0041] Figure 9 The diagram shows a schematic representation of the separation process between the thin film and the substrate in step 3 of the thin film peeling method in Embodiment 4 of the present invention.

[0042] Figure 10 The diagram shows a schematic representation of the separation process between the thin film and the substrate in step 3 of the thin film peeling method in Embodiment 4 of the present invention.

[0043] Component designation explanation

[0044] 110. Frame operating structure; 120. Base operating structure; 130. Adhesive operating structure; 131. Adhesive belt conveyor head; 132. Adhesive roller; 133. Dustproof housing; 140. Robotic arm;

[0045] 211. Storage component of the structure to be removed; 212. Storage component of the transfer frame; 213. Storage component of the separated substrate; 214. Storage component of the transfer frame adhesive film; 221. Fixed shaft; 222. Lifting mechanism; 223. Rotating arm; 224. Transfer arm; 225. Execution arm; 226. Clamping structure; 230. Bearing frame; 240. Partition plate;

[0046] 310. Structure to be peeled off; 311. Substrate; 312. Film; 320. Transfer frame; 331. Single-sided adhesive tape; 332. Double-sided adhesive layer; 340. Frame movement direction. Detailed Implementation

[0047] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0048] In the detailed description of embodiments of the present invention, for ease of explanation, the schematic diagrams illustrating the device structure may be partially enlarged without adhering to the general scale, and the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. Furthermore, in actual manufacturing, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0049] For ease of description, spatial relation terms such as “below,” “under,” “lower than,” “below,” “above,” and “upper” may be used herein to describe the relationship between one element or feature shown in the accompanying drawings and other elements or features. It will be understood that these spatial relation terms are intended to include directions other than those depicted in the accompanying drawings for devices in use or operation.

[0050] In the context of this application, the structure described above the first feature may include embodiments in which the first and second features are in direct contact, or embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0051] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0052] Example 1:

[0053] This embodiment provides a thin film peeling device, such as... Figure 1 As shown, the film peeling device includes: a frame operation structure 110, a substrate operation structure 120, an adhesive operation structure 130, and a control structure (not shown in the figure);

[0054] The frame operation structure 110 is used to place and move the transfer frame 320, which is used to peel off the film 312 from the substrate 311 of the structure to be peeled off 310.

[0055] The substrate operation structure 120 is used to place and move the structure 310 to be removed;

[0056] The adhesive operation structure 130 is used to set up an adhesive connection between the transfer frame 320 and the film 312 of the structure to be peeled off 310.

[0057] The control structure is used to control the automated operation of the frame operation structure 110, the substrate operation structure 120, and the adhesive operation structure 130.

[0058] In the prior art, when peeling the photomask protective film coated on the substrate 311, it is generally done manually. However, during the manual peeling process, the peeling speed and the posture of the film 312 during the peeling process must be manually controlled by the operator. It is difficult to ensure that each film 312 is peeled in the same way. Therefore, the consistency of the protective film 312 of the produced photomask is often poor, and the quality reliability is poor. At the same time, since the photomask protective film has high requirements for optical transmittance in the ultraviolet band, the thickness of the photomask protective film is usually no more than 2 micrometers. For such a thin film 312, uneven stress distribution during the manual peeling process is more likely to cause local wrinkles or even damage to the film 312, thereby affecting the yield of the photomask protective film 312 peeling process. In addition, in existing technologies, there are improved methods for automating film peeling, such as patent CN118062378A, where the film is directly peeled off from the surface of the glass substrate using a suction cup and then laid flat on the processing table. However, when the film thickness is very thin, the film is still easily damaged during the suction cup gripping process. Furthermore, since there is no temporary support after the film is peeled off, wrinkles are still likely to appear on the film surface, making it difficult to apply to the actual peeling process of mask protective films with very thin film thickness.

[0059] This invention provides a frame operation structure 110 comprising an operation transfer frame 320, a substrate operation structure 120 for operating the structure to be peeled 310, an adhesive operation structure 130 for setting the bonding connection, and a control structure for controlling each component. This allows the film 312 of the structure to be peeled 310 to be bonded to the transfer frame 320, and the film 312 to be separated from the substrate 311 by relative displacement between the bonded transfer frame 320 and the substrate 311. Using this film peeling device, the transfer frame 320 acts as a transfer medium during the peeling process, ensuring a relatively stable posture of the film 312 during the peeling process. By employing an automated control structure to control the movement of each component, the film 312 can be peeled off at a uniform speed. This ensures that the film 312 is subjected to uniform force and remains flat during peeling, preventing wrinkles or even damage. This improves the yield of film 312 peeling and is beneficial for applications where the peeled film 312 is relatively thin, such as photomask protective films. At the same time, the transfer frame 320, acting as a transfer intermediary, works in conjunction with the movement of the control components to improve the consistency of various variables during multiple film 312 peelings. This enhances the consistency of film 312 peeling and the repeatability of the process, which is conducive to large-scale industrial production.

[0060] Specifically, although this solution focuses on solving the yield problem of peeling the protective film 312 of the photomask from the substrate 311 on which the film 312 is prepared, it can also be used in other application scenarios that require improved yield of peeling film 312, all of which are within the protection scope of this invention.

[0061] Specifically, both the frame operation structure 110 and the base operation structure 120 may include a movable or immovable placement platform, such as... Figure 1 The robotic arm 140 and other structures shown for moving materials that need to operate the transfer frame 320 or the structure to be peeled off 310 in the film peeling method can be adjusted according to the actual application requirements.

[0062] In one embodiment, the adhesive operation structure 130 includes an actuator, which is one or more of a dispensing mechanism, a spraying mechanism, a roller brush mechanism, an adhesive application mechanism, an adhesive cutting mechanism, or a release paper peeling mechanism. Specifically, the actuator of the adhesive operation structure 130 can be configured according to the requirements of the adhesive bonding method in the specific film peeling method; for example, the actuator in Embodiment 2 below may include an adhesive application mechanism or other mechanism that can provide a single-sided adhesive tape 331, an adhesive cutting mechanism that cuts the single-sided adhesive tape 331 when its length is sufficient, and the adhesive cutting mechanism may be a blade; the actuator in Embodiment 3 below may include a dispensing mechanism, a spraying mechanism, a roller brush mechanism or other mechanism that can provide a double-sided adhesive layer 332, and a release paper peeling mechanism for peeling the release paper from the second side of the double-sided adhesive layer 332; the actuator may include a moving structure to control various components performing dispensing and other operations to move to the corresponding operating position.

[0063] This invention allows for different bonding and connection methods by using different actuators, thus flexibly adapting to application requirements.

[0064] In one embodiment, such as Figure 2 As shown, the adhesive operation structure 130 also includes a dustproof housing 133, and the actuator is located inside the dustproof housing 133. The pressure inside the dustproof housing 133 is less than the pressure outside the dustproof housing 133.

[0065] This invention avoids particle contamination during the bonding process by setting the dustproof housing 133 outside the actuator under negative pressure. Specifically, when the actuator is running, the moving parts can be exposed from the dustproof housing 133 to meet process requirements.

[0066] In one embodiment, the film peeling device further includes a monitoring system for monitoring the operation of the film peeling device and whether the materials during the operation are normal. The control structure controls the operation status of the frame operation structure 110, the substrate operation structure 120 and the adhesive operation structure 130 according to the monitoring results of the monitoring system.

[0067] This invention, by setting up a monitoring system, can promptly detect abnormal process components or steps, stop losses in time, reduce process costs, and improve process yield.

[0068] Specifically, the monitoring system may include optical, mechanical, and other sensors, or various monitoring structures such as machine vision modules. The monitoring system monitors, but is not limited to, whether the material is correctly placed in the storage structure, whether the material slides during the transfer process, the position of the structure to be peeled 310 and the transfer frame 320 on the placement table, whether the film 312 and the transfer frame 320 are properly fixed, and whether the film 312 is damaged before and after peeling. The information collected by the monitoring system is transmitted to the control structure in real time. If the monitoring results received by the control structure are abnormal, the subsequent process flow will be stopped, and an alarm and error code will be issued so that the operator can troubleshoot the problem.

[0069] In one embodiment, such as Figure 1 As shown, the film peeling device further includes a material storage structure, which includes a material storage component 211 of the structure to be peeled 310, a material storage component 212 of the transfer frame 320, a material storage component 213 of the separated substrate 311, and a material storage component 214 of the transfer frame 320 for bonding the film 312.

[0070] In one embodiment, the film peeling device further includes a conveying structure for picking up and delivering the structure to be peeled 310, the transfer frame 320, the separated substrate 311, and the film 312 bonded to the transfer frame 320 from the storage structure. The control structure controls the operating state of the conveying structure.

[0071] In one embodiment, such as Figure 1 As shown, the conveying structure includes a fixed shaft 221, a lifting mechanism 222, a telescopic arm, and a clamping structure 226. One end of the lifting mechanism 222 is vertically connected to the fixed shaft 221, and the other end of the lifting mechanism 222 is telescopically connected to one end of the telescopic arm. The other end of the telescopic arm is fixedly connected to the clamping structure 226. The clamping structure 226 is used to pick up and deliver the corresponding material to be picked up and delivered. The lifting mechanism 222 and the telescopic arm are used to move the clamping structure 226 to the position corresponding to the material to be picked up and delivered.

[0072] In one embodiment, such as Figure 1 As shown, the telescopic arm includes a rotating arm 223, a central rotating arm 224, and an actuating arm 225. One end of the rotating arm 223 is rotatably connected to the lifting mechanism 222, and the other end of the rotating arm 223 is rotatably connected to one end of the central rotating arm 224. The other end of the central rotating arm 224 is rotatably connected to one end of the actuating arm 225, and the other end of the actuating arm 225 is fixedly connected to the clamping structure 226. The rotation of the central rotating arm 224 can control the distance between the actuating arm 225 and the lifting mechanism 222.

[0073] In one embodiment, one end of the telescopic arm is rotatably connected to the lifting mechanism 222, and the other end of the telescopic arm is fixedly connected to the clamping structure 226. The telescopic arm itself can extend and retract with the lifting mechanism 222 as the axis.

[0074] In one embodiment, the clamping structure 226 includes two or more clamping structures 226 for clamping different materials.

[0075] By setting multiple different clamping structures 226, this invention can adapt to the clamping requirements of different materials, increase the range of materials that can be clamped, and improve ease of use.

[0076] In one embodiment, such as Figure 1 As shown, the film peeling device also includes a support frame 230 and a fan filter unit (not shown in the figure). The fan filter unit is located above the support frame 230 and is used for gas exchange between the support frame 230 and the outside environment. The components of the frame operation structure 110, the substrate operation structure 120, the adhesive operation structure 130, and the conveying structure that need to be fixed are fixed inside the support frame 230. The material storage structure is fixed inside the support frame 230.

[0077] In one embodiment, such as Figure 1 As shown, the supporting frame 230 also includes a partition 240, which includes multiple through holes. The frame operation structure 110, the base operation structure 120, the adhesive operation structure 130, the execution components of the conveying structure, and the material storage structure are placed on the partition 240. The non-execution components of the frame operation structure 110, the base operation structure 120, the adhesive operation structure 130, and the conveying structure are placed below the partition 240. The non-execution components include drive motors, air pumps, and other components that do not require movement.

[0078] In one embodiment, the material of the support frame 230 is mirror stainless steel.

[0079] Example 2:

[0080] This embodiment provides a film peeling method, wherein the film peeling method uses any one of the film peeling devices described in Embodiment 1 above to peel off the film 312, and the film peeling method includes:

[0081] Step 1: The film peeling device automatically provides the structure to be peeled 310 and the transfer frame 320. The structure to be peeled 310 includes a substrate 311 and a film 312 covering one surface of the substrate 311. The film peeling device automatically moves the transfer frame 320 to a surface of the film 312 away from the substrate 311, so that the transfer frame 320 coincides with the central axis of the structure to be peeled 310, and the direction of the central axis is a first direction.

[0082] Step 2: The adhesive connection between the film 312 and the transfer frame 320 is automatically established by the film peeling device;

[0083] Step 3: The transfer frame 320 and the structure to be peeled 310 are automatically displaced relative to each other along the first direction by the film peeling device, so that the film 312 bonded to the transfer frame 320 is separated from the substrate 311 of the structure to be peeled 310.

[0084] The thin film peeling method of the embodiments will be described in detail below with reference to the accompanying drawings. It should be noted that the above order does not strictly represent the order of the thin film peeling method protected by the present invention, and those skilled in the art can make changes according to the actual preparation steps.

[0085] First, in step 1, the thin film peeling device automatically provides the structure to be peeled 310 and the transfer frame 320. The structure to be peeled 310 includes a substrate 311 and a thin film 312 covering one surface of the substrate 311. The thin film peeling device automatically moves the transfer frame 320 to a surface of the thin film 312 away from the substrate 311, so that the transfer frame 320 coincides with the central axis of the structure to be peeled 310, and the direction of the central axis is a first direction.

[0086] In this embodiment, the plane perpendicular to the first direction is the first plane, such as... Figures 2-4 As shown, in step 1, when the transfer frame 320 is moved to a surface of the film 312 away from the substrate 311, the projections of the film 312 and the transfer frame 320 on the first plane do not overlap.

[0087] This embodiment achieves this by setting the projections of the thin film 312 and the transfer frame 320 on the first plane to be non-overlapping, so that the transfer frame 320 itself will not come into contact with the thin film 312, thereby further reducing the stress on the thin film 312 and avoiding the problem of wrinkles or damage to the thin film 312.

[0088] Specifically, the distance between the inner circumferential surface of the transfer frame 320 and the film 312 is controlled within a small range to improve the adhesion of subsequent bonding.

[0089] Then, in step 2, the adhesive connection between the film 312 and the transfer frame 320 is automatically set by the film peeling device.

[0090] In this embodiment, before setting the bonding connection in step 2, the vertical distance between the surface of the transfer frame 320 away from the substrate 311 and the surface of the film 312 away from the substrate 311 is controlled to not exceed a preset distance; when setting the bonding connection, such as Figure 2 As shown, the single-sided adhesive tape 331 is provided on the surface of the transfer frame 320 away from the substrate 311 and the surface of the film 312 away from the substrate 311, so that the surface of the transfer frame 320 away from the substrate 311 and the surface of the film 312 away from the substrate 311 are both bonded to the single-sided adhesive tape 331, thereby forming an adhesive connection between the transfer frame 320 and the film 312.

[0091] Specifically, the purpose of setting the preset distance is to prevent the single-sided adhesive tape 331 from failing to make sufficient contact with the surface of the film 312 away from the substrate 311 during bonding due to an excessively large vertical distance between the surface of the transfer frame 320 away from the substrate 311 and the surface of the film 312 away from the substrate 311, or to prevent excessive stress in the single-sided adhesive tape 331 from damaging or breaking the film 312. The preset distance can be 0-3 mm. Preferably, the preset distance can be 0-0.5 mm, limited to not affecting the bonding connection, and the preset distance is set according to the maximum height difference that does not affect the bonding connection.

[0092] Specifically, multiple single-sided adhesive tapes 331 can be provided to improve the adhesion of the single-sided adhesive tapes 331 to the transfer frame 320 and the film 312.

[0093] In one embodiment, when the vertical distance between the surface of the transfer frame 320 away from the substrate 311 and the surface of the film 312 away from the substrate 311 does not exceed a preset distance, the transfer frame 320 is kept to coincide with the central axis of the structure to be removed 310.

[0094] The present invention improves the uniformity of force on the film 312 during the peeling process by keeping the central axis of the transfer frame 320 coincide with the central axis of the structure to be peeled 310, thereby further improving the yield of peeling the film 312.

[0095] In one embodiment, after the single-sided adhesive tape 331 is applied to the surface of the transfer frame 320 away from the substrate 311 and the surface of the film 312 away from the substrate 311, the position of the single-sided adhesive tape 331 is rolled.

[0096] The present invention improves the adhesion between the single-sided adhesive tape 331 and the film 312 and the transfer frame 320 by rolling the single-sided adhesive tape 331, thereby avoiding the film 312 or the transfer frame 320 from falling off or shifting during the film peeling process, and thus improving the yield of film 312 peeling.

[0097] In one embodiment, such as Figure 2 As shown, the actuator of the film peeling device is a close-fitting adhesive tape conveyor head 131 and a glue roller 132. The glue roller 132 rolls the applied single-sided adhesive tape 331 in a timely manner. At the same time, when the adhesive tape conveyor head 131 stops conveying the single-sided adhesive tape 331 outward, the glue cutting mechanism (not shown in the figure) cuts off the connected single-sided adhesive tape 331.

[0098] Finally, proceed to step 3, as follows: Figures 3-4 As shown, the film peeling device automatically controls the relative displacement of the transfer frame 320 and the structure to be peeled 310 along the first direction, so that the film 312 bonded to the transfer frame 320 is separated from the substrate 311 of the structure to be peeled 310.

[0099] In one embodiment, such as Figures 3-4 As shown in the figure, the frame movement direction 340 is the movement direction of the transfer frame 320 relative to the base 311.

[0100] This invention separates the film 312 from the substrate 311 by moving the transfer frame 320 to the surface of the film 312 away from the substrate 311 and bonding the film 312 to the transfer frame 320, followed by relative displacement between the transfer frame 320, the film 312, and the substrate 311. During this process, the transfer frame 320 acts as a transfer medium, and its central axis coincides with that of the film 312, ensuring a relatively stable posture of the film 312 during the peeling process. Furthermore, the automated control of each step by the film peeling device allows for uniform speed... The peeling of film 312 ensures that the film 312 is subjected to uniform force and remains flat during peeling, avoiding wrinkles or even damage. This improves the yield of film 312 peeling and is beneficial for applications where the peeled film 312 is relatively thin, such as photomask protective film. At the same time, the transfer frame 320, as a transfer medium, works in conjunction with the automated movement of the film peeling device to improve the consistency of various variables when peeling film 312 multiple times. This improves the consistency of film 312 peeling and the repeatability of the process, which is conducive to large-scale industrial production.

[0101] In one embodiment, the speed at which the transfer frame 320 in step 3 causes the film 312 to move relative to the substrate 311 is 0.01 mm / min to 10 mm / min. Specifically, the speed of relative displacement can be determined based on parameters such as the adhesion between the film 312 and the substrate 311, and the mechanical strength of the film 312.

[0102] Example 3:

[0103] This embodiment provides a film peeling method, which has other features that are basically the same as those in Embodiment 2, except that:

[0104] In this embodiment, in step 1, the provided transfer frame 320 is bonded to a double-sided adhesive layer 332 near the surface of the film 312. The double-sided adhesive layer 332 includes a first side and a second side that are oppositely arranged and both have adhesive properties. The transfer frame 320 is bonded to the first side of the double-sided adhesive layer 332. A plane perpendicular to the first direction is the first plane. After moving the transfer frame 320 to a surface of the film 312 away from the substrate 311, as... Figures 5-7 As shown, the projection of the thin film 312 onto the first plane and the projection of the double-sided adhesive layer 332 onto the first plane overlap; in step 2, as... Figure 5 As shown, when setting the adhesive connection, the second side of the double-sided adhesive layer 332 is controlled to contact the surface of the film 312 away from the substrate 311 to form an adhesive connection between the transfer frame 320 and the film 312.

[0105] Specifically, step 3 is similar to the steps in Example 2, such as... Figures 6-7 As shown, the film peeling device automatically controls the relative displacement of the transfer frame 320 and the structure to be peeled 310 along the first direction, so that the film 312 bonded to the transfer frame 320 is separated from the substrate 311 of the structure to be peeled 310.

[0106] In one embodiment, such as Figures 6-7 The frame movement direction 340 shown is the movement direction of the transfer frame 320 relative to the base 311.

[0107] This embodiment sets the projection of the film 312 on the first plane to overlap with the projection of the double-sided adhesive layer 332 on the first plane, so that the transfer frame 320 and the film 312 can be bonded together by the double-sided adhesive layer 332. Compared with the method in Embodiment 2, this embodiment can improve the adhesion between the transfer frame 320 and the film 312 during the peeling process and improve the reliability of the bonding connection between the transfer frame 320 and the film 312 during the peeling process.

[0108] In this embodiment, the transfer frame 320 includes an inner peripheral surface and an outer peripheral surface parallel to the first direction; in step 1, as... Figure 5 As shown, after the transfer frame 320 is moved to the surface of the film 312 away from the substrate 311, the projection of the inner peripheral surface on the first plane is located within the projection of the film 312 on the first plane, and the projection of the outer peripheral surface on the first plane is located outside the projection of the film 312 on the first plane.

[0109] By setting the positional relationship between the inner and outer peripheral surfaces of the transfer frame 320 and the film 312, the present invention can improve the adhesion while reducing the impact on the film 312, thereby achieving the optimal effect between peeling process yield and process reliability.

[0110] In one embodiment, the direction perpendicular to the corresponding inner and outer peripheral surfaces of any position of the transfer frame 320 is radial; in step 1, after the transfer frame 320 is moved to the surface of the film 312 away from the substrate 311, the length of the portion of the projection of the second side of the double-sided adhesive layer 332 of the transfer frame 320 on the first plane that coincides with the projection of the film 312 on the first plane in the radial direction at the corresponding position is greater than or equal to 5 mm.

[0111] By setting the overlap width between the transfer frame 320 and the film 312, the present invention can further improve the adhesion while reducing the impact on the film 312, thereby achieving the optimal effect between peeling process yield and process reliability.

[0112] In one embodiment, in step 1, when the transfer frame 320 is provided, the second side of the double-sided adhesive layer 332 is provided with release paper; in step 2, before the second side of the double-sided adhesive layer 332 contacts the surface of the film 312 away from the substrate 311, the release paper of the second side is peeled off.

[0113] By providing release paper on the second side of the double-sided adhesive layer 332 of the provided transfer frame 320, this invention can prevent the second side of the double-sided adhesive layer 332 from directly contacting the transfer frame 320 storage component 212 when the transfer frame 320 is removed from the transfer frame 320 storage component 212. It can also reduce contamination of the double-sided adhesive layer 332 with particulate matter during the transfer process, thereby further improving the stress uniformity of the film 312 under the transfer frame 320 during the peeling process, reducing contamination of the film 312, and improving the peeling yield of the film 312.

[0114] In one embodiment, in step 2, when the second side of the double-sided adhesive layer 332 is in contact with the surface of the film 312 away from the substrate 311, the transfer frame 320 is kept aligned with the central axis of the structure to be removed 310.

[0115] The present invention improves the uniformity of force on the film 312 during the peeling process by keeping the central axis of the transfer frame 320 coincide with the central axis of the structure to be peeled 310, thereby further improving the yield of peeling the film 312.

[0116] In one embodiment, in step 2, after controlling the second side of the double-sided adhesive layer 332 to contact the surface of the film 312 away from the substrate 311, the transfer frame 320 is rolled on the surface away from the film 312 at the position corresponding to the double-sided adhesive layer 332.

[0117] The present invention improves the adhesion of the double-sided adhesive layer 332 to the film 312 and the transfer frame 320 by rolling the position where the transfer frame 320 is set with double-sided adhesive layer 332, thereby avoiding the film 312 or the transfer frame 320 from falling off or shifting during the film peeling process, and thus improving the yield of film 312 peeling.

[0118] Example 4:

[0119] This embodiment provides a thin film peeling method, which has other features that are basically the same as those in Embodiment 3, except that:

[0120] In this embodiment, the transfer frame 320 includes an inner peripheral surface and an outer peripheral surface parallel to the first direction; in step 1, as... Figures 8-10 As shown, after the transfer frame 320 is moved to a surface of the film 312 away from the substrate 311, the projection of the transfer frame 320 on the first plane is located within the projection of the film 312 on the first plane.

[0121] Specifically, similar to the steps in Embodiment 2, in step 2, as follows: Figure 8 As shown, when setting the adhesive connection, the second side of the double-sided adhesive layer 332 is controlled to contact the surface of the film 312 away from the substrate 311 to form an adhesive connection between the transfer frame 320 and the film 312; in step 3, as Figures 9-10 As shown, the film peeling device automatically controls the relative displacement of the transfer frame 320 and the structure to be peeled 310 along the first direction, so that the film 312 bonded to the transfer frame 320 is separated from the substrate 311 of the structure to be peeled 310.

[0122] The present invention improves the reliability of the bonding connection between the transfer frame 320 and the film 312 by setting the projection of the transfer frame 320 on the first plane to be located within the projection of the film 312 on the first plane.

[0123] Specifically, such as Figures 9-10 The frame movement direction 340 shown is the movement direction of the transfer frame 320 relative to the base 311.

[0124] In summary, the film peeling device and method of the present invention can bond the film of the structure to be peeled and the transfer frame through the frame operation structure, the substrate operation structure and the adhesive operation structure, and generate relative displacement between the transfer frame and the structure to be peeled. The separation of the film and the substrate is achieved by automatic control, and the transfer frame ensures that the stress distribution on the film during separation is uniform and flat, thereby improving the yield of film peeling and the repeatability of the process. At the same time, by rolling the bonding joint, the adhesion between the film and the transfer frame is improved, and the risk of the film falling off during the peeling and transfer process is reduced.

[0125] Therefore, this invention effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0126] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A film peeling device, characterized in that, The film peeling device includes: a frame operation structure, a substrate operation structure, an adhesive operation structure, and a control structure; The frame operation structure is used to place and move the transfer frame, which is used to peel off the film from the substrate of the structure to be peeled off. The substrate operating structure is used to place and move the structure to be removed; The adhesive operation structure is used to set up an adhesive connection between the transfer frame and the film of the structure to be peeled off. The control structure is used to control the automated operation of the frame operation structure, the substrate operation structure, and the adhesive operation structure.

2. The film peeling device according to claim 1, characterized in that, The adhesive application structure includes an actuator, which is one or more of the following: a dispensing mechanism, a spraying mechanism, a roller brush mechanism, an adhesive applicator, an adhesive cutting mechanism, or a release paper peeling mechanism.

3. The film peeling device according to claim 1, characterized in that, The film peeling device also includes a monitoring system, which is used to monitor the operation process of the film peeling device and whether the material is normal during the operation process. The control structure controls the operation status of the frame operation structure, the substrate operation structure and the adhesive operation structure according to the monitoring results of the monitoring system. And / or the film peeling device further includes a storage structure, the storage structure including a storage component for the structure to be peeled, a storage component for the transfer frame, a storage component for the separated substrate, and a storage component for the transfer frame adhesive film. And / or the film peeling device further includes a conveying structure for picking up and delivering the structure to be peeled, the transfer frame, the separated substrate, and the film bonded to the transfer frame from the storage structure, and the control structure controls the operating state of the conveying structure.

4. A method for peeling off a thin film, characterized in that, The film peeling method employs the film peeling device according to any one of claims 1-3 to peel off the film, and the film peeling method includes: The thin film peeling device automatically provides the structure to be peeled and the transfer frame. The structure to be peeled includes a substrate and a thin film covering one surface of the substrate. The thin film peeling device automatically moves the transfer frame to a surface of the thin film away from the substrate, so that the transfer frame coincides with the central axis of the structure to be peeled, and the direction of the central axis is a first direction. The adhesive connection between the film and the transfer frame is automatically established by the film peeling device. The film peeling device automatically controls the relative displacement of the transfer frame and the structure to be peeled along the first direction, so that the film bonded to the transfer frame is separated from the substrate of the structure to be peeled.

5. The film peeling method according to claim 4, characterized in that, A plane perpendicular to the first direction is the first plane. When the transfer frame is moved to a surface of the film away from the substrate, the projections of the film and the transfer frame on the first plane do not overlap. Before setting the bonding connection, the vertical distance between the surface of the transfer frame away from the substrate and the surface of the film away from the substrate shall not exceed a preset distance; When setting up the adhesive connection, the single-sided adhesive tape is applied to the surface of the transfer frame away from the substrate and the surface of the film away from the substrate, so that the surface of the transfer frame away from the substrate and the surface of the film away from the substrate are both adhered to the single-sided adhesive tape to form an adhesive connection between the transfer frame and the film.

6. The film peeling method according to claim 5, characterized in that, After the single-sided adhesive tape is applied to the surface of the transfer frame away from the substrate and the surface of the film away from the substrate, the position of the single-sided adhesive tape is rolled; and / or the vertical distance between the surface of the transfer frame away from the substrate and the surface of the film away from the substrate is controlled to not exceed a preset distance, so that the transfer frame and the central axis of the structure to be peeled off are kept coincident.

7. The film peeling method according to claim 4, characterized in that, The provided transfer frame is bonded to a double-sided adhesive layer on a surface close to the film. The double-sided adhesive layer includes a first side and a second side that are oppositely arranged and both have adhesive properties. The transfer frame is bonded to the first side of the double-sided adhesive layer. A plane perpendicular to the first direction is a first plane. After the transfer frame is moved to a surface of the film away from the substrate, the projection of the film on the first plane and the projection of the double-sided adhesive layer on the first plane have an overlapping portion. When setting up the adhesive connection, the second side of the double-sided adhesive layer is controlled to contact the surface of the film away from the substrate to form an adhesive connection between the transfer frame and the film.

8. The film peeling method according to claim 7, characterized in that, After controlling the second side of the double-sided adhesive layer to contact the surface of the film away from the substrate, roll the transfer frame on the surface away from the film corresponding to the position of the double-sided adhesive layer; and / or when controlling the second side of the double-sided adhesive layer to contact the surface of the film away from the substrate, keep the transfer frame aligned with the central axis of the structure to be peeled off.

9. The film peeling method according to claim 7, characterized in that, The transfer frame includes an inner circumferential surface and an outer circumferential surface parallel to the first direction; After the transfer frame is moved to a surface of the film away from the substrate, the projection of the inner peripheral surface onto the first plane is located within the projection of the film onto the first plane, and the projection of the outer peripheral surface onto the first plane is located outside the projection of the film onto the first plane. Alternatively, after the transfer frame is moved to a surface of the film away from the substrate, the projection of the transfer frame on the first plane lies within the projection of the film on the first plane.

10. The film peeling method according to claim 7, characterized in that, When the transfer frame is provided, a release paper is provided on the second side of the double-sided adhesive layer; before the second side of the double-sided adhesive layer comes into contact with the surface of the film away from the substrate, the release paper on the second side is peeled off.

Images