Photoetching machine exposure task management method and device, photoetching machine and storage medium

Abstract

The invention discloses a photoetching machine exposure task management method and device, a photoetching machine and a storage medium. The method comprises the steps that in response to an exposure task starting instruction, a pre-constructed multi-dimensional task table is read from a database, and the multi-dimensional task table comprises task indexes of multiple exposure subtasks in an exposure task and task circulation indexes corresponding to the task indexes; the task circulation index represents a next to-be-executed exposure subtask of the exposure subtask corresponding to any task index; and executing each exposure subtask based on the task indexes of the plurality of exposure subtasks and the task circulation index corresponding to each task index. According to the technical scheme, the exposure tasks are sequentially circulated and executed according to the pre-configured multi-dimensional task table, so that different exposure control requirements can be met by configuring the multi-dimensional task table, the dynamic management of the exposure tasks of the photoetching machine is realized, and the flexibility of the scheduling of the exposure tasks of the photoetching machine is improved.

Description

Technical Field

[0001] This invention relates to the field of photolithography technology, and in particular to a photolithography machine exposure task management method, apparatus, photolithography machine, and storage medium. Background Technology

[0002] In the semiconductor manufacturing field, lithography machines are the core equipment for chip production, and the precise control of their exposure tasks directly determines the chip's process accuracy and yield.

[0003] Current lithography machine exposure control technology mostly relies on preset fixed processes to perform exposure operations, and the task scheduling mechanism lacks flexibility.

[0004] In the process of realizing the present invention, it was found that at least the following technical problems exist in the prior art: the above-mentioned existing lithography machine exposure control scheme has the problem of poor flexibility in task scheduling mechanism. Summary of the Invention

[0005] This invention provides a method, apparatus, lithography machine, and storage medium for managing exposure tasks in a lithography machine, thereby improving the flexibility of exposure task scheduling in a lithography machine.

[0006] According to one aspect of the present invention, a method for managing exposure tasks in a lithography machine is provided, comprising:

[0007] In response to the exposure task start command, a pre-built multidimensional task table is read from the database. The multidimensional task table includes task indexes of multiple exposure subtasks in the exposure task and a task flow index corresponding to each task index. The task flow index indicates the next exposure subtask to be executed for any given task index.

[0008] Each exposure subtask is executed based on the task index of the multiple exposure subtasks and the task flow index corresponding to each task index.

[0009] According to another aspect of the present invention, a lithography machine exposure task management device is provided, comprising:

[0010] The multidimensional task table reading module is used to read a pre-built multidimensional task table from the database in response to the exposure task start command. The multidimensional task table includes task indexes of multiple exposure sub-tasks in the exposure task and a task flow index corresponding to each task index. The task flow index indicates the next exposure sub-task to be executed for any task index corresponding to the exposure sub-task.

[0011] The exposure task execution module is used to execute each exposure subtask based on the task index of the plurality of exposure subtasks and the task flow index corresponding to each task index.

[0012] According to another aspect of the present invention, a lithography machine is provided, the lithography machine comprising:

[0013] At least one processor;

[0014] and a memory communicatively connected to the at least one processor;

[0015] The memory stores a computer program that can be executed by the at least one processor, and the computer program is executed by the at least one processor to enable the at least one processor to execute the lithography machine exposure task management method according to any embodiment of the present invention.

[0016] According to another aspect of the present invention, a computer-readable storage medium is provided, the computer-readable storage medium storing computer instructions for causing a processor to execute and implement the lithography machine exposure task management method according to any embodiment of the present invention.

[0017] The technical solution of this invention, in response to an exposure task start command, reads a pre-constructed multi-dimensional task table from a database. The multi-dimensional task table includes task indexes for multiple exposure sub-tasks within the exposure task and a task flow index corresponding to each task index. The task flow index indicates the next exposure sub-task to be executed for any given task index. Each exposure sub-task is executed based on its task index and the corresponding task flow index. This technical solution sequentially flows and executes exposure tasks according to the pre-configured multi-dimensional task table. By configuring the multi-dimensional task table, different exposure control requirements can be met, achieving dynamic management of lithography machine exposure tasks and improving the flexibility of lithography machine exposure task scheduling.

[0018] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a flowchart of a lithography machine exposure task management method according to Embodiment 1 of the present invention;

[0021] Figure 2This is a flowchart of a lithography machine exposure task management method according to Embodiment 2 of the present invention;

[0022] Figure 3 This is a flowchart of a lithography machine exposure task management method according to Embodiment 3 of the present invention;

[0023] Figure 4 This is a flowchart of a lithography machine exposure task management method according to Embodiment 4 of the present invention;

[0024] Figure 5 This is a schematic diagram of the structure of a lithography machine exposure task management system according to an embodiment of the present invention;

[0025] Figure 6 This is a flowchart of a lithography machine exposure task management method according to Embodiment 5 of the present invention;

[0026] Figure 7 This is a flowchart illustrating the creation and initiation of an exposure task according to an embodiment of the present invention;

[0027] Figure 8 This is a flowchart illustrating the processing and workflow of an exposure task according to an embodiment of the present invention;

[0028] Figure 9 This is a schematic diagram of the structure of a lithography machine exposure task management device according to Embodiment Six of the present invention;

[0029] Figure 10 This is a schematic diagram of the structure of a lithography machine that implements the lithography machine exposure task management method of this embodiment of the invention. Detailed Implementation

[0030] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0031] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be used interchangeably where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or device that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or devices. The acquisition, storage, use, and processing of data in the technical solutions of this application all comply with the relevant provisions of national laws and regulations.

[0032] Example 1

[0033] Figure 1 This is a flowchart of a lithography machine exposure task management method provided in Embodiment 1 of the present invention. This embodiment is applicable to the dynamic management of lithography machine exposure tasks. The method can be executed by a lithography machine exposure task management device, which can be implemented in hardware and / or software and can be configured within the lithography machine. Figure 1 As shown, the method includes:

[0034] S110. In response to the exposure task start command, read the pre-built multidimensional task table from the database. The multidimensional task table includes task indexes of multiple exposure sub-tasks in the exposure task and task flow indexes corresponding to each task index. The task flow indexes represent the next exposure sub-task to be executed for any given task index.

[0035] S120. Execute each exposure subtask based on the task index of the plurality of exposure subtasks and the task flow index corresponding to each task index.

[0036] The exposure task start command is used to initiate the exposure task. An exposure task can include multiple exposure subtasks, which together complete the exposure control of the lithography machine. For example, the exposure task may include, but is not limited to, subtasks such as mask transmission control task, silicon wafer transmission control task, mask alignment task, silicon wafer alignment task, and silicon wafer leveling and focusing task.

[0037] Specifically, the exposure task start command can be triggered through the human-machine interface of the lithography machine, and the lithography machine can also receive exposure task start commands sent by other devices or systems.

[0038] A multidimensional task table refers to a data table that classifies and sorts exposure subtasks according to multiple dimensions. It may include, but is not limited to, task indexes for multiple exposure subtasks and task flow indexes corresponding to each task index. The task index is used to quickly locate the corresponding exposure subtask; for example, task index 1 corresponds to the photomask control task, and task index 5 corresponds to the photomask alignment task. The task flow index indicates the next exposure subtask to be executed for any given task index. For example, task index 1 corresponds to task flow index 5, meaning that the photomask alignment task will be executed after the photomask control task is completed.

[0039] It is understandable that by using each task index and the corresponding task flow index, the automatic flow and execution of each exposure subtask can be achieved, and the orderly execution of each exposure subtask can be coordinated.

[0040] In this embodiment of the invention, the multidimensional task table can be customized through the human-machine interface of the lithography machine and stored in a database. Multidimensional task tables can also be imported from other devices into the database.

[0041] The technical solution of this invention, in response to an exposure task start command, reads a pre-constructed multi-dimensional task table from a database. The multi-dimensional task table includes task indexes for multiple exposure sub-tasks within the exposure task and a task flow index corresponding to each task index. The task flow index indicates the next exposure sub-task to be executed for any given task index. Each exposure sub-task is executed based on its task index and the corresponding task flow index. This technical solution sequentially flows and executes exposure tasks according to the pre-configured multi-dimensional task table. This allows for the configuration of the multi-dimensional task table to meet different exposure control requirements, achieving dynamic management of lithography machine exposure tasks and improving the flexibility of lithography machine exposure task scheduling.

[0042] Example 2

[0043] Figure 2This is a flowchart of a lithography machine exposure task management method provided in Embodiment 2 of the present invention. The method of this embodiment can be combined with various optional schemes in the lithography machine exposure task management method provided in the above embodiments. The lithography machine exposure task management method provided in this embodiment has been further optimized. Optionally, the multi-dimensional task table further includes: a task end flag corresponding to each task index; a task conversion flag corresponding to each task index, wherein the task end flag is used to indicate the end of the exposure subtask execution, and the task conversion flag is used to determine whether the next exposure subtask to be executed can be executed; correspondingly, the execution of each exposure subtask based on the task index of the plurality of exposure subtasks and the task flow index corresponding to each task index includes: for any task index, determining whether the next exposure subtask to be executed can be executed based on the task end flag and the task conversion flag corresponding to the task index; if the determination result is that the next exposure subtask to be executed can be executed, then each exposure subtask is executed based on the task index of the plurality of exposure subtasks and the task flow index corresponding to each task index.

[0044] like Figure 2 As shown, the method includes:

[0045] S210. In response to the exposure task start command, read the pre-built multidimensional task table from the database, wherein the multidimensional task table includes task indexes of multiple exposure sub-tasks in the exposure task, task end flags corresponding to each task index, task conversion flags corresponding to each task index, and task flow indexes corresponding to each task index.

[0046] S220. For any task index, determine whether the next exposure subtask to be executed can be executed based on the task end flag and the task convertible flag corresponding to the task index.

[0047] S230. If the determination result is that the next exposure subtask to be executed can be executed, then each exposure subtask is executed based on the task index of the plurality of exposure subtasks and the task flow index corresponding to each task index.

[0048] The task end flag indicates that the exposure subtask has ended, and the task switchable flag is used to determine whether the next exposure subtask to be executed can be executed.

[0049] In this embodiment of the invention, in order to facilitate the judgment of the flow, a task end flag and a task conversion flag are set. That is, at the end of each exposure subtask, the task end flag of the exposure subtask can be set, and the task conversion flag is used to determine whether the task flow conditions are met.

[0050] For example, the task end flag for the previous plate task can be EndLoadReticle, the task end flag for the next film task can be EndLoadWafer, and the task conversion flag can be {EndLoadReticle} or {EndLoadReticle, EndLoadWafer}. {EndLoadReticle} indicates that the next exposure subtask can be executed after the previous plate task is completed, and {EndLoadReticle, EndLoadWafer} indicates that the next exposure subtask can be executed after both the previous plate task and the next film task are completed.

[0051] Based on the above embodiments, optionally, determining whether the next exposure subtask to be executed can be executed based on the task end flag corresponding to the task index and the task conversion flag corresponding to the task index includes: if the task end flag corresponding to the task index is the same as the task conversion flag corresponding to the task index, the determination result is that the next exposure subtask to be executed can be executed; if the task end flag corresponding to the task index is different from the task conversion flag corresponding to the task index, the determination result is that the next exposure subtask to be executed cannot be executed.

[0052] For example, after the previous page task corresponding to task index 1 is completed, the task end flag of the previous page task, EndLoadReticle, can be obtained. If the task conversion flag corresponding to task index 1 is {EndLoadReticle}, it means that the task end flag corresponding to the task index is the same as the task conversion flag corresponding to the task index, and the next photomask alignment task to be executed for the previous page task can be performed. After the previous page task corresponding to task index 1 is completed, the task end flag of the previous page task, EndLoadReticle, can be obtained. After the upper-layer task corresponding to task index 2 is completed, the task end flag of the upper-layer task, EndLoadWafer, can be obtained. If the task conversion flags of both task index 1 and task index 2 are {EndLoadReticle, EndLoadWafer}, it means that the task end flag corresponding to the task index is the same as the task conversion flag corresponding to the task index, and the next photomask alignment task to be executed for both the previous page task and the upper-layer task can be performed.

[0053] The technical solution of this invention determines whether the next exposure subtask to be executed can be executed based on the task end flag and the task conversion flag corresponding to the task index. This realizes the automatic coordination and flow of exposure tasks, enabling exposure tasks to be executed according to the pre-configured multi-dimensional task table, avoiding task execution errors, and effectively improving the stability and reliability of exposure task execution.

[0054] Example 3

[0055] Figure 3 This is a flowchart of a lithography machine exposure task management method provided in Embodiment 3 of the present invention. The method of this embodiment can be combined with various optional schemes in the lithography machine exposure task management method provided in the above embodiments. The lithography machine exposure task management method provided in this embodiment has been further optimized. Optionally, the multi-dimensional task table further includes: a list of successfully transferred tasks corresponding to each task index, wherein the list of successfully transferred tasks includes a first task transfer index; a list of failed transferred tasks corresponding to each task index, wherein the list of failed transferred tasks includes a second task transfer index; correspondingly, executing each exposure sub-task based on the task index of the plurality of exposure sub-tasks and the task transfer index corresponding to each task index includes: executing each exposure sub-task based on the task index of the plurality of exposure sub-tasks, the first task transfer index corresponding to each task index, and the second task transfer index corresponding to each task index.

[0056] like Figure 3 As shown, the method includes:

[0057] S310. In response to the exposure task start command, read a pre-built multidimensional task table from the database, wherein the multidimensional task table includes task indexes of multiple exposure sub-tasks in the exposure task, a list of successful transfer tasks corresponding to each task index, wherein the list of successful transfer tasks includes a first task transfer index; and a list of failed transfer tasks corresponding to each task index, wherein the list of failed transfer tasks includes a second task transfer index.

[0058] S320. Execute each exposure subtask based on the task index of the plurality of exposure subtasks, the first task flow index corresponding to each task index, and the second task flow index corresponding to each task index.

[0059] In this embodiment of the invention, the successful task flow list refers to the list of the next exposure subtasks to be executed after the current exposure subtask has been successfully executed. It may include a first task flow index, which represents the task index of the next exposure subtask to be executed after the current exposure subtask has been successfully executed. Similarly, the failed task flow list refers to the list of the next exposure subtasks to be executed after the current exposure subtask has failed. It may include a second task flow index, which represents the task index of the next exposure subtask to be executed after the current exposure subtask has failed.

[0060] For example, after the previous version task corresponding to task index 1 is executed successfully, the task flow index corresponding to task index 1 can be obtained from the list of successful flow tasks: {5}, that is, the task index of the next exposure subtask to be executed is 5. After the previous version task corresponding to task index 1 fails to execute, the task flow index corresponding to task index 1 can be obtained from the list of failed flow tasks: {}, that is, the task index of the next exposure subtask to be executed is empty, and no exposure subtask is executed.

[0061] In some embodiments, the list of successfully transferred tasks can be changed as needed to accommodate the requirements of concurrent tasks. For example, two exposure subtasks can be executed simultaneously after the first one is completed.

[0062] Based on the above embodiments, optionally, the multidimensional task table further includes: task function pointers corresponding to each task index, wherein the task function pointers are used to point to the function that implements the exposure sub-task; correspondingly, the execution of each exposure sub-task based on the task indexes of the plurality of exposure sub-tasks and the task flow index corresponding to each task index includes: executing each exposure sub-task based on the task indexes of the plurality of exposure sub-tasks, the task flow index corresponding to each task index, and the task function pointers corresponding to each task index.

[0063] In this embodiment of the invention, the task function pointer is a pointer to the function that implements the exposure subtask, and the task function pointer can pass the function that implements the exposure subtask as data.

[0064] For example, the functional functions for implementing the exposure subtask may include, but are not limited to, the Init function, LoadReticle function, LoadWafer function, AlignReticle function, RSMove function, WSMove function, CalALGReticle function, AlignWafer function, FM Focus function, FMLeveling function, WaferFocus function, WaferLeveling function, Exposure function, Stop function, and EMO function. The lithography machine can execute the corresponding exposure subtask through these functional functions.

[0065] The `Init` function is the initialization function. The `LoadReticle` function is used for mounting the photomask. The `LoadWafer` function is used for mounting the wafer. The `AlignReticle` function is used for photomask alignment. The `RSMove` function is used to move the photomask stage. The `WSMove` function is used to move the wafer stage. The `CalALGReticle` function calculates the photomask alignment result. The `AlignWafer` function aligns the wafer. The `FM Focus` function performs FM (Fiducial Mark) focusing. The `FMLeveling` function performs FM leveling. The `WaferFocus` function performs wafer focusing, the `WaferLeveling` function performs wafer leveling, the `Exposure` function performs exposure, the `Stop` function stops the service, and the `EMO` function interrupts the service.

[0066] Based on the above embodiments, optionally, the multidimensional task table further includes: a parent task index corresponding to each task index; correspondingly, the execution of each exposure sub-task based on the task index of the plurality of exposure sub-tasks and the task flow index corresponding to each task index includes: executing each exposure sub-task based on the task index of the plurality of exposure sub-tasks, the task flow index corresponding to each task index and the parent task index corresponding to each task index.

[0067] The parent task index represents the parent task of the exposure subtask corresponding to the task index. For example, the parent task index can be 3 or -1, where -1 indicates that there is no direct parent task, that is, the exposure subtask corresponding to the current task index is the root task or an independent task in the task hierarchy.

[0068] For example, if the parent task index of task index 12 is 3, it means that the exposure subtask corresponding to task index 12 is a subtask of task index 3. For example, the exposure subtask corresponding to task index 12 is moving the photomask stage, and the exposure subtask corresponding to its parent task index 3 is photomask alignment, that is, photomask alignment is the parent task of moving the photomask stage.

[0069] It should be noted that the parent task index can flexibly maintain multi-level task management and jump between parent and child tasks and tasks at the same level.

[0070] The technical solution of this invention realizes the flow of the next exposure subtask to be executed by using the successful flow task list and the failed flow task list in the multi-dimensional task table.

[0071] Example 4

[0072] Figure 4 This is a flowchart of a lithography machine exposure task management method provided in Embodiment 4 of the present invention. The method of this embodiment can be combined with various optional schemes in the lithography machine exposure task management methods provided in the above embodiments. The lithography machine exposure task management method provided in this embodiment has been further optimized. Optionally, after reading the pre-built multidimensional task table from the database, the method further includes: parsing the multidimensional task table to obtain a multidimensional task mapping relationship; and caching the multidimensional task mapping relationship in a cache.

[0073] like Figure 4 As shown, the method includes:

[0074] S410. In response to the exposure task start command, read the pre-built multidimensional task table from the database. The multidimensional task table includes task indexes of multiple exposure sub-tasks in the exposure task and a task flow index corresponding to each task index. The task flow index indicates the next exposure sub-task to be executed for any given task index.

[0075] S420. Parse the multidimensional task table to obtain the multidimensional task mapping relationship, and cache the multidimensional task mapping relationship in the cache.

[0076] S430. Execute each exposure subtask based on the task index of the plurality of exposure subtasks and the task flow index corresponding to each task index.

[0077] The cache is used to cache the multidimensional task mapping relationship corresponding to the multidimensional task table, that is, the multidimensional task mapping relationship is the relationship between the data of each dimension in the cached multidimensional task table.

[0078] In some embodiments, the multidimensional task mapping relationship can be an unordered map from a standard library implemented using a hash table, which enables efficient random access. The unordered map may include:

[0079] 1. Mapping of task indexes with task function pointers, task end flags, and task convertibility flags;

[0080] 2. Mapping between task conversion flags and task indexes;

[0081] 3. Mapping between task completion markers and the list of successfully transferred tasks;

[0082] 4. Mapping between task completion markers and failed task transitions.

[0083] It should be noted that by preloading the multidimensional task mapping relationship corresponding to the multidimensional task table in the database through the cache, efficient and flexible exposure task management can be achieved.

[0084] For example, Figure 5 This is a schematic diagram of the structure of a lithography machine exposure task management system according to an embodiment of the present invention, such as... Figure 5 As shown, the lithography machine exposure task management system includes an external module, a database service module, a service control module, and a task execution module. The external module can be the lithography machine's human-machine interface or other devices or systems, capable of sending exposure task start commands and receiving feedback messages from the service control module. The database service module provides database services, storing pre-configured multidimensional task tables. The service control module includes a buffer and a task flow service unit. The buffer caches the multidimensional task mapping relationships corresponding to the multidimensional task tables. The task flow service unit manages tasks, enabling the discovery, coordination, and fault tolerance of multiple exposure sub-tasks. The task execution module executes exposure sub-tasks such as photomask transmission control tasks, silicon wafer transmission control tasks, photomask alignment tasks, silicon wafer alignment tasks, silicon wafer leveling and focusing tasks, and FM leveling and focusing tasks.

[0085] The technical solution of this invention can achieve efficient and flexible exposure task management by pre-loading the multi-dimensional task mapping relationship corresponding to the multi-dimensional task table in the database through a cache.

[0086] Example 5

[0087] Figure 6 This is a flowchart of a lithography machine exposure task management method provided in Embodiment 5 of the present invention. The method in this embodiment is a preferred example of the lithography machine exposure task management method provided in the above embodiments. Figure 6 As shown, the method includes:

[0088] S510, in response to the exposure task start command, reads a pre-built multidimensional task table from the database.

[0089] S520. Parse the multidimensional task table to obtain the multidimensional task mapping relationship, and cache the multidimensional task mapping relationship in the cache.

[0090] S530 executes each exposure subtask in the exposure task based on the multi-dimensional task mapping relationship in the cache.

[0091] The multidimensional task table includes task indexes for multiple exposure subtasks within the exposure task, task end flags corresponding to each task index, task conversion flags corresponding to each task index, lists of successful transition tasks corresponding to each task index, lists of failed transition tasks corresponding to each task index, task function pointers corresponding to each task index, and parent task indexes corresponding to each task index.

[0092] In this embodiment of the invention, the multidimensional task table can add or remove exposure subtasks as needed, i.e., delete or add a row of data. The task conversion flag can also be changed as needed; for example, {EndLoadReticle, EndLoadWafer} can be modified to {EndLoadReticle}.

[0093] For example, a multidimensional task table can be shown in Table 1.

[0094] Table 1

[0095]

[0096]

[0097] For example, Figure 7 This is a flowchart illustrating the creation and initiation of an exposure task according to an embodiment of the present invention. Figure 7 As shown, the creation and startup process of an exposure task includes: 1. Client creates exposure task. 1.1 Service control module initialization. 1.1.1 Task flow service unit initialization. 1.1.2 Execution result. 1.1.3 Initialization. 1.1.4 Execution result. 1.1.5 Restart. 1.1.5.1 Execution result. 1.1.6 Task initialization. 1.1.6.1 Read multidimensional task table. 1.1.6.2 Save the multidimensional task mapping relationship corresponding to the multidimensional task table to the cache. 1.1.6.2.1 Execution result. 1.1.6.2.1.1 Start task flow service. 1.1.6.2.1.2 Return.

[0098] Figure 8This is a flowchart illustrating the processing and workflow of an exposure task according to an embodiment of the present invention. Figure 8 As shown, the processing and workflow of the exposure task includes: 1. The client executes the exposure task. 1.1 Exposure. 1.1.1 Call the task index. 1.1.1.1 Obtain the initial task index. 1.1.1.2 Return to the two tasks: upload and film upload. 1.1.1.3 Upload. 1.1.1.3.1 Control device to upload. 1.1.1.3.1.1 Device executes the action. 1.1.1.3.1.2 Execution result. 1.1.1.4 Upload. 1.1.1.4.1 Control device to upload. 1.1.1.4.1.1 Device executes the action. 1.1.1.4.1.2 Execution result. 1.1.1.4.1.2.1 End film upload. 1.1.1.3.1.2.1 End upload. 1.1.1.3.1.2.1.1, Obtain the task index of the next exposure subtask to be executed. 1.1.1.3.1.2.1.1.1, Determine if the task flow conditions are met. 1.1.1.3.1.2.1.1.2, The task has not ended, but there is no task index to execute. 1.1.1.4.1.2.1.1, Obtain the task index of the next exposure subtask to be executed. 1.1.1.4.1.2.1.1.1, Determine if the task flow conditions are met. 1.1.1.4.1.2.1.1.2, The task flow conditions are met, obtain the next task to be executed: FM focusing. 1.1.1.4.1.2.1.2, FM focusing. 1.1.1.4.1.2.1.2.1, Equipment executes action. 1.1.1.4.1.2.1.2.1.1, Equipment executes action. 1.1.1.4.1.2.1.2.1.2、Execution Result。 1.1.1.4.1.2.1.2.1.2.1、End FM Focusing。 The equipment entry points include Equipment Entry 1, Equipment Entry 2, and Equipment Entry 3. Equipment Entry 1 represents the photomask control access layer, Equipment Entry 2 represents the silicon wafer control access layer, and Equipment Entry 3 represents the leveling and focusing access layer.

[0099] The technical solution of this invention uses a multi-dimensional task list to classify and sort exposure tasks according to multiple dimensions, allowing for a more comprehensive planning and execution of exposure tasks by examining them from multiple perspectives. Furthermore, by sequentially transferring and executing exposure tasks according to a pre-configured multi-dimensional task table, exposure control requirements can be met through the configuration of the multi-dimensional task table, achieving dynamic management of lithography machine exposure tasks and improving the flexibility of lithography machine exposure task scheduling.

[0100] Example 6

[0101] Figure 9 This is a schematic diagram of the structure of a lithography machine exposure task management device provided in Embodiment Six of the present invention. Figure 9 As shown, the device includes:

[0102] The multidimensional task table reading module 610 is used to read a pre-built multidimensional task table from the database in response to an exposure task start command. The multidimensional task table includes task indexes of multiple exposure sub-tasks in the exposure task and a task flow index corresponding to each task index. The task flow index indicates the next exposure sub-task to be executed for any task index corresponding to the exposure sub-task.

[0103] The exposure task execution module 620 is used to execute each exposure subtask based on the task index of the plurality of exposure subtasks and the task flow index corresponding to each task index.

[0104] The technical solution of this invention, in response to an exposure task start command, reads a pre-constructed multi-dimensional task table from a database. The multi-dimensional task table includes task indexes for multiple exposure sub-tasks within the exposure task and a task flow index corresponding to each task index. The task flow index indicates the next exposure sub-task to be executed for any given task index. Each exposure sub-task is executed based on its task index and the corresponding task flow index. This technical solution sequentially flows and executes exposure tasks according to the pre-configured multi-dimensional task table. This allows for the fulfillment of non-exposure control requirements through multi-dimensional task table configuration, achieving dynamic management of lithography machine exposure tasks and improving the flexibility of lithography machine exposure task scheduling.

[0105] In some optional implementations, the multidimensional task table further includes:

[0106] Each task index corresponds to a task end flag;

[0107] Each task index corresponds to a task conversion flag, wherein the task end flag is used to indicate that the exposure subtask has ended, and the task conversion flag is used to determine whether the next exposure subtask to be executed can be executed.

[0108] Correspondingly, the exposure task execution module 620 includes:

[0109] The flow judgment unit is used to determine, for any task index, whether the next exposure subtask to be executed can be executed based on the task end flag and the task convertible flag corresponding to the task index.

[0110] The flow execution unit is used to execute each exposure subtask based on the task index of the plurality of exposure subtasks and the task flow index corresponding to each task index if the determination result is that the next exposure subtask to be executed can be executed.

[0111] In some optional implementations, the flow determination unit may specifically be used for:

[0112] If the task end flag corresponding to the task index is the same as the task convertible flag corresponding to the task index, then the determination result is the next exposure subtask to be executed that can be executed.

[0113] If the task end flag corresponding to the task index is different from the task conversion flag corresponding to the task index, the result is that the next exposure subtask to be executed cannot be executed.

[0114] In some optional implementations, the multidimensional task table further includes:

[0115] Each task index corresponds to a list of successfully processed tasks, wherein the list of successfully processed tasks includes the first task processing index;

[0116] Each task index corresponds to a list of failed task flows, wherein the list of failed task flows includes a second task flow index;

[0117] Correspondingly, the exposure task execution module 620 can be used specifically for:

[0118] Each exposure subtask is executed based on the task index of the plurality of exposure subtasks, the first task flow index corresponding to each task index, and the second task flow index corresponding to each task index.

[0119] In some optional implementations, the multidimensional task table further includes:

[0120] Each task index corresponds to a task function pointer, wherein the task function pointer is used to point to the function that implements the exposure subtask;

[0121] Correspondingly, the exposure task execution module 620 can be used specifically for:

[0122] Each exposure subtask is executed based on the task index of the multiple exposure subtasks, the task flow index corresponding to each task index, and the task function pointer corresponding to each task index.

[0123] In some optional implementations, the multidimensional task table further includes:

[0124] Each task index corresponds to a parent task index, wherein the parent task index represents the parent task of the exposure subtask corresponding to the task index;

[0125] Correspondingly, the exposure task execution module 620 can be used specifically for:

[0126] Each exposure subtask is executed based on the task index of the multiple exposure subtasks, the task flow index corresponding to each task index, and the parent task index corresponding to each task index.

[0127] In some optional embodiments, the lithography machine exposure task management device further includes:

[0128] The multidimensional task table parsing module is used to parse the multidimensional task table to obtain the multidimensional task mapping relationship;

[0129] A multidimensional task mapping relationship caching module is used to cache the multidimensional task mapping relationship in a cache.

[0130] The lithography machine exposure task management device provided in this embodiment of the invention can execute the lithography machine exposure task management method provided in any embodiment of the invention, and has the corresponding functional modules and beneficial effects of the method execution.

[0131] Example 7

[0132] Figure 10 A schematic diagram of the structure of a lithography machine 10 that can be used to implement an embodiment of the present invention is shown. Figure 10 As shown, the lithography machine 10 includes at least one processor 11 and a memory, such as a read-only memory (ROM) 12 and a random access memory (RAM) 13, communicatively connected to the at least one processor 11. The memory stores computer programs executable by the at least one processor. The processor 11 can perform various appropriate actions and processes based on the computer program stored in the ROM 12 or loaded from storage unit 18 into the RAM 13. The RAM 13 can also store various programs and data required for the operation of the lithography machine 10. The processor 11, ROM 12, and RAM 13 are interconnected via a bus 14. An I / O interface 15 is also connected to the bus 14.

[0133] Multiple components in the lithography machine 10 are connected to the I / O interface 15, including: an input unit 16, such as a keyboard, mouse, etc.; an output unit 17, such as various types of displays, speakers, etc.; a storage unit 18, such as a disk, optical disk, etc.; and a communication unit 19, such as a network card, modem, wireless transceiver, etc. The communication unit 19 allows the lithography machine 10 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.

[0134] Processor 11 can be a variety of general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. Processor 11 performs the various methods and processes described above, such as a lithography machine exposure task management method, which includes:

[0135] In response to the exposure task start command, a pre-built multidimensional task table is read from the database. The multidimensional task table includes task indexes of multiple exposure subtasks in the exposure task and a task flow index corresponding to each task index. The task flow index indicates the next exposure subtask to be executed for any given task index.

[0136] Each exposure subtask is executed based on the task index of the multiple exposure subtasks and the task flow index corresponding to each task index.

[0137] In some embodiments, the lithography machine exposure task management method can be implemented as a computer program tangibly contained in a computer-readable storage medium, such as storage unit 18. In some embodiments, part or all of the computer program can be loaded and / or mounted onto the lithography machine 10 via ROM 12 and / or communication unit 19. When the computer program is loaded into RAM 13 and executed by processor 11, one or more steps of the lithography machine exposure task management method described above can be performed. Alternatively, in other embodiments, processor 11 can be configured to perform the lithography machine exposure task management method by any other suitable means (e.g., by means of firmware).

[0138] Various embodiments of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), system-on-a-chip (SoCs), complex programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments may include implementations in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which may be a dedicated or general-purpose programmable processor, capable of receiving data and instructions from a storage system, at least one input device, and at least one output device, and transmitting data and instructions to the storage system, the at least one input device, and the at least one output device.

[0139] Computer programs used to implement the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when executed by the processor, the computer programs cause the functions / operations specified in the flowcharts and / or block diagrams to be performed. The computer programs may be executed entirely on a machine, partially on a machine, or as a standalone software package, partially on a machine and partially on a remote machine, or entirely on a remote machine or server.

[0140] In the context of this invention, a computer-readable storage medium can be a tangible medium that may contain or store a computer program for use by or in conjunction with an instruction execution system, apparatus, or device. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination thereof. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. More specific examples of machine-readable storage media include electrical connections based on one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof.

[0141] To provide user interaction, the systems and techniques described herein can be implemented on a lithography machine having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user provides input to the lithography machine. Other types of devices can also be used to provide user interaction; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including sound input, voice input, or tactile input).

[0142] The systems and technologies described herein can be implemented in computing systems that include backend components (e.g., as data servers), or middleware components (e.g., application servers), or frontend components (e.g., user computers with graphical user interfaces or web browsers through which users can interact with implementations of the systems and technologies described herein), or any combination of such backend, middleware, or frontend components. The components of the system can be interconnected via digital data communication of any form or medium (e.g., communication networks). Examples of communication networks include local area networks (LANs), wide area networks (WANs), blockchain networks, and the Internet.

[0143] A computing system can include clients and servers. Clients and servers are generally located far apart and typically interact through communication networks. The client-server relationship is created by computer programs running on the respective computers and having a client-server relationship with each other. The server can be a cloud server, also known as a cloud computing server or cloud host, which is a hosting product within the cloud computing service system to address the shortcomings of traditional physical hosts and VPS services, such as high management difficulty and weak business scalability.

[0144] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0145] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A method for managing exposure tasks in a lithography machine, characterized in that, include: In response to the exposure task start command, a pre-built multidimensional task table is read from the database. The multidimensional task table includes task indexes of multiple exposure subtasks in the exposure task and a task flow index corresponding to each task index. The task flow index indicates the next exposure subtask to be executed for any given task index. Each exposure subtask is executed based on the task index of the multiple exposure subtasks and the task flow index corresponding to each task index.

2. The method according to claim 1, characterized in that, The multidimensional task table also includes: Each task index corresponds to a task end flag; Each task index corresponds to a task conversion flag, wherein the task end flag is used to indicate that the exposure subtask has ended, and the task conversion flag is used to determine whether the next exposure subtask to be executed can be executed. Accordingly, executing each exposure subtask based on the task index of the plurality of exposure subtasks and the task flow index corresponding to each task index includes: For any task index, determine whether the next exposure subtask to be executed can be executed based on the task end flag and the task convertible flag corresponding to the task index. If the determination result is that the next exposure subtask to be executed can be executed, then each exposure subtask is executed based on the task index of the plurality of exposure subtasks and the task flow index corresponding to each task index.

3. The method according to claim 2, characterized in that, The step of determining whether the next exposure subtask to be executed can be executed based on the task end flag corresponding to the task index and the task convertibility flag corresponding to the task index includes: If the task end flag corresponding to the task index is the same as the task convertible flag corresponding to the task index, then the determination result is the next exposure subtask to be executed that can be executed. If the task end flag corresponding to the task index is different from the task conversion flag corresponding to the task index, the result is that the next exposure subtask to be executed cannot be executed.

4. The method according to claim 1, characterized in that, The multidimensional task table also includes: Each task index corresponds to a list of successfully processed tasks, wherein the list of successfully processed tasks includes the first task processing index; Each task index corresponds to a list of failed task flows, wherein the list of failed task flows includes a second task flow index; Accordingly, executing each exposure subtask based on the task index of the plurality of exposure subtasks and the task flow index corresponding to each task index includes: Each exposure subtask is executed based on the task index of the plurality of exposure subtasks, the first task flow index corresponding to each task index, and the second task flow index corresponding to each task index.

5. The method according to claim 1, characterized in that, The multidimensional task table also includes: Each task index corresponds to a task function pointer, wherein the task function pointer is used to point to the function that implements the exposure subtask; Accordingly, executing each exposure subtask based on the task index of the plurality of exposure subtasks and the task flow index corresponding to each task index includes: Each exposure subtask is executed based on the task index of the multiple exposure subtasks, the task flow index corresponding to each task index, and the task function pointer corresponding to each task index.

6. The method according to claim 1, characterized in that, The multidimensional task table also includes: Each task index corresponds to a parent task index, wherein the parent task index represents the parent task of the exposure subtask corresponding to the task index; Accordingly, executing each exposure subtask based on the task index of the plurality of exposure subtasks and the task flow index corresponding to each task index includes: Each exposure subtask is executed based on the task index of the multiple exposure subtasks, the task flow index corresponding to each task index, and the parent task index corresponding to each task index.

7. The method according to claim 1, characterized in that, After reading the pre-built multidimensional task table from the database, the following is also included: The multidimensional task table is parsed to obtain the multidimensional task mapping relationship; The multidimensional task mapping relationship is cached in the cache.

8. A photolithography machine exposure task management device, characterized in that, include: The multidimensional task table reading module is used to read a pre-built multidimensional task table from the database in response to the exposure task start command. The multidimensional task table includes task indexes of multiple exposure sub-tasks in the exposure task and a task flow index corresponding to each task index. The task flow index indicates the next exposure sub-task to be executed for any task index corresponding to the exposure sub-task. The exposure task execution module is used to execute each exposure subtask based on the task index of the plurality of exposure subtasks and the task flow index corresponding to each task index.

9. A lithography machine, characterized in that, The lithography machine includes: At least one processor; and a memory communicatively connected to the at least one processor; The memory stores a computer program that can be executed by the at least one processor, which is then executed by the at least one processor to enable the at least one processor to perform the lithography machine exposure task management method according to any one of claims 1-7.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer instructions that cause a processor to execute the lithography machine exposure task management method according to any one of claims 1-7.

Images