Anti-scalding and anti-falling device for computer intelligent manufacturing mainboard label

Abstract

The invention relates to a computer intelligent manufacturing mainboard label sticking anti-scalding and anti-falling device which is arranged on a host circuit board and comprises a dustproof plate, label sticking paper and an air bag compacting mechanism. The dustproof plate is mounted at the top of the host circuit board, and the label sticker is mounted on the dustproof plate through the air bag compaction mechanism; the air bag compaction mechanism comprises a built-in ring, a pasting layer and a heat absorption assembly. The built-in rings are fixed to the two sides of the label sticker, the pasting layer and the heat absorption assembly are installed on the two opposite sides of the built-in rings respectively, the built-in rings are fixed to the dustproof plate through the pasting layer, and the heat absorption assembly is used for heat dissipation of the pasting layer. Compared with the prior art, the invention has the advantages of long service life of the adhesive layer, reliable fixation of the label sticker, compact and reliable structure and the like.

Description

Technical Field

[0001] This invention relates to the field of computer labeling technology, and in particular to a device for preventing the label from being burned and falling off on a computer intelligent manufacturing motherboard. Background Technology

[0002] The purpose of labels is to clearly identify and distinguish different items or categories. They can be used in various settings, such as workplaces, laboratories, and homes. By using labels, it is easier to understand the name, purpose, precautions, and other information of items, which helps improve work efficiency, ensure safety, and facilitate management.

[0003] Using an adhesive backing to adhere the label to the object is a relatively traditional method. However, this traditional method has a drawback: when some labels are applied to the motherboard, the heat generated by the motherboard can cause the adhesive to become less viscous and form air bubbles. This reduced viscosity or buildup of air bubbles can weaken the label's adhesion, making it easy for the label to detach from the motherboard and fall off.

[0004] For example, the invention disclosed in publication number CN116661555A discloses a device for preventing the heat-induced roll-off of computer motherboard labels based on intelligent manufacturing. The device includes a motherboard, characterized in that: a label is disposed at the bottom of the motherboard, a tightening mechanism is disposed below the label, a heating block is fixedly installed inside the tightening mechanism, a heating chamber is formed inside the heating block, a pressing plate is slidably connected inside the heating chamber, air inflators are fixedly connected to both sides of the heating chamber, a winding tube is fixedly connected to the side of the air inflators away from the heating chamber, a pressing wheel is slidably connected to the side of the winding tube away from the heating chamber, and a buffer mechanism is disposed inside the tightening mechanism. However, this method of venting air bubbles generated in the adhesive layer and pressing the adhesive layer cannot solve the problem of high-temperature failure of the adhesive material, and the service life of the adhesive layer is still relatively short.

[0005] Therefore, it is necessary to provide a new computer intelligent manufacturing motherboard label anti-scalding roll-off device that improves viscosity recovery speed and avoids adhesive layer failure to solve the above-mentioned technical problems. Summary of the Invention

[0006] The purpose of this invention is to overcome the shortcomings of the prior art, which cannot effectively prevent the adhesive layer material from losing its adhesiveness due to temperature rise, resulting in a shortened lifespan and the label falling off, and to provide a computer intelligent manufacturing motherboard label anti-heat roll-off device.

[0007] The objective of this invention can be achieved through the following technical solutions: A computer intelligent manufacturing motherboard label anti-scalding roll-off device is installed on the host circuit board. The device includes a dustproof plate, a label sticker and an airbag compaction mechanism. The dustproof plate is installed on top of the main circuit board, and the label sticker is installed on the dustproof plate by an airbag compaction mechanism; the airbag compaction mechanism includes a built-in ring, an adhesive layer, and a heat-absorbing component; The built-in ring is fixed on both sides of the label sticker, and the adhesive layer and heat-absorbing component are respectively installed on opposite sides of the built-in ring. The built-in ring is fixed to the dustproof plate by the adhesive layer, and the heat-absorbing component is used for heat dissipation of the adhesive layer.

[0008] Preferably, one side of the built-in ring is provided with a receiving groove, the opening end of the receiving groove is provided with an annular cavity, and the bottom of the annular cavity is provided with a through hole communicating with the receiving groove; The heat absorption assembly includes a convex sphere, a small spherical airbag, and a pressure relief unit. The convex sphere is a hemispherical shell structure. The open end of the convex sphere is fixed to the open end of the receiving groove to form a receiving cavity. A phase change energy storage unit is provided in the receiving cavity. The small spherical airbag is covered on the through hole and located in the annular cavity. The pressure relief unit is installed in the through hole and is used to control the connection and disconnection between the small spherical airbag and the receiving cavity.

[0009] Preferably, the through hole includes a T-shaped mounting hole and an air inlet that are interconnected and vertically arranged, the T-shaped mounting hole is connected to the receiving groove, and the air inlet is connected to the small ball airbag; The pressure relief unit includes a piston block, an elastic reset member, and a sealing ring. The piston block is slidably installed in a T-shaped mounting hole. The sealing ring is disposed on the side wall of the piston block and the T-shaped mounting hole. One end of the elastic reset member is fixed in the T-shaped mounting hole, and the other end is connected to the piston block. In the initial state, the piston block is located between the T-shaped mounting hole and the air inlet; when the pressure in the receiving cavity reaches a preset value, the piston block moves, and the T-shaped mounting hole and the air inlet connect.

[0010] Preferably, the elastic reset element includes a sealing block, a stop rod, and a reset spring; The piston block has a mounting hole along the moving direction. The return spring is coaxially fixed in the mounting hole. The abutment rod is connected to the sealing block to form a T-shaped rod. The T-shaped rod passes through the interior of the return spring, and one end of the T-shaped rod abuts against the movable end of the return spring, while the other end is fixed in the T-shaped mounting hole. When the pressure in the receiving cavity reaches a preset value, the return spring is compressed as the piston block moves.

[0011] Preferably, the annular cavity is provided with multiple through holes, each through hole is covered with a small ball airbag, each small ball airbag is connected through a pressure relief channel, and the pressure relief channel is connected to the receiving cavity through a pressure relief valve.

[0012] Preferably, the phase change temperature of the phase change energy storage unit is lower than the failure temperature of the adhesive layer.

[0013] Preferably, the built-in ring is connected to the label sticker via a connecting strip, and the built-in ring, connecting strip, and label sticker are integrally injection molded, with the annular cavity and convex sphere being an integral injection molded part.

[0014] Preferably, the airbag compaction mechanism further includes a raised band located on top of the label sticker, and the label sticker has thickened corners at all four corners.

[0015] Preferably, the main circuit board has a base plate on the side opposite to the dustproof plate, and the dustproof plate is connected to the base plate through an expansion snap-fit ​​structure.

[0016] Preferably, the expansion snap-fit ​​structure includes a connecting post and a first post and a second post with the same structure and a snap-fit, wherein the snap-fit ​​has a protrusion and a telescopic rod; The first column and the second column are respectively threaded onto the two ends of the connecting column. The telescopic rod is movably fixed on the first column. The protrusion is fixed on the telescopic rod. The protrusion has a fan-shaped structure. The arc sides of the protrusions of the first column and the second column are arranged opposite to each other.

[0017] Compared with the prior art, the present invention has the following advantages: (1) In this solution, a dustproof plate is installed on one side of the main circuit board, and an inner ring is set on both sides of the label sticker. An adhesive layer is pasted on one side of the inner ring and the inner ring is pasted on the dustproof plate. A heat-absorbing component is set on the other side of the inner ring, which can dissipate heat and cool the adhesive layer when the main circuit board heats up, thereby avoiding the adhesive layer from bubbling and curling due to heat, resulting in low adhesion of the adhesive layer and the label sticker falling off, effectively extending the service life of the adhesive layer.

[0018] (2) The convex sphere and the receiving groove in this design form a sealed receiving cavity. With the precise layout of the T-shaped through hole, the phase change energy storage unit, the small spherical airbag and the pressure relief unit are integrated and installed. This meets the batch assembly requirements of intelligent manufacturing and does not occupy too much space on the motherboard. The structure is compact. The phase change energy storage unit in the receiving cavity can delay the temperature rise through phase change heat absorption and reduce the gas expansion rate. The pressure relief unit adopts a combination structure of piston block and elastic reset component. With the help of the on / off control of the T-shaped mounting hole and the air inlet, the automatic pressure adjustment triggered by the preset air pressure value is realized. This ensures the sealing and compaction effect under normal working conditions and can respond quickly to pressure relief.

[0019] (3) The annular cavity of this design features multiple through holes paired with independent small spherical airbags, which are connected through a pressure relief channel. This not only expands the gas capacity redundancy but also achieves uniform pressure distribution, preventing the rupture of a single airbag due to overload. At the same time, the pressure relief channel is linked with the pressure relief valve, forming a dual protection of distributed pressure bearing and centralized pressure relief, which greatly improves the stability and efficiency of overpressure response. The phase change temperature of the phase change energy storage unit is lower than the failure temperature of the adhesive layer. By prioritizing phase change heat absorption, the temperature rise is suppressed, reducing the gas expansion amplitude from the source and preventing the adhesive layer from losing its adhesiveness due to high temperature, thus firmly adhering to the core requirement of preventing the label from falling off. The overall design not only strengthens the pressure relief redundancy through the multi-airbag and multi-channel structure but also protects the functions of key components through precise temperature adaptation, fully adapting to the high-temperature working scenarios of the motherboard, taking into account both structural stability and practical applicability, and meeting the batch application needs of intelligent manufacturing.

[0020] (4) This solution achieves a stable connection between the dustproof plate and the base plate through an extended snap-fit ​​structure, forming a wrap-around protection for the main circuit board. This not only improves the overall assembly integrity of the device but also prevents component displacement during use, providing structural support for label anti-scalding and anti-detachment. The first and second columns are installed at both ends of the connecting column by threads, allowing for flexible adjustment of the overall length to accommodate main circuit boards of different sizes. The combination of threaded connection and snap-fit ​​structure allows for disassembly and assembly without complex tools, making it suitable for batch assembly scenarios in intelligent manufacturing. The overall structural design is simple and the stress is evenly distributed, ensuring connection reliability without affecting the normal heat dissipation of the main board and the assembly of other components, achieving a balance between installation practicality and scenario adaptability. Attached Figure Description

[0021] Figure 1 A schematic diagram of a preferred embodiment of the computer intelligent manufacturing motherboard label anti-scalding roll-off device provided by the present invention; Figure 2 for Figure 1 The diagram shows the structure of the label sticker. Figure 3 for Figure 2 A cross-sectional view of the internal structure of the built-in ring shown; Figure 4 for Figure 3 Enlarged structural diagram at point A; Figure 5 for Figure 1 A schematic diagram of the expansion card connection mechanism.

[0022] The diagram shows the following components: 1. Main circuit board; 2. Dustproof plate; 3. Label sticker; 4. Airbag compaction mechanism; 41. Raised strip; 42. Internal ring; 43. Raised sphere; 44. Adhesive layer; 45. Small ball airbag; 46. Air inlet; 47. Receiving groove; 5. Thickened corners; 6. Expansion latching mechanism; 61. First column; 62. Second column; 63. Connecting column; 64. Raised block; 65. Telescopic rod; 7. Base plate; 8. Piston block; 9. Sealing ring; 10. Sealing block; 11. Support rod; 12. Return spring. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0024] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0025] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0026] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of this invention is usually placed during use. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0027] It should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0028] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0029] Example 1 like Figure 1 and Figure 2 As shown, this embodiment provides a computer intelligent manufacturing motherboard label anti-scalding roll-off device, which is installed on the host circuit board 1. The device includes a dustproof plate 2, a label sticker 3 and an airbag compaction mechanism 4. The dustproof plate 2 is installed on the top of the main circuit board 1, and the label sticker 3 is installed on the dustproof plate 2 by the airbag compaction mechanism 4; the airbag compaction mechanism 4 includes an internal ring 42, an adhesive layer 44 and a heat-absorbing component; The built-in ring 42 is fixed on both sides of the label sticker 3. The adhesive layer 44 and the heat absorption component are respectively installed on opposite sides of the built-in ring 42. The built-in ring 42 is fixed to the dustproof plate 2 through the adhesive layer 44. The heat absorption component is used to dissipate heat from the adhesive layer 44.

[0030] A dustproof plate 2 is installed on one side of the main circuit board 1. Built-in rings 42 are provided on both sides of the label sticker 3, and an adhesive layer 44 is pasted onto one side of each built-in ring 42. The built-in rings 42 are then attached to the dustproof plate 2. A heat-absorbing component is provided on the other side of the built-in rings 42. This component dissipates heat from the adhesive layer 44 when the main circuit board 1 heats up, preventing the adhesive layer 44 from bubbling and curling due to heat, which would result in low adhesion and label sticker detachment. This effectively extends the service life of the adhesive layer.

[0031] Preferred implementation methods, such as Figure 3 As shown, a receiving groove 47 is provided on one side of the built-in ring 42, and an annular cavity is provided around the opening end of the receiving groove 47. A through hole communicating with the receiving groove 47 is provided at the bottom of the annular cavity. The heat absorption assembly includes a convex sphere 43, a small spherical airbag 45, and a pressure relief unit. The convex sphere 43 is a hemispherical shell structure. The open end of the convex sphere 43 is fixed to the open end of the receiving groove 47 to form a receiving cavity. A phase change energy storage unit is provided in the receiving cavity. The small spherical airbag 45 is covered on the through hole and located in the annular cavity. The pressure relief unit is installed in the through hole and is used to control the opening and closing of the small spherical airbag 45 and the receiving cavity.

[0032] Furthermore, the through hole includes a T-shaped mounting hole and an air inlet 46 that are interconnected and vertically arranged. The T-shaped mounting hole is connected to the receiving groove 47, and the air inlet 46 is connected to the small ball airbag 45. The pressure relief unit includes a piston block 8, an elastic reset member, and a sealing ring 9. The piston block 8 is slidably installed in the T-shaped mounting hole. The sealing ring 9 is provided on the side wall of the piston block 8 and the T-shaped mounting hole. One end of the elastic reset member is fixed in the T-shaped mounting hole, and the other end is connected to the piston block 8. In the initial state, the piston block 8 is located between the T-shaped mounting hole and the air inlet 46; when the pressure in the receiving cavity reaches the preset value, the piston block 8 moves, and the T-shaped mounting hole and the air inlet 46 are connected.

[0033] The elastic reset component includes a sealing block 10, a stop rod 11, and a reset spring 12. The piston block 8 has a mounting hole along the moving direction. The return spring 12 is coaxially fixed in the mounting hole. The abutment rod 11 is connected to the sealing block 10 to form a T-shaped rod. The T-shaped rod passes through the interior of the return spring 12, and one end of the T-shaped rod abuts against the movable end of the return spring 12, while the other end is fixed in the T-shaped mounting hole. When the pressure in the receiving cavity reaches the preset value, the return spring 12 is compressed as the piston block 8 moves.

[0034] The convex sphere and the receiving groove form a sealed receiving cavity. Combined with the precise layout of the T-shaped through holes, this allows for the integrated installation of the phase change energy storage unit, the small spherical airbag, and the pressure relief unit. This design is suitable for the batch assembly requirements of intelligent manufacturing, while minimizing the space occupied by the mainboard, resulting in a compact structure. The phase change energy storage unit within the receiving cavity can slow down temperature rise and reduce the gas expansion rate through phase change heat absorption. The pressure relief unit employs a combination of a piston block and an elastic reset component. By controlling the opening and closing of the T-shaped mounting hole and the air inlet, it achieves automatic pressure regulation triggered by a preset air pressure value, ensuring both effective sealing and compaction under normal operating conditions and rapid pressure relief response.

[0035] In the preferred embodiment, the annular cavity is provided with multiple through holes, and each through hole is covered with a small ball airbag 45. Each small ball airbag 45 is connected through a pressure relief channel, and the pressure relief channel is connected to the receiving cavity through a pressure relief valve.

[0036] The annular cavity has multiple through holes and independent small spherical airbags, which are connected by a pressure relief channel. This not only increases the gas capacity redundancy but also achieves uniform pressure distribution, preventing the rupture of a single airbag due to overload. At the same time, the pressure relief channel is linked with the pressure relief valve, forming a dual protection of distributed pressure bearing and centralized pressure relief, which greatly improves the stability and efficiency of overpressure response.

[0037] In this embodiment, the phase change temperature of the phase change energy storage unit is lower than the failure temperature of the adhesive layer 44.

[0038] The phase change energy storage unit's phase change temperature is lower than the adhesive layer's failure temperature. By prioritizing phase change heat absorption, it suppresses temperature rise, reducing gas expansion at the source and preventing the adhesive layer from losing its stickiness due to high temperatures, thus firmly upholding the core requirement of preventing label detachment. The overall design enhances pressure relief redundancy through a multi-airbag, multi-channel structure, while precise temperature adaptation protects key components, fully adapting to high-temperature operating scenarios on the motherboard. It balances structural stability with practical applicability, meeting the mass application needs of intelligent manufacturing.

[0039] In this embodiment, the built-in ring 42 is connected to the label sticker 3 via a connecting strip. The built-in ring 42, the connecting strip, and the label sticker 3 are integrally injection molded, and the annular cavity and the convex sphere 43 are injection molded as a single unit. This integrated injection molding design offers significant advantages. The built-in ring, connecting strip, and label sticker are integrally molded, and the annular cavity and convex sphere are injection molded simultaneously. This eliminates assembly gaps between components, preventing loosening and detachment under high temperatures or vibration, and simplifies the production process, adapting to the mass production needs of intelligent manufacturing and improving production efficiency.

[0040] In this embodiment, the airbag compaction mechanism 4 also includes a raised strip 41, which is located on the top of the label sticker 3. The label sticker 4 has thickened corner edges 5 at all four corners. This targeted adhesion strengthening structure increases the contact friction between the label sticker and the motherboard, while the thickened corner edges strengthen the structural strength of easily detachable areas, effectively dispersing the influence of external forces and heat on the label, preventing it from curling or falling off, and further consolidating the adhesion effect. The overall design balances structural integrity and functional practicality. Integrated molding ensures long-term stability, and the raised strips and thickened corner edges enhance the core adhesion function, adapting to both motherboard operating scenarios and meeting the engineering requirements of mass production. In conjunction with the above preferred embodiments, this embodiment also provides a computer intelligent manufacturing motherboard label anti-scalding and roll-off device, including a dustproof plate 2 disposed on the top of the host circuit board 1, a label sticker 3 disposed inside the dustproof plate 2, an airbag compaction mechanism 4 disposed on both sides of the label sticker 3, thickened corner 5 disposed at the four corners of the label sticker 3, a base plate 7 disposed at the bottom of the host circuit board 1, and an expansion snap-fit ​​mechanism 6 disposed between the dustproof plate 2 and the base plate 7. The airbag compaction mechanism 4 is used to press out the air bubbles generated by heat to improve the adhesion, and the expansion snap-fit ​​mechanism 6 is used to snap the dustproof plate 2 and the base plate 7 onto the outside of the host circuit board 1.

[0041] In the specific implementation process, such as Figure 1 and Figure 2 As shown, the airbag compaction mechanism 4 includes a raised band 41, the bottom of which is attached to the top of the label sticker 3.

[0042] refer to Figure 1 and Figure 2As shown, the label sticker 3 is connected to both sides by connecting strips, and one end of the connecting strip is connected to an internal ring 42. The top of the internal ring 42 is provided with a convex sphere 43, and the inside of the internal ring 42 is provided with a cavity, and the cavity is provided with a paraffin-based composite phase change material. The bottom of the internal ring 42 is provided with an adhesive layer 44. By incorporating a paraffin-based composite phase change material within the built-in ring 42, the paraffin-based composite phase change material can absorb the heat generated by the main circuit board 1. At the same time, the design of the raised strip 41 and the thickened corners 5 can effectively increase the friction between the label sticker 3 and the main circuit board 1, thereby reducing the likelihood of the label sticker 3 falling off the main circuit board 1. This can effectively achieve the connection between the airbag compaction mechanism 4 and the label sticker 3, and can also effectively cool and buffer the built-in ring 42, thereby extending the service life of the built-in ring 42.

[0043] refer to Figure 2 and Figure 3 As shown, multiple small spherical airbags 45 are provided on the outer side of the built-in ring 42. The interior of the small spherical airbags 45 is connected to the interior of the built-in ring 42. An air inlet 46 is provided inside the built-in ring 42. When the paraffin-based composite phase change material inside the built-in ring 42 is heated and expands, gas can enter the interior of the small spherical airbags 45 through the air inlet 46, causing the small spherical airbags 45 to deform.

[0044] It should be noted that: the outer side of the built-in ring 42 and the connecting strip are integral parts, the connecting strip and the label sticker 3 are injection molded integral parts, the convex sphere 43 and the built-in ring 42 are injection molded integral parts, the interior of the convex sphere 43 is filled with paraffin-based composite phase change material, and the top of the adhesive layer 44 is adhered to the bottom of the built-in ring 42.

[0045] refer to Figure 2 and Figure 3 As shown, the inner ring 42 has a cavity, and a piston block 8 is provided inside the cavity. A sealing ring 9 is provided on the outside of the piston block 8, and a sealing block 10 is provided inside the piston block 8. A return spring 12 is connected to one side of the sealing block 10, and a stop rod 11 is connected inside the cavity of the inner ring 42.

[0046] The piston block 8 is embedded inside the cavity of the built-in ring 42. The outer side of the piston block 8 is slidably connected to the inner wall of the cavity. The sealing ring 9 is sleeved on the outer side of the piston block 8. The two ends of the return spring 12 are welded and fixed to one side of the piston block 8 and the sealing block 10, respectively.

[0047] Example 2 This embodiment is basically the same as Embodiment 1, except that, as follows: Figure 1 and Figure 5 As shown, in this embodiment, the host circuit board 1 has a base plate 7 on the side opposite to the dustproof plate 2, and the dustproof plate 2 is connected to the base plate 7 through an expansion snap-fit ​​structure 6.

[0048] Furthermore, the extended snap-fit ​​structure 6 includes a connecting post 63 and a first post 61 and a second post 62 with the same structure and a snap fastener. The snap fastener has a protrusion 64 and a telescopic rod 65. The first column 61 and the second column 62 are respectively threaded onto the two ends of the connecting column 63. The telescopic rod 65 is movably fixed on the first column 61. The protrusion 64 is fixed on the telescopic rod 65. The protrusion 64 has a fan-shaped structure, and the arc sides of the protrusion 64 of the first column 61 and the second column 62 are arranged opposite to each other.

[0049] refer to Figure 1 and Figure 5 As shown, the expansion card mechanism 6 includes a first column 61, an internal connecting column 63, and a second column 62 connected to the bottom of the connecting column 63. Specifically, by setting a connecting post 63 on the top of the second post 62, when the thickness of the main circuit board 1 is greater than the length of the first post 61 and the second post 62, the first post 61 can be rotated along the outside of the connecting post 63 by rotating the second post 62, thereby increasing the distance between the first post 61 and the second post 62.

[0050] refer to Figure 1 and Figure 5 As shown, both the first column 61 and the second column 62 have protrusions 64 inside. The protrusions 64 are connected to telescopic rods 65 inside. A spring is sleeved on the outside of the top rod of the telescopic rod 65, and one end of the spring is connected to one side of the protrusion 64. The outer sides of the dustproof plate 2 and the bottom plate 7 are both snapped and fixed to the outer side of the protrusions 64.

[0051] By providing a telescopic rod 65 on one side of the protrusion 64, the stability of the protrusion 64 during movement can be improved when it retracts into the first column 61 and the second column 62 under force. The spring can further improve the buffering effect of the protrusion 64 and enhance its stability.

[0052] It should be noted that: the interior of the first column 61 is threadedly connected to the outer side of the connecting column 63, the interior of the protrusion 64 is threadedly connected to the outer side of the top rod of the telescopic rod 65, the spring is embedded between the protrusion 64 and the telescopic rod 65, and one end of the sleeve in the telescopic rod 65 is integrally cast with the inner cavity of the first column 61 and the second column 62.

[0053] The dustproof plate and base plate are securely connected via an extended snap-fit ​​structure, forming a protective enclosure for the main circuit board. This improves the overall assembly integrity of the device and prevents component displacement during use, while also providing structural support for label protection against heat and detachment. The first and second columns are threaded onto both ends of the connecting column, allowing for flexible length adjustment to accommodate different sized main circuit boards. The combination of threaded connection and snap-fit ​​structure enables assembly and disassembly without complex tools, making it suitable for mass assembly scenarios in smart manufacturing. The overall structural design is simple and distributes stress evenly, ensuring reliable connection without affecting the motherboard's heat dissipation or the assembly of other components, achieving a balance between practicality and scenario adaptability.

[0054] The working principle of the computer-aided intelligent manufacturing motherboard label anti-scalding roll-off device provided in this embodiment is as follows: In use, the adhesive layer 44 at the bottom of the built-in ring 42 is peeled off, and the label sticker 3 is applied to the top of the main circuit board 1. Then, the dustproof plate 2 is placed on top of the label sticker 3, so that the through holes of the dustproof plate 2 are aligned with each convex ball 43, and the outer side of the convex ball 43 is in contact with the inside of the dustproof plate 2. Then, the base plate 7 is placed at the bottom of the main circuit board 1, and the first pillar 61 and the second pillar 62 are inserted into the base plate 7 and the dustproof plate 2. When it is necessary to adjust the length of the first pillar 61 and the second pillar 62, By rotating the first column 61, it moves along the outside of the connecting column 63, thus expanding the distance between the first column 61 and the second column 62. When the protrusion 64 on the outside of the first column 61 and the second column 62 contacts the dustproof plate 2 and the base plate 7, the protrusion 64 presses against the spring and telescopic rod 65 on one side, and the protrusion 64 retracts back into the first column 61 and the second column 62. The protrusion 64 can be separated from the top rod of the telescopic rod 65 by rotating it for replacement. When the main circuit board 1 generates heat, the adhesive layer... 44. When heated, bubbles are generated. The heat generated by the main circuit board 1 causes the paraffin-based composite phase change material inside the inner ring 42 to undergo an endothermic phase change. Due to the stable chemical properties of inert gases, they do not usually react with liquids. The expansion of the gas causes the piston block 8 to move inside the cavity. The piston block 8 moves upward, allowing the inert gas to enter the interior of the small ball airbag 45 through the air inlet 46. The small ball airbag 45 expands and deforms, allowing the outer side of the inner ring 42 to press against the interior of the dustproof plate 2, thus making the inner ring... The inner ring 42 moves downward, squeezing the adhesive layer 44 and expelling air bubbles inside the adhesive layer 44, thereby ensuring the fit between the inner ring 42 and the main circuit board 1. When the pressure inside the small ball airbag 45 is greater than the pressure inside the inner ring 42, it will drive the piston block 8 to move downward. When the push rod 11 contacts the sealing block 10, the push rod 11 pushes open the sealing block 10, allowing the air pressure inside the small ball airbag 45 to return to the interior of the inner ring 42, thereby ensuring that the air pressure inside the small ball airbag 45 and the inner ring 42 remains balanced.

[0055] The preferred embodiments of the present invention have been described in detail above. It should be understood that those skilled in the art can make numerous modifications and variations based on the concept of the present invention without creative effort. Therefore, all technical solutions that can be obtained by those skilled in the art based on the concept of the present invention through logical analysis, reasoning, or limited experimentation on the basis of existing technology should be within the scope of protection defined by the claims.

Claims

1. A device for preventing the label from detaching due to heat on a computer intelligent manufacturing motherboard, mounted on a host circuit board (1), characterized in that, The device includes a dustproof plate (2), a label sticker (3), and an airbag compaction mechanism (4); The dustproof plate (2) is installed on the top of the main circuit board (1), and the label sticker (3) is installed on the dustproof plate (2) by the airbag compaction mechanism (4); the airbag compaction mechanism (4) includes an inner ring (42), an adhesive layer (44) and a heat-absorbing component; The built-in ring (42) is fixed on both sides of the label sticker (3). The adhesive layer (44) and the heat absorption component are respectively installed on opposite sides of the built-in ring (42). The built-in ring (42) is fixed on the dustproof plate (2) through the adhesive layer (44). The heat absorption component is used to dissipate heat from the adhesive layer (44).

2. The anti-scalding and anti-fall-off device for computer intelligent manufacturing motherboard labels according to claim 1, characterized in that, The built-in ring (42) has a receiving groove (47) on one side, and an annular cavity is provided around the opening end of the receiving groove (47). The bottom of the annular cavity is provided with a through hole that connects to the receiving groove (47). The heat absorption assembly includes a convex sphere (43), a small spherical airbag (45), and a pressure relief unit. The convex sphere (43) is a hemispherical shell structure. The open end of the convex sphere (43) is fixed to the open end of the receiving groove (47) to form a receiving cavity. A phase change energy storage unit is provided in the receiving cavity. The small spherical airbag (45) is covered on the through hole and located in the annular cavity. The pressure relief unit is installed in the through hole and is used to control the opening and closing of the small spherical airbag (45) and the receiving cavity.

3. The anti-scalding and anti-fall-off device for computer intelligent manufacturing motherboard labels according to claim 2, characterized in that, The through hole includes a T-shaped mounting hole and an air inlet (46) that are interconnected and arranged vertically. The T-shaped mounting hole is connected to the receiving groove (47), and the air inlet (46) is connected to the small ball airbag (45). The pressure relief unit includes a piston block (8), an elastic reset member and a sealing ring (9). The piston block (8) is slidably installed in the T-shaped mounting hole. The sealing ring (9) is provided on the side wall of the piston block (8) and the T-shaped mounting hole. One end of the elastic reset member is fixed in the T-shaped mounting hole and the other end is connected to the piston block (8). In the initial state, the piston block (8) is located between the T-shaped mounting hole and the air inlet (46); when the pressure in the receiving cavity reaches a preset value, the piston block (8) moves, and the T-shaped mounting hole and the air inlet (46) are connected.

4. The anti-scalding and anti-fall-off device for computer intelligent manufacturing motherboard labels according to claim 3, characterized in that, The elastic reset component includes a sealing block (10), a stop rod (11), and a reset spring (12). The piston block (8) has a mounting hole along the moving direction. The reset spring (12) is coaxially fixed in the mounting hole. The abutment rod (11) is connected to the sealing block (10) to form a T-shaped rod. The T-shaped rod passes through the interior of the reset spring (12), and one end of the T-shaped rod abuts the movable end of the reset spring (12), while the other end is fixed in the T-shaped mounting hole. When the pressure in the receiving cavity reaches the preset value, the reset spring (12) is compressed as the piston block (8) moves.

5. A device for preventing the label from detaching and rolling off a motherboard label in intelligent computer manufacturing according to claim 2, characterized in that, The annular cavity is provided with multiple through holes, and each through hole is covered with a small ball airbag (45). Each small ball airbag (45) is connected through a pressure relief channel, and the pressure relief channel is connected to the receiving cavity through a pressure relief valve.

6. The anti-scalding and anti-fall-off device for computer intelligent manufacturing motherboard labels according to claim 2, characterized in that, The phase change temperature of the phase change energy storage unit is lower than the failure temperature of the adhesive layer (44).

7. The anti-scalding and anti-detachment device for computer intelligent manufacturing motherboard labels according to claim 2, characterized in that, The built-in ring (42) is connected to the label sticker (3) by a connecting strip. The built-in ring (42), the connecting strip and the label sticker (3) are integrally injection molded. The annular cavity and the convex sphere (43) are integrally injection molded parts.

8. The anti-scalding and anti-fall-off device for motherboard labels in computer intelligent manufacturing according to claim 1, characterized in that, The airbag compaction mechanism (4) also includes a raised strip (41), which is located on the top of the label sticker (3), and the four corners of the label sticker (4) are provided with thickened corner edges (5).

9. A device for preventing the label from detaching and rolling off a motherboard label in intelligent computer manufacturing according to claim 1, characterized in that, The main circuit board (1) has a base plate (7) on the side opposite to the dustproof plate (2), and the dustproof plate (2) is connected to the base plate (7) through an expansion snap-fit ​​structure (6).

10. A device for preventing the label from detaching and rolling off a motherboard label in intelligent computer manufacturing according to claim 9, characterized in that, The expansion snap-fit ​​structure (6) includes a connecting post (63) and a first post (61) and a second post (62) with the same structure and a snap fastener. The snap fastener has a protrusion (64) and a telescopic rod (65). The first column (61) and the second column (62) are respectively threaded onto the two ends of the connecting column (63). The telescopic rod (65) is movably fixed on the first column (61). The protrusion (64) is fixed on the telescopic rod (65). The protrusion (64) has a fan-shaped structure. The arc sides of the protrusions (64) of the first column (61) and the second column (62) are arranged opposite to each other.

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