Insulating heat dissipation pad and electronic equipment comprising same

Abstract

The invention discloses an insulating heat dissipation pad and electronic equipment comprising the same. The insulation heat dissipation pad comprises a heat conduction insulation film and a thermosetting adhesive layer. Wherein the thermosetting adhesive layer is pre-bonded to the heat-conducting insulating film, and the thermosetting adhesive layer is used for being bonded to a heating part of a first component or a metal part of a second component so as to insulatively isolate the heating part from the metal part. According to the invention, the proper heat-conducting insulating film and thermosetting adhesive are selected, so that the thermosetting adhesive with relatively small thickness can also have good adhesion. Furthermore, by selecting a proper heating temperature, the thermosetting adhesive layer can be firmly adhered between the heat-conducting insulating film and the heating part or the metal part under the condition that the heat-conducting insulating film is prevented from being damaged by high temperature, so that the performance of the electronic equipment comprising the insulating heat dissipation pad is safer and more reliable.

Description

Technical Field

[0001] This application relates to the field of electronic devices, and more particularly to an insulating heat dissipation pad and an electronic device including the same. Background Technology

[0002] Electronic devices that include heat-generating components typically require cooling systems to dissipate the heat generated by these components, preventing localized overheating that could interfere with the normal operation of the electronic device. Cooling systems can include metal components with good thermal conductivity. However, metal components usually also have good electrical conductivity, so an insulating device is also required between the heat-generating component and the metal component. Summary of the Invention

[0003] This application provides an insulating heat dissipation pad in a first aspect, comprising: a thermally conductive insulating film and a thermosetting adhesive layer. The thermosetting adhesive layer is pre-bonded to the thermally conductive insulating film, and is used to bond to a heat-generating portion of a first component or a metal portion of a second component, thereby insulatingly isolating the heat-generating portion and the metal portion.

[0004] According to the first aspect described above, the thermally conductive insulating film has opposing upper and lower surfaces. The thermosetting adhesive layer has opposing upper and lower surfaces. The lower surface of the thermosetting adhesive layer is pre-bonded to the upper surface of the thermally conductive insulating film, the upper surface of the thermosetting adhesive layer is used for bonding to the heating portion of the first component, and the lower surface of the thermally conductive insulating film is supported above the metal portion of the second component for thermal conductivity with the metal portion.

[0005] According to the first aspect above, the material of the thermosetting adhesive layer includes at least one of the following materials: polyester thermosetting adhesive, polyamide thermosetting adhesive, polyether thermosetting adhesive, polyurethane thermosetting adhesive, copolymers thereof, and copolymers of at least two of them.

[0006] According to the first aspect above, the thermosetting adhesive layer comprises a saturated polyester thermosetting adhesive.

[0007] According to the first aspect above, the thermosetting adhesive layer comprises a polyester thermosetting adhesive formed from a condensation polymer of diacid and diol or a copolymer thereof.

[0008] According to the first aspect above, the thickness of the thermosetting adhesive layer is 0.01 to 0.08 mm.

[0009] According to the first aspect above, the thickness of the thermosetting adhesive layer is 0.015 to 0.08 mm.

[0010] According to the first aspect above, the thermally conductive insulating film is a PP thermally conductive insulating film or a PC thermally conductive insulating film.

[0011] According to the first aspect above, the thickness of the thermally conductive insulating film is 0.05 to 1 mm.

[0012] According to the first aspect above, the thickness of the thermally conductive insulating film is 0.2 to 0.6 mm.

[0013] According to the first aspect above, the thermal conductivity of the thermally conductive insulating film is greater than 0.5 W / mK.

[0014] According to the first aspect above, the pre-bonding of the thermosetting adhesive layer to the thermally conductive insulating film is achieved through a drying process.

[0015] According to the first aspect above, the thermosetting adhesive layer is used to bond the thermosetting adhesive layer pre-bonded to the thermally conductive insulating film to the thermally conductive insulating film through a hot pressing process, and the thermosetting adhesive layer is bonded to the heating part or the metal part.

[0016] According to the first aspect above, the hot pressing process is carried out at a temperature of 125-145℃ and a pressure of 2-15MPa for 5-20 minutes.

[0017] This application provides an electronic device in a second aspect, including a first component, a second component, and an insulating heat dissipation pad according to any one of the first aspects. The first component includes a heat-generating portion. The second component includes a metal portion. The insulating heat dissipation pad is disposed between the heat-generating portion and the metal portion to insulatingly and thermally isolate the heat-generating portion and the metal portion.

[0018] According to the second aspect above, the first component includes a battery module, a PCB board, or a metal busbar. The second component includes a cooling plate having a metal portion.

[0019] Other features, advantages, and embodiments of this application may be set forth or become apparent upon consideration of the following detailed description, accompanying drawings, and claims. Furthermore, it should be understood that the foregoing summary and the following detailed description are exemplary and intended to provide further explanation, without limiting the scope of the claimed application. It should also be understood that although specific component arrangements are disclosed and shown in these exemplary embodiments, other arrangements may also be within the scope of this application. However, the detailed description and specific examples only indicate preferred embodiments of this application. Various changes and modifications within the spirit and scope of this application will become apparent to those skilled in the art through this detailed description. Attached Figure Description

[0020] Figure 1A This is a partial structural schematic diagram of an electronic device including the insulating heat dissipation pad of this application;

[0021] Figure 1B for Figure 1A A partial front view of the electronic device in the image;

[0022] Figure 2 This is a partial structural schematic diagram of an electronic device including the insulating heat dissipation pad of this application;

[0023] Figure 3 This is a partial structural schematic diagram of an electronic device that includes the insulating heat dissipation pad of this application in yet another embodiment. Detailed Implementation

[0024] Various specific embodiments of this application will now be described with reference to the accompanying drawings, which form part of this specification. It should be understood that although terms indicating direction, such as "front," "rear," "upper," "lower," "left," "right," "top," "bottom," "inner," and "outer," are used herein to describe various exemplary structural parts and elements, their use is merely for illustrative purposes and is based on the exemplary orientations shown in the accompanying drawings. Since the embodiments disclosed in this application can be arranged in different orientations, these terms indicating direction are illustrative only and should not be considered limiting.

[0025] In this application, unless otherwise specified, all equipment and raw materials are commercially available or commonly used in the industry. Unless otherwise specified, the methods in the following embodiments are conventional methods in the art.

[0026] The insulating heat dissipation pad of this application is disposed between the first component and the second component, for example, between the heating part of the first component and the metal part of the second component, to insulatingly isolate the heating part and the metal part, and to dissipate the heat generated by the heating part to the metal part, thereby both dissipating heat in time to ensure that the heating part does not have an excessively high local temperature, and preventing the metal part from becoming conductive.

[0027] In this application, the insulating heat dissipation pad includes a thermally conductive insulating film and a thermosetting adhesive layer. The thermosetting adhesive layer is pre-bonded to the thermally conductive insulating film and is also used to bond to the heat-generating portion of a first component or the metal portion of a second component, such that the thermally conductive insulating film and the thermosetting adhesive layer are located between the heat-generating portion and the metal portion, insulatingly and thermally isolating the heat-generating portion and the metal portion. In some embodiments, the first component is located above the second component, the thermosetting adhesive layer is bonded to the heat-generating portion of the first component, and the thermally conductive insulating film is supported above the metal portion of the second component to conduct heat with the metal portion, for example, through contact heat conduction or heat conduction with a small gap. Thus, even if the first component shifts relative to the second component, the thermally conductive insulating film will not shift with the first component, ensuring insulation between the first component and the second component. In some embodiments, the thermosetting adhesive layer may also be bonded to the metal portion of the second component, and the thermally conductive insulating film may be supported below the heat-generating portion of the first component to conduct heat with the heat-generating portion, for example, through contact heat conduction or heat conduction with a small gap.

[0028] As an example, the thickness of the thermally conductive insulating film is 0.1–1 mm. In some more specific examples, the thickness is 0.2–0.6 mm. Furthermore, the thermal conductivity of the thermally conductive insulating film is greater than 0.5 W / mK to ensure good thermal conductivity. Simultaneously, the surface resistivity of the thermally conductive insulating film is greater than 10⁻⁶. 13 Ω, to ensure that the thermally conductive insulating film has good insulation properties.

[0029] In some examples, the thermally conductive insulating film is a PP thermally conductive insulating film or a PC thermally conductive insulating film. PP or PC thermally conductive insulating films can simultaneously possess good thermal conductivity and insulation properties at a relatively thin thickness. The PP thermally conductive insulating film comprises 20–80% PP resin and 20–70% thermally conductive filler by weight. The PC thermally conductive insulating film comprises 20–80% PC resin and 20–70% thermally conductive filler by weight. In some more specific examples, the PP or PC thermally conductive insulating film is a commercially available product.

[0030] As an example, the thickness of the thermosetting adhesive layer is 0.01–0.08 mm. In some more specific examples, the thickness of the thermosetting adhesive layer is 0.015–0.08 mm. In some embodiments, the material of the thermosetting adhesive layer comprises a low-temperature thermosetting adhesive with an application temperature not exceeding 150°C, such as including at least one of the following materials: polyester thermosetting adhesive, polyamide thermosetting adhesive, polyether thermosetting adhesive, polyurethane thermosetting adhesive, copolymers thereof, and copolymers of at least two of them. In some embodiments, the material of the thermosetting adhesive layer is a polyester thermosetting adhesive, which has good low-temperature adhesion and is particularly suitable for bonding other components. In some examples, the polyester thermosetting adhesive is a saturated polyester thermosetting adhesive. In some examples, the polyester thermosetting adhesive is a polyester thermosetting adhesive formed from a condensation polymer of diacid and glycol or a copolymer thereof. In some more specific examples, the polyester thermosetting adhesive is a commercially available product, such as TM301 from Hot Melt Adhesives.

[0031] Thermosetting adhesives form a cross-linked structure when heated, and upon cooling, they can firmly bond the thermally conductive insulating film to the desired location. In this application, the insulating heat dissipation pad is formed by pre-bonding a thermosetting adhesive to a thermally conductive insulating film. When needed, the thermosetting adhesive layer of the insulating heat dissipation pad is brought into contact with the heating part of the first component or the metal part of the second component. Heating and pressure are then applied to simultaneously bond the thermosetting adhesive to both the thermally conductive insulating film and the heating part or metal part, thus bonding the thermally conductive insulating film and the heating part or metal part together.

[0032] In some embodiments, the pre-bonding of thermosetting adhesives to the thermally conductive insulating film is achieved through a drying process. Under drying conditions, the thermosetting adhesive can form an insulating and heat-dissipating pad with a certain adhesive strength to meet transportation requirements. However, the thermosetting adhesive does not form a cross-linked structure, meaning it does not firmly bond to the thermally conductive insulating film, thus allowing it to bond to other parts as well. Those skilled in the art can select appropriate drying temperatures and times based on the specific composition of the thermosetting adhesive to remove solvents and other components, enabling the thermosetting adhesive to be pre-bonded to the thermally conductive insulating film. As some more specific embodiments, an operator applies a thermosetting adhesive of the desired thickness to the surface of the thermally conductive insulating film and then dries it in an oven at approximately 120–150°C for 1–3 minutes to form a thermosetting adhesive layer attached to the thermally conductive insulating film.

[0033] In some embodiments, the thermosetting adhesive layer firmly bonds the thermally conductive insulating film and the heating element or metal part through a hot-pressing process. Under hot-pressing conditions, one surface of the thermosetting adhesive is firmly bonded to the thermally conductive insulating film, and the other surface of the thermosetting adhesive is firmly bonded to the heating element or metal part. As some more specific embodiments, after the operator covers the heating element with an insulating heat dissipation pad, the insulating heat dissipation pad and the metal part are hot-pressed at a temperature of 125–145°C and a pressure of 2–15 MPa for 5–20 minutes, and then cooled to obtain a thermally conductive insulating film and heating element firmly bonded by the thermosetting adhesive layer.

[0034] The applicant found that thermosetting adhesives generally do not have a positive impact on the heat dissipation of insulating thermal pads. The thinner the thermosetting adhesive layer, the less negative the negative impact on heat dissipation; however, excessively thin thermosetting adhesive layers may affect the adhesive's bonding properties. Furthermore, when the thickness of the thermally conductive insulating film is small, the heat resistance temperature is usually not too high. Heating the thermosetting adhesive may damage the performance of the thermally conductive insulating film. Especially for films containing PP and PC resins, excessively high heating temperatures can cause the film to melt, rendering it ineffective as a thermally conductive and insulating agent.

[0035] This application achieves good adhesion even with a relatively thin thermosetting adhesive by selecting suitable thermally conductive insulating film and thermosetting adhesive. Furthermore, by selecting a suitable heating temperature, the thermosetting adhesive layer can be firmly bonded between the thermally conductive insulating film and the heat-generating part or metal part without damaging the thermally conductive insulating film at high temperatures. Therefore, electronic devices including the insulating heat dissipation pad of this application can achieve safer and more reliable performance.

[0036] The effects of the insulating heat dissipation pad of this application are illustrated below through specific examples 1-4 and comparative examples 1-5. Table 1 shows a comparison of the composition, thickness, and performance of the samples from the embodiments and comparative examples of this application.

[0037] Table 1 shows a comparison of the composition, thickness, and performance of the samples from the embodiments of this application and the comparative examples.

[0038]

[0039] In Table 1, the PP thermally conductive and insulating film is... TCI, PC thermally conductive insulating film is PCTCI, a commercially available roll of non-thermally conductive insulating film with a PET substrate; polyester thermosetting adhesive TM301 from Hehe Company; epoxy thermosetting adhesive BL-ER500 from Banglan Electronics; double-sided adhesive 9495LE from 3M Company; and hot melt adhesive F701 from Shanghai Tianyang. Thermal conductivity was measured using the insulating heat dissipation pads of Examples 1-4 and Comparative Examples 1-5 according to ASTM D5470-12. Peel strength was measured using a 180° T-type peel strength test method after the insulating heat dissipation pads of Examples 1-4 and Comparative Examples 1-5 were placed at -30°C for 1 hour. It should be noted that the heating element of the first component is generally made of metal or plastic, and its adhesion to various adhesives is stronger than the adhesion between the adhesive and the film. Therefore, peeling mainly occurs between the adhesive and the film or due to the film's own failure. Therefore, the performance results tested in Table 1 represent the performance of the corresponding insulating film and standard thermally conductive aluminum sheet after being bonded with the corresponding adhesives.

[0040] As can be seen from Table 1 above, the insulating heat dissipation pads of Examples 1-4 not only have good thermal conductivity but also maintain very good adhesion under low-temperature conditions, making them difficult to peel off. The insulating heat dissipation pad of Example 2 requires only a 0.05mm thermally conductive insulating film and a 0.015mm polyester thermosetting adhesive to achieve very good thermal conductivity and adhesive strength with a total thickness of less than 0.1mm. Furthermore, the higher the thickness of the polyester thermosetting adhesive within a certain range, the better its adhesive strength. The heat dissipation pads of Comparative Examples 1-2 and 5-6 include a thermally conductive insulating film, therefore, the heat dissipation pads of Comparative Examples 1-2 and 5-6 have good thermal conductivity. However, Comparative Example 1 uses epoxy thermosetting adhesive, Comparative Examples 2 and 5 use double-sided adhesive, and Comparative Example 6 uses hot melt adhesive; their adhesion to the thermally conductive insulating film is insufficient, resulting in low peel strength, and therefore the thermally conductive insulating film is easy to detach. Furthermore, comparing the heat dissipation pads of Comparative Examples 5 and 6 with the insulating heat dissipation pads of Examples 1 and 4, although Comparative Examples 5 and 6 included thermally conductive insulating films, their thermal conductivity was lower than that of the insulating heat dissipation pads of Examples 1 and 4. This indicates that the negative impact of double-sided adhesive and hot melt adhesive on thermal conductivity is greater than the negative impact of polyester thermosetting adhesive. Although the heat dissipation pad of Comparative Example 3 used polyester thermosetting adhesive to bond the film and metal parts, resulting in good adhesion, the heat dissipation pad of Comparative Example 3 included a non-thermally conductive insulating film, leading to poor thermal conductivity.

[0041] This demonstrates that thermally conductive insulating films are particularly suitable for bonding with polyester thermosetting adhesives. The polyester thermosetting adhesive layer not only provides a strong bond between the thermally conductive insulating film and the heat-generating component even at relatively thin thicknesses, but also ensures the insulating heat dissipation pad exhibits excellent thermal conductivity.

[0042] Figure 1A and Figure 1BThis is a partial structural schematic diagram of an electronic device including the insulating heat dissipation pad of this application, wherein... Figure 1A This shows a partial structure of the electronic device before the insulating heat dissipation pad is attached to the second component. Figure 1B This shows a partial structure of an electronic device when an insulating heat dissipation pad is attached to a second component. For example... Figure 1A and Figure 1B As shown, the electronic device includes a battery device 110, which includes a first component 113 and a second component 111. An insulating heat dissipation pad 100 is disposed between the first component 113 and the second component 111 to insulate and thermally isolate the first component 113 and the second component 111. In the embodiment shown, the first component 113 is a battery module, which includes a heating element 112 and has a battery casing 105 made of a metal material. When the battery module is in operation, it can generate heat. The second component 111 is a cooling plate, which includes a metal part 115 made of a metal with good thermal conductivity. The insulating heat dissipation pad 100 insulates and thermally isolates the heating element 112 and the metal part 115. In this embodiment, the first component 113 can generate heat as a whole, so that it forms the heating element 112 as a whole. In other embodiments, the first component 113 can also generate heat locally, forming a heating element at its heating location, and the insulating heat dissipation pad can be disposed below the corresponding heating element. In this embodiment, the second component 111 is entirely made of metal, meaning that all other parts 114 of the second component 111, except for the metal portion 115, are also made of metal. In other embodiments, the second component 111 may also be partially made of metal. For example, in some embodiments, other parts 114 may be coated with a non-metallic material on a metal material, or may be made of a non-metallic material.

[0043] The insulating heat dissipation pad 100 includes a thermally conductive insulating film 101 and a thermosetting adhesive layer 102. In this embodiment, the thermosetting adhesive layer 102 of the insulating heat dissipation pad 100 is adhered to the heating element 112, and the thermally conductive insulating film 101 is in contact with the metal element 115 for thermal conduction. Specifically, the thermally conductive insulating film 101 has opposing upper surface 121 and lower surface 122. The thermosetting adhesive layer 102 has opposing upper surface 131 and lower surface 132. When the insulating heat dissipation pad 100 is not yet adhered to the heating element 112, the lower surface 132 of the adhesive is pre-adheded to the upper surface 121 of the film, for example, by a drying process. The upper surface 131 of the adhesive is aligned with and faces the lower surface of the heating element 112. The lower surface 122 of the thermally conductive insulating film 101 is supported above and in contact with the metal element 115.

[0044] After the thermosetting adhesive layer 102 of the insulating heat dissipation pad 100 is attached to the lower surface of the heating element 112, the lower surface 132 of the adhesive layer 102, which was pre-adheded to the upper surface 121 of the film, is bonded to the upper surface 121 of the film through a hot-pressing process, and the upper surface 131 of the adhesive is bonded to the lower surface of the heating element 112. Furthermore, in this embodiment, the size of the insulating heat dissipation pad 100 is approximately the same as the size of the heating element 112, and both are smaller than the size of the metal part 115. Therefore, even if there is relative displacement between the heating element 112 and the metal part 115, the insulating heat dissipation pad 100 can still be firmly attached below the heating element 112, ensuring that the battery module does not leak current to the metal part 115.

[0045] Therefore, the battery device including the insulating heat dissipation pad 100 in this embodiment can both cool the heat-generating part 112 through the metal part 115 and prevent the metal part 115 from conducting electricity, making it particularly suitable for battery devices including a thermal management system.

[0046] Figure 2 This is a partial structural schematic diagram of an electronic device including the insulating heat dissipation pad of this application. Figure 2 As shown, the electronic device 210 includes a first component 213 and a second component 211. The first component 213 includes a heat-generating part 212, and the second component 211 includes a metal part 215. In this embodiment, the first component 213 is a PCB board, which generates heat as a whole. The second component 211 is a cooling plate made entirely of metal material, which includes a metal part 115. In this embodiment, an insulating heat dissipation pad 200 is supported below the PCB board, and the thermally conductive insulating film 201 of the insulating heat dissipation pad 200 is in close contact with the side surface of the PCB board where no electrical components are located. The thermosetting adhesive layer 202 of the insulating heat dissipation pad 200 is adhered to the upper surface of the metal part 215 to insulate and thermally isolate the heat-generating part 212 of the PCB board and the metal part 215 of the cooling plate. In this embodiment, the size of the insulating heat dissipation pad 100 is approximately the same as the size of the metal part 215, and both are larger than the size of the heat-generating part 212. Therefore, even if there is a relative displacement between the heat-generating part 212 and the metal part 215, the insulating heat dissipation pad 200 can still be firmly attached to the metal part 215, ensuring that the PCB board will not leak current to the metal part 215.

[0047] Therefore, the PCB board including the insulating heat dissipation pad 200 in this embodiment can both cool the PCB board through the metal part 215 and prevent the metal from conducting electricity and affecting the normal operation of the PCB board, making it particularly suitable for PCB boards that can be thermally managed.

[0048] Figure 3 This is a partial structural schematic diagram of an electronic device including the insulating heat dissipation pad of this application, according to yet another embodiment. Figure 3As shown, the electronic device 310 includes a first component 313 and a second component 311. The first component 313 includes a heating element 312, and the second component 311 includes a metal part 315. In this embodiment, both the first component 313 and the second component 311 are metal busbars. That is, both the first component 311 and the second component 311 are capable of generating heat and are both made of metal materials.

[0049] However, the first component 313 and the second component 311 have different temperatures. As an example, by designing parameters such as the power of the metal busbar, the first component 313 and the second component 311 can have different operating temperatures. In this embodiment, the temperature of the metal busbar of the first component 313 is higher than the temperature of the metal busbar of the second component 311. Therefore, the first component 313 is integrally formed as a heating element 312, and the second component 311 is integrally formed as a metal part 315 for cooling the first component 313.

[0050] An insulating heat dissipation pad 300 is attached to the underside of the metal busbar of the first component 313, and a thermosetting adhesive layer 302 of the insulating heat dissipation pad 300 is attached to the lower surface of the metal busbar of the first component 313. After the thermally conductive insulating film 301 of the insulating heat dissipation pad 300 is in close contact with the upper surface of the metal busbar of the second component 311, it can insulate and thermally isolate the metal busbars of the first component 313 and the metal busbars of the second component 311.

[0051] Therefore, the metal busbar assembly including the insulating heat dissipation pad 300 in this embodiment can cool the higher-temperature metal busbars through the lower-temperature metal busbars, thereby maintaining the temperature balance inside the metal busbar assembly. Furthermore, it can prevent conductive interference between the metal busbars, making it particularly suitable for metal busbar assemblies capable of thermal management.

[0052] Although this disclosure has been described in conjunction with examples of the embodiments outlined above, various alternatives, modifications, variations, improvements, and / or substantially equivalents, whether known or now or soon to be foreseen, will likely be apparent to those skilled in the art. Therefore, the examples of embodiments of this disclosure set forth above are intended to be illustrative rather than restrictive. Various changes can be made without departing from the spirit or scope of this disclosure. Therefore, this disclosure is intended to include all known or previously developed alternatives, modifications, variations, improvements, and / or substantially equivalents. The technical effects and problems described in this specification are exemplary rather than restrictive. It should be noted that the embodiments described in this specification may have other technical effects and may solve other technical problems.

Claims

1. An insulating heat dissipation pad, characterized in that... include: Thermally conductive insulating film; as well as Thermosetting adhesive layer; The thermosetting adhesive layer is pre-bonded to the thermally conductive insulating film, and the thermosetting adhesive layer is used to bond to the heating part of the first component or the metal part of the second component to insulate the heating part and the metal part from each other.

2. The insulating heat dissipation pad according to claim 1, characterized in that: The thermally conductive insulating film has opposing upper and lower surfaces. The thermosetting adhesive layer has an upper adhesive surface and a lower adhesive surface opposite each other; The lower surface of the thermosetting adhesive layer is pre-bonded to the upper surface of the thermally conductive insulating film. The upper surface of the thermosetting adhesive layer is used to bond to the heating part of the first component. The lower surface of the thermally conductive insulating film is supported above the metal part of the second component to conduct heat with the metal part.

3. The insulating heat dissipation pad according to claim 1, characterized in that: The material of the thermosetting adhesive layer includes at least one of the following materials: polyester thermosetting adhesive, polyamide thermosetting adhesive, polyether thermosetting adhesive, polyurethane thermosetting adhesive, copolymers thereof, and copolymers of at least two of them.

4. The insulating heat dissipation pad according to claim 3, characterized in that: The thermosetting adhesive layer comprises a saturated polyester thermosetting adhesive.

5. The insulating heat dissipation pad according to claim 4, characterized in that: The thermosetting adhesive layer comprises a polyester thermosetting adhesive formed from a condensation polymer of diacid and diol or a copolymer thereof.

6. The insulating heat dissipation pad according to claim 1, characterized in that: The thickness of the thermosetting adhesive layer is 0.01 to 0.08 mm.

7. The insulating heat dissipation pad according to claim 5, characterized in that: The thickness of the thermosetting adhesive layer is 0.015–0.08 mm.

8. The insulating heat dissipation pad according to claim 1, characterized in that: The thermally conductive insulating film is a PP thermally conductive insulating film or a PC thermally conductive insulating film.

9. The insulating heat dissipation pad according to claim 1, characterized in that: The thickness of the thermally conductive insulating film is 0.05 to 1 mm.

10. The insulating heat dissipation pad according to claim 9, characterized in that: The thickness of the thermally conductive insulating film is 0.2 to 0.6 mm.

11. The insulating heat dissipation pad according to claim 1, characterized in that: The thermal conductivity of the thermally conductive insulating film is greater than 0.5 W / mK.

12. The insulating heat dissipation pad according to claim 1, characterized in that: The thermosetting adhesive layer is pre-bonded to the thermally conductive insulating film through a drying process.

13. The insulating heat dissipation pad according to claim 12, characterized in that: The thermosetting adhesive layer is used to bond the thermosetting adhesive layer pre-bonded to the thermally conductive insulating film to the thermally conductive insulating film through a hot-pressing process, and the thermosetting adhesive layer is bonded to the heating part or the metal part.

14. The insulating heat dissipation pad according to claim 13, characterized in that: The hot pressing process is carried out at a temperature of 125-145℃ and a pressure of 2-15MPa for 5-20 minutes.

15. An electronic device, characterized in that... include: A first component, the first component including a heating element; The second component, the second component including a metal portion; and The insulating heat dissipation pad according to any one of claims 1-14 is disposed between the heating part and the metal part to insulate and thermally isolate the heating part and the metal part.

16. The electronic device according to claim 15, characterized in that: The first component includes a battery module, a PCB board, or a metal busbar; and The second component includes a cooling plate having a metal portion.

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