Cooling block and liquid cooling type device for data center server rack

Abstract

The present disclosure relates to a cooling block (160) for cooling a heat-generating electronic component (166), the cooling block comprising: a body (162) having an outer surface (164), referred to as a heat transfer surface, configured to be arranged in thermal contact with the heat-generating electronic component, the invention relates to a cooling block (100) comprising a body (200) defining a fluid line (170) for internally circulating a cooling fluid, the fluid line having at least one inlet (172) for receiving the cooling fluid and at least one outlet (174) for discharging the cooling fluid, the cooling block further comprising at least one acoustic generator (200), referred to as a vibrating element, the sound wave generator is configured to generate a vibration field of the cooling liquid in the fluid pipeline, and the vibration field is called a vibration area.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to European Patent Application No. 24306320.3, filed on August 2, 2024, entitled “COOLING BLOCK FOR A DATACENTERSERVER RACK”, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This technology relates to data center server rack cooling. Background Technology

[0004] Data centers are constructed to house multiple server racks that contain electronic devices such as computer systems (e.g., server components), storage, and other electronic components, in an attempt to process massive amounts of data in near real-time. During operation, the electronic equipment in these server racks generates significant heat, which must be dissipated to ensure the continued efficient operation of the electronic equipment. Numerous cooling solutions have been implemented to address this heat generation problem, including liquid cooling of heat-generating components by directly mounting liquid cooling blocks (often referred to as liquid block units or water block units) onto certain heat-generating parts.

[0005] While water block units are effective at cooling heat-generating components, their implementation in server racks typically requires a liquid distribution infrastructure to serve multiple server racks and the large number of electronic devices they support. Such liquid distribution infrastructure often necessitates relatively large and / or heavy piping configurations and high-capacity pumps to maintain the necessary fluid flow rates to supply water blocks and meet the cooling needs of the numerous heat-generating components. It's important to understand that using such piping configurations and large pumps is prohibitively expensive for data centers in terms of initial investment and operating costs. These piping configurations and large pumps themselves occupy significant space, which can reduce productivity (e.g., the number of servers per unit area of ​​the data center floor).

[0006] Therefore, there appears to be a need for a liquid-cooled device for data center server racks that can alleviate at least some of the cost issues and / or improve the efficiency of cooling solutions.

[0007] It should be noted that the topics discussed in the background section should not be considered prior art simply because they are mentioned in the background section. Similarly, the problems mentioned in the background section should not be interpreted as having been recognized in the prior art. Summary of the Invention

[0008] According to one aspect of the present technology, there is provided a cooling block for cooling a heat generating electronic component, the cooling block comprising: a body having an outer surface, referred to as a heat transfer surface, configured to be arranged in thermal contact with the heat generating electronic component, the body defining a fluid circuit for circulating a cooling fluid inside, the fluid circuit having at least one inlet for receiving the cooling fluid and at least one outlet for discharging the cooling fluid, the cooling block further comprising at least one acoustic wave generator, referred to as a vibration element, configured to generate a vibration field of the cooling liquid in the fluid circuit, referred to as a vibration zone.

[0009] Thanks to the vibration element, the flow of the cooling liquid is locally modified, which helps to reduce the boundary layer and / or to increase the local turbulence in the liquid flow, thus enhancing the heat exchange between the cooling liquid and the air, and thus optimizing the efficiency of the cooling block.

[0010] In some embodiments, the frequency of the vibration element is comprised between 30 Hz and 500 Hz, advantageously the frequency of the vibration element is comprised between 150 Hz and 300 Hz; and / or, the frequency of the vibration element is comprised between 20 kHz and 50 kHz, advantageously the frequency of the vibration element is 25 kHz; and / or, the frequency of the vibration element is comprised between 0.8 MHz and 1.2 MHz, advantageously the frequency of the vibration element is 1 MHz; and / or, the frequency of the vibration element is comprised between 1.3 MHz and 1.7 MHz, advantageously the frequency of the vibration element is 1.5 MHz; and / or, the frequency of the vibration element is comprised between 1.8 MHz and 2.2 MHz, advantageously the frequency of the vibration element is 2 MHz.

[0011] In some embodiments, the vibration element is arranged on the outer surface of the body.

[0012] In some embodiments, the vibration element is configured so that the generated field presents a main direction forming an angle comprised between 0° and 360° with a longitudinal axis of the cooling block.

[0013] In some embodiments, the cooling block comprises at least a first vibration element and a second vibration element.

[0014] In some embodiments, the first vibration element and the second vibration element are configured so that the frequency of the first vibration element is different from the frequency of the second vibration element.

[0015] In some embodiments, the first and second vibrating elements are configured such that the field generated by the first vibrating element exhibits a principal direction forming a non-zero angle with the principal direction of the field generated by the second vibrating element.

[0016] In some embodiments, the principal direction of the field generated by the first vibrating element is perpendicular to the principal direction of the field generated by the second vibrating element.

[0017] In some embodiments, the acoustic power of the acoustic wave generator is comprised between 50 W and 200 W, advantageously the acoustic power of the acoustic wave generator is 100 W.

[0018] The present invention also relates to a liquid-cooled type device for a data center server rack, said liquid-cooled type device comprising:

[0019] a liquid cooling circuit configured to convey a cooling liquid;

[0020] a plurality of server clusters each comprising a plurality of server components including at least one respective liquid cooling unit as already described and configured to collect at least a portion of the thermal energy generated by heat-generating components;

[0021] at least one heat exchanger fluidically connected to the liquid cooling units of the plurality of server clusters by the liquid cooling circuit; and

[0022] a pump fluidically coupled to the heat exchanger via the liquid cooling circuit, the pump being configured to convey the cooling liquid in the liquid cooling circuit.

[0023] In some embodiments, the at least one exchanger is arranged on a rear door of a rack carrying a server cluster.

[0024] In some embodiments, the at least one exchanger is configured to cool an air flow with the circulation of the cooling liquid in a heat exchange zone.

[0025] Various implementations of the technology have at least one of the above aspects, but not necessarily all. Some implementations of the technology can achieve one or more, but not necessarily all, of the above aspects.

[0026] Additional and / or alternative aspects, features, and advantages of the implementations of the technology will be apparent from the following description, the drawings, and the appended claims. BRIEF DESCRIPTION OF DRAWINGS

[0027] For a better understanding of the present technology, and to show how the same can be carried into effect, reference will be made to the following description taken in conjunction with the accompanying drawings in which:

[0028] Figure 1 depicts a functional block diagram of a serialized liquid-cooled type apparatus for a data center server rack, in accordance with some non-limiting embodiments of the present disclosure;

[0029] Figure 2 depicts details of a cooling block of the apparatus of Figure 1 equipped with a vibrating element.

[0030] Figure 3 depicts details of a cooling block of the apparatus of Figure 1 equipped with a plurality of vibrating elements.

[0031] Figure 4 depicts details of a cooling block of the apparatus of Figure 2 and Figure 3 . DETAILED DESCRIPTION

[0032] The present disclosure proposes various embodiments of vibrating elements for optimizing the cooling of heat-generating electronic components.

[0033] The example and conditional language used herein is merely used to help the reader understand the principles of the technology, and is not intended to limit the scope of the technology to such specifically recited examples and conditions. It will be appreciated that those skilled in the art can devise various arrangements which, although not explicitly described or shown herein, embody the principles of the technology and are included within its spirit and scope.

[0034] Furthermore, in the following description, numerous specific details are set forth to provide a thorough understanding of the present technology. However, it will be understood by those skilled in the art that the present technology can be practiced without the specific details. In other instances, well-known methods, procedures, components, and circuits have not been described in detail so as not to unnecessarily obscure aspects of the present technology.

[0035] In some cases, examples can be set forth in terms of sequences of actions to be taken by, for example, elements of a computing device, a process, or other component, that collectively accomplish an overall result. These sequences of actions can be embodied within machine-executable code or instructions that cause a machine, such as those built using components and / or materials similar to those described herein, to implement the actions described. However, these sequences of actions are also not limited to those described herein but can also include other sequences of actions. Note that the description could have been presented in an arrangement alternative to that described and illustrated herein, and the present technology is not intended to be limited to the arrangements described and illustrated herein. Further, the description and illustration of the technology is not intended to be limited to the specific examples and conditions described and illustrated herein. Further, the examples and conditions described and illustrated herein are not intended to be exhaustive or otherwise limit the technology to the specific examples and conditions described and illustrated herein.

[0036] Moreover, all statements herein reciting principles, aspects, and implementations of the technology, as well as specific examples thereof, are intended to encompass both structural and functional equivalents thereof. Additionally, it is intended that such equivalents include both currently known

[0037] In order to better understand the following description of the application, Figures 2 to 4 A three-axis coordinate system (X, Y, Z) is shown. The Y-axis is referred to as the longitudinal axis.

[0038] With the above in mind, we will now consider a number of non-limiting examples to illustrate implementations of the various inventive aspects of the present disclosure.

[0039] Figure 1 A functional block diagram of a server rack serialized liquid-cooled apparatus 100 according to an embodiment of the present disclosure is depicted. As shown, the liquid-cooled apparatus 100 includes a plurality of server clusters 110, 112,..., 11M that are fluidly connected in series via a server rack liquid-cooling loop 150. The server rack liquid-cooling loop 150 is configured to transport and facilitate the flow of a cooling liquid throughout the electronic equipment of the server rack, and can be constructed of a flexible material (e.g., rubber, plastic, etc.), a rigid material (e.g., metal, PVC tubing, etc.), or any combination thereof. It will be appreciated that the transported liquid can include water, alcohol, or any suitable liquid capable of maintaining a sufficient cooling temperature.

[0040] Each of the server clusters 110, 112,..., 11M includes a plurality of server components 110A-110N, 112A-112N,..., 11MA-11MN arranged in parallel and / or series. As noted above, the server components 110A-110N, 112A-112N,..., 11MA-11MN contain heat-generating electronic components.

[0041] Thus, each of the server assemblies 110A-110N, 112A-112N,..., 11MA-11MN of the parallel server cluster 110, 112,..., 11M comprises at least one respective liquid cooling unit or block 110A1-110N1, 112A1-112N1,..., 11MA1-11MN1, which are respectively arranged in parallel for direct thermal contact liquid cooling of the heat generating electronic components. That is, each of the liquid cooling units 110A1-110N1, 112A1-112N1,..., 11MA1-11MN1 is configured as a liquid cooled heat sink block which is directly or indirectly thermally coupled with the heat generating electronic components such that the cooling liquid circulates within the internal liquid piping of the liquid cooling unit 110A1-110N1, 112A1-112N1,..., 11MA1-11MN1 to absorb heat from the heat generating electronic components and expel the heated liquid. The liquid cooling units will be described in more detail later.

[0042] The heat generating components are for example graphics processors (GPU) and / or central processors (CPU). Other components are for example random access memories (RAM), hard disks,....

[0043] For example, each of the server clusters 110, 112,..., 11M can comprise a first manifold which, in use, receives the cooling liquid and feeds the cooling liquid to the plurality of liquid cooling units of the server cluster in parallel. A second manifold can be provided downstream of the plurality of liquid cooling units to receive the cooling liquid from the plurality of liquid cooling units.

[0044] The liquid cooling type arrangement 100 further comprises at least one air-liquid heat exchanger (ALHEX), Figure 1 There are three air-liquid heat exchangers, 120, 122,..., 12M.

[0045] In Figure 1 Each of the air-liquid heat exchangers (ALHEX) 120, 122,..., 12M defines an exchanger internal fluid piping which forms part of the cooling circuit 150. Thus, each of the air-liquid heat exchangers (ALHEX) 120, 122,..., 12M has an inlet through which, in use, the cooling liquid flows into the exchanger internal fluid piping and an outlet through which, in use, the cooling liquid is expelled from the exchanger internal fluid.

[0046] In Figure 1In particular, the ALHEXs 120, 122,..., 12M of the liquid-cooled device 100 are fluidly connected in parallel to each other. That is, the internal fluid lines of the air-liquid heat exchangers (ALHEXs) 120, 122,..., 12M of the liquid-cooled device 100 are fluidly connected in parallel. The ALHEXs 120, 122,..., 12M of the liquid-cooled device 100 are also fluidly coupled to the server clusters 110, 112,..., 11M via the liquid cooling loop 150. The ALHEXs 120, 122,..., 12M serve to sufficiently air cool the heated liquid received by the liquid cooling units 110A1-110N1, 112A1-112N1,..., 11MA1-11MN1 for re- introduction back to the server clusters 110, 112,..., 11M. The ALHEXs 120, 122,..., 12M can take any suitable configuration to reduce the liquid temperature by a supplied air flow, e.g., internal cooling coils, heat dissipating air flow fins, etc. The ALHEXs 120, 122,..., 12M can be, for example, but not limited to, disposed on the back door of the rack that carries the server clusters 110, 112,..., 11M.

[0047] The liquid-cooled device 100 also includes at least one pump 130 fluidly connected with the server rack liquid cooling loop 150. The pump 130 is configured to receive the cooling liquid from the ALHEXs 120, 122,..., 12M via the server rack liquid cooling loop 150, and the pump 130 serves to force the circulation flow rate required to flow the cooling liquid through the server rack liquid cooling loop 150 to service the liquid cooling units 110A1-110N1, 112A1-112N1,..., 11MA1-11MN1 of the server clusters 110, 112,..., 11M.

[0048] The present disclosure is not limited to Figure 1 configurations. For example, the heat exchangers ALHEXs 120, 122,..., 12M can each be dedicated to a respective server cluster, rather than being in parallel to each other, and / or some of the server clusters can be in series, while others can be in parallel to each other.

[0049] Additionally, it is worth noting that the ALHEXs 120, 122,..., 12M can serve other roles in the loop 150. In Figure 1 In particular, the liquid is cooled in the ALHEXs 120, 122,..., 12M by an air flow. However, the present disclosure also encompasses embodiments in which the cooling liquid flowing inside the ALHEXs 120, 122,..., 12M can be used to cool the air flow of the rack.

[0050] Now referring to FIG. 2, a schematic diagram of a liquid-cooled device 200 is shown. The liquid-cooled device 200 is similar to the liquid-cooled device 100 of FIG. 1, and like reference numerals are used to refer to like elements.Figures 2 to 4 One of the liquid cooling units 110A1-110N1, 112A1-112N1,..., 11MA1-11MN1 is described. This cooling unit is also called a cooling block or water block assembly and is referred to as WB assembly 160.

[0051] Advantageously, each cooling unit can contain a serpentine tube for cooling the dielectric fluid.

[0052] From Figure 2 and Figure 3 It can be seen that the WB assembly 160 comprises a body 162 having an outer surface 164 defining an internal volume V. A heat generating component 166 is resting on a portion 168 of the outer surface 164 such that heat is transferred from the component 166 to the WB assembly 160 (see Figure 3 ).

[0053] The water block assembly WB further comprises a tubing 170 of cooling liquid located in the internal volume V, and at least one inlet 172 for introducing the cooling liquid from the liquid cooling circuit 150 into the tubing 170 and an outlet 174 for discharging the cooling liquid from the tubing 170 to the liquid cooling circuit 150.

[0054] In the illustrated embodiment, the WB assembly 160 comprises only one inlet 172 and one outlet 174. However, the present disclosure is not limited to this particular arrangement, and the WB assembly 160 can be provided with more inlets and / or outlets.

[0055] The shape of the tubing 170 of cooling liquid depends on several parameters, such as the material and the dimensions of the WB assembly. Preferably, the tubing 170 is in a serpentine shape to enhance the heat exchange between the heat generating component 166 and the WB assembly 160. As can be seen, the body 162 of the WB assembly 160 is composed of two half-shells 176, 178, the tubing 170 being formed by said two half-shells. Figure 4 A non-limiting example of the tubing 170 is shown. The plane (X, Y) is called the main plane of the tubing 170 of cooling liquid. The heat generating component 166 is located on the half-shell 178 in Figure 3 .

[0056] The WB assembly 160 is equipped with at least one acoustic wave generator 200, called a vibration element, for generating a mechanical vibration field of the cooling liquid in the WB assembly 160, as will now be described in detail.

[0057] Preferably, the vibration element 200 is an ultrasonic wave generator, such as a piezoelectric transducer.

[0058] In Figure 2 , a first vibration element 200-1 is shown, while in Figure 3Among others, two other vibrating elements 200-2 and 200-3 are visible. From Figure 3 It can be seen that the first vibrating element 200-1 is resting against a surface 180 (X, Y) opposite to said portion 168 of the outer surface 164, while the second vibrating element 200-2 and the third vibrating element 200-3 are located on two opposite portions 182, 184 (Y, Z) of the body 162.

[0059] The present disclosure encompasses embodiments in which the WB assembly 160 is equipped with only one vibrating element 200 or with a plurality of vibrating elements 200. The vibrating elements 200 can be identical, or on the contrary, of different types, depending on the degree of impact to be generated on the flow of liquid for cooling. The number of vibrating elements, the position of the vibrating elements and the size of the vibrating elements depend on the level of heat exchange required between the heat-generating component 166 and the WB assembly 160, as well as on the size of the WB assembly 160.

[0060] Each vibrating element 200 is configured to generate a vibration field VF at a given frequency f, which can cause a local variation of the flow of liquid for cooling, as will be detailed later. Each vibration field VF exhibits a main direction, which corresponds to the main direction of propagation of the vibrations generated by the vibrating element 200. This main direction is indicated by the arrow in the figure. The area of the flow of liquid for cooling in which the vibrations are generated is called a vibrating area.

[0061] The vibrating elements 200 can be located inside the WB assembly or outside the WB assembly, but in each case, each vibrating element 200 is positioned so that the vibration field VF has an impact on the liquid for cooling.

[0062] In the example shown in Figure 3 , the main direction of the first vibrating element 200-1 extends along the Z axis, while the main direction of the second vibrating element 200-2 and of the third vibrating element 200-3 extends along the X axis. In other words, the main direction of the second vibrating element 200-2 and of the third vibrating element 200-3 extends within the main plane (X, Y) of the circuit 170 of the liquid for cooling, while the main direction of the first vibrating element 200-1 is perpendicular to this plane.

[0063] The present disclosure is not limited to Figure 2 and Figure 3 the configuration shown. The WB assembly 160 can be equipped with less than three vibrating elements 200, or on the contrary, with more vibrating elements 200. Furthermore, the WB assembly 160 can be equipped with more than one vibrating element on the half 176, and / or with more or less vibrating elements on the longitudinal walls 182, 184. Furthermore, in Figure 2 , the present disclosure also encompasses configurations in which the main directions do not all belong to the same plane or on the contrary, all belong to the same plane.

[0064] It should be noted that the frequency of the vibrating element 200 can be comprised between 10 Hz and 5 MHz, for example, the frequency of the vibrating element 200 can be comprised between 30 Hz and 500 Hz, advantageously, the frequency of the vibrating element 200 can be comprised between 100 Hz and 300 Hz, advantageously, the frequency of the vibrating element 200 can be comprised between 150 Hz and 300 Hz, advantageously, the frequency of the vibrating element 200 can be comprised between 50 Hz and 200 Hz, and / or, the frequency of the vibrating element 200 can be comprised between 20 kHz and 50 kHz, advantageously, the frequency of the vibrating element 200 can be 25 kHz, and / or, the frequency of the vibrating element 200 can be comprised between 0.8 MHz and 1.2 MHz, advantageously, the frequency of the vibrating element 200 can be 1 MHz, and / or, the frequency of the vibrating element 200 can be comprised between 1.3 MHz and 1.7 MHz, advantageously, the frequency of the vibrating element 200 can be 1.5 MHz, and / or, the frequency of the vibrating element 200 can be comprised between 1.8 MHz and 2.2 MHz, advantageously, the frequency of the vibrating element 200 can be 2 MHz, the frequency of the vibrating element 200 can be comprised between 1.7 MHz and 2.5 MHz.

[0065] Preferably, the vibrating element 200 is an ultrasonic transducer.

[0066] As it is known, ultrasonic waves are sounds with frequencies from 20 kHz to several megahertz. When the frequency of the ultrasonic transducer 200 is comprised between 20 kHz and 50 kHz, advantageously, 25 kHz, cavitation phenomena occur, thus reducing the thickness of the boundary layer and thus enhancing the heat exchange between the heat generating components 166 and the cooling liquid in the WB assembly 160. When the frequency of the ultrasonic transducer 200 is comprised between 1.8 MHz and 2.2 MHz, advantageously, 2 MHz, acoustic streaming occurs, thus increasing the local turbulence of the heat transfer liquid flow and thus enhancing the heat exchange in the WB assembly 160. When the frequency of the ultrasonic transducer 200 is comprised between 800 kHz and 1.8 MHz, advantageously, between 800 kHz and 1.2 MHz, advantageously, 1 MHz, the combination of cavitation phenomena and acoustic streaming enhances the heat exchange in the heat exchanger.

[0067] It should be noted that the Reynolds number of the heat transfer liquid can be comprised between 500 and 10000, advantageously, between 500 and 800, advantageously, between 900 and 5000. The higher the Reynolds number, the less the ultrasonic transducer 200 influences the cooling liquid flow, so that a liquid cooling type device with a Reynolds number comprised between 500 and 800 is preferred.

[0068] The ultrasonic wave power of the ultrasonic transducer 200 is comprised between 50 W and 200 W, advantageously, 100 W.

[0069] The two ultrasonic transducers can be positioned so that the main direction of the field of the first transducer 200-1 forms an angle with the main direction of the field of the second transducer 200-2, the angle being comprised between 0° and 360°, preferably between 0° and 180°. Figure 3 In particular, the two ultrasonic transducers can be collinear (200-2, 200-3), or also perpendicular (200-1 and 200-2 or 200-3), or form other angles, depending on the degree of impingement of the liquid for cooling.

[0070] The two ultrasonic transducers can have the same frequency and ultrasonic power, or, on the contrary, different frequencies and / or ultrasonic powers. For example, the WB assembly 160 can comprise a first ultrasonic transducer and a second ultrasonic transducer with a frequency lower than 1 MHz, lower than 500 kHz, lower than 100 kHz, and a third ultrasonic transducer and a fourth ultrasonic transducer with a frequency comprised between 1 MHz and 1.5 MHz or between 1.8 MHz and 2.5 MHz.

[0071] As previously mentioned, depending on the number of vibrating elements 200, the positioning of the vibrating elements 200, the frequency and acoustic power of the vibrating elements 200 and the relative direction of their main directions, the boundary layer is reduced and the turbulence is increased, which leads to a better heat transfer in the WB assembly 160.

[0072] In other words, the efficiency of the WB assembly 160 is improved after being equipped with vibrating elements 200, thanks to the optimization of the heat exchange between the heat transfer liquid and the component (for example, because of the reduced boundary layer and / or the electrical current). The plurality of vibrating elements is able to better improve the heat exchange, thanks to the synergistic effect generated when the vibrating elements have different frequencies and / or are positioned relative to each other. Another advantage is that the WB assembly 160 can be chosen more compact, in the case of optimized heat exchange.

[0073] Preferably, the heat exchanger is arranged at or on the back door of the rack carrying the cluster of servers 110, 112,..., 11M, as already explained.

[0074] The present disclosure is particularly interesting in which the liquid for cooling flowing inside the ALHEX 120, 122,..., 12M can be used to cool the air flow of the rack.

[0075] Modifications and improvements to the above-described implementations of the technology can become apparent to those skilled in the art. The foregoing description is intended to be exemplary rather than limiting. The scope of the technology is therefore intended to be limited only by the scope of the appended claims.

Claims

1. A cooling block (160) for cooling a heat-generating electronic component (166), the cooling block comprising: The body (162) has an outer surface (164), which is referred to as a heat transfer surface, and is configured to be in thermal contact with the heat-generating electronic component. The body defines a fluid conduit (170) for circulating cooling liquid internally, the fluid conduit having at least one inlet (172) for receiving the cooling liquid and at least one outlet (174) for discharging the cooling liquid. The cooling block also includes at least one acoustic wave generator (200), which is referred to as a vibration element and is configured to generate a vibration field of the cooling liquid in the fluid conduit, which is referred to as a vibration region.

2. The cooling block according to claim 1, wherein, The frequency of the vibrating element (200) is between 30 Hz and 500 Hz, advantageously, the frequency of the vibrating element (200) is between 150 Hz and 300 Hz; and / or, the frequency of the vibrating element (200) is between 20 kHz and 50 kHz, advantageously, the frequency of the vibrating element (200) is 25 kHz; and / or, the frequency of the vibrating element (200) is between 0.8 MHz and 1.2 MHz, advantageously, the frequency of the vibrating element (200) is 1 MHz; and / or, the frequency of the vibrating element (200) is between 1.3 MHz and 1.7 MHz, advantageously, the frequency of the vibrating element (200) is 1.5 MHz; and / or, the frequency of the vibrating element (200) is between 1.8 MHz and 2.2 MHz, advantageously, the frequency of the vibrating element (200) is 2 MHz.

3. The cooling block according to claim 1 or 2, wherein, The vibrating element (200) is arranged on the outer surface of the body.

4. The cooling block according to any one of the preceding claims, wherein, The vibrating element (200) is configured such that the generated field has a main direction that forms an angle between 0° and 360° with the longitudinal axis of the cooling block (160).

5. The cooling block according to any one of the preceding claims, wherein the cooling block comprises at least a first vibration element (200-1) and a second vibration element (200-2).

6. The cooling block according to the preceding claim, wherein, The first vibrating element (200-1) and the second vibrating element (200-2) are configured such that the frequency of the first vibrating element (200-1) is different from the frequency of the second vibrating element (200-2).

7. The cooling block according to claim 5 or 6, wherein, The first vibrating element (200-1) and the second vibrating element (200-2) are configured such that the field generated by the first vibrating element (200-1) exhibits a principal direction that forms a non-zero angle with the principal direction of the field generated by the second vibrating element (200-2).

8. The cooling block according to the preceding claim, wherein, The principal direction of the field generated by the first vibrating element (200-1) is perpendicular to the principal direction of the field generated by the second vibrating element (200-2).

9. The cooling block according to any one of the preceding claims, wherein, The acoustic power of the sound wave generator is between 50W and 200W, and advantageously, the acoustic power of the sound wave generator is 100W.

10. A liquid-cooled device for a data center server rack, the liquid-cooled device comprising: A liquid cooling circuit configured to deliver a cooling liquid; Multiple server clusters, each server cluster comprising multiple server components, the multiple server components including at least one corresponding cooling block as described in any of the preceding claims and configured to collect at least a portion of the heat energy generated by the heat-generating electronic components; At least one heat exchanger, the at least one heat exchanger being fluidly connected to the liquid cooling units of the plurality of server clusters via the liquid cooling loop; as well as A pump (130) is fluidly connected to the heat exchanger via the liquid cooling circuit, and the pump is configured to deliver the cooling liquid in the liquid cooling circuit.

11. The liquid cooling device according to claim 10, wherein, The at least one switch is located on the back door of the rack hosting the server cluster.

12. The liquid cooling device according to claim 10 or 11, wherein, The at least one heat exchanger is configured to cool the airflow by circulating the cooling liquid in the heat exchange zone.

Images