Chip picking and positioning method and device

Abstract

The invention relates to the technical field of semiconductor manufacturing, in particular to a chip picking and positioning method and device. The method comprises the steps of using a first light source or a second light source to illuminate an ejector pin, obtaining an ejector pin image, and identifying position coordinates of the ejector pin based on the ejector pin image; using a first light source or a second light source to illuminate a chip, obtaining a chip image, and identifying position coordinates of the chip based on the chip image; based on the position coordinates of the ejector pin and the position coordinates of the chip, moving the position of the chip to enable the center of the chip to be aligned with the center of the ejector pin; and the ejector pin is controlled to jack up the chip, and the chip is picked up. According to the invention, an illumination scheme of combining the annular light source and the coaxial point light source is adopted, so that the interference with the thimble structure is avoided, the precise visual positioning of the chip and the thimble is realized, and the precision and stability of chip picking and positioning are effectively improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and more specifically, to a chip picking and positioning method and apparatus. Background Technology

[0002] Wafer bonding is a core process in semiconductor manufacturing that enables the interconnection between chips and wafers. It precisely connects chips and wafers through mechanical fixation, electrical conduction, and thermal matching technologies. This technology is widely used in 3D integration, microelectromechanical systems (MEMS), and advanced packaging, playing a crucial role in improving integration density and performance.

[0003] Before aligning and bonding the chip to the wafer, the chip needs to be picked up from the carrier film and transferred to the bonding head. Since the chip spacing may change irregularly after film expansion, the relative spacing of each chip is different. If the chip is not accurately identified and positioned before picking, it is very easy to cause pick-up position deviation, which may lead to chip damage or bonding alignment failure, seriously affecting bonding quality and efficiency.

[0004] In existing technologies, chip positioning typically involves adding a machine vision system, specifically using backlighting to acquire chip position information and assist in the picking operation. For example, Chinese invention patent CN119812022A discloses a chip-to-wafer bonding device, in which a loading and positioning detection mechanism determines the chip size and quantity. This mechanism includes a surface light source positioned below a light source base plate, forming a typical backlighting method. However, this approach has significant drawbacks: when a chip ejector pin mechanism is located below the chip, the installation space and optical path of the backlight can easily interfere with the pin structure. This not only increases the difficulty of system design and debugging but may also affect image clarity and positioning accuracy, making it difficult to meet the process requirements of high-precision bonding.

[0005] Therefore, it is necessary to propose a new chip pickup and positioning method and device to overcome the shortcomings of existing backlighting methods. Summary of the Invention

[0006] The purpose of this invention is to provide a chip pickup and positioning method and apparatus to solve the problem that the backlight illumination method in the existing wafer bonding process cannot effectively guarantee the chip pickup and positioning accuracy and stability.

[0007] To achieve the above objectives, the present invention provides a chip pickup and positioning method, comprising the following steps:

[0008] Illuminate the ejector pin using a first light source or a second light source, acquire an image of the ejector pin, and identify the position coordinates of the ejector pin based on the image of the ejector pin;

[0009] The chip is illuminated using a first light source or a second light source to acquire an image of the chip, and the position coordinates of the chip are identified based on the chip image.

[0010] Based on the position coordinates of the ejector pin and the position coordinates of the chip, move the chip position so that the center of the chip is aligned with the center of the ejector pin;

[0011] The control pins lift the chip, allowing for chip pickup.

[0012] In some embodiments, the first light source is a ring light source, and the second light source is a coaxial point light source.

[0013] In some embodiments, illuminating the chip with a first light source or a second light source, acquiring a chip image, and identifying the chip's position coordinates based on the chip image includes:

[0014] The chip outline is illuminated using a first light source to obtain a first chip image;

[0015] The chip outline is illuminated using a second light source to obtain a second chip image;

[0016] Compare the imaging quality metrics of the first chip image and the second chip image, and select the image with the better imaging quality metrics as the target chip image;

[0017] Based on the target chip image, the position coordinates of the chip are identified.

[0018] In some embodiments, the imaging quality metrics include at least one of contrast and sharpness.

[0019] In some embodiments, identifying the position coordinates of the thimble based on the thimble image includes: performing image processing on the thimble image to obtain the position coordinates of the center of the thimble in the camera's field of view;

[0020] The step of identifying the chip's position coordinates based on the chip image includes: performing image processing on the chip image to obtain the position coordinates of the chip's center in the camera's field of view.

[0021] In some embodiments, the first light source is a ring light source:

[0022] The diameter of the ring light source is between 10mm and 400mm.

[0023] In some embodiments, the first light source is a surface light source, a strip light source, or an arc light source.

[0024] In some embodiments, the first light source illuminates vertically downwards or tilted downwards.

[0025] In some embodiments, the second light source is of the type of visible light or infrared light, with a wavelength range of 400nm-1700nm.

[0026] To achieve the above objectives, the present invention provides a chip pickup and positioning device, comprising:

[0027] The lighting module is used to provide a first light source and a second light source;

[0028] The imaging module, connected to the image processing module, is used to acquire images of the ejector pin and the chip.

[0029] The image processing module, connected to the motion control module, is used to recognize the position coordinates of the ejector pin based on the ejector pin image and the position coordinates of the chip based on the chip image;

[0030] The motion control module, connected to the pickup actuator, is used to move the chip position based on the position coordinates of the ejector pin and the chip so that the chip center is aligned with the ejector pin center, and to control the ejector pin to lift the chip.

[0031] The pick-up actuator is used to pick up the chip after it is lifted by the ejector pin.

[0032] In some embodiments, the imaging module includes a lens and a camera:

[0033] The lens is used for optical imaging of the pin and the chip;

[0034] The camera is used to convert the optical imaging of the pin and the chip into pin images and chip images.

[0035] In some embodiments, the lighting module includes a first light source and a second light source;

[0036] The first light source is a ring light source, a surface light source, a strip light source, or an arc light source;

[0037] The second light source is a coaxial point light source.

[0038] In some embodiments, the first light source is located either outside the lens at the same height as the lens or at a height position between the chip and the lens;

[0039] The first light source illuminates vertically downwards or tilted downwards.

[0040] This invention proposes a chip pickup and positioning method and apparatus. By employing an illumination scheme that combines a ring light source and a coaxial point light source, and further introducing a light source selection mechanism based on imaging quality assessment to adapt to chips with different characteristics, it achieves precise visual positioning of the chip and the ejector pin while avoiding interference with the ejector pin structure. This effectively improves the accuracy and stability of chip pickup and positioning, provides a reliable guarantee for subsequent chip-to-wafer bonding processes, and is applicable to high-precision bonding equipment in the semiconductor manufacturing field. Attached Figure Description

[0041] The above and other features, properties and advantages of the present invention will become more apparent from the following description taken in conjunction with the accompanying drawings and embodiments, in which the same reference numerals always denote the same features, wherein:

[0042] Figure 1 A step diagram of a chip pickup and positioning method according to an embodiment of the present invention is disclosed;

[0043] Figure 2 A flowchart of a chip pickup and positioning method according to an embodiment of the present invention is disclosed;

[0044] Figure 3 A step diagram of a chip image recognition method according to an embodiment of the present invention is disclosed;

[0045] Figure 4 A schematic diagram of the structure of a chip pickup and positioning device according to an embodiment of the present invention is disclosed;

[0046] Figure 5 An imaging effect diagram of a ring light source for imaging a pin according to an embodiment of the present invention is disclosed;

[0047] Figure 6 An imaging effect diagram of a thimble image based on a coaxial point light source according to an embodiment of the present invention is disclosed;

[0048] Figure 7 A schematic diagram of dark-field illumination for chip contour imaging using a ring light source according to an embodiment of the present invention is disclosed;

[0049] Figure 8 An imaging effect diagram of dark field illumination for chip contour imaging by a ring light source according to an embodiment of the present invention is disclosed;

[0050] Figure 9 A schematic diagram of bright-field illumination for chip contour imaging using a coaxial point light source according to an embodiment of the present invention is disclosed.

[0051] Figure 10 The image shows the bright-field illumination effect of a coaxial point light source for chip contour imaging according to an embodiment of the present invention.

[0052] The meanings of the labels in the figures are as follows:

[0053] 11 cameras;

[0054] 12 lenses;

[0055] 21. Ring light source;

[0056] 22 coaxial point light sources;

[0057] 31 chips;

[0058] 32 thimbles. Detailed Implementation

[0059] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the invention.

[0060] This invention provides a chip pickup and positioning method and apparatus to solve the problem of interference between backlight illumination and ejector pin mechanical structure in existing wafer bonding processes, and to ensure the accuracy and stability of chip pickup and positioning.

[0061] Figure 1 A step diagram of a chip pickup and positioning method according to an embodiment of the present invention is disclosed, as follows: Figure 1 and Figure 2 As shown, the chip pickup and positioning method includes the following steps:

[0062] Step S1: Illuminate the ejector pin using a first light source or a second light source, acquire an image of the ejector pin, and identify the position coordinates of the ejector pin based on the image of the ejector pin;

[0063] Step S2: Illuminate the chip using a first light source or a second light source, acquire a chip image, and identify the chip's position coordinates based on the chip image;

[0064] Step S3: Based on the position coordinates of the ejector pin and the position coordinates of the chip, move the chip position so that the center of the chip is aligned with the center of the ejector pin;

[0065] Step S4: Control the ejector pin to lift the chip and pick it up.

[0066] The present invention proposes a chip pickup and positioning method, which uses dual light source adaptation of a first light source and a second light source and performs precise coordinate calculation to ensure the accuracy and stability of chip pickup and positioning, and to meet the process requirements before chip bonding to wafer.

[0067] Figure 2 A flowchart illustrating a chip pickup and positioning method according to an embodiment of the present invention is shown, such as... Figure 2As shown, the entire chip pickup and positioning process proposed in this invention is fully presented. In this embodiment, the first light source is preferably a ring light source with a diameter between 10mm and 400mm to adapt to different fields of view and lighting requirements. Furthermore, the first light source can also be replaced with other forms of lighting sources such as surface light sources, strip light sources, or arc light sources. Its lighting method can be vertical downward illumination or oblique downward illumination to obtain lighting effects at different angles.

[0068] The second light source is a coaxial point light source, which can be visible light or infrared light, with a wavelength range typically between 400nm and 1700nm, to meet the imaging needs of chips made of different materials. For example, when processing a chip with a transparent epoxy resin passivation layer on its surface, if 450nm visible light is used as the coaxial point light source, the light is prone to specular reflection on the surface of the passivation layer, causing the chip outline to be submerged by strong light; however, after switching to 1550nm infrared light, the infrared light can penetrate the passivation layer, making the chip body and the supporting film form a clear grayscale contrast, thereby clearly presenting the chip boundary.

[0069] The following will combine Figure 2 Examples illustrate these steps of the method in detail. It should be understood that, within the scope of this invention, the above-described technical features of this invention and the technical features specifically described below (such as in the embodiments) can be combined and associated with each other to constitute preferred technical solutions.

[0070] In step S1, the pin is imaged, and the pin's precise position is identified based on the pin image.

[0071] Specifically, a ring light source or a coaxial point light source can be turned on to illuminate the pin, and the camera can capture images of the pin. By processing the images of the pin, the edge contour of the pin can be identified, and the position coordinates of the center of the pin in the camera's field of view can be calculated.

[0072] The image processing algorithm can be any commonly used algorithm in the field, including edge detection, contour extraction and center point calculation. The specific method is not limited, as long as it can achieve the expected function.

[0073] Step S1 achieves pre-calibration of the ejector pin position, ensuring that the subsequent chip remains coaxial with the center of the ejector pin, thereby effectively ensuring that the chip is ejected more smoothly and reliably.

[0074] It should be noted that imaging the ejector pin does not require the simultaneous use of two light sources. Either a ring light source or a coaxial point light source can be selected based on the actual imaging effect. If further improvement in positioning accuracy is needed, two light sources can be used sequentially, and the optimal image can be selected based on its imaging quality. Specifically, referring to the chip image recognition method in step S2, the imaging quality of the ejector pin images under different light sources can be compared. By comparing the contrast and sharpness indicators of the images, the optimal image can be selected for identifying the ejector pin's position coordinates, thereby further improving the accuracy of ejector pin positioning.

[0075] In step S2, the chip is imaged and its precise position is identified based on the chip image, thereby obtaining the precise coordinates of the chip carried on the thin film.

[0076] Figure 3 A step diagram of a chip image recognition method according to an embodiment of the present invention is disclosed, as follows: Figure 3 As shown, to achieve the best imaging effect, step S2 further includes:

[0077] Step S21: Illuminate the chip outline using the first light source to obtain a first chip image;

[0078] Step S22: Illuminate the chip outline using a second light source to obtain a second chip image;

[0079] Step S23: Compare the imaging quality indicators of the first chip image and the second chip image, and select the image with better imaging quality indicators as the target chip image.

[0080] Step S24: Based on the target chip image, identify the position coordinates of the chip.

[0081] like Figure 3 As shown, steps S21 to S24 involve acquiring chip images under two different light sources and selecting the image with the better imaging effect for positioning, thereby effectively improving the accuracy of chip position recognition and environmental adaptability.

[0082] More specifically, in this embodiment, by arranging a ring light source outside the lens, the chip outline is clearly imaged by utilizing the difference in light reflectivity between the chip and the carrier film; at the same time, by arranging a coaxial point light source in the lens optical path, effective illumination can also be provided.

[0083] More specifically, in step S21, the first light source is activated to illuminate the chip outline vertically downwards, and the first chip image is captured by a camera.

[0084] More specifically, in step S22, the first light source is turned off, the second light source is turned on, and coaxial illumination is provided for the same area of ​​the chip outline, so that the second chip image is captured by the camera.

[0085] For example, the first light source is a ring light source, the diameter of which is selected according to the chip size. For instance, when the chip size is 5mm × 5mm, a ring light source with a diameter of 20mm can be selected and mounted on the outside of the lens, ensuring that it is at the same height as the lens. The second light source is a coaxial point light source, typically using visible light with a wavelength of 650nm; if the chip surface has a transparent passivation layer, it can be switched to infrared light with a wavelength of 940nm.

[0086] For chips with different materials and surface properties, the imaging effects of the two light sources differ. This method dynamically evaluates and selects the light source with better imaging effect through step S23, ensuring that chip images with high contrast and clear outlines can be obtained under various conditions, thereby significantly improving the accuracy and adaptability of positioning.

[0087] More specifically, the imaging quality metrics in step S23 include at least one of contrast and sharpness, and the specific evaluation method is as follows:

[0088] Contrast is evaluated by calculating the grayscale difference between the chip area and the thin film area carrying the chip. For example, if the grayscale difference of the first chip image is 80 and the grayscale difference of the second chip image is 120, then the contrast of the second chip image is determined to be better.

[0089] Sharpness is measured by using grayscale gradient operators (such as the Sobel operator) to measure the gradient intensity of the chip contour edges. The larger the gradient value, the sharper and clearer the image edges.

[0090] Ultimately, based on the selected imaging quality index (contrast only, sharpness only, or a combination of both), the image with the better performance in the corresponding index will be selected as the target chip image to improve the accuracy and stability of subsequent positioning.

[0091] This step can be adapted to chips with different reflectivities: for example, for chips with a high proportion of surface metal wiring, the ring light source is prone to blurring the outline due to metal reflection. In this case, the directional illumination of the coaxial point light source can reduce reflection and become the optimal choice; for silicon-based bare chips with flat surfaces, the uniform illumination of the ring light source can obtain a clearer outline and is more suitable as a target light source.

[0092] More specifically, in step S24, the camera acquires an image of the chip, performs image processing on the chip image, identifies the edge contour of the chip, and calculates the position coordinates of the chip's center in the camera's field of view.

[0093] Optionally, the same algorithm as that used for pin position recognition is applied to the chip image to calculate the geometric center of the chip contour and convert it into physical coordinates, thereby completing the identification of the chip position coordinates.

[0094] More specifically, in step S3, after obtaining the precise center coordinates of the ejector pin and the chip, the positional deviation between the two on the horizontal plane is calculated. Then, the moving platform (such as the XY platform) carrying the chip is controlled to move to eliminate the positional deviation, so that the center of the chip and the center of the ejector pin are completely coincident in the vertical projection, thus achieving precise alignment.

[0095] More specifically, in step S4, after alignment is completed, the ejector pin mechanism is controlled to move vertically to lift the chip from the carrier film; subsequently, the pick-up actuator (e.g., the vacuum nozzle of the bonding head) descends to pick up the lifted chip, thereby completing the entire pick-up process.

[0096] Although the methods described above are illustrated and depicted as a series of actions for the sake of simplicity, it should be understood and appreciated that these methods are not limited by the order of the actions, as some actions may occur in a different order and / or concurrently with other actions from the illustrations and descriptions herein or not illustrated and described herein but which may be understood by those skilled in the art, according to one or more embodiments.

[0097] This invention proposes a chip pickup and positioning device for implementing the above-mentioned chip pickup and positioning method.

[0098] Figure 4 A schematic diagram of a chip pickup and positioning device according to an embodiment of the present invention is shown, as follows: Figure 4 As shown, the chip pickup and positioning device proposed in this invention mainly includes an imaging module, an illumination module, an image processing module, a motion control module, and a pickup execution mechanism.

[0099] The imaging module, connected to the image processing module, is used to acquire images of the ejector pin and the chip.

[0100] The lighting module, connected to the image processing module, is used to provide a first light source and a second light source.

[0101] The image processing module, connected to the motion control module, is used to receive image data from the imaging module and execute image processing algorithms to recognize the position coordinates of the pin 32 based on the pin image and the position coordinates of the chip 31 based on the chip image.

[0102] The motion control module, connected to the pickup actuator, receives the position coordinates calculated by the image processing module and controls the moving platform to align the center of chip 31 with the center of ejector pin 32, while controlling the ejector pin mechanism to lift chip 31.

[0103] The pick-up actuator is used to perform a pick-up operation on the chip 31 after the chip 31 is lifted by the ejector pin 32.

[0104] exist Figure 4 In the chip pickup and positioning device shown, each functional module works collaboratively through corresponding hardware entities: the imaging module acquires images using lens 12 and camera 11; the illumination module provides multi-mode optical illumination by including ring light source 21 and coaxial point light source 22; the image processing module runs image processing algorithms using an industrial computer or embedded processor; the motion control module adjusts the chip position and operates the ejector pins through a motion control card, motor, and moving platform; and the pickup execution mechanism completes the chip pickup task using a vacuum nozzle or mechanical gripper.

[0105] Furthermore, the imaging module includes a lens 12 and a camera 11; the lens 12 is used to perform optical imaging of the pin 32 and the chip 31; the camera 11 is used to convert the optical imaging of the pin 32 and the chip 31 into digital image signals, namely pin images and chip images.

[0106] Furthermore, the lighting module includes a ring light source 21 as the first light source, or an alternative surface light source, strip light source, or arc light source, and a coaxial point light source 22 as the second light source. The first light source is located outside the lens 12, and its position can be located at any of the following: at the same height as the lens 12 or at the height between the chip 31 and the lens 12. The lighting method can be vertically downward or tilted downward.

[0107] The following is combined with Figure 4 The chip pickup and positioning device shown illustrates the chip pickup and positioning method proposed in this invention.

[0108] After the device is started, the lighting module first controls the ring light source 21 or the coaxial point light source 22 to illuminate the pin 32. The camera 11 in the imaging module, with the help of the lens 12, acquires images of the pin and transmits the pin image data to the image processing module.

[0109] Figure 5 An imaging effect diagram of a ring light source for imaging a pin according to an embodiment of the present invention is shown, such as... Figure 5 As shown, under the uniform illumination of the ring light source, the edge contour of the pin is clearly visible without obvious reflection interference, which is conducive to the image processing module accurately identifying the geometric center of the pin.

[0110] Figure 6 An imaging effect diagram of a thimble image created by a coaxial point light source according to an embodiment of the present invention is shown, such as... Figure 6 As shown, under vertical illumination from a coaxial point light source, the central feature of the top of the pin is accurately captured, and the image is uniform overall, which helps to accurately extract the center coordinates.

[0111] The image processing module performs edge detection, contour extraction and other algorithms on the thimble image to calculate the position coordinates of the thimble's center in the camera's field of view.

[0112] Subsequently, the device executes the chip positioning process. The lighting module sequentially activates the ring light source 21 and the coaxial point light source 22 to illuminate the chip 31.

[0113] Figure 7 A schematic diagram of dark-field illumination for chip contour imaging using a ring light source according to an embodiment of the present invention is shown, such as... Figure 7 As shown, after the ring light source 21 is turned on, it illuminates the chip 31. The illumination method is tilted, and the light shines on the surface of the chip 31 at a preset angle (such as 15°-45°) to avoid surface reflection caused by direct light.

[0114] Figure 8 The image shows the dark-field illumination effect of a ring light source for chip contour imaging according to an embodiment of the present invention, such as... Figure 8 As shown, under dark field illumination conditions for chip contour imaging by a ring light source, the edge of chip 31 is significantly highlighted due to the scattering effect of light, forming a high contrast with the background of the supporting thin film, which is particularly suitable for contour imaging of flat silicon-based bare chips.

[0115] Figure 9 A schematic diagram of bright-field illumination for chip contour imaging using a coaxial point light source according to an embodiment of the present invention is shown, such as... Figure 9 As shown, the coaxial point light source 22 is turned on, and its optical path is consistent with the camera's optical path, providing vertical illumination for the chip 31. This directional illumination method can effectively suppress specular reflection for chips with metal wiring on their surface, revealing a clear chip boundary.

[0116] Figure 10 The image shows the bright-field illumination effect of a coaxial point light source for chip contour imaging according to an embodiment of the present invention, such as... Figure 10 As shown, under bright field illumination of the chip contour imaging by a coaxial point light source, the detailed texture of the chip 31 surface is completely preserved. Even if the chip 31 has a complex surface structure (such as a passivation layer and metal wiring), it can provide rich feature information to meet the requirements of image processing algorithms for image details.

[0117] The camera 11 in the imaging module, in conjunction with the lens 12, acquires the first chip image under the illumination of the ring light source 21 and the second chip image under the illumination of the coaxial point light source 22, and transmits the two image data synchronously to the image processing module.

[0118] After receiving the first chip image and the second chip image, the image processing module calculates their contrast and sharpness indices using the aforementioned method, and automatically selects the image with the better imaging quality indices as the target chip image. Based on this target chip image, the image processing module uses algorithms such as contour extraction and center calculation to ultimately identify the precise position coordinates of chip 31.

[0119] After acquiring the position coordinates of the ejector pin 32 and the chip 31, the motion control module drives the moving platform to adjust the position of the chip 31, ensuring precise vertical alignment between the center of the chip 31 and the center of the ejector pin 32. Once aligned, the motion control module controls the ejector pin mechanism to rise vertically, smoothly lifting the chip off the supporting film. The pickup actuator then actuates, picking up the lifted chip 31 using vacuum adsorption or other methods, completing the entire pickup and positioning process.

[0120] The chip pickup and positioning method and apparatus proposed in this invention have the following beneficial effects:

[0121] 1) Effectively avoid mechanical interference and improve system reliability: The lighting method combining ring light source and coaxial point light source completely avoids the spatial conflict between traditional backlighting and the ejector pin mechanism under the chip, simplifies the mechanical structure design, and enhances the overall stability and reliability of the system.

[0122] 2) Significantly enhance imaging adaptability and improve positioning accuracy and robustness: By integrating the dark field illumination of the ring light source and the bright field illumination of the coaxial point light source, the contour imaging effect of chips with different surface characteristics is effectively enhanced; combined with the image quality evaluation mechanism, the optimal imaging light source is dynamically selected to ensure that images with sharp contrast and clear contours can be obtained under various complex working conditions (such as different chip materials, surface structures and thin film characteristics), thereby achieving high-precision and high-stability positioning of chips and ejector pins.

[0123] 3) Optimize the process flow to improve production yield and efficiency: By pre-calibrating the position of the ejector pin and accurately aligning the chip and ejector pin, the stability and consistency of the chip lifting process are ensured, significantly reducing the risk of offset, tilting and breakage during the picking process; at the same time, the automated light source selection and image processing process reduces manual intervention and debugging time, which helps to improve the overall production efficiency and automation level.

[0124] As indicated in this invention and the claims, unless the context clearly indicates otherwise, the words "a," "an," "an," and / or "the" do not specifically refer to the singular and may also include the plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of explicitly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements.

[0125] In the description of this invention, it should be noted that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0126] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0127] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0128] The above embodiments are provided for those skilled in the art to implement or use the present invention. Those skilled in the art can make various modifications or changes to the above embodiments without departing from the inventive concept of the present invention. Therefore, the protection scope of the present invention is not limited to the above embodiments, but should be the maximum scope that conforms to the innovative features mentioned in the claims.

Claims

1. A chip pickup and positioning method, characterized in that, Includes the following steps: Illuminate the ejector pin using a first light source or a second light source, acquire an image of the ejector pin, and identify the position coordinates of the ejector pin based on the image of the ejector pin; The chip is illuminated using a first light source or a second light source to acquire an image of the chip, and the position coordinates of the chip are identified based on the chip image. Based on the position coordinates of the ejector pin and the position coordinates of the chip, move the chip position so that the center of the chip is aligned with the center of the ejector pin; The control pins lift the chip, allowing for chip pickup.

2. The chip pickup and positioning method according to claim 1, characterized in that, The first light source is a ring light source, and the second light source is a coaxial point light source.

3. The chip pickup and positioning method according to claim 1, characterized in that, The step of illuminating the chip using a first light source or a second light source, acquiring a chip image, and identifying the chip's position coordinates based on the chip image includes: The chip outline is illuminated using a first light source to obtain a first chip image; The chip outline is illuminated using a second light source to obtain a second chip image; Compare the imaging quality metrics of the first chip image and the second chip image, and select the image with the better imaging quality metrics as the target chip image; Based on the target chip image, the position coordinates of the chip are identified.

4. The chip pickup and positioning method according to claim 3, characterized in that, The imaging quality metrics include at least one of contrast and sharpness.

5. The chip pickup and positioning method according to claim 1, characterized in that, The step of identifying the position coordinates of the thimble based on the thimble image includes: performing image processing on the thimble image to obtain the position coordinates of the center of the thimble in the camera's field of view; The step of identifying the chip's position coordinates based on the chip image includes: performing image processing on the chip image to obtain the position coordinates of the chip's center in the camera's field of view.

6. The chip pickup and positioning method according to claim 1, characterized in that, The first light source is a ring light source: The diameter of the ring light source is between 10mm and 400mm.

7. The chip pickup and positioning method according to claim 1, characterized in that, The first light source is a surface light source, a strip light source, or an arc light source.

8. The chip pickup and positioning method according to claim 1, characterized in that, The first light source illuminates vertically downwards or tilted downwards.

9. The chip pickup and positioning method according to claim 1, characterized in that, The second light source is of the visible light or infrared light type, with a wavelength range of 400nm-1700nm.

10. A chip pickup and positioning device, used to implement the chip pickup and positioning method as described in any one of claims 1-9, characterized in that, include: The lighting module is used to provide a first light source and a second light source; The imaging module, connected to the image processing module, is used to acquire images of the ejector pin and the chip. The image processing module, connected to the motion control module, is used to recognize the position coordinates of the ejector pin based on the ejector pin image and the position coordinates of the chip based on the chip image; The motion control module, connected to the pickup actuator, is used to move the chip position based on the position coordinates of the ejector pin and the chip so that the chip center is aligned with the ejector pin center, and to control the ejector pin to lift the chip. The pick-up actuator is used to pick up the chip after it is lifted by the ejector pin.

11. The chip pickup and positioning device according to claim 10, characterized in that, The imaging module includes a lens and a camera: The lens is used for optical imaging of the pin and the chip; The camera is used to convert the optical imaging of the pin and the chip into pin images and chip images.

12. The chip pickup and positioning device according to claim 10, characterized in that, The lighting module includes a first light source and a second light source; The first light source is a ring light source, a surface light source, a strip light source, or an arc light source; The second light source is a coaxial point light source.

13. The chip pickup and positioning device according to claim 10, characterized in that, The first light source is located outside the lens, either at the same height as the lens or at any point between the chip and the lens. The first light source illuminates vertically downwards or tilted downwards.

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