Quartz glass member for exposure of film-forming process gas and method for producing same

Abstract

Provided is a silica glass member for exposure to a film-forming process gas, the silica glass member being obtained by increasing a derived surface area obtained from a BET specific surface area, without increasing the size, shape, or size compared to conventional silica glass members for exposure to a film-forming process gas, and without causing an increase in man-hours or costs. A quartz glass member for exposure of a film-forming process gas, the quartz glass member comprising: a plate-shaped quartz glass member main body; a plurality of linear protrusions formed on at least a portion of the surface of the quartz glass member main body and having a substantially square cross-section; and a plurality of microscopic cracks formed on at least one side surface of the linear protrusions. The size surface area with the linear convex part, which is calculated according to the size, is set to be 1; when the relationship between a derived surface area obtained from a BET specific surface area obtained by a BET measurement method and a dimensional surface area with linear protrusions obtained from dimensions of the quartz glass member for exposure to film-forming treatment gas in which the linear protrusions and the microscopic cracks are formed is B times, B is 5 or more.

Description

TECHNICAL FIELD

[0001] The present application relates to a quartz glass member for exposure to a film formation processing gas and a manufacturing method thereof, the quartz glass member for exposure to a film formation processing gas being a member for exposure to a film formation processing gas that is placed in a reaction chamber together with a semiconductor substrate subjected to a film formation processing at the time of the film formation processing of the semiconductor substrate, and that has an increased exposure area to a film formation processing gas. BACKGROUND

[0002] Conventionally, in a manufacturing process of a semiconductor device, a semiconductor substrate such as a silicon wafer is subjected to various film formation processes such as CVD (Chemical Vapor Deposition) or the like. At the time of the film formation process, the semiconductor substrate is placed on a wafer holding tool called a boat, carried into a reaction chamber, and subjected to the film formation process.

[0003] In such a film formation process using a wafer holding tool, a boat is made of quartz glass that does not react with a processing gas, the semiconductor substrate is placed on the boat, and the semiconductor substrate and a member made of quartz glass that does not react with a processing gas are housed in a reaction chamber and subjected to a film formation process.

[0004] A semiconductor substrate subjected to a film formation process is processed to form unevenness on the surface. As compared with a semiconductor substrate having a flat surface, the surface area is increased, and thus in order to make the film formation on the semiconductor substrate uniform, it is necessary to increase the surface area of a quartz glass member (sometimes referred to as a dummy wafer) for exposure to a film formation processing gas in a reaction chamber as much as possible.

[0005] In the case of the gas distribution adjusting member described in Patent Literature 1, the surface area is based on the outer diameter dimension, and thus the presence of minute cracks (microscopic cracks) or the like is not taken into consideration, and there is a problem that the actual surface area including the fine unevenness of the surface or the like cannot be quantitatively evaluated.

[0006] The exposure area increasing quartz glass member described in Patent Literature 2 is a technique for managing the unevenness of the dimension shape of the groove depth, and is not a technique for managing the size of the actual surface area that is considered to affect gas adsorption.

[0007] In the case of the manufacturing method described in Patent Literature 3 in which a bubble is manufactured on a silicon glass to increase the surface area, there is a problem that man-hours and costs are consumed because processing under high temperature and high pressure is required.

[0008] On the other hand, the shape and size of the quartz glass member for film formation are limited, and the size and shape cannot be increased indefinitely, and thus the size and shape are studied to increase the surface area more than ever before, and there is a limit. Therefore, it is necessary to identify an element that contributes to increasing the surface area of the quartz glass member without being affected by the size limitation of the quartz glass member for film formation and to add the element to the quartz glass member.

[0009] Therefore, the present inventors produced quartz glass members with different exposure areas using tools different from those in Example 1 of Patent Literature 2, and as a result, even with the same finish size, the BET value (Brunauer Emmett Teller Value) differed depending on the grinding stone used for processing, and the quality during film formation differed. Then, in order to clarify the cause of the difference, an investigation was conducted, and as a result, even with the same finish size, the BET specific surface area differed depending on the processing conditions, and if a member with a large BET specific surface area was used, the quality during film formation was better.

[0010] Prior Art Documents

[0011] Patent Literature

[0012] Patent Literature 1: Japanese Patent Application Publication No. 2015-173154

[0013] Patent Literature 2: WO2017 / 217309

[0014] Patent Literature 3: WO2022 / 215663 SUMMARY

[0015] Problems to be Solved by the Invention

[0016] The object of the present invention is to provide a quartz glass member for film formation process gas exposure that is not increased in size and shape compared to conventional quartz glass members for film formation process gas exposure and does not result in an increase in man-hours and costs, and a method for manufacturing the same.

[0017] Means for Solving the Problems

[0018] The quartz glass member for film formation processing gas exposure of the present invention is a plate-shaped quartz glass member for film formation processing gas exposure exposed to a film formation processing gas used in a semiconductor film formation process, wherein the quartz glass member for film formation processing gas exposure includes: a plate-shaped quartz glass member main body; a plurality of linear protrusions of substantially square cross section formed on at least a portion of a surface of the quartz glass member main body; and a plurality of microscopic cracks formed on at least one side surface of the linear protrusions, and when a size-derived dimension surface area with linear protrusions is taken as 1, and a relationship between a derived surface area derived from a BET specific surface area obtained by a BET measurement method and the size-derived dimension surface area with linear protrusions of the quartz glass member for film formation processing gas exposure formed with the linear protrusions and the microscopic cracks is taken as B times, B is 5 or more.

[0019] The quartz glass member for film formation processing gas exposure is preferably such that, when a quartz glass member with only flat surfaces, which assumes that the surface of the quartz glass member main body has no linear protrusions and microscopic cracks, is taken as 1 for a size-derived dimension surface area with only flat surfaces, and a quartz glass member with linear protrusions, which assumes that linear protrusions are formed on at least a portion of the surface of the quartz glass member main body and has surfaces that have no microscopic cracks, is taken as A times for a size-derived dimension surface area with linear protrusions, and a relationship between a derived surface area derived from the BET specific surface area and the size-derived dimension surface area with only flat surfaces is taken as C times, when the size-derived dimension surface area with only flat surfaces is taken as 1, the relationship A < B < C is satisfied.

[0020] The quartz glass member for film formation processing gas exposure is preferably such that the relationship B is 2 times or more of A, and C is 6 times or more of A is satisfied.

[0021] It is preferable that, with respect to the microscopic cracks formed within 0.1 mm per unit length of the at least one side surface of the linear protrusions, the microscopic crack average depth of each of the microscopic cracks is 8 μm or more, and the total depth of all of the microscopic cracks per the unit length is 50 μm or more.

[0022] It is preferable that the microscopic cracks are enlarged microscopic cracks that are enlarged by etching.

[0023] It is preferable that the BET specific surface area obtained by a BET measurement method of the quartz glass member for film formation processing gas exposure including the enlarged microscopic cracks is 7 times or more of the BET specific surface area obtained by a BET measurement method of a quartz glass member with only flat surfaces, which assumes that the surface of the quartz glass member main body has no linear protrusions and microscopic cracks.

[0024] Preferably, the BET specific surface area of the quartz glass member exposed to the film formation processing gas containing the enlarged microcracks is 19 times or more larger than the BET specific surface area of a quartz glass member having only flat surfaces, assuming that the surfaces of the main body of the quartz glass member do not have the linear projections and the microcracks.

[0025] Preferably, the thickness of the main body of the quartz glass member is 1 mm to 1.5 mm, and the projection height of the linear projection is 0.6 mm or more and less than 1.5 mm.

[0026] The manufacturing method of the quartz glass member for film formation processing gas exposure of the present application is a manufacturing method of the quartz glass member for film formation processing gas exposure, wherein the manufacturing method of the quartz glass member for film formation processing gas exposure includes the following steps: forming a linear projection having a substantially square cross section by a grinding blade on at least a part of the main body of the quartz glass member; and forming a plurality of microcracks on at least one side surface of the linear projection, and the derived surface area calculated from the BET specific surface area obtained by the BET measurement is larger than the size surface area calculated from the dimensions of the quartz glass member for film formation processing gas exposure.

[0027] Preferably, the manufacturing method of the quartz glass member for film formation processing gas exposure includes the following steps: etching the main body of the quartz glass member on which the linear projection is formed, in a depth range of 0.1 μm to 0.6 μm, forming the microcracks on the linear projection, and enlarging the microcracks to form enlarged microcracks.

[0028] Preferably, the etching is performed by an HF cleaning process.

[0029] Effects of the Invention

[0030] According to the present application, the object is to provide a quartz glass member for film formation processing gas exposure and a manufacturing method thereof, in which the derived surface area calculated from the BET specific surface area is increased without increasing the size shape, size, and without incurring an increase in man-hours and cost, compared to the conventional quartz glass member for film formation processing gas exposure. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 is a schematic plan view showing one embodiment of a circular plate-shaped quartz glass member for film formation processing gas exposure of the present application.

[0032] Figure 2is an example of a linear projection formed on a quartz glass member for exposure to a film formation processing gas according to the present application, (a) is an enlarged sectional view of a surface on which the linear projection is formed, and (b) is an enlarged sectional view of a surface before the linear projection is formed.

[0033] Figure 3 is a diagram schematically showing microscopic cracks of a quartz glass member for exposure to a film formation processing gas according to the present application, (a) is a schematic view of a general microscopic crack, and (b) is a schematic view of an enlarged microscopic crack.

[0034] Figure 4 is a diagram explaining magnifications A, B, C, and X used in the present application.

[0035] Figure 5 is a schematic plan view showing one embodiment of a rotary grinding blade, (a) is a perspective view, and (b) is a front view.

[0036] Figure 6 is a diagram showing the shape of a sample for BET measurement.

[0037] Figure 7 is a result of SEM observation of Example 1 showing microscopic cracks having an amount of "medium" degree.

[0038] Figure 8 is a result of SEM observation of Example 2 showing microscopic cracks having an amount of "large" degree.

[0039] Figure 9 is a result of SEM observation of Comparative Example 1 showing microscopic cracks having an amount of "small" degree.

[0040] Figure 10 is a diagram explaining magnification E.

[0041] Figure 11 is a microscope observation photograph showing the back surface of Experimental Example 6.

[0042] Figure 12 is a microscope observation photograph showing the back surface of Experimental Example 7.

[0043] Figure 13 is a microscope observation photograph showing the back surface of Experimental Example 8. DETAILED DESCRIPTION

[0044] Hereinafter, embodiments of the present application will be described, but these embodiments are illustrative, and various modifications can be made without departing from the technical idea of the present application. In the drawings, the same components are denoted by the same reference numerals.

[0045] In Figure 1 and Figure 2In the drawings, reference numeral 10 is a quartz glass member for film formation processing gas exposure of the present application. The quartz glass member for film formation processing gas exposure 10 is a quartz glass member for film formation processing gas exposure that is placed in a reaction chamber together with a semiconductor substrate subjected to film formation processing, and exposed to a film formation processing gas in a film formation processing step of the semiconductor substrate. The quartz glass member for film formation processing gas exposure has a plate-shaped (in the illustrated example, a circular plate-shaped) quartz glass member body 12, and a plurality of linear protrusions 14 of a substantially square cross section formed on at least a portion of the quartz glass member body 12, and the exposure area to the film formation processing gas is increased.

[0046] Figure 2 (b) shows the plate-shaped (in the illustrated example, a circular plate-shaped) quartz glass member body 12 before the linear protrusions 14 are formed. As shown in Figure 2 (b), the plate-shaped (in the illustrated example, a circular plate-shaped) quartz glass member body 12 before the linear protrusions 14 are formed has a flat surface 16 and a flat back surface 18. If the linear protrusions are formed, as shown in Figure 2 (a), the recesses 20 are formed together with the linear protrusions 14. The linear protrusions 14 are composed of the surface 16 and side surfaces 22a, 22b. The recesses 20 are composed of the side surfaces 22a, 22b and a bottom surface 24. The side surfaces 22a, 22b of the recesses 20 are also the side surfaces of the linear protrusions 14. Note that, in the drawings, an example of a circular plate-shaped quartz glass member body 12 is shown, but in addition to the circular plate shape, for example, a plate-shaped quartz glass member body having a square or polygonal shape with rounded corners, or the like, can be used.

[0047] In Figure 1 and Figure 2 (a), an example in which the linear protrusions 14 are formed on one plane (the surface side) of the quartz glass member body 12 is shown, but in order to increase the specific surface area, the linear protrusions 14 can also be formed on the surface opposite to the one plane (the back surface side), and the linear protrusions 14 can be formed on both surfaces of the quartz glass member body 12. Further, in order to form the linear protrusions 14, the linear protrusions 14 can be formed by slot processing performed on the quartz glass member body 12.

[0048] <Concerning Microcracks>

[0049] The quartz glass member for film formation processing gas exposure 10 of the present application is characterized in that, as shown in Figure 2 (a), at least one of the side surfaces 22a, 22b of the linear protrusions 14, as shown in Figure 3As shown in (a), multiple microcracks 26 are formed. Microcracks 26 can also be formed on the bottom surface 24. Microcracks refer to fine cracks or fissures formed on the surface of the quartz glass component body 12. Figure 3 In (a), the microcrack 26 is schematically shown by magnifying a portion of the linear protrusion 14. Figure 3 In example (a), microcracks 26 are formed on the side surface 22a of the linear protrusion 14. Such microcracks are also formed when the linear protrusion 14 is formed. In particular, microcracks can be formed by using a grooving process to form the linear protrusion 14.

[0050] In this invention, preferably, in the microcracks 26 formed within a unit length of 0.1 mm or less on the at least one side of the linear protrusion 14, the average depth of each microcrack is 8 μm or more, and the total depth of all microcracks per unit length is 50 μm or more.

[0051] Figure 3 The microcracks schematically shown in (b) are enlarged microcracks 28 formed by etching. In this invention, it is preferable that the microcracks are enlarged microcracks 28 formed by etching. This is because, although processing contaminants on the outermost surface of the quartz glass component can be removed using pure water, etching removes the outermost surface and opens up the previously blocked microcracks, increasing the specific surface area. It should be noted that enlarged microcracks refer to microcracks whose crack portions are enlarged due to etching.

[0052] For the quartz glass component 10 for film-forming gas exposure of the present invention, when the surface area of ​​the linear protrusion (based on the external dimensions without considering the presence of microcracks, etc.) of the quartz glass component body 12, calculated according to the dimensions of the surface and the linear protrusion 14, is set to 1, and when the relationship between the derived surface area of ​​the quartz glass component for film-forming gas exposure, having the linear protrusion 14 and the microcrack 26 formed thereon, obtained by the BET specific surface area measurement method, and the surface area of ​​the linear protrusion calculated according to the dimensions of the surface and the linear protrusion 14 of the quartz glass component body 12, is set to B times, B is 5 or more. An explanatory diagram showing this multiplier is shown in [illustration missing]. Figure 4 middle.

[0053] like Figure 4 As shown, the surface area of ​​the quartz glass component body 12 from which the linear protrusion is not formed to the quartz glass component body 12 with the linear protrusion is set to A times. Techniques for increasing the surface area over such dimensions are disclosed in Patent Documents 1 and 2.

[0054] Moreover, for the film formation processing gas-exposed quartz glass member 10 of the present application, it is preferable that, when the size-derived only-flat-surface size table area of the quartz glass member in which the surface 16 of the quartz glass member main body 12 is assumed to be an only-flat-surface quartz glass member in which the linear protrusions 14 and the micro cracks 26 are not present, is set to 1, the relationship between the size-derived linear-protrusion-bearing-surface size table area of the quartz glass member in which at least a part of the surface of the quartz glass member main body is assumed to be a linear-protrusion-bearing-surface quartz glass member in which the linear protrusions 14 are present and the size-derived only-flat-surface size table area is set to A times, the relationship between the derived surface area according to the BET specific surface area and the size-derived only-flat-surface size table area when the size-derived only-flat-surface size table area is set to 1 is set to C times, the relationship of A < B < C is satisfied.

[0055] Further, for the film formation processing gas-exposed quartz glass member 10, it is preferable that the relationship of B being 2 times or more of A and C being 6 times or more of A is satisfied.

[0056] Moreover, in the present application, the BET specific surface area of the film formation processing gas-exposed quartz glass member 10 including the enlarged micro cracks obtained by the BET measurement method is preferably 7 times or more, more preferably 19 times or more, of the BET specific surface area obtained by the BET measurement method when the surface of the quartz glass member main body is assumed to be an only-flat-surface quartz glass member in which the linear protrusions and the micro cracks are not present. In the present application, the ratio of the BET specific surface area of the film formation processing gas-exposed quartz glass member 10 of the present application obtained by the BET measurement method to the BET specific surface area obtained by the BET measurement method when the surface of the quartz glass member main body is assumed to be an only-flat-surface quartz glass member in which the linear protrusions and the micro cracks are not present is referred to as the ratio X.

[0057] <About the BET measurement method>

[0058] In the present application, since the specific surface area is defined by the BET measurement method (gas adsorption method), the surface including the micro cracks and the fine irregularities can also be included as a part of the surface area. As for the measurement of the BET specific surface area based on the BET measurement method, the measurement can be performed by the carrier gas method according to the measurement method of the adsorption gas amount of JIS Z8830:2013, and the analysis of the adsorption data can be performed by the multipoint method or the single-point method.

[0059] In addition, in this invention, it is preferred that the thickness of the quartz glass component body 12 is 1 mm to 1.5 mm, and the height of the linear protrusion is 0.6 mm or more and less than 1.5 mm.

[0060] The manufacturing method of the present invention is a method for manufacturing the quartz glass component 10 for film-forming gas exposure, comprising: a step of forming a linear protrusion 14 with a generally square cross-section on at least a portion of the quartz glass component body 12 using a grinding edge; and a step of forming a plurality of microcracks 26 on at least one side surface 22a, 22b of the linear protrusion 14. The derived surface area of ​​the quartz glass component 10 for film-forming gas exposure is larger than the dimensional surface area of ​​the quartz glass component 10 for film-forming gas exposure, which is determined based on the BET specific surface area obtained by the BET measurement method.

[0061] As the grinding edge, a rotary grinding edge is preferred, for example. As a rotary grinding edge, for example, it is possible to use... Figure 5 A multi-peripheral cutting tool as shown. Figure 5 In this multi-peripheral cutting tool 30, there are: a single disc-shaped base metal portion 32; a diamond abrasive layer base portion 36 formed on the outer periphery 34 of the disc-shaped base metal portion 32; and a diamond abrasive cutting edge portion 40, which is formed by integrally providing multiple cutting edges 38 protruding from the diamond abrasive layer base portion 36. A through hole 42 for inserting a rotating shaft is provided in the center.

[0062] There are no particular restrictions on the conditions for grooving using a grinding edge. Preferably, the feed speed of the rotating grinding edge is set to 10~300 mm / min, and the rotation speed is set to 1500~4000 mm / min.

[0063] As the bonding agent for the grinding edge used, any known bonding agent can be used without particular limitation, such as metal, resin, electrodeposition, etc., with metal being preferred.

[0064] Furthermore, in the manufacturing method of the present invention, it is preferable to include the following step: etching the quartz glass component 10 for exposing the film-forming gas at a depth range of 0.1 μm to 0.6 μm to expand the microcracks 26 and form expanded microcracks 28.

[0065] Furthermore, the etching is preferably performed via an HF cleaning process. By performing an HF cleaning process, the surface area of ​​the open shape of microcracks, which affect gas adsorption and are evaluated using the BET method, can be controlled using the amount of HF cleaning. The amount of HF cleaning can be appropriately selected based on the surface area of ​​the quartz glass component body forming the linear protrusions, but is preferably 0.3 μm.

[0066] This allows for more precise management of the surface area of ​​the quartz components, which is a major factor affecting film thickness control.

[0067] Furthermore, by performing an HF cleaning process, the shape caused by micro-cracks formed by grooving the quartz glass component body 12 is managed using the amount of HF cleaning. Thus, silicon glass with a structure containing a large number of bubbles, as in Patent Document 3, is not used. Therefore, special equipment and processes are not required to obtain the raw quartz glass, and the surface area can be controlled without increasing costs and time, resulting in quartz tools with a large surface area.

[0068] [Example]

[0069] The present invention will be described in more detail below with reference to specific embodiments, but these embodiments are illustrative and should not be interpreted as limiting.

[0070] (Example 1)

[0071] use Figure 5 A rotary grinding blade, as shown, is used to groove a transparent quartz glass plate to create a plate-shaped quartz component with multiple linear protrusions (groove shapes). The grinding blade uses a metal-bonded grinding stone. As conditions for grooving, the feed rate of the rotary grinding blade is set to a low speed (100 mm / min), and the rotational speed is set to a high speed (1500~1700 rpm). The thickness of the plate-shaped component is 1.5 mm, and the groove depth is 0.6 mm. HF cleaning is performed to remove processing contaminants from the plate-shaped component after groove formation, resulting in the quartz glass component for film-forming gas exposure according to the present invention. The HF cleaning amount is 0.6 μm.

[0072] Plate-shaped samples for BET specific surface area determination were cut from the components after HF cleaning.

[0073] The size of the plate-shaped sample is set to 40mm × 8mm × 1.5mm. The surface area, calculated based on the dimensions of the linear convex portion of the sample (width of the convex surface: 0.4mm, width of the concave bottom surface: 0.2mm, height of the side surface: 0.6mm), is denoted as S1. The shape of the plate-shaped sample used for specific surface area measurement is shown below. Figure 6 (a) and (b).

[0074] The BET specific surface area was measured using a BELSORP MAX apparatus manufactured by MicrotracBEL, employing the Kr-BET method with krypton gas. The specific surface area obtained at this time is denoted as H1 (m²). 2 / g).

[0075] H1 is multiplied by the sample weight to calculate the surface area of the sample, and the surface area at this time is set as the derived surface area HS1.

[0076] A reference double-sided ground sample having a size identical to that of the sample cut from the plate-like member and having no groove shape but all flat faces was prepared, and BET specific surface area measurement was performed in the same manner.

[0077] The specific surface area of the reference double-sided ground sample obtained at this time was set as H0 (m 2 / g), and the value of H1 / H0 was calculated, and the result ratio X was 7 times.

[0078] The surface area calculated from the size of the double-sided ground sample having all flat faces was set as S0, and the relationship S1 / S0 with the size surface area S1 was calculated, and the result ratio A was 1.8.

[0079] In addition, the relationship HS1 / S1 of S1 and HS1 was calculated, and the result ratio B was 6.

[0080] Further, the relationship HS1 / S0 of S0 and HS1 was calculated, and the result ratio C was 11. The results are shown in Table 1.

[0081] Cross-sectional SEM observation of the sample was performed, the state of microscopic cracks formed every 0.1 mm length of the groove side face was observed, and the number of microscopic cracks and the depth were measured. The SEM observation photograph of Example 1 is shown in Figure 7 , and the measurement results of the microscopic cracks are shown in Table 2.

[0082] The evaluation criteria of the microscopic cracks are described below.

[0083] Large: the case where the total depth per unit length (0.1 mm) is 100 μm or more

[0084] Medium: the case where the total depth per unit length (0.1 mm) is 50 μm or more and less than 100 μm

[0085] Small: the case where the total depth per unit length (0.1 mm) is less than 50 μm

[0086] As shown in Figure 7 , it was confirmed that the microscopic cracks of the "medium" degree of amount were generated in the sample of Example 1. From the SEM observation image shown in Figure 7 , the microscopic cracks were measured, and the result total depth of the microscopic cracks per 0.1 mm length was 65 μm, and the average depth was 8 μm per piece.

[0087] Further, using the obtained quartz glass member for film formation treatment gas exposure, semiconductor film formation was performed by the following method, and the quality at the time of film formation was evaluated. The results are shown in Table 1.

[0088] <Method for forming semiconductor and quality evaluation>

[0089] A quartz glass for exposure described in Example 1 was prepared, and a film formation test of a nitride film was performed to verify the effect of the treatment gas adsorption to the quartz glass member. The film formation test was performed by placing the quartz glass for exposure and a semiconductor substrate as a film formation treatment object in a reaction vessel in which the film formation treatment was performed. The evaluation of the film quality was confirmed by the ratio of the film thickness of the center portion of the semiconductor substrate after the film formation to the maximum value (Max.) of the film thickness in the semiconductor substrate when the film thickness was 1.

[0090] The evaluation criteria were as follows.

[0091] ◎: Film thickness ratio < 1.05

[0092] O: Film thickness ratio > 1.05 and < 1.10

[0093] Δ: Film thickness ratio > 1.10 and < 1.30

[0094] X: Film thickness ratio > 1.30

[0095]

[0096]

[0097] (Example 2)

[0098] A plate-shaped quartz member having a plurality of groove shapes was prepared under the same conditions as in Example 1, except that the amount of HF cleaning described in Example 1 was set to 0.3 μm. A sample was prepared under the same conditions, and a plate-shaped sample for BET measurement was cut from the member after the HF cleaning. The BET specific surface area measurement, microscopic crack observation, and film formation quality evaluation were performed in the same manner as in Example 1.

[0099] The size of the plate-shaped sample at this time was 40 mm x 8 mm x 1.5 mm, and the surface area calculated from the dimensions, i.e., the dimensional surface area, was set to S2.

[0100] The BET specific surface area was measured by the Kr-BET method using krypton gas, and the specific surface area obtained at this time was set to H2(m 2 / g).

[0101] The surface area of the sample was calculated by multiplying H2by the weight of the sample, and the surface area at this time was set to the derived surface area HS2.

[0102] In the same manner as in Example 1, a reference double-sided ground sample having the same size as the sample cut from the plate-shaped member and having no groove shape but all flat faces was prepared, and the BET specific surface area measurement was performed in the same manner.

[0103] The specific surface area of the reference double-ground sample obtained at this time was set as H0 (m 2 / g), and the value of H2 / H0 was calculated, and the result ratio X was 9 times.

[0104] As with Example 1, the surface area calculated from the dimensions of the double-ground sample having all flat surfaces was set as S0, and the relationship S2 / S0 with the dimensional surface area S2 was calculated, and the result ratio A was 1.8.

[0105] In addition, the relationship HS2 / S2 of S2 and HS2 was calculated, and the result ratio B was 8. Further, the relationship HS2 / S0 of S0 and HS2 was calculated, and the result ratio C was 15. The results are shown in Table 1.

[0106] Cross-sectional SEM observation of the sample was performed, and the state of microscopic cracks formed on the groove side surface per 0.1 mm length was observed, and as a result, it was confirmed that microscopic cracks of an amount of a "large" degree were generated. The SEM observation photograph of Example 2 is shown in Figure 8 From the SEM observation image shown in Figure 8 The microscopic cracks were measured from the SEM observation image, and as a result, the total depth of the microscopic cracks per 0.1 mm length was 222 μm, and the average depth was 25 μm per bar. The results are shown in Table 2.

[0107] (Example 3)

[0108] For the plate-shaped quartz member having a plurality of groove shapes produced under the same conditions as Example 1, except that the amount of HF cleaning described in Example 1 was set to 0.15 μm, a sample was produced under the same conditions, and a plate-shaped sample for BET measurement was cut out from the member after HF cleaning, and BET specific surface area measurement, microscopic crack observation, and film formation quality evaluation were performed as with Example 1.

[0109] The size of the plate-shaped sample at this time was 40 mm x 8 mm x 1.5 mm, and the surface area calculated from the dimensions, that is, the dimensional surface area, was set as S3.

[0110] The BET specific surface area was measured by the Kr-BET method using krypton gas, and the specific surface area obtained at this time was set as H3 (m 2 / g).

[0111] The surface area of the sample was calculated by multiplying H3 by the sample weight, and the surface area at this time was set as the derived surface area HS3.

[0112] As with Example 1, a reference double-ground sample of the same size as the sample cut out from the plate-shaped member and having all flat surfaces without a groove shape was prepared, and BET specific surface area measurement was performed as with Example 1. The specific surface area of the reference double-ground sample obtained at this time was set as H0 (m2 The value of H3 / H0 was calculated, and the resulting ratio X was 10 times.

[0113] As with Example 1, the surface area calculated from the dimensions of the double-sided ground sample, which was a flat surface on both sides, was set as S0, and the relationship S3 / S0 with the dimensional surface area S3 was calculated, and the ratio A thereof was 1.8.

[0114] In addition, the relationship HS3 / S3 of S3 and HS3 was calculated, and the ratio B thereof was 10. Further, the relationship HS3 / S0 of S0 and HS3 was calculated, and the ratio C thereof was 17.

[0115] Cross-sectional SEM observation was performed on this sample, and the state of microscopic cracks formed every 0.1 mm length on the groove side surface was observed, and as a result, it was confirmed that microscopic cracks were generated in an amount of "large" degree, which was the same degree as the SEM observation image of Example 2 shown in FIG. 2. Figure 8

[0116] (Example 4)

[0117] As with Example 1, a transparent quartz glass plate was grooved using a rotating grinding blade, and a plate-shaped quartz member having a plurality of groove shapes was produced. The grinding blade was a metal bond grindstone. The conditions at the time of grooving were set to the same conditions as in Example 1, and grooving was performed on one plane (surface) of the transparent quartz glass plate, and further, grooving was additionally performed on the opposite plane (back surface) as well, and was set to form groove shapes on both surfaces. The thickness of the plate-shaped member was 1.5 mm, and the depth of the groove was 0.6 mm on both surfaces. In order to remove the processing contamination of the plate-shaped member after the formation of the groove, HF cleaning was performed, and at this time, the amount of HF cleaning was 0.3 μm.

[0118] A plate-shaped sample for BET measurement was cut from the member after HF cleaning, and BET specific surface area measurement, microscopic crack observation, and film formation quality evaluation were performed as with Example 1.

[0119] The size of the plate-shaped sample at this time was 40 mm x 8 mm x 1.5 mm, and the surface area calculated from this dimension, which was the dimensional surface area, was set as S4.

[0120] The BET specific surface area was measured by the Kr-BET method using krypton gas, and the specific surface area obtained at this time was set as H4 (m 2 / g).

[0121] H4 was multiplied by the weight of the sample to calculate the surface area of the sample, and the surface area at this time was set as the derived surface area HS4.

[0122] ​A double-sided ground sample for reference having the same size as the sample cut from the plate-like member and having no groove shape but all flat faces was prepared, and BET specific surface area measurement was performed in the same manner as in Example 1.

[0123] The specific surface area of the double-sided ground sample for reference obtained at this time was set as H0 (m 2 / g), and the value of H4 / H0 was calculated, and as a result, the magnification X was 18 times.

[0124] In the same manner as in Example 1, the surface area calculated from the size of the double-sided ground sample having all flat faces was set as S0, and the relationship S4 / S0 with the size surface area S4 was calculated, and as a result, the ratio A was 2.6.

[0125] In addition, the relationship HS4 / S4 of S4 and HS4 was calculated, and as a result, the ratio B was 9.

[0126] Further, the relationship HS4 / S0 of S0 and HS4 was calculated, and as a result, the ratio C was 23.

[0127] Cross-sectional SEM observation of the sample was performed, and the state of microscopic cracks formed per 0.1 mm length of the groove side face was observed, and as a result, it was confirmed that microscopic cracks were generated in an amount of "large" degree equivalent to that of the SEM observation image of Example 2 shown in FIG. 2. Figure 8

[0128] (Example 5)

[0129] In the same manner as in Example 1, a plate-like quartz member having a plurality of groove shapes was produced by slot processing of a transparent quartz glass plate using a rotary grinding blade. The grinding blade was a metal bond grindstone. As the conditions at the time of slotting, the feed speed of the rotary grinding blade was set to low speed, and the rotation speed was set to high speed. The thickness of the plate-like member was 1.5 mm, and the depth of the groove was 1 mm. HF cleaning was performed in order to remove processing contamination of the plate-like member after formation of the groove, and at this time, the amount of HF cleaning was 0.3 μm.

[0130] A plate-like sample for BET measurement was cut from the member after HF cleaning, and BET specific surface area measurement, microscopic crack observation, and film formation quality evaluation were performed in the same manner as in Example 1.

[0131] The size of the plate-like sample at this time was 40 mm x 8 mm x 1.5 mm, and the surface area calculated from the size, that is, the size surface area was set as S5.

[0132] The BET specific surface area was measured by Kr-BET method using krypton gas, and the specific surface area obtained at this time was set as H5 (m 2 / g).

[0133] ​H5 is multiplied by the sample weight to calculate the surface area of the sample, and the surface area at this time is set as the derived surface area HS5.

[0134] A double-sided ground sample for reference, which is the same size as the sample cut from the plate-shaped member and has no groove shape but all flat faces, was prepared, and BET specific surface area measurement was performed in the same manner as in Example 1.

[0135] The specific surface area of the double-sided ground sample for reference obtained at this time was set as H0 (m 2 / g), and the value of H5 / H0 was calculated, and as a result, the ratio X was 19 times.

[0136] In the same manner as in Example 1, the surface area calculated from the size of the double-sided ground sample having all flat faces was set as S0, and the relationship S5 / S0 with the size surface area S5 was calculated, and as a result, the ratio A was 2.2.

[0137] In addition, the relationship HS5 / S5 of S5 and HS5 was calculated, and as a result, the ratio B was 13.

[0138] Further, the relationship HS5 / S0 of S0 and HS5 was calculated, and as a result, the ratio C was 28.

[0139] Cross-sectional SEM observation of the sample was performed, and the state of microscopic cracks formed every 0.1 mm length of the groove side surface was observed, and as a result, it was confirmed that microscopic cracks were generated in an amount of "large" degree, which was the same degree as the SEM observation image of Example 2 shown in FIG. 2. Figure 8

[0140] (Example 6)

[0141] In the same manner as in Example 1, a plate-shaped quartz member having a plurality of groove shapes was produced by performing groove processing on a transparent quartz glass plate using a rotary grinding blade. The grinding blade used was the same metal bond grindstone as in Example 1. As the conditions at the time of grooving, the feed speed of the rotary grinding blade was set to low speed, and the rotation speed was set to high speed. The thickness of the plate-shaped member was 1.5 mm, and the depth of the groove was 0.6 mm.

[0142] In order to remove processing contamination of the plate-shaped member after groove formation, pure water washing was performed, and HF washing was not performed. A plate-shaped sample for BET measurement was cut from the member after the pure water washing, and BET specific surface area measurement, microscopic crack observation, and film formation quality evaluation were performed in the same manner as in Example 1.

[0143] The size of the plate-shaped sample at this time was 40 mm x 8 mm x 1.5 mm, and the surface area calculated from the size, that is, the size surface area, was set as S6.

[0144] ​The BET specific surface area was determined using the Kr-BET method with krypton gas, and the specific surface area obtained at this time was set as H6 (m²). 2 / g).

[0145] Calculate the sample's surface area by multiplying H6 by the sample weight, and set this surface area as the derived surface area HS6.

[0146] Similar to Example 1, a reference double-sided ground sample of the same size as the sample cut from the plate-shaped member and without grooves but with all flat surfaces was prepared, and the BET specific surface area was measured in the same manner.

[0147] The specific surface area of ​​the double-sided grinding sample obtained at this time is set as H0 (m²). 2 ( / g), calculate the value of H6 / H0, and the resulting multiplier X is 21 times.

[0148] Similar to Example 1, the surface area calculated based on the dimensions of a double-sided grinding sample with all flat surfaces is set as S0, and the relationship between the surface area S6 and the dimensions S6 is calculated as S6 / S0, resulting in a ratio A of 1.8.

[0149] In addition, the relationship between S6 and HS6 is calculated as HS6 / S6, and the ratio B is 20.

[0150] Then, the relationship between S0 and HS6, HS6 / S0, is calculated, and the ratio C is 36.

[0151] Cross-sectional SEM observation of the sample was performed to examine the state of microcracks formed on the side of the groove at lengths of 0.1 mm. The results confirmed the formation of microcracks related to... Figure 8 The SEM images of Example 2 shown exhibit the same degree of "large" quantity of microcracks.

[0152] (Example 7)

[0153] Similar to Example 1, a transparent quartz glass plate was grooved using a rotary grinding blade to create a plate-shaped quartz component with multiple grooves. The grinding blade used was a grinding stone with the same metal-bonded material as in Example 1. As for grooving conditions, the feed rate of the rotary grinding blade was set to low, and the rotation speed to high. The thickness of the plate-shaped component was 1.5 mm, and the groove depth was 0.6 mm. HF cleaning was performed to remove machining contaminants from the plate-shaped component after groove formation; the HF cleaning amount was 0.7 μm.

[0154] Plate-shaped samples for BET measurement were cut from the components after they were cleaned with pure water, and the BET specific surface area was measured, microcracks were observed, and film quality was evaluated in the same manner as in Example 1.

[0155] The size of the plate-shaped sample at this time was 40 mm x 8 mm x 1.5 mm, and the surface area calculated from this size, i.e., the dimensional surface area, was set as S7.

[0156] The BET specific surface area was measured by the Kr-BET method using krypton gas, and the specific surface area obtained at this time was set as H7 (m 2 / g).

[0157] The surface area of the sample was calculated by multiplying H7 by the sample weight, and the surface area at this time was set as the derived surface area HS7.

[0158] A reference double-sided ground sample having the same size as the sample cut from the plate-shaped member and having a flat surface throughout without a groove shape was prepared, and BET specific surface area measurement was performed in the same manner as in Example 1.

[0159] The specific surface area of the reference double-sided ground sample obtained at this time was set as H0 (m 2 / g), and the value of H7 / H0 was calculated, and as a result, the ratio X was 6 times.

[0160] In the same manner as in Example 1, the surface area calculated from the size of the double-sided ground sample having a flat surface throughout was set as S0, and the relationship S7 / S0 with the dimensional surface area S7 was calculated, and as a result, the ratio A was 1.8.

[0161] In addition, the relationship HS7 / S7 of S7 and HS7 was calculated, and as a result, the ratio B was 5.

[0162] Further, the relationship HS7 / S0 of S0 and HS7 was calculated, and as a result, the ratio C was 9.

[0163] Cross-sectional SEM observation of the sample was performed, and the state of microscopic cracks formed every 0.1 mm length on the groove side surface was observed, and as a result, it was confirmed that microscopic cracks were generated in an amount of "medium" degree, which was the same degree as that of the SEM observation image of Example 1 shown in FIG. 2. Figure 7

[0164] (Example 8)

[0165] In the same manner as in Example 1, a plate-shaped quartz member having a plurality of groove shapes was produced by slot processing of a transparent quartz glass plate using a rotary grinding blade. The grinding blade used was the same metal bond grindstone as in Example 1. As the conditions at the time of slotting, the feed speed of the rotary grinding blade was set to low speed, and the rotation speed was set to high speed. The thickness of the plate-shaped member was 1.5 mm, and the depth of the groove was 0.6 mm.

[0166] HF cleaning was performed in order to remove processing contamination of the plate-shaped member after groove formation, and at this time, the HF cleaning amount was 0.9 μm.

[0167] ​A plate-shaped sample for BET measurement was cut out from the member washed with pure water, and BET specific surface area measurement, microscopic crack observation, and film formation quality evaluation were performed in the same manner as in Example 1. The size of the plate-shaped sample at this time was 40 mm x 8 mm x 1.5 mm, and the surface area calculated from the dimensions, i.e., the dimensional surface area, was set to S8.

[0168] The BET specific surface area was measured by the Kr-BET method using krypton gas, and the specific surface area obtained at this time was set to H8 (m 2 / g).

[0169] The surface area of the sample was calculated by multiplying H8 by the sample weight, and the surface area at this time was set to the derived surface area HS8.

[0170] In the same manner as in Example 1, a reference double-sided ground sample having the same dimensions as the sample cut out from the plate-shaped member and having no groove shape but all flat faces was prepared, and BET specific surface area measurement was performed in the same manner.

[0171] The specific surface area of the reference double-sided ground sample obtained at this time was set to H0 (m 2 / g), and the value of H8 / H0 was calculated, and as a result, the ratio X was 6 times.

[0172] In the same manner as in Example 1, the surface area calculated from the dimensions of the double-sided ground sample having all flat faces was set to S0, and the relationship S8 / S0 with the dimensional surface area S8 was calculated, and as a result, the ratio A was 1.8.

[0173] In addition, the relationship HS8 / S8 of S8 and HS8 was calculated, and as a result, the ratio B was 5.

[0174] Further, the relationship HS8 / S0 of S0 and HS8 was calculated, and as a result, the ratio C was 8.

[0175] Cross-sectional SEM observation of the sample was performed, and the state of microscopic cracks was observed, and as a result, it was confirmed that the amount of microscopic cracks was the same degree as the SEM observation image of Example 1 shown in FIG. 2. Figure 7

[0176] (Comparative Example 1)

[0177] In the same manner as in Example 1, a plate-shaped quartz member having a plurality of groove shapes was prepared by slot processing of a transparent quartz glass plate using a rotating grinding blade. The grinding blade was a grindstone of a resin bond. The thickness of the plate-shaped member was 1.5 mm, and the depth of the groove was 0.6 mm. As the conditions at the time of slotting, the feed rate of the rotating grinding blade was set to low speed, and the rotation speed was set to high speed.

[0178] HF cleaning was performed in order to remove processing contamination of the plate-shaped member after groove formation, and at this time, the HF cleaning amount was 0.3 μm.​

[0179] A plate-shaped sample for BET measurement was cut out from the member after HF cleaning, and BET specific surface area measurement, microscopic crack observation, and film formation quality evaluation were performed in the same manner as in Example 1.

[0180] The size of the plate-shaped sample at this time was 40 mm x 8 mm x 1.5 mm, and the surface area calculated from this size, that is, the dimensional surface area, was set as S9.

[0181] The BET specific surface area was measured using a BELSORP MAX measuring device manufactured by Microtrac BEL Co., Ltd., by Kr-BET method using krypton gas, and the specific surface area obtained at this time was set as H9 (m 2 / g).

[0182] The surface area of the sample was calculated by multiplying H9 by the sample weight, and the surface area at this time was set as the derived surface area HS9.

[0183] In the same manner as in Example 1, a reference double-sided ground sample having the same size as the sample cut out from the plate-shaped member and having no groove shape but all flat faces was prepared, and BET specific surface area measurement was performed in the same manner.

[0184] The specific surface area of the reference double-sided ground sample obtained at this time was set as H0 (m 2 / g), and the value of H9 / H0 was calculated, and as a result, the ratio was 3 times.

[0185] In the same manner as in Example 1, the surface area calculated from the size of the double-sided ground sample having all flat faces was set as S0, and their relationship S9 / S0 was calculated, and as a result, the value A thereof was 1.3.

[0186] In addition, the relationship HS9 / S9 of S9 and HS9 was found, and as a result, the value B thereof was 3.

[0187] Further, the relationship HS9 / S0 of S0 and HS9 was calculated, and as a result, the value C thereof was 4.

[0188] Cross-sectional SEM observation of the sample was performed, and the state of microscopic cracks was observed, and as a result, it was confirmed that microscopic cracks of an amount of "small" degree were generated. The SEM observation photograph of Comparative Example 1 is shown in Figure 9 . From the SEM observation image shown in Figure 9 , microscopic cracks were measured, and as a result, the total depth of microscopic cracks per 0.1 mm length was 26 μm, and the average depth was 7 μm per line. The results are shown in Table 2.

[0189] (Comparative Example 2)

[0190] A plate-shaped quartz member having a plurality of groove shapes was produced by grooving processing of transparent quartz glass using a rotating grinding blade, similarly to Example 1. The grinding blade was a metal bond grindstone. As the conditions at the time of grooving, the feed rate of the rotating grinding blade was set to low speed, and the rotation speed was set to high speed. The thickness of the plate-shaped member was 1.5 mm, and the depth of the groove was 0.6 mm. HF cleaning was performed in order to remove processing contamination of the plate-shaped member after groove formation, and at this time, the amount of HF cleaning was 5 μm.

[0191] A plate-shaped sample for BET measurement was cut from the member after HF cleaning, and BET specific surface area measurement, microscopic crack observation, and film formation quality evaluation were performed similarly to Example 1. The size of the plate-shaped sample at this time was 40 mm x 8 mm x 1.5 mm, and the surface area calculated from the dimensions, i.e., the dimensional surface area, was set to S10.

[0192] The BET specific surface area was measured by the Kr-BET method using krypton gas, and the specific surface area obtained at this time was set to H10 (m 2 / g).

[0193] The sample surface area was calculated by multiplying H10 by the sample weight, and the surface area at this time was set to the derived surface area HS10.

[0194] A reference double-sided ground sample having the same size as the sample cut from the plate-shaped member and having no groove shape but a flat surface on both sides was prepared similarly to Example 1, and BET specific surface area measurement was performed similarly.

[0195] The specific surface area of the reference double-sided ground sample obtained at this time was set to H0 (m 2 / g), and the value of H10 / H0 was calculated, and as a result, the ratio was 1.8 times.

[0196] The surface area calculated from the dimensions of the double-sided ground sample was set to S0, and their relationship S10 / S0 was calculated, and as a result, the value A thereof was 1.8.

[0197] Furthermore, the relationship HS10 / S10 of S10 and HS10 was found, and as a result, the value B thereof was 1.

[0198] Furthermore, the relationship HS10 / S0 of S0 and HS10 was calculated, and as a result, the value C thereof was 2.

[0199] Cross-sectional SEM observation of the sample was performed, and the state of microscopic cracks formed on the groove side surface per 0.1 mm length was observed, and as a result, microscopic cracks were not confirmed to have occurred.

[0200] It was confirmed from the above results that in the quartz glass member for film formation treatment gas exposure according to the present application, the value of B is 5 or more, and the derived surface area calculated from the BET specific surface area obtained by the BET method increases. In addition, as shown in Table 1, it is suggested that the film formation quality is good when the etching amount is 0.6 μm or less, and the film formation quality deteriorates if it exceeds 0.6 μm.

[0201] <Regarding etching treatment>

[0202] In addition, the difference in the BET value caused by the difference in the etching amount (HF cleaning amount) of the sample for BET measurement used in Example 1 is shown in Table 3.

[0203]

[0204] In order to remove contamination from the outer surface of the quartz tool, HF cleaning requires 0.1 μm or more. From the results of Table 3, it is considered that the BET specific surface area of the sample for BET measurement does not change when the HF cleaning amount is 0.6 μm or more, and the film quality deteriorates if it exceeds 0.6 μm, and thus it is considered that the etching amount based on HF cleaning, i.e., the HF cleaning amount, is preferably 0.1 μm to 0.6 μm.

[0205] (Experimental Examples 1 to 5) Regarding machining conditions

[0206] The machining conditions when slot machining is performed on a plate-shaped quartz glass member main body are shown in Table 4. Except that the machining conditions for slot machining are changed to the conditions shown in Table 4, a plate-shaped quartz member having a plurality of slot shapes is produced by the same method as in Example 1, and then a plate-shaped sample is cut out by the same method as in Example 1, and BET specific surface area measurement and film formation quality evaluation are performed. In Table 4, the differences in the slot machining conditions are as follows.

[0207] High speed: 1500 rpm to 4000 rpm

[0208] Low speed: 500 rpm to 1500 rpm

[0209] High speed: 300 mm / min to 600 mm / min.

[0210] Low speed: 10 mm / min to 300 mm / min.

[0211] Note that the feed speed described herein indicates the speed at which the rotating grinding blade moves in a direction parallel to the plane of the plate-shaped quartz member as a workpiece.

[0212] The deterioration of the grinding blade is evaluated by visual observation.

[0213] In addition, in Table 4, the evaluation criteria of the quality at the time of film formation are the same as those in Table 1, and the evaluation of the BET specific surface area is as described below.

[0214] BET specific surface area Large: 0.020 m 2 / g or more, Medium: 0.005 m 2 / g or more and less than 0.020 m 2 / g, Small: less than 0.005 m 2 / g.

[0215]

[0216] From Table 4, it is known that, with respect to the binder of the grinding blade, metal is preferable compared to resin, and, with respect to the rotation speed, high speed is preferable compared to low speed.

[0217] <Effects of sandblasting treatment and grinding treatment>

[0218] In the case where the quartz glass member is subjected to sandblasting treatment and grinding treatment, fine cracks and the like are generated. Such fine cracks and the like are sometimes referred to as microcracks, and the measurement results of the BET specific surface area in the case where such sandblasting treatment and grinding treatment are performed are shown below as further experimental examples.

[0219] (Experimental Examples 6 to 8) Amount of generation of microcracks on sandblasted surface

[0220] Similarly to Example 2, a plate-shaped sample on which groove processing was performed on one surface of the surface side was prepared. The back surface side of the plate-shaped sample was subjected to sandblasting treatment (Experimental Example 6: normal back surface sandblasting, Experimental Example 7: enhanced back surface sandblasting) or back surface grinding treatment (Experimental Example 8: back surface grinding roughness large) under the conditions shown in Table 5.

[0221] The cross sections of the sandblasted surface and the ground surface were observed at a magnification using a microscope VHX-7000 manufactured by KEYENCE. The number and the depth of the microcracks generated per 0.1 mm were measured by multi-point measurement using the plane measurement function of the device.

[0222] The results are shown in Table 5. In addition, a diagram illustrating the magnification E (effect on the back surface) in Table 5 is shown in Figure 10 Furthermore, a microscope observation photograph of the cross section of the back surface of the processed sample obtained in Experimental Example 6 is shown in Figure 11 a microscope observation photograph of the cross section of the back surface of the processed sample obtained in Experimental Example 7 is shown in Figure 12 a microscope observation photograph of the cross section of the back surface of the processed sample obtained in Experimental Example 8 is shown in Figure 13 .

[0223]

[0224] As is apparent from the above, the total depth of the microscopic cracks per unit length generated on the sandblasted surface is significantly smaller than that of the ground surface. In addition, the magnification E of the sandblasted surface in Table 5 is 1.2, which is not as large as the magnification of the quartz glass member for exposure of a film formation processing gas according to the present application.

[0225] Explanation of Reference Numerals

[0226] 10: quartz glass member for exposure of a film formation processing gas, 12: main body of the quartz glass member, 14: linear protrusion, 16: front surface, 18: back surface, 20: recess, 22a, 22b: side surface, 24: bottom surface, 26: microscopic crack, 28: enlarged microscopic crack, 30: multi-peripheral-edge blade, 32: disc-shaped base metal portion, 34: peripheral portion, 36: diamond abrasive grain layer base portion, 38: plurality of edges, 40: diamond abrasive grain edge portion, 42: through-hole.

Claims

1. A quartz glass component for exposing a film-forming gas, comprising a plate-shaped quartz glass component for exposing a film-forming gas used in a semiconductor film-forming process, wherein, The quartz glass component for film-forming treatment gas exposure includes: The main body of the quartz glass component is in the shape of a plate; A plurality of linear protrusions with generally square cross-sections formed on at least a portion of the surface of the quartz glass component body; and Multiple microcracks formed on at least one side of the linear protrusion. Set the surface area of ​​the dimension with linear protrusions, calculated based on the dimensions, to 1. When the relationship between the derived surface area of ​​the quartz glass component for exposing the film-forming gas, which has the linear protrusions and the microcracks, obtained by the BET specific surface area measurement method and the dimensional surface area with linear protrusions obtained by the size measurement method is set to B times, B is 5 or higher.

2. The quartz glass component for film-forming treatment gas exposure according to claim 1, wherein, If the quartz glass component used for exposing the film-forming gas is assumed to be a quartz glass component whose main body surface is entirely flat without the linear protrusions and microcracks, then the surface area of ​​the flat surface calculated based on the dimensions is set to 1. If the quartz glass component for exposing the film-forming gas is assumed to be a quartz glass component with linear protrusions formed on at least a portion of the surface of the quartz glass component body and having a surface without microcracks, then the relationship between the surface area of ​​the linear protrusions (calculated from the dimensions) and the surface area of ​​the flat surface (calculated from the dimensions) is set as A times. Set the surface area of ​​the flat surface calculated based on the aforementioned dimensions to 1. When the relationship between the derived surface area calculated based on the BET specific surface area and the surface area of ​​the flat surface only calculated based on the dimensions is set to C times... The relationship A < B < C is satisfied.

3. The quartz glass component for film-forming treatment gas exposure according to claim 2, wherein, The quartz glass component used for film-forming gas exposure satisfies the relationship that B is more than twice that of A and C is more than six times that of A.

4. The quartz glass component for film-forming treatment gas exposure according to claim 1, wherein, Regarding the microcracks formed within 0.1 mm of a unit length on at least one side of the linear protrusion, The average depth of each microcrack is over 8 μm. The total depth of all microcracks per unit length is greater than 50 μm.

5. The quartz glass component for film-forming treatment gas exposure according to claim 1, wherein, The microcracks are enlarged microcracks formed by etching.

6. The quartz glass component for film-forming treatment gas exposure according to claim 5, wherein, The BET specific surface area of ​​the quartz glass component for exposing the film-forming gas, which includes the enlarged microcracks, obtained by the BET measurement method, is more than 7 times that of a quartz glass component with only flat surfaces, assuming that the surface of the quartz glass component body has no linear protrusions and microcracks.

7. The quartz glass component for film-forming treatment gas exposure according to claim 5, wherein, The BET specific surface area of ​​the quartz glass component for exposure to film-forming gas containing the aforementioned enlarged microcracks, as determined by the BET method, is more than 19 times that of a quartz glass component whose surface is assumed to be entirely flat and without the aforementioned linear protrusions and microcracks.

8. The quartz glass component for film-forming treatment gas exposure according to claim 1, wherein, The thickness of the main body of the quartz glass component is 1mm to 1.5mm, and the height of the linear protrusion is more than 0.6mm and less than 1.5mm.

9. A method for manufacturing a quartz glass component for film-forming gas exposure, comprising the method for manufacturing a quartz glass component for film-forming gas exposure as described in any one of claims 1 to 8, wherein, The manufacturing method of the quartz glass component for film-forming treatment gas exposure includes the following steps: At least a portion of the quartz glass component body is formed with a linear protrusion having a generally square cross-section by grinding; and Multiple microcracks are formed on at least one side of the linear protrusion. The derived surface area of ​​the quartz glass component for film-forming gas exposure, calculated based on the BET specific surface area obtained by the BET measurement method, is larger than the dimensional surface area of ​​the quartz glass component for film-forming gas exposure.

10. The method for manufacturing a quartz glass component for film-forming treatment gas exposure according to claim 9, wherein, The manufacturing method of the quartz glass component for film-forming treatment gas exposure includes the following steps: The quartz glass component body with linear protrusions is etched at a depth range of 0.1μm to 0.6μm, and the microcracks are formed on the linear protrusions. The microcracks are then enlarged to form enlarged microcracks.

11. The method for manufacturing a quartz glass component for film-forming treatment gas exposure according to claim 10, wherein, The etching is performed using an HF cleaning process.

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