A polishing liquid filtering device for semiconductor processing

Abstract

The application discloses a kind of grinding fluid filtering devices for semiconductor processing, belong to semiconductor silicon wafer grinding waste liquid processing technical field, including filter frame, the inside of filter frame top is equipped with filter barrel, the bearing seat is equipped with in the filter frame top corresponding filter barrel, the bearing seat is rotatably connected with linkage shaft, the end of linkage shaft is inserted into the inside of filter barrel and is rotatably connected with the end of filter barrel, the reduction motor is installed on the filter frame, the other end of linkage shaft is connected with the output end of the reduction motor, in the application, dynamic filtering effect, by driving deep fiber filter element, first membrane filter element and second membrane filter element do circular motion, make liquid phase relative to filter membrane surface form dynamic shearing, can break down concentration polarization layer, reduce filter cake formation resistance, to improve filtration rate, continue to disturb liquid, prevent particle from surface tension effect in membrane hole bridging or deep adhesion, effectively slow down filter element blockage, prolong its effective working period.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor silicon wafer grinding waste liquid treatment technology, and particularly relates to a grinding liquid filtration device for semiconductor processing. Background Technology

[0002] With the widespread application of intelligent devices and the continuous growth of market demand, the demand for chips, as their core components, has increased significantly, which in turn has driven the continuous expansion of the market demand for semiconductor silicon wafers, the basic material for chips. In the semiconductor silicon wafer manufacturing process, the precision of the grinding process directly affects the final processing quality of the silicon wafer. In order to improve the grinding precision and reduce the processing difficulty, a large amount of grinding fluid needs to be continuously sprayed during the production process. While rinsing and cooling, the grinding fluid will carry the fine debris peeled off from the surface of the silicon wafer, forming grinding waste liquid with high impurity content. In order to implement the concept of circular economy and effectively control production costs, enterprises usually treat and purify the grinding waste liquid to achieve its recycling and reuse.

[0003] Existing technologies disclose several invention patents in the field of semiconductor silicon wafer grinding waste liquid treatment. Among them, invention patent with publication number CN222871579U discloses a semiconductor silicon wafer grinding waste liquid filtration device, including a treatment box. The treatment box is mounted on a base frame, and bearings are provided at both the upper and lower ends of the treatment box. A support frame is provided on the top of the treatment box, and a primary filter structure and a driving structure are provided on the support frame, connecting the primary filter structure to the treatment box. The treatment box is equipped with an agitation structure and a drainage structure, and both the agitation structure and the drainage structure are connected to the driving structure. The process involves connecting the used semiconductor silicon wafer grinding waste liquid to the primary filter box, which filters out large particulate impurities in the grinding waste liquid. This allows for multiple filtrations of the grinding waste liquid while reducing the difficulty of a single filtration, improving the filtration effect and facilitating the recycling of the grinding liquid. However, this technical solution still has some shortcomings. Static filter cartridge filtration has relatively low filtration efficiency, and concentration polarization layers are prone to appear on the filter membrane surface, thus affecting the membrane filtration efficiency. Centrifugal filtration technology has high filtration efficiency, but its filtration accuracy is relatively low.

[0004] Based on this, the present invention designs a slurry filtration device for semiconductor processing to solve the above problems. Summary of the Invention

[0005] The purpose of this invention is to address the problems of relatively low filtration efficiency and the formation of concentration polarization layers on the filter membrane surface when using static filter cartridges, which affects membrane filtration efficiency, while centrifugal filtration technology has high filtration efficiency but low filtration accuracy. Therefore, this invention proposes a grinding fluid filtration device for semiconductor processing.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A semiconductor processing slurry filtration device includes a filter frame, a filter barrel provided on the inner side of the top of the filter frame, a bearing seat provided on the top of the filter frame corresponding to the filter barrel, a linkage shaft rotatably connected inside the bearing seat, one end of the linkage shaft extending into the interior of the filter barrel and rotatably connected to the end of the filter barrel, a geared motor mounted on the filter frame, and the other end of the linkage shaft connected to the output end of the geared motor.

[0008] The linkage shaft has multiple three-way folding frames evenly arranged circumferentially on its axial surface. Each three-way folding frame has three filter ports opened along the rotation direction. A deep fiber filter element, a first membrane filter element, and a second membrane filter element are detachably snapped into the three filter ports. Each three-way folding frame has a sealing plate on its outer arc surface. The three-way folding frame slides and seals with the inner wall of the filter barrel through the sealing plate.

[0009] As a further description of the above technical solution:

[0010] The bottom of the filter bucket is provided with a second infusion pipe, and the upper part of the outer wall of the filter bucket is provided with a first infusion pipe. Both the first infusion pipe and the second infusion pipe are connected to the interior of the filter bucket.

[0011] As a further description of the above technical solution:

[0012] The other end of the filter barrel is connected to an outer ring sleeve, and an inner ring groove is opened on the inner ring surface of the outer ring sleeve. A rotating disk is rotatably connected in the inner ring groove.

[0013] A groove is formed on the circumference of the rotating disk, and a slider is slidably connected in the groove. The slider is fixedly connected to the inner wall of the inner ring groove. A first spring is provided in the groove, and the slider is elastically connected to the inner wall of the groove through the first spring.

[0014] As a further description of the above technical solution:

[0015] A rotating sleeve is provided at the center of the rotating disk, and an electromagnet is installed in the port of the rotating sleeve. A permanent magnet shaft is connected to one end of the linkage shaft facing the rotating disk. The end of the permanent magnet shaft is rotatably connected to the rotating sleeve and magnetically attracted to the electromagnet.

[0016] As a further description of the above technical solution:

[0017] The end face of the rotating disk is provided with a first insertion interface and a second insertion interface on both sides of one of the three-way folding frames. A first insertion box is detachably inserted into the first insertion interface, and an output tube is connected to the end of the first insertion box.

[0018] A second connector box is detachably connected inside the second connector, and an input tube is connected to the end of the second connector box;

[0019] An electric push rod is installed on the end face of the rotating disk. The telescopic end of the electric push rod is connected to a compensation plate. The compensation plate is located between the first plug-in box and the second plug-in box and is connected to both of them.

[0020] As a further description of the above technical solution:

[0021] The second plug box has an inner liner plate inside, and the end face of the inner liner plate has multiple injection holes. The second plug box has multiple turbulence shafts rotatably connected to the multiple injection holes inside, and one end of each turbulence shaft passes through the corresponding injection hole and is connected to a turbulence fan.

[0022] As a further description of the above technical solution:

[0023] A ratchet is fixedly sleeved on the spoiler shaft, and a gear shaft is rotatably connected to the inner wall of the second plug box. One end of the gear shaft is provided with ratchet teeth that mesh with the tooth groove of the ratchet. A second spring is sleeved on the gear shaft, and the gear shaft is elastically rotatably connected to the inner wall of the second plug box through the second spring.

[0024] As a further description of the above technical solution:

[0025] Gears are fixedly sleeved on the spoiler shaft, and sliding holes are respectively opened at the end of the second plug box corresponding to each gear. A drive plate is slidably connected in the sliding holes.

[0026] The bottom of the drive plate is connected to a flip seat corresponding to each gear. A flip shaft is rotatably connected inside the flip seat. The flip shaft is provided with flip teeth, which mesh with the tooth grooves of the gears. A fourth spring is sleeved on the flip shaft, and the flip shaft is elastically rotatably connected to the flip seat through the fourth spring.

[0027] As a further description of the above technical solution:

[0028] The ends of the multiple drive plates are connected to the same linkage frame, and the ends of the linkage frame are connected to the compensation plate;

[0029] The other end of the drive plate is provided with a directional groove, a limiting shaft is sleeved in the directional groove, a third spring is sleeved on the limiting shaft, and the drive plate is elastically supported and connected to the inner wall of the second plug box through the third spring.

[0030] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0031] 1. In this invention, the dynamic filtration effect drives the deep fiber filter element, the first membrane filter element, and the second membrane filter element to perform circumferential motion, causing the liquid to form dynamic shear relative to the filter membrane surface. This breaks the concentration polarization layer, reduces the resistance to filter cake formation, thereby increasing the filtration rate. The continuous disturbance of the liquid prevents particles from bridging or adhering deeply at the membrane pores due to surface tension, effectively slowing down filter element clogging and extending its effective working cycle.

[0032] 2. In this invention, integrated in-situ cleaning is achieved by integrating a first plug-in box and a second plug-in box as a reverse pulse cleaning interface. Cleaning can be completed inside the equipment without disassembling the filter element. The pulsed hot airflow penetrates from the clean side to the contaminated side, which can powerfully peel off and remove particles and gel contaminants that are stuck deep in the filter element. Compared with forward rinsing or static soaking, the cleaning is more thorough and efficient. The cleaning process directly uses hot airflow. After rinsing, the filter element can be dried to prevent residual moisture from breeding microorganisms or affecting the initial performance of the next filtration. This achieves the integration of cleaning and drying.

[0033] 3. In this invention, the turbulence fan driven by the ratchet and gear mechanism transforms the unidirectional continuous rotation into active turbulence of hot airflow in the cleaning chamber. This design increases the flow rate and kinetic energy of the hot airflow, enhances the scouring force, and ensures that the hot airflow can evenly cover the complex flow channels inside the filter element, reduce cleaning dead zones, and improve the consistency of the overall cleaning effect.

[0034] 4. In this invention, the linkage shaft and the rotating sleeve are locked instantaneously by using electromagnets and permanent magnets for adsorption. Combined with the precise advancement of the plug box, the sealing and connection reliability between the cleaning interface and the filter element assembly is ensured, preventing leakage of the cleaning medium. The energy storage and release of the first spring enables the rotating disk and the plug box to return to their stable and automatic state after cleaning. The reliable operation provides a guarantee for continuous automated operation.

[0035] 5. In this invention, multiple three-way folding frames work in rotation. When one unit enters the cleaning cycle, other units can continue to perform the filtration task, realizing parallel operation of filtration and cleaning. It can support a near-continuous filtration process, improve equipment utilization, and the automated in-situ cleaning greatly reduces the need for manual disassembly, handling, and installation of filter elements. This not only reduces the labor intensity of maintenance personnel, but also avoids the risk of introducing external contamination or damaging filter elements due to frequent disassembly and assembly, meeting the extremely high requirements of cleanliness and reliability in semiconductor manufacturing. Attached Figure Description

[0036] Figure 1 This is a schematic diagram of the overall structure of a semiconductor processing slurry filtration device proposed in this invention;

[0037] Figure 2This is a schematic diagram of the structure of the first and second insertion interfaces in a semiconductor processing polishing slurry filtration device proposed in this invention;

[0038] Figure 3 This is a cross-sectional structural diagram of the filter barrel in a semiconductor processing polishing slurry filtration device proposed in this invention;

[0039] Figure 4 This is a schematic diagram of the three-way folding frame in a semiconductor processing polishing slurry filtration device proposed in this invention;

[0040] Figure 5 This is a schematic diagram of the structure of the first and second plug-in boxes in a semiconductor processing polishing slurry filtration device proposed in this invention;

[0041] Figure 6 This is a schematic diagram of the inner liner plate in a semiconductor processing slurry filtration device proposed in this invention;

[0042] Figure 7 This invention provides a filtration device for grinding slurry in semiconductor processing. Figure 6 Enlarged structural diagram at point A;

[0043] Figure 8 This invention provides a filtration device for grinding slurry in semiconductor processing. Figure 6 Enlarged structural diagram at point B;

[0044] Figure 9 This is a schematic diagram of the structure of an electric push rod in a semiconductor processing polishing slurry filtration device proposed in this invention;

[0045] Figure 10 This is a schematic diagram of the drive plate in a semiconductor processing slurry filtration device proposed in this invention;

[0046] Figure 11 This invention provides a filtration device for grinding slurry in semiconductor processing. Figure 10 Enlarged structural diagram at point C.

[0047] Legend:

[0048] 1. Filter frame; 2. Filter barrel; 3. First infusion tube; 4. Second infusion tube; 5. Linkage shaft; 6. Bearing seat; 7. Gear motor; 8. Three-way folding frame; 9. Deep fiber filter element; 10. First membrane filter element; 11. Second membrane filter element; 12. Sealing plate; 13. Outer ring sleeve; 14. Inner ring groove; 15. Rotating disk; 16. Rotating sleeve; 17. Permanent magnet shaft; 18. Electromagnet; 19. Slider; 20. Slide groove; 21. First spring; 22. First insertion interface; 23. Second insertion interface 24. First connector box; 25. Output pipe; 26. Second connector box; 27. Input pipe; 28. Compensation plate; 29. ​​Electric push rod; 30. Inner liner plate; 31. Injection hole; 32. Spoiler shaft; 33. Spoiler fan; 34. Ratchet; 35. Ratchet tooth; 36. Gear shaft; 37. Second spring; 38. Drive plate; 39. Limiting shaft; 40. Third spring; 41. Flip seat; 42. Flip tooth; 43. Flip shaft; 44. Fourth spring; 45. Gear; 46. Linkage frame. Detailed Implementation

[0049] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0050] Please see the appendix Figure 1 - Appendix Figure 11 The present invention provides a technical solution: a semiconductor processing polishing slurry filtration device, including a filter frame 1, a filter barrel 2 provided on the inner side of the top of the filter frame 1, a bearing seat 6 provided on the top of the filter frame 1 corresponding to the filter barrel 2, a linkage shaft 5 rotatably connected in the bearing seat 6, one end of the linkage shaft 5 extending into the interior of the filter barrel 2 and rotatably connected to the end of the filter barrel 2, a reduction motor 7 installed on the filter frame 1, and the other end of the linkage shaft 5 connected to the output end of the reduction motor 7;

[0051] Multiple three-way folding frames 8 are evenly arranged circumferentially on the shaft surface of the linkage shaft 5. Each three-way folding frame 8 has three filter ports opened in the direction of rotation. A deep fiber filter element 9, a first membrane filter element 10, and a second membrane filter element 11 are detachably snapped into the three filter ports. A sealing plate 12 is provided on the outer arc surface of each three-way folding frame 8. The three-way folding frame 8 slides and seals with the inner wall of the filter barrel 2 through the sealing plate 12.

[0052] The specific implementation method is as follows: The reduction motor 7 is controlled to run. The output end of the reduction motor 7 drives multiple three-way folding frames 8 to rotate slowly counterclockwise in the filter barrel 2 through the linkage shaft 5. Then, the semiconductor processing polishing slurry is introduced into the filter barrel 2 through the first input pipe 27. The polishing slurry flows onto the three-way folding frame 8 located below. After being filtered sequentially by the deep fiber filter element 9, the first membrane filter element 10 and the second membrane filter element 11 on the three-way folding frame 8, it flows to the bottom of the filter barrel 2 and is then discharged through the second inlet pipe 4. The deep fiber filter element 9, the first membrane filter element 10 and the second membrane filter element 11 achieve fine filtration of the polishing slurry. Since the deep fiber filter element 9, the first membrane filter element 10 and the second membrane filter element 11 make circular motion during the filtration of the polishing slurry, they can continuously change the flow direction and flow rate of the polishing slurry, thus accelerating the filtration rate of the polishing slurry to a certain extent, while reducing the clogging caused by the surface tension of the liquid.

[0053] Specifically, the bottom of the filter bucket 2 is provided with a second infusion pipe 4, and the upper part of the outer wall of the filter bucket 2 is provided with a first infusion pipe 3. Both the first infusion pipe 3 and the second infusion pipe 4 are connected to the interior of the filter bucket 2. The other end of the filter bucket 2 is connected to an outer ring sleeve 13. An inner ring groove 14 is opened on the inner ring surface of the outer ring sleeve 13, and a rotating disk 15 is rotatably connected in the inner ring groove 14.

[0054] A groove 20 is provided on the circumferential surface of the rotating disk 15. A slider 19 is slidably connected in the groove 20. The slider 19 is fixedly connected to the inner wall of the inner ring groove 14. A first spring 21 is provided in the groove 20. The slider 19 is elastically connected to the inner wall of the groove 20 through the first spring 21. A rotating sleeve 16 is provided at the axis of the rotating disk 15. An electromagnet 18 is installed in the port of the rotating sleeve 16. A permanent magnet shaft 17 is connected to one end of the linkage shaft 5 facing the rotating disk 15. The end of the permanent magnet shaft 17 is rotatably connected in the rotating sleeve 16 and magnetically attracted to the electromagnet 18. A first insertion interface 22 and a second insertion interface 23 are respectively provided on both sides of one of the three-way folding frames 8 on the end face of the rotating disk 15. A first insertion box 24 is detachably inserted into the first insertion interface 22. An output tube 25 is connected to the end of the first insertion box 24.

[0055] A second connector box 26 is detachably connected inside the second connector 23, and an input tube 27 is connected to the end of the second connector box 26.

[0056] An electric push rod 29 is installed on the end face of the rotating disk 15. The telescopic end of the electric push rod 29 is connected to a compensation plate 28. The compensation plate 28 is located between the first plug box 24 and the second plug box 26 and is connected to both.

[0057] The specific implementation method is as follows: After the three-way folding frame 8 rotates to between the first insertion interface 22 and the second insertion interface 23, the electromagnet 18 is energized, and the electromagnet 18 is magnetically attracted to the permanent magnet. The linkage shaft 5 drives the rotating disk 15 to rotate synchronously in the inner ring groove 14 through the rotating sleeve 16. Then, the electric push rod 29 is controlled to retract. The electric push rod 29 pulls the first insertion box 24 and the second insertion box 26 into the filter barrel 2 through the compensation plate 28. Hot airflow for filter element backwashing is injected into the second insertion box 26 through the input pipe 27. The hot airflow is ejected through multiple injection holes 31 and acts directly on the reverse side of the second membrane filter element 11. Then it flows sequentially through the first membrane filter element 10 and the deep fiber filter element 9, and finally enters the first insertion box 24. During this process, the filter surfaces of the deep fiber filter element 9, the first membrane filter element 10 and the second membrane filter element 11 are always tilted downwards, which is conducive to the reverse flushing cleaning and drying of the deep fiber filter element 9, the first membrane filter element 10 and the second membrane filter element 11, ensuring the effective filtration and filtration efficiency of the deep fiber filter element 9, the first membrane filter element 10 and the second membrane filter element 11.

[0058] During the rotation of the rotating disk 15, the slider 19 slides in the groove 20 and squeezes the first spring 21 to cause it to undergo elastic deformation. After cleaning the three filter elements on the three-way folding frame 8 is completed, the voltage input to the electromagnet 18 is gradually reduced, and the first spring 21 begins to perform elastic reset movement, which in turn can push the rotating disk 15, the first plug box 24, and the second plug box 26 to reverse and reset.

[0059] Specifically, the second plug-in box 26 has an inner liner plate 30 inside, and multiple injection holes 31 are opened on the end face of the inner liner plate 30. Multiple turbulence shafts 32 are rotatably connected to the multiple injection holes 31 inside the second plug-in box 26. One end of each turbulence shaft 32 passes through the corresponding injection hole 31 and is connected to a turbulence fan 33. A ratchet 34 is fixedly sleeved on the turbulence shaft 32. A gear shaft 36 is rotatably connected to the inner wall of the second plug-in box 26. One end of the gear shaft 36 is provided with ratchet teeth 35 that mesh with the tooth groove of the ratchet 34. A second spring 37 is sleeved on the gear shaft 36. The gear shaft 36 is elastically rotatably connected to the inner wall of the second plug-in box 26 through the second spring 37. A gear 45 is fixedly sleeved on the turbulence shaft 32. A sliding hole is opened at the end of the second plug-in box 26 corresponding to each gear 45. A drive plate 38 is slidably connected in the sliding hole.

[0060] The bottom of the drive plate 38 is connected to a flip seat 41 corresponding to each gear 45. A flip shaft 43 is rotatably connected inside the flip seat 41. A flip tooth 42 is provided on the flip shaft 43. The flip tooth 42 meshes with the tooth groove of the gear 45. A fourth spring 44 is sleeved on the flip shaft 43. The flip shaft 43 is elastically rotatably connected to the flip seat 41 through the fourth spring 44. The ends of multiple drive plates 38 are connected to the same linkage frame 46. The end of the linkage frame 46 is connected to the compensation plate 28.

[0061] The other end of the drive plate 38 is provided with a directional groove, and a limiting shaft 39 is sleeved in the directional groove. A third spring 40 is sleeved on the limiting shaft 39. The drive plate 38 is elastically supported and connected to the inner wall of the second plug box 26 through the third spring 40.

[0062] The specific implementation method is as follows: After the hot airflow is ejected through the injection hole 31, the electric push rod 29 is controlled to continue its retraction motion, which in turn pulls the linkage frame 46 through the compensation plate 28. The linkage frame 46 then pushes multiple drive plates 38, which in turn drive multiple rotating teeth 42 to move on the corresponding gears 45. This, in turn, drives the gears 45 to rotate the turbulence shaft 32. During this process, the drive plates 38 slide on the limiting shaft 39 through the directional groove and compress the third spring 40 to cause it to undergo elastic deformation. Then, the electric push rod 29 is controlled to extend, which in turn pulls the drive plates 38. When the reverse movement is engaged with the ratchet 34 and ratchet 35, the flipping tooth 42 on the drive plate 38 is subjected to resistance from the gear 45. The flipping tooth 42 rotates inside the flipping seat 41 through the flipping shaft 43 and twists the fourth spring 44 to cause it to undergo elastic deformation. By operating in a regular sequence, the turbulence fan 33 can be driven to rotate in one direction. During the rotation, the turbulence fan 33 can further accelerate the flow rate of the hot air and turbulent the hot air, thereby improving the flow direction of the hot air and enhancing its backwashing effect on the filter element.

[0063] Working principle and usage:

[0064] Phase 1: Dynamic Precision Filtration

[0065] When the system is started and liquid is introduced, the control system starts the geared motor 7, whose output shaft drives multiple three-way folding frame 8 components in the filter barrel 2 to rotate slowly in the counterclockwise direction through the linkage shaft 5. Then, the semiconductor processing polishing fluid is injected into the filter barrel 2 through the first input pipe 27.

[0066] Multi-stage dynamic filtration: Under the action of gravity, the grinding fluid flows to the three-way folding frame 8 below. Each three-way folding frame 8 is sequentially equipped with a pre-filtration deep fiber filter element 9, a fine filtration first-stage membrane filter element, and a terminal filtration second-stage membrane filter element, forming a three-stage series filtration system. The liquid flows through these three filter elements in sequence, and after achieving deep purification, it collects at the bottom of the filter tank 2 and is discharged through the second liquid delivery pipe 4. As the filter element assembly continuously performs circumferential motion, it constantly changes the flow direction and relative flow velocity of the liquid flowing through the filter media. This dynamic effect can effectively improve the filtration rate, break the concentration polarization layer on the surface of the filter membrane, accelerate the liquid passage, reduce filter element clogging, disturb the liquid, and reduce the particle adhesion and bridging effect caused by surface tension.

[0067] Phase Two: In-situ Reverse Pulse Cleaning and Drying

[0068] Cleaning positioning and docking: When the target three-way folding frame 8 rotates to the position aligned with the first insertion interface 22 and the second insertion interface 23, the electromagnet 18 is energized and attracted and fixed with the permanent magnet on the three-way folding frame 8, so that the linkage shaft 5 drives the bottom rotating disk 15 to lock synchronously in the inner ring groove 14 through the rotating sleeve 16. Subsequently, the electric push rod 29 retracts, pulling the first insertion box 24 and the second insertion box 26 connected to the compensation plate 28 to move forward and seal dock with the three filter elements.

[0069] Reverse pulse cleaning involves injecting hot airflow for backwashing the filter element into the second insertion box 26 through the input pipe 27. The hot air forms a pulse jet through multiple spray holes 31 on the box, penetrating from the clean side of the filter element to the contaminated side in reverse, and powerfully flushing the second membrane filter element 11, the first membrane filter element 10 and the deep fiber filter element 9 in sequence. During the cleaning process, the filter surface of the filter element assembly is always tilted downward to facilitate the shedding of contaminants and the discharge of accumulated liquid.

[0070] The cleaning flow path carries the hot airflow carrying the flushed contaminants, which eventually flows into the first insertion box 24 and is discharged from the system. This process simultaneously achieves deep reverse cleaning and hot air drying of the filter element, effectively restoring its filtration performance and throughput. The auxiliary mechanism and reset mechanism buffer and reset are as follows: when the rotating disk 15 rotates, the slider 19 on it slides along the slide groove 20 and compresses the first spring 21. After cleaning is completed, the voltage of the electromagnet 18 is gradually reduced, the first spring 21 is released elastically, and the rotating disk 15 and the insertion box are precisely reversed and reset to prepare for the next cycle.

[0071] The turbulence enhancement mechanism, during the hot air jet stage, controls the reciprocating motion of the electric push rod 29 to drive the linkage frame 46 and the drive plate 38. The flipping teeth 42 on the drive plate 38, in cooperation with the ratchet 34-gear 45 mechanism, convert the linear reciprocating motion into the unidirectional continuous rotation of the turbulence shaft 32, thereby driving the turbulence fan 33 on it to rotate. The turbulence fan 33 acts as a turbine, accelerating the flow of hot air, enhancing the rinsing intensity, and actively turbulentizing the hot air, causing it to generate turbulence in the internal space of the filter element, thereby improving the uniformity of cleaning coverage and the cleaning effect of dead corners.

[0072] The above are merely preferred embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A semiconductor processing slurry filtration device, comprising a filter frame (1), characterized in that, The filter frame (1) has a filter barrel (2) on its inner top side. The top of the filter frame (1) is provided with a bearing seat (6) corresponding to the filter barrel (2). A linkage shaft (5) is rotatably connected inside the bearing seat (6). One end of the linkage shaft (5) extends into the filter barrel (2) and is rotatably connected to the end of the filter barrel (2). A reduction motor (7) is installed on the filter frame (1). The other end of the linkage shaft (5) is connected to the output end of the reduction motor (7). The linkage shaft (5) has a plurality of three-way folding frames (8) evenly arranged circumferentially on its axial surface. Each of the three-way folding frames (8) has three filter ports opened in the direction of rotation. The three filter ports are respectively detachably fitted with a deep fiber filter element (9), a first membrane filter element (10), and a second membrane filter element (11). Each of the three-way folding frames (8) has a sealing plate (12) on its outer arc surface. The three-way folding frame (8) slides and seals with the inner wall of the filter barrel (2) through the sealing plate (12). The bottom of the filter bucket (2) is provided with a second infusion pipe (4), and the upper part of the outer wall of the filter bucket (2) is provided with a first infusion pipe (3). Both the first infusion pipe (3) and the second infusion pipe (4) are connected to the interior of the filter bucket (2). The other end of the filter barrel (2) is connected to an outer ring sleeve (13), and an inner ring groove (14) is opened on the inner ring surface of the outer ring sleeve (13). A rotating disk (15) is rotatably connected in the inner ring groove (14). The rotating disk (15) has a groove (20) on its circumferential surface. A slider (19) is slidably connected in the groove (20). The slider (19) is fixedly connected to the inner wall of the inner ring groove (14). A first spring (21) is provided in the groove (20). The slider (19) is elastically connected to the inner wall of the groove (20) through the first spring (21). A rotating sleeve (16) is provided at the center of the rotating disk (15). An electromagnet (18) is installed in the port of the rotating sleeve (16). A permanent magnet shaft (17) is connected to one end of the linkage shaft (5) facing the rotating disk (15). The end of the permanent magnet shaft (17) is rotatably connected to the rotating sleeve (16) and magnetically attracted to the electromagnet (18). The end face of the rotating disk (15) is provided with a first plug-in interface (22) and a second plug-in interface (23) respectively on both sides of one of the three-way folding frames (8). A first plug-in box (24) is detachably plugged into the first plug-in interface (22), and an output tube (25) is connected to the end of the first plug-in box (24). The second plug-in interface (23) is detachably plugged into a second plug box (26), and the end of the second plug box (26) is connected to an input tube (27). An electric push rod (29) is installed on the end face of the rotating disk (15). The telescopic end of the electric push rod (29) is connected to a compensation plate (28). The compensation plate (28) is located between the first plug box (24) and the second plug box (26) and is connected to both.

2. The semiconductor processing slurry filtration device according to claim 1, characterized in that, The second plug box (26) is provided with an inner liner plate (30), and the end face of the inner liner plate (30) is provided with multiple injection holes (31). The second plug box (26) is rotatably connected with multiple turbulence shafts (32) corresponding to the multiple injection holes (31). One end of each turbulence shaft (32) passes through the corresponding injection hole (31) and is connected to a turbulence fan (33).

3. The semiconductor processing slurry filtration device according to claim 2, characterized in that, A ratchet (34) is fixedly sleeved on the turbulence shaft (32), and a gear shaft (36) is rotatably connected to the inner wall of the second plug box (26). One end of the gear shaft (36) is provided with ratchet teeth (35) that mesh with the tooth groove of the ratchet (34). A second spring (37) is sleeved on the gear shaft (36), and the gear shaft (36) is elastically rotatably connected to the inner wall of the second plug box (26) through the second spring (37).

4. The semiconductor processing slurry filtration device according to claim 3, characterized in that, Gears (45) are fixedly sleeved on the turbulence shaft (32), and sliding holes are opened at the end of the second plug box (26) corresponding to each gear (45), and a drive plate (38) is slidably connected in the sliding holes. The bottom of the drive plate (38) is connected to a flip seat (41) corresponding to each gear (45). A flip shaft (43) is rotatably connected inside the flip seat (41). A flip tooth (42) is provided on the flip shaft (43). The flip tooth (42) meshes with the tooth groove of the gear (45). A fourth spring (44) is sleeved on the flip shaft (43). The flip shaft (43) is elastically rotatably connected to the flip seat (41) through the fourth spring (44).

5. A semiconductor processing slurry filtration device according to claim 4, characterized in that, The ends of multiple drive plates (38) are connected to the same linkage frame (46), and the ends of the linkage frame (46) are connected to the compensation plate (28); The other end of the drive plate (38) is provided with a directional groove, and a limiting shaft (39) is sleeved in the directional groove. A third spring (40) is sleeved on the limiting shaft (39). The drive plate (38) is elastically supported and connected to the inner wall of the second plug box (26) through the third spring (40).

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