A board-level TGV laser drilling processing equipment

Abstract

The application discloses a kind of plate-level TGV laser drilling processing equipment, including beam device and support platform, beam device is provided with X-axis movement module, X-axis movement module includes X-axis movement mounting seat, Z-axis movement module is provided on X-axis movement mounting seat, support platform is provided with Y-axis movement module, the acting end of Y-axis movement module is provided with plate jacking module, plate jacking module includes the plate adsorption platform with negative pressure adsorption function and jacking rod, Z-axis movement module includes Z-axis optical path box assembly, camera positioning assembly, displacement sensor and Bezier cutting head, and the plate supported on plate jacking module is punched by the Bezier cutting head.Processing equipment for plate-level TGV laser drilling has the advantages of accurate control, small thermal effect, high adaptability, etc., can realize the efficient processing of highly controllable high depth-diameter ratio micro-holes in aperture and hole type, high processing efficiency, greatly improves production efficiency.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of laser application of three-dimensional integrated packaging, and particularly to a board-level TGV laser drilling processing equipment. BACKGROUND

[0002] The board-level TGV laser drilling technology is a key enabling technology to support the next generation of advanced electronic packaging (especially based on glass substrates). Its background stems from the urgent demand for high frequency, high speed, high density, high reliability interconnection and the unique advantages of glass substrates. Ultrafast laser (picosecond / femtosecond) with its "cold processing" characteristics has become the only feasible solution to realize high-quality, high-precision TGV manufacturing. Modern TGV laser drilling equipment is a highly complex system engineering, which integrates top-notch ultrafast laser technology, precision optics, high-precision motion control, advanced sensing, intelligent software and automation technology to solve the core challenges of high aspect ratio, high quality, high efficiency, large size, high yield and other core challenges in glass material processing.

[0003] The existing glass micro-hole processing technologies include mechanical drilling, sand blasting drilling, electrochemical discharge hole forming, plasma dry etching hole forming, photosensitive glass etching hole forming, etc. The above-mentioned technologies can only make micro-holes with a hole diameter of more than 30 μm, and the processing efficiency is low, and the micro-hole morphology is not good. By using ultrafast laser single pulse perforation, multi-pulse percussion, top-down or bottom-up ring cutting or spiral processing, micro-channel structure is directly prepared by means of micro-explosion and ablation, and micro-holes with a minimum diameter of about 20 um can be processed, but it is almost impossible to obtain micro-holes with a diameter less than 10 um without taper. The laser energy required by the laser direct ablation to obtain micro-holes reaches the ablation threshold of the material, which leads to the fact that the surface of the glass via hole formed by laser direct ablation is still very rough. Therefore, the quality and depth-diameter ratio of the micro-holes formed on the glass material by the laser direct ablation method are not ideal.

[0004] In summary, the existing glass micro-hole processing technology has the technical problems of large hole diameter, low processing efficiency, poor micro-hole morphology, large taper of micro-hole, rough via hole surface, poor hole forming quality, etc. The above-mentioned problems seriously limit the further development and popularization and application of the field.

[0005] Therefore, the purpose of the present application is to provide a new technical solution to solve the existing technical problems. SUMMARY

[0006] In order to overcome the shortcomings of the prior art, the present application provides a board-level TGV laser drilling processing equipment, which effectively solves the technical problems of large hole diameter, poor micro-hole morphology, rough via hole surface, taper of hole forming, poor hole forming quality, low drilling efficiency and other technical problems existing in the prior art.

[0007] The technical scheme adopted by the present application to solve its technical problems is:

[0008] A kind of plate level TGV laser drilling processing equipment, including beam device and support platform, X-axis movement module is provided on the beam device, the X-axis movement module includes X-axis movement mounting seat, Z-axis movement module is provided on the X-axis movement mounting seat, Y-axis movement module is provided on the support platform, the acting end of the Y-axis movement module is provided with the plate jacking module for supporting plate, the plate jacking module includes plate adsorption platform with negative pressure adsorption function and jacking rod with negative pressure adsorption function, the Z-axis movement module includes Z-axis optical path box assembly, camera positioning assembly, displacement sensor and Bezier cutting head arranged on the X-axis movement mounting seat, the Z-axis optical path box assembly is used to reflect the laser beam sent from outside into the Bezier cutting head and carry out the drilling processing to the plate supported on the plate jacking module by the Bezier cutting head.

[0009] As a further improvement of the above technical solution, the Z-axis movement module further includes Z-axis movement guide rail, Z-axis screw nut pair, Z-axis drive motor and Z-axis movement mounting seat provided on the X-axis movement mounting seat, the output shaft of the Z-axis drive motor is connected with one end of the screw rod of the Z-axis screw nut pair, the nut of the Z-axis screw nut pair is connected with the Z-axis movement mounting seat through connecting block, the camera positioning assembly, displacement sensor and the Bezier cutting head are arranged on the Z-axis movement mounting seat, the Z-axis drive motor can drive the Z-axis movement mounting seat, the camera positioning assembly, the displacement sensor and the Bezier cutting head to move up and down in the guide direction of the Z-axis movement guide rail through the Z-axis screw nut pair, and the Z-axis optical path box assembly is arranged on the X-axis movement mounting seat.

[0010] As a further improvement of the above technical solution, the camera positioning assembly includes coarse positioning camera assembly and fine positioning camera assembly arranged on the Z-axis movement mounting seat, the coarse positioning camera assembly and the fine positioning camera assembly are fixedly installed on the Z-axis movement mounting seat through camera assembly mounting seat, the coarse positioning camera assembly includes a coarse positioning camera, a coarse positioning camera lens and a coarse positioning camera point light source used in conjunction, and the fine positioning camera assembly includes a fine positioning camera, a fine positioning camera lens and a fine positioning camera point light source used in conjunction.

[0011] As a further improvement of the above technical solution, the displacement sensor is a point spectrum displacement sensor, and the displacement sensor is fixedly installed on the Z-axis movement mounting seat through a sensor mounting seat.

[0012] As a further improvement of the above technical solution, the Bessel cutting head is fixedly installed on the Z-axis moving mounting base through a cutting head mounting base, and a cutting head temperature sensor is arranged on the cutting head mounting base.

[0013] As a further improvement of the above technical solution, a light path protection sleeve is arranged between the light path outlet of the Z-axis light path box assembly and the light path inlet of the Bessel cutting head.

[0014] As a further improvement of the above technical solution, a dust collection head is arranged at the bottom of the Bessel cutting head, a through slot matched with the light beam outlet of the Bessel cutting head is arranged at the middle position of the dust collection head, the dust collection head is fixedly installed on the Z-axis moving mounting base through a dust collection head mounting base and a dust collection head mounting plate, a dust collection pipeline is arranged at the side of the X-axis moving mounting base, an internal dust collection channel is arranged in the dust collection head mounting base, the internal dust collection channel is communicated with the dust collection inner cavity of the dust collection head, and the outlet of the internal dust collection channel is communicated with the lower end inlet of the dust collection pipeline through a dust collection connecting pipe.

[0015] As a further improvement of the above technical solution, the Z-axis moving mounting base is arranged on the Z-axis moving guide rail through a Z-axis moving guide rail base, a Z-axis cooling channel is arranged in the Z-axis moving mounting base from the position corresponding to the Z-axis moving guide rail base at the side of the Z-axis moving mounting base, a Z-axis cooling pipeline joint is arranged at the inlet of the Z-axis cooling channel at the side of the Z-axis moving mounting base, and the other end of the Z-axis cooling channel extends to the back of the Z-axis moving mounting base and forms an air outlet structure with multiple air outlets.

[0016] As a further improvement of the above technical solution, the X-axis moving module comprises an X-axis linear motor arranged on the beam device, an X-axis moving guide rail and an X-axis moving mounting base arranged on the X-axis moving guide rail, the stator of the X-axis linear motor is fixedly arranged on the beam device, the rotor of the X-axis linear motor is fixedly connected with the X-axis moving mounting base, and the X-axis linear motor is used to drive the X-axis moving mounting base to move on the X-axis moving guide rail.

[0017] As a further improvement of the above technical solution, the X-axis moving module further comprises an X-axis moving grating arranged on the beam device and an X-axis temperature sensor arranged at the side of the rotor of the X-axis linear motor.

[0018] As a further improvement of the above technical solution, the X-axis moving module further comprises an X-axis limit switch and an X-axis limit buffer arranged on the beam device.

[0019] As a further improvement of the above technical solution, the X-axis moving mounting base is arranged on the X-axis moving guide rail through an X-axis moving guide rail base, an X-axis cooling channel is arranged on the side of the X-axis moving mounting base corresponding to the position of the X-axis moving guide rail base, an X-axis cooling pipe joint is arranged at the entrance of the X-axis cooling channel on the side of the X-axis moving mounting base, and the other end of the X-axis cooling channel extends to the back of the X-axis moving mounting base and forms an air outlet structure with multiple air outlets.

[0020] As a further improvement of the above technical solution, the cross beam device comprises a cross beam body, a first lateral thickening part and a second lateral thickening part are arranged on one side of the cross beam body on which the X-axis moving guide rail is arranged, a first lateral groove is arranged between the first lateral thickening part and the second lateral thickening part, the X-axis moving guide rail comprises a first X-axis moving guide rail and a second X-axis moving guide rail which are parallel to each other, the first X-axis moving guide rail is arranged on the first lateral thickening part, the second X-axis moving guide rail is arranged on the second lateral thickening part, and the X-axis linear motor is arranged in the first lateral groove.

[0021] As a further improvement of the above technical solution, the Y-axis moving module comprises a Y-axis linear motor arranged on the support platform, a Y-axis moving guide rail, and a Y-axis moving mounting base arranged on the Y-axis moving guide rail, the stator of the Y-axis linear motor is fixedly arranged on the support platform, the plate jacking module is fixedly arranged on the Y-axis moving mounting base, the mover of the Y-axis linear motor is fixedly connected with the Y-axis moving mounting base, and the Y-axis linear motor is used to drive the Y-axis moving mounting base to move on the Y-axis moving guide rail.

[0022] As a further improvement of the above technical solution, the Y-axis moving module further comprises a Y-axis moving grating arranged on the support platform and a Y-axis temperature sensor arranged on the side of the mover of the Y-axis linear motor.

[0023] As a further improvement of the above technical solution, the Y-axis moving module further comprises a Y-axis limit switch and a Y-axis limit buffer arranged on the support platform.

[0024] As a further improvement of the above technical solution, the Y-axis moving mounting base is arranged on the Y-axis moving guide rail through a Y-axis moving guide rail base, a Y-axis cooling channel is arranged on the side of the Y-axis moving mounting base corresponding to the position of the Y-axis moving guide rail base, a Y-axis cooling pipe joint is arranged at the entrance of the Y-axis cooling channel on the side of the Y-axis moving mounting base, and the other end of the Y-axis cooling channel extends to the back of the Y-axis moving mounting base and forms an air outlet structure with multiple air outlets.

[0025] As a further improvement of the above technical solution, the plate jacking module comprises a jacking module base and a plate adsorption platform with platform adsorption holes opened on the surface, the plate adsorption platform is fixedly installed on the jacking module base through an adsorption platform mounting seat, a vertically extending lifting guide is arranged between the jacking module base and the plate adsorption platform, a lifting mounting seat capable of moving along the guide direction of the lifting guide is arranged on the lifting guide, a lifting driving device is arranged on the jacking module base or the adsorption platform mounting seat, the acting end of the lifting driving device is connected to the lifting mounting seat and is used to drive the lifting mounting seat to move up and down, a jacking rod is arranged on the lifting mounting seat, a jacking rod negative pressure channel is opened in the jacking rod, and the outlet of the jacking rod negative pressure channel is arranged on the upper end surface of the jacking rod, a jacking rod avoidance through hole adapted to the jacking rod is opened on the plate adsorption platform, the upper end of the jacking rod passes through the jacking rod avoidance through hole, when the jacking rod is driven by the lifting driving device to rise to the highest point, the upper end surface of the jacking rod is higher than the upper surface of the plate adsorption platform, and when the jacking rod is driven by the lifting driving device to descend to the lowest point, the upper end surface of the jacking rod is level with or lower than the upper surface of the plate adsorption platform.

[0026] As a further improvement of the above technical solution, the jacking rod has a plurality of jacking rods, and the jacking rods are fixedly installed on the lifting mounting seat through jacking rod mounting seats.

[0027] As a further improvement of the above technical solution, a mounting seat internal gas path is opened on the jacking rod mounting seat, a gas path communication hole communicating with the jacking rod negative pressure channel is arranged on the lower part of the jacking rod, the gas path communication hole communicates the mounting seat internal gas path with the jacking rod negative pressure channel, the mounting seat internal gas path has a gas path outlet on the side of the jacking rod mounting seat, and a jacking rod gas path joint is arranged at the gas path outlet.

[0028] As a further improvement of the above technical solution, an adsorption platform internal gas path is opened in the plate adsorption platform, the adsorption platform internal gas path communicates with the platform adsorption hole, the inlet of the adsorption platform internal gas path is located on the side of the plate adsorption platform and is provided with an adsorption platform gas path joint.

[0029] As a further improvement of the above technical solution, the lifting driving device comprises a lead screw stepper motor, the lead screw stepper motor has a motor lead screw, a matched lead screw nut is arranged on the motor lead screw, the lead screw nut is fixedly arranged in the lead screw stepper motor, a rotating bearing is arranged on the upper end of the motor lead screw, and the rotating bearing is fixedly connected with the lifting mounting seat through a bearing fixing block.

[0030] As a further improvement of the above technical solution, the adsorption platform mounting seat is a vertically arranged platform connecting plate, the upper end of the adsorption platform mounting seat is fixedly connected with the bottom surface of the plate adsorption platform, the lower end of the adsorption platform mounting seat is fixedly connected with the upper surface of the jacking module base, the platform connecting plate includes a first connecting plate and a second connecting plate, and the first connecting plate and the second connecting plate are perpendicular to each other.

[0031] As a further improvement of the above technical solution, the lifting guide includes a lifting linear guide arranged in a vertical direction, the lifting linear guide has a plurality of linear guides fixedly arranged on the side wall of the adsorption platform mounting seat, a lifting linear guide seat is arranged on the lifting linear guide, a lifting mounting seat connecting block is fixedly arranged on the lifting linear guide seat, and the lifting mounting seat is fixedly installed on the lifting mounting seat connecting block.

[0032] As a further improvement of the above technical solution, the lifting mounting seat is an integrally formed frame mounting seat, the lifting mounting seat includes a plurality of parallel mounting seat horizontal rods and a plurality of parallel mounting seat vertical rods, the plurality of mounting seat horizontal rods and the plurality of mounting seat vertical rods are vertically connected and together form the lifting mounting seat, a plurality of mounting seat through grooves are formed on the lifting mounting seat, the adsorption platform mounting seat and the lifting guide pass through the mounting seat through grooves, and the lifting driving device has two groups, and the two groups of lifting driving devices are arranged on opposite side walls of the jacking module base.

[0033] As a further improvement of the above technical solution, the cross beam device is installed on the support platform of the drilling equipment through the first cross beam base and the second cross beam base, and the cross beam device, the first cross beam base and the second cross beam base are all marble members.

[0034] As a further improvement of the above technical solution, the support platform is a marble platform, the cross beam device is arranged on the support platform, a plurality of support platform flow guide holes are formed in the support platform, a support platform flow guide fan is arranged in the support platform flow guide hole, and a plurality of support platform damping pads are arranged at the bottom of the marble platform.

[0035] As a further improvement of the above technical solution, the laser and the light path shaping box assembly further comprise a sealed shaping box with a shaping box light path entrance and a shaping box light path exit, and along the light path of the laser beam, the sealed shaping box is sequentially provided with a first mirror, a second mirror, a beam expander, a glass sheet and a third mirror, the shaping box light path entrance is used for the laser beam emitted by the laser to be emitted into the light path shaping box assembly, the shaping box light path exit is used for the laser beam to be emitted from the light path shaping box assembly, and the laser beam emitted from the shaping box light path exit of the light path shaping box assembly is used to correspond to the light path entrance of the Z-axis light path box assembly, the Z-axis light path box assembly is internally provided with a fourth mirror and is used for reflecting the laser beam entering the Z-axis light path box assembly to the Bessel cutting head through the fourth mirror.

[0036] As a further improvement of the above technical solution, the first mirror, the second mirror and the third mirror are all installed in the sealed shaping box through a three-dimensional adjusting frame, the beam expander is installed in the sealed shaping box through a two-dimensional adjusting frame, and the glass sheet is installed in the sealed shaping box through a six-dimensional adjusting frame.

[0037] The beneficial effects of the present application are that the present application provides a plate-level TGV laser drilling machining equipment, the drilling machining mechanism of the plate-level TGV laser drilling equipment drives the Bessel cutting head to move on the X-axis and the Z-axis through the X-axis moving module and the Z-axis moving module, reflects the laser beam to the Bessel cutting head through the Z-axis light path box assembly, drills the glass plate through the Bessel cutting head, generates the Bessel beam through the Bessel cutting head, the Bessel cutting head can be modulated into a non-diffractive beam with long focal depth through beam shaping technology, and the axial energy distribution is controllable, combined with the control of high-speed and high-precision X-axis and Z-axis, the energy controllable deposition in the glass plate and the accurate control of the modified machining area can be realized, and the highly controllable high-depth-ratio micro-hole with adjustable aperture can be efficiently machined. Compared with other existing machining technologies, the machining process does not produce any mechanical force, the thermal effect is small, the aperture is adjustable, and the machining can be performed in an atmospheric environment, so that the feasibility of industrial batch preparation of adapter plates can be met, and the traditional process has obvious technical advancement, and the production efficiency is greatly improved.

[0038] In summary, the plate-level TGV laser drilling machining equipment effectively solves the technical problems of large hole diameter, poor micro-hole appearance characteristics, rough through-hole surface, taper in hole forming, poor hole forming quality and low drilling efficiency in the prior art. BRIEF DESCRIPTION OF DRAWINGS

[0039] The present application will be further described below in combination with the drawings and examples.

[0040] Figure 1 is an assembly schematic diagram of a board-level TGV laser drilling machining equipment in an embodiment of the present application;

[0041] Figure 2 is an assembly schematic diagram of an X-axis moving module and a Z-axis moving module in an embodiment of the present application;

[0042] Figure 3 is an assembly schematic diagram of a Z-axis moving module in an embodiment of the present application;

[0043] Figure 4 is another assembly schematic diagram of a Z-axis moving module in an embodiment of the present application;

[0044] Figure 5 is an assembly schematic diagram of an X-axis moving module in an embodiment of the present application;

[0045] Figure 6 is a partial structure schematic diagram of a back of an X-axis moving mounting seat in an embodiment of the present application;

[0046] Figure 7 is an assembly schematic diagram of a Y-axis moving module in an embodiment of the present application;

[0047] Figure 8 is a partial structure schematic diagram of a back of a Y-axis moving mounting seat in an embodiment of the present application;

[0048] Figure 9 is an assembly schematic diagram of a crossbeam device and a support platform in an embodiment of the present application;

[0049] Figure 10 is a structure schematic diagram of a crossbeam device in an embodiment of the present application;

[0050] Figure 11 is a structure schematic diagram of a support platform in an embodiment of the present application;

[0051] Figure 12 is an assembly schematic diagram of a board material jacking module in an embodiment of the present application;

[0052] Figure 13 is another angle assembly schematic diagram of a board material jacking module in an embodiment of the present application;

[0053] Figure 14 is a third angle assembly schematic diagram of a board material jacking module in an embodiment of the present application;

[0054] Figure 15 is a fourth angle assembly schematic diagram of a board material jacking module in an embodiment of the present application;

[0055] Figure 16 is a fifth angle assembly schematic diagram in an embodiment of the present application;

[0056] Figure 17 is the assembly schematic diagram of the plate jacking module in the jacking plate state in the embodiment of the application;

[0057] Figure 18 is the internal structure schematic diagram of the light path shaping box assembly in the embodiment of the application.

[0058] In the figure:

[0059] 1, beam device, 11, beam body, 111, first lateral thickening, 112, second lateral thickening, 113, first lateral groove, 12, first beam base, 13, second beam base, 2, X-axis moving module, 21, X-axis moving mounting seat, 211, X-axis cooling pipeline joint, 212, X-axis cooling air outlet, 213, X-axis cooling groove, 22, X-axis linear motor, 23, X-axis moving guide rail, 24, X-axis moving grating, 25, X-axis temperature sensor, 26, X-axis limit switch, 27, X-axis limit buffer, 3, Z-axis moving module, 301, Z-axis moving guide rail, 302, Z-axis screw nut pair, 303, Z-axis drive motor, 31, Z-axis moving mounting seat, 311, Z-axis cooling pipeline joint, 32, Z-axis optical path box assembly, 33, camera positioning assembly, 331, coarse positioning camera, 332, coarse positioning camera lens, 333, coarse positioning camera point light source, 334, fine positioning camera, 335, fine positioning camera lens, 336, fine positioning camera point light source, 337, camera assembly mounting seat, 34, displacement sensor, 341, sensor mounting seat, 35, Bezier cutting head, 351, cutting head mounting seat, 352, cutting head temperature sensor, 36, optical path protection sleeve, 37, dust collection head, 371, dust collection head mounting seat, 372, dust collection head mounting plate, 373, dust collection pipeline, 38, Z-axis limit switch, 39, Z-axis buffer block, 4, laser, 5, optical path shaping box assembly, 51, sealed shaping box, 511, shaping box optical path inlet, 512, shaping box optical path outlet, 52, first reflector, 53, second reflector, 54, beam expander, 55, glass slide, 56, third reflector, 57, three-dimensional adjustment frame, 58, two-dimensional adjustment frame, 59, six-dimensional adjustment frame, 6, support platform, 61, support platform flow guide hole, 62, support platform flow guide fan, 63, support platform shock absorption pad, 7, Y-axis moving module, 71, Y-axis moving mounting seat, 711, Y-axis cooling pipeline joint, 712, Y-axis cooling air outlet, 713, Y-axis cooling groove, 72, Y-axis linear motor, 73, Y-axis moving guide rail, 74, Y-axis moving grating, 75, Y-axis temperature sensor, 76, Y-axis limit switch, 77, X-axis limit buffer, 8, plate jacking module, 81, jacking module base, 82, plate adsorption platform, 8201, adsorption platform gas joint, 821, platform adsorption hole, 822, jacking rod air clearance through hole, 823, adsorption platform baffle, 83, adsorption platform mounting seat, 84, screw stepper motor, 841, motor screw, 85, lifting mounting seat, 8501, bearing fixing block, 851, mounting seat horizontal rod, 852, mounting seat vertical rod, 86, jacking rod, 860, jacking rod mounting seat, 8601, jacking rod gas joint, 861, jacking rod negative pressure channel, 87, lifting linear guide rail, 871, lifting linear guide rail seat, 872, lifting mounting seat connecting block, 9, plate. DETAILED DESCRIPTION

[0060] The concept, specific structure and generated technical effects of the present application will be described clearly and completely in combination with the embodiments and drawings, so as to fully understand the purpose, features and effects of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments, and other embodiments obtained by those skilled in the art based on the embodiments of the present application without creative labor are within the protection scope of the present application. In addition, all the coupling / connection relationships involved in the patent do not mean that the components are directly connected, but that a better coupling structure can be composed by adding or reducing coupling accessories according to the specific implementation situation. The technical features in the present application can be combined with each other without conflict, and the specific implementation can be referred to Figures 1-18 .

[0061] Specifically referring to Figure 1 , Figure 2 , Figure 3 , Figure 4 , the present application provides:

[0062] The utility model provides a kind of plate-level TGV laser drilling processing equipment, including beam device 1 and support platform 6, X-axis movement module 2 is provided on the beam device 1, the X-axis movement module 2 includes X-axis movement mounting seat 21, Z-axis movement module 3 is provided on the X-axis movement mounting seat 21, Y-axis movement module 7 is provided on the support platform 6, the acting end of Y-axis movement module 7 is provided with plate jacking module 8 for supporting plate 9, and the plate jacking module 8 includes plate adsorption platform 82 with negative pressure adsorption function and jacking rod 86 with negative pressure adsorption function, the Z-axis movement module 3 includes Z-axis optical path box assembly 32 being arranged on the X-axis movement mounting seat 21, camera positioning assembly 33, displacement sensor 34 and Bezier cutting head 35, the Z-axis optical path box assembly 32 is used to reflect the laser beam sent from outside into the Bezier cutting head 35 and carry out the drilling processing to the plate 9 supported on the plate jacking module 8 by the Bezier cutting head 35.When the utility model is implemented, the plate-level TGV laser drilling processing equipment supports plate 9 by the plate jacking module 8, drives the plate jacking module 8 and plate 9 to move in Y-axis direction by Y-axis movement module 7, drives the Bezier cutting head 35 to move in X-axis direction and Z-axis direction by X-axis movement module 2 and Z-axis movement module 3, so that the Bezier cutting head 35 reaches the preset processing position and carries out drilling processing work.Specifically, the laser 4 laser beam is shot into the optical path shaping box assembly 5, the optical path shaping box assembly 5 shapes laser beam and shoots the shaped laser beam to the Z-axis optical path box assembly 32, reflects the laser beam to the Bezier cutting head 35 by the Z-axis optical path box assembly 32, carries out drilling processing to glass plate by the Bezier cutting head 35, generates Bezier beam by the Bezier cutting head 35, the Bezier cutting head 35 can be modulated into non-diffractive beam with long focal depth by beam shaping technology, and its axial energy distribution is controllable, combined with high-speed high-precision X-axis direction and Z-axis direction control, energy controllable deposition in glass plate and accurate control of modified processing area can be realized, high-depth-ratio micro-hole with highly controllable aperture and hole type can be efficiently processed.Compared with other existing processing technologies, the processing process does not generate any mechanical force, the thermal effect is small, the hole type is adjustable, and the processing can be carried out in atmospheric environment, which can completely meet the feasibility of industrial batch preparation of adapter plate, has obvious technical advancement compared with traditional process, and greatly improves production efficiency.

[0063] Reference Figure 3 、 Figure 4In some specific embodiments, the Z-axis moving module 3 further comprises a Z-axis moving guide rail 301 arranged on the X-axis moving mounting base 21, a Z-axis screw-nut pair 302, a Z-axis driving motor 303, and a Z-axis moving mounting base 31 arranged on the Z-axis moving guide rail 301. The output shaft of the Z-axis driving motor 303 is connected with one end of the screw rod of the Z-axis screw-nut pair 302, and the nut of the Z-axis screw-nut pair 302 is connected with the Z-axis moving mounting base 31 through a connecting block. The camera positioning assembly 33, the displacement sensor 34, and the Bezier cutting head 35 are arranged on the Z-axis moving mounting base 31. The Z-axis driving motor 303 can drive the Z-axis moving mounting base 31, the camera positioning assembly 33, the displacement sensor 34, and the Bezier cutting head 35 to move up and down in the guiding direction of the Z-axis moving guide rail 301. The Z-axis light path box assembly 32 is arranged on the X-axis moving mounting base 21. In this embodiment, the Z-axis moving guide rail 301 is a linear guide rail and has two, and the two Z-axis moving guide rails 301 are symmetrically arranged on the X-axis moving mounting base 21. The Z-axis driving motor 303 is a servo motor, which is installed on the X-axis moving mounting base 21 through a motor base. The screw rod of the Z-axis screw-nut pair 302 is installed on the X-axis moving mounting base 21 through a screw rod base and a screw rod bearing. The output shaft of the Z-axis driving motor 303 is connected with one end of the screw rod of the Z-axis screw-nut pair 302 through a shaft coupling. The camera positioning assembly 33 is used for positioning the plate material. The displacement sensor 34 is used for collecting the height displacement data of the Bezier cutting head 35, so as to realize high-precision drilling.

[0064] Referring to Figure 3 , Figure 4 In some specific embodiments, the side of the Z-axis moving mounting base 31 is provided with a Z-axis limit switch 38, and the X-axis moving mounting base 21 is provided with a Z-axis buffer block 39. The Z-axis limit switch 38 and the Z-axis buffer block 39 are used for limiting the movement of the Z-axis moving mounting base 31 in the Z-axis direction.

[0065] Referring to Figure 2 , Figure 3In some specific embodiments, the camera positioning assembly 33 comprises a coarse positioning camera assembly and a fine positioning camera assembly arranged on the Z-axis moving mount 31, and the coarse positioning camera assembly and the fine positioning camera assembly are fixedly installed on the Z-axis moving mount 31 through a camera assembly mount 337. The coarse positioning camera assembly comprises a coarse positioning camera 331, a coarse positioning camera lens 332 and a coarse positioning camera point light source 333 used in cooperation, and the fine positioning camera assembly comprises a fine positioning camera 334, a fine positioning camera lens 335 and a fine positioning camera point light source 336 used in cooperation. In the implementation of the present application, the coarse positioning camera assembly and the fine positioning camera assembly are respectively used to provide coarse positioning and fine positioning functions for the plate, and the positioning accuracy can be improved through double positioning operation, thereby providing a basis for high-quality drilling work.

[0066] With reference to Figure 3 , Figure 4 In some specific embodiments, the displacement sensor 34 is a point spectrum displacement sensor, and the displacement sensor 34 is fixedly installed on the Z-axis moving mount 31 through a sensor mount 341. The point spectrum displacement sensor can maximize the monitoring and control accuracy of the Bezier cutting head 35 in the height direction, thereby improving the drilling processing quality.

[0067] With reference to Figure 3 , Figure 4 In some specific embodiments, the Bezier cutting head 35 is fixedly installed on the Z-axis moving mount 31 through a cutting head mount 351, and the cutting head mount 351 is provided with a cutting head temperature sensor 352. The cutting head mount 351 is a cylindrical mount with a fixed through hole at the center position, and the Bezier cutting head 35 is fixedly arranged at the fixed through hole. The cutting head temperature sensor 352 is used to provide real-time temperature data of the Bezier cutting head 35, and when an abnormal temperature is detected, data can be fed back to the control system. After receiving the abnormal temperature, the control system can control the equipment to stop, thereby avoiding equipment damage or abnormal processing.

[0068] With reference to Figure 3 , Figure 4In some specific embodiments, a light path protection sleeve 36 is arranged between the light path outlet of the Z-axis light path box assembly 32 and the light path inlet of the Bezier cutting head 35, which is used to protect the light path safety between the light path outlet of the Z-axis light path box assembly 32 and the light path inlet of the Bezier cutting head 35, avoiding the influence of external environment on the light path and affecting the processing quality. The upper end of the light path protection sleeve 36 is connected with the light path outlet of the Z-axis light path box assembly 32, and the lower end of the light path protection sleeve 36 is connected with the light path inlet of the Bezier cutting head 35. The light path protection sleeve 36 has a certain telescopic function to ensure that the light path protection sleeve 36 will not be deformed and damaged when the Bezier cutting head 35 is in lifting motion.

[0069] Referring to Figure 3 , Figure 4 In some specific embodiments, the bottom of the Bezier cutting head 35 is provided with a dust collection head 37, which has a through slot in the middle position matched with the light beam outlet of the Bezier cutting head 35. The dust collection head 37 is fixed on the Z-axis moving mounting seat 31 through a dust collection head mounting seat 371 and a dust collection head mounting plate 372. The X-axis moving mounting seat 21 is provided with a dust collection pipeline 373 on the side. An internal dust collection channel is formed in the inside of the dust collection head mounting seat 371, which is communicated with the dust collection inner cavity of the dust collection head 37. The outlet of the internal dust collection channel is communicated with the lower end inlet of the dust collection pipeline 373 through a dust collection connecting pipe. In specific application, the upper part of the dust collection pipeline 373 is connected with a dust collector module. When the equipment works, the dust collector module starts to work. The smoke and dust particles generated during the drilling work of the Bezier cutting head 35 are sucked away by the dust collection head 37. The smoke and dust particles in the dust collection inner cavity of the dust collection head 37 pass through the internal dust collection channel of the dust collection head mounting seat 371, the dust collection connecting pipe and the dust collection pipeline 373 in turn and are finally sucked away by the dust collector module, avoiding the influence of smoke and dust particles on the processing quality and the pollution of the environment.

[0070] Referring to Figure 3 , Figure 4In some specific embodiments, the Z-axis moving mount 31 is arranged on the Z-axis moving guide rail 301 through a Z-axis moving guide rail seat, and a Z-axis cooling channel is arranged in the Z-axis moving mount 31 from the side corresponding to the position of the Z-axis moving guide rail seat, and a Z-axis cooling pipe joint 311 is arranged at the entrance of the Z-axis cooling channel on the side of the Z-axis moving mount 31, and the other end of the Z-axis cooling channel extends to the back of the Z-axis moving mount 31 and forms an air outlet structure with multiple air outlets. Specifically, multiple Z-axis cooling air outlets are arranged at the back of the Z-axis moving mount 31, and multiple Z-axis cooling grooves are arranged in the back of the Z-axis moving mount 31 and are in communication with the Z-axis cooling air outlets. In actual application, an external cooling air source is connected to the Z-axis cooling pipe joint 311 through a pipe and sends cooling air into the Z-axis cooling channel, and the Z-axis cooling channel sends the cooling air into the Z-axis cooling grooves through the Z-axis cooling air outlets. Since the Z-axis moving guide rail seat is arranged at the position of the Z-axis cooling grooves, and the distal end of the Z-axis cooling grooves extends out of the projection range of the Z-axis moving guide rail seat on the Z-axis moving mount 31 and forms an air outlet, when the cooling air enters the Z-axis cooling grooves, the cooling air in the Z-axis cooling grooves cools the Z-axis moving guide rail seat on one hand, and on the other hand, the cooling air is sent out through the air outlets at the distal end of the Z-axis cooling grooves and cools the Z-axis moving guide rail 301, thereby ensuring the normal operation of the Z-axis moving guide rail 301 and the Z-axis moving guide rail seat.

[0071] Referring to Figure 2 , Figure 5 In some specific embodiments, the X-axis moving module 2 comprises an X-axis linear motor 22 arranged on the beam device 1, an X-axis moving guide rail 23, and an X-axis moving mount 21 arranged on the X-axis moving guide rail 23. The stator of the X-axis linear motor 22 is fixedly arranged on the beam device 1, the mover of the X-axis linear motor 22 is fixedly connected with the X-axis moving mount 21, and the X-axis linear motor 22 is used to drive the X-axis moving mount 21 to move on the X-axis moving guide rail 23. In the implementation of the present application, since the Z-axis optical path box assembly 32, the camera positioning assembly 33, the displacement sensor 34, and the Bezier cutting head 35 are all arranged on the X-axis moving mount 21, when the X-axis linear motor 22 drives the X-axis moving mount 21 to move on the X-axis moving guide rail 23, the Z-axis optical path box assembly 32, the camera positioning assembly 33, the displacement sensor 34, and the Bezier cutting head 35 will move synchronously with the X-axis moving mount 21, thereby achieving the control of the movement of the Z-axis optical path box assembly 32, the camera positioning assembly 33, the displacement sensor 34, and the Bezier cutting head 35 in the X-axis direction.

[0072] With reference to Figure 2 , Figure 5 , Figure 9 , Figure 10 In the embodiment, the beam device 1 is installed on the support platform of the drilling equipment through the first beam base 12 and the second beam base 13, and the beam device 1 and the first beam base 12 and the second beam base 13 are all marble components, which have good anti-seismic performance and help to improve the machining precision. The beam device 1 comprises a beam body 11, one side of the beam body 11 on which the X-axis moving guide rail 23 is installed is provided with a first lateral thickening part 111 and a second lateral thickening part 112, and the first lateral thickening part 111 and the second lateral thickening part 112 have a first lateral groove 113 therebetween. The X-axis moving guide rail 23 comprises a first X-axis moving guide rail and a second X-axis moving guide rail which are parallel to each other. The first X-axis moving guide rail is arranged on the first lateral thickening part 111, and the second X-axis moving guide rail is arranged on the second lateral thickening part 112. The X-axis linear motor 22 is arranged in the first lateral groove 113.

[0073] With reference to Figure 2 , Figure 5 In some specific embodiments, the X-axis moving module 2 further comprises an X-axis moving grating 24 arranged on the beam device 1 and an X-axis temperature sensor 25 arranged on the mover side of the X-axis linear motor 22. The X-axis moving grating 24 can be used to detect the movement distance of the Z-axis moving module 3 in the X-axis direction in real time, and the X-axis temperature sensor 25 can be used to detect the temperature of the X-axis linear motor 22, thereby ensuring the normal operation of the equipment.

[0074] With reference to Figure 2 , Figure 5 In some specific embodiments, the X-axis moving module 2 further comprises an X-axis limit switch 26 and an X-axis limit buffer 27 arranged on the beam device 1. The X-axis limit switch 26 and the X-axis limit buffer 27 are used to limit the X-axis moving mounting seat 21 in the X-axis direction. Specifically, the X-axis limit switch 26 has two, which are arranged on the two sides of the beam device 1 in the X-axis direction. The X-axis limit buffer 27 has four, which are arranged on the two sides of the beam device 1 in the X-axis direction in pairs.

[0075] With reference to Figure 5 , Figure 6In some specific embodiments, the X-axis moving seat 21 is arranged on the X-axis moving guide rail 23 through an X-axis moving guide rail seat, and an X-axis cooling channel is arranged on the side of the X-axis moving seat 21 corresponding to the position of the Z-axis moving guide rail seat, and an X-axis cooling pipeline joint 211 is arranged at the entrance of the X-axis cooling channel on the side of the X-axis moving seat 21, and the other end of the X-axis cooling channel extends to the back of the X-axis moving seat 21 and forms an air outlet structure with multiple air outlets. Specifically, multiple X-axis cooling air outlets 212 are arranged on the back of the X-axis moving seat 21, and multiple X-axis cooling grooves 213 are arranged on the back of the X-axis moving seat 21 and are in communication with the X-axis cooling air outlets 212. In actual application, an external cooling air source is connected to the X-axis cooling pipeline joint 211 through a pipeline and sends cooling air into the X-axis cooling channel, and the X-axis cooling channel sends the cooling air into the X-axis cooling grooves 213 through the X-axis cooling air outlets 212. Since the X-axis moving guide rail seat is arranged on the position of the X-axis cooling grooves 213, and the distal end of the X-axis cooling grooves 213 extends out of the projection range of the X-axis moving guide rail seat on the X-axis moving seat 21 and forms an air outlet, when the cooling air enters the X-axis cooling grooves 213, the cooling air in the X-axis cooling grooves 213 cools the X-axis moving guide rail seat on one hand, and on the other hand, the cooling air is sent out through the air outlet at the end of the X-axis cooling grooves 213 and cools the X-axis moving guide rail 23, thereby ensuring the normal operation of the X-axis moving guide rail 23 and the X-axis moving guide rail seat.

[0076] Referring to Figure 7 , Figure 8 In some specific embodiments, the Y-axis moving module 7 comprises a Y-axis linear motor 72 arranged on the support platform 6, a Y-axis moving guide rail 73, and a Y-axis moving seat 71 arranged on the Y-axis moving guide rail 73. The stator of the Y-axis linear motor 72 is fixedly arranged on the support platform 6, the plate lifting module 8 is fixedly arranged on the Y-axis moving seat 71, the mover of the Y-axis linear motor 72 is fixedly connected with the Y-axis moving seat 71, and the Y-axis linear motor 72 is used to drive the Y-axis moving seat 71 to move on the Y-axis moving guide rail 73. In the implementation of the present application, when the Y-axis linear motor 72 drives the Y-axis moving seat 71 to move on the Y-axis moving guide rail 73, the plate lifting module 8 moves synchronously with the Y-axis moving seat 71, thereby achieving the control of the movement of the plate 9 in the Y-axis direction.

[0077] Referring to Figure 7 , Figure 8In some specific embodiments, the Y-axis moving module 7 further comprises a Y-axis moving grating 74 arranged on the support platform 6 and a Y-axis temperature sensor 75 arranged on the side of the mover of the Y-axis linear motor 72. The Y-axis moving grating 74 can be used to detect the movement distance of the plate jacking module 8 in the Y-axis direction in real time, and the Y-axis temperature sensor 75 can be used to detect the temperature of the Y-axis linear motor 72, thereby ensuring stable operation of the equipment.

[0078] With reference to Figure 7 , Figure 8 In some specific embodiments, the Y-axis moving module 7 further comprises a Y-axis limit switch 76 and a Y-axis limit buffer 77 arranged on the support platform 6. Specifically, the Y-axis limit switch 76 has two, which are arranged on the two sides of the support platform 6 in the Y-axis direction, respectively. The Y-axis limit buffer 77 has four, which are arranged on the two sides of the support platform 6 in the Y-axis direction in pairs.

[0079] With reference to Figure 7 , Figure 8 In some specific embodiments, the Y-axis moving mounting base 71 is arranged on the Y-axis moving guide rail 73 through a Y-axis moving guide rail seat. The Y-axis cooling channel is opened on the side of the Y-axis moving mounting base 71 corresponding to the position of the Y-axis moving guide rail seat. The Y-axis cooling channel is provided with a Y-axis cooling pipe joint 711 at the entrance of the side of the Y-axis moving mounting base 71. The other end of the Y-axis cooling channel extends to the back of the Y-axis moving mounting base 71 and forms an air outlet structure with multiple air outlets. Specifically, the Y-axis cooling channel is provided with multiple Y-axis cooling air outlets 712 at the back of the Y-axis moving mounting base 71. The Y-axis moving mounting base 71 is provided with multiple Y-axis cooling grooves 713 which are arranged in a longitudinal and transverse manner. The Y-axis cooling grooves 713 are in communication with the Y-axis cooling air outlets 712. In actual application, an external cooling air source is connected to the Y-axis cooling pipe joint 711 through a pipeline and sends cooling air into the Y-axis cooling channel. The Y-axis cooling channel sends the cooling air into the Y-axis cooling grooves 713 through the Y-axis cooling air outlets 712. Since the Y-axis moving guide rail seat is arranged at the position of the Y-axis cooling grooves 713, and the distal end of the Y-axis cooling grooves 713 extends out of the projection range of the Y-axis moving guide rail seat on the Y-axis moving mounting base 71 and forms an air outlet, when the cooling air enters the Y-axis cooling grooves 713, the cooling air in the Y-axis cooling grooves 713 cools the Y-axis moving guide rail seat on one hand, and on the other hand, the cooling air is sent out through the air outlet at the end of the Y-axis cooling grooves 713 and cools the Y-axis moving guide rail 73, thereby ensuring normal operation of the Y-axis moving guide rail 73 and the Y-axis moving guide rail seat.

[0080] Reference Figure 9 , Figure 11 In some specific embodiments, the support platform 6 is a marble platform, the crossbeam device 1 is mounted on the support platform 6, and the support platform 6 has several support platform guide holes 61. Support platform guide fans 62 are installed in the support platform guide holes 61, and several support platform shock-absorbing pads 63 are installed at the bottom of the marble platform. In actual implementation of this invention, the support platform guide fans 62 can draw air from the support platform guide holes 61 to form an internal and external airflow circulation within the equipment. The support platform shock-absorbing pads 63 can block external vibrations from interfering with the equipment, thus helping to improve the quality of drilling.

[0081] Reference Figures 12-17The plate jacking module 8 comprises a jacking module base 81 and a plate adsorption platform 82 with platform adsorption holes 821 on the surface, the plate adsorption platform 82 is fixedly installed on the jacking module base 81 through an adsorption platform mounting seat 83, a lifting guide extending in the vertical direction is arranged between the jacking module base 81 and the plate adsorption platform 82, a lifting mounting seat 85 moving along the guide direction of the lifting guide is arranged on the lifting guide, a lifting driving device is arranged on the jacking module base 81 or the adsorption platform mounting seat 83, the acting end of the lifting driving device is connected to the lifting mounting seat 85 and is used to drive the lifting mounting seat 85 to move up and down, a jacking rod 86 is arranged on the lifting mounting seat 85, a jacking rod negative pressure channel 861 is arranged in the jacking rod 86 and the outlet of the jacking rod negative pressure channel 861 is arranged on the upper end face of the jacking rod 86, a jacking rod avoidance through hole 822 matching the jacking rod 86 is arranged on the plate adsorption platform 82, the upper end of the jacking rod 86 passes through the jacking rod avoidance through hole 822, when the lifting driving device drives the jacking rod 86 to rise to the highest point, the upper end face of the jacking rod 86 is higher than the upper surface of the plate adsorption platform 82, when the lifting driving device drives the jacking rod 86 to descend to the lowest point, the upper end face of the jacking rod 86 is level with or lower than the upper surface of the plate adsorption platform 82. When the plate 9 is drilled, the jacking rod 86 is jacked to the highest point, the plate 9 is conveyed to the upper end of the jacking rod 86 by the mechanical hand, after the mechanical hand leaves, the jacking rod 86 adsorbs the plate 9 by negative pressure, then the jacking rod 86 descends until the plate is supported on the plate adsorption platform 82, the jacking rod 86 breaks the negative pressure adsorption, the plate adsorption platform 82 adsorbs the plate 9 by vacuum adsorption through the platform adsorption holes 821 distributed on the surface, so as to avoid displacement of the plate 9 in the drilling process and ensure the drilling quality. When the plate 9 is drilled, the plate adsorption platform 82 breaks the negative pressure, the jacking rod 86 adsorbs the plate 9 by negative pressure, the lifting driving device drives the lifting mounting seat 85 to rise to a preset height in the guide direction of the lifting guide, the lifting mounting seat 85 drives the jacking rod 86 to rise to a preset height in the process of rising, the upper end of the jacking rod 86 passes through the jacking rod avoidance through hole 822 on the plate adsorption platform 82 and jacks the plate 9, the jacking rod 86 applies vacuum adsorption to the plate 9 through the jacking rod negative pressure channel 861 in the process of jacking the plate 9, so as to avoid position movement of the plate 9 in the lifting process.

[0082] In practical application, the plate jacking module 8 further comprises an external negative pressure source. The platform suction holes 821 on the plate suction platform 82 and the jacking rod negative pressure channels 861 on the jacking rods 86 are connected with the external negative pressure source. The negative pressure state of the platform suction holes 821 and the jacking rod negative pressure channels 861 is controlled by the external negative pressure source and the air path control module.

[0083] With reference to Figures 12-17 In some specific embodiments, the jacking rods 86 are multiple, and the jacking rods 86 are fixedly installed on the lifting mounting seat 85 through the jacking rod mounting seats 860. Specifically, in the present embodiment, the jacking rods 86 are nine, and are distributed in a 3X3 pattern. Such jacking rods 86 form equidistant jacking support points, and provide relatively average jacking support force for the plate 9, so as to avoid deformation of the plate 9 due to excessive local support force. In addition, in order to avoid damage to the plate 9 caused by the upper end surface of the jacking rods 86, and to form a protective effect on the plate 9, the upper end portion of the jacking rods 86 can be provided with flexible support members, and the support members can be provided in a hollow cylindrical shape.

[0084] With reference to Figures 12-17 In some specific embodiments, the jacking rod mounting seats 860 are provided with mounting seat internal air paths, the lower portions of the jacking rods 86 are provided with air path communication holes which are in communication with the jacking rod negative pressure channels 861, the air path communication holes communicate the mounting seat internal air paths with the jacking rod negative pressure channels 861, the mounting seat internal air paths are provided with air path outlets at the side portions of the jacking rod mounting seats 860, and the air path outlets are provided with jacking rod air path connectors 8601. In actual implementation of the present application, the external negative pressure source is connected with the jacking rod air path connectors 8601 through pipelines, the jacking rod air path connectors 8601 are in communication with the jacking rod negative pressure channels 861 through the mounting seat internal air paths and the air path communication holes in sequence, and thus the jacking rods 86 are provided with negative pressure suction function.

[0085] With reference to Figures 12-17 In some specific embodiments, the platform suction holes 821 are uniformly distributed on the plate suction platform 82, the plate suction platform 82 is provided with an internal suction platform air path, the internal suction platform air path is in communication with the platform suction holes 821, and the inlet of the internal suction platform air path is located at the side portion of the plate suction platform 82 and is provided with a suction platform air path connector 8201. In actual implementation of the present application, the external negative pressure source is connected with the suction platform air path connector 8201 through a pipeline, the suction platform air path connector 8201 is in communication with the platform suction holes 821 through the internal suction platform air path, and thus the plate suction platform 82 is provided with negative pressure suction function.

[0086] With reference to Figure 12 ,16 In some specific embodiments, the upper surface of the plate adsorption platform 82 is provided with an adsorption platform baffle 823 around the periphery, and the bottom surface of the plate adsorption platform 82 is provided with an adsorption platform temperature sensor. In application, the adsorption platform baffle 823 has the functions of positioning and blocking the plate 9, and the adsorption platform temperature sensor can monitor the temperature of the plate 9 in real time during drilling processing to prevent the plate 9 from being damaged by high temperature.

[0087] Referring to Figures 12-17 In some specific embodiments, the lifting driving device has two groups, and the two groups of lifting driving devices are respectively arranged on the opposite two side walls of the jacking module base 81. Arranging the lifting driving device on the side wall of the jacking module base 81 can avoid occupying too much vertical space inside the jacking module, thereby reducing the height of the entire jacking module.

[0088] Referring to Figures 12-17 The lifting driving device includes a lead screw stepper motor 84, the lead screw stepper motor 84 has a motor lead screw 841, the motor lead screw 841 is provided with a matched lead screw nut, the lead screw nut is fixedly arranged inside the lead screw stepper motor 84, and the upper end of the motor lead screw 841 is provided with a rotating bearing, and the rotating bearing is fixedly connected with the lifting mounting seat 85 through a bearing fixing block 8501. In application, when it is necessary to control the lifting of the jacking rod 86, the lead screw stepper motor 84 drives the motor lead screw 841 to rotate. Since the lead screw nut is fixed inside the lead screw stepper motor 84, when the motor lead screw 841 rotates, the lead screw nut drives the motor lead screw 841 to move axially. After the motor lead screw 841 moves axially, the motor lead screw 841 drives the lifting mounting seat 85 to move up and down through the rotating bearing and the bearing fixing block 8501. The lifting mounting seat 85 drives the jacking rod 86 to move up and down synchronously during the up-and-down movement.

[0089] In some other embodiments, other linear drives can also be selected to drive the lifting mounting seat 85 to move up and down under the premise of meeting the performance requirements, such as a linear motor module, an electric cylinder, a separated motor lead screw module, etc., which will not be described here.

[0090] Referring to Figures 12-17In some specific embodiments, the adsorption platform mounting seat 83 is a vertically arranged platform connecting plate, the upper end of the adsorption platform mounting seat 83 is fixedly connected with the bottom surface of the plate adsorption platform 82, and the lower end of the adsorption platform mounting seat 83 is fixedly connected with the upper surface of the jacking module base 81. The platform connecting plate includes a first connecting plate and a second connecting plate, and the first connecting plate is perpendicular to the second connecting plate. By connecting the plate adsorption platform 82 and the jacking module base 81 through the vertical first connecting plate and the second connecting plate, the relative positions of the plate adsorption platform 82 and the jacking module base 81 can be fixed in two directions of the transverse direction and the longitudinal direction, thereby improving the structural stability.

[0091] With reference to Figures 12-17 In some specific embodiments, the lifting guide includes a lifting linear guide rail 87 arranged in the vertical direction, the lifting linear guide rail 87 has a plurality of lifting linear guide rail seats 871 fixedly arranged on the side wall of the adsorption platform mounting seat 83, the lifting linear guide rail seat 871 is fixedly provided with a lifting mounting seat connecting block 872, and the lifting mounting seat 85 is fixedly mounted on the lifting mounting seat connecting block 872. In some other embodiments, under the premise of meeting the performance requirements, linear guide elements such as lifting guide rods and linear bearings can also be used to replace the lifting linear guide rail 87 of the present application.

[0092] With reference to Figures 12-17 In some specific embodiments, the lifting mounting seat 85 is an integrally formed frame mounting seat, the lifting mounting seat 85 includes a plurality of mutually parallel mounting seat horizontal rods 851 and a plurality of mutually parallel mounting seat vertical rods 852, the plurality of mounting seat horizontal rods 851 and the plurality of mounting seat vertical rods 852 are vertically connected and jointly constitute the lifting mounting seat 85, a plurality of mounting seat through slots are formed on the lifting mounting seat 85, and the adsorption platform mounting seat 83 and the lifting guide are both arranged through the mounting seat through slots. Specifically, the jacking rod 86 is mounted at the intersection of the mounting seat horizontal rod 851 and the mounting seat vertical rod 852. By arranging more components in the internal space between the plate adsorption platform 82 and the jacking module base 81 through the mounting seat through slots, the structure can be simplified and the cost can be reduced. In addition, the lifting mounting seat 85 formed by the plurality of mounting seat horizontal rods 851 and the plurality of mounting seat vertical rods 852 can greatly reduce the weight while ensuring the structural strength, thereby improving the lifting response speed of the jacking rod 86 and improving the processing efficiency.

[0093] With reference to Figure 18In some specific embodiments, the laser 4 and the light path shaping box assembly 5 are further included, the light path shaping box assembly 5 comprises a sealed shaping box 51 with a shaping box light path entrance 511 and a shaping box light path exit 512, along the light path of the laser beam, the first mirror 52, the second mirror 53, the beam expander 54, the glass sheet 55 and the third mirror 56 are sequentially arranged in the sealed shaping box 51, the shaping box light path entrance 511 is used for the laser beam emitted by the laser 4 to exit to the inside of the light path shaping box assembly 5, the shaping box light path exit 512 is used for the laser beam to exit from the light path shaping box assembly 5, the laser beam exiting from the shaping box light path exit 512 of the light path shaping box assembly 5 is used to correspond to the light path entrance of the Z-axis light path box assembly 32, the Z-axis light path box assembly 32 has a fourth mirror inside and is used to reflect the laser beam entering the inside of the Z-axis light path box assembly 32 to the Bessel cutting head 35 through the fourth mirror. Specifically, the first mirror 52, the second mirror 53 and the third mirror 56 are all installed in the sealed shaping box 51 through a three-dimensional adjusting frame 57, the beam expander 54 is installed in the sealed shaping box 51 through a two-dimensional adjusting frame 58, and the glass sheet 55 is installed in the sealed shaping box 51 through a six-dimensional adjusting frame 59. In the implementation of the present application, the first mirror 52, the second mirror 53 and the third mirror 56 are all used to reflect the laser beam, the beam expander 54 is arranged opposite to the second mirror 53 and is used to expand the diameter of the laser beam, the glass sheet 55 is used to receive the laser beam after the expansion of the beam expander 54 and modulate the beam into left-handed circularly polarized light, and the sealed shaping box 51 is used to seal the internal components to avoid the adverse effects of the external environment.

[0094] The above is a specific description of the preferred embodiment of the present application, but the present application is not limited to the above-mentioned embodiments, and those skilled in the art can make various equivalent modifications or replacements without departing from the spirit of the present application, and these equivalent modifications or replacements are all included in the scope defined by the claims of the present application.

Claims

1. A board-level TGV laser drilling apparatus, characterized by: Including beam device (1) and support platform (6), the X-axis moving module (2) is provided on the beam device (1), the X-axis moving module (2) includes X-axis moving mounting seat (21), the Z-axis moving module (3) is provided on the X-axis moving mounting seat (21), the Y-axis moving module (7) is provided on the support platform (6), the plate lifting module (8) for supporting plate (9) is provided at the action end of the Y-axis moving module (7), the plate lifting module (8) includes plate adsorption platform (82) with negative pressure adsorption function and lifting rod (86) with negative pressure adsorption function, the Z-axis light path box assembly (32) is provided on the X-axis moving mounting seat (21), camera positioning assembly (33), displacement sensor (34) and Bezier cutting head (35), the Z-axis light path box assembly (32) is used to reflect the laser beam sent from outside into the Bezier cutting head (35) and carries out the punching processing to the plate (9) supported on the plate lifting module (8) by the Bezier cutting head (35); The plate lifting module (8) includes lifting module base (81), the platform adsorption hole (821) is opened in the surface of the plate adsorption platform (82), the plate adsorption platform (82) is fixedly installed on the lifting module base (81) by adsorption platform mounting seat (83), the lifting module base (81) and the plate adsorption platform (82) are provided with lifting guide piece extending in vertical direction, the lifting guide piece is provided with lifting mounting seat (85) that can move along the guide direction of the lifting guide piece, the lifting module base (81) or the adsorption platform mounting seat (83) is provided with lifting drive device, the action end of the lifting drive device is connected to the lifting mounting seat (85) and is used to drive the lifting mounting seat (85) to lift and move, the lifting mounting seat (85) is provided with the lifting rod (86), the lifting rod negative pressure channel (861) is opened in the inside of the lifting rod (86) and the outlet of the lifting rod negative pressure channel (861) is provided at the upper end surface of the lifting rod (86), the lifting rod avoidance through-hole (822) that is adapted to the lifting rod (86) is opened in the plate adsorption platform (82), the upper end of the lifting rod (86) passes through the lifting rod avoidance through-hole (822), when the lifting drive device drives the lifting rod (86) to rise and reaches the highest point, the upper end surface of the lifting rod (86) is higher than the upper surface of the plate adsorption platform (82), when the lifting drive device drives the lifting rod (86) to descend and reaches the lowest point, the upper end surface of the lifting rod (86) is level or lower than the upper surface of the plate adsorption platform (82); The lifting rod (86) has multiple, the lifting rod (86) is fixedly installed on the lifting mounting seat (85) by lifting rod mounting seat (860). The jacking rod mounting seat (860) is provided with an internal air passage, the lower part of the jacking rod (86) is provided with an air passage communication hole in communication with the jacking rod negative pressure passage (861), the air passage communication hole communicates the internal air passage with the jacking rod negative pressure passage (861), and the internal air passage is provided with an air passage outlet at the side of the jacking rod mounting seat (860) and is provided with a jacking rod air passage joint (8601) at the air passage outlet; The plate adsorption platform (82) is internally provided with an adsorption platform internal air passage, the adsorption platform internal air passage is in communication with the platform adsorption hole (821), and the inlet of the adsorption platform internal air passage is located at the side of the plate adsorption platform (82) and is provided with an adsorption platform air passage joint (8201).

2. A board-level TGV laser drilling apparatus according to claim 1, characterized in that: The Z-axis movement module (3) further comprises a Z-axis movement guide rail (301) arranged on the X-axis movement mounting seat (21), a Z-axis screw nut pair (302), a Z-axis drive motor (303), and a Z-axis movement mounting seat (31) arranged on the Z-axis movement guide rail (301). The output shaft of the Z-axis drive motor (303) is connected with one end of the screw rod of the Z-axis screw nut pair (302), and the nut of the Z-axis screw nut pair (302) is connected with the Z-axis movement mounting seat (31) through a connecting block. The camera positioning assembly (33), the displacement sensor (34), and the Bezier cutting head (35) are arranged on the Z-axis movement mounting seat (31). The Z-axis drive motor (303) can drive the Z-axis movement mounting seat (31), the camera positioning assembly (33), the displacement sensor (34), and the Bezier cutting head (35) to move up and down in the guide direction of the Z-axis movement guide rail (301) through the Z-axis screw nut pair (302). The Z-axis light path box assembly (32) is arranged on the X-axis movement mounting seat (21).

3. A board-level TGV laser drilling apparatus according to claim 2, characterized in that: The camera positioning assembly (33) comprises a coarse positioning camera assembly and a fine positioning camera assembly arranged on the Z-axis movement mounting seat (31). The coarse positioning camera assembly and the fine positioning camera assembly are fixedly installed on the Z-axis movement mounting seat (31) through a camera assembly mounting seat (337). The coarse positioning camera assembly comprises a coarse positioning camera (331), a coarse positioning camera lens (332), and a coarse positioning camera point light source (333) used in conjunction. The fine positioning camera assembly comprises a fine positioning camera (334), a fine positioning camera lens (335), and a fine positioning camera point light source (336) used in conjunction.

4. The board-level TGV laser drilling apparatus of claim 2, wherein: The displacement sensor (34) is a point spectrum displacement sensor, and the displacement sensor (34) is fixedly installed on the Z-axis movement mounting seat (31) through a sensor mounting seat (341).

5. The board-level TGV laser drilling apparatus of claim 2, wherein: The Bezier cutting head (35) is fixedly installed on the Z-axis movement mounting seat (31) through a cutting head mounting seat (351), and the cutting head mounting seat (351) is provided with a cutting head temperature sensor (352).

6. The board-level TGV laser drilling apparatus of claim 2, wherein: An optical path protective sleeve (36) is provided between the optical path outlet of the Z-axis optical path box assembly (32) and the optical path inlet of the Bezier cutting head (35).

7. A board-level TGV laser drilling apparatus according to claim 2, characterized by: The bottom of the Bezier cutting head (35) is provided with a suction head (37). The suction head (37) has a through groove in the middle position that matches the beam outlet of the Bezier cutting head (35). The suction head (37) is fixed on the Z-axis moving mounting base (31) by a suction head mounting base (371) and a suction head mounting plate (372). The side of the X-axis moving mounting base (21) is provided with a suction pipe (373). The suction head mounting base (371) has an internal suction channel. The internal suction channel is connected to the suction cavity of the suction head (37). The outlet of the internal suction channel is connected to the lower inlet of the suction pipe (373) through a suction connecting pipe.

8. A board-level TGV laser drilling apparatus according to claim 2, characterized by: The Z-axis movable mounting base (31) is mounted on the Z-axis movable guide rail (301) via a Z-axis movable guide rail seat. The Z-axis movable mounting base (31) has a Z-axis cooling channel on its side corresponding to the position of the Z-axis movable guide rail seat. The Z-axis cooling channel has a Z-axis cooling pipe connector (311) at the entrance on the side of the Z-axis movable mounting base (31). The other end of the Z-axis cooling channel extends to the back of the Z-axis movable mounting base (31) and forms an air outlet structure with multiple air outlets.

9. The board-level TGV laser drilling apparatus of claim 1, wherein: The X-axis moving module (2) also includes an X-axis linear motor (22) and an X-axis moving guide rail (23) mounted on the crossbeam device (1). The X-axis moving mounting base (21) is mounted on the X-axis moving guide rail (23). The stator of the X-axis linear motor (22) is fixedly mounted on the crossbeam device (1). The mover of the X-axis linear motor (22) is fixedly connected to the X-axis moving mounting base (21). The X-axis linear motor (22) is used to drive the X-axis moving mounting base (21) to move on the X-axis moving guide rail (23).

10. The board-level TGV laser drilling apparatus of claim 9, wherein: The X-axis moving module (2) also includes an X-axis moving grating (24) disposed on the crossbeam device (1) and an X-axis temperature sensor (25) disposed on the moving side of the X-axis linear motor (22).

11. The board-level TGV laser drilling apparatus of claim 9, wherein: The X-axis moving module (2) also includes an X-axis limit switch (26) and an X-axis limit buffer (27) disposed on the beam device (1).

12. The board-level TGV laser drilling apparatus of claim 9, wherein: The X-axis movable mounting base (21) is mounted on the X-axis movable guide rail (23) via an X-axis movable guide rail seat. The X-axis movable mounting base (21) has an X-axis cooling channel on its side corresponding to the position of the X-axis movable guide rail seat. The X-axis cooling channel has an X-axis cooling pipe connector (211) at the entrance on the side of the X-axis movable mounting base (21). The other end of the X-axis cooling channel extends to the back of the X-axis movable mounting base (21) and forms an air outlet structure with multiple air outlets.

13. The board-level TGV laser drilling apparatus of claim 9, wherein: The crossbeam device (1) comprises a crossbeam body (11), one side of the crossbeam body (11) on which the X-axis moving guide rail (23) is installed is provided with a first lateral thickening portion (111) and a second lateral thickening portion (112), and a first lateral groove (113) is arranged between the first lateral thickening portion (111) and the second lateral thickening portion (112), the X-axis moving guide rail (23) comprises a first X-axis moving guide rail and a second X-axis moving guide rail which are parallel to each other, the first X-axis moving guide rail is arranged on the first lateral thickening portion (111), the second X-axis moving guide rail is arranged on the second lateral thickening portion (112), and the X-axis linear motor (22) is arranged in the first lateral groove (113).

14. The board-level TGV laser drilling apparatus of claim 1, wherein: The Y-axis moving module (7) comprises a Y-axis linear motor (72), a Y-axis moving guide rail (73) and a Y-axis moving mounting base (71) arranged on the Y-axis moving guide rail (73), the stator of the Y-axis linear motor (72) is fixedly arranged on the support platform (6), the plate lifting module (8) is fixedly arranged on the Y-axis moving mounting base (71), the mover of the Y-axis linear motor (72) is fixedly connected with the Y-axis moving mounting base (71), and the Y-axis linear motor (72) is used to drive the Y-axis moving mounting base (71) to move on the Y-axis moving guide rail (73).

15. A board-level TGV laser drilling apparatus according to claim 14, characterized by: The Y-axis moving module (7) further comprises a Y-axis moving grating (74) arranged on the support platform (6) and a Y-axis temperature sensor (75) arranged on the side of the mover of the Y-axis linear motor (72).

16. The board-level TGV laser drilling apparatus of claim 14, wherein: The Y-axis moving module (7) further comprises a Y-axis limit switch (76) and a Y-axis limit buffer (77) arranged on the support platform (6).

17. The board-level TGV laser drilling apparatus of claim 14, wherein: The Y-axis moving mounting base (71) is arranged on the Y-axis moving guide rail (73) through a Y-axis moving guide rail seat, a Y-axis cooling channel is arranged on the side of the Y-axis moving mounting base (71) corresponding to the position of the Y-axis moving guide rail seat, a Y-axis cooling pipe joint (711) is arranged at the inlet of the Y-axis cooling channel on the side of the Y-axis moving mounting base (71), and the other end of the Y-axis cooling channel extends to the back of the Y-axis moving mounting base (71) and forms an air outlet structure with multiple air outlets.

18. The board-level TGV laser drilling apparatus of claim 1, wherein: The lifting driving device comprises a screw stepper motor (84), the screw stepper motor (84) has a motor screw (841), an adaptive screw nut is arranged on the motor screw (841), the screw nut is fixedly arranged in the screw stepper motor (84), a rotating bearing is arranged at the upper end of the motor screw (841), and the rotating bearing is fixedly connected with the lifting mounting base (85) through a bearing fixing block (8501).

19. The board-level TGV laser drilling apparatus of claim 1, wherein: The adsorption platform mounting seat (83) is a vertically arranged platform connecting plate, the upper end of the adsorption platform mounting seat (83) is fixedly connected with the bottom surface of the plate adsorption platform (82), the lower end of the adsorption platform mounting seat (83) is fixedly connected with the upper surface of the jacking module base (81), the platform connecting plate comprises a first connecting plate and a second connecting plate, and the first connecting plate and the second connecting plate are perpendicular to each other. The lifting guide member comprises a lifting linear guide rail (87) arranged in the vertical direction, the lifting linear guide rail (87) has a plurality of linear guide rails fixedly arranged on the side wall of the adsorption platform mounting seat (83), the lifting linear guide rail (87) is provided with a lifting linear guide rail seat (871), the lifting linear guide rail seat (871) is fixedly provided with a lifting mounting seat connecting block (872), and the lifting mounting seat (85) is fixedly mounted on the lifting mounting seat connecting block (872).

20. The board-level TGV laser drilling apparatus of claim 1, wherein: The lifting mounting seat (85) is an integrally formed frame mounting seat, the lifting mounting seat (85) comprises a plurality of parallel mounting seat horizontal rods (851) and a plurality of parallel mounting seat vertical rods (852), the plurality of mounting seat horizontal rods (851) and the plurality of mounting seat vertical rods (852) are vertically connected and jointly form the lifting mounting seat (85), and the plurality of parallel mounting seat horizontal rods (851) and the plurality of parallel mounting seat vertical rods (852) form a plurality of mounting seat through grooves on the lifting mounting seat (85), and the adsorption platform mounting seat (83) and the lifting guide member pass through the mounting seat through grooves. The lifting driving device has two groups, and the two groups of lifting driving devices are arranged on the opposite two side walls of the jacking module base (81).

21. The board-level TGV laser drilling apparatus of claim 1, wherein: The cross beam device (1) is installed on the support platform of the plate-level TGV laser drilling processing equipment through the first cross beam base (12) and the second cross beam base (13), and the cross beam device (1), the first cross beam base (12) and the second cross beam base (13) are all marble components.

22. The board-level TGV laser drilling apparatus of claim 1, wherein: The support platform (6) is a marble platform, the cross beam device (1) is arranged on the support platform (6), a plurality of support platform flow guide holes (61) are formed in the support platform (6), a support platform flow guide fan (62) is arranged in each support platform flow guide hole (61), and a plurality of support platform damping pads (63) are arranged at the bottom of the marble platform.

23. A board level TGV laser drilling apparatus as defined in any one of claims 1-22, characterized by: Also include a laser (4) and a light path shaping box assembly (5), the light path shaping box assembly (5) includes a sealed shaping box (51) with a shaping box light path entrance (511) and a shaping box light path exit (512), along the light path of the laser beam, the first mirror (52), the second mirror (53), the beam expander (54), the glass (55) and the third mirror (56) are sequentially arranged in the sealed shaping box (51), the shaping box light path entrance (511) is used for the laser beam emitted by the laser (4) to exit to the inside of the light path shaping box assembly (5), the shaping box light path exit (512) is used for the laser beam to exit from the light path shaping box assembly (5), the laser beam exiting from the shaping box light path exit (512) of the light path shaping box assembly (5) is used to correspond to the light path entrance of the Z-axis light path box assembly (32), the Z-axis light path box assembly (32) has a fourth mirror inside and is used to reflect the laser beam entering the inside of the Z-axis light path box assembly (32) to the Bessel cutting head (35) through the fourth mirror.

24. A board-level TGV laser drilling apparatus according to claim 23, wherein: The first mirror (52), the second mirror (53) and the third mirror (56) are all installed in the sealed shaping box (51) through a three-dimensional adjusting frame (57), the beam expander (54) is installed in the sealed shaping box (51) through a two-dimensional adjusting frame (58), and the glass (55) is installed in the sealed shaping box (51) through a six-dimensional adjusting frame (59).

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