Anti-ultraviolet antistatic release film and preparation method thereof

Abstract

The anti-ultraviolet and anti-static release film according to one embodiment of the present invention may comprise: a polyester substrate; and an antistatic release layer formed by coating at least one surface of the polyester substrate with an antistatic release composition which may include a conductive polymer resin, a binder resin, a cross-linking agent, an ultraviolet light absorber, and a silicon release agent, thereby providing a release film which does not require separate post-processing, and which can be used in the production of a conductive film. The antistatic release film has antistatic property and release property at the same time, and has ultraviolet resistance, so that surface resistance change can be minimized even if ultraviolet treatment is performed.

Description

TECHNICAL FIELD

[0001] The present application relates to an antistatic release film, and more particularly, to an anti-UV antistatic release film and a method for manufacturing the same, in which an antistatic release layer is formed on one side or both sides of a polyester base film using an in-line coating apparatus in a single coating, thereby having excellent anti-UV properties. BACKGROUND

[0002] Generally, polyester films have excellent dimensional stability, thickness uniformity, and optical transparency, and are widely used as various industrial materials and materials in various industrial fields such as the electronic and electric industry, display manufacturing processes, and the automobile industry. In line with this trend, in recent years, as the display industry has developed, polyester films have been widely used in release films and adhesive films, etc. However, although polyester films have excellent physical properties as described above, since the inherent resistance of the film surface is very large, there is a problem in that the film surface is easily charged when friction is applied, and in this case, the film surface is short-circuited due to static electricity, thereby causing defects or the attachment of foreign matter such as dust, resulting in product defects, and thus research into imparting an antistatic function to polyester films has been continuously conducted. Thus, when polyester films are used in release films, in order to solve the problem of static electricity as described above, a method of imparting an antistatic function to polyester films is used, and in recent years, in order to impart an antistatic function, the use of a conductive polymer has increased.

[0003] As described above, the conductive polymer has excellent transparency and antistatic properties, and thus has the advantage of maintaining the transparency of the polyester film and imparting antistatic properties. However, since the prior art is limited to simply imparting antistatic properties by forming a conductive polymer coating layer on the surface of the polyester film, additional processing steps for forming a release layer or an adhesive layer are required when processing a release film or an adhesive film, and thus there is a problem in that separate processing costs are incurred and a separate lamination process after processing is required. In addition, since most processing forms use a method of inducing a curing reaction based on ultraviolet (UV) to form a coating layer, the antistatic layer and the release layer (or the adhesive layer) are degraded due to UV, resulting in a problem in that reliability physical properties (a decrease in release force and a change in adhesive force over time, etc.) are reduced.

[0004] Thus, the present inventors have completed the present application by an anti-UV antistatic release film, which can form an antistatic layer and a release layer through a single coating without an additional processing step, thereby reducing the number of processes in the upper layer process, saving processing costs, and improving anti-UV properties to prevent degradation due to UV. SUMMARY

[0005] The technical problems to be solved by the present application

[0006] The present invention has been made to solve the problems as described above and to comply with the existing requirements, and the technical problem to be solved by the present invention is to provide an anti-UV antistatic release film and a method for manufacturing the same, which has both antistatic properties and release properties, and thus can save processing time and expenses by omitting a release coating process as a post-processing, and can minimize changes in physical properties of a release layer due to UV by improving anti-UV properties, and has excellent antistatic properties, and thus can remove short circuit occurrence based on static electricity and prevent dust adsorption.

[0007] The above objects and other objects and advantages of the present invention will become readily apparent from the following description of the preferred embodiments taken in conjunction with the accompanying drawings.

[0008] Technical scheme

[0009] The above objects are achieved by an anti-UV antistatic release film, which includes a polyester substrate, and an antistatic release layer on at least one side of the polyester substrate, and is coated using an antistatic release composition including a conductive polymer resin, a binder resin, a crosslinking agent, an ultraviolet absorber, and a silicone release agent; and a surface resistance change amount (△H) of the antistatic release layer before and after treatment with a UV light amount of 300 mJ or more satisfies Equation 1.

[0010] Equation 1

[0011] △H = log[(surface resistance after UV treatment) / (surface resistance before UV treatment)] ≤ 1.

[0012] Preferably, the average particle diameter of the conductive polymer resin can be 10 nm to 90 nm, and the conductive polymer resin can be an aqueous dispersion containing a polyanion and a polythiophene or an aqueous dispersion containing a polyanion and a polythiophene derivative.

[0013] Preferably, the binder resin can include at least one selected from the group consisting of urethane-based resins, polyester-based resins, and copolymers thereof.

[0014] Preferably, the crosslinking agent can include at least one selected from the group consisting of carbodiimide-based, oxazoline-based, epoxy-based, and melamine-based crosslinking agents.

[0015] Preferably, the ultraviolet absorber can include at least one selected from the group consisting of benzotriazole-based compounds and benzophenone-based compounds.

[0016] Preferably, the ultraviolet absorber can include at least one selected from 2-(2H-benzotriazol-2-yl)-4,6-bis(1-methyl-1-phenylmethyl)phenol, bis[2-hydroxy-5-tert-octyl-3-(benzotriazol-2-yl)-phenyl]-methane, 2(2'-hydroxy-3,5'-di-tert-butylphenyl)benzotriazole, 2(2'-hydroxy-3'-tert-butyl-5'-methyl-phenyl)benzotriazole, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, 2,2'4,4'-tetrahydroxybenzophenone, 2,2'-dihydroxy-4-methoxybenzophenone, and 2,2'-methylenebis[6-(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol].

[0017] Preferably, the antistatic release composition can include 150 parts by weight to 400 parts by weight of the binder resin and 200 parts by weight to 600 parts by weight of the crosslinking agent, with respect to 100 parts by weight of the conductive polymer resin.

[0018] Preferably, the antistatic release composition can include 15 parts by weight to 40 parts by weight of the ultraviolet absorber, with respect to 100 parts by weight of the binder resin.

[0019] Preferably, the antistatic release composition can include 10% by weight or less of the organic solvent, with respect to the total content of the antistatic release composition.

[0020] Preferably, the silicone release agent can include the organopolysiloxane having the structure of Chemical Formula 1 and the organohydrogenpolysiloxane having the structure of Chemical Formula 2.

[0021] Preferably, the silicone release agent can include the organopolysiloxane having the structure of Chemical Formula 1 and the organohydrogenpolysiloxane having the structure of Chemical Formula 2.

[0022] Chemical Formula 1

[0023]

[0024] In Chemical Formula 1, R is -CH=CH2, -CH2-CH2-CH2-CH2-CH=CH2, and -CH3, m and n are integers of 0 or more,

[0025] Chemical Formula 2

[0026]

[0027] In Chemical Formula 2, p and q are integers of 0 or more.

[0028] Preferably, the release force of the antistatic release layer measured at a speed of 30 cm / minute when peeled after the TESA 7475 tape is attached is 25 g / inch or less.

[0029] Preferably, the polyester substrate and the antistatic release layer can be simultaneously processed through an in-line coating process.

[0030] In addition, the object is achieved by a method of manufacturing an anti-UV antistatic release film including a polyester substrate and an antistatic release layer on at least one surface of the polyester substrate, the method including: a first step of melting and extruding a polyester to manufacture an unstretched sheet; a second step of stretching the unstretched sheet in a length direction to manufacture a uniaxially stretched sheet; a third step of manufacturing an antistatic release composition, the antistatic release composition including a conductive polymer resin, a binder resin, a crosslinking agent, an ultraviolet absorber, and a silicone release agent; a fourth step of coating the antistatic release composition on a surface of the uniaxially stretched sheet to form an antistatic release layer; and a fifth step of biaxially stretching the film on which the antistatic release layer is formed in a width direction.

[0031] Preferably, the amount of change (△H) in the surface resistance of the antistatic release layer before and after treatment with a UV light amount of 300 mJ or more can satisfy Equation 1.

[0032] Equation 1

[0033] △H = log[(surface resistance after UV treatment) / (surface resistance before UV treatment)] ≤ 1.

[0034] Preferably, the polyester substrate and the antistatic release layer can be simultaneously processed through an in-line coating process.

[0035] Beneficial effects

[0036] The anti-UV antistatic release film and the method of manufacturing the same according to the present application can form a coating layer having both antistatic properties and release properties through one in-line coating, thereby saving processing time and costs by omitting an additional release coating process.

[0037] Furthermore, the anti-UV antistatic release film and the method of manufacturing the same according to the present application can minimize changes in physical properties of a processed layer due to UV by improving anti-UV properties, and in particular, durability based on UV is improved, and thus the amount of change in surface resistance can be minimized.

[0038] In addition, the anti-UV antistatic release film and the method of manufacturing the same according to the present application have excellent release properties, and at the same time, have excellent antistatic properties, and thus can remove short circuit occurrence based on static electricity and prevent dust adsorption.

[0039] However, the effects of the present application are not limited to the above-mentioned effects, and other effects not mentioned can be clearly understood by those skilled in the art according to the following description. BRIEF DESCRIPTION OF DRAWINGS

[0040] Figure 1 is a constitutional diagram of an anti-UV antistatic release film according to an embodiment of the present application.

[0041] Figure 2 is a constitutional diagram of an anti-UV antistatic release film according to another embodiment of the present application.

[0042] Figure 3 is a flow chart showing a method of manufacturing an anti-UV antistatic release film according to an embodiment of the present application.

[0043] BRIEF DESCRIPTION OF DRAWINGS

[0044] 110: polyester base material

[0045] 120: antistatic release layer

[0046] 130: second antistatic release layer DETAILED DESCRIPTION

[0047] Hereinafter, embodiments of the present application will be described in detail with reference to the accompanying drawings so as to be easily practiced by one of ordinary skill in the art. The present application can be implemented in various different forms and is not limited to the embodiments described herein.

[0048] Unless otherwise defined, all technical and scientific terms used in the present specification have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. If there is a conflict between the definitions in the present specification and those in the included documents, the present specification takes precedence. In addition, although methods and materials similar or equivalent to those described in the present specification can be used in the practice or testing of the present application, suitable methods and materials are described in the present specification.

[0049] In the present specification, "a ~ base resin", "a ~ base polymer", or / and "a ~ base copolymer" mean a broad concept including "a ~ resin", "a ~ polymer", "a ~ copolymer", or / and "a derivative of a ~ resin, polymer, or copolymer". In addition, in the present specification, the term "a polymer or copolymer crosslinked by these resins" means "a polymer or copolymer crosslinked by the aforementioned resins".

[0050] In the present specification, "a compound" means a broad concept including "a monatomic molecule", "an oligomer", and "a high molecular compound including homopolymers and copolymers".

[0051] In the present specification, the term "comprising" can also include other constituent elements than those mentioned, unless otherwise specifically stated.

[0052] In the present specification, the term "a combination thereof" means a mixture or combination of one or more of the constituent elements already mentioned.

[0053] In the present specification, the term "and / or" means that any one or all of the listed items are included. In the present specification, the term "or" means "and / or". In the present specification, the expression "at least one" or "one or more" before a list of components means that the list of components is supplemented, and is not intended to supplement the single component recited above.

[0054] In the present specification, all percentages, fractions, ratios, etc. are by weight, unless otherwise indicated. Further, when amounts, concentrations or other values or parameters are given in a list of ranges, preferred ranges or preferred upper and lower limits, it is understood that all ranges formed by any pair of an upper limit of a range or preferred value and a lower limit of a range or preferred value, whether or not the ranges are expressly disclosed, are expressly disclosed.

[0055] In case numerical ranges are recited in this text, unless otherwise indicated, the range is intended to include the end points and all integers and fractions within the range. It is not intended to limit the scope of the present application to the specific values recited when defining the range.

[0056] In the present specification, each component is a concept including both the singular and the plural.

[0057] As a result of the present inventors' efforts to research the problems of the above-described prior art with respect to the anti-UV antistatic release film of the present application and the method for manufacturing the same, it was found that when a coating layer is formed by combining a modified conductive compound having excellent antistatic properties, a crosslinking agent, and a binder, etc., the appearance quality is good, and UV durability can be improved by a UV absorber, and it was found that when a silicon release agent is added to the same preparation liquid, the characteristics of a release film are exhibited, thereby achieving the present application. Hereinafter, the anti-UV antistatic release film of the present application will be described in detail with reference to the drawings. Figure 1 The present application will be described in detail.

[0058] Referring to the configuration diagram of the anti-UV antistatic release film of the present application as an embodiment Figure 1 The anti-UV antistatic release film of the present application as an embodiment includes a polyester substrate 110; and an antistatic release layer 120 formed by coating an antistatic release composition on at least one side of the polyester substrate.

[0059] 1. Polyester substrate 110

[0060] The polyester substrate 110 can be a film formed from a polyester resin, and the kind of such a polyester film is not limited, but a substrate film conventionally known as an antistatic coating substrate film or a release film can be used. In the present application, polyester-based resins such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate are described as the center, but the polyester substrate 110 of the present application is not limited thereto.

[0061] As an example, the polyester constituting the polyester substrate 110 can use a polyester obtained by polycondensation of an aromatic dicarboxylic acid and an aliphatic diol. Among them, the aromatic dicarboxylic acid can be exemplified by terephthalic acid and 2,6-naphthalene dicarboxylic acid, and the aliphatic diol can be exemplified by ethylene glycol, diethylene glycol, and 1,4-cyclohexane dimethanol. Typical polyesters include polyethylene terephthalate (PET), polyethylene-2,6-naphthalate (PEN), and the like. Furthermore, the polyester can also be a copolymer containing a third component. The dicarboxylic acid component of the copolymer polyester can be exemplified by isophthalic acid, phthalic acid, terephthalic acid, 2,6-naphthalene dicarboxylic acid, adipic acid, sebacic acid, and oxy carboxylic acid (for example, p-hydroxybenzoic acid, and the like), and the diol component can be exemplified by ethylene glycol, diethylene glycol, propylene glycol, butylene glycol, 1,4-cyclohexane dimethanol, and neopentyl glycol, and the like. In addition, two or more of their dicarboxylic acid components and diol components can also be used. Typical polyester substrates 110 include polyethylene terephthalate (PET) and polyethylene-2,6-naphthalate (PEN), and the like, and the polyester can also be a copolymer containing a third component.

[0062] In addition, the polyester substrate 110 can be a film formed by melt-extruding a polyester resin in a single layer, and can have a laminated structure of two or more layers, for example, a laminated form of A / B / A, and the like. In addition, the polyester substrate 110 preferably uses a uniaxially or biaxially oriented film having high transparency and excellent productivity and processability.

[0063] As an example, the thickness of the polyester substrate 110 is preferably 25 μm to 250 μm. When the thickness of the polyester substrate 110 is less than 25 μm, there is a problem that the degree of deformation due to external force increases, and when the thickness exceeds 250 μm, there is a problem that the economy decreases.

[0064] 2. Antistatic release layer 120

[0065] The antistatic release layer 120 is formed by coating at least one side of the polyester substrate 110 with an antistatic release composition. In the present application, the antistatic release composition preferably contains a conductive polymer resin, a binder resin, a crosslinking agent, an ultraviolet absorber, and a silicon-based release agent. In addition, preferably, the antistatic release layer 120 and the polyester substrate 110 are simultaneously processed by an in-line coating process. Hereinafter, the composition of the antistatic release composition is described in order.

[0066] (1) Conductive polymer resin

[0067] In the present application, the conductive polymer resin contained in the antistatic release composition forming the antistatic release layer 120 imparts antistatic properties to the antistatic release layer 120, and preferably includes a water dispersion containing a polyanion and a polythiophene or a water dispersion containing a polyanion and a polythiophene derivative. Among them, the polyanion is an acidic polymer, and preferably includes a carboxylic acid polymer or a sulfonic acid polymer, polyvinylsulfonic acid, or the like. Also, examples of the carboxylic acid polymer include polyacrylic acid, polymethacrylic acid, polymaleic acid, and the like, and the carboxylic acid polymer includes polystyrene sulfonic acid and the like.

[0068] In terms of imparting conductivity, the polythiophene or polythiophene derivative in the conductive polymer resin used in the present application preferably has an excess of the solid weight ratio of the polyanion. As an example, when 1% by weight of the polythiophene or polythiophene derivative is used, the polyanion is preferably more than 1% by weight and less than 5% by weight, and more preferably more than 1% by weight and less than 3% by weight. In the examples of the present application described later, a water dispersion containing 0.5% by weight of poly(3,4-ethylenedioxythiophene) and 0.8% by weight of polystyrene sulfonic acid (molecular weight Mn = 150000) is used, but is not limited thereto.

[0069] As an example, the average particle size of the conductive polymer resin is preferably 10 nm to 90 nm, and more preferably 20 nm to 50 nm, and the conductive polymer resin can have a particle size distribution as described above so that it exhibits stable antistatic properties. At this time, if the average particle size of the conductive polymer resin exceeds 90 nm, the surface resistance deviation at each position after lateral stretching (width direction) becomes very large, and thus the durability of the antistatic function is significantly reduced. In addition, when the average particle size of the conductive polymer resin is less than 10 nm, as the molecular weight decreases, if the distance between molecules exceeds a certain distance, antistatic properties cannot be achieved, and when stretched in-line, the smaller the average particle size, the more the antistatic properties decrease. The particle size of the conductive polymer resin used in the present application as described above has a particle size of 20% or less of the particles of conventional conductive polymer resins, and conventional means capable of physically fine particles can be used without limitation, and commercial products that satisfy the particle size conditions of the particles can also be used.

[0070] (2) Binder resin

[0071] In the present application, in terms of the binder resin contained in the antistatic release composition forming the antistatic release layer 120, when the antistatic release composition is applied to the polyester substrate 110, it is used in order to improve the adhesion between the antistatic release layer 120 and the polyester substrate 110.

[0072] The antistatic release composition forming the antistatic release layer 120 preferably contains at least one selected from the group consisting of urethane-based resins, polyester-based resins, and copolymers thereof as a binder resin, and more preferably contains a polyurethane resin.

[0073] As an example, in the present application, the polyurethane resin contained in the antistatic release composition is preferably of a water-dispersible type, and a resin made of an anionic polyether polyurethane dispersion containing at least one functional group selected from the group consisting of a hydroxyl group, an amine group, an alkyl group, and a carboxyl group, etc. is preferably used.

[0074] More specifically, the water-dispersible polyurethane resin contained in the antistatic release composition preferably contains: an anionic polyether polyurethane dispersion containing a hydroxyl group; an anionic polyether polyurethane dispersion containing a repeating unit functional group selected from the group consisting of an allylamine, a vinylamine, an ethylene amine, a vinylpyridine, a diethylaminoethyl methacrylate, a diallyldimethylammonium chloride, a methacryloyloxyethyltrimethylammonium sulfate, and combinations thereof; or an anionic polyether polyurethane dispersion containing a complex unit functional group selected from the group consisting of a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, and combinations thereof.

[0075] As an example, in the present application, the polyester-based resin contained in the antistatic release composition refers to a polyester obtained by condensation polymerization of an aromatic dicarboxylic acid and an aliphatic diol, and the aromatic dicarboxylic acid can use terephthalic acid and 2,6-naphthalene dicarboxylic acid, etc., and further, the dicarboxylic acid component of the copolymerized polyester can use isophthalic acid, phthalic acid, terephthalic acid, 2,6-naphthalene dicarboxylic acid, adipic acid, sebacic acid, oxy carboxylic acid (e.g., p-hydroxybenzoic acid, etc.), and the aliphatic diol can list ethylene glycol, diethylene glycol, 1,4-cyclohexane dimethanol, propylene glycol, butanediol, and neopentyl glycol, etc., and two or more of each of the dicarboxylic acid component and the diol component are used in combination.

[0076] As an example, the polyester-based resin contained in the antistatic release composition can contain at least one selected from the group consisting of polyethylene terephthalate (PET), polyethylene-2,6-naphthalate (PEN), and a copolymer containing a third component in the above polyester.

[0077] As an example, the antistatic release composition preferably contains 150 parts by weight to 400 parts by weight of the adhesive resin, more preferably 200 parts by weight to 300 parts by weight, relative to 100 parts by weight of the conductive polymer resin. When the content of the adhesive resin is less than 150 parts by weight, there is a problem that the surface resistance increases and the durability of the antistatic release layer 120 decreases, and when it exceeds 400 parts by weight, the surface resistance is too low. In particular, when the antistatic release layer 120 is peeled after being attached to the surface of the adherend (such as an adhesive or an adhesive layer), if the difference in surface resistance between the antistatic release layer 120 and the adherend is too low, the peeling electrostatic voltage increases, and there is a problem that short-circuit failure of electronic materials or attachment of foreign matter is induced, and thus the content of the adhesive resin preferably has the above content.

[0078] (3) Cross-linking agent

[0079] In the present application, in terms of the cross-linking agent contained in the antistatic release composition that forms the antistatic release layer 120, when the antistatic release composition is cured to form the antistatic release layer 120, the durability and the conductive properties of the antistatic release layer 120 and the polyester base material 110 are improved by adjusting the cross-linking density.

[0080] As an example, the cross-linking agent preferably contains at least one cross-linking agent selected from the group consisting of carbodiimides, oxazolines, epoxies, and melamines.

[0081] As an example, the antistatic release composition preferably contains 200 parts by weight to 600 parts by weight of the cross-linking agent, more preferably 300 parts by weight to 400 parts by weight, relative to 100 parts by weight of the conductive polymer resin. When the content of the cross-linking agent is less than 200 parts by weight, there is a problem that the cross-linking density of the antistatic release layer 120 decreases, the adhesion between the polyester base material 110 and the antistatic release layer 120 decreases, and the surface resistance increases, and when it exceeds 600 parts by weight, the surface resistance is too low. In particular, when the antistatic release layer 120 is peeled after being attached to the surface of the adherend (such as an adhesive or an adhesive layer), if the difference in surface resistance between the antistatic release layer 120 and the adherend is too low, there is a problem that the peeling electrostatic voltage increases, and thus the content of the cross-linking agent preferably has the above content.

[0082] As described above, when the contents of the adhesive resin and the cross-linking agent are excessive, the surface resistance decreases, and when the contents of the adhesive resin and the cross-linking agent are insufficient, the surface resistance increases, and thus it is preferable to adjust the ratio to the conductive polymer resin to the above content.

[0083] (4) Ultraviolet absorber

[0084] In the present application, the ultraviolet absorber contained in the antistatic release composition forming the antistatic release layer 120 preferably contains a benzotriazole compound or a benzophenone compound. More specifically, the ultraviolet absorber preferably contains at least one compound selected from the group consisting of 2-(2H-benzotriazol-2-yl)-4,6-bis(l-methyl-l-phenylmethyl)phenol, bis[2-hydroxy-5-tert-octyl-3-(benzotriazol-2-yl)-phenyl]-methane, 2(2'-hydroxy-3,5'-di-tert-butylphenyl)benzotriazole, 2(2'-hydroxy-3'-tert-butyl-5'-methyl-phenyl)benzotriazole, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, 2,2'4,4'-tetrahydroxybenzophenone, 2,2'-dihydroxy-4-methoxybenzophenone, and 2,2'-methylenebis[6-(2H-benzotriazol-2-yl)-4-(l,l,3,3-tetramethylbutyl)phenol].

[0085] As an example, the antistatic release composition preferably contains 15 to 40 parts by weight of the ultraviolet absorber with respect to 100 parts by weight of the binder resin. More preferably, 20 to 38 parts by weight. When the content of the ultraviolet absorber is less than 15 parts by weight, the UV resistance (UV durability) is reduced, resulting in an increase in the surface resistance after UV irradiation (UV treatment), and when it exceeds 40 parts by weight, the surface distribution of the silicon release agent is hindered, thereby inducing an increase in the peeling force.

[0086] (5) Silicon release agent

[0087] In order to impart antistatic properties and release properties to the antistatic release layer 120, the antistatic release composition of an embodiment of the present application further includes a silicon release agent in addition to the conductive polymer resin.

[0088] As an example, the silicon release agent contained in the antistatic release composition preferably contains an organopolysiloxane, and any type such as an addition type, a condensation type, and an ultraviolet curing type can be used, but more preferably contains an organopolysiloxane having the following Chemical Formula 1.

[0089] Chemical Formula 1

[0090]

[0091] In Chemical Formula 1, R is -CH=CH2, -CH2-CH2-CH2-CH2-CH=CH2, and -CH3, and m and n are integers of 0 or more.

[0092] In the present application, the organopolysiloxane contains an alkenyl group in the molecule, and the alkenyl group can exist in any part of the molecule, and preferably, at least two or more. Also, the molecular structure can be linear or branched, and can also be a structure of both linear and branched.

[0093] The silicon release agent contained in the antistatic release composition preferably contains an organohydrogenpolysiloxane. The organohydrogenpolysiloxane is used for the curing of the silicon release agent, and more preferably, as a typical molecular structure, an organohydrogenpolysiloxane containing a structure of Formula 2.

[0094] Formula 2

[0095]

[0096] In Formula 2, p and q are integers of 0 or more.

[0097] As an example, the antistatic release composition preferably contains 0.5 parts by weight to 15 parts by weight of the silicon release agent with respect to 100 parts by weight of the conductive polymer resin. When the content of the silicon release agent is less than 0.5 parts by weight, there is a problem in that the release effect is not good, resulting in an increase in the peeling force, and when it exceeds 15 parts by weight, there is a problem in that the antistatic property is reduced.

[0098] In addition, in the present application, in order to improve the curing degree, the silicon release agent can further contain a platinum chelate catalyst. At this time, the antistatic release composition preferably contains 1 ppm to 1000 ppm of the platinum chelate catalyst.

[0099] (6) Solvent

[0100] In the present application, preferably, the solvent used in the antistatic release composition forming the antistatic release layer 120 is actually an aqueous coating solution in which water is the main medium. Also, for the purpose of improving the coating property and transparency of the antistatic release composition used in the present application, an organic solvent which does not hinder the effect of the present application can be contained, and as a preferred organic solvent, isopropyl alcohol, butyl cellosolve, tertiary butyl cellosolve, ethyl cellosolve, acetone, ethanol, and methanol, etc. can be used.

[0101] However, when the antistatic release composition contains a large amount of an organic solvent, in the case of coating the antistatic release composition using an on-line coating method, there is an explosion hazard in the drying and stretching machine heat treatment process, and thus the content of the organic solvent in the total content of the antistatic release composition is preferably 10% by weight or less, and more preferably 5% by weight or less.

[0102] (7) Additive

[0103] The antistatic release composition of the present application can contain various additives other than the conductive polymer resin, the adhesive resin, the crosslinking agent, the ultraviolet absorber, and the silicon-based release agent, within a range that does not hinder the effects of the present application, specifically, within a range that does not hinder the optical properties and the antistatic properties. For example, the additives can include plasticizers, surfactants, solvents, antioxidants, heat-resistant stabilizers, weather-resistant stabilizers, organic reversible lubricants, pigments, dyes, organic / inorganic microparticles, fillers, and nucleating agents, etc. In particular, when inorganic particles are added to the antistatic release composition, the runnability and the resistance to blocking can be improved. At this time, preferably, the inorganic particles added to the antistatic release composition include at least one selected from the group consisting of silica, colloidal silica, alumina, aluminum sol, kaolin, talc, mica, and calcium carbonate.

[0104] 3. Anti-ultraviolet antistatic release film

[0105] The surface resistance of the anti-ultraviolet antistatic release film of an embodiment of the present application is preferably 1.1*10 5 to 5.5*10 7 Ω / □. More specifically, in both the state in which UV treatment is performed and the state in which UV treatment is not performed, the surface resistance of the anti-ultraviolet antistatic release film of an embodiment of the present application is preferably 1.1*10 5 to 5.5*10 7 Ω / □. When the surface resistance is less than 1.1*10 5 Ω / □, when peeling after being attached to the surface of the adherend (such as an adhesive or an adhesive layer) to which the antistatic release layer 120 is adhered, the difference in surface resistance between the antistatic release layer 120 and the adherend is too small, and thus the peeling static voltage increases, which can cause a short-circuit defect of an electronic material or the attachment of foreign matter. When the surface resistance exceeds 5.5*10 7 Ω / □, there is a problem in that the antistatic properties cannot be ensured.

[0106] In the anti-ultraviolet antistatic release film of an embodiment of the present application, the amount of change (ΔH) in the surface resistance of the antistatic release layer before and after treatment with a UV light amount of 300 mJ or more preferably satisfies Equation 1.

[0107] Equation 1

[0108] ΔH = log [(surface resistance after UV treatment) / (surface resistance before UV treatment)] ≤ 1.

[0109] When the value of Equation 1 exceeds 1, the anti-ultraviolet properties of the antistatic release layer 120 decrease, and the surface resistance increases due to the UV irradiation in the release film preparation process, and thus there is a problem in that the antistatic properties decrease.

[0110] In the anti-UV antistatic release film of one embodiment of the present application, the peeling force measured when the antistatic release layer 120 is peeled at a speed of 30 cm / minute after the TESA 7475 tape is attached is preferably 25 g / inch or less. When the peeling force exceeds 25 g / inch, a problem in the process can occur because the antistatic release film cannot be smoothly peeled from the adherend.

[0111] Figure 2 is a configuration diagram of the anti-UV antistatic release film of another embodiment of the present application.

[0112] Referring to Figure 1 and Figure 2 , Figure 1 The anti-UV antistatic release film shown in Figure 2 is not only formed on one side of the polyester substrate 110, but can have a configuration in which it can be formed on both sides.

[0113] Figure 2 The anti-UV antistatic release film shown in Figure 2 can protect the adherend located on both sides.

[0114] Figure 3 is a flowchart showing the method of manufacturing the anti-UV antistatic release film of one embodiment of the present application.

[0115] Referring to Figure 3 , the method of manufacturing the anti-UV antistatic release film of one embodiment of the present application includes a first step S101 of melting and extruding a polyester to manufacture an unstretched sheet, a second step S102 of stretching the unstretched sheet in the length direction to manufacture a uniaxially stretched sheet, a third step S103 of manufacturing an antistatic release composition, a fourth step S104 of applying the antistatic release composition to the surface of the uniaxially stretched sheet to form an antistatic release layer, and a fifth step S105 of biaxially stretching the film on which the antistatic release layer is formed in the width direction. However, in the method of manufacturing the anti-UV antistatic release film of one embodiment of the present application in Figure 3 , the description repeated in Figure 1 will be omitted.

[0116] First, in the first step S101 of melting and extruding the polyester to prepare an unstretched sheet, the polyester raw material chip is melted and extruded under a prescribed temperature condition, and a sheet is prepared in an unstretched form in a casting roll.

[0117] Next, in the second step S102 of preparing a uniaxially stretched sheet by stretching the unstretched sheet in the length direction, the unstretched sheet is uniaxially stretched in the length direction (i.e., the moving direction of the casting roll), and at this time, the stretching ratio can be 3 to 5 times.

[0118] Next, in the third step S103 of preparing an antistatic release composition, an antistatic release composition for forming an antistatic release layer is prepared by mixing a conductive polymer resin, an adhesive resin, a crosslinking agent, an ultraviolet absorber, and a silicon-based release agent. However, the third step S103 can be performed before the fourth step S104 described later, i.e., also before the first step S101 or the second step S102 is performed.

[0119] Next, in the fourth step S104 of forming an antistatic release layer by applying the antistatic release composition to the surface of the uniaxially stretched sheet, the antistatic release composition prepared in the third step S103 is applied and cured to form an antistatic release layer. As an example, in the fourth step S104, a metal bar #4 can be used to apply the antistatic release composition to the surface of the uniaxially stretched sheet, and then heat-cured at a temperature condition of 150°C to form an antistatic release layer.

[0120] Next, in the fifth step S105 of biaxially stretching the film on which the antistatic release layer is formed in the width direction, the film on which the antistatic release composition is applied and cured in the fourth step S104 is biaxially stretched in the width direction to prepare an antistatic release film. At this time, the width direction stretching ratio is preferably 3 to 5 times.

[0121] As described above, in the present application, after the antistatic release composition is applied in the fourth step S104, the antistatic release layer is formed using an on-line method of biaxial stretching in the width direction in the fifth step S105, so that the post-processing process can be reduced.

[0122] In addition, as described above, the surface resistance of the antistatic release film prepared by the method of preparing an antistatic release film according to an embodiment of the present application is preferably 1.1*10 5 to 5.5*10 7 Ω / □.

[0123] Further, the antistatic release film prepared by the method of preparing an antistatic release film according to an embodiment of the present application has a change amount (ΔH) of surface resistance of the antistatic release layer before and after treatment with a UV light amount of 300 mJ or more preferably satisfies Equation 1.

[0124] Equation 1

[0125] ΔH = log [(surface resistance after UV treatment) / (surface resistance before UV treatment)] ≤ 1.

[0126] Hereinafter, the structure of the present application and effects obtained therefrom will be described in detail with reference to examples and comparative examples. However, the examples are provided to describe the present application in more detail, and the scope of the present application is not limited to the examples.

[0127] Example

[0128] Example 1

[0129] A polyethylene terephthalate raw material chip was melted and extruded, a sheet was prepared in a non-stretched form in a casting roll, and a uniaxially stretched sheet was prepared by stretching in the length direction.

[0130] Next, 90 wt% of water, 10 wt% of an electrically conductive polymer resin (an aqueous dispersion containing 0.5 wt% of poly 3,4-ethylenedioxythiophene and 0.8 wt% of polystyrene sulfonic acid (molecular weight Mn = 150,000) having an average particle diameter of 50 nm) were mixed as 100 parts by weight with a polyurethane resin (AP-50RI, DIC Corporation) as an adhesive resin, a melamine-based crosslinking agent (PM80, DIC Corporation) as a crosslinking agent, and a hydroxyphenyl benzotriazole (BASF, Tinuvin 384-2) as a UV absorber in the amounts shown in Table 1 below, and mixed with the following silicone release agent to prepare an antistatic release composition. At this time, the silicone release agent was prepared by mixing an organopolysiloxane represented by Chemical Formula 1 and an organohydrogen polysiloxane represented by Chemical Formula 2 in a weight ratio of 1:2.2, and by adding 50 ppm of a platinum chelate catalyst (Dow Corning), and mixed so as to contain 7.5 parts by weight of the silicone release agent with respect to the total content of 100 parts by weight of the antistatic release composition.

[0131] Next, the prepared antistatic release composition was coated on the surface of the uniaxially stretched sheet using a metal bar #4, and dried at a temperature of 150°C to form an antistatic release layer. Then, stretching was performed in the width direction perpendicular to the length direction to prepare an antistatic release film.

[0132] Examples 2 to 9

[0133] An antistatic release film was produced in the same manner as in Example 1 except that the content of the antistatic release composition was as shown in Table 1.

[0134] Comparative Example

[0135] Comparative Examples 1 to 6

[0136] An antistatic release film was produced in the same manner as in Example 1 except that the content of the antistatic release composition was as shown in Table 1.

[0137] Table 1

[0138]

[0139] Using the antistatic release films of Examples 1 to 9 and Comparative Examples 1 to 6, physical properties were measured by the following Experimental Examples, and the results are shown in Table 2 below.

[0140] [Experimental Examples]

[0141] (1) Measurement of Surface Resistance

[0142] The release films of the examples and comparative examples were sampled as A4 size films, and the initial surface resistance (surface resistance before UV treatment, A) was measured on the surface of the antistatic release layer of the sample using a resistance measuring instrument (Model 800, terminal method, ACL Co.).

[0143] Next, after the sample was irradiated with UV light of 300 mJ on the surface of the antistatic release layer, the surface resistance (surface resistance after UV treatment, B) was measured by the method described above. At this time, the unit of the surface resistance was Ω / D.

[0144] (2) Measurement of Peeling Force

[0145] According to FINAT Test Method No. 1, a reference tape (TESA 7475) was attached to the antistatic release layer with a load of 2 kgf and left for 24 hours, and then peeled off under conditions of a peeling angle of 180 degrees and a peeling speed of 30 cm / minute and the peeling force was measured. At this time, the size of the sample to be measured was 100 mm in length and 25.4 mm in width, the unit of the peeling force was g / inch, and the measurement device used was AR-1000 of the U.S. chem-instrument Co., and the average of three measurements was taken.

[0146] Table 2

[0147]

[0148] In Table 2, △H shows a surface resistance change amount (log[(surface resistance after UV treatment) / (surface resistance before UV treatment)]) according to Formula 1, the unit of the surface resistance is Ω / □, and the unit of the peeling force is g / inch (based on TESA 7475 Tape peeling force).

[0149] As shown in Table 2, Examples 1 to 9 satisfying all the configurations of the present application satisfy the range of 1.1*10 5 7 Ω / □, have excellent antistatic properties, have a surface resistance change amount according to Formula 1 of 1 or less, have high ultraviolet resistance, and can maintain antistatic properties even under UV irradiation in various manufacturing processes. In addition, the peeling forces of Examples 1 to 9 satisfying all the configurations of the present application satisfy the range of the present application, and it can be seen that they have antistatic properties and excellent release properties.

[0150] On the contrary, it can be seen that the surface resistance values of Comparative Examples 1 to 4, which are different from the contents of the binder and the crosslinking agent in the present application while fixing the content of the conductive polymer to 100 parts by weight, do not satisfy the configurations defined in the present application.

[0151] More specifically, it can be seen that Comparative Example 1, in which the content of the binder is excessive, has a problem in that the peeling electrostatic voltage with the adherend is rather increased due to excessively low surface resistance, and Comparative Example 2, in which the content of the binder is insufficient, has a problem in that not only antistatic properties are reduced due to excessively high surface resistance, but also ultraviolet resistance is reduced due to excessively large surface resistance change amount (△H).

[0152] In addition, it can be seen that Comparative Example 5, in which the content of the ultraviolet absorber is excessive, has excessively high peeling force, and Comparative Example 6, in which the content of the ultraviolet absorber is insufficient, has reduced ultraviolet resistance due to excessively large surface resistance change amount (△H).

[0153] In addition, it can be seen that Comparative Example 5, in which the content of the ultraviolet absorber is excessive, has excessively high peeling force, and Comparative Example 6, in which the content of the ultraviolet absorber is insufficient, has reduced ultraviolet resistance due to excessively large surface resistance change amount (△H).

[0154] As described above, the ultraviolet-resistant antistatic release film of the present application can effectively remove the electrostatic generation rate, improve productivity by suppressing the generation of foreign substances based on dust adsorption and electrostatically caused electrical short circuits, while realizing release characteristics, can reduce the release processing procedure in post-processing, and can minimize changes in physical properties by preventing UV-based degradation, thereby protecting equipment.

[0155] ​The preferred embodiments of the present application have been described in detail above, but the scope of the present application is not limited thereto, and various modifications and improvements of the present application made by those skilled in the art using the basic concept of the present application defined in the appended claims are also within the scope of the present application.

Claims

1. An anti-ultraviolet and anti-static release film, wherein, include: Polyester substrate, and An antistatic release layer is located on at least one side of a polyester substrate and is coated using an antistatic release composition comprising a conductive polymer resin, an adhesive resin, a crosslinking agent, an ultraviolet absorber, and a silicone release agent. The change in surface resistance ΔH of the antistatic release layer before and after processing with UV light of 300 mJ or more satisfies Equation 1. Formula 1 △H=log[(Surface resistance after UV treatment) / (Surface resistance before UV treatment)]≤1.

2. The UV-resistant and antistatic release film according to claim 1, wherein, The conductive polymer resin has an average particle size of 10 nm to 90 nm, and the conductive polymer resin is an aqueous dispersion containing polyanions and polythiophene or an aqueous dispersion containing polyanions and polythiophene derivatives.

3. The anti-UV and anti-static release film according to claim 1, wherein, The adhesive resin includes at least one selected from urethane resins, polyester resins, and copolymers thereof.

4. The UV-resistant and antistatic release film according to claim 1, wherein, The crosslinking agent includes at least one crosslinking agent selected from carbodiimide, oxazoline, epoxy and melamine.

5. The UV-resistant and antistatic release film according to claim 1, wherein, The ultraviolet absorber includes at least one ultraviolet absorber selected from benzotriazole compounds and benzophenone compounds.

6. The anti-UV and anti-static release film according to claim 5, wherein, The ultraviolet absorber comprises at least one selected from 2-(2H-benzotriazol-2-yl)-4,6-bis(1-methyl-1-phenylmethyl)phenol, bis[2-hydroxy-5-tert-octyl-3-(benzotriazol-2-yl)-phenyl]methane, 2(2'-hydroxy-3,5'-di-tert-butylphenyl)benzotriazole, 2(2'-hydroxy-3'-tert-butyl-5'-methyl-phenyl)benzotriazole, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, 2,2'-4,4'-tetrahydroxybenzophenone, 2,2'-dihydroxy-4-methoxybenzophenone, and 2,2'-methylenebis[6-(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol].

7. The anti-UV and anti-static release film according to claim 1, wherein, The antistatic release composition comprises, relative to 100 parts by weight of conductive polymer resin, 150 to 400 parts by weight of adhesive resin and 200 to 600 parts by weight of crosslinking agent.

8. The UV-resistant and antistatic release film according to claim 7, wherein, The antistatic release composition contains 15 to 40 parts by weight of ultraviolet absorber relative to 100 parts by weight of adhesive resin.

9. The anti-UV and anti-static release film according to claim 1, wherein, The antistatic release composition uses water as the main solvent and contains 0.5% to 15.0% organic solvent in its total content.

10. The anti-UV and antistatic release film according to claim 1, wherein, Silicon release agents include organopolysiloxanes, organohydropolysiloxanes, and platinum chelating catalysts.

11. The UV-resistant and antistatic release film according to claim 10, wherein, Silicone release agents contain organopolysiloxanes having the structure of Formula 1 and organohydrogen polysiloxanes having the structure of Formula 2. Chemical Formula 1 In chemical formula 1, R represents -CH=CH2, -CH2-CH2-CH2-CH2-CH=CH2, and -CH3, and m and n are integers greater than or equal to 0. Chemical formula 2 In chemical formula 2, p and q are integers greater than or equal to 0.

12. The UV-resistant and antistatic release film according to claim 1, wherein, The surface resistivity of the antistatic release layer is 1.1*10⁻⁶. 5 Up to 5.5*10 7 Ω / □.

13. The UV-resistant and antistatic release film according to claim 1, wherein, After attaching TESA7475 tape, the peel force of the antistatic release layer, when peeled at a speed of 30 cm / min, was less than 25 g / inch.

14. The UV-resistant and antistatic release film according to claim 1, wherein, The polyester substrate and the antistatic release layer are processed simultaneously through an online coating process.

15. A method for preparing an anti-ultraviolet and antistatic release film, wherein, The anti-UV and anti-static release film is provided with a polyester substrate and an anti-static release layer located on at least one side of the polyester substrate. The preparation method includes: The first step is to melt and extrude polyester to prepare unstretched sheets; The second step is to stretch the unstretched sheet along its length to prepare a uniaxially stretched sheet. The third step is the preparation of an antistatic release composition, wherein the antistatic release composition comprises a conductive polymer resin, an adhesive resin, a crosslinking agent, an ultraviolet absorber, and a silicone release agent. The fourth step involves coating the antistatic release composition onto the surface of a uniaxially stretched sheet to form an antistatic release layer; and The fifth step involves biaxially stretching the film with the antistatic release layer along its width.

16. The method for preparing the anti-UV and antistatic release film according to claim 15, wherein, The change in surface resistance ΔH of the antistatic release layer before and after processing with UV light of 300 mJ or more satisfies Equation 1. Formula 1 △H=log[(Surface resistance after UV treatment) / (Surface resistance before UV treatment)]≤1.

17. The method for preparing the anti-UV and antistatic release film according to claim 15, wherein, The polyester substrate and the antistatic release layer are processed simultaneously through an online coating process.

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