Passive coupling machine

Abstract

This application relates to a passive coupling machine, comprising: a machine base equipped with a multi-axis moving module; a replacement frame disposed on the machine base; a gripping mechanism driven by the multi-axis moving module to move onto the replacement frame for picking up or placing bonding heads; and including an adjustment drive module and a material picking module, the material picking module being disposed on the output end of the adjustment drive module. The adjustment drive module drives the material picking module to move up and down, and the force applied by the adjustment drive module to the material picking module varies with the magnitude of the input current. The material picking module clamps and fixes the bonding head. According to the embodiments provided in this application, the corresponding bonding head can be replaced from the replacement frame via the material picking module. Simultaneously, by adjusting the working current applied to the adjustment drive module, the magnitude of the pressing force output by the adjustment drive module can be changed, thereby adjusting the pressing force applied to the material to ensure that the pressing and bonding requirements of materials of different specifications are met.

Description

Technical Field

[0001] This application relates to the field of automated production and processing technology of optical components, and in particular to a passive coupler. Background Technology

[0002] In the manufacturing process of components such as optical communication modules or optical coupling devices, it is usually necessary to press and attach the lens onto the PCB board to meet the corresponding processing requirements.

[0003] During the lens assembly process, a robotic arm is generally needed to pick up and move the lens to the top of the PCB board so that the lens can be pressed and bonded to the PCB board.

[0004] However, when picking up and moving lenses of different specifications, different bonding heads are required for lens adsorption. Therefore, it is generally necessary to change the bonding head according to different lenses. At the same time, the required pressing force between different lenses and the PCB board varies, thus requiring corresponding adjustments. However, the output of existing material handling devices is relatively fixed and cannot meet the requirements for rapid replacement of bonding heads, thus failing to meet the switching needs between different specifications of materials in automated production processes. Summary of the Invention

[0005] This application provides a passive coupling machine to solve the problem that the material handling device of the existing passive coupling machine cannot be adaptively adjusted according to the different specifications of the lens or PCB board or the differences of a single workstation, making it difficult to meet the needs of automated production and processing under different conditions.

[0006] This application provides a passive coupler, including:

[0007] The machine is equipped with a multi-axis moving module;

[0008] A replacement rack, set on the machine base, is used to hold the bonding head;

[0009] A gripping mechanism is mounted on the moving end of a multi-axis moving module. The multi-axis moving module drives the gripping mechanism to move onto the replacement frame to pick up or place the bonding head. The mechanism includes an adjustment drive module and a material picking module. The material picking module is mounted on the output end of the adjustment drive module. The adjustment drive module drives the material picking module to move up and down. The force applied to the material picking module by the adjustment drive module varies with the magnitude of the input current. The material picking module clamps and fixes the bonding head.

[0010] Furthermore, the adjustment drive module adopts a voice coil motor, and the material handling module is set on the output end of the voice coil motor. The voice coil motor drives the material handling module to move up and down.

[0011] Furthermore, the bonding head is provided with a through hole running vertically through it, and the adjustment drive module is provided with a negative pressure passage corresponding to the through hole. The negative pressure passage is connected to a negative pressure adsorption system through a pipe.

[0012] Furthermore, the adjustment drive module adopts a hollow shaft motor, and the negative pressure passage passes through the central shaft of the hollow shaft motor and is movably connected to the through hole of the bonding head.

[0013] Furthermore, the material picking module includes: a material picking bracket disposed outside the output end of the adjustment drive module, a plurality of telescopic mechanisms disposed on the material picking bracket, and an insert disposed on the output end of the telescopic mechanism. The outer side of the bonding head is provided with a fitting groove, and the telescopic mechanism drives the insert to extend and embed into the fitting groove.

[0014] Furthermore, the replacement frame includes a rotation drive mechanism and a turntable disposed on the output end of the rotation drive mechanism. The turntable has several slots on its side, and the fitting head is fitted into the slots so that the side wall of the slot is embedded in the fitting groove.

[0015] Furthermore, it also includes an incoming material transport area, a transition transport area, and an outgoing material transport area set on the machine platform. The front end of the incoming material transport area is connected to the outgoing material transport area of ​​the adjacent equipment, the rear end of the incoming material transport area is connected to the transition transport area, and the rear end of the transition transport area is connected to the outgoing material transport area to form a continuous transport line.

[0016] Furthermore, the incoming material transport area includes: an incoming material switching module installed on the machine base, and an incoming material transport module and a processing transport module installed on the moving end of the incoming material switching module. The incoming material switching module drives the incoming material transport module or the processing transport module to be connected to the assembly line respectively. The incoming material switching module drives the processing transport module to move below the multi-axis moving module, and the multi-axis moving module drives the gripping mechanism to move above the processing transport module.

[0017] Furthermore, the moving end of the multi-axis moving module is provided with a height detection module, a dispensing module, and a photocuring module. The detection surface of the height detection module faces the processing and transporting module, and the operating surfaces of the dispensing module and the photocuring module face the transporting surface of the processing and transporting module, respectively.

[0018] Furthermore, when the processing and transport module moves to below the multi-axis moving module under the drive of the material switching device, an optical coupling detection module is arranged on the side of the processing and transport module. The optical coupling detection module includes: a first detection module and a second detection module; the first detection module is arranged on the moving end of the multi-axis moving module, and its detection direction is towards the processing and transport module and perpendicular to the plane of the machine tool downward; the second detection module is arranged on the machine tool, and its detection direction is towards the processing and transport module and horizontal to the plane of the machine tool; the detection directions of the first detection module and the second detection module are perpendicular to each other.

[0019] The technical solutions provided in this application have the following advantages compared with the prior art:

[0020] According to the embodiments provided in this application, the corresponding bonding head can be replaced from the replacement rack via the material picking module. At the same time, by adjusting the working current applied to the adjustment drive module, the magnitude of the pressing force output by the adjustment drive module can be changed, thereby adjusting the pressing force applied to the material to ensure that the pressing and bonding requirements of materials of different specifications are met. Attached Figure Description

[0021] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0024] Figure 1 This is a schematic diagram of a passive coupler provided in an embodiment of this application.

[0025] Figure 2 This is a schematic diagram of the gripping mechanism.

[0026] Figure 3 This is a schematic diagram of the fitting head.

[0027] Figure 4 This is a structural diagram of the replacement frame.

[0028] Figure 5for Figure 4 A magnified view of a portion of point B in the middle.

[0029] Figure 6 for Figure 1 A magnified view of a portion of point A in the middle.

[0030] Explanation of reference numerals in the attached figures:

[0031] 1. Machine base; 11. Multi-axis moving module; 2. Gripping mechanism; 21. Adjustment drive module; 3. Replacement frame; 31. Bonding head; 311. Fitting groove; 312. Sealing ring; 32. Rotation drive mechanism; 33. Turntable; 34. Positioning; 4. Incoming material transport area; 41. Incoming material transport module; 42. Processing transport module; 43. Incoming material switching module; 5. Transition transport area; 51. Transition transport module; 52. Transport curing module; 6. Outgoing material transport area; 61. Outgoing material transport module; 71. Height detection module; 72. Dispensing module; 73. Photocuring module. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0033] The following disclosure provides numerous different embodiments or examples for implementing various structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0034] For ease of description, spatial relative terms may be used in the text to describe the relative position or movement of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "front," "back," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure undergoes a positional flip, orientation change, or change of motion, these directional indications will change accordingly. For instance, an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0035] To address the problem that existing passive coupling machines cannot adapt their material handling devices to different lens or PCB board specifications or variations in a single workstation, thus failing to meet the demands of automated production under various conditions, this application provides a passive coupling machine that allows for the replacement of the appropriate bonding head from a replacement rack via a material handling module. Simultaneously, by adjusting the operating current applied to the adjustment drive module, the magnitude of the pressing force output by the adjustment drive module is changed, thereby adjusting the pressing force applied to the material to ensure that the pressing and bonding requirements of materials of different specifications are met.

[0036] Please see Figure 1 , Figure 2 This application provides a passive coupler, comprising:

[0037] Machine 1 is equipped with a multi-axis moving module 11;

[0038] Replacement frame 3, set on the machine base 1, is used to place bonding head 31;

[0039] The gripping mechanism 2 is mounted on the moving end of the multi-axis moving module 11. The multi-axis moving module 11 drives the gripping mechanism 2 to move onto the replacement frame 3 to pick up or place the bonding head 31. The gripping mechanism 2 includes an adjustment drive module 21 and a material picking module. The material picking module is mounted on the output end of the adjustment drive module 21. The adjustment drive module drives the material picking module to move up and down. The force applied by the adjustment drive module 21 to the material picking module varies with the magnitude of the input current. The material picking module clamps and fixes the bonding head 31.

[0040] During operation, the lens is picked up by the gripping mechanism 2 and moved by the multi-axis moving module 11, thereby placing the lens on the corresponding bonding position on the PCB board. The adjustment drive module 21 is then activated to output a downward clamping force, thus pressing the lens firmly onto the PCB board. When picking up the lens, it is generally adsorbed by the bonding head 31 fixed in place by the material picking module, facilitating the picking and movement of the lens. In subsequent pressing operations, the bonding head 31 presses the lens firmly onto it, ensuring a tight and effective bonding between the lens and the PCB board.

[0041] In the processing of different products, the specifications and models of the lenses used vary. Therefore, the specifications of the bonding head 31 used to adsorb and press the lens should also be changed accordingly. In the embodiment provided in this application, the multi-axis moving module 11 drives the gripping mechanism 2 to move to the position of the replacement frame 3. The material picking module of the gripping mechanism 2 places the bonding head 31, which was originally clamped and fixed, onto the replacement frame 3. Then, a bonding head 31 matching the lens specifications in the current working process is picked up from the replacement frame 3. The material picking module clamps and fixes the selected bonding head 31 to facilitate the picking and moving of the corresponding lens in subsequent work, thereby realizing the corresponding lens pressing and bonding work. At the same time, when bonding different specifications of lenses to PCB boards, the pressing force will also vary depending on the specifications of the material to ensure the stability of the bonding effect. Therefore, the magnitude of the current applied to the adjustment drive module 21 can be adjusted to meet the adjustment of the output pressure of the adjustment drive module 21, effectively ensuring a stable bonding effect between the lens and the PCB board.

[0042] In some optional embodiments, the adjustment drive module 21 employs a voice coil motor, and the material handling module is located at the output end of the voice coil motor. The voice coil motor drives the material handling module to move up and down. A voice coil motor is a direct-drive motor with characteristics such as simple structure, small size, high speed, high acceleration, and fast response. Its working principle is that a current-carrying coil generates a force in a magnetic field, and the magnitude of the force is proportional to the current applied to the coil. Therefore, by adjusting the current applied to the voice coil motor, the magnitude of the pressing force applied to the headscarf by the adjustment drive module 21 can be controlled, thereby meeting the requirements for applying corresponding pressing forces to different lenses and ensuring the stability of the pressing effect between the PCB board and the lens.

[0043] In some optional embodiments, the bonding head 31 is provided with a through hole running vertically through it, and the adjustment drive module 21 is provided with a negative pressure passage corresponding to the through hole. The negative pressure passage is connected to a negative pressure adsorption system through a pipe. When the negative pressure adsorption system is activated, it generates a negative pressure airflow through the negative pressure passage and the through hole, thereby generating a negative pressure suction on the bottom surface of the bonding head 31, thus achieving negative pressure adsorption of the lens and meeting the needs of lens pickup.

[0044] In some optional embodiments, the adjustment drive module 21 employs a hollow shaft motor, and the negative pressure passage passes through the central shaft of the hollow shaft motor and is movably connected to the through hole of the bonding head 31. The output shaft of the hollow shaft motor has a hollow center, thus facilitating the passage of the negative pressure passage through the central shaft of the output shaft of the adjustment drive module 21. This allows the negative pressure passage to be connected to the through hole of the bonding head 31, enabling the generation of a negative pressure airflow within the negative pressure passage when the negative pressure adsorption system is activated. This, in turn, generates a negative pressure adsorption force on the bottom surface of the bonding head 31, thereby achieving the effect of adsorbing the lens.

[0045] Please see Figure 3 In some embodiments, a sealing ring 312 is provided on the top surface of the bonding head 31, and the sealing ring 312 is sleeved on the outside of the through hole of the bonding head 31. When the material taking module clamps and fixes the bonding head 31, the sealing ring 312 is pressed between the bottom surface of the material taking module and the bonding head 31, thereby providing an effective sealing effect. In the process of transporting negative pressure airflow through the negative pressure passage and the through hole to generate suction on the bottom surface of the bonding head 31, the sealing effect provided by the sealing ring 312 prevents the airtightness between the negative pressure passage and the through hole from being damaged, which would result in the negative pressure suction applied to the lens being less than the pressure output by the negative pressure adsorption system, affecting the stability of the negative pressure adsorption effect, and effectively ensuring the stability of the lens fixing and moving process.

[0046] In some optional embodiments, the material-grabbing module includes: a material-grabbing bracket disposed outside the output end of the adjustment drive module 21, a plurality of telescopic mechanisms disposed on the material-grabbing bracket, and an insert disposed on the output end of the telescopic mechanism. The outer side of the bonding head 31 is provided with a fitting groove 311, and the telescopic mechanism drives the insert to extend and embed into the fitting groove 311. Further, the material-grabbing bracket is disposed around the output end of the adjustment drive module 21, and the front end of the telescopic mechanism is tilted downwards, thereby ensuring the clamping and fixing of the bonding head 31 while avoiding interference or collision with the adjacent mechanisms during movement, thus guaranteeing safety during movement. When it is necessary to clamp and fix the bonding head 31, the telescopic mechanism drives the insert to extend, causing the insert to embed into the fitting groove 311. Since multiple sets of telescopic mechanisms are arranged around the output end of the adjustment drive module 21, the inserts of the multiple sets of telescopic mechanisms clamp and fix the bonding head 31 from multiple directions, thereby effectively achieving stable clamping and fixing of the bonding head 31.

[0047] In some embodiments, the fitting groove 311 adopts an intermittent structure, with each segment of the fitting groove 311 corresponding to a set of telescopic mechanisms. The telescopic mechanisms then embed the insert into the fitting groove 311, allowing the material handling module to clamp and fix the bonding head 31. Simultaneously, because the position of the fitting groove 311 is fixed, it effectively ensures that the bonding head 31 will not rotate after being clamped and fixed by the material handling module. This effectively ensures that the lens will not rotate during the adsorption, movement, and pressing and fixing process using the bonding head 31, thus guaranteeing the stability of the assembly effect between the lens and the PCB board.

[0048] In some embodiments, the fitting groove 311 adopts a continuous annular groove structure, so that when the bonding head 31 is clamped and fixed by the material picking module, the relative position requirement between the insert and the bonding head 31 is not high, and the insert of the material picking module can be embedded into the fitting groove 311 at any angle to meet the requirement of clamping and fixing the bonding head 31.

[0049] Please see Figure 4 , Figure 5In some optional embodiments, the replacement frame 3 includes a rotation drive mechanism 32 and a turntable 33 disposed on the output end of the rotation drive mechanism 32. The turntable 33 has several locking slots 34 on its side. The fitting head 31 is fitted into the locking slots 34, with the sidewall of the locking slot 34 embedded in the fitting groove 311. In some embodiments, the locking slot 34 has a U-shaped structure, allowing the main body of the fitting head 31 to enter the locking slot 34 from the opening of the U-shaped structure and engage with the U-shaped structure of the locking slot 34. Simultaneously, the sidewall of the locking slot 34 is embedded in the fitting groove 311, thereby fixing the fitting head 31 in the locking slot 34 through the mutual engagement between the locking slot 34 and the fitting head 31. This configuration allows the bonding head 31 to be stored on the turntable 33, so that the turntable 33 can be driven to rotate by the rotation drive mechanism 32. This facilitates the movement of the corresponding bonding head 31 to the corresponding pick-up and place position of the material picking module according to the requirements of the processing procedure, making it convenient for the material picking module to pick up or place the bonding head 31. This enables the bonding head 31 to be quickly replaced according to different lens sizes.

[0050] When the multi-axis moving module 11 moves the gripping mechanism 2 to the side of the replacement frame 3, and it is necessary to place the bonding head 31 that has been clamped and fixed on the material picking module on the replacement frame 3, the rotation drive mechanism 32 drives the turntable 33 to rotate, so that the unloaded slot 34 on the turntable 33 moves to a position close to the material picking module, so that the material picking module can embed the bonding head 31 into the slot 34.

[0051] When the multi-axis moving module 11 moves the gripping mechanism 2 to the side of the replacement frame 3 so as to pick up the corresponding bonding head 31 from the replacement frame 3 through the material picking module, the rotation drive mechanism 32 drives the turntable 33 to rotate, so that the slot 34 on the turntable 33 where the corresponding bonding head 31 is placed moves to a position close to the material picking module, so that the material picking module can pick up the bonding head 31 that matches the specifications and dimensions of the lens from the turntable 33.

[0052] Please see Figure 1In some optional embodiments, this application further includes an incoming material transport area 4, a transition transport area 5, and an outgoing material transport area 6 disposed on the machine 1. The front end of the incoming material transport area 4 is connected to the outgoing material transport area 6 of the adjacent equipment, the rear end of the incoming material transport area 4 is connected to the transition transport area 5, and the connection between the rear end of the transition transport area 5 and the outgoing material transport area 6 forms a continuous transport line. In the prior art, in order to improve the overall processing efficiency, similar types of equipment are generally set up in parallel to meet the need to send materials to multiple similar types of equipment for synchronous processing. However, the control logic of this parallel setting method is relatively complex and occupies too much factory space. In the embodiment provided in this application, the incoming material transport area 4 is connected to the outgoing material transport area 6 of the previous group of equipment to form a continuous transport line. When processing is required by the current equipment, the material is sent to the multi-axis moving module 11 through the incoming material transport area 4 so that the lens can be moved to the PCB board in the incoming material transport area 4 by the gripping mechanism 2 to achieve the pressing and bonding work between the lens and the PCB board.

[0053] In some optional embodiments, the incoming material transport area 4 includes: an incoming material switching module 43 disposed on the machine 1, and an incoming material transport module 41 and a processing transport module 42 disposed on the moving end of the incoming material switching module 43. The incoming material switching module 43 drives the incoming material transport module 41 or the processing transport module 42 to be connected to the assembly line respectively. The incoming material switching module 43 drives the processing transport module 42 to move below the multi-axis moving module 11. The multi-axis moving module 11 drives the gripping mechanism 2 to move above the processing transport module 42.

[0054] During operation, similar types of equipment are connected in series, so that the discharge transport area 6 of the previous set of equipment connects with the incoming transport area 4 of the next set of equipment, thus forming a complete assembly line. During operation, the PCBs to be bonded are placed in a tray and transported along the assembly line. When there is no PCB to be bonded on the processing transport module 42 of the passive coupler, i.e., the passive coupler is not in processing mode, the processing transport module 42 is moved in the incoming transport area 4 to a position where it is integrated into the assembly line. When the conveyor line transports pallets containing PCB boards, the pallets sent from the discharge transport area 6 of the previous passive coupler move to the processing transport module 42. Driven by the incoming material switching module 43, the processing transport module 42 moves below the multi-axis moving module 11, allowing the multi-axis moving module 11 to drive the gripping mechanism 2, which picks up the lens, to move above the processing transport module 42. The lens is then placed on the corresponding bonding position on the PCB board, thus pressing and bonding the lens to the PCB board, completing the corresponding processing step. Simultaneously, the incoming material transport module 41, driven by the incoming material switching module 43, moves to a position where it merges into the conveyor line. At this time, since the PCB board on the processing and transportation module 42 is undergoing the corresponding lens pressing and bonding work, the material transportation module 41 connects the discharge transportation area 6 of the previous passive coupling machine with the transition transportation area of ​​this passive coupling machine, so that the tray containing the PCB board sent by the previous passive coupling machine is directly sent to the next passive coupling machine, avoiding the situation of stopping and waiting for transportation, so as to ensure the continuous operation of transportation and processing.

[0055] Through the above structure, rapid switching between processing and transport states can be achieved with simple control logic. Specifically, when the processing transport module 42 is located under the multi-axis moving module 11 for pressing and bonding the lens to the PCB board, the incoming material transport module 41 directly transports the tray containing the PCB board from the previous passive coupler to the next passive coupler. When the processing transport module 42 is integrated into the assembly line, the incoming material switching module 43 moves the tray containing the PCB board to be processed from the processing transport module 42 to below the multi-axis moving module 11, so that the gripping mechanism 2 can move and press the lens onto the PCB board. In the above control logic, the switching between the processing transport module 42 and the incoming material transport module 41 in the incoming material transport area 4 only needs to consider the current working state of the passive coupler, which effectively simplifies the control scheme, quickly achieves the switching effect, and improves the corresponding control and switching efficiency.

[0056] In some optional embodiments, the material receiving module 43 employs a dual-motion linear module, which includes two independent sets of moving ends. The material receiving module 41 and the processing transport module 42 are respectively disposed on different moving ends of the dual-motion linear module. The two sets of moving ends of the dual-motion linear module are independent of each other, allowing for independent control of the two sets of moving ends on the same linear module, thereby driving the material receiving module 41 and the processing transport module 42, which are connected to a single moving end, to perform corresponding movements. That is, by setting up a dual-motion linear module, the material receiving module 41 and the processing transport module 42 can be driven and controlled separately, thereby effectively adjusting the travel distance of the material receiving module 41 and the processing transport module 42.

[0057] In some optional embodiments, the transition transport area 5 is provided with a transition transport module 51. The front end of the transition transport module 51 is connected to the incoming material transport module 41 or the processing transport module 42, and the rear end of the transition transport module 51 is connected to the outgoing material transport area 6. After the pallet is transported to the transition transport module 51 by the incoming material transport module 41 or the processing transport module 42, the pallet is transported by the transition transport module 51 to facilitate the delivery of the pallet to the outgoing material transport area 6 for the corresponding unloading operation.

[0058] In some optional embodiments, the discharge transport area 6 is equipped with a discharge transport module 61. The front end of the discharge transport module 61 is connected to the transition transport area 5, and the rear end of the discharge transport module 61 is connected to the incoming transport module 41 or the processing transport module 42 of the adjacent incoming transport area 4. When a pallet containing PCB boards is delivered from the transition transport area 5 to the discharge transport area 6, the pallet containing PCB boards is transferred to the discharge transport module 61. The discharge transport module 61 continues to transport the pallet, thereby enabling the PCB boards to be processed to be sent to the passive coupling machine at the rear end for lens and PCB board pressing and bonding work, or the PCB boards with lenses bonded are sent to the equipment of the next process, thus meeting the material transportation needs.

[0059] Please see Figure 5 , Figure 6 In some optional embodiments, the moving end of the multi-axis moving module 11 is provided with a height detection module 71, a dispensing module 72 and a photocuring module 73. The detection surface of the height detection module 71 faces the processing and transporting module 42, and the operating surfaces of the dispensing module 72 and the photocuring module 73 face the transporting surface of the processing and transporting module 42, respectively.

[0060] When the processing and transport module 42 moves the tray containing the PCB boards to be bonded to below the multi-axis moving module 11, the height detection module 71 identifies and detects the height status of each bonding surface on the PCB board and transmits the detected data back to the control system. After receiving the data, the control system calculates the height difference of each bonding surface on the PCB board and controls and adjusts the output state of the adjustment drive module 21. In this way, when pressing and assembling each group of PCB boards and lenses, it can ensure that the final output pressing force and pressing depth on the lens and PCB board are kept within a consistent range. This effectively avoids deviations in pressing force caused by issues such as the thickness, height, or flatness of the PCB board, which could lead to unstable bonding effects or material damage, thus ensuring the overall production yield of the product.

[0061] Adhesive is applied to the PCB board via the dispensing module 72, thus applying the adhesive to the bonding area of ​​the PCB board. When the multi-axis moving module 11 moves the picking module containing the lens to the corresponding position on the PCB board to place the lens on the PCB board, the adhesive applied to the PCB board bonds and fixes the lens to the PCB board. At the same time, the downward pressure generated by the drive module 21 is adjusted to press the lens firmly against the PCB board, thereby improving the adhesion and fixing effect of the adhesive between the lens and the PCB board.

[0062] After the dispensing module 72 dispenses adhesive and the adjustment drive module 21 presses and bonds the lens to the PCB board, the photocuring module 73 is activated. The UV light emitted by the photocuring module 73 irradiates the adhesive between the lens and the PCB board, thereby accelerating the curing efficiency of the adhesive and achieving rapid bonding between the lens and the PCB board. This avoids problems such as lens displacement caused by the adhesive not being fixed between the lens and the PCB board during movement, ensuring product yield.

[0063] A transport curing module 52 is provided above the transition transport module 51. The transport curing module 52 emits UV light toward the transport surface of the transition transport module 51, thereby further photocuring the PCB board that has been bonded and transported by the assembly line, ensuring that the bonding state between the lens and the PCB board is stable and reliable.

[0064] In some optional embodiments, when the processing and transport module 42 moves to below the multi-axis moving module 11 under the drive of the material switching device, an optical coupling detection module is provided on the side of the processing and transport module 42. The optical coupling detection module includes: a first detection module and a second detection module; the first detection module is disposed on the moving end of the multi-axis moving module 11, and its detection direction is towards the processing and transport module 42 and perpendicular to the plane of the machine base 1 downward; the second detection module is disposed on the machine base 1, and its detection direction is towards the processing and transport module 42 and horizontal to the plane of the machine base 1; the detection directions of the first detection module and the second detection module are perpendicular to each other.

[0065] The first and second detection modules are used to detect the optical coupling effect of the lens and PCB board after bonding in the vertical direction. During the detection process, the first detection module emits light to the lens, and the second detection module judges the imaging effect of the light emitted by the first detection module. This determines whether the optical coupling effect of the lens and PCB board after bonding meets the set requirements, and thus determines whether the current bonding state of the lens and PCB board meets the bonding process requirements.

[0066] According to the embodiments provided in this application, the corresponding bonding head 31 can be replaced from the replacement frame 3 by the material picking module. At the same time, by adjusting the working current applied to the adjustment drive module 21, the magnitude of the pressing force output by the adjustment drive module 21 can be changed, thereby adjusting the pressing force applied to the material to ensure that the pressing and bonding requirements of materials of different specifications are met.

[0067] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0068] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0069] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0070] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0071] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0072] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0073] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Since these modifications and variations fall within the scope of the claims and their equivalents, this application also intends to include these modifications and variations.

[0074] The above description describes specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A passive coupler, characterized in that, include: The machine is equipped with a multi-axis moving module; A replacement rack, set on the machine base, is used to hold the bonding head; A gripping mechanism is mounted on the moving end of a multi-axis moving module. The multi-axis moving module drives the gripping mechanism to move onto the replacement frame to pick up or place the bonding head. The gripping mechanism includes an adjustment drive module and a material picking module. The material picking module is mounted on the output end of the adjustment drive module. The adjustment drive module drives the material picking module to move up and down. The force applied by the adjustment drive module to the material picking module varies with the magnitude of the input current. The material picking module clamps and fixes the bonding head. The material picking module includes: a material picking bracket disposed outside the output end of the adjustment drive module, a plurality of telescopic mechanisms disposed on the material picking bracket, and an insert disposed on the output end of the telescopic mechanism. The outer side of the bonding head is provided with a fitting groove, and the telescopic mechanism drives the insert to extend and embed into the fitting groove. It also includes an incoming material transport area, a transition transport area and an outgoing material transport area set on the machine platform. The front end of the incoming material transport area is connected to the outgoing material transport area of ​​the adjacent equipment, the rear end of the incoming material transport area is connected to the transition transport area, and the connection between the rear end of the transition transport area and the outgoing material transport area forms a continuous transport line. The incoming material transport area includes: an incoming material switching module set on the machine base, and an incoming material transport module and a processing transport module set on the moving end of the incoming material switching module. The incoming material switching module drives the incoming material transport module or the processing transport module to be connected to the assembly line respectively. The incoming material switching module drives the processing transport module to move below the multi-axis moving module. The multi-axis moving module drives the gripping mechanism to move above the processing transport module. When the processing and transport module moves to below the multi-axis moving module under the drive of the material switching device, an optical coupling detection module is arranged on the side of the processing and transport module. The optical coupling detection module includes: a first detection module and a second detection module; the first detection module is arranged on the moving end of the multi-axis moving module, and its detection direction is towards the processing and transport module and perpendicular to the plane of the machine tool downward; the second detection module is arranged on the machine tool, and its detection direction is towards the processing and transport module and horizontal to the plane of the machine tool; the detection directions of the first detection module and the second detection module are perpendicular to each other.

2. The passive coupler according to claim 1, characterized in that, The adjustment drive module uses a voice coil motor, and the material handling module is located on the output end of the voice coil motor. The voice coil motor drives the material handling module to move up and down.

3. The passive coupler according to claim 1 or 2, characterized in that, The bonding head is provided with a through hole running vertically through it, and the adjustment drive module is provided with a negative pressure passage corresponding to the through hole. The negative pressure passage is connected to a negative pressure adsorption system through a pipe.

4. The passive coupler according to claim 1, characterized in that, The replacement frame includes a rotation drive mechanism and a turntable disposed on the output end of the rotation drive mechanism. The turntable has several slots on its side, and the fitting head is fitted into the slots such that the side wall of the slot is embedded in the fitting groove.

5. The passive coupler according to claim 1, characterized in that, The moving end of the multi-axis moving module is equipped with a height detection module, a dispensing module, and a photocuring module. The detection surface of the height detection module faces the processing and transporting module, and the operating surfaces of the dispensing module and the photocuring module face the transporting surface of the processing and transporting module, respectively.

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