Exhaust gas cooling and recovery device

Abstract

The application provides a waste gas cooling and recycling device, which comprises a shell, a cover plate and a cooling assembly; a cold flow baffle and a first liquid outlet structure; the liquid flow channel is formed between the cold flow baffle and the shell and connects the first cavity and the second cavity; the first liquid outlet structure is used for discharging the first cooling liquid in the liquid storage cavity to flow along the first surface of the cold flow baffle; the shell comprises a first side wall which is arranged opposite to the first surface of the cold flow baffle, and an air inlet is formed in the first side wall; the cold flow baffle is partially immersed in the second cooling liquid in the cooling cavity and is configured with at least one group of first through structures which connect the first cavity and the second cavity; and the part of the cold flow baffle which is not immersed in the second cooling liquid is configured with at least one group of second through structures which connect the first cavity and the second cavity. The waste gas cooling and recycling device disclosed by the application solves the problems of the decrease of the cooling efficiency and the poor gas-liquid separation effect caused by the fluctuation of the liquid level of the cooling liquid.

Description

Technical Field

[0001] This invention relates to the field of semiconductor equipment technology, and in particular to a waste gas cooling and recovery device. Background Technology

[0002] After processes such as Chemical Mechanical Polishing (CMP), etching, and photolithography, various contaminants such as abrasive particles, metallic impurities, organic pollutants, and oxide residues remain on the substrate surface. To improve the cleaning efficiency of these contaminants, heated cleaning solutions are typically used to clean the substrate. Heated solutions enhance chemical activity, more efficiently decomposing and peeling off stubborn contaminants from the substrate surface, significantly improving the cleaning effect.

[0003] Within the cleaning system, the cleaning solution is heated to a certain temperature, causing it to evaporate rapidly during the cleaning process. This results in the generation of a large amount of vapor containing the cleaning solution components, which is discharged along with the system's exhaust gas, forming an exhaust gas flow containing high humidity. This gas flow is then processed by a gas-liquid separator. The start-up and shutdown of the heating process, along with temperature adjustments, leads to unstable vapor generation, causing fluctuations in the exhaust gas pressure and resulting in continuous changes in the airflow state entering the gas-liquid separator.

[0004] Chinese invention patent application CN117954348A discloses a substrate processing apparatus, a polishing apparatus, and a substrate processing method. The substrate processing apparatus includes: a processing module for processing a substrate using a liquid; and a gas-liquid separation tank connected to the exhaust outlet of the processing module to separate the liquid from the exhaust gas received from the processing module and release the exhaust gas to an exhaust duct. The gas-liquid separation tank has: a tank body; a heat exchanger disposed within the tank body for cooling the exhaust gas; and an air nozzle disposed within the tank body for supplying air to cool the exhaust gas.

[0005] However, in actual operation, fluctuations in exhaust gas pressure (especially excessive pressure) in the aforementioned prior art substrate processing apparatus can cause airflow impact, leading to fluctuations in the coolant surface within the gas-liquid separation tank. This disrupts the stable contact between the gas and the coolant, reducing the uniformity of heat exchange and ultimately resulting in decreased cooling efficiency and poor gas-liquid separation. Furthermore, the high-speed airflow impacting the fluctuating liquid surface further exacerbates the irregular undulations. These undulating liquid surfaces impact the tank sidewalls, baffles, and other components with high kinetic energy, causing significant operating noise.

[0006] It should be noted that the above description of the background technology is only for the purpose of providing a clear and complete explanation of the technical solutions of the present invention and facilitating understanding by those skilled in the art. It should not be assumed that the above technical solutions are known to those skilled in the art simply because they have been described in the background section of the present invention. Summary of the Invention

[0007] The purpose of this invention is to disclose a waste gas cooling and recovery device that solves the problems of reduced cooling efficiency and poor gas-liquid separation effect caused by fluctuations in the coolant level in the prior art.

[0008] To achieve the above objectives, the present invention provides a waste gas cooling and recovery device, comprising: a housing having an air inlet and an air outlet, a cover plate formed on the top of the housing and together with the housing forming a cooling cavity, and a cooling assembly;

[0009] The cooling assembly includes: a cold flow baffle disposed in the cooling cavity and dividing the cooling cavity into a first cavity and a second cavity, a liquid storage cavity formed inside the cold flow baffle, and a first liquid outlet structure communicating with the liquid storage cavity;

[0010] The cold flow baffle is sealed to the cover plate and the housing respectively, and a liquid flow channel connecting the first cavity and the second cavity is formed between the cold flow baffle and the housing;

[0011] The first liquid outlet structure is used to discharge the first coolant in the liquid storage chamber to flow along the first surface of the cold flow baffle; the housing includes a first sidewall disposed opposite to the first surface of the cold flow baffle, and the air inlet is formed in the first sidewall;

[0012] The portion of the cold flow baffle is immersed in the second coolant in the cooling cavity and is constructed with at least one first through structure connecting the first cavity and the second cavity. The portion of the cold flow baffle not immersed in the second coolant is constructed with at least one second through structure connecting the first cavity and the second cavity.

[0013] As a further improvement of the present invention, the bottom of the first liquid outlet structure is configured as a guide surface extending obliquely downward from the liquid storage cavity to the first surface to guide the first coolant to flow along the first surface; the lowermost end of the guide surface is higher than the height of the air inlet.

[0014] As a further improvement of the present invention, the size of the inlet formed by the first liquid outlet structure communicating with the liquid storage cavity is smaller than the size of the outlet formed by the first liquid outlet structure connecting with the first surface.

[0015] As a further improvement of the present invention, the cold flow baffle is constructed with a plurality of guide grooves recessed in the first surface and continuously arranged along its width direction; the guide grooves extend along the height direction of the cold flow baffle, one end of the guide groove along its extension direction is connected to the liquid outlet of the first liquid outlet structure, and the other end extends at least to the liquid surface of the second coolant.

[0016] As a further improvement of the present invention, the first through structure and the second through structure are distributed in multiple sets at intervals along the height direction of the cold flow baffle.

[0017] Both the first through structure and the second through structure can be configured as a plurality of first liquid outlet holes spaced apart along the width direction of the cold flow baffle or a first elongated groove that runs through the width direction of the cold flow baffle.

[0018] As a further improvement of the present invention, the waste gas cooling and recovery device further includes: a baffle plate disposed at the bottom of the cooling chamber and immersed in the second coolant, the baffle plate being arranged along the width direction of the cold flow baffle, and the bottom of the baffle plate being constructed with a plurality of flow channels.

[0019] As a further improvement of the present invention, the cold flow baffle is integrally formed with the cover plate, and the cover plate is configured to have an injection port communicating with the liquid storage chamber.

[0020] As a further improvement of the present invention, the cooling assembly further includes: a cold source device that connects to the injection port for injecting a first coolant into the liquid storage chamber;

[0021] The exhaust gas cooling and recovery device also includes a liquid level sensor disposed in the cooling chamber for monitoring the second coolant.

[0022] The housing is configured with an overflow port for the discharge of the second coolant.

[0023] As a further improvement of the present invention, the cooling assembly further includes: a second liquid outlet structure formed inside the cold flow baffle and communicating with the liquid storage chamber; the second liquid outlet structure is used to discharge the first coolant in the liquid storage chamber and flow along a second surface disposed opposite to the first surface.

[0024] As a further improvement of the present invention, both the first liquid outlet structure and the second liquid outlet structure can be configured as a plurality of second liquid outlet through holes spaced apart along the width direction of the cold flow baffle or a second elongated groove that extends through the width direction of the cold flow baffle.

[0025] Compared with the prior art, the beneficial effects of the present invention are as follows: When the exhaust gas pressure increases, the high-speed exhaust gas flow first contacts the first surface of the cold flow baffle. The liquid film formed by the first coolant on the first surface disperses some of the impact kinetic energy of the high-speed airflow, weakening the impact force of subsequent airflow on the surface of the second coolant. Simultaneously, the liquid film and the first surface continuously cool the exhaust gas in the first cavity through heat exchange, and the liquid film also removes heat from the cold flow baffle. Furthermore, the submerged portion of the cold flow baffle in the second coolant is simultaneously cooled by the second coolant. This dual cooling by the liquid film and the second coolant maintains the cold flow baffle at a stable low temperature, ensuring efficient cooling of the exhaust gas as it passes through the liquid film and contacts the first surface, avoiding the problem of temperature rise and reduced heat exchange efficiency caused by prolonged contact with high-temperature exhaust gas. The partial submersion of the cold flow baffle in the second coolant directly blocks the conduction of undulating liquid flow from the first cavity to the second cavity, preventing the undulations of the liquid surface in the first cavity from spreading throughout the entire cooling cavity and preventing large-scale fluctuations in the liquid surface within the cooling cavity. The first through-flow structure directly provides a flow path for the turbulent liquid flow, guiding it from the first chamber to the second chamber. This prevents the accumulation of disturbance kinetic energy within the first chamber, which could cause large-scale fluctuations in the liquid surface, thus maintaining a stable liquid surface in the first chamber. This stable liquid surface ensures a uniform and continuous stable contact between the exhaust gas and the second coolant, improving the uniformity of heat exchange and gas-liquid separation, and preventing operational noise caused by the undulating liquid surface impacting the tank components. Attached Figure Description

[0026] Figure 1 This is an overall schematic diagram of the waste gas cooling and recovery device disclosed in this invention;

[0027] Figure 2 This is a sectional view showing the connection between the shell, cover plate, and cold flow baffle.

[0028] Figure 3 A cross-sectional view showing the connection between the shell, cover plate, and cold flow baffle from another perspective;

[0029] Figure 4 This is a sectional view showing the connection between the shell and the cover plate.

[0030] Figure 5 A schematic diagram showing a flow channel configured on the first surface, wherein the first liquid outlet structure can be configured as a first second elongated channel;

[0031] Figure 6 Cross-sectional view of the first and second liquid outlet structures formed by the cold flow baffle;

[0032] Figure 7 A cross-sectional view of the flow guide channel formed by the cold flow baffle;

[0033] Figure 8 Schematic diagram in which the first through-structure is configured as the first first elongated groove, and the second through-structure is configured as the second first elongated groove. Detailed implementation modes

[0034] The present invention will be described in detail below in conjunction with the implementation modes shown in the drawings. However, it should be noted that these implementation modes are not limitations on the present invention, and equivalent transformations or substitutions in terms of functions, methods, or structures made by those of ordinary skill in the art based on these implementation modes all fall within the protection scope of the present invention.

[0035] The drawings in the present invention are not strictly drawn according to the actual proportions, and the specific dimensions of each structure can be determined according to actual needs. The drawings described in the present invention are only schematic diagrams of the structures. The lines shown in the attached drawings of the specification of the present invention can be understood as components having a certain actual thickness.

[0036] Please refer Figures 1 to 8 A specific implementation mode of an exhaust gas cooling and recovery device disclosed.

[0037] Refer Figures 1 to 4 As shown, in this implementation mode, the exhaust gas cooling and recovery device 100 includes: a housing 10 provided with an air inlet 11 and an air outlet 12, a cover plate 20 formed on the top of the housing 10 and jointly forming a cooling cavity 13 with the housing 10, and a cooling component 30;

[0038] The cooling component 30 includes: a cold flow baffle 31 disposed in the cooling cavity 13 and separating the cooling cavity 13 to form a first cavity 1, a liquid storage cavity 32 formed inside the cold flow baffle 31, and a first liquid discharge structure 33 communicating with the liquid storage cavity 32; the cold flow baffle 31 is respectively hermetically connected to the cover plate 20 and the housing 10, and a liquid flow channel 14 communicating the first cavity 131 and the second cavity 132 is formed between the cold flow baffle 31 and the housing 10; the first liquid discharge structure 33 is used for discharging the first coolant in the liquid storage cavity 32 to flow along the first surface 311 of the cold flow baffle 31; the housing 10 includes a first side wall 101 disposed opposite to the first surface 311 of the cold flow baffle 31, and the air inlet 11 is formed on the first side wall 101; a part of the cold flow baffle 31 is immersed in the second coolant in the cooling cavity 13, and at least one group of first through-structures 34 communicating the first cavity 131 and the second cavity 132 is constructed, and at least one group of second through-structures 35 communicating the first cavity 131 and the second cavity 132 is constructed on the part of the cold flow baffle 31 not immersed in the second coolant.

[0039] In the operation of the waste gas cooling and recovery device 100 disclosed in this invention, the waste gas (i.e., a high-humidity mixed gas containing water vapor generated by the heating and volatilization of cleaning solution, mixed with residual abrasive particles, metal impurity particles, and organic or inorganic components of the cleaning solution volatilized from the substrate surface) enters the first chamber 131 through the air inlet 11 and first contacts the first surface 311 of the cold flow baffle 31. Since the first coolant in the liquid storage chamber 32 flows along the first surface 311 of the cold flow baffle 31 after being discharged through the first liquid outlet structure 33, the first coolant can form a continuously flowing liquid film (not shown) on the first surface 311. Therefore, the waste gas can achieve sufficient contact with the liquid film for preliminary cooling, and at the same time, the liquid film can also intercept and adsorb impurity particles in the waste gas, thereby achieving preliminary gas-solid separation.

[0040] After initial cooling, the exhaust gas flows downwards within the first chamber 131, coming into contact with the second coolant within the first chamber 131 for further cooling. Simultaneously, the second coolant adsorbs and purifies residual impurities and pharmaceutical components in the exhaust gas.

[0041] In existing technologies, when the exhaust gas pressure of the cleaning system (not shown) increases due to operations such as starting and stopping the heating solution or adjusting the temperature, especially when the pressure is too high, the high-speed exhaust gas flow is prone to violent fluctuations in the coolant surface inside the gas-liquid separation tank during contact, which in turn disrupts the stability of the gas-liquid contact and generates impact noise. In this invention, when the exhaust gas pressure increases, the high-speed exhaust gas flow first contacts the first surface 311 of the cold flow baffle 31. The liquid film formed by the first coolant on the first surface 311 disperses some of the impact kinetic energy of the high-speed airflow, weakening the impact force of the subsequent airflow on the second coolant surface M1. At the same time, the liquid film and the first surface 311 can continuously cool the exhaust gas in the first cavity 131 through heat exchange, and the heat of the cold flow baffle 31 is discharged through the liquid film. Furthermore, the submerged portion 31a of the cold flow baffle 31 immersed in the second coolant is simultaneously cooled by the second coolant. The cold flow baffle 31 is kept at a stable low temperature by the dual cooling of the liquid film and the second coolant, which ensures that the exhaust gas is efficiently cooled when it passes through the liquid film and comes into contact with the first surface 311, and avoids the problem of temperature rise and heat exchange efficiency decay of the cold flow baffle 31 due to prolonged contact with high temperature exhaust gas.

[0042] After preliminary treatment by the liquid film and the first surface 311, the exhaust gas flows downwards, impacting the surface M1 of the second coolant in the first cavity 131. Due to the influence of the remaining gas flow energy, the surface M1 in the first cavity 131 will still fluctuate and form a undulating liquid flow. At this time, the cold flow baffle 31 is partially immersed in the second coolant. This immersed part 31a can directly block the undulating liquid flow in the first cavity 131 from being conducted to the second cavity 132, preventing the fluctuation of the surface M1 in the first cavity 131 from spreading to the entire cooling cavity 13, and preventing large-scale fluctuations of the surface M1 in the cooling cavity 13.

[0043] Meanwhile, the first through structure 34 formed in the aforementioned submerged portion 31a can serve as a coolant flow channel between the first cavity 131 and the second cavity 132. The fluctuations in the liquid surface M1 within the first cavity 131 caused by airflow impact create turbulent flow within the first cavity 131. The position of the first through structure 34 corresponds to the turbulent flow region above the second coolant. The first through structure 34 can directly provide a flow path for the aforementioned turbulent flow, guiding it from the first cavity 131 to the second cavity 132. This prevents the turbulent flow from accumulating disturbance kinetic energy within the first cavity 131, thus avoiding large-scale fluctuations in the liquid surface M1 and ensuring that the liquid surface M1 within the first cavity 131 remains stable. A stable liquid surface M1 ensures a uniform and continuous stable contact between the exhaust gas and the second coolant, improving the uniformity of heat exchange and gas-liquid separation, and preventing operational noise caused by the undulating liquid surface impacting the tank components.

[0044] The treated exhaust gas in the first chamber 131 enters the second chamber 132 through the second through structure 35. The exhaust gas entering the second chamber 132 comes into contact with the cold flow baffle 31 and the second coolant within the second chamber 132. The low temperature of the cold flow baffle 31 further cools the exhaust gas, while the second coolant within the second chamber 132 further removes residual fine impurities and cools the gas before it is discharged through the outlet 12. Simultaneously, the cold flow baffle 31 is sealed to the cover plate 20 and the housing 10, respectively, completely blocking the gaps between the cold flow baffle 31 and the mating surfaces of the cover plate 20 and the housing 10, preventing untreated exhaust gas from the first chamber 131 from directly entering the second chamber 132 or leaking to the outside without cooling and purification.

[0045] In some examples, both the first and second coolants can be ultrapure water or a 25% sodium hydroxide solution. Taking ultrapure water as an example, ultrapure water achieves airflow cooling through heat exchange, while also possessing the ability to dissolve small amounts of acidic vapors such as hydrogen fluoride and sulfuric acid in the waste gas and adsorbing impurities. After the ultrapure water in the storage chamber 32 is discharged through the first outlet structure 33, a continuously flowing liquid film is formed on the first surface 311 of the cold flow baffle 31. When the waste gas comes into contact with this liquid film, the liquid film traps solid impurities such as abrasive particles and metal impurity particles in the waste gas; at the same time, the ultrapure water liquid film causes the organic or inorganic liquid components in the waste gas to condense into liquid droplets in a vapor state, while water-soluble liquid components can also be directly dissolved in the liquid film. Finally, the intercepted solid impurities and the condensed and dissolved liquid components will flow into the second coolant at the bottom of the cooling chamber 13 along with the continuously flowing liquid film, achieving initial separation from the waste gas. The initially cooled exhaust gas flows downwards and comes into full contact with the ultrapure aqueous solution layer (i.e., the second coolant) at the bottom of the cooling chamber 13. The second coolant can trap residual solid impurities that were not completely intercepted by the first coolant, causing them to settle to the bottom of the cooling chamber 13 through the encapsulation and adsorption effect of the liquid layer. For residual pharmaceutical components in the exhaust gas that have not been dissolved by the first coolant, the second coolant can further absorb them through dissolution, while simultaneously achieving secondary cooling of the exhaust gas through heat exchange. In addition, by regularly replacing the second coolant through the inlet 16 and outlet 17 on the shell 10, the solubility saturation problem of the second coolant can be effectively avoided, ensuring the long-term stability of the adsorption, purification, and cooling effects of the second coolant, and preventing the accumulation of impurities from causing a decline in the adsorption, purification, and cooling effects.

[0046] It should be noted that the first and second coolants can be of the same type, or different types of coolants can be selected based on the actual composition of the exhaust gas, the treatment conditions, and the purification requirements. When using different types of coolants, it is necessary to ensure that there is no safety risk associated with mixing the two coolants; simultaneously, the physicochemical properties of the different coolants should not interfere with each other, ensuring that the interception, adsorption, condensation, separation, and initial cooling effects of the first coolant film are not weakened, and that the adsorption, purification, residual impurity sedimentation, and secondary cooling capabilities of the second coolant layer are not affected, thus ensuring that the exhaust gas cooling and recovery device 100 maintains stable and efficient exhaust gas treatment performance.

[0047] In some examples, the parameter Figure 2As shown, the bottom of the first outlet structure 33 is constructed as a guide surface 330 extending downwards at an angle from the reservoir 32 to the first surface 311, guiding the first coolant to flow along the first surface 311. By extending downwards at an angle from the reservoir 32 to the first surface 311 via the guide surface 330, the outflow direction of the first coolant can be precisely guided, forcing the first coolant to flow smoothly along the guide surface 330 towards the first surface 311 and spread downwards along the first surface 311. This avoids splashing and scattering of the first coolant when it is discharged through the first outlet structure 33, improving the utilization rate of the first coolant. Simultaneously, it prevents splashed first coolant droplets from directly impacting the second coolant surface M1, avoiding droplet impact noise.

[0048] In some examples, the lowermost point of the guide surface 330 is higher than the height of the air inlet 11 (this state is not shown). The guide surface 330 guides the first coolant above the height of the air inlet 11, so that the liquid film spread on the first surface 311 is laterally (i.e., Figure 4 The direction shown by the Y-axis is also the width direction of the cold flow baffle 31. (i.e., ...) Figure 4 The direction indicated by the Z-axis (which is also the height direction of the cold flow baffle 31) covers the exhaust gas flow section (not shown) of the inlet 11. Therefore, all exhaust gas flowing into the inlet 11 will first contact the liquid film layer for cooling and gas-solid separation, improving cooling and impurity interception efficiency. Furthermore, it increases the contact area between the liquid film and the first surface 311, improving the heat exchange efficiency of the cold flow baffle 31. It also continuously exchanges heat with the exhaust gas buffered in the first cavity 131. Since the exhaust gas entering the first cavity 131 is not quickly discharged, it repeatedly contacts the continuously renewed liquid film and the first surface 311 within the first cavity 131, thereby improving the overall cooling efficiency of the exhaust gas within the first cavity 131.

[0049] In some examples, the parameter Figure 6 As shown, the size of the inlet 334 formed by the first liquid outlet structure 33 connecting to the liquid storage chamber 32 is smaller than the size of the outlet 333 formed by the first liquid outlet structure 33 connecting to the first surface 311. When the first coolant flow rate is stable, as the first coolant flows from the inlet 334 into the outlet 333, the flow area increases, and the flow velocity of the first coolant decreases accordingly. This prevents the first coolant from forming a high-speed flow and prevents the first coolant from dripping directly into the second coolant, thus avoiding droplet impact noise. At the same time, the first coolant with a slower flow velocity can smoothly spread downwards along the first surface 311 under the inclined guidance of the guide surface 330, forming a continuous liquid film on the first surface 311 with a longitudinal height covering the exhaust gas flow section of the air inlet 11. This allows the first coolant to cover the first surface 311 without splashing, which is beneficial for the subsequent efficient heat exchange and impurity interception of the exhaust gas by the liquid film.

[0050] In some examples, the parameter Figure 2 As shown, the liquid level M2 of the first coolant in the storage chamber 32 is higher than the height of the inlet 334 of the first outlet structure 33. By maintaining the liquid level M2 of the first coolant in the storage chamber 32 above the inlet 334, the path of exhaust gas backflow into the storage chamber 32 through the first outlet structure 33 can be blocked, thus preventing exhaust gas from contaminating the first coolant in the storage chamber 32.

[0051] In some examples, the parameter Figures 5 to 7 As shown, the cold flow baffle 31 is constructed with multiple guide channels 312 recessed into the first surface 311 and continuously arranged along its width direction. The guide channels 312 extend along the height direction of the cold flow baffle 31, with one end of the guide channel 312 connected to the outlet 333 of the first liquid outlet structure 33 along its extension direction, and the other end extending at least to the surface of the second coolant. The multiple guide channels 312 are continuously and closely arranged along the width direction of the first surface 311, which allows the liquid flow from adjacent guide channels 312 to quickly connect and merge on the first surface 311 to form a liquid film, avoiding liquid flow discontinuity. Based on this, the first coolant flowing from the outlet 333 can be quickly and evenly distributed laterally to the first surface 311 through the multiple guide channels 312. Meanwhile, the guide channel 312 extends along the height of the cold flow baffle 31 to the surface of the second coolant, providing a fixed flow channel for the first coolant. This guides the first coolant to flow smoothly downwards along the guide channel 312, preventing splashing of the liquid film caused by high-speed exhaust gas impact and ensuring a continuous liquid film on the first surface 311. Furthermore, the guide channel 312, being a groove-shaped structure recessed into the first surface 311, increases the contact area between the first coolant and the cold flow baffle 31, thereby improving heat exchange efficiency. This allows the first coolant to more fully dissipate heat from the cold flow baffle 31 as it flows within the guide channel 312, enhancing the cooling efficiency of the cold flow baffle 31 for newly flowing and buffered exhaust gas in the first cavity 131. The cross-sectional shape of the guide channel 312 is preferably semi-circular.

[0052] In some examples, the first through structure 34 and the second through structure 35 are distributed in multiple sets at intervals along the height direction of the cold flow baffle 31 (not shown); the first through structure 34 and the second through structure 35 can both be configured as multiple first liquid outlet holes distributed at intervals along the width direction of the cold flow baffle 31 or a first elongated groove provided through the width direction of the cold flow baffle 31.

[0053] In some examples, the first through structure 34 is configured as a plurality of first first liquid outlet holes 341 spaced apart along the width direction of the cold flow baffle 31 (e.g. Figure 3 As shown), or the first elongated groove 342 that extends through the width of the cold flow baffle 31 (as shown). Figure 8(As shown). The present invention does not limit the specific structure of the first through structure 34. The first through structure 34 can also be configured as other equivalent structures that can realize the flow of coolant between the first cavity 131 and the second cavity 132 and play a guiding role in the turbulent flow of the liquid.

[0054] Multiple sets of first through-structures 34 are spaced apart along the height direction of the cold flow baffle 31 in the submerged portion 31a of the cold flow baffle 31 immersed in the second coolant. When the high-speed exhaust gas in the first cavity 131 impacts the surface M1 of the second coolant, the kinetic energy of the exhaust gas impact gradually decreases from top to bottom along the vertical direction of the surface M1, thus forming a gradient turbulent distribution in the second coolant. The area near the surface M1 directly bears the airflow impact, and the degree of liquid flow turbulence is the strongest. As the depth increases, the kinetic energy of the airflow impact gradually weakens, and the degree of liquid flow turbulence also decreases. By using multiple sets of first through-structures 34 spaced apart along the height direction of the cold flow baffle 31 in the submerged portion 31a, the multiple sets of first through-structures 34 can be matched with the aforementioned gradient turbulent region, wherein the first through-structure 34 near the surface M1 is responsible for guiding the strong turbulent liquid flow, while the first through-structure 34 in the middle and lower part receives the medium and weak turbulent liquid flow transmitted from it. By using multiple sets of first through-structures 34 to receive and guide turbulent liquid flows of different heights and degrees within the first cavity 131 in layers, a flow path is directly provided for the turbulent liquid flows of each height from the first cavity 131 to the second cavity 132 before the turbulent kinetic energy diffuses and superimposes to form a stronger disturbance. After the turbulent liquid flows are guided to the second cavity 132 through this path, they diffuse naturally. The turbulent kinetic energy they carry is gradually dispersed, dissipated, and eventually completely dissipated during the diffusion process, preventing continuous accumulation and formation of strong local disturbances. This avoids large-scale fluctuations in the liquid surface M1 caused by the superposition of turbulent disturbance kinetic energy and improves the overall stability of the second coolant surface M1.

[0055] In some examples, the second through structure 35 is configured as a plurality of second first liquid outlet holes 351 spaced apart along the width direction of the cold flow baffle 31 (e.g. Figure 2 and Figure 3 (as shown), or a second first elongated groove 352 (as shown) that is provided through the width of the cold flow baffle 31. Figure 8 (As shown). The present invention does not limit the specific structure of the second through structure 35, which can also be configured as other equivalent structures that can realize the flow of exhaust gas between the first cavity 131 and the second cavity 132.

[0056] Multiple sets of second through-structures 35 are spaced apart along the height direction of the cold flow baffle 31 in the submerged portion 31b of the cold flow baffle 31 that is not submerged in the second coolant, and are preferably arranged in the lower region of the cold flow baffle 31. This allows the exhaust gas in the first cavity 131, which has already undergone at least preliminary cooling and impurity interception, to enter the second cavity 132. The newly flowing high-temperature exhaust gas in the first cavity 131 does not directly enter the second through-structures 35, but first comes into contact with the first surface 311 of the cold flow baffle 31 and the liquid film on the first surface 311 to complete the initial cooling and impurity particle interception. Subsequently, the pre-treated exhaust gas flows downward and comes into contact with the surface of the second coolant in the first cavity 131 to achieve further cooling and adsorption purification. After the exhaust gas completes the above treatment process, it enters the second cavity 132 through the second through structure 35 located in the lower area of ​​the cold flow baffle 31, and comes into contact with the second coolant in the cold flow baffle 31 and the second cavity 132 again to complete the cooling and adsorption purification treatment, and finally is discharged through the exhaust port 12.

[0057] In some examples, the parameter Figures 2 to 4 As shown, the exhaust gas cooling and recovery device 100 further includes a baffle plate 40 disposed at the bottom of the cooling chamber 13 and immersed in the second coolant. The baffle plate 40 is arranged along the width direction of the cold flow baffle 31, and the bottom of the baffle plate 40 is constructed with multiple flow-through grooves 41. The baffle plate 40 can weaken the diffusion of turbulent liquid flow from the bottom of the first chamber 131 to the second chamber 132, and suppress the spread of turbulent liquid flow along the bottom of the cooling chamber 13. Furthermore, the liquid flow must pass through the flow-through grooves 41 at the bottom of the baffle plate 40. The flow-through grooves 41 can guide the liquid flow in an orderly manner, consume the disturbance kinetic energy of the liquid flow, prevent the upward transmission of turbulent kinetic energy at the bottom, and reduce the impact of bottom liquid flow disturbance on the stability of the liquid surface in the second chamber 132.

[0058] In some examples, multiple baffles 40 can be arranged along the X-axis (not shown), and the flow channels 41 of adjacent baffles 40 are staggered along the Y-axis (not shown), so that the turbulent liquid flow will change direction multiple times when flowing through multiple flow channels 41 staggered along the Y-axis, thereby consuming the kinetic energy of the turbulent liquid flow and preventing the turbulent liquid flow from forming a through-flow impact along the X-axis, so as to suppress the fluctuation of the second coolant surface M1 due to turbulent flow.

[0059] In some examples, the parameter Figure 3 and Figure 6As shown, the cold flow baffle 31 and the cover plate 20 are integrally formed, and the cover plate 20 is configured with an injection port 21 that connects to the liquid storage chamber 32. The integral formation of the cold flow baffle 31 and the cover plate 20 eliminates assembly gaps between separate components, preventing sealing hazards such as exhaust gas leakage that are prone to occur with separate structures. Furthermore, the heat conduction path of the integral structure of the cold flow baffle 31 and the cover plate 20 is more continuous, and the heat absorbed by the cold flow baffle 31 can be further dissipated through the cover plate 20, helping to maintain the low temperature state of the cold flow baffle 31.

[0060] In some examples, the sealing connection between the cold flow baffle 31 and the housing 10 can be achieved by using an elastic seal for compression. A sealing groove (not shown) is provided on the inner wall of the housing 10 corresponding to the two side walls of the cold flow baffle 31 in the width direction. An elastic seal (e.g., a fluororubber sealing strip) is embedded in the sealing groove, pressing the two side walls of the cold flow baffle 31 against the mating surface of the sealing groove. This causes the fluororubber sealing strip to deform elastically under pressure, completely filling the gap between the cold flow baffle 31 and the housing 10 to form a seal, thus blocking the gas-liquid crossflow path between the first cavity 131 and the second cavity 132. The cover plate 20 and the housing 10 can also be sealed using the same elastic seal compression method. A matching sealing groove and elastic seal are added at the mating surface of the cover plate 20 and the housing 10, and bolts are used to fasten the cover plate 20 and the housing 10 together, further ensuring the overall sealing performance of the cooling cavity 13. It should be noted that the present invention is not limited to the sealing connection method between the cold flow baffle 31 and the housing 10, and between the cover plate 20 and the housing 10, and other suitable sealing connection methods can also be selected.

[0061] In some examples, the parameter Figure 5 As shown, the cooling assembly 30 further includes: a cold source device (not shown) connected to the injection port 21 for injecting a first coolant into the storage chamber 32; the exhaust gas cooling recovery device 100 further includes a liquid level sensor (not shown) disposed within the cooling chamber 13 for monitoring a second coolant; the housing 10 is configured with an overflow port 15 for discharging the second coolant. The cover plate 20 is integrally formed with a connecting block 18, which is configured to form a mounting groove 19 connected to the cooling chamber 13 for assembling and fixing the liquid level sensor.

[0062] The first coolant, kept at a low temperature, is continuously supplied to the storage chamber 32 by a cold source device, ensuring that the first coolant in the storage chamber 32 always maintains a preset low temperature and that the cold flow baffle 31 maintains a stable and efficient heat exchange. The first coolant level M2 is always kept higher than the inlet 334 to maintain the first coolant seal on the first outlet structure 33 and prevent exhaust gas from flowing backward through the first outlet structure 33. The second coolant level data is fed back in real time by a level sensor to prevent the second coolant from overflowing from the outlet 12 due to excessively high levels, or from being too low to ensure that the immersion depth of the submerged portion 31a of the cold flow baffle 31 is insufficient, ensuring that the first through structure 34 can cover and guide turbulent liquid flows at different heights. The level sensor can also form a linkage control with the cold source device and the overflow port 15. When the liquid level is higher than a preset threshold, the overflow port 15 is triggered to drain liquid; when the liquid level is lower than the preset threshold, the cold source device is triggered to replenish liquid into the cooling chamber 13, realizing automated management of the second coolant level and periodic replacement of the second coolant. When the second coolant level is too high due to excessive replenishment of the first coolant or the accumulation of liquid droplets carried by exhaust gas, the excess second coolant can be automatically discharged through the overflow port 15 to prevent the liquid level M1 from being too high and submerging the second through structure 35, thus obstructing the flow of exhaust gas.

[0063] In some examples, the parameter Figure 6As shown, the cooling assembly 30 further includes a second liquid outlet structure 36 formed inside the cold flow baffle 31 and communicating with the liquid storage chamber 32. The second liquid outlet structure 36 is used to discharge the first coolant in the liquid storage chamber 32 and allow it to flow along the second surface 313, which is opposite to the first surface 311. The first liquid outlet structure 33 guides the first coolant to form a continuous liquid film on the first surface 311 of the cold flow baffle 31, while the second liquid outlet structure 36 simultaneously guides the first coolant to flow along the opposite second surface 313, so that both surfaces of the cold flow baffle 31 (i.e., the first surface 311 and the second surface 313) are covered by the first coolant, enabling the cold flow baffle 31 to maintain a stable low temperature and improve heat transfer efficiency. It should be noted that the first coolant coverage here is not a complete coverage of both surfaces; its specific coverage range is determined by parameters such as the cross-sectional dimensions and arrangement positions of the outlets of the first liquid outlet structure 33 and the second liquid outlet structure 36. After the exhaust gas pretreated in the first chamber 131 enters the second chamber 132 through the second through structure 35, it will come into contact with the second surface 313 of the cold flow baffle 31 for cooling. At this time, the first coolant flowing on the second surface 313 can achieve further contact cooling of the exhaust gas, while simultaneously adsorbing any remaining fine impurities, further improving the cooling and purification effect. Furthermore, the fact that both surfaces are heat-conducted by the first coolant reduces the thermal stress on the cold flow baffle 31, preventing deformation and other problems. Simultaneously, the flowing first coolant can also flush the second surface 313, reducing scale buildup caused by impurities adhering to it, thus maintaining the heat exchange performance of the cold flow baffle 31. The exhaust port 12 can be located on the sidewall of the housing 10 opposite to the second surface 313.

[0064] In some examples, both the first liquid outlet structure 33 and the second liquid outlet structure 36 can be configured as a plurality of second liquid outlet through holes spaced apart along the width direction of the cold flow baffle 31 or a second elongated groove that runs through the width direction of the cold flow baffle 31.

[0065] In some examples, the first liquid outlet structure 33 may be configured as a plurality of first second liquid outlet through holes 331 spaced apart along the width direction of the cold flow baffle 31 (e.g. Figure 4 (as shown) or the first second elongated groove 332 that extends through the width of the cold flow baffle 31 (as shown) Figure 5 (As shown). The present invention does not limit the specific structure of the first liquid outlet structure 33. It can also be configured as other equivalent structures that can achieve uniform outflow of the first coolant in the liquid storage chamber 32 and stably spread along the first surface 311 of the cold flow baffle 31 to form a continuous liquid film.

[0066] In some examples, the second liquid outlet structure 36 may be configured as a plurality of second second liquid outlet through holes (not shown) spaced apart along the width direction of the cold flow baffle 31, or as a second second elongated groove 362 extending through the width direction of the cold flow baffle 31 (e.g. Figure 8 (As shown). The present invention does not limit the specific structure of the second liquid outlet structure 36. It can also be configured as other equivalent structures that can achieve uniform outflow of the first coolant in the liquid storage chamber 32 and stably spread along the second surface 313 of the cold flow baffle 31 to form a continuous liquid film.

[0067] The detailed descriptions listed above are merely specific descriptions of feasible embodiments of the present invention, and are not intended to limit the scope of protection of the present invention. All equivalent embodiments or modifications made without departing from the spirit of the present invention should be included within the scope of protection of the present invention.

[0068] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. An exhaust gas cooling and recovery device, characterized by, The application relates to a waste gas cooling and recycling device. The device comprises a shell provided with an air inlet and an air outlet, a cover plate formed on the top of the shell and jointly forming a cooling cavity with the shell, and a cooling assembly. The cooling assembly comprises a cold flow baffle arranged in the cooling cavity and separating the cooling cavity into a first cavity and a second cavity, a liquid storage cavity formed in the cold flow baffle and a first liquid outlet structure connected with the liquid storage cavity. The cold flow baffle is sealingly connected with the cover plate and the shell, and a liquid flow channel is formed between the cold flow baffle and the shell and connected with the first cavity and the second cavity. The first liquid outlet structure is used for discharging the first cooling liquid in the liquid storage cavity to flow along the first surface of the cold flow baffle. Part of the cold flow baffle is immersed in the second cooling liquid in the cooling cavity, and at least one group of first through structures connected with the first cavity and the second cavity is formed on the cold flow baffle.

2. The exhaust cooling and recovery device of claim 1, wherein The bottom of the first liquid outlet structure is formed as a guide surface extending downwardly from the liquid storage cavity to the first surface, so as to guide the first cooling liquid to flow along the first surface.

3. The exhaust cooling and recovery device of claim 2, wherein The size of the liquid inlet formed by the first liquid outlet structure connected with the liquid storage cavity is smaller than the size of the liquid outlet formed by the first liquid outlet structure connected with the first surface.

4. The exhaust cooling and recovery device of claim 1, wherein The cold flow baffle is formed with a plurality of flow guide grooves recessed in the first surface and continuously arranged along the width direction of the first surface.

5. The exhaust cooling and recovery device of claim 1, wherein The first through structures and the second through structures are spacedly arranged in multiple groups along the height direction of the cold flow baffle. The first through structures and the second through structures can be arranged as a plurality of first liquid outlet through holes spacedly arranged along the width direction of the cold flow baffle or first long strip-shaped grooves arranged along the width direction of the cold flow baffle.

6. The exhaust cooling and recovery device of claim 1, wherein The waste gas cooling and recycling device further comprises a flow resistance plate arranged at the bottom of the cooling cavity and immersed in the second cooling liquid, the flow resistance plate is arranged along the width direction of the cold flow baffle, and the bottom of the flow resistance plate is formed with a plurality of flow-through grooves.

7. The exhaust cooling and recovery device of claim 1, wherein The cold flow baffle and the cover plate are integrally formed, and the cover plate is formed with a liquid injection port connected with the liquid storage cavity.

8. The exhaust cooling and recovery device of claim 7, wherein, The cooling assembly further comprises a cooling source device connected with the liquid injection port and used for injecting the first cooling liquid into the liquid storage cavity. The waste gas cooling and recycling device further comprises a liquid level sensor arranged in the cooling cavity and used for monitoring the second cooling liquid. The shell is formed with an overflow port used for discharging the second cooling liquid.

9. The exhaust cooling and recovery device of claim 1, wherein, The cooling assembly further comprises a second liquid outlet structure formed inside the cold airflow baffle and communicating with the liquid storage cavity, and the second liquid outlet structure is used for discharging the first cooling liquid in the liquid storage cavity and flowing along a second surface opposite to the first surface.

10. The exhaust cooling and recovery device of claim 9, wherein, The first liquid outlet structure and the second liquid outlet structure can be configured as a plurality of second liquid outlet through holes spaced apart along the width direction of the cold airflow baffle or a second long strip-shaped groove body penetratingly arranged along the width direction of the cold airflow baffle.

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