Ring topology eight-mass-block full-decoupling monolithic three-axis integrated MEMS (Micro Electro Mechanical System) gyroscope chip

Abstract

The invention relates to a three-axis gyroscope, in particular to a ring topology eight-mass-block full-decoupling monolithic three-axis integrated MEMS (Micro Electro Mechanical System) gyroscope chip which comprises a harmonic oscillator part and an electrode part, the harmonic oscillator part comprises a circular anchor block and an annular frame coaxially arranged on the outer side of the circular anchor block in a sleeving mode. Eight trapezoidal mass blocks are arranged on the outer side of the annular frame in a surrounding manner; the surfaces of the first, third, fifth and seventh trapezoidal mass blocks are respectively provided with a square hole and a rectangular hole A in a penetrating manner; the side face of each square hole is connected with four Z-shaped suspension beams, and the tail ends of the four Z-shaped suspension beams are jointly connected with a square mass block. The side surface of each rectangular hole A is connected with a double-side comb tooth beam A; a rectangular hole B is formed in the surface of each of the second, fourth, sixth and eighth trapezoidal mass blocks in a penetrating manner; the side face of each rectangular hole B is connected with a double-side comb tooth beam B. The three-axis integrated MEMS gyroscope solves the problem that an existing three-axis integrated MEMS gyroscope is low in measurement precision, and is suitable for high-precision and advanced fields such as military navigation and automatic driving.

Description

Technical Field

[0001] This invention relates to a three-axis gyroscope, specifically a ring-topology eight-mass block fully decoupled monolithic three-axis integrated MEMS gyroscope chip. Background Technology

[0002] A three-axis integrated MEMS gyroscope is a core sensing device for angular velocity measurement, capable of simultaneously measuring angular velocity input along the x, y, and z axes. It is widely used in high-precision fields such as military navigation and autonomous driving, and has extremely broad application prospects. However, in practical applications, existing three-axis integrated MEMS gyroscopes, due to their inherent structural limitations, require each detection mode to share a mass block. This prevents complete decoupling of the detection directions, resulting in large coupling errors between the detection modes and consequently low measurement accuracy. Therefore, it is necessary to invent a ring-topology eight-mass-block fully decoupled monolithic three-axis integrated MEMS gyroscope chip to solve the problem of low measurement accuracy in existing three-axis integrated MEMS gyroscopes. Summary of the Invention

[0003] To address the problem of low measurement accuracy in existing triaxial integrated MEMS gyroscopes, this invention provides a ring topology eight-mass block fully decoupled monolithic triaxial integrated MEMS gyroscope chip.

[0004] This invention is achieved using the following technical solution: A ring-topology, eight-mass block, fully decoupled monolithic three-axis integrated MEMS gyroscope chip, including a resonator part and an electrode part; The resonator part includes a circular anchor block and a ring frame coaxially sleeved on the outside of the circular anchor block. Eight U-shaped cantilever beams connect the annular frame and the circular anchor blocks; eight trapezoidal mass blocks, narrower on the inside and wider on the outside, are arranged around the outer side of the annular frame; a pair of U-shaped cantilever beams A are connected to the inner side of each trapezoidal mass block; a point anchor block A is connected to the tail end of each U-shaped cantilever beam A; a pair of U-shaped cantilever beams B are connected to the outer side of each trapezoidal mass block; a point anchor block B is connected to the tail end of each U-shaped cantilever beam B; a notch is opened on the inner side of each trapezoidal mass block; a U-shaped cantilever beam C is connected to the side of each notch; a straight cantilever beam is connected between the bottom edge of each U-shaped cantilever beam C and the annular frame. Each of the first, third, fifth, and seventh trapezoidal mass blocks has a square hole and a rectangular hole A through its surface, with the rectangular hole A located inside the square hole. Each square hole has four Z-shaped suspension beams connected to its side, and the tail ends of the four Z-shaped suspension beams are connected to a square mass block. Each rectangular hole A has a double-sided comb beam A connected to its side. Each double-sided comb beam A has a pair of single-sided comb beams A symmetrically fitted on both sides, and the pair of single-sided comb beams A and the double-sided comb beam A form a pair of comb capacitors A. Each single-sided comb beam A has a pair of point anchor blocks C connected to its two ends. The second, fourth, sixth, and eighth trapezoidal mass blocks each have a rectangular hole B through their surfaces; a double-sided comb beam B is connected to the side of each rectangular hole B; a pair of single-sided comb beams B are symmetrically fitted on both sides of each double-sided comb beam B, and the pair of single-sided comb beams B and the double-sided comb beam B form a pair of comb capacitors B; a pair of point anchor blocks D are connected to both ends of each single-sided comb beam B. The electrode portion includes a square base; The square base and the circular anchor block are coaxially arranged; the upper surface of the square base is sputtered with a circular planar electrode, eight pairs of point-shaped planar electrodes A, eight pairs of point-shaped planar electrodes B, four square planar electrodes, eight pairs of point-shaped planar electrodes C, and eight pairs of point-shaped planar electrodes D; The upper surface of the circular planar electrode is bonded to the lower surface of the circular anchor block; the upper surface of the eight pairs of point-shaped planar electrodes A is bonded to the lower surface of the eight pairs of point-shaped anchor blocks A in a one-to-one correspondence; the upper surface of the eight pairs of point-shaped planar electrodes B is bonded to the lower surface of the eight pairs of point-shaped anchor blocks B in a one-to-one correspondence; the upper surface of the four square planar electrodes and the lower surface of the four square mass blocks form four parallel capacitors in a one-to-one correspondence; the upper surface of the eight pairs of point-shaped planar electrodes C is bonded to the lower surface of the eight pairs of point-shaped anchor blocks C in a one-to-one correspondence; the upper surface of the eight pairs of point-shaped planar electrodes D is bonded to the lower surface of the eight pairs of point-shaped anchor blocks D in a one-to-one correspondence.

[0005] Furthermore, the eight square-shaped cantilever beams, eight trapezoidal mass blocks, eight pairs of U-shaped cantilever beams A, eight pairs of point anchor blocks A, eight pairs of U-shaped cantilever beams B, eight pairs of point anchor blocks B, eight U-shaped cantilever beams C, eight straight cantilever beams, sixteen Z-shaped cantilever beams, four square mass blocks, four double-sided comb beams A, four pairs of single-sided comb beams A, eight pairs of point anchor blocks C, four double-sided comb beams B, four pairs of single-sided comb beams B, eight pairs of point anchor blocks D, eight pairs of point planar electrodes A, eight pairs of point planar electrodes B, four square planar electrodes, eight pairs of point planar electrodes C, and eight pairs of point planar electrodes D are all symmetrically distributed circumferentially.

[0006] Furthermore, the resonator portion is made of silicon; the square base is made of glass or silicon.

[0007] Furthermore, the resonator and electrode components are manufactured as a single unit using MEMS fabrication technology.

[0008] Compared with existing triaxial integrated MEMS gyroscopes, the ring topology eight-mass block fully decoupled monolithic triaxial integrated MEMS gyroscope chip of this invention adopts a novel structure to simultaneously measure angular velocity input in the x, y, and z axes. Its resonator uses an independent design of eight mass blocks, which ensures that each detection mode uses only its own mass block, thereby achieving complete decoupling of each detection direction. This effectively reduces the coupling error between the detection modes and thus effectively improves the measurement accuracy.

[0009] This invention has a reasonable structure and ingenious design, which effectively solves the problem of low measurement accuracy of existing three-axis integrated MEMS gyroscopes, and is suitable for high-precision fields such as military navigation and autonomous driving. Attached Figure Description

[0010] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0011] Figure 2 yes Figure 1 A partial structural diagram.

[0012] Figure 3 This is a schematic diagram of the planar structure of the present invention.

[0013] Figure 4 yes Figure 3 Partial structural diagram Figure 1 .

[0014] Figure 5 yes Figure 3 Partial structural diagram Figure 2 .

[0015] Figure 6 yes Figure 3 Partial structural diagram Figure 3 .

[0016] In the diagram: 101-Circular anchor block, 102-Annular frame, 103-U-shaped cantilever beam, 104-Trapezoidal mass block, 105-U-shaped cantilever beam A, 106-Point anchor block A, 107-U-shaped cantilever beam B, 108-Point anchor block B, 109-U-shaped cantilever beam C, 110-Straight cantilever beam, 111-Z-shaped cantilever beam, 112-Square mass block, 113-Double-sided comb beam A, 114-Single-sided comb beam A, 115-Point anchor block C, 116-Double-sided comb beam B, 117-Single-sided comb beam B, 118-Point anchor block D, 201-Square base, 202-Circular planar electrode, 203-Point planar electrode A, 204-Point planar electrode B, 205-Square planar electrode, 206-Point planar electrode C, 207-Point planar electrode D. Detailed Implementation

[0017] A ring-topology, eight-mass block, fully decoupled monolithic three-axis integrated MEMS gyroscope chip, including a resonator part and an electrode part; The resonator part includes a circular anchor block 101 and an annular frame 102 coaxially sleeved on the outside of the circular anchor block 101; Eight U-shaped cantilever beams 103 connect the annular frame 102 and the circular anchor block 101; eight trapezoidal mass blocks 104, narrower on the inside and wider on the outside, are arranged around the outer side of the annular frame 102; a pair of U-shaped cantilever beams A105 are connected to the inner side of each trapezoidal mass block 104; a point anchor block A106 is connected to the tail end of each U-shaped cantilever beam A105; a pair of U-shaped cantilever beams B107 are connected to the outer side of each trapezoidal mass block 104; a point anchor block B108 is connected to the tail end of each U-shaped cantilever beam B107; a notch is opened on the inner side of each trapezoidal mass block 104; a U-shaped cantilever beam C109 is connected to the side of each notch; a straight cantilever beam 110 is connected between the bottom edge of each U-shaped cantilever beam C109 and the annular frame 102. Each of the first, third, fifth, and seventh trapezoidal mass blocks 104 has a square hole and a rectangular hole A through its surface, with the rectangular hole A located inside the square hole. Each square hole has four Z-shaped suspension beams 111 connected to its side, and the tail ends of the four Z-shaped suspension beams 111 are connected to a square mass block 112. Each rectangular hole A has a double-sided comb beam A113 connected to its side. Each double-sided comb beam A113 has a pair of single-sided comb beams A114 symmetrically fitted on both sides, and the pair of single-sided comb beams A114 and the double-sided comb beam A113 form a pair of comb capacitors A. Each single-sided comb beam A114 has a pair of point anchor blocks C115 connected to both ends. The second, fourth, sixth, and eighth trapezoidal mass blocks 104 each have a rectangular hole B through their surfaces; each rectangular hole B has a double-sided comb beam B116 connected to its side; each double-sided comb beam B116 has a pair of single-sided comb beams B117 symmetrically fitted on both sides, and the pair of single-sided comb beams B117 and the double-sided comb beam B116 form a pair of comb capacitors B; each single-sided comb beam B117 has a pair of point anchor blocks D118 connected to both ends. The electrode portion includes a square base 201; The square base 201 and the circular anchor block 101 are coaxially arranged; the upper surface of the square base 201 is sputtered with a circular planar electrode 202, eight pairs of point-shaped planar electrodes A203, eight pairs of point-shaped planar electrodes B204, four square planar electrodes 205, eight pairs of point-shaped planar electrodes C206, and eight pairs of point-shaped planar electrodes D207. The upper surface of the circular planar electrode 202 is bonded to the lower surface of the circular anchor block 101; the upper surface of the eight pairs of point-shaped planar electrodes A203 is bonded to the lower surface of the eight pairs of point-shaped anchor blocks A106 in a one-to-one correspondence; the upper surface of the eight pairs of point-shaped planar electrodes B204 is bonded to the lower surface of the eight pairs of point-shaped anchor blocks B108 in a one-to-one correspondence; the upper surface of the four square planar electrodes 205 and the lower surface of the four square mass blocks 112 in a one-to-one correspondence form four parallel capacitors; the upper surface of the eight pairs of point-shaped planar electrodes C206 is bonded to the lower surface of the eight pairs of point-shaped anchor blocks C115 in a one-to-one correspondence; the upper surface of the eight pairs of point-shaped planar electrodes D207 is bonded to the lower surface of the eight pairs of point-shaped anchor blocks D118 in a one-to-one correspondence.

[0018] During operation, the first square mass block 112 (i.e. Figure 1 The third square mass block 112 (located at the rear) Figure 1 The square mass block 112 located in front is used as the x-axis detection mass block. The second square mass block 112 (i.e. Figure 1 The square mass block 112 located on the right in the middle), the fourth square mass block 112 (i.e. Figure 1 The square mass block 112 located on the right is used as the y-axis detection mass block. The second trapezoidal mass block 104 (i.e. Figure 1 The trapezoidal mass block 104 located in the middle right rear), the fourth trapezoidal mass block 104 (i.e. Figure 1 The trapezoidal mass block 104 located in the middle right front), the sixth trapezoidal mass block 104 (i.e. Figure 1 The trapezoidal mass block 104 located in the middle left front), the eighth trapezoidal mass block 104 (i.e. Figure 1 The trapezoidal mass block 104 located in the middle left rear is used as the z-axis detection mass block.

[0019] All four pairs of comb-tooth capacitors A serve as driving excitation capacitors. All four pairs of comb-tooth capacitors B serve as z-axis detection response capacitors.

[0020] The first parallel capacitor (i.e.) Figure 1 The third parallel capacitor (i.e., the one located at the rear) Figure 1 The parallel capacitors located in front of the center are both used as the x-axis detection response capacitors. The second parallel capacitor (i.e. Figure 1 The fourth parallel capacitor (located on the right) Figure 1 The parallel capacitors located on the left are all used as the y-axis detection response capacitors.

[0021] The circular planar electrode 202, the eight pairs of point-shaped planar electrodes A203, the eight pairs of point-shaped planar electrodes B204, the four square planar electrodes 205, the eight pairs of point-shaped planar electrodes C206, and the eight pairs of point-shaped planar electrodes D207 are all connected to the control system via metal wires.

[0022] The specific work process is as follows: First, the control system generates a DC bias voltage signal and two drive voltage signals with the same amplitude, frequency, and opposite phase. The DC bias voltage signal is applied to the circular planar electrode 202. Simultaneously, the first drive voltage signal is applied to four drive excitation capacitors (the first comb capacitor A in the first pair of comb capacitors A, the first comb capacitor A in the third pair of comb capacitors A, the second comb capacitor A in the second pair of comb capacitors A, and the second comb capacitor A in the fourth pair of comb capacitors A). Meanwhile, the second drive voltage signal is applied to the other four drive excitation capacitors (the second comb capacitor A in the first pair of comb capacitors A, the second comb capacitor A in the third pair of comb capacitors A, the first comb capacitor A in the second pair of comb capacitors A, and the first comb capacitor A in the fourth pair of comb capacitors A). This causes the four double-sided comb beams A113 and the first trapezoidal mass block 104 (i.e., Figure 1 The third trapezoidal mass block 104 (located at the rear) Figure 1 The trapezoidal mass block 104 located on the right), the fifth trapezoidal mass block 104 (i.e. Figure 1 The trapezoidal mass block 104 located in front), the seventh trapezoidal mass block 104 (i.e. Figure 1The trapezoidal mass block 104 (located on the left), the first pair of U-shaped suspension beams A105, the third pair of U-shaped suspension beams A105, the fifth pair of U-shaped suspension beams A105, the seventh pair of U-shaped suspension beams A105, the first pair of U-shaped suspension beams B107, the third pair of U-shaped suspension beams B107, the fifth pair of U-shaped suspension beams B107, the seventh pair of U-shaped suspension beams B107, the first U-shaped suspension beam C109, the third U-shaped suspension beam C109, the fifth U-shaped suspension beam C109, the seventh U-shaped suspension beam C109, the first straight suspension beam 110, the third straight suspension beam 110, the fifth straight suspension beam 110, the seventh straight suspension beam 110, the sixteen Z-shaped suspension beams 111, and the four square mass blocks 112 undergo in-plane translational reciprocating motion under the action of electrostatic force. Driven by the first, third, fifth, and seventh straight suspension beams 110, the annular frame 102 undergoes in-plane four-wave antinode bending vibration.

[0023] When there is no angular velocity input, the following structures are used: four double-sided comb beams A113, the first trapezoidal mass block 104, the third trapezoidal mass block 104, the fifth trapezoidal mass block 104, the seventh trapezoidal mass block 104, the first pair of U-shaped suspension beams A105, the third pair of U-shaped suspension beams A105, the fifth pair of U-shaped suspension beams A105, the seventh pair of U-shaped suspension beams A105, the first pair of U-shaped suspension beams B107, the third pair of U-shaped suspension beams B107, the fifth pair of U-shaped suspension beams B107, the seventh pair of U-shaped suspension beams B107, the first U-shaped suspension beam C109, and the third U-shaped suspension beam C109. 109, the fifth U-shaped suspension beam C109, the seventh U-shaped suspension beam C109, the first straight suspension beam 110, the third straight suspension beam 110, the fifth straight suspension beam 110, the seventh straight suspension beam 110, the sixteenth Z-shaped suspension beam 111, and four square mass blocks 112 perform in-plane translational reciprocating motion in the driving mode, thereby keeping the plate spacing of the two x-axis detection response capacitors and the plate spacing of the two y-axis detection response capacitors unchanged, thus keeping the capacitance of the two x-axis detection response capacitors and the capacitance of the two y-axis detection response capacitors unchanged. Simultaneously, the annular frame 102 undergoes in-plane four-antinode bending vibration in the driving mode. The second, fourth, sixth, and eighth straight suspension beams 110 are located at the nodes of the in-plane four-antinode bending vibration, such that the second, fourth, sixth, and eighth U-shaped suspension beams C109, the second, fourth, and sixth trapezoidal mass blocks 104, and the sixth trapezoidal mass blocks 104... The eighth trapezoidal mass block 104, the second pair of U-shaped suspended beams A105, the fourth pair of U-shaped suspended beams A105, the sixth pair of U-shaped suspended beams A105, the eighth pair of U-shaped suspended beams A105, the second pair of U-shaped suspended beams B107, the fourth pair of U-shaped suspended beams B107, the sixth pair of U-shaped suspended beams B107, the eighth pair of U-shaped suspended beams B107, and the four double-sided comb beams B116 remain stationary. This keeps the plate spacing of the four pairs of z-axis detection response capacitors constant, thus keeping the capacitance of the four pairs of z-axis detection response capacitors constant. At this time, the output of the present invention is zero.

[0024] When there is an angular velocity input in the x-axis direction, the two x-axis sensing masses move out of plane under the action of Coriolis force. This causes a change in the distance between the plates of the two x-axis sensing response capacitors, thereby changing the capacitance of the two x-axis sensing response capacitors. At this time, the control system can calculate the angular velocity input in the x-axis direction by detecting the capacitance of the two x-axis sensing response capacitors.

[0025] When there is an angular velocity input in the y-axis direction, the two y-axis sensing masses move out of plane under the action of Coriolis force. This causes a change in the distance between the plates of the two y-axis sensing response capacitors, thereby changing the capacitance of the two y-axis sensing response capacitors. At this time, the control system can calculate the angular velocity input in the y-axis direction by detecting the capacitance of the two y-axis sensing response capacitors.

[0026] When an angular velocity is input along the z-axis, the annular frame 102, under the action of Coriolis force, undergoes in-plane four-antinode bending vibration in the detection mode. The second, fourth, sixth, and eighth straight suspension beams 110 are located at the antinodes of the in-plane four-antinode bending vibration. Driven by the annular frame 102, the second, fourth, sixth, and eighth straight suspension beams 110, the second U-shaped suspension beam C109, the fourth U-shaped suspension beam C109, the sixth U-shaped suspension beam C109, the eighth U-shaped suspension beam C109, the second trapezoidal mass block 104, the fourth trapezoidal mass block 104, the sixth trapezoidal mass block 104, the eighth trapezoidal mass block 104, and the second pair of U-shaped... The four pairs of U-shaped suspension beams (A105, B107, B107, B107, B107, B107, B107, B107, and B116) undergo in-plane translational reciprocating motion. This causes a change in the plate spacing of the four pairs of z-axis detection response capacitors, thereby changing their capacitance. The control system can then calculate the angular velocity input along the z-axis by detecting the capacitance of these four pairs of capacitors.

[0027] Eight square-shaped cantilever beams 103, eight trapezoidal mass blocks 104, eight pairs of U-shaped cantilever beams A105, eight pairs of point anchor blocks A106, eight pairs of U-shaped cantilever beams B107, eight pairs of point anchor blocks B108, eight U-shaped cantilever beams C109, eight straight cantilever beams 110, sixteen Z-shaped cantilever beams 111, four square mass blocks 112, four double-sided comb beams A113, four pairs of single-sided comb beams A114, eight pairs of point anchor blocks C115, four double-sided comb beams B116, four pairs of single-sided comb beams B117, eight pairs of point anchor blocks D118, eight pairs of point planar electrodes A203, eight pairs of point planar electrodes B204, four square planar electrodes 205, eight pairs of point planar electrodes C206, and eight pairs of point planar electrodes D207 are all symmetrically distributed circumferentially.

[0028] The resonator is made of silicon; the square base 201 is made of glass or silicon.

[0029] The resonator and electrode components are manufactured as a single unit using MEMS fabrication technology.

[0030] While specific embodiments of the present invention have been described above, those skilled in the art should understand that these are merely illustrative examples, and the scope of protection of the present invention is defined by the appended claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of the present invention, but all such changes and modifications fall within the scope of protection of the present invention.

Claims

1. A ring-topology eight-mass fully decoupled monolithic three-axis integrated MEMS gyroscope chip, characterized in that: The resonator part comprises a circular anchor block (101) and an annular frame (102) coaxially sleeved outside the circular anchor block (101); Eight H-shaped suspension beams (103) are connected between the annular frame (102) and the circular anchor block (101); eight inner-narrow-and-outer-wide trapezoidal mass blocks (104) are arranged around the outside of the annular frame (102); the inner side of each trapezoidal mass block (104) is connected with a pair of U-shaped suspension beams A (105); the tail end of each U-shaped suspension beam A (105) is connected with a dot-shaped anchor block A (106); the outer side of each trapezoidal mass block (104) is connected with a pair of U-shaped suspension beams B (107); the tail end of each U-shaped suspension beam B (107) is connected with a dot-shaped anchor block B (108); the inner side of each trapezoidal mass block (104) is provided with a gap; the side of each gap is connected with a U-shaped suspension beam C (109); a straight suspension beam (110) is connected between the bottom edge of each U-shaped suspension beam C (109) and the annular frame (102); The surface of the first, third, fifth and seventh trapezoidal mass blocks (104) is provided with a square hole and a rectangular hole A, and the rectangular hole A is located on the inner side of the square hole; the side of each square hole is connected with four Z-shaped suspension beams (111), and the tail ends of the four Z-shaped suspension beams (111) are connected with a square mass block (112); the side of each rectangular hole A is connected with a double-sided comb beam A (113); each double-sided comb beam A (113) is symmetrically embedded with a pair of single-sided comb beams A (114) on both sides, and the pair of single-sided comb beams A (114) and the double-sided comb beam A (113) form a pair of comb capacitors A; the two ends of each single-sided comb beam A (114) are respectively connected with a pair of dot-shaped anchor blocks C (115); The surface of the second, fourth, sixth and eighth trapezoidal mass blocks (104) is provided with a rectangular hole B; the side of each rectangular hole B is connected with a double-sided comb beam B (116); each double-sided comb beam B (116) is symmetrically embedded with a pair of single-sided comb beams B (117) on both sides, and the pair of single-sided comb beams B (117) and the double-sided comb beam B (116) form a pair of comb capacitors B; the two ends of each single-sided comb beam B (117) are respectively connected with a pair of dot-shaped anchor blocks D (118); The electrode part comprises a square base (201); The square base (201) is coaxially arranged with the circular anchor block (101); the upper surface of the square base (201) is sputtered with a circular planar electrode (202), eight pairs of dot-shaped planar electrodes A (203), eight pairs of dot-shaped planar electrodes B (204), four square planar electrodes (205), eight pairs of dot-shaped planar electrodes C (206) and eight pairs of dot-shaped planar electrodes D (207). ​ The upper surface of the circular planar electrode (202) is bonded with the lower surface of the circular anchor block (101); the upper surface of the eight pairs of point-shaped planar electrodes A (203) is bonded with the lower surface of the eight pairs of point-shaped anchor blocks A (106) one by one; the upper surface of the eight pairs of point-shaped planar electrodes B (204) is bonded with the lower surface of the eight pairs of point-shaped anchor blocks B (108) one by one; the upper surface of the four square planar electrodes (205) is one by one corresponding to the lower surface of the four square mass blocks (112) to form four parallel capacitors; the upper surface of the eight pairs of point-shaped planar electrodes C (206) is bonded with the lower surface of the eight pairs of point-shaped anchor blocks C (115) one by one; the upper surface of the eight pairs of point-shaped planar electrodes D (207) is bonded with the lower surface of the eight pairs of point-shaped anchor blocks D (118) one by one.

2. The ring topology octuple mass full-decoupled monolithic three-axis integrated MEMS gyroscope chip according to claim 1, characterized in that: The eight H-shaped suspensions (103), the eight trapezoidal mass blocks (104), the eight pairs of U-shaped suspensions A (105), the eight pairs of point-shaped anchor blocks A (106), the eight pairs of U-shaped suspensions B (107), the eight pairs of point-shaped anchor blocks B (108), the eight U-shaped suspensions C (109), the eight straight suspensions (110), the sixteen Z-shaped suspensions (111), the four square mass blocks (112), the four double-sided comb tooth beams A (113), the four pairs of single-sided comb tooth beams A (114), the eight pairs of point-shaped anchor blocks C (115), the four double-sided comb tooth beams B (116), the four pairs of single-sided comb tooth beams B (117), the eight pairs of point-shaped anchor blocks D (118), the eight pairs of point-shaped planar electrodes A (203), the eight pairs of point-shaped planar electrodes B (204), the four square planar electrodes (205), the eight pairs of point-shaped planar electrodes C (206), and the eight pairs of point-shaped planar electrodes D (207) are all distributed symmetrically in the circumferential direction.

3. The ring topology octuple-mass full-decoupled monolithic three-axis integrated MEMS gyroscope chip according to claim 1, characterized in that: The resonator part is made of silicon; and the square base (201) is made of glass or silicon.

4. The ring topology octuple-mass full-decoupled monolithic three-axis integrated MEMS gyroscope chip of claim 1, wherein: The resonator part and the electrode part are manufactured as a whole by using a MEMS processing technology. The resonator part and the electrode part are manufactured as a whole by using a MEMS processing technology.

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