Heat dissipation device and heat dissipation processing method

Abstract

The embodiment of the invention provides a heat dissipation device and a heat dissipation processing method, and relates to the technical field of terminals. The device comprises a heat dissipation unit, a processor and a power supply unit, the power supply unit is connected with the heat dissipation unit and the processor, and the heat dissipation unit is arranged on one side of the processor. The processor controls the power supply unit to supply power to the heat dissipation unit based on the first parameter, and the heat dissipation unit can form a low-temperature area based on the thermoelectric effect after being powered. In this way, the low-temperature area of the heat dissipation unit can achieve rapid cooling of the processor, and the problem that the heat dissipation time is long in the terminal heat dissipation technology is effectively solved.

Description

Technical Field

[0001] This application relates to the field of terminal technology, and in particular to a heat dissipation device and heat dissipation method. Background Technology

[0002] In modern smart terminals, when the processor load is high, the processor temperature will also rise, which will affect the terminal performance. Therefore, the heat dissipation technology of the terminal has always been one of the core challenges.

[0003] One method of heat dissipation in a terminal is based on a vapor chamber (VC). VC heat dissipation technology involves constructing a sealed cavity inside the terminal, which contains a small amount of working fluid. Heat dissipation is achieved through the phase change process of the working fluid between gas and liquid states.

[0004] Existing terminal cooling technologies suffer from long cooling times, making it difficult to achieve rapid cooling of the processor. Summary of the Invention

[0005] This application provides a heat dissipation device and a heat dissipation method, applicable to the field of terminal technology. This heat dissipation method enables rapid cooling of the terminal, preventing the processor temperature from becoming too high and affecting performance.

[0006] In a first aspect, embodiments of this application provide a heat dissipation device, including: a heat dissipation unit, a processor, and a power supply unit;

[0007] The power supply unit is connected to the heat dissipation unit and is used to supply power to the heat dissipation unit; and the power supply unit is also connected to the processor and is used to supply power to the processor.

[0008] The heat dissipation unit is located on one side of the processor and is used to dissipate heat from the processor.

[0009] The processor is used to control the power supply unit to supply power to the heat dissipation unit based on the first parameter.

[0010] The heat dissipation device can be an electronic device, or a chip or chip system within an electronic device.

[0011] In this implementation, the processor controls the power supply unit to supply power to the heat dissipation unit based on information in the first parameter, which may include, for example, the supply voltage and the supply duration. After receiving the voltage from the power supply unit, the heat dissipation unit forms a cold spot, or low-temperature region, on one side of itself based on the thermoelectric effect. Compared to uniform heat dissipation techniques, this implementation places the low-temperature cold spot of the heat dissipation unit near the processor, allowing the processor's temperature to drop rapidly and ensuring the processor's transient performance.

[0012] In one possible implementation, the heat dissipation unit is positioned between the screen of the electronic device and the processor.

[0013] In this implementation, after receiving power from the power supply unit, the heat dissipation unit forms a cold spot on one side based on the thermoelectric effect, while a thermoelectric field forms on the other side. In this implementation, the heat dissipation unit is positioned between the screen and the processor of the electronic device. This can be further understood as placing the cold spot of the heat dissipation unit between the heat dissipation unit and the processor, thereby cooling the processor through the cold spot. Simultaneously, the thermoelectric field of the heat dissipation unit is positioned between the heat dissipation unit and the screen, allowing the heat from the thermoelectric field to be conducted away through the screen of the electronic device.

[0014] In one possible implementation, the heat dissipation unit is a thermoelectric sensor, which is used to control the formation of a temperature difference between the first plane and the second plane of the thermoelectric sensor according to the power supply of the power supply unit.

[0015] In this implementation, the thermoelectric sensor controls the temperature difference between its first and second planes based on the power supply from the power supply unit. In other words, the magnitude of the temperature difference is related to the power supply voltage; the higher the voltage, the greater the temperature difference between the first and second planes. The planes described in this implementation are not strictly two-dimensional planes, but rather can be understood as a region. Furthermore, since the first plane corresponds to the cold spot of the thermoelectric sensor, and the second plane corresponds to the thermoelectric field, a larger temperature difference between the first and second planes results in a lower temperature at the cold spot, thus providing a stronger cooling effect on the processor.

[0016] In one possible implementation, the first plane is the side plane of the thermoelectric sensor closer to the processor, and the second plane is the side plane of the thermoelectric sensor closer to the screen.

[0017] The temperature of the first plane is lower than the temperature of the second plane.

[0018] In this implementation, after receiving power, the thermoelectric sensor creates a temperature difference between its first and second planes based on the thermoelectric effect, with the temperature of the first plane being lower than that of the second plane. In other words, the first plane is a low-temperature region on one side of the thermoelectric sensor, while the second plane is a high-temperature region near the thermoelectric sensor. By strategically placing the thermoelectric sensor so that its first plane is close to the processor and its second plane is close to the screen, heat from the processor can be quickly conducted to the first plane, and heat from the second plane can be conducted to the screen. This creates an efficient heat conduction path for dissipating heat from the processor, significantly reducing the cooling time compared to traditional uniform cooling methods.

[0019] In one possible implementation, thermal conductive gel is also placed between the heat dissipation unit and the processor.

[0020] In this implementation, thermally conductive gel is placed between the heat dissipation unit and the processor. Based on the gel's soft and compressible properties, it can fill the gap between the heat dissipation unit and the processor. Furthermore, the thermally conductive gel allows the processor and the thermoelectric sensor to fit tightly together, reducing thermal resistance in the heat transfer path and facilitating rapid heat transfer.

[0021] In one possible implementation, the power supply unit includes a power supply, a management unit, a first voltage conversion unit, and a second voltage conversion unit;

[0022] The power supply is connected to the thermoelectric sensor through the management unit and the first voltage conversion unit connected in sequence to supply power to the thermoelectric sensor;

[0023] The power supply is connected to the processor via a management unit and a second voltage conversion unit connected in sequence to supply power to the processor.

[0024] In this implementation, the power supply sequentially powers the thermoelectric sensor through a management unit and a first voltage conversion unit. The first voltage conversion unit can adjust the voltage according to the instructions of the management unit. For example, the first voltage conversion unit can boost the voltage to provide a higher voltage to the thermoelectric sensor, thereby lowering the temperature of the first plane of the thermoelectric sensor and enabling faster cooling of the processor.

[0025] In one possible implementation, the first parameter includes the supply voltage and the supply duration;

[0026] The first parameter is determined based on the first strategy.

[0027] This implementation specifically details two power supply parameters included in the first parameter: power supply voltage and power supply duration. In other words, under different scenarios or conditions, the processor can control the power supply to provide current based on the first parameter. This current, after passing through the management unit and the first voltage conversion unit, powers the thermoelectric sensor with the power supply voltage specified in the first parameter, and the power supply duration is the same as specified in the first parameter. For example, when the processor temperature rises rapidly or remains high, a larger power supply voltage and a longer power supply duration can be used in the first parameter. Thus, by using different power supply voltages and durations in the first parameter, more flexible heat dissipation can be achieved. Furthermore, in some cases, a smaller power supply voltage and a shorter power supply duration can be used, meeting heat dissipation requirements while saving energy.

[0028] The first parameter in this approach is determined based on a first strategy, which can be rule-based, statistical, or algorithmic, without specific limitations. For example, the first parameter can be set manually for different scenarios, or it can be set by referring to relevant historical data for different scenarios. The appropriate first strategy can be selected to determine the first parameter based on actual needs, thereby improving product development efficiency and user experience.

[0029] Secondly, this application provides a heat dissipation method for use in electronic devices. The electronic devices include a heat dissipation unit, a processor, and a power supply unit. The heat dissipation unit is located on one side of the processor.

[0030] The methods include:

[0031] In response to the launch of the first application, determine the first parameter;

[0032] The power supply unit supplies power to the heat dissipation unit based on the first parameter, so that the heat dissipation unit can dissipate heat from the processor.

[0033] In this implementation, the processor determines a first parameter when the first application of the electronic device starts, and controls the power supply unit to supply power to the heat dissipation unit based on the first parameter, so that the heat dissipation unit can cool the processor. Compared with the traditional uniform cooling method, this method adopts an active cooling method. That is, after the first application starts, when the temperature of the corresponding processor rises or reaches a high temperature, it does not passively wait for the natural heat to diffuse and transfer from the processor to the surroundings, but actively supplies power to the heat dissipation unit to create a low-temperature cold spot near the processor for cooling. This method can significantly shorten the heat dissipation time, achieve rapid heat dissipation, and keep the processor temperature within a normal range to ensure the processor's transient performance.

[0034] In one possible implementation, in response to the launch of the first application, the first parameter is determined, including:

[0035] In response to the launch of the first application, obtain the first parameter corresponding to the first application.

[0036] This implementation demonstrates that the first parameter corresponds to the first application in the electronic device. In other words, each application has its own corresponding first parameter. For example, some applications have a higher load during startup or operation, so their corresponding first parameter can include a larger supply voltage and a longer supply duration to achieve a stronger heat dissipation effect. Conversely, some applications have a lower load during startup or operation, so their corresponding first parameter can include a smaller supply voltage and a shorter supply duration, achieving heat dissipation while consuming less power.

[0037] In one possible implementation, the whitelist data records the power supply parameters corresponding to each of the multiple applications.

[0038] In response to the launch of the first application, obtain the first parameters corresponding to the first application, including:

[0039] In response to the launch of the first application, the first parameter corresponding to the first application is obtained from the whitelist data.

[0040] In this implementation, a whitelist data method is used to represent the correspondence between the first application and the first parameter. Its beneficial effects can be seen in the previous implementation method, and will not be elaborated here.

[0041] In one possible implementation, the first parameter includes a first supply voltage and a first supply duration;

[0042] The power supply unit supplies power to the heat dissipation unit based on the first parameter, including:

[0043] The control power supply unit supplies power to the heat dissipation unit according to the first power supply voltage and starts the first timer;

[0044] When the first timer reaches the first power supply duration, the control power supply unit stops supplying power to the heat dissipation unit.

[0045] In this implementation, when the first timer reaches the first power supply duration, it can be understood that the corresponding heat dissipation treatment has been completed, and the power supply can be stopped. This effectively avoids the waste of power caused by continuing to supply power after the processor temperature has been reduced.

[0046] In one possible implementation, in response to the launch of the first application, the first parameters corresponding to the first application are obtained, including:

[0047] In response to the startup of the first application, predict the load information of multiple runtime stages of the first application;

[0048] Based on the load information of multiple operating phases, the first parameter for each of the multiple operating phases is determined.

[0049] In this implementation, the load information of the first application at multiple operational stages is predicted, and then the first parameters for each operational stage are determined based on this load information. In other words, each operational stage after the first application starts has different first parameters. For example, generally, the load of the first application is high in some operational stages after startup, and decreases in later stages. Therefore, a higher supply voltage and longer supply duration can be set for the first parameters corresponding to the earlier operational stages, while a lower supply voltage and shorter supply duration can be set for the first parameters corresponding to the later operational stages. In this way, by using different first parameters for different operational stages of the first application, a more flexible heat dissipation method is achieved.

[0050] Furthermore, load prediction-based methods can initiate cooling in advance. For example, if a high load is predicted during a certain phase of application operation, a higher supply voltage can be used in advance to enhance heat dissipation. This keeps the processor temperature within a normal range, ensuring stable transient performance.

[0051] In one possible implementation, based on the load information of multiple running stages, the first parameters for each of the multiple running stages are determined, including:

[0052] Based on the load information of multiple operating phases, determine the load level of multiple operating phases; based on the correspondence between load level and power supply parameters, determine the first parameter of each of the multiple operating phases.

[0053] Alternatively, based on the load information of multiple stages and the correspondence between the load information and power supply parameters, the first parameter for each of the multiple operating stages can be determined.

[0054] The above implementation describes two methods for determining the first parameters at multiple operating stages. One method is based on load levels. For example, the load range is divided from low to high, and each load range is sequentially mapped to a first, second, or third load level, etc. The first parameters for each operating stage are then determined based on the correspondence between load levels and power supply parameters. Generally, the first parameters determined for high load levels have a larger supply voltage and a longer supply duration, while the first parameters determined for low load levels have a smaller supply voltage and a shorter supply duration. This allows for more accurate determination of the first parameters for different operating stages, further optimizing the heat dissipation process.

[0055] Another approach is to determine the first parameter for each of the multiple operating stages based on load information from multiple phases and the correspondence between load information and power supply parameters. The specific correspondence between load information and power supply parameters can take different forms, which are not limited here. For example, a linear model can be used, with load information as input and power supply parameters as output to realize the correspondence between the two. In this way, for any load size, there is a set of power supply parameters corresponding to it, enabling precise and automated adjustment of the first parameter for each operating stage and optimizing heat dissipation.

[0056] In one possible implementation, for any one of the multiple operating phases, the first parameter corresponding to the operating phase includes the second power supply voltage and the second power supply duration.

[0057] The power supply unit supplies power to the heat dissipation unit based on the first parameter, including:

[0058] The control power supply unit supplies power to the heat dissipation unit according to the second power supply voltage and starts the second timer;

[0059] When the second timer reaches the second power supply duration, the control power supply unit adjusts the power supply voltage supplied to the heat dissipation unit.

[0060] In this implementation, when the second timer reaches the second power supply duration, the heat dissipation process for the corresponding operating phase can be considered complete. If there is a next operating phase, the processor needs to control the power supply unit to adjust the power supply voltage to the heat dissipation unit to the power supply voltage for the next operating phase and start the timer for the next phase. If there is no next operating phase, the processor needs to control the power supply unit to stop supplying power to the heat dissipation unit, thus completing a full heat dissipation process. This method uses a timer to control the power supply duration of each operating phase and can be used to trigger the adjustment of the power supply voltage for each operating phase and to stop supplying power to the heat dissipation unit. This allows for flexible heat dissipation and saves power.

[0061] In one possible implementation, the second power supply duration is equal to the duration of the operation phase.

[0062] In this implementation, the second power supply duration is explicitly equal to the duration of the operation phase. This can be understood as the power supply unit continuously supplying power to the heat dissipation unit during multiple operation phases after the first application starts, thereby continuously dissipating heat and achieving a seamless and continuous heat dissipation process, which can achieve better heat dissipation effect.

[0063] Thirdly, embodiments of this application provide an electronic device including a processor and a memory, the memory for storing code instructions, and the processor for running the code instructions to perform the methods described in the second aspect or any possible implementation of the second aspect.

[0064] Fourthly, embodiments of this application provide a computer-readable storage medium storing a computer program or instructions that, when executed on a computer, cause the computer to perform the methods described in the second aspect or any possible implementation thereof.

[0065] Fifthly, embodiments of this application provide a computer program product including a computer program, which, when run on a computer, causes the computer to perform the methods described in the second aspect or any possible implementation thereof.

[0066] Sixthly, this application provides a chip or chip system including at least one processor and a communication interface, wherein the communication interface and at least one processor are interconnected via a circuit, and the at least one processor is used to run a computer program or instructions to perform the methods described in the second aspect or any possible implementation thereof. The communication interface in the chip may be an input / output interface, a pin, or a circuit, etc.

[0067] In one possible implementation, the chip or chip system described above in this application further includes at least one memory storing instructions. The memory can be an internal storage unit of the chip, such as a register or cache, or it can be a storage unit of the chip itself (e.g., read-only memory, random access memory, etc.).

[0068] It should be understood that the third to sixth aspects of this application correspond to the technical solutions of the second aspect of this application, and the beneficial effects achieved by each aspect and the corresponding feasible implementation are similar, and will not be repeated here. Attached Figure Description

[0069] Figure 1 This is a schematic diagram of the hardware structure of the terminal device provided in the embodiments of this application;

[0070] Figure 2 This is a schematic diagram of the software structure of the terminal device provided in the embodiments of this application;

[0071] Figure 3 Schematic diagram of the heat dissipation device provided in the embodiments of this application Figure 1 ;

[0072] Figure 4 Schematic diagram of the heat dissipation device provided in the embodiments of this application Figure 2 ;

[0073] Figure 5 Schematic diagram of the heat dissipation treatment method provided in the embodiments of this application Figure 1 ;

[0074] Figure 6 A schematic diagram of whitelist data for heat dissipation applications provided in this application embodiment;

[0075] Figure 7 A schematic diagram of the functional interface provided in the embodiments of this application. Figure 1 ;

[0076] Figure 8 Schematic diagram of the heat dissipation treatment method provided in the embodiments of this application Figure 2 ;

[0077] Figure 9 This is a schematic diagram of multi-stage load changes provided in an embodiment of this application;

[0078] Figure 10 Implementation illustration of load prediction provided in the embodiments of this application Figure 1 ;

[0079] Figure 11 Implementation illustration of load prediction provided in the embodiments of this application Figure 2 ;

[0080] Figure 12 A schematic diagram of the functional interface provided in the embodiments of this application. Figure 2 ;

[0081] Figure 13 This is a schematic diagram illustrating the mapping relationship between load range and load level provided in an embodiment of this application.

[0082] Figure 14 This is a schematic diagram illustrating the mapping relationship between load level and power supply parameters provided in an embodiment of this application.

[0083] Figure 15 Schematic diagram of the heat dissipation treatment method provided in the embodiments of this application Figure 3 ;

[0084] Figure 16 This is a schematic diagram illustrating the mapping relationship between load range and power supply parameters provided in an embodiment of this application.

[0085] Figure 17 Implementation illustration of load prediction provided in the embodiments of this application Figure 3 ;

[0086] Figure 18 This is a schematic diagram of the hardware structure of the electronic device provided in the embodiments of this application. Detailed Implementation

[0087] To facilitate a clear description of the technical solutions in the embodiments of this application, some terms and technologies involved in the embodiments of this application will be briefly introduced below:

[0088] 1. System-on-a-Chip (SOC)

[0089] A System-on-a-Chip (SoC) is a highly integrated microprocessor that integrates numerous components, including a central processing unit (CPU), a graphics processing unit (GPU), a memory controller, a communication module, an artificial intelligence (AI) processor, and a global positioning system (GPS) module, onto a single chip. An SoC can be installed, for example, in a terminal device.

[0090] The SOC is designed to optimize space utilization, reduce power consumption, and improve data transmission efficiency. It is a core component of modern smartphones, responsible for handling various functions such as computing, image display, network communication, and photo processing.

[0091] 2. Junction temperature

[0092] Junction temperature refers to the highest temperature reached in a PN junction or similar structural region within a semiconductor material. In integrated circuits, electrical energy is converted into heat, and the PN junction, as the primary heat-generating region, typically has a temperature higher than the chip surface temperature and package temperature. Therefore, junction temperature is an important indicator for evaluating chip operational reliability and thermal management performance.

[0093] In this application embodiment, junction temperature mainly refers to the junction temperature of the processor or SOC of the terminal device. High junction temperature may lead to performance degradation, shortened lifespan, or even functional failure of semiconductor devices. Therefore, in SOC design and application, an upper limit for junction temperature, i.e., the maximum junction temperature, is usually set to ensure that the chip can operate within a safe temperature range.

[0094] 3. Thermal conductive gel

[0095] Thermal conductive gels are typically materials with a silicone matrix mixed with various high-performance ceramic powders. These materials are designed to optimize heat dissipation in electronic devices, particularly smartphones. Thermal conductive gels offer several advantages, including:

[0096] It has good adaptability and can fill tiny gaps to ensure good thermal contact; it can reduce thermal resistance by closely fitting the surface of the heating element, thus reducing thermal resistance in the heat transfer path.

[0097] Long-term stability: Compared with traditional thermal grease, thermal gel is less prone to drying or evaporation, ensuring long-term heat dissipation and equipment lifespan.

[0098] 4. VC

[0099] A vapor chamber (VC) can also be called a heat spreader, heat sink, or heat-conducting plate. VC cooling technology is based on the principle of phase change. Inside the device, a sealed vacuum chamber is constructed, containing a small amount of working fluid. The fluid absorbs heat and rapidly evaporates into a gas, which then diffuses to the cold end of the chamber. At the cold end, the gas releases heat and condenses back into a liquid state, subsequently returning to the heat source through capillary action or gravity. This cycle repeats continuously, forming a continuous heat transfer process.

[0100] VC cooling technology is a high-efficiency, quiet cooling solution suitable for electronic devices with high heat flux density. It is used in various electronic devices with high heat dissipation requirements, including mobile phones and high-performance laptop power supplies.

[0101] 5. Thermoelectric effect

[0102] The thermoelectric effect is a voltage conversion effect that generates voltage from a temperature difference, and vice versa. Here are two specific thermoelectric effects: the Seebeck effect, which generates a voltage when there is a temperature difference across the two ends of a thermoelectric device; and the Peltier effect, which generates a temperature difference across a thermoelectric device when a voltage is applied to it.

[0103] 6. Thermoelectric sensor

[0104] A thermoelectric sensor is a thermoelectric device that utilizes the thermoelectric effect to generate electrical energy, measure temperature, and cool or heat objects. Thermoelectric sensors typically use metals or semiconductors with significant thermoelectric properties. When two different materials are combined, a voltage is generated at the contact point when there is a temperature difference between their two ends; conversely, if a voltage is actively applied, a temperature difference will be created between the two ends.

[0105] Thermoelectric sensors may have different names in different scenarios, including thermoelectric conversion chips, thermoelectric coolers, thermoelectric power generation and cooling chips, and thermoelectric conversion sensors.

[0106] 7. TEC

[0107] A thermoelectric cooler (TEC) is also a type of thermoelectric sensor, a device that utilizes the electrothermal effect of semiconductor materials to achieve heating or cooling. Specifically, the thermoelectric effect refers to the Peltier effect. The basic working principle of a TEC is that when a direct current passes through a thermocouple composed of two different types of materials, heat absorption and release occur at the junction. By changing the direction of the current, the hot and cold ends can be switched, thus achieving the function of heating or cooling.

[0108] Since the thermoelectric effect of semiconductor materials is usually more significant than that of metal materials, semiconductor thermocouples can generate a larger thermoelectric potential at the same temperature difference. Therefore, two different types of semiconductors are usually used to manufacture TECs, which can improve the sensitivity and heating / cooling efficiency of TECs. The two different types of semiconductors are usually N-type and P-type semiconductors.

[0109] 8. Shell temperature

[0110] In this embodiment, the casing temperature refers to the temperature of the terminal's outer casing or outer surface, also known as the housing temperature. The casing temperature directly relates to the terminal's thermal management capabilities; a good heat dissipation design can ensure that the phone's casing temperature remains within a safe range during high-load operation.

[0111] 9. Hotspots / Colds

[0112] In this embodiment, a hot spot refers to an area in the terminal that generates a lot of heat and has a relatively high temperature, such as the area where the processor is located; a cold spot refers to an area in the terminal that generates less heat and has a relatively low temperature, such as an area far from the processor. These can also be referred to as a hot / cold area, a hot surface / cold surface, or a hot end / cold end.

[0113] 10. Uniform heating

[0114] In this embodiment, heat equalization can also be called uniform heat dissipation. Heat equalization refers to the process of transferring heat from hot spots to cold spots, causing the temperature of the hot spots to gradually decrease. Generally, during the heat equalization process, the temperature of the originally cold spots will also increase.

[0115] 11. Active heat dissipation

[0116] In this embodiment, active cooling refers to a method of heat dissipation that is actively employed, in contrast to some traditional passive cooling technologies. For example, natural cooling can be considered a passive cooling technology; while using a fan to accelerate heat transfer and achieve faster cooling can be considered an active cooling technology.

[0117] 12. Transient

[0118] In this application embodiment, "short time" refers to the relevant state / performance parameters of the terminal within a short period of time, generally on the order of seconds or even shorter. Specifically, it can refer to the transient performance of the SOC, that is, the load situation of the SOC within a short period of time. Compared with non-transient performance, transient performance better reflects the detailed load situation of the terminal, and thus allows for relevant optimizations based on detailed load requirements.

[0119] 13. PMIC

[0120] A power management integrated circuit (PMIC) is a highly integrated electronic component designed to manage and optimize power distribution in electronic devices. PMICs include functions such as DC-DC conversion (boost / buck), linear regulation, battery charging management, power metering, load switching, power sequencing, and protection circuitry.

[0121] 14. DDR

[0122] Double data rate (DDR) memory is a form of RAM specifically designed for mobile devices. This type of memory can transfer data on both the rising and falling edges of each clock cycle, thus doubling the data transfer speed and improving data processing efficiency compared to traditional RAM.

[0123] 15. Other terms

[0124] In the embodiments of this application, terms such as "first" and "second" are used to distinguish identical or similar items with substantially the same function and purpose. For example, "first chip" and "second chip" are used only to distinguish different chips and do not limit their order of execution. Those skilled in the art will understand that terms such as "first" and "second" do not limit the quantity or execution order, and that "first" and "second" do not necessarily imply that they are different.

[0125] It should be noted that, in the embodiments of this application, the terms "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design scheme described as "exemplary" or "for example" in this application should not be construed as being more preferred or advantageous than other embodiments or design schemes. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0126] In this application embodiment, "at least one" refers to one or more, and "more than one" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can represent: a, b, c, ab, a--c, bc, or abc, where a, b, and c can be single or multiple.

[0127] 16. Electronic equipment

[0128] The electronic devices in this application embodiment may include handheld devices with heat dissipation function, vehicle-mounted devices, etc. For example, some electronic devices include: mobile phones, tablets, PDAs, laptops, mobile internet devices (MIDs), wearable devices, virtual reality (VR) devices, augmented reality (AR) devices, wireless terminals in industrial control, wireless terminals in self-driving, wireless terminals in remote medical surgery, wireless terminals in smart grids, wireless terminals in transportation safety, wireless terminals in smart cities, wireless terminals in smart homes, cellular phones, cordless phones, session initiation protocol (SIP) phones, wireless local loop (WLL) stations, personal digital assistants (PDAs), handheld devices with wireless communication capabilities, computing devices or other processing devices connected to wireless modems, in-vehicle devices, wearable devices, terminal devices in 5G networks and future communication networks, or future evolved public land mobile communication networks. Terminal devices in a network (PLMN), etc., are not limited to this in the embodiments of this application.

[0129] By way of example and not limitation, in this embodiment, the electronic device can also be a wearable device. Wearable devices, also known as wearable smart devices, are a general term for devices that utilize wearable technology to intelligently design and develop everyday wearables, such as glasses, gloves, watches, clothing, and shoes. Wearable devices are portable devices that are worn directly on the body or integrated into the user's clothing or accessories. Wearable devices are not merely hardware devices, but also achieve powerful functions through software support, data interaction, and cloud interaction. Broadly speaking, wearable smart devices include those that are feature-rich, large in size, and can achieve complete or partial functions without relying on a smartphone, such as smartwatches or smart glasses, as well as those that focus on a specific type of application function and require the use of other devices such as smartphones, such as various smart bracelets and smart jewelry for vital sign monitoring.

[0130] Furthermore, in this embodiment of the application, the electronic device can also be a terminal device in the Internet of Things (IoT) system. IoT is an important part of the future development of information technology. Its main technical feature is to connect objects to the network through communication technology, thereby realizing an intelligent network of human-machine interconnection and object-to-object interconnection.

[0131] The electronic devices in the embodiments of this application may also be referred to as: terminal equipment, user equipment (UE), mobile station (MS), mobile terminal (MT), access terminal, user unit, user station, mobile station, mobile station, remote station, remote terminal, mobile device, user terminal, terminal, wireless communication equipment, user agent, or user device, etc.

[0132] In this embodiment, the electronic device or various network devices include a hardware layer, an operating system layer running on top of the hardware layer, and an application layer running on top of the operating system layer. The hardware layer includes hardware such as a central processing unit (CPU), a memory management unit (MMU), and memory (also called main memory). The operating system can be any one or more computer operating systems that implement business processing through processes, such as Linux, Unix, Android, iOS, or Windows. The application layer includes applications such as browsers, address books, word processing software, and instant messaging software.

[0133] Based on the above introduction, the relevant technologies involved in this application will be further described in detail below.

[0134] The following uses a mobile phone as an example to illustrate the technical scenario of this application. Mobile phones have become an important part of our daily lives, serving as our information center, entertainment partner, work assistant, payment tool, and even health management device, profoundly influencing our lifestyles and social interaction patterns.

[0135] As mobile phone functions become increasingly sophisticated and usage frequency rises, components such as processors and graphics chips generate significant heat when running high-load tasks, including games, video editing, and multitasking. If this heat cannot be effectively dissipated, it will negatively impact phone performance and user experience, specifically manifesting in the following ways:

[0136] 1. Performance degradation: High temperatures will trigger the phone's thermal management system, which will automatically reduce the operating frequency of the CPU and GPU to reduce heat generation. However, this will cause applications to become less responsive, which may cause game applications to lag.

[0137] 2. Shortened battery life: Long-term high-temperature operation will accelerate battery aging, reduce its charge and discharge cycles, and thus shorten the overall usage time of the mobile phone;

[0138] 3. Hardware damage risk: In extreme cases, overheating may cause permanent damage to the internal components of the phone, such as circuit board deformation, battery swelling and other safety issues;

[0139] 4. Reduced user comfort: Holding an overheated phone is not only uncomfortable, but long-term use may also cause skin problems.

[0140] Therefore, an efficient heat dissipation design is crucial for ensuring stable operation of mobile phones, extending their lifespan, and improving user experience.

[0141] Electronic devices typically employ various heat dissipation technologies. Taking a mobile phone as an example, one implementation might include VC cooling, which can also be referred to as auxiliary cooling technology.

[0142] Among them, VC cooling technology, also known as vacuum chamber heat sink technology, is a relatively efficient thermal management solution used in smartphones, laptops, tablets, and high-performance computing devices. The following is a detailed explanation of VC cooling technology in mobile phones.

[0143] VC cooling technology is based on the principle of phase change. Its internal structure includes a sealed vacuum chamber containing a small amount of working fluid, typically water or other low-boiling-point liquids. When a heat source generates heat, the liquid in the chamber absorbs the heat and rapidly evaporates into a gas. Due to the low pressure in the vacuum environment, the gas easily diffuses to the cold end of the chamber. At the cold end, the gaseous fluid releases heat and condenses back into a liquid state, then returns to the heat source through capillary action or gravity. This cycle repeats continuously, forming a continuous heat transfer process.

[0144] VC cooling technology has some unique characteristics, including:

[0145] 1. Two-dimensional heat dissipation: Compared with traditional heat pipes, VC heat dissipation technology can transfer heat more evenly on a two-dimensional plane, rather than being limited to the one-dimensional linear conduction of heat pipes. This makes it more effective in handling large-scale or irregularly shaped heat sources, and is particularly suitable for the complex layout of modern high-performance electronic devices.

[0146] 2. Reduced thermal resistance: VC heat dissipation technology significantly reduces thermal resistance and improves heat conduction efficiency by directly contacting the heat source and the device casing, which helps maintain the internal temperature of the device within a safe range;

[0147] 3. Silent operation: Since VC cooling technology relies on phase change cooling, it does not require a fan and therefore operates very quietly, which is a major advantage for users who pursue a silent experience.

[0148] However, VC (Vibration Control) cooling technology has the problem of long cooling times. Generally, cooling technologies like VC require minutes to achieve uniform heat dissipation. For example, after an electronic device experiences a rise in temperature due to increased load, it may take several minutes to tens of minutes to lower the temperature to a relatively low level, allowing the device to operate at its optimal performance.

[0149] The relatively long cooling time of technologies like VC (Vibration Control) is inherent to their technical principles. In a mobile phone, the area where the processor is located generally has a relatively high temperature, known as a hot spot, while areas further away from the processor have a relatively low temperature, known as cold spots. VC cooling technology, and other cooling technologies, primarily transfer heat from hot spots to cold spots through various heat transfer methods—a method of uniform heat dissipation. However, during this heat transfer process, the temperature at the cold spots continues to rise, narrowing the temperature difference between the hot and cold spots and thus reducing the overall cooling effect. Furthermore, the small, enclosed internal space of a mobile phone further prolongs the cooling time required for this method of heat transfer between hot and cold spots within the phone itself.

[0150] Due to the relatively long cooling time of VC (Vibration Control) cooling technology, it cannot meet the heat dissipation needs of electronic devices in scenarios requiring rapid cooling. For example, in electronic devices, when the processor is under high load, the corresponding processor temperature (or junction temperature) will also be too high, thus limiting processor performance.

[0151] Furthermore, because VC cooling technology cannot achieve rapid cooling, relying solely on VC cooling technology to dissipate heat from electronic devices in the scenarios described above will negatively impact processor performance. In other words, VC cooling technology cannot meet the heat dissipation requirements of electronic devices in these scenarios, leading to poor processor performance.

[0152] The following examples illustrate several possible scenarios where high processor load leads to excessive processor temperature, as described above:

[0153] Scenario 1: Electronic devices reach a high load in a short period of time, causing the processor temperature to rise sharply.

[0154] For example, when using an electronic device, typically when launching a high-load application, the device's processor needs to perform a large number of operations in a short period of time. These operations may include: touch screen interaction detection, operating system receiving instructions, permission checks, loading and initialization, rendering the interface, network connection and data loading, background service and function activation, etc.

[0155] Alternatively, when users cold-start applications (such as games or cameras) on electronic devices, they need to minimize startup time while loading multiple algorithms and resources. This requires the processor to perform various operations and data processing, thus placing high demands on the phone's transient performance.

[0156] Scenario 2: Launching multiple different applications consecutively on an electronic device causes the processor temperature to rise sharply.

[0157] For example, a user may launch multiple applications on an electronic device in succession. These applications may include communication software, resource management software, and video entertainment software. The startup load of a single application may not be high, but when multiple applications are launched in succession, the load on the SOC will increase significantly.

[0158] Scenario 3: During the operation of an application on an electronic device, a large amount of calculation and processing needs to be performed in a short period of time depending on the user's usage, causing the processor temperature to rise sharply.

[0159] For example, in a scenario where a mobile phone is running a mobile performance rating application, the transient performance of the mobile phone is evaluated.

[0160] For example, when a user runs a video editing application on their mobile phone and completes the configuration of video editing operations, the application processes the video according to the configured parameters. This involves a large amount of computation and processing by the SOC, which can cause the load to increase in a short period of time. Video editing operations may include selecting video frame rates, adjusting window ratios, and adjusting color rendering.

[0161] Scenario 4: Multiple applications are running simultaneously on an electronic device, all of which require processing by the device's processor. The high load on the processor causes its temperature to rise sharply.

[0162] For example, a user's mobile phone may have multiple different applications running simultaneously, including foreground and background applications, such as chat and communication applications, file download applications, and video playback applications. If multiple applications require a certain amount of SOC resources for a period of time, it will inevitably lead to an increase in the SOC load.

[0163] Scenario 5: Electronic devices run high-load applications for extended periods, making it difficult for the cooling system to provide effective heat dissipation under these conditions.

[0164] For example, when a user plays a game on a mobile phone, the game typically requires dozens or even hundreds of rendering processes and corresponding game logic processing every second. This means that running the game requires the processor or SoC to continuously provide a high load to ensure smooth operation; otherwise, stuttering and frame drops may occur. Understandably, a sustained high load will continuously generate heat, and there is an upper limit to the heat dissipation efficiency of any heat dissipation method. If the heat dissipation efficiency is low, or insufficient to transfer the continuously generated heat, heat will accumulate in hot spots, typically the area near the processor or SoC, causing the temperature to rise and remain high.

[0165] In all the scenarios described above, the high load on the processor of electronic devices causes a sharp rise in processor temperature, or a sharp rise in the processor's junction temperature, preventing the processor from performing at its optimal transient performance at all times. Since VC cooling technology cannot meet the demand for rapid heat dissipation, a technical solution capable of achieving rapid heat dissipation and cooling is needed.

[0166] Based on this, the embodiments of this application propose the following technical concept: By analyzing the characteristics of technologies such as VC heat dissipation and combining the needs of the scenario, unlike the idea of ​​uniform heat dissipation, the embodiments of this application adopt an active and targeted heat dissipation approach to achieve rapid heat dissipation. Here, "active" refers to actively controlling whether heat dissipation occurs and the efficiency of heat dissipation through various methods; "targeted" refers to focusing on the temperature of hot spots in electronic devices and prioritizing the rapid reduction of the temperature of these hot spots to ensure the transient performance of related components in the electronic device.

[0167] Specifically, in this embodiment, a thermoelectric sensor can be placed near the processor of the electronic device. By actively supplying power to the thermoelectric sensor, the temperature of the end of it that is close to the processor is reduced, thereby enabling targeted and rapid cooling of the processor.

[0168] The reason why the technical concept proposed in this application can achieve rapid cooling of the processor is that a low-temperature cold spot is formed directly near the processor. Unlike the cold spot on the phone itself in technologies such as VC cooling, the cold spot in this technical concept can be placed much closer to the processor. At the same time, by controlling the power supply of the thermoelectric sensor, the temperature of this cold spot can be further reduced. This can significantly enhance heat dissipation efficiency, shorten heat dissipation time, and allow the processor to perform at its best transient performance as needed.

[0169] The technical solution provided in this application can be applied to terminal devices. The terminal devices will be briefly introduced below.

[0170] For example, Figure 1 A schematic diagram of the hardware structure of a terminal device provided in an embodiment of this application is shown.

[0171] Figure 1This is a schematic diagram of the structure of a terminal device provided in an embodiment of this application. The terminal device 100 may include a processor 110, an external memory interface 120, an internal memory 121, a universal serial bus (USB) interface 130, a charging management module 140, a power management module 141, a battery 142, an antenna 1, an antenna 2, a mobile communication module 150, a wireless communication module 160, an audio module 170, a speaker 170A, a receiver 170B, a microphone 170C, a headphone jack 170D, a sensor module 180, buttons 190, a motor 191, an indicator 192, a camera 193, a display screen 194, and a subscriber identification module (SIM) card interface 195, etc. The sensor module 180 includes a thermoelectric sensor 180A, and may also include a gyroscope sensor 180B, a barometric pressure sensor 180C, a magnetic sensor 180D, an accelerometer sensor 180E, a distance sensor 180F, a proximity sensor 180G, a fingerprint sensor 180H, a temperature sensor 180J, a touch sensor 180K, an ambient light sensor 180L, a bone conduction sensor 180M, a pressure sensor 180N, etc.

[0172] It is understood that the structures illustrated in the embodiments of this application do not constitute a specific limitation on the terminal device 100. In other embodiments of this application, the terminal device 100 may include more or fewer components than illustrated, or combine some components, or split some components, or have different component arrangements. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

[0173] Processor 110 may include one or more processing units, such as application processors (APs), modem processors, graphics processing units (GPUs), image signal processors (ISPs), controllers, video codecs, digital signal processors (DSPs), baseband processors, and / or neural network processing units (NPUs). These different processing units may be independent devices or integrated into one or more processors.

[0174] The controller can generate operation control signals based on the instruction opcode and timing signals to complete the control of instruction fetching and execution.

[0175] The processor 110 may also include a memory for storing instructions and data. In some embodiments, the memory in the processor 110 is a cache memory. This memory can store instructions or data that the processor 110 has just used or that are used repeatedly. If the processor 110 needs to use the instruction or data again, it can retrieve it from the memory. This avoids repeated accesses, reduces the waiting time of the processor 110, and thus improves the efficiency of the system.

[0176] In some embodiments, the processor 110 may include one or more interfaces. Interfaces may include an inter-integrated circuit (I2C) interface, an inter-integrated circuit sound (I2S) interface, a pulse code modulation (PCM) interface, a universal asynchronous receiver / transmitter (UART) interface, a mobile industry processor interface (MIPI), a general-purpose input / output (GPIO) interface, a subscriber identity module (SIM) interface, and / or a universal serial bus (USB) interface, etc.

[0177] It is understood that the interface connection relationships between the modules illustrated in the embodiments of this application are illustrative and do not constitute a structural limitation on the terminal device 100. In other embodiments of this application, the terminal device 100 may also adopt different interface connection methods or a combination of multiple interface connection methods as described in the above embodiments.

[0178] The charging management module 140 receives charging input from a charger. The charger can be a wireless charger or a wired charger. In some wired charging embodiments, the charging management module 140 receives charging input from the wired charger via the USB interface 130. In some wireless charging embodiments, the charging management module 140 receives wireless charging input via the wireless charging coil of the terminal device 100. While charging the battery 142, the charging management module 140 can also supply power to the terminal device via the power management module 141.

[0179] The power management module 141 connects the battery 142, the charging management module 140, and the processor 110. The power management module 141 receives input from the battery 142 and / or the charging management module 140, providing power to the processor 110, internal memory 121, display screen 194, camera 193, and wireless communication module 160, etc. The power management module 141 can also monitor parameters such as battery capacity, battery cycle count, and battery health status (leakage current, impedance). In some other embodiments, the power management module 141 may also be located within the processor 110. In other embodiments, the power management module 141 and the charging management module 140 may be located in the same device.

[0180] The thermoelectric sensor 180A is connected to the power management module 141, or it can be connected to the voltage conversion unit after passing through the power management module 141. In the terminal, the thermoelectric sensor 180A can be used for temperature measurement, cooling and heat dissipation, energy conversion, etc., based on the thermoelectric effect, and can be placed in the area near the processor 110 as needed.

[0181] The software system of terminal device 100 can adopt a layered architecture, event-driven architecture, microkernel architecture, microservice architecture, or cloud architecture, etc. This application embodiment uses the layered architecture Android system as an example to exemplify the software structure of terminal device 100.

[0182] For example, Figure 2 This is a schematic diagram of the software structure of a terminal device provided in an embodiment of this application. For example... Figure 2 As shown, the layered architecture divides the software into several layers, each with a clear role and division of labor. Layers communicate with each other through interfaces. In some embodiments, the system may include an application layer, an application framework layer, the Android runtime and system libraries, a hardware abstraction layer (HAL), and a kernel layer. It should be noted that this application uses the Android system as an example; however, the solution can also be implemented in other operating systems (such as HarmonyOS, iOS, etc.) as long as the functions implemented by each module are similar to those in the embodiments of this application.

[0183] The application layer can include a series of application packages.

[0184] like Figure 2 As shown, the application layer can include applications such as camera, gallery, games, calls, calendar, maps, navigation, wireless local area networks (WLAN), Bluetooth, music, video, SMS, lock screen application, settings application, etc.

[0185] Of course, the application layer may also include other application packages, such as third-party applications like payment apps, shopping apps, banking apps, and social apps; this application does not limit this. For example, third-party applications may have functions such as facial recognition, video calling, scanning, taking photos, and recording videos.

[0186] In addition, the application layer can also include terminal management-related applications, such as terminal processor temperature control programs and terminal power control programs.

[0187] Some applications require a high load during startup or long-term operation under certain circumstances, such as cameras, games, and videos.

[0188] The application framework layer provides application programming interfaces (APIs) and a programming framework for applications in the application layer. The application framework layer includes some predefined functions. These may include, for example, an activity manager, a window manager, a content provider, a view system, a resource manager, a notification manager, etc., though this embodiment does not impose any limitations on them.

[0189] In this embodiment, the application framework layer may further include a power management service, which determines power supply parameters and controls the underlying power module to supply power to the heat dissipation unit based on these parameters. These power supply parameters include, but are not limited to, power supply voltage and power supply duration.

[0190] System libraries can include multiple functional modules. For example: surface manager, media libraries, 3D graphics processing libraries (e.g., OpenGL ES), 2D graphics engines (e.g., SGL), etc.

[0191] The Android runtime consists of the core libraries and the virtual machine. The Android runtime is responsible for scheduling and managing the Android system. The core libraries consist of two parts: one part contains the functionalities that Java calls, and the other part comprises the Android core libraries. The application layer and application framework layer run in the virtual machine. The virtual machine executes the Java files of the application layer and application framework layer as binary files. The virtual machine is used to perform functions such as object lifecycle management, stack management, thread management, security and exception management, and garbage collection.

[0192] The HAL layer is a wrapper around Linux kernel drivers, providing interfaces to the upper layers and shielding them from the implementation details of the lower-level hardware.

[0193] The HAL layer can include WiFi HAL, sensor HAL, camera service (Camera HAL Server) unit, and software code library, etc.

[0194] For new terminal function requirements, corresponding new HAL interfaces can be designed. For example, the HAL layer includes a power supply HAL interface, which allows upper-layer services to control the power management module. This interface should contain methods for setting the power supply voltage and duration, as well as which device in the terminal is powered.

[0195] In one implementation, the HAL layer can pass control signals to the kernel through appropriate Linux kernel interfaces (such as the sysfs file system, ioctl commands, or dedicated character device drivers) to achieve precise control over the power supply to the thermoelectric sensor.

[0196] The kernel layer is the layer between hardware and software. The kernel layer includes at least display drivers, camera drivers, power drivers, sensor drivers, and charging drivers.

[0197] Among them, the power driver is the bridge between the PMIC and the mobile phone operating system. The PMIC is responsible for regulating the power distribution in the mobile phone, including charging management, battery status monitoring, and power supply management for different hardware components.

[0198] The technical solutions of the embodiments of this application and how the technical solutions of the embodiments of this application solve the above-mentioned technical problems will be described in detail below with reference to the accompanying drawings and specific embodiments. The same or similar concepts or processes may not be described again in some embodiments.

[0199] First, combine Figure 3 The heat dissipation device 300 provided in the embodiments of this application will be described below. Figure 3 This is a schematic diagram of the heat dissipation device provided in an embodiment of this application.

[0200] like Figure 3 As shown, the heat dissipation device 300 provided in this application embodiment may include three modules, namely a power supply unit 303, a heat dissipation unit 301, and a processor 302.

[0201] In the heat dissipation device 300, the three modules are connected as follows: the power supply unit 303 is connected to both the heat dissipation unit 301 and the processor 302, with the heat dissipation unit 301 located on the side of the processor 302. The following is a detailed description of each module in the heat dissipation device 300:

[0202] 1. Power supply unit 303

[0203] The power supply unit 303 is connected to the heat dissipation unit 301 and is used to supply power to the heat dissipation unit 301; and the power supply unit 303 is also connected to the processor 302 and is used to supply power to the processor 302.

[0204] The power supply unit 303 supplies power to the processor 302. For example, the power supply unit 303 can use direct current to supply power to the processor 302. Furthermore, considering that the processor requires a relatively small voltage during normal operation, the voltage supplied by the power supply unit can be stepped down before power is supplied. Additionally, the voltage can be dynamically adjusted according to the processor's load to maintain efficient and safe operation of the processor.

[0205] Furthermore, the power supply unit 303 is also used to supply power to the heat dissipation unit 301. Similarly, the power supply unit 303 can be powered by DC power, for example. Considering that the heat dissipation unit 301 requires a relatively high voltage to operate, the voltage provided by the power supply unit can be boosted before power supply, and the specific voltage can be adjusted according to requirements.

[0206] In one implementation, during the process of power supply unit 303 supplying power to heat dissipation unit 301, for example, processor 302 can control power supply unit 303 to perform power supply processing, such as whether power supply unit 303 supplies power to heat dissipation unit 301, and the magnitude of the voltage supplied by power supply unit 303 when supplying power, etc.

[0207] 2. Heat dissipation unit 301

[0208] A heat dissipation unit 301 is disposed on one side of the processor 302 and is used to dissipate heat from the processor 302. The heat dissipation unit 301 is manufactured based on the thermoelectric effect, and this embodiment does not impose specific limitations on the specific materials and processes.

[0209] The heat dissipation unit 301 is used to dissipate heat from the processor 302. This means that after receiving voltage from the power supply unit 303, the heat dissipation unit 301 cools down on one side or one end based on the thermoelectric effect, forming a cold spot, which then cools the processor 302. It should be understood that the cold spot mentioned in this embodiment is not a single point, but rather a region. The thermoelectric effect described above can be understood as, for example, the Peltier effect.

[0210] In this embodiment, the heat dissipation unit 301 is located on one side of the processor 302, and there is no restriction on its specific location. It can be set according to specific circumstances.

[0211] In one implementation, the heat dissipation unit 301 can be placed near the processor 302. For example, it could be above the processor 302. The processor 302 is typically located within an electronic device, and its orientation can be determined based on the device's first orientation. It is understood that when the electronic device is in its first orientation, the processor and the electronic device remain relatively stationary, thus the processor is also in a corresponding orientation. The orientation of the processor—above, below, and to the side—can be determined using this orientation as a standard. For example, the first orientation could be the electronic device being placed horizontally on a plane, with the screen above the back panel. (See reference...) Figure 3 It is also understandable that the side corresponding to the cold spot formed by the aforementioned heat dissipation unit 301 is close to the processor 302.

[0212] Understandably, the heat dissipation unit 301 can also be placed below the processor 302, or on the back of the processor 302.

[0213] For example, the heat dissipation unit 301 can also be placed on the side of the processor 302, with the side corresponding to the aforementioned cold spot close to the processor 302. Here, the side can be any area around the processor 302 that is relatively close to it, excluding the top and bottom.

[0214] For example, the heat dissipation unit 301 can also be placed in an area at a certain distance from the processor 302, and a heat conduction channel can be formed in some way, such as using a heat-conducting sheet to connect the processor 302 with the cold point corresponding to the heat dissipation unit 301.

[0215] 3. Processor 302

[0216] In this embodiment, the processor 302 is used to control the power supply unit 303 to supply power to the heat dissipation unit 301 based on a first parameter. In one implementation, the first parameter may include power management related information, and the processor 302 may, for example, control the power supply unit 303 to perform corresponding power supply processing based on the information contained in the first parameter.

[0217] For example, the first parameter may include the magnitude of the supply voltage. It is understood that when the processor is under high load, the processor junction temperature rises rapidly. For the heat dissipation unit 301 to achieve rapid cooling or accelerate the cooling process, a higher supply voltage within a reasonable range is required. Therefore, the voltage included in the first parameter can be adjusted according to the current processor load or junction temperature.

[0218] For example, the first parameter may include the duration of power supply. That is, based on the duration of power supply, the power supply unit 303 supplies voltage to the heat dissipation unit 301 for the specified duration and then stops supplying power. In this way, on the one hand, the heat dissipation effect can be ensured; on the other hand, setting a reasonable power supply duration can save the power of the power supply unit 303 as much as possible, ensure the endurance of the heat dissipation device 300, and avoid energy waste caused by continuing to supply power after heat dissipation.

[0219] Based on the three core modules included in the heat dissipation device 300 described above, the function of the heat dissipation device 300 will be further summarized and explained below.

[0220] In this embodiment, the processor 302 controls the power supply unit 303 to supply power to the heat dissipation unit 301 based on information in the first parameter. The information in the first parameter may include the power supply voltage and power supply duration. After receiving the voltage from the power supply unit 303, the heat dissipation unit 301 forms a cold spot, or low-temperature region, on one side of itself based on the thermoelectric effect. By placing the cold spot of the heat dissipation unit 301 near the processor 302, heat dissipation of the processor 302 can be achieved. The vicinity of the processor 302 includes the area above, below, and on the side.

[0221] Compared to uniform heat dissipation techniques, this embodiment places a low-temperature cold spot near the processor 302, which allows the temperature of the processor 302 or its junction temperature to drop rapidly, ensuring the transient performance of the processor 302. Simultaneously, by rationally setting the first parameter, cooling can be performed more flexibly and efficiently, saving power in the power supply unit 303.

[0222] Based on the above embodiments, the following will combine... Figure 4 The heat dissipation device 400 provided in the embodiments of this application will be further described in detail. For example, Figure 4 The device shown in the document can be understood as... Figure 3 Further forms of the device shown in the image. Figure 4 This is a schematic diagram of the heat dissipation device provided in an embodiment of this application.

[0223] The heat dissipation device 400 provided in this application embodiment includes eight modules, namely a thermoelectric sensor 301, a processor 302, a power supply 3031, a management unit 3032, a first voltage conversion unit 3033, a second voltage conversion unit 3034, a thermal conductive gel 409, and a screen 410. The thermoelectric sensor 301 also has two planes, namely a first plane 402 and a second plane 403.

[0224] In the heat dissipation device 400, the interconnections of the eight modules are as follows: Figure 4As shown, the power supply 3031 is connected to the management unit 3032, and the management unit 3032 is connected to the first voltage conversion unit 3033 and the second voltage conversion unit 3034 respectively.

[0225] Furthermore, the first voltage conversion unit 3033 is connected to the thermoelectric sensor 301, and the second voltage converter 408 is connected to the processor 302. The thermoelectric sensor 301 is disposed on one side of the processor 302, and a thermally conductive gel 409 is disposed between the thermoelectric sensor 301 and the processor 302. The first plane 402 is close to the thermally conductive gel 409, and the second plane 403 is close to the screen 410.

[0226] The following is a detailed description of each module in the heat dissipation device 400:

[0227] 1. Screen 410

[0228] Within the heat dissipation device 400, screen 410 is primarily used for displaying the image interface and interacting with the user. In this embodiment, screen 410 is closer to the second plane 403 of the thermoelectric sensor 301. During heat dissipation, since the second plane 403 is the side of the thermoelectric sensor 301 with a higher temperature than the first plane 402, heat can be transferred through screen 410 to aid in heat dissipation. In other words, screen 410 can be considered a cold spot or cold plane integrated into the heat dissipation device 400.

[0229] It is understood that the heat dissipation device 400 provided in this application embodiment may also include other modules that can be used for auxiliary heat dissipation functions.

[0230] For example, a graphite heat sink can also be provided between the screen 410 and the thermoelectric sensor 301 or the first plane 402. By utilizing the high thermal conductivity of graphite material, the heat generated by heat-generating components such as the processor can be quickly dispersed to a larger area such as the heat dissipation device screen, thereby reducing local high temperature.

[0231] For example, a VC (heat sensor) can be further configured between the screen 410 and the thermoelectric sensor 301 or the first plane 402 to assist in heat dissipation. The advantage of VC heat dissipation technology lies in its high thermal conductivity and its ability to uniformly transfer heat across a two-dimensional plane. This allows it to more effectively handle large-scale or irregularly shaped heat sources, making it particularly suitable for the complex layouts of modern high-performance electronic devices. In other words, the VC can be made into a large plane, comparable in size to the screen 410, achieving uniform heat dissipation more quickly.

[0232] 2. Back panel 411

[0233] The backplate 411, within the heat dissipation device 400, primarily serves to encapsulate and protect internal components. Figure 4 By combining the relative positions of the screen 410 and the back panel 411, the relative positions of the multiple modules contained in the heat dissipation device 400 can be understood more intuitively.

[0234] Understandably, the backplate 411 can also have a similar function to the screen 410 mentioned above, that is, to assist in heat dissipation as a cooling point built into the heat dissipation device 400 itself.

[0235] In some implementations, the backplate 411 can be made of a material with high thermal conductivity to achieve faster and more uniform heat dissipation. For example, a metal material with good thermal conductivity can be used to manufacture the backplate 411.

[0236] 3. Power supply 3031

[0237] In this embodiment, the power supply 3031 is connected to the management unit 3032 and is controlled by the management unit 3032 to provide DC power. The related technologies of the power supply 3031 can be found in existing power supply technologies for heat dissipation devices, and will not be elaborated upon here.

[0238] 4. Management Unit 3032

[0239] One end of the management unit 3032 is connected to the power supply 3031, and it is also connected to the first voltage conversion unit 3033 and the second voltage conversion unit 3034 respectively.

[0240] Reference Figure 4 After power is supplied by power supply 3031, the current can, for example, pass through management unit 3032 to reach first voltage conversion unit 3033 and second voltage conversion unit 3034 respectively. First voltage conversion unit 3033 is connected to thermoelectric sensor 301, thereby supplying power to thermoelectric sensor 301. Second voltage conversion unit 3034 is connected to processor 302, thereby supplying power to processor 302.

[0241] For example, the management unit 3032 may be a power management system (PMIC), a highly integrated electronic component designed to manage and optimize power distribution in electronic devices. A PMIC integrates multiple power management functions on a single chip, including voltage control conversion, power charging management, and load switching.

[0242] The voltage can be effectively regulated through the management unit 3032, or through the combined action of the PMIC and the voltage conversion unit. The management unit 3032 and the first voltage conversion unit 3033 can boost the power supply 3031 to provide a higher voltage to the thermoelectric sensor 301; conversely, the management unit 3032 and the second voltage conversion unit 3034 can buck the power supply 3031 to provide a lower voltage to the processor 302.

[0243] In addition, the management unit 3032, or PMIC, is programmable, allowing engineers to adjust power management strategies, such as dynamic voltage regulation and power timing control, according to the specific needs of the device to optimize performance and energy efficiency.

[0244] 5. First voltage conversion unit 3033

[0245] The first voltage conversion unit 3033 is connected to the management unit 3032 and the thermoelectric sensor 301, respectively.

[0246] The first voltage conversion unit 3033 can boost the current passing through the power supply 3031 and the management unit 3032 to power the thermoelectric sensor 301.

[0247] In one implementation, the first voltage conversion unit 3033 can be, for example, a DC-DC converter circuit used to convert one DC voltage level to another different DC voltage level. The DC-DC conversion can be achieved using switching power supply technology, primarily utilizing the energy storage characteristics of inductors and capacitors, as well as the control of high-frequency switching to regulate the output voltage. When the switch is on, the inductor draws energy from the input power supply and stores magnetic field energy on it; when the switch is off, the voltage across the inductor plus the input voltage charges the capacitor and discharges through the load, thereby achieving a voltage boost.

[0248] It is understood that the embodiments of this application do not impose specific limitations on the magnitude of the voltage, nor do they limit whether the voltage is a fixed voltage or a variable voltage.

[0249] For example, when the processor 302 is under high load, the junction temperature of the processor 302 will rise rapidly. At this time, the first voltage conversion unit 3033 can increase the voltage supplied to the thermoelectric sensor 301, so that the temperature of the first plane 402 of the thermoelectric sensor 301 is lower, and the processor 302 can be cooled down more quickly.

[0250] 6. Second voltage conversion unit 3034

[0251] The second voltage conversion unit 3034 is connected to the management unit 3032 and the processor 302 respectively.

[0252] The second voltage conversion unit 3034 steps down the current passing through the power supply 3031 and the management unit 3032 to supply power to the processor 302.

[0253] Understandably, the second voltage conversion unit 3034 is the same as the first voltage conversion unit 3033 mentioned above. The second voltage conversion unit 3034 is also a DC voltage conversion circuit. During the switch conduction period, the input voltage charges the inductor and establishes the energy stored in the magnetic field. When the switch is closed, the inductor releases energy and flows to the load through the diode, thereby realizing voltage reduction.

[0254] 7. Thermal conductive gel 409

[0255] Thermal conductive gel 409 is disposed between processor 302 and thermoelectric sensor 301, and thermal conductive gel 409 is closer to the first plane 402 of thermoelectric sensor 301. Alternatively, it can be said that thermal conductive gel 409 is disposed between processor 302 and the first plane 402 of thermoelectric sensor 301.

[0256] Understandably, thermally conductive gel 409 is typically a material with silicone as the matrix, mixed with various high-performance ceramic powders. Due to its soft and compressible properties, thermally conductive gel 409 can adapt to different shapes and uneven surfaces, filling gaps between different components. Using thermally conductive gel 409, the processor 302 and the thermoelectric sensor 301 can be tightly bonded, reducing thermal resistance in the heat transfer path and facilitating rapid heat transfer.

[0257] For example, when the processor 302 is at a high temperature due to high load, the processor 302 becomes a hot spot, or in other words, the side of the processor 302 closest to the first plane 402 is a hot surface. At this time, power is supplied to the thermoelectric sensor 301 via the power supply 3031, causing the temperature of its first plane 402 to decrease, forming a cold spot, or a cold surface. Due to the temperature difference between the hot and cold surfaces, heat is transferred more quickly from the hot surface of the processor 302 to the cold surface, i.e., the first plane 402, via the thermally conductive gel 409.

[0258] In different terminal devices, other components may exist between the thermal conductive gel 409 and the processor 302, and this application embodiment does not impose any restrictions.

[0259] For example, a DDR is provided on the processor 302, and thermal conductive gel can be provided between the DDR and the thermoelectric sensor 301. In this case, the thermal conductive gel can also serve to bond the DDR and the thermoelectric sensor together.

[0260] 8. Thermoelectric sensor 301

[0261] The thermoelectric sensor 301 in the heat dissipation device 400 provided in this application embodiment corresponds to... Figure 3 The heat dissipation unit 301 in the heat dissipation device 300 shown can be referenced.

[0262] The thermoelectric sensor 301 is connected to the first voltage conversion unit and is powered by the first voltage conversion unit.

[0263] When powered, the thermoelectric sensor 301 can create a temperature difference between its two planes based on the thermoelectric effect. Specifically, the temperature decreases on the first plane 402 and increases on the second plane 403. Cooling can be achieved by bringing the lower-temperature first plane close to the processor 302.

[0264] Understandably, the magnitude of the temperature difference created by the thermoelectric sensor 301, or the low temperature of the first plane 402, is related to the voltage supplied to it. When the voltage supplied to the thermoelectric sensor 301 increases, a lower temperature can be obtained on the first plane 402, thereby increasing the temperature difference between the first plane 402 and the processor 302. Compared to other heat dissipation technologies based on uniform heat dissipation, the thermoelectric sensor 301 can form a low-temperature cold plane in the area near the processor 302, achieving rapid cooling.

[0265] For example, the thermoelectric sensor 301, which can also be a TEC, is composed of multiple pairs of N-type and P-type semiconductor materials arranged alternately and tightly connected to form a structure of multiple thermocouples connected in series. When a direct current passes through these thermocouples, a cold plane is formed on one side and a hot plane is formed on the other side, achieving a cooling effect. TECs are characterized by their compact structure, noiselessness, vibration-free operation, and ease of control. Furthermore, they do not require a refrigerant and react rapidly, making them particularly suitable for applications with limited space and high requirements for rapid heat dissipation.

[0266] Understandably, the supply voltage on the thermoelectric sensor 301 and the temperature between its two planes are affected by the materials and manufacturing process of the thermoelectric sensor 301 itself. Therefore, under different circumstances, it is necessary to determine the supply voltage in the first parameter by combining the supply voltage required for the first plane 402 of the thermoelectric sensor 301 to reach a certain temperature.

[0267] 9. First plane 402 and second plane 403

[0268] In one implementation, after the thermoelectric sensor 301 is powered, it can control its first plane 402 and second plane 403 to generate a temperature difference. Since the temperature of the first plane 402 is lower than the temperature of the second plane 403, the first plane 402 can be understood as existing as a cold plane.

[0269] Reference Figure 4It can be determined that the first plane 402 is the plane of the thermoelectric sensor 301 closest to the processor 302, and the first plane 402 exists as a cold plane, so the first plane 402 can specifically cool the processor 302. Furthermore, in this embodiment, the first plane 302 is generated by the operation of the thermoelectric sensor 301, therefore, the technical solution of this application can achieve active cooling of the processor.

[0270] As can be seen from the above description, the operation of the thermoelectric sensor 301 will cause the temperature of the second plane 403 to be relatively high compared with the first plane. In this embodiment, the second plane 403 is the side plane of the thermoelectric sensor 301 that is closer to the screen 410. Therefore, the screen 410 can effectively dissipate the heat generated by the second plane 403, so that the hot surface generated by the thermoelectric sensor 301 can be effectively dissipated, thereby enabling the electronic device to operate normally.

[0271] In another implementation, a VC heat dissipation device may be included between the second plane 403 and the screen 410, so that the heat generated by the second plane 403 can be dissipated through the VC heat dissipation device.

[0272] 10. Processor 302

[0273] The processor 302 is used to control the power supply 3031 to supply power to the thermoelectric sensor 301 based on a first parameter. For example, the first parameter may include the supply voltage and the supply duration. Then, the processor 302 may, for example, control the power supply 3032 to supply power to the thermoelectric sensor 301 at the supply voltage included in the first parameter, and the supply duration of the power supply 3032 shall be the supply duration included in the first parameter. The information included in the first parameter is not limited to the supply voltage and supply duration described above. In one implementation, any parameter related to power supply can be used as the first parameter in this embodiment.

[0274] The processor 302 controls the power supply 3031 to supply power to the thermoelectric sensor 301. This can be understood as the processor 302 sending instructions to the power supply 3031 through the bus interface to supply power to the thermoelectric sensor 301. The current from the power supply 3031 is boosted by the management unit 3032 and the first voltage conversion unit 3033 to supply power to the thermoelectric sensor 301.

[0275] In some implementations, the first parameter includes the supply voltage and the supply duration. For example, when the processor load is high and the junction temperature is high, the processor can control the power supply to provide a relatively high voltage and a relatively long supply duration based on the first parameter; when the processor load is low and the junction temperature is not high, the processor can control the power supply to provide a relatively low voltage and a relatively short supply duration based on the first parameter. In this way, rapid cooling and heat dissipation can be achieved flexibly and precisely without wasting unnecessary energy.

[0276] In some implementations, the setting of the power supply voltage and power supply duration in the first parameter also needs to be determined in conjunction with the relationship between the power supply voltage on the thermoelectric sensor 301 and the temperature of the first plane 402.

[0277] The first parameter can be obtained through a first strategy, which can be formulated in various ways. This application does not impose too many restrictions on the embodiments.

[0278] For example, the first strategy may correspond to a whitelist, which sets different power supply voltages and power supply durations for applications or some applications in the terminal.

[0279] For example, the first strategy can be an automated strategy that automatically sets different supply voltages and supply durations for different applications based on some rules or model algorithms. For instance, using a rule, based on the application's historical load logs and corresponding processor junction temperature logs, different applications are rated by setting different load / junction temperature thresholds. Applications with high loads are given high ratings and set with correspondingly larger supply voltages and longer supply durations; applications with low loads are given low ratings and set with correspondingly smaller supply voltages and shorter supply durations.

[0280] Based on the various modules included in the heat dissipation device 400 described above, the function of the heat dissipation device 400 will be further summarized and explained below.

[0281] In this embodiment, the processor 302 controls the voltage provided by the power supply 3031 based on the information in the first parameter. Then, the voltage provided by the power supply 3031 is boosted by the first voltage conversion unit 3033 to reach the power supply voltage level included in the first parameter, and then supplies power to the thermoelectric sensor 301 for a power supply duration included in the first parameter.

[0282] After receiving the voltage from the power supply unit 303, the thermoelectric sensor 301 will form a cold spot, or low-temperature region, on one side of itself based on the thermoelectric effect, corresponding to the first plane 402. Heat dissipation can be achieved by placing the cold spot of the thermoelectric sensor 301 near the processor 302 or on the thermal conductive gel 409, wherein the thermal conductive gel is placed between the processor 302 and the thermoelectric sensor 301.

[0283] Similarly, compared to uniform heat dissipation technology, in this embodiment, the processor 302 controls the power supply unit 303 to supply power to the thermoelectric sensor 301 at a certain voltage and duration, forming a controllable cold spot near the processor 302. This allows the junction temperature of the processor 302 to drop rapidly, greatly shortening the heat dissipation time and saving power on the power supply 3031.

[0284] Based on the device description provided in this embodiment above, the following will further combine... Figures 5-7 The heat dissipation method provided in the embodiments of this application will be described. Figure 5 Flowchart of the heat dissipation method provided in the embodiments of this application Figure 1 , Figure 6 This is a schematic diagram of the whitelist data for heat dissipation applications provided in the embodiments of this application. Figure 7 A schematic diagram of the functional interface provided in the embodiments of this application. Figure 1 .

[0285] Figure 5 The terminal heat dissipation treatment method shown in the document includes the following steps: S501, S502 and S503.

[0286] S501. In response to the startup of the first application, the processor obtains the first parameter corresponding to the first application from the whitelist data. The first parameter includes the first power supply voltage and the first power supply duration.

[0287] The first power supply voltage refers to the voltage at which the power supply unit supplies power to the heat dissipation unit, and the first power supply duration refers to the duration for which the power supply unit supplies power to the heat dissipation unit.

[0288] In some implementations, "processor responds to the startup of the first application" means that when the first application starts in the terminal, the processor begins executing subsequent heat dissipation-related steps. In other words, the method in this embodiment can be understood as starting from the startup of the first application and continuously executing during the operation of the first application.

[0289] In this embodiment of the application, the processor can, in response to the startup of the first application, obtain the first parameter corresponding to the first application based on whitelist data. For example, Figure 6 A specific example of whitelist data is given.

[0290] Reference Figure 6 The example in the text suggests that the whitelist data could include multiple applications, along with the power supply voltage and duration for each application. Figure 6 Taking the application Game A as an example, if Game A corresponds to a power supply voltage of 10V and a power supply duration of 120 seconds, then the first power supply voltage of Game A can be determined to be 10V and the first power supply duration of Game A is 120 seconds by referring to the whitelist data in Table 1 above. Figure 6 The implementation of the other applications is similar, and will not be described in detail here.

[0291] When the processor retrieves the first parameter corresponding to the first application from the whitelist data, it matches the application by name or other identifiers. If a match is found, it retrieves the power supply voltage and duration corresponding to that application, thus obtaining the first parameter for that application. If no match is found, it can also retrieve the default power supply voltage and duration, and then use these as the first parameter for the first application. The default power supply voltage and duration can be preset.

[0292] In the embodiments of this application, such as Figure 7 The image shows a functional interface for configuring a whitelist of thermal applications. Figure 7 At the top of the interface shown in (a) is a selection button for enabling a function, which is used to select whether to enable the whitelist-based heat dissipation function. Figure 7 Below the interface shown in (a) is a list of applications in the terminal. For example, you can click on the Camera B application to enter the parameter settings interface of the Camera B application.

[0293] For example, the parameter setting interface can be found by referring to Figure 7 Understanding (b) in the text, different first power supply voltages and first power supply durations can be set for each application in the whitelist. For example... Figure 7 As shown in (b), in the parameter settings interface, the corresponding power supply duration can be set for the selected application, and the duration unit can also be selected. Furthermore, the power supply voltage can also be set in the parameter settings interface. For example, a power supply voltage of 3V and a power supply duration of 1 minute can be set for the camera B application.

[0294] Furthermore, the power supply duration and / or voltage can be set to 0, which can be used to indicate that no heat dissipation is applied to the application. In some implementations, when the first application starts, the processor searches for and matches the first application in a whitelist. If the first application is set in the whitelist and a match is successful, the corresponding first parameter can be obtained.

[0295] In some implementations, the whitelist data can be pre-set by the developers as a default setting; for example, some commonly used applications in the terminal can be added to the whitelist data.

[0296] Alternatively, the whitelist data can be customized by the user, who can add frequently used applications from the terminal to the whitelist data.

[0297] Alternatively, a default case can be set in the whitelist data. If the first application cannot be successfully matched in the whitelist data, the first parameter corresponding to the default case can be returned.

[0298] In this embodiment, the determination of the first parameter, or the determination of the first power supply voltage and the first power supply duration, needs to be set in conjunction with the characteristics of the heat dissipation unit itself and the load of the first application in the terminal. The characteristics of the heat dissipation unit itself refer to the relationship between the power supply voltage of the heat dissipation unit and the temperature of the low-temperature plane it forms. More relevant information can be found in the description of the first strategy in the heat dissipation device 400, and will not be repeated here.

[0299] Understandably, when multiple applications start up in quick succession on the terminal, appropriate strategies can be set to handle the situation.

[0300] For example, both the first application and the second application are in the whitelist data. When the first application starts, the processor controls the power supply unit to supply power according to the first power supply voltage, and the second application starts within the first power supply duration. At this time, if the second power supply voltage is not equal to the first power supply voltage, then according to the preset settings, the first power supply voltage, the second power supply voltage, a relatively higher power supply voltage, or the average value of the power supply voltage can be selected to supply power to the thermoelectric sensor 301 during this period. If the second power supply duration has not ended after the first power supply duration is reached, then the second power supply voltage continues to be used for power supply.

[0301] S502, The processor control power supply unit supplies power to the heat dissipation unit according to the first power supply voltage and starts the first timer so that the heat dissipation unit can dissipate heat from the processor.

[0302] Specifically, the processor controls the power supply unit to supply power to the heat dissipation unit according to the first supply voltage. This can be achieved by the processor sending an instruction to the power supply unit containing the first supply voltage, causing the power supply to provide current according to the first supply voltage. The voltage supplied by the power supply is then processed by a first voltage conversion unit to obtain the first supply voltage. The first voltage conversion unit then provides the processed first supply voltage to the heat dissipation unit, thus supplying power to the heat dissipation unit according to the first supply voltage. For more details, please refer to the description of the power supply unit 303 in the heat dissipation device 300; it will not be repeated here.

[0303] Understandably, due to the fast response characteristics of the heat dissipation unit in this embodiment, after receiving the voltage from the power supply unit, it can form a low-temperature cold plane on the side closest to the processor in a very short time, achieving rapid cooling of the processor. Thus, whether it's the high load required by the first application during startup or the high load required by the first application during operation, the rapid cooling of the heat dissipation unit will keep the processor's junction temperature within a certain range for a long time, preventing it from actively throttling due to overheating, thereby maintaining optimal transient performance.

[0304] The above describes the implementation of the processor controlling the power supply unit to supply power to the heat dissipation unit according to the first supply voltage. Simultaneously, the processor also controls the power supply process of the power supply unit according to the first duration included in the first parameter. In one implementation, the processor may, for example, start a first timer in response to the startup of a first application, wherein the first timer is used to time the duration of power supply from the power supply unit to the heat dissipation unit.

[0305] For example, different applications can have their own timers. When there is overlap between different timers, corresponding rules can be set to determine the specific amount of voltage supplied by the power supply unit to the heat dissipation unit. For more details, please refer to the description in S501 regarding the strategy adopted when multiple applications are launched successively in a short period of time in the terminal, which will not be repeated here.

[0306] S503: When the first timer reaches the first power supply duration, the processor controls the power supply unit to stop supplying power to the heat dissipation unit.

[0307] When the first timer reaches the first power supply duration, the cooling work of the current heat dissipation unit can be considered complete. It can be understood that during the first timer's operation, the heat dissipation unit continuously cools the processor. Under a properly set first power supply duration, this allows the processor's temperature to return to a normal level, or for the processor's temperature to remain below a certain high-temperature threshold, thus effectively cooling the processor.

[0308] In this embodiment of the application, the processor controls the power supply unit to stop supplying power to the heat dissipation unit, which can be understood as the processor issuing an instruction to the power supply unit to stop supplying power.

[0309] For example, different applications can have their own timers. When one application's timer finishes while another application's timer is still running, the processor sends a command to the power supply unit, instructing the power supply unit to change the voltage supplied, from the voltage provided when both timers were running together to the voltage provided when only one timer was running. It is understood that when two or more timers are running simultaneously, the process can be handled in a similar manner as described above.

[0310] In the above introduction Figure 5 Based on the heat dissipation process described in the above embodiments, the implementation methods will be further summarized and explained below.

[0311] In this embodiment of the application, a method based on whitelist data is used to determine the first parameter of the first application. The power supply voltage and power supply duration of each application in the whitelist can be set, and it can also be set whether to start heat dissipation treatment for the application.

[0312] Different applications have different load requirements. Some applications have higher load requirements, which can easily cause the processor temperature to rise; conversely, some applications have lower load requirements and will not cause a significant increase in processor temperature. By using whitelist data, different primary parameters can be selected for different applications based on their respective load requirements, enabling flexible heat dissipation.

[0313] In other words, when the application load is high, a relatively high supply voltage and a relatively long supply duration are used, allowing the cooling unit to dissipate heat from the processor at a relatively lower temperature for a longer period, ensuring rapid cooling. Conversely, when the application load is low, a relatively low supply voltage and a relatively short supply duration are used, allowing the cooling unit to dissipate heat from the processor in a shorter time, thus controlling the processor's temperature and conserving power as much as possible.

[0314] This application also provides another heat dissipation method, which is described below in conjunction with... Figures 8 to 14 Please provide an explanation. Figure 8 Flowchart of the heat dissipation method provided in the embodiments of this application Figure 2 , Figure 9 This is a schematic diagram illustrating the changes in multi-stage load provided in an embodiment of this application. Figure 10 Implementation illustration of load prediction provided in the embodiments of this application Figure 1 , Figure 11 Implementation illustration of load prediction provided in the embodiments of this application Figure 2 , Figure 12 A schematic diagram of the functional interface provided in the embodiments of this application. Figure 2 , Figure 13 This is a schematic diagram illustrating the mapping relationship between load range and load level provided in an embodiment of this application. Figure 14 This is a schematic diagram illustrating the mapping relationship between load level and power supply parameters provided in an embodiment of this application.

[0315] Figure 8 The heat dissipation method shown includes the following steps: S801, S802, S803, S804 and S805.

[0316] S801: The processor responds to the startup of the first application by predicting the load information of multiple running stages of the first application.

[0317] In one implementation, the operation of the first application after startup can be divided into multiple stages, each of which can be understood as a running phase, and each running phase has its own corresponding duration. Alternatively, it can be understood as dividing the startup and operation of the first application into multiple time periods, each time period corresponding to a running phase.

[0318] For example, the process can be divided into multiple stages based on a fixed duration. Alternatively, it can be divided into multiple stages based on a varying duration. For instance, the first 5 seconds after the application starts can be considered the startup stage, or stage 1; the following 10 seconds can be considered the high-load operation stage, or stage 2; and each subsequent 30 seconds can be considered a stage for stable operation, etc.

[0319] Each of the multiple stages corresponds to the load of the first application at that stage, and the load may vary between stages. For example, the load may be relatively high during the initial startup period or in the first few stages, while the load may be relatively low during the subsequent stable operation of the first application or in the later stages.

[0320] like Figure 9 The diagram illustrates load variation across multiple stages, with the horizontal axis representing stages such as stage 1, stage 2, and stage 3. The vertical axis represents processor load, ranging from 0% to 100%. For example, see [reference]. Figure 9 It can be determined that the load in Phase 1 is 75%. The load for the remaining phases can be understood in a similar way, and will not be elaborated here.

[0321] Reference Figure 9 Understandable, Figure 9The load varies at each stage; the load is relatively high in the earlier stages and relatively low in the later stages. Generally, the load is relatively high in the first few stages after application startup, and relatively low in the later stages.

[0322] In this embodiment, predicting the load information of multiple operational stages of the first application can be achieved by predicting the load demand at each stage from the application's startup to its continued operation. For example, the load demand of the first application may be relatively high when the application first starts, then gradually decrease and fluctuate within a certain range over a period of time. Therefore, determining the load information for multiple operational stages is beneficial.

[0323] In this embodiment, for example, a predictive approach can be used to determine the load information for multiple operating phases.

[0324] For example, load logs can be recorded for multiple runtime phases of the first application, and predictions can be made using this log information. Figure 10 The image illustrates a method for predicting load based on load logs. Figure 10 On the left is an application log for the first application, which records information including the load of the first application at different times after it starts running. For example, Figure 10 The first record in the log shows that the first application started at 12:08:03, and the load at that time was 70%. Subsequent records are made every second.

[0325] Figure 10 The right side of the graph shows the load predicted for each stage based on the application logs on the left. Stages can be divided into fixed durations, and the maximum load from multiple log records within each stage is taken as the predicted load. Figure 10 The fixed duration of the segmentation phase used in this embodiment is 3 seconds. In actual implementation, the fixed duration of the segmentation phase can be selected according to actual needs, and this embodiment does not impose any restrictions.

[0326] In addition, Figure 10 Based on the load prediction method shown, the average load of multiple log records in each stage can be used as the predicted load; multiple stages can be divided by the duration of the change; and multiple application logs can be used, that is, load information at various times after the first application starts can be used to predict the load.

[0327] For example, predictions can be made based on relevant information from the first application itself, combined with rules or models. For instance... Figure 11This paper demonstrates a method for predicting load at each stage based on a model. The load prediction model can be a pre-trained model, the input of which can be various information related to the first application, and the output of which is the load size at each stage.

[0328] For example, Figure 11 The left side exemplifies the possible related information (i.e., feature names) and the specific values ​​of the relevant information for the first application (i.e., feature values). For example... Figure 11 As shown, application-related information may include application type, sub-type, startup load, running load, background operation, and memory usage. Some feature values ​​can be directly obtained from the application's own information, while others may require calculations based on that information. In special cases, if some feature values ​​cannot be obtained, these can be set to null values.

[0329] Reference Figure 11 It can be determined that, in the current example, the feature value corresponding to the application type of the first application is "game", and the feature value corresponding to the sub-type of the first application is "casual game". These features can be obtained directly from the information of the first application itself.

[0330] and reference Figure 11 It can also be determined that the characteristic value corresponding to the startup load of the first application is 80%, and the characteristic value corresponding to the running load of the first application is 50%. This characteristic can be obtained, for example, by statistical calculation from the running log file of the first application, or by listening to relevant data after the first application starts.

[0331] This is for Figure 11 The specific details of the relevant information of the first application shown will not be repeated here. It is understood that the method of obtaining the relevant information of the first application can be arbitrarily set according to actual needs, and this embodiment does not impose any restrictions on this.

[0332] In one possible implementation, after obtaining the prediction results of the application for multiple stages through model prediction, the prediction results of the multiple stages in which the model is located can be reused to perform subsequent heat dissipation processing, thereby achieving the goal of not needing to repeatedly obtain relevant information about the application and repeatedly predict the load of multiple stages of the application.

[0333] Furthermore, it can periodically update relevant application information and periodically re-predict the load of multiple stages of the application based on the prediction model to ensure the accuracy of the predicted load of multiple stages of the application.

[0334] as well as, Figure 12It also showcased a user interface that allows for the configuration of active cooling. Figure 12 The interface shown in (a) has an "Enable Function" button at the top, which allows you to choose whether to enable the active cooling function. Below is a list of applications in the terminal; for example, clicking on the camera application will take you to the predicted load information interface for Camera B application.

[0335] exist Figure 12 (b) shows the interface for the corresponding predicted load information. At the top of the interface is an "Enable Prediction" button to select whether to enable the cooling function for the application. That is, with both the active cooling function and the predicted load information interface enabled, load prediction for the application can be performed. The interface below shows the load information for each stage of operation, including the duration and load magnitude for each stage.

[0336] S802: The processor determines the load level of multiple operating stages based on the load information of multiple operating stages.

[0337] In this embodiment, the load information obtained from different stages of prediction is divided into different load levels according to certain rules.

[0338] For example, multiple different thresholds can be set for different load levels. Figure 13 As shown, the thresholds can be set to include 20%, 40%, 60%, 80%, and 100%, with adjacent load thresholds forming a load range. Different load ranges are then mapped to different load levels; for example, greater than 80% and less than or equal to 100% is level one, greater than 60% and less than or equal to 80% is level two, and so on.

[0339] Furthermore, different load level correspondences can be used. For example, a load greater than 0% and less than or equal to 20% can be classified as Level 1, and a load greater than 20% and less than or equal to 40% as Level 2. In other words, the higher the load, the higher the corresponding load level. This embodiment does not restrict the correspondence between load levels; it can be arbitrarily set according to actual needs.

[0340] As can be seen from the above introduction, the load level intuitively represents the level of processor load demand of the first application at a certain stage of operation.

[0341] S803 The processor determines the first parameters for each of the multiple operating stages based on the correspondence between the load level and the power supply parameters. For any one of the multiple operating stages, the first parameters corresponding to the operating stage include the second power supply voltage and the second power supply duration.

[0342] The second power supply voltage refers to the voltage supplied by the power supply unit to the heat dissipation unit, and more specifically, the voltage at each operating stage. The second power supply duration refers to the duration for which the power supply unit supplies voltage to the heat dissipation unit, and more specifically, the power supply duration at each operating stage.

[0343] like Figure 14 The diagram illustrates the correspondence between load levels and power supply parameters, with each load level corresponding to a set of power supply parameters. For example, a load level of 1 is considered a high load, and a higher secondary power supply voltage of 25V can be set; a load level of 4 is considered a low load, and a lower secondary power supply voltage of 10V can be set. Figure 14 The power supply duration is optional because when predicting the load in multiple stages, the duration of each stage is essentially determined.

[0344] Understandably, by predicting the load information of multiple operating phases of the first application, corresponding to the load level, and determining the primary parameters for each operating phase, precise and rapid heat dissipation can be achieved during the operation of the same application, while saving power. Through prediction, the appropriate secondary voltage can be provided for heat dissipation before the processor junction temperature reaches a high value, which is equivalent to further accelerating heat dissipation efficiency and shortening heat dissipation time.

[0345] For more information on this step, please refer to S501; it will not be repeated here.

[0346] S804: The processor control power supply unit supplies power to the heat dissipation unit according to the second power supply voltage and starts the second timer so that the heat dissipation unit can dissipate heat from the processor.

[0347] The second timer is used to time the power supply duration. Furthermore, each operating stage has its own timer, and the duration of the timer for each operating stage is the same as the power supply duration of that operating stage.

[0348] Since there are multiple operating phases, and each operating phase may correspond to a different power supply voltage, the processor needs to send an instruction to the power supply unit before the start of each operating phase, instructing the power supply unit to provide the power supply voltage for the next operating phase to the heat dissipation unit, and at the same time start the timer corresponding to that operating phase.

[0349] Understandably, the first parameter can include the duration of each running phase, which can be different or the same. The processor can trigger the sending of instructions to the power supply unit based on the duration of each running phase.

[0350] For more information on this step, please refer to S502; it will not be repeated here.

[0351] S805: When the second timer reaches the second power supply duration, the processor controls the power supply unit to adjust the power supply voltage to the heat dissipation unit. The second power supply duration is equal to the duration of the running phase.

[0352] When the second timer reaches the second power supply duration, the cooling work of the heat dissipation unit in the current stage can be considered complete. It can be understood that before the last running stage, when the timer for one stage reaches its duration, the timing for the next stage will start and the power supply voltage for the next stage will be adjusted; when the timer for the last running stage reaches its duration, the processor-controlled power supply unit adjusting the power supply voltage to the heat dissipation unit, as described above, can be understood as the processor controlling the power supply unit to stop supplying power to the heat dissipation unit.

[0353] For more information on this step, please refer to S503; it will not be repeated here.

[0354] In the above introduction Figure 8 Based on the heat dissipation process described in the above embodiments, the implementation methods will be further summarized and explained below.

[0355] In this embodiment, a multi-stage load prediction method is employed. The load level is determined by predicting the load, and ultimately, a first parameter is determined. This allows for the use of different voltages to power the thermoelectric sensor at different time periods after the first application starts. Thus, different power supply parameters can be applied to different operating stages of the first application.

[0356] For example, during periods of high load demand, the heat dissipation capacity of the thermoelectric sensor can be enhanced based on the corresponding power supply parameters, thereby accelerating the heat dissipation of the processor and ensuring that the processor's temperature is controlled at all times, thus achieving optimal transient performance. Conversely, during periods of low load demand, a lower supply voltage or shorter supply duration can be used to power the thermoelectric sensor to meet the heat dissipation requirements of these periods, while also saving energy consumption for powering the heat dissipation sensor.

[0357] Furthermore, using predictive load analysis instead of real-time processor temperature monitoring is because while thermoelectric sensors can cool down quickly, it still takes some time. If we wait until the processor load increases and the temperature rises before increasing the supply voltage to the thermoelectric sensor, it may still be difficult to prevent the processor temperature from exceeding the set stability threshold and thus triggering active frequency reduction. Therefore, using a predictive approach allows for heat dissipation before the processor temperature rises rapidly, keeping the processor temperature within a normal range.

[0358] This application also provides another heat dissipation method, which is described below in conjunction with... Figures 15-17Please provide an explanation. Figure 15 Schematic diagram of the heat dissipation treatment method provided in the embodiments of this application Figure 3 , Figure 16 This is a schematic diagram illustrating the mapping relationship between load range and power supply parameters provided in an embodiment of this application. Figure 17 Implementation illustration of predicted load provided in the embodiments of this application Figure 3 .

[0359] S1501, In response to the startup of the first application, the processor predicts the load information of multiple running stages of the first application.

[0360] For details regarding this step, please refer to S801; further explanation is not required here.

[0361] S1502. The processor determines the first parameters for each of the multiple operating stages based on the load information of multiple stages and the correspondence between the load information and the power supply parameters. For any one of the multiple operating stages, the first parameters corresponding to the operating stage include the second power supply voltage and the second power supply duration.

[0362] The processor determines the first parameter for each of the multiple operating stages based on the load information of multiple stages and the correspondence between the load information and the power supply parameters. This can be achieved by using the predicted load information as input to obtain the output of the power supply parameters.

[0363] The following section explains some methods for determining the second power supply voltage:

[0364] For example, the first parameter can be determined by establishing a rule mapping table between load information and power supply parameters. This can be done by first dividing the load into a series of threshold values, such as 20%, 40%, and 60%, and then using adjacent load threshold values ​​to form multiple load ranges. The following section combines... Figure 16 For example, Figure 16 As shown, the first column represents the load range, which can include (0%, 20%), (20%, 40%), and (40%, 60%), etc. The second column represents the power supply parameters, which can include 5V, 10V, and 15V, etc. The load range and the power supply parameters correspond one-to-one. For example, when the load is greater than 20% and less than or equal to 40%, the corresponding power supply parameter is 10V, that is, the second power supply voltage in the first parameter is 10V.

[0365] For example, a model can be built to map the relationship. This model can take various forms, including mathematical models and trained machine learning models. Generally, it is considered reasonable if the power supply parameters increase along with the predicted load. Figure 17 As shown, a method for predicting power supply parameters using a linear function model is illustrated. For example, this linear function model can be... Figure 17 The given equation is y = 0.222x + 2.778, where x represents the size of the load as input and y represents the size of the supply voltage as output.

[0366] It is necessary to understand that Figure 17 The linear function model shown is only one possible example. In actual implementation, the specific implementation of the model can be determined according to actual needs. This embodiment does not impose any restrictions on this.

[0367] Reference Figure 17 It can be determined that, based on this linear function model, the second supply voltage is 5V when the load is 10% and 25V when the load is 100%.

[0368] Next, we will explain some of the implementation methods for determining the second power supply duration:

[0369] In one implementation, the second power supply duration is equal to the duration of the operation phase. This allows for continuous cooling of the device during operation, ensuring effective heat dissipation.

[0370] Alternatively, the power supply parameters in the rule mapping table can also include power supply duration, allowing the determination of the power supply duration corresponding to each of the multiple load levels based on the rule mapping table. For example, the power supply duration for a load range greater than 80% and less than or equal to 100% can be set to 20 seconds. This embodiment does not impose any restrictions on the specific value of the power supply duration corresponding to the load level.

[0371] Alternatively, a function model can be set to determine the power supply duration, which can also be determined using a linear function model. For example, the linear function model is y = 15x + 5, where x represents the load size as input and y represents the power supply duration as output. When the load is 20%, the second power supply duration is 8 seconds, and when the load is 100%, the second power supply duration is 20 seconds. The specific implementation of the model can be determined according to actual needs, and this embodiment does not impose any restrictions on it.

[0372] In this way, when the duration of each operating phase is inconsistent with the corresponding power supply duration, power can be supplied during the specified power supply period. Since the second power supply duration is determined in conjunction with the load information of the operating phase, it can better guide the power supply unit on how to supply power, thus improving the heat dissipation effect.

[0373] Furthermore, the determination of the second power supply voltage and the second power supply duration in the first parameter can also be performed using an end-to-end prediction method. For example, a model-based prediction method can be used. This model can be a pre-trained machine learning model. The model's input can be various information related to the first application, and the model's output is the power supply voltage and power supply duration for each stage. The relevant information of the first application can include, for example, application type, sub-type, startup load, running load, background operation, and memory usage. The training data for the end-to-end prediction model, especially the labeled data, can be obtained, for example, through relevant heat dissipation experimental data and manual annotation. For instance, for a certain application, the first stage power supply voltage is 10V and the power supply duration is 8 seconds, and the second stage power supply voltage is 15V and the power supply duration is 10 seconds. This embodiment does not limit the specific form of the end-to-end model, input features, training data, or methods.

[0374] S1503: The processor control power supply unit supplies power to the heat dissipation unit according to the second power supply voltage and starts the second timer so that the heat dissipation unit can dissipate heat from the processor.

[0375] For details on this step, please refer to S804; it will not be repeated here.

[0376] S1504. When the second timer reaches the second power supply duration, the processor controls the power supply unit to adjust the power supply voltage to the heat dissipation unit. The second power supply duration is equal to the duration of the running phase.

[0377] For details on this step, please refer to S805; it will not be repeated here.

[0378] In the above introduction Figure 15 Based on the heat dissipation process included in the previous section, the following is a further summary and explanation.

[0379] In this embodiment, a more direct multi-stage load prediction method is adopted, that is, the first parameter is obtained directly by predicting the multi-stage load. The first parameter can also be obtained by the end-to-end prediction method described above. In practical use, the process of determining the first parameter can be effectively simplified.

[0380] Furthermore, the model-based method for determining the first parameter described above allows for different outputs for any given input. For example, in the linear function model, as the input load increases, the output supply voltage or supply duration also increases. This enables more detailed and precise control of the supply voltage and supply duration in the first parameter, thereby optimizing heat dissipation and reducing energy consumption.

[0381] It should be noted that the module names involved in the embodiments of this application can all be defined as other names, as long as they can achieve the function of each module, and no specific restrictions are placed on the module names.

[0382] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, stored data, displayed data, etc.) involved in the embodiments of this application are all information and data authorized by the user or fully authorized by all parties. Furthermore, the collection, use and processing of related data must comply with the relevant laws, regulations and standards of the relevant countries and regions, and corresponding operation entry points are provided for users to choose to authorize or refuse.

[0383] The heat dissipation method of the present application has been described above. The apparatus for performing the above method provided in the embodiments of the present application is described below. Those skilled in the art will understand that the methods and apparatus can be combined with and referenced by each other, and the related apparatus provided in the embodiments of the present application can perform the steps in the above heat dissipation method.

[0384] The heat dissipation method provided in this application can be applied to electronic devices equipped with a System-on-a-Chip (SOC). Electronic devices include terminal devices; the specific device form of the terminal device can be referred to the above-described related features, and will not be repeated here.

[0385] In one implementation, this application provides an electronic device. Figure 18 This is a schematic diagram of the hardware structure of the electronic device provided in the embodiments of this application.

[0386] like Figure 18 As shown, the electronic device 180 includes: a processor 1801 and a memory 1802; the memory 1802 stores computer execution instructions; the processor 1801 executes the computer execution instructions stored in the memory 1802, causing the electronic device 180 to perform the above-described method.

[0387] When the memory 1802 is set up independently, the electronic device also includes a bus 1803 for connecting the memory 1802 and the processor 1801.

[0388] This application provides a chip. The chip includes a processor, which is used to call a computer program in memory to execute the technical solutions in the above embodiments. Its implementation principle and technical effects are similar to those in the related embodiments described above, and will not be repeated here.

[0389] This application also provides a computer-readable storage medium. The computer-readable storage medium stores a computer program. When the computer program is executed by a processor, it implements the methods described above. The methods described in the above embodiments can be implemented wholly or partially by software, hardware, firmware, or any combination thereof. If implemented in software, the functionality can be stored as one or more instructions or code on or transmitted over the computer-readable medium. The computer-readable medium can include computer storage media and communication media, and can also include any medium that can transfer a computer program from one place to another. The storage medium can be any target medium accessible by a computer.

[0390] In one possible implementation, a computer-readable medium may include RAM, ROM, compact disc read-only memory (CD-ROM) or other optical disc storage, disk storage or other magnetic storage devices, or any other medium targeted to carry or to store the required program code in the form of instructions or data structures, and accessible by a computer. Furthermore, any connection is appropriately referred to as a computer-readable medium. For example, if software is transmitted from a website, server, or other remote source using coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave, then coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of medium. As used herein, disks and optical discs include optical discs, laser discs, optical discs, Digital Versatile Discs (DVDs), floppy disks, and Blu-ray discs, where disks typically reproduce data magnetically, while optical discs optically reproduce data using lasers. Combinations of the above should also be included within the scope of computer-readable media.

[0391] This application provides a computer program product, which includes a computer program that, when run, causes a computer to perform the above-described method.

[0392] This application describes embodiments of methods, apparatus (systems), and computer program products according to embodiments of this application with reference to flowchart illustrations and / or block diagrams. It should be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processing unit of a general-purpose computer, special-purpose computer, embedded processor, or other programmable device to produce a machine, such that the instructions, which execute via the processing unit of the computer or other programmable data processing device, generate instructions for implementing the flowchart illustrations. Figure 1One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0393] The above specific embodiments further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above are merely specific embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made on the basis of the technical solution of the present invention should be included within the scope of protection of the present invention.

Claims

1. A heat dissipation device, characterized in that, include: Heat dissipation unit, processor, and power supply unit; The power supply unit is connected to the heat dissipation unit and is used to supply power to the heat dissipation unit; and the power supply unit is also connected to the processor and is used to supply power to the processor. The heat dissipation unit is disposed on one side of the processor and is used to dissipate heat from the processor; The processor is used to control the power supply unit to supply power to the heat dissipation unit based on the first parameter.

2. The apparatus according to claim 1, characterized in that, The heat dissipation unit is disposed between the screen of the electronic device and the processor.

3. The apparatus according to claim 2, characterized in that, The heat dissipation unit is a thermoelectric sensor, which is used to control the formation of a temperature difference between the first plane and the second plane of the thermoelectric sensor according to the power supply of the power supply unit.

4. The apparatus according to claim 3, characterized in that, The first plane is the side of the thermoelectric sensor closest to the processor, and the second plane is the side of the thermoelectric sensor closest to the screen. The temperature of the first plane is lower than the temperature of the second plane.

5. The apparatus according to any one of claims 1-4, characterized in that, Thermal conductive gel is also provided between the heat dissipation unit and the processor.

6. The apparatus according to any one of claims 1-5, characterized in that, The power supply unit includes a power source, a management unit, a first voltage conversion unit, and a second voltage conversion unit; The power supply is connected to the thermoelectric sensor via the management unit and the first voltage conversion unit connected in sequence, so as to supply power to the thermoelectric sensor; The power supply is connected to the processor via the management unit and the second voltage conversion unit, which are connected in sequence, to supply power to the processor.

7. The apparatus according to any one of claims 1-6, characterized in that, The first parameter includes the power supply voltage and the power supply duration; the first parameter is determined based on the first strategy.

8. A heat dissipation treatment method, characterized in that, The invention is applied to an electronic device, which includes a heat dissipation unit, a processor, and a power supply unit, with the heat dissipation unit disposed on one side of the processor. The method includes: In response to the launch of the first application, determine the first parameter; Based on the first parameter, the power supply unit is controlled to supply power to the heat dissipation unit so that the heat dissipation unit can perform heat dissipation treatment on the processor.

9. The method according to claim 8, characterized in that, The response to the launch of the first application determines the first parameter, including: In response to the launch of the first application, the first parameter corresponding to the first application is obtained.

10. The method according to claim 9, characterized in that, The whitelist data records the power supply parameters corresponding to each of the multiple applications. The step of obtaining the first parameter corresponding to the first application in response to the launch of the first application includes: In response to the launch of the first application, the first parameter corresponding to the first application is obtained from the whitelist data.

11. The method according to claim 10, characterized in that, The first parameter includes a first power supply voltage and a first power supply duration; The step of controlling the power supply unit to supply power to the heat dissipation unit based on the first parameter includes: The power supply unit is controlled to supply power to the heat dissipation unit according to the first power supply voltage, and the first timer is started; When the first timer reaches the first power supply duration, the power supply unit is controlled to stop supplying power to the heat dissipation unit.

12. The method according to claim 9, characterized in that, The step of obtaining the first parameter corresponding to the first application in response to the launch of the first application includes: In response to the startup of the first application, predict the load information of multiple running stages of the first application; Based on the load information of the multiple operating stages, the first parameter of each of the multiple operating stages is determined.

13. The method according to claim 12, characterized in that, The step of determining the first parameter for each of the plurality of operating stages based on the load information of the plurality of operating stages includes: Based on the load information of the multiple operating phases, determine the load level of the multiple operating phases; based on the correspondence between the load level and the power supply parameters, determine the first parameter of each of the multiple operating phases; or, Based on the load information of the multiple stages and the correspondence between the load information and the power supply parameters, the first parameter of each of the multiple operating stages is determined.

14. The method according to claim 12 or 13, characterized in that, For any one of the plurality of operating stages, the first parameter corresponding to the operating stage includes the second power supply voltage and the second power supply duration; The step of controlling the power supply unit to supply power to the heat dissipation unit based on the first parameter includes: The power supply unit is controlled to supply power to the heat dissipation unit according to the second power supply voltage, and the second timer is started; When the second timer reaches the second power supply duration, the power supply unit is controlled to adjust the power supply voltage supplied to the heat dissipation unit.

15. The method according to claim 14, characterized in that, The second power supply duration is equal to the duration of the operation phase.

16. An electronic device, characterized in that, The electronic device includes: one or more processors and memory; The memory is coupled to the one or more processors, the memory being used to store computer program code, the computer program code including computer instructions, the one or more processors invoking the computer instructions to cause the electronic device to perform the method as described in any one of claims 8 to 15.

17. A chip system, characterized in that, The chip system is applied to an electronic device, the chip system including one or more processors, the one or more processors being used to invoke computer instructions to cause the electronic device to perform the method as described in any one of claims 8 to 15.

18. A computer-readable storage medium, characterized in that, The computer-readable storage medium includes computer instructions that, when executed on an electronic device, cause the electronic device to perform the method as described in any one of claims 8 to 15.

19. A computer program product, characterized in that, The computer program product includes computer program code that, when run on an electronic device, causes the electronic device to perform the method as described in any one of claims 8 to 15.

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