Energy storage and heat dissipation electronic equipment shell

Abstract

The invention discloses an energy storage and heat dissipation electronic equipment shell, a seeker power supply and electronic equipment. The shell comprises a circuit board, a shell body, a VC vapor chamber, copper alloy cooling fins, a cover plate and a high-enthalpy-value phase change energy storage material. The interior of the shell body is divided into an upper cavity and a lower cavity which are mutually independent through a partition plate, a circuit board is arranged in the upper cavity, and a heating device on the circuit board is tightly attached to the upper surface of the partition plate through a heat conduction interface material. In the lower cavity, the upper surface of the VC vapor chamber is fixedly welded to the lower surface of the partition plate, the upper surfaces of the cooling fins are fixedly welded to the lower surface of the VC vapor chamber, the cover plate is fixed to the edge of an opening of the lower cavity through welding so as to seal the lower cavity, and energy storage materials attached to the surfaces of the cooling fins are injected into the cavity. The energy storage material can absorb heat and change phases, latent heat is used for absorbing heat consumption, the temperature of the electronic equipment can be kept constant in a short time, and good heat dissipation and temperature equalization effects are achieved.

Description

Technical Field

[0001] This application relates to the field of equipment heat dissipation, and more particularly to a housing for an energy storage heat dissipation electronic device. Background Technology

[0002] With the development of technology and market demand, electronic devices are evolving towards miniaturization, lightweighting, high power, and multifunctionality. Therefore, the requirements for heat dissipation structures in power supplies are becoming increasingly stringent. Taking a seeker power supply as an example, this power supply has a concentrated heat source, high heat flux density, and short operating time. Due to the special operating environment of the seeker power supply, the heat it generates cannot be conducted externally and needs to be dissipated and evenly by the power supply casing to maintain the temperature within the normal range during the specified operating time. Therefore, the heat dissipation design of the seeker power supply casing is optimized, mainly in the following two aspects: firstly, optimizing the thermal conductivity of the casing; and secondly, increasing the heat absorption capacity of energy storage materials. Summary of the Invention

[0003] The main objective of this application is to provide a housing for an energy storage and heat dissipation electronic device, which aims to maintain a constant temperature for a short period of time when the temperature of the electronic device rises to the phase transition temperature.

[0004] To achieve the above objectives, this application provides a housing for an energy storage and heat dissipation electronic device, comprising: a circuit board, a housing, a vapor chamber, heat dissipation fins, and a cover plate; the interior of the housing is divided into an upper cavity and a lower cavity by a partition; the circuit board is disposed in the upper cavity of the housing, and the surfaces of all heat-generating devices on the circuit board are tightly bonded to the upper surface of the partition through a thermally conductive interface material; the vapor chamber is a VC vapor chamber based on the phase change heat transfer principle, and the VC vapor chamber is disposed in the lower cavity of the housing, and the VC... The upper surface of the heat spreader is fixedly connected to the lower surface of the partition by welding; the heat dissipation fins are made of copper alloy and are located in the lower cavity of the shell, with the upper surface of the heat dissipation fins fixedly connected to the lower surface of the heat spreader by welding; the cover plate is fixedly connected to the edge of the lower cavity opening of the shell by welding to seal the lower cavity of the shell, and the lower cavity is filled with energy storage material, which is a high enthalpy phase change material, attached to the surface of the heat dissipation fins. The energy storage material is used for heat absorption phase change, using latent heat to absorb heat loss so that the electronic equipment can maintain a constant temperature.

[0005] Optionally, a material injection hole and a vent hole are provided through the cover plate. The material injection hole is used to inject energy storage material into the lower cavity of the shell, and the vent hole is used to expel air from the lower cavity of the shell during the injection of energy storage material.

[0006] Optionally, both the injection hole and the vent hole are equipped with plugs. The two plugs are connected to the injection hole and the vent hole of the cover plate by threads, so as to seal the injection hole and the vent hole on the cover plate respectively after the energy storage material is injected into the cavity.

[0007] Optionally, the weld between the cover plate and the edge of the opening of the lower cavity of the housing forms a continuous sealing structure to prevent leakage of the energy storage material injected into the lower cavity of the housing.

[0008] Optionally, the quantity, installation location, and size of the housing, heat spreader, heat dissipation fins, and energy storage materials can be adapted and adjusted according to the external dimensions of the circuit board and the location and quantity of the heating modules on the circuit board.

[0009] Optionally, the melting point of the energy storage material is matched with the thermal protection temperature of the heating device on the circuit board to provide high-temperature protection for the heating plate during phase change.

[0010] In addition, to achieve the above objectives, this application also provides a guide head power supply having the energy storage and heat dissipation electronic device housing provided in any of the preceding claims. In addition, to achieve the above objectives, this application also provides an electronic device having the aforementioned guide head power supply.

[0011] This application provides an energy storage and heat dissipation electronic device housing, including a circuit board, a housing, a vapor chamber, heat dissipation fins, and a cover plate. The housing is internally divided into an upper cavity and a lower cavity by a partition. The circuit board is disposed within the upper cavity of the housing, and the surfaces of all heat-generating devices on the circuit board are tightly bonded to the upper surface of the partition through a thermally conductive interface material. The vapor chamber is a VC vapor chamber based on the phase change heat transfer principle, and is disposed within the lower cavity of the housing. The upper surface of the heat spreader plate and the lower surface of the partition plate are fixedly connected by welding. The heat dissipation fins are made of copper alloy and are located in the lower cavity of the shell. The upper surface of the heat dissipation fins is fixedly connected to the lower surface of the heat spreader plate by welding. The cover plate is fixedly connected to the edge of the lower cavity opening of the shell by welding to seal the lower cavity. The lower cavity is filled with energy storage material, which is a high enthalpy phase change material and is attached to the surface of the heat dissipation fins. The energy storage material is used for heat absorption phase change and uses latent heat to absorb heat loss so that the electronic device can maintain a constant temperature. Through the scientific design of the energy storage and heat dissipation electronic device shell, the shell is divided into two parts, upper and lower cavities. The upper cavity is used to install the circuit board, and the lower cavity is used to install the heat spreader plate, heat dissipation fins and energy storage material. The integrated design allows the heat generated by the heat-generating devices on the circuit board to be quickly conducted to the entire shell and absorbed by the energy storage material, thereby reducing the overall temperature of the shell and achieving a good energy storage and heat dissipation effect. Attached Figure Description

[0012] Figure 1 This is a bottom view of an embodiment of an energy storage and heat dissipation electronic device housing provided in this disclosure; Figure 2This is a side view of an embodiment of an energy storage and heat dissipation electronic device housing provided in this disclosure; Figure 3 This is an exploded view of an embodiment of an energy storage and heat dissipation electronic device housing provided in this disclosure.

[0013] In the diagram: 1. Circuit board; 2. Housing; 3. Heat spreader; 4. Heat sink fins; 5. Cover plate; 6. Energy storage material; 7. End cap.

[0014] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0015] It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.

[0016] To facilitate understanding of the technical solutions disclosed herein, the present disclosure will be clearly and completely described below with reference to the accompanying drawings and specific embodiments. The following is merely a preferred embodiment of the present disclosure and is not intended to limit the scope of protection of the present disclosure.

[0017] Reference Figure 2 The energy storage and heat dissipation electronic device housing provided in the first embodiment of this application may include: a circuit board 1, a housing 2, a heat spreader 3, heat dissipation fins 4, and a cover plate 5; the housing 2 is divided into an upper cavity and a lower cavity by a partition; the circuit board 1 is disposed in the upper cavity of the housing 2, and the surfaces of all heat-generating devices on the circuit board 1 are tightly attached to the upper surface of the partition through a thermally conductive interface material; the heat spreader 3 is a VC heat spreader based on the phase change heat transfer principle, and the VC heat spreader is disposed in the lower cavity of the housing 2, and the VC heat spreader... The upper surface of the heat spreader plate and the lower surface of the partition plate are fixedly connected by welding. The heat dissipation fins 4 are made of copper alloy and are located in the lower cavity of the housing 2. The upper surface of the heat dissipation fins 4 is fixedly connected to the lower surface of the heat spreader plate 3 by welding. The cover plate 5 is fixedly connected to the edge of the lower cavity opening of the housing 2 by welding to seal the lower cavity of the housing 2. The lower cavity is filled with energy storage material 6, which is a high enthalpy phase change material and is attached to the surface of the heat dissipation fins 4. The energy storage material 6 is used for heat absorption phase change and uses latent heat to absorb heat loss so that the electronic equipment can maintain a constant temperature.

[0018] In this embodiment, the heat dissipation path of the heat-generating device on the circuit board 1 is as follows: First, the heat dissipation is transferred to the partition plate of the housing 2 through the thermally conductive interface material; then, it diffuses on the partition plate to the heat spreader. Due to the high thermal conductivity of the heat spreader 3, the heat dissipation rapidly diffuses to the entire partition plate, the heat spreader 3, and the heat dissipation fins 4 welded and fixed to the heat spreader 3. Afterward, the heat dissipation is transferred to the energy storage material 6 attached to the heat dissipation fins 4. As the heat dissipation increases, the temperature of the energy storage material also increases. When the temperature of the energy storage material rises to the phase change temperature, the material absorbs heat and undergoes a phase change, utilizing latent heat to absorb the heat dissipation. Since the phase change process is approximately isothermal, the electronic device can maintain a constant temperature for a short period of time.

[0019] It should be noted that the VC vapor chamber is a passive heat dissipation element based on the principle of phase change heat transfer. It has an ultra-high thermal conductivity and three-dimensional heat diffusion capability, which can rapidly dissipate local heat on the partition to the entire partition and the entire vapor chamber. The heat dissipation fins 4 can conduct heat from the vapor chamber to themselves. The heat dissipation fins 4 not only increase the heat dissipation area, but also provide support for the energy storage material.

[0020] In one embodiment of this application, a material injection hole and a vent hole are provided through the cover plate 5. The material injection hole is used to inject energy storage material 6 into the lower cavity of the housing 2, and the vent hole is used to discharge air from the lower cavity of the housing 2 during the injection of energy storage material 6.

[0021] Both the injection hole and the vent hole are equipped with plugs 7. The two plugs 7 are connected to the injection hole and the vent hole of the cover plate 5 by threads, so as to seal the injection hole and the vent hole on the cover plate 5 respectively after the energy storage material 6 is injected into the lower cavity.

[0022] like Figure 1 , Figure 2 and Figure 3 As shown, a preferred embodiment of this disclosure provides a housing for an energy storage and heat dissipation electronic device, comprising a circuit board 1, a housing 2, a heat spreader 3, heat dissipation fins 4, a cover plate 5, energy storage material 6, and a plug 7. The housing 2 is divided into an upper and lower cavity by a partition. The circuit board 1 is fixed to the upper cavity of the housing 2 with screws. The surface of the heat-generating device on the circuit board is in close contact with the upper surface of the partition plate of the housing 2 through a thermally conductive interface material. The heat spreader 3 is mounted in the lower cavity of the housing 2 and fixed to the lower surface of the partition plate by welding. Similarly, the heat dissipation fins 4 are mounted in the lower cavity of the housing 2 and fixed to the lower surface of the heat spreader by welding. The cover plate 5 seals the lower cavity of the housing by welding, and then the energy storage material 7 is injected through an opening in the cover plate. Finally, a plug is used to seal the opening in the cover plate.

[0023] In this embodiment, the cover plate 5 is used to encapsulate the lower cavity of the housing 2. The cover plate is designed with two through holes. One through hole is used to inject energy storage material, and the other hole is used to vent air when injecting energy storage material. The plug 7 is connected to the opening of the cover plate 5 by thread. After the plug is installed, it is welded to the opening of the cover plate for sealing. Since the energy storage material is in liquid form when injected and its physical state changes when a phase change occurs, a leakage check is required after the encapsulation is completed.

[0024] In one embodiment of this application, the weld between the cover plate 5 and the edge of the lower cavity opening of the housing 2 forms a continuous sealing structure to prevent leakage of the energy storage material 6 injected into the lower cavity of the housing 2.

[0025] The quantity, installation position, and size of the shell 2, heat spreader 3, heat dissipation fins 4, and energy storage material 6 are all adapted and adjusted according to the external dimensions of the circuit board 1 and the position and quantity of the heating modules on the circuit board 1.

[0026] Among them, the melting point of the energy storage material 6 is compatible with the thermal protection temperature of the heating device on the circuit board 1, which can provide high-temperature protection for the heating plate when a phase change occurs.

[0027] In this embodiment, the quantity, position, and size of the housing 2, the heat spreader 3, the heat dissipation fins 4, and the energy storage material 6 can be adjusted according to the position and quantity of the circuit board and its heating module. The housing 2, the heat spreader 3, and the heat dissipation fins 4 are welded together in an integrated design. Thanks to the high thermal conductivity of the heat spreader 3, heat loss can be quickly conducted to various components, keeping the overall temperature difference of the electronic device housing within a small range, thereby reducing the temperature of the heating devices on the circuit board 1. Furthermore, the energy storage material 6 needs to be selected based on the thermal protection temperature of the heating devices. This is because the energy storage material 6 mainly absorbs a large amount of heat loss through phase change. If the selected energy storage material 6 has a too high melting point, the heating device may be under high-temperature protection before the phase change occurs. If the selected energy storage material 6 has a too low melting point, its heat absorption capacity may not meet the requirements.

[0028] Compared with the prior art, this application provides a housing for energy storage and heat dissipation electronic devices, which has the following beneficial effects: the housing is scientifically designed, dividing the housing into two parts, upper and lower cavities. The upper cavity houses the circuit board, and the lower cavity houses the heat dissipation plate, heat sink fins, and energy storage material. This integrated design allows the heat generated by the heat-generating devices on the circuit board to be quickly conducted to the entire housing, and a large amount of heat is absorbed by the energy storage material, thereby reducing the overall temperature of the housing and achieving a good energy storage and heat dissipation effect.

[0029] The second embodiment of this application provides a guide head power supply having the energy storage and heat dissipation electronic device housing provided in any of the preceding claims. The third embodiment of this application provides an electronic device having the previously provided guide head power supply.

[0030] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A housing for an energy storage and heat dissipation electronic device, characterized in that, include: Circuit board (1), housing (2), heat spreader (3), heat dissipation fins (4) and cover plate (5); The interior of the shell (2) is divided into an independent upper cavity and a lower cavity by a partition; The circuit board (1) is disposed in the upper cavity of the housing (2), and the surfaces of all heating devices on the circuit board (1) are tightly attached to the upper surface of the partition through a thermally conductive interface material. The heat exchange plate (3) is a VC heat exchange plate based on the phase change heat transfer principle. The VC heat exchange plate is set in the lower cavity of the shell (2), and the upper surface of the VC heat exchange plate is fixedly connected to the lower surface of the partition by welding. The heat dissipation fins (4) are made of copper alloy. The heat dissipation fins (4) are located in the lower cavity of the shell (2), and the upper surface of the heat dissipation fins (4) is fixedly connected to the lower surface of the heat exchange plate (3) by welding. The cover plate (5) is fixedly connected to the edge of the lower cavity opening of the housing (2) by welding to seal the lower cavity of the housing (2). The lower cavity is filled with energy storage material (6). The energy storage material (6) is a high enthalpy phase change material and is attached to the surface of the heat dissipation fins (4). The energy storage material (6) is used for heat absorption phase change and uses latent heat to absorb heat loss so that the electronic device can maintain a constant temperature.

2. The energy storage and heat dissipation electronic device housing as described in claim 1, characterized in that, The cover plate (5) has a through-hole for injecting material and a vent hole. The injection hole is used to inject energy storage material (6) into the lower cavity of the shell (2), and the vent hole is used to discharge air from the lower cavity of the shell (2) during the injection of energy storage material (6).

3. The energy storage and heat dissipation electronic device housing as described in claim 1, characterized in that, Both the injection hole and the vent hole are equipped with plugs (7). The two plugs (7) are connected to the injection hole and the vent hole of the cover plate (5) by threads, so as to seal the injection hole and the vent hole on the cover plate (5) respectively after the energy storage material (6) is injected into the lower cavity.

4. The energy storage and heat dissipation electronic device housing as described in claim 1, characterized in that, The weld between the cover plate (5) and the edge of the lower cavity opening of the shell (2) forms a continuous sealing structure to prevent leakage of the energy storage material (6) injected into the lower cavity of the shell (2).

5. The energy storage and heat dissipation electronic device housing as described in claim 1, characterized in that, The quantity, installation position, and size of the housing (2), heat spreader (3), heat dissipation fins (4), and energy storage material (6) are all adapted and adjusted according to the external dimensions of the circuit board (1) and the position and quantity of the heating modules on the circuit board (1).

6. The energy storage and heat dissipation electronic device housing as described in claim 1, characterized in that, The melting point of the energy storage material (6) is adapted to the thermal protection temperature of the heating device on the circuit board (1) so as to provide high-temperature protection for the heating plate when a phase change occurs.

7. A seeker power supply, characterized in that, It has a housing for an energy storage and heat dissipation electronic device as described in any one of claims 1-6.

8. An electronic device having a seeker power supply as claimed in claim 7.

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