Semiconductor chip etching apparatus

Abstract

The application discloses a semiconductor chip etching device, which comprises an etching box, a driving mechanism for driving the wafer fixing mechanism to move, and a layered assembly in the etching box. The driving mechanism comprises a lifting assembly and a rotating assembly. The rotating assembly comprises a rotating seat and a vertical rod. The vertical rod penetrates through the rotating seat. A plurality of horizontal plates are arranged on the vertical rod. An upper rotating column penetrates through the horizontal plates. The upper rotating column is connected with the top of the wafer fixing mechanism. The layered assembly comprises a plurality of parallel distributed partition plates and a bottom plate welded with the inner wall of the etching box. A fixing cylinder penetrates through the center of the partition plate and the bottom plate. The etching box is divided into a plurality of etching areas. The wafers are dispersed in the etching areas. The wafer etching work in each etching area does not interfere with each other. The concentration of the reactant in the etching liquid in each etching area is low, so that the wafer etching device can effectively reduce the situation that the reactant is attached to the wafer.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more specifically, to a semiconductor chip etching apparatus. Background Technology

[0002] Wafer etching is a critical step in semiconductor manufacturing. It typically involves removing specific materials from the wafer surface using wet or dry etching methods to achieve pattern transfer and structural finishing. Wet etching relies on the reaction between a chemical solution and the material being etched to remove the material. This process demands high precision in etching rate, etching endpoint control, and the uniformity of pattern edge morphology. Slight errors can introduce defects such as under-etching, over-etching, or pattern distortion, affecting device performance and yield.

[0003] In existing wet etching processes, multiple wafers are often arranged at high density and immersed as a whole in the etching solution. The flow of the etching solution helps to reduce local concentration differences and minimize etching deviations. However, after the wafer surface material is etched, a certain amount of reactants and byproducts are generated. These reactants first accumulate in localized areas around the wafer and then diffuse to surrounding areas with the circulation of the etching solution, causing the reactant concentration in the etching solution near the wafer to gradually increase. As the reactants continuously contact the wafer surface with the flow, they are prone to re-adhere to the wafer surface. Even when the etching solution is in a flowing state, it is difficult to remove them in a timely and sufficient manner, resulting in a decrease in local etching rate, uneven etching depth, and consequently, surface defects and even affecting subsequent process windows.

[0004] To address these issues, existing devices often enhance solution renewal by increasing the etchant flow rate, optimizing the flow channel structure, or adding agitation and spraying. However, in situations with dense wafer distribution or limited etching space, the accumulation of localized reactants remains difficult to completely prevent, and the etching uniformity between different locations on the wafer and between different areas within the same wafer is still challenging to guarantee. Furthermore, simply relying on increasing the flow rate introduces new problems such as increased reagent consumption, exacerbated equipment corrosion, and unstable flow field. In summary, current semiconductor chip etching devices still have shortcomings in suppressing reactant accumulation in the etchant and re-adhesion on the wafer surface, improving etching efficiency, and ensuring etching uniformity across multiple wafers, requiring further improvement. Summary of the Invention

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art or related art.

[0006] Therefore, the object of the present invention is to provide a semiconductor chip etching apparatus, including an etching chamber, a drive mechanism for moving a wafer fixing mechanism, and a layering assembly located within the etching chamber.

[0007] The driving mechanism includes a lifting assembly and a rotating assembly. The rotating assembly includes a rotating base and a vertical rod. The top of the vertical rod passes through the rotating base. Multiple horizontal plates are arranged on the vertical rod, and an upper rotating column passes through each horizontal plate. The upper rotating column is connected to the top of the wafer fixing mechanism. A lower rotating column is connected to the bottom of the upper rotating column, and a secondary rotor is arranged on the lower rotating column.

[0008] The layered assembly includes multiple parallel partitions and a base plate welded and fixed to the inner wall of the etching tank. A fixing cylinder penetrates the center of each partition and the base plate. A fixing seat is provided on the topmost partition, and a set of main rotors is movably connected to the fixing seat.

[0009] An etched zone is formed between two adjacent partitions and between a partition and a bottom plate. A first through hole is provided on the fixed cylinder at the etched zone. A circulation mechanism is also provided on the etched box.

[0010] As a preferred technical solution:

[0011] As described above, in a semiconductor chip etching apparatus, the lifting assembly includes a top plate and a set of support frames welded and fixed to the top plate. The bottom ends of the two support frames are welded and fixed by connecting strips. A protrusion passes through the bottom end of the support frame and is fixed to the outer wall of the etching chamber.

[0012] Through the above technical solution, the protrusion can guide the support frame and ensure the accuracy of the vertical movement of the support frame. In this way, when the support frame moves vertically, it can be raised and lowered by the rotating seat driven by the top plate.

[0013] As described above, in a semiconductor chip etching apparatus, the top surface of the rotating base extends downward to form a groove, and the inner wall of the top surface of the rotating base is connected to a bearing on the outer circular wall of the top plate.

[0014] A column is welded and fixed at the center of the rotating seat. The top of the column passes through the top plate and is connected to the output shaft of the first drive motor. The first drive motor is fixed on the top plate.

[0015] Through the above technical solution, the rotating seat and the top plate are combined to form a hollow cylindrical structure, so that the internal space can accommodate components such as the gear ring.

[0016] As described above, in a semiconductor chip etching apparatus, the vertical rod is movably connected to a rotating seat bearing, the vertical rod is welded and fixed to a horizontal plate, the top end of the vertical rod is located in a groove and a first gear is fixed thereon with a pin, and a gear ring that meshes with the first gear is movably connected to a bearing on the inner wall of the rotating seat.

[0017] Through the above technical solution, the gear ring can rotate axially on the rotating seat, and then drive the vertical rod to rotate axially through meshing with the first gear.

[0018] A semiconductor chip etching device as described above, wherein the diameter of the partition plate is smaller than the inner wall length of the etching tank, and both the partition plate and the bottom plate are fixedly welded to the fixed cylinder, and the bottom end of the fixed cylinder is open.

[0019] Through the above technical solution, the size design of the partition plate makes there still be a gap between the outer circular surface of the partition plate and the inner wall of the etching tank, so that the wafer fixing mechanism can move in and rotate circumferentially.

[0020] A semiconductor chip etching device as described above, wherein the circulation mechanism includes a first circulation pipe connected to the etching tank and a second circulation pipe connected to the shunt bar. The shunt bar is a hollow "匚" - shaped structure. Four guide columns distributed in a rectangular shape are connected to the shunt bar, and second through - holes are uniformly formed on the guide columns.

[0021] Through the above technical solution, there are four guide columns in total, and they are arranged around the etching area, so that the replenished etching liquid can be evenly distributed in the etching area, avoiding the situation of uneven etching liquid concentration in the etching area.

[0022] A semiconductor chip etching device as described above, wherein the shunt bar is fixed to the top of the etching tank. The guide columns are vertically arranged as a whole. The bottom ends of the guide columns are in contact with the surface of the bottom plate. The shunt bar and the guide columns are integrally formed, and the connection part between the shunt bar and the guide columns is through - connected.

[0023] Through the above technical solution, the shunt bar and the guide columns are through - connected, so that the etching liquid introduced into the shunt bar can be shunted into each guide column.

[0024] A semiconductor chip etching device as described above, wherein the fixed seat is a hollow structure. A transmission column connected to it by a bearing penetrates through the top wall of the fixed seat, and the top end of the transmission column is connected to the main rotor.

[0025] A second gear is fixed by a snap - pin on the end face of the transmission column located in the fixed seat. A second driving motor is fixed on the top surface of the fixed seat. The output shaft of the second driving motor extends into the fixed seat and is fixed by a snap - pin with a transmission gear, and the transmission gear meshes with the second gear.

[0026] Through the above technical solution, a protective cover is sleeved outside the second driving motor to avoid being corroded by the etching liquid, thereby increasing the service life and working stability of the second driving motor.

[0027] As described above, in a semiconductor chip etching apparatus, the wafer fixing mechanism includes a first fixing rod and a second fixing rod arranged in a ring. The first fixing rod and the second fixing rod are provided with slots for fixing the wafer. The first fixing rod is integrally formed with a fixing strip. Mounting strips are integrally formed at both ends of the fixing strip. The mounting strips are provided with multiple mounting holes.

[0028] With the above technical solution, the distribution design of the first fixing rod and the second fixing rod, the first fixing rod and the second fixing rod are firmly clamped by the slots on them, so that the wafer will not shake during the etching process, ensuring the uniformity of etching.

[0029] As described above, in a semiconductor chip etching apparatus, an upper mounting plate is integrally formed at the top of the second fixing rod, and an upper rotating column connected to a bearing passes through the upper mounting plate. The upper rotating column is connected to a horizontal plate bearing. A lower mounting plate is integrally formed at the bottom of the second fixing rod, and a lower rotating column is fixed to the bottom of the lower mounting plate.

[0030] The upper and lower mounting plates are fitted with a fixing frame for fixed bonding, and a plurality of limiting rods protrude from one side of the fixing frame.

[0031] With the above technical solution, the lower rotating column and the upper rotating column are coaxial, so when the lower rotating column is subjected to the transmitted torque, the upper rotating column can drive the wafer fixing mechanism to rotate.

[0032] Compared with the prior art, the present invention has at least the following beneficial effects:

[0033] (1) The synergistic effect of the layering component and the circulation mechanism improves etching efficiency. This invention adopts an innovative combination of a layering component and a circulation mechanism. The layering component divides the interior of the etching chamber into multiple independent etching zones, with wafers evenly distributed in each zone, avoiding mutual interference. Through precise control of the circulation mechanism, the etching solution can flow continuously in each etching zone, ensuring that reactants do not accumulate on the wafer surface. The synergistic effect of layering and circulation effectively improves the utilization efficiency of the etching solution, reduces the adhesion and uneven concentration of reactants, thereby improving the overall etching quality and efficiency.

[0034] (2) By controlling the wafer movement through the joint operation of the lifting and rotating components, etching uniformity is enhanced. The coordinated work of the lifting and rotating components allows the wafer to be precisely lifted and rotated within the etching chamber. The lifting component precisely controls the height of the wafer, while the rotating component ensures that the wafer rotates uniformly around the fixed cylinder during the etching process. The combination of the two results in more uniform contact between the wafer surface and the etching solution, reducing the accumulation of local reactants and improving the uniformity of the etching effect. Through the coordination of rotation and lifting, the processing accuracy of the wafer during the process is greatly improved.

[0035] (3) Automatic wafer cleaning is achieved through the combination of magnetic drive and rotation mechanism. This invention enables the wafer fixing mechanism to automatically rotate after etching, dislodging residual etching solution from the surface, through the magnetic drive mechanism between the main rotor and the secondary rotor. The precise coordination between magnetic drive and rotation mechanism not only reduces the complexity of mechanical transmission components but also improves the reliability and cleanliness of the equipment. The automatic cleaning function reduces liquid waste, prevents etching solution contamination, and effectively extends the service life of the equipment, demonstrating an innovative power transmission method. Attached Figure Description

[0036] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0037] Figure 1 This is a front view of the present invention;

[0038] Figure 2 This is a perspective view of the present invention;

[0039] Figure 3 This is an internal front view of the invention in its working state;

[0040] Figure 4 This is an internal perspective view of the present invention in its working state;

[0041] Figure 5 This is an internal front view of the main rotor and secondary rotor of the present invention when they are aligned;

[0042] Figure 6 This is an internal perspective view of the main rotor and secondary rotor of the present invention when they are aligned;

[0043] Figure 7 This is a perspective view of the flow divider and guide column of the present invention;

[0044] Figure 8 This is a perspective view of the interior of the fixing base of the present invention;

[0045] Figure 9 This is a perspective view of the wafer fixing mechanism of the present invention.

[0046] In the diagram: 1. Etching tank; 2. Support frame; 3. Top plate; 4. Rotating seat; 5. Connecting strip; 6. Vertical rod; 7. Gear ring; 8. Column; 9. First drive motor; 10. Horizontal plate; 11. Upper rotating column; 12. Lower rotating column; 13. Secondary rotor; 14. Partition plate; 15. Bottom plate; 16. Fixed cylinder; 17. First through hole; 18. First circulation pipe; 19. Second circulation pipe; 20. Diverter strip; 21. Guide column; 22. Second through hole; 23. Fixed seat; 24. Second drive motor; 25. Transmission gear; 26. Transmission column; 27. Main rotor; 28. First fixed rod; 29. ​​Second fixed rod; 30. Slot; 31. Fixed strip; 32. Upper mounting plate; 33. Lower mounting plate; 34. Mounting strip; 35. Fixed frame; 36. Mounting hole; 37. Limiting rod; 38. Protrusion. Detailed Implementation

[0047] To better understand the above-mentioned objectives, features, and advantages of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0048] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and therefore the scope of protection of the invention is not limited to the specific embodiments disclosed below.

[0049] like Figures 1-6 As shown, an embodiment of the present invention discloses a semiconductor chip etching apparatus, including an etching chamber 1, a drive mechanism for moving a wafer fixing mechanism, and a layering assembly located within the etching chamber 1.

[0050] The drive mechanism includes a lifting assembly and a rotating assembly. The rotating assembly includes a rotating base 4 and a vertical rod 6. The top of the vertical rod 6 passes through the rotating base 4. Multiple horizontal plates 10 are provided on the vertical rod 6. An upper rotating column 11 passes through the horizontal plates 10. The upper rotating column 11 is connected to the top of the wafer fixing mechanism. A lower rotating column 12 is connected to the bottom of the upper rotating column 11. A secondary rotor 13 is provided on the lower rotating column 12.

[0051] The layered assembly includes multiple parallel partitions 14 and a base plate 15 welded and fixed to the inner wall of the etching chamber 1. A fixed cylinder 16 passes through the center of both the partitions 14 and the base plate 15. A fixed seat 23 is provided on the topmost partition 14, and a set of main rotors 27 are movably connected to the fixed seat 23.

[0052] An etched zone is formed between two adjacent partitions 14 and between partition 14 and bottom plate 15. A first through hole 17 is provided on the fixed cylinder 16 at the etched zone. A circulation mechanism is also provided on the etched box 1.

[0053] Specifically, during implementation, the wafer can be fixed on the wafer fixing mechanism. The lifting component drives the wafer fixing mechanism to move through the rotating component, and moves the wafer fixing mechanism into the etching chamber 1. The rotating component drives the wafer fixing mechanism to rotate circumferentially, so that the wafer fixing mechanism can rotate into the etching area. The wafer on the wafer fixing mechanism reacts with the etching solution, and the reactants generated by the reaction diffuse into the surrounding etching solution.

[0054] At this time, the etchant in the etching area can be driven to flow through the circulation mechanism and flow radially along the fixed cylinder 16. At the same time, the rotating component drives the wafer fixing mechanism to move in a circular motion around the fixed cylinder 16.

[0055] The reactants produced by the reaction will diffuse around the wafer. At this time, the wafer fixing mechanism can move the wafer away from the diffusion area by rotating, and the reactants in the area can be carried away by the flow of the etching solution. Since the flow direction of the etching solution and the movement direction of the wafer are different, the reactants will not adhere to the wafer surface when they flow with the etching solution, which is beneficial to the etching uniformity of the wafer.

[0056] like Figure 5-6 As shown, after etching is completed, the rotating component drives the wafer fixing mechanism to rotate out of the etching area, and the lifting component drives the wafer fixing mechanism to move upward through the rotating component. When one of the wafer fixing mechanisms moves above the fixing seat 23, the rotating component drives the wafer fixing mechanism to rotate, so that the secondary rotor 13 and the main rotor 27 are aligned vertically.

[0057] When the main rotor 27 rotates, the magnets on the main rotor 27 generate a magnetic field. This magnetic field rotates along with the main rotor 27, forming a rotating magnetic field.

[0058] The rotating magnetic field acts on the magnet on the secondary rotor 13. Due to the magnetic field, the magnet on the secondary rotor 13 is subjected to magnetic force and begins to rotate.

[0059] As the magnet on the secondary rotor 13 rotates, the entire secondary rotor 13 begins to rotate, thereby realizing the torque transmission from the main rotor 27 to the secondary rotor 13. Power transmission is achieved by means of magnetic field. The overall structure is simple and reduces the complexity of the equipment.

[0060] When the secondary rotor 13 rotates, it can drive the wafer fixing mechanism to rotate around the lower rotating column 12 and the upper rotating column 11. Through rotation, the residual etching solution on the wafer can be thrown off, avoiding waste of the etching solution. At the same time, it can prevent the etching solution from causing pollution during the subsequent wafer transfer process.

[0061] The lifting assembly drives multiple wafer fixing mechanisms to rise gradually through the rotating assembly, and performs etching solution ejection. Finally, the lifting assembly removes multiple wafer fixing mechanisms from the etching chamber 1 to facilitate wafer transfer for subsequent cleaning and other processes.

[0062] In one specific embodiment of the present invention, the lifting assembly includes a top plate 3 and a set of support frames 2 welded and fixed to the top plate 3. The bottom ends of the two support frames 2 are welded and fixed by connecting strips 5. A protrusion 38 passes through the bottom end of the support frame 2 and is fixed to the outer wall of the etching tank 1.

[0063] Specifically, such as Figure 1 and Figure 2 As shown, the etching tank 1 is also equipped with a set of screw jacks (not shown in the figure). The screw passes through the connecting strip 5 and is threadedly connected to the connecting strip 5. When the motor drives the screw to rotate, the screw can push the connecting strip 5 to move vertically. The connecting strip 5 can drive the support frame 2 to move along the protrusion 38. The support frame 2 can drive the top plate 3 to rise and fall.

[0064] In one specific embodiment of the present invention, the top surface of the rotating seat 4 extends downward to form a groove, and the inner wall of the top of the rotating seat 4 is connected to the outer circular wall of the top plate 3 by a bearing.

[0065] A column 8 is welded and fixed at the center of the rotating base 4. The top of the column 8 passes through the top plate 3 and is connected to the output shaft of the first drive motor 9. The first drive motor 9 is fixed on the top plate 3.

[0066] The vertical rod 6 is movably connected to the rotating seat 4 by a bearing. The vertical rod 6 is welded and fixed to the horizontal plate 10. The top of the vertical rod 6 is located in the groove and the first gear is fixed with a pin. The gear ring 7, which meshes with the first gear, is movably connected to the bearing on the inner wall of the rotating seat 4 by a bearing.

[0067] Specifically, such as Figure 1 As shown, a motor is also installed inside the rotating base 4 (not shown in the figure). The motor and the gear ring 7 are driven by gear meshing, which can drive the gear ring 7 to rotate. The gear ring 7 then drives the vertical rod 6 to rotate through meshing with the first gear, thereby realizing that the wafer fixing mechanism rotates around the circumference of the vertical rod 6.

[0068] When the first drive motor 9 is powered on, it can drive the rotating seat 4 to rotate around the top plate 3 through the column 8. The rotating seat 4 then drives the vertical rod 6 to rotate, so that the wafer fixing mechanism can make circular motion around the fixing cylinder 16.

[0069] In one specific embodiment of the present invention, the diameter of the partition 14 is smaller than the inner wall length of the etching tank 1, and both the partition 14 and the bottom plate 15 are welded and fixed to the fixing cylinder 16, the bottom end of the fixing cylinder 16 being open.

[0070] Specifically, such as Figure 3 and Figure 4 As shown in Figure 4 , a recovery cavity can be formed by enclosing the bottom surface of the bottom plate 15 and the inner wall of the bottom end of the etching tank 1. The etching solution mixed with the reactants flows into the fixed cylinder 16 through the first through hole 17 and is centrally introduced into the recovery cavity through the open end at the bottom of the fixed cylinder 16. Filters such as filter meshes can be arranged in the recovery cavity. When the circulation mechanism drives the etching solution in the recovery cavity to circulate, the etching solution can be filtered to ensure the etching effect of the etching solution.

[0071] In a specific embodiment of the present invention, the circulation mechanism includes a first circulation pipe 18 connected to the etching tank 1 and a second circulation pipe 19 connected to the shunt bar 20. The shunt bar 20 is a hollow "匚"-shaped structure. Four guide columns 21 distributed in a rectangular shape are connected to the shunt bar 20, and second through holes 22 are uniformly formed in the guide columns 21.

[0072] The shunt bar 20 is fixed to the top of the etching tank 1. The guide columns 21 are vertically arranged as a whole. The bottom ends of the guide columns 21 are in contact with the surface of the bottom plate 15. The shunt bar 20 and the guide columns 21 are integrally formed, and the connection part between the shunt bar 20 and the guide columns 21 is through.

[0073] Specifically, as Figure 2 、 Figure 4 and Figure 7 shown, a pump valve for transporting the etching solution is provided on the etching tank 1 (not shown in the figure). The liquid inlet end of the pump valve is butted with the first circulation pipe 18, and the liquid outlet end of the pump valve is butted with the second circulation pipe 19. When the pump valve operates, the etching solution in the recovery cavity can be pumped out and sent into the shunt bar 20 through the first circulation pipe 18 and the second circulation pipe 19. The etching solution is shunted into the four guide columns 21 through the shunt bar 20 and uniformly flows into multiple etching areas through the second through holes 22. In cooperation with the fixed cylinder 16 and the first through hole 17, the etching solution in the etching area keeps flowing, ensuring the uniformity of etching.

[0074] In a specific embodiment of the present invention, the fixed seat 23 is a hollow structure. A transmission column 26 connected to it by a bearing penetrates through the top wall of the fixed seat 23, and the top end of the transmission column 26 is connected to the main rotor 27.

[0075] A second gear is fixed by a snap pin on the end face of the transmission column 26 located in the fixed seat 23. A second driving motor 24 is fixed on the top surface of the fixed seat 23. The output shaft of the second driving motor 24 extends into the fixed seat 23 and a transmission gear 25 is fixed by a snap pin. The transmission gear 25 meshes with the second gear.

[0076] Specifically, as Figure 8As shown, after the second drive motor 24 is powered on, it can drive the transmission gear 25 on it to rotate. The transmission gear 25 can drive the transmission column 26 to rotate through the meshing action with the second gear. The main rotor 27 can rotate synchronously with the transmission column 26. In this way, when the main rotor 27 and the secondary rotor 13 are aligned, the main rotor 27 and the secondary rotor 13 can transmit power.

[0077] The main rotor 27 to the secondary rotor 13 are coated with an anti-corrosion coating or fitted with a protective cover to prevent corrosion by the etching solution.

[0078] In one specific embodiment of the present invention, the wafer fixing mechanism includes a first fixing rod 28 and a second fixing rod 29 arranged in a ring. The first fixing rod 28 and the second fixing rod 29 are provided with slots 30 for fixing the wafer. The first fixing rod 28 is integrally formed with a fixing strip 31. The fixing strip 31 is integrally formed with mounting strips 34 at both ends. The mounting strips 34 are provided with a plurality of mounting holes 36.

[0079] The top of the second fixing rod 29 has an integrally formed upper mounting plate 32, through which an upper rotating column 11 connected to its bearing passes. The upper rotating column 11 is connected to the bearing of the horizontal plate 10. The bottom of the second fixing rod 29 has an integrally formed lower mounting plate 33, and the bottom of the lower mounting plate 33 is fixed with a lower rotating column 12.

[0080] The upper mounting plate 32 and the lower mounting plate 33 are fitted with a fixing frame 35 for fixed bonding, and a plurality of limiting rods 37 protrude from one side of the fixing frame 35.

[0081] Specifically, such as Figure 9 As shown, when fixing the wafer, the wafer can first be inserted into the slot 30 on the first fixing rod 28. The first fixing rod 28 and the fixing strip 31 can be combined into a whole and can be used to transfer the wafer. When inserting the wafer into the slot 30 on the second fixing rod 29, the mounting hole 36 and the limiting rod 37 can be aligned so that the limiting rod 37 can pass through the mounting hole 36. One end of the limiting rod 37 is threaded, so it can be locked with a nut or bolt to prevent the mounting strip 34 and the fixing frame 35 from separating, ensuring the overall firmness. The wafer will not wobble after fixing.

[0082] When the etching is completed and the wafer needs to be transferred for cleaning or other processes, the nut or cap at one end of the limiting rod 37 can be removed, and the first fixing rod 28 and the fixing strip 31 can be pulled out from the fixing frame 35 as a whole.

[0083] The fixed frame 35 can connect the upper mounting plate 32 and the lower mounting plate 33 into one piece. In this way, when the lower rotating column 12 drives the upper mounting plate 32 to rotate, the upper mounting plate 32 can drive the whole to rotate.

[0084] In one specific embodiment of the present invention, the etching chamber 1 is made of acid-resistant glass. The vertical rod 6, horizontal plate 10, upper rotating column 11, lower rotating column 12, partition 14, bottom plate 15 and fixing cylinder 16 are made of 316L stainless steel.

[0085] The diverting strip 20, the guide column 21, the first fixing rod 28, the second fixing rod 29, the fixing strip 31, the upper mounting plate 32, the lower mounting plate 33, the mounting strip 34, the fixing frame 35, the mounting hole 36, and the limiting rod 37 are all made of Teflon.

[0086] Specifically, the design using acid-resistant glass, 316L stainless steel, and Teflon materials ensures that the components in the equipment have good corrosion resistance, guaranteeing the normal and stable operation of the etching process.

[0087] In the description of this specification, terms such as "connection," "installation," and "fixation" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meanings of the above terms within this invention based on the specific circumstances.

[0088] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0089] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A semiconductor chip etching device, comprising an etching tank (1), a driving mechanism for driving the movement of the wafer fixing mechanism, and a layered component located inside the etching tank (1); Its features are: The driving mechanism includes a lifting component and a rotating component. The rotating component includes a rotating base (4) and a vertical rod (6). The top end of the vertical rod (6) penetrates through the rotating base (4). A plurality of cross plates (10) are provided on the vertical rod (6). An upper rotating column (11) penetrates through the cross plate (10). The upper rotating column (11) is connected to the top of the wafer fixing mechanism. The bottom of the upper rotating column (11) is connected to a lower rotating column (12). A secondary rotor (13) is provided on the lower rotating column (12); The layered component includes a plurality of partition plates (14) distributed in parallel, and a bottom plate (15) welded and fixed to the inner wall of the etching tank (1). Fixing cylinders (16) penetrate through the centers of both the partition plate (14) and the bottom plate (15). A fixing seat (23) is provided on the topmost partition plate (14). A set of main rotors (27) is movably connected to the fixing seat (23); Etching areas are formed between adjacent two partition plates (14) and between the partition plate (14) and the bottom plate (15). First through holes (17) are formed on the fixing cylinder (16) at the etching area. A circulating mechanism is further provided on the etching tank (1); The diameter of the partition plate (14) is smaller than the inner wall length of the etching tank (1). Both the partition plate (14) and the bottom plate (15) are welded and fixed to the fixing cylinder (16). The bottom end of the fixing cylinder (16) is in an open shape; The circulating mechanism includes a first circulating pipe (18) communicated with the etching tank (1), and a second circulating pipe (19) communicated with a shunt strip (20). The shunt strip (20) is a hollow "C"-shaped structure. Four guide columns (21) distributed in a rectangular shape are connected to the shunt strip (20). Second through holes (22) are uniformly formed on the guide column (21); 2. The semiconductor chip etching apparatus according to claim 1, characterized in that: The lifting component includes a top plate (3), and a group of support frames (2) welded and fixed to the top plate (3). The bottom ends of the two support frames (2) are welded and fixed through a connecting strip (5). A convex block (38) penetrates through the bottom end of the support frame (2). The convex block (38) is fixed to the outer wall of the etching tank (1); 3. The semiconductor chip etching apparatus according to claim 1, characterized in that: A groove is formed by the downward extension of the top surface of the rotating base (4). The inner wall of the top end of the rotating base (4) is connected to the outer circular wall of the top plate (3) by a bearing; A column (8) is welded and fixed at the center of the rotating base (4). The top end of the column (8) penetrates through the top plate (3) and is butted against the output shaft of the first driving motor (9). The first driving motor (9) is fixed to the top plate (3); 4. The semiconductor chip etching apparatus according to claim 1, characterized in that: The vertical rod (6) is movably connected to the rotating base (4) by a bearing. The vertical rod (6) is welded and fixed to the cross plate (10). The top end of the vertical rod (6) is located in the groove and is fixed with a first gear by a snap pin. A gear ring (7) meshing with the first gear is movably connected to the inner wall of the rotating base (4) by a bearing.

5. The semiconductor chip etching apparatus according to claim 1, characterized in that: The diverting strip (20) is fixed to the top of the etching tank (1). The guide column (21) is set vertically. The bottom end of the guide column (21) is attached to the surface of the bottom plate (15). The diverting strip (20) and the guide column (21) are integrally formed. The connection between the diverting strip (20) and the guide column (21) is continuous.

6. The semiconductor chip etching apparatus according to claim 1, characterized in that: The fixed base (23) has a hollow structure, and a transmission column (26) connected to its bearing runs through the top wall of the fixed base (23). The top end of the transmission column (26) is connected to the main rotor (27). The end face of the transmission column (26) located in the fixed seat (23) is fixed with a second gear. The top surface of the fixed seat (23) is fixed with a second drive motor (24). The output shaft of the second drive motor (24) extends into the fixed seat (23) and is fixed with a transmission gear (25). The transmission gear (25) meshes with the second gear.

7. The semiconductor chip etching apparatus according to claim 1, characterized in that: The wafer fixing mechanism includes a first fixing rod (28) and a second fixing rod (29) arranged in a ring. The first fixing rod (28) and the second fixing rod (29) are provided with slots (30) for fixing the wafer. The first fixing rod (28) and the fixing strip (31) are integrally formed. The fixing strip (31) has mounting strips (34) integrally formed at both ends. The mounting strip (34) is provided with a plurality of mounting holes (36).

8. The semiconductor chip etching apparatus according to claim 7, characterized in that: The second fixing rod (29) has an integrally formed upper mounting plate (32) at its top end. An upper rotating column (11) connected to the bearing of the upper mounting plate (32) passes through the upper mounting plate (32). The upper rotating column (11) is connected to the bearing of the horizontal plate (10). The second fixing rod (29) has an integrally formed lower mounting plate (33) at its bottom end. A lower rotating column (12) is fixed at the bottom end of the lower mounting plate (33). The upper mounting plate (32) and the lower mounting plate (33) are fitted with a fixing frame (35) for fixed bonding, and a plurality of limiting rods (37) protrude from one side of the fixing frame (35).

Images