A semiconductor die feeding device and method

Abstract

This invention discloses a semiconductor chip loading device and method, relating to the field of semiconductor loading technology. It includes a main frame, a material box, a loading mechanism, a clamping mechanism, and a transfer mechanism. The loading mechanism is mounted on the main frame and can transport a first material and a second material to a transfer station. Both materials at the transfer station can be clamped and transported by the same clamping mechanism. The clamping mechanism and the loading mechanism are shared between the two loading modes, replacing two independent mechanical and control systems. This successfully solves the problem of large space occupation caused by the simple side-by-side arrangement of two systems in traditional composite loading equipment, while also significantly reducing hardware and equipment maintenance costs.

Description

Technical Field

[0001] This invention relates to the field of semiconductor loading technology, and more specifically to a semiconductor chip loading device and method. Background Technology

[0002] With the rapid development of the electronics and information industry, integrated circuit and semiconductor component packaging technologies continue to evolve towards higher density, higher performance, and miniaturization. Under this trend, semiconductor placement machines, as core equipment in back-end packaging production lines, are particularly crucial in terms of performance. The placement accuracy, production efficiency, and operational flexibility of the equipment directly determine the final product's packaging quality, yield, and overall manufacturing cost. The loading system is considered the "choke point" of the semiconductor placement machine, undertaking the critical task of continuously, stably, and efficiently transporting chips of various specifications from the wafer to the pick-up station. Its performance directly determines the overall production cycle time and operational stability of the machine.

[0003] To accommodate both standard and specialized process requirements, traditional pick-and-place machines generally employ a hybrid loading mode, which involves a standard cassette loading system coupled with a flip-over loading unit. Standard cassette loading delivers standard cassettes containing lead frames that have undergone die bonding and wire bonding to the workstation, where a robotic arm sequentially retrieves them, achieving efficient and universal standard loading. The flip-over loading unit, on the other hand, is designed for specialized processes such as back-side inspection, cleaning, or placement. After receiving the lead frames from the cassette, it uses a precision flipping mechanism to flip them over before delivering them to the workstation. However, this simple side-by-side arrangement of two independent systems has inherent drawbacks: the side-by-side layout results in a large overall equipment size, significantly encroaching on expensive cleanroom space; furthermore, the redundant configuration of the two mechanical and control systems significantly increases equipment costs and the complexity of subsequent maintenance. Summary of the Invention

[0004] The purpose of this invention is to provide a semiconductor chip mounting and feeding device and method to solve the problems existing in the prior art, optimize equipment space, and reduce hardware and equipment maintenance costs.

[0005] To achieve the above objectives, the present invention provides the following solution:

[0006] This invention provides a semiconductor chip mounting and feeding device, comprising: a main frame, a material box, a feeding mechanism, a clamping mechanism, and a transfer mechanism; the material box is used to hold a first material; the feeding mechanism is disposed on the main frame and is used to transport the material box containing the first material and a second material to a transfer station; the clamping mechanism is used to transport the material box containing the first material at the transfer station to the next station; the transfer mechanism is used to pick up and transfer the second material at the transfer station to a material platform, and the clamping mechanism transports the material platform containing the second material to the next station.

[0007] In some embodiments, the transfer mechanism is a flip-over suction nozzle assembly, which can rotate forward about a first axis to the transfer station to adsorb the second material; it can also rotate backward about the first axis to the material platform to place the second material on the material platform.

[0008] In some embodiments, the feeding mechanism is movably mounted on the main frame and can switch between a horizontal position and an inclined position;

[0009] When the feeding mechanism is in a horizontal position, it is used to transport the material box containing the first material to the first transfer station along the horizontal direction. The first transfer station is in a horizontal state and is used to support the material box so that the material box is also in a horizontal state. The clamping mechanism is used to clamp the material box on the first transfer station and transport it to the next station.

[0010] When the feeding mechanism is in an inclined position, it is used to transport the second material to the second transfer station in an upward inclined direction. The second transfer station is in an inclined state and is used to support the second material so that the second material is also in an inclined state. The adsorbed surface of the second material in the inclined state extends upward in an inclined direction away from the flipping nozzle assembly. The flipping nozzle assembly is used to pick up and flip the second material on the second transfer station and place it on the material platform. The clamping mechanism transports the material platform with the second material to the next station.

[0011] In some embodiments, when the nozzle of the flip-over nozzle assembly is moved to a position on the same plane as the surface of the material to be adsorbed, its axis is perpendicular to the surface of the material placed on the material stage.

[0012] In some embodiments, the feeding mechanism includes a drive motor, a main shaft, a mode switching component, a first conveyor belt group, a second conveyor belt group, and a pallet; the drive motor drives the main shaft to rotate; the drive wheel of the first conveyor belt group is fixedly connected to and directly driven by the main shaft; the drive wheel of the second conveyor belt group is sleeved on the main shaft through a bearing; the second conveyor belt group and the pallet are fixedly connected; the mode switching component switches the connection state between the drive wheel of the second conveyor belt group and the main shaft so that the drive wheel of the second conveyor belt group and the main shaft have a connected state and a disconnected state; the feeding mechanism is in an inclined position, and the pallet supports the second material so that the second material is in an inclined state;

[0013] When the feeding mechanism is in the horizontal position, it is in the disconnected state. The drive motor only drives the first conveyor belt group to move so that the feeding mechanism in the horizontal position can transport the material box containing the first material to the first transfer station.

[0014] When the feeding mechanism is in the inclined position, it is in the connected state. The drive motor simultaneously drives the first conveyor belt group and the second conveyor belt group to move so that the feeding mechanism in the inclined position can transport the pallet containing the second material to the second transfer station.

[0015] In some embodiments, the mode switching assembly includes a telescopic cylinder, a brake block, an intermediate wheel, and a transmission assembly; the brake block and the intermediate wheel are connected via the transmission assembly; the push rod of the telescopic cylinder is fixedly connected to the intermediate wheel; the transmission assembly is configured such that: when the push rod of the telescopic cylinder retracts, it drives the brake block to abut against the drive wheel of the second conveyor belt group, thereby braking the drive wheel of the second conveyor belt group and switching the first and second conveyor belt groups to a disconnected state; when the push rod of the telescopic cylinder extends, it drives the brake block to separate from the drive wheel of the second conveyor belt group, and simultaneously drives the intermediate wheel to press against the drive wheel of the first and second conveyor belt groups, thereby establishing synchronous movement between the first and second conveyor belts to switch to a connected state.

[0016] In some embodiments, the intermediate wheel, the drive wheel of the first conveyor belt group, and the drive wheel of the second conveyor belt group are all made of polyurethane material.

[0017] In some embodiments, a positioning and locking mechanism is also included for positioning and locking the feeding mechanism in a horizontal or inclined position.

[0018] In some embodiments, a material sensor is provided at the end of the conveying path of the feeding mechanism to detect whether the material has arrived at the transfer station and control the start and stop of the drive motor accordingly.

[0019] The present invention also provides a method for feeding semiconductor wafers using a semiconductor wafer feeding device, the method comprising the following steps:

[0020] The first material is fed, including:

[0021] Place the first material into the material box;

[0022] Place the material box on the feeding mechanism;

[0023] The feeding mechanism transports the material box containing the first material to the transfer station;

[0024] The clamping mechanism transports the material box containing the first material at the transfer station to the next station;

[0025] The second material is fed, including:

[0026] Place the second material onto the feeding mechanism;

[0027] The feeding mechanism transports the second material to the transfer station;

[0028] The transfer mechanism is used to pick up and transfer the second material from the transfer station to the material platform;

[0029] The gripping mechanism transports the material platform containing the second material to the next workstation.

[0030] The present invention achieves the following technical effects compared to the prior art:

[0031] The semiconductor chip loading device provided by this invention includes a main frame, a material box, a loading mechanism, a clamping mechanism, and a transfer mechanism. The loading mechanism is disposed on the main frame and can transport the first material and the second material to the transfer station. Both materials at the transfer station can be clamped and transported by the same clamping mechanism. The clamping mechanism and the loading mechanism are shared between the two loading modes, replacing two independent mechanical and control systems. This successfully solves the problem of large space occupation caused by the simple side-by-side arrangement of two systems in traditional composite loading equipment, and also significantly reduces hardware costs and equipment maintenance costs. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 This is a schematic diagram of a semiconductor chip loading device for horizontal loading.

[0034] Figure 2 A schematic diagram of a semiconductor chip loading device when tilting the loading mechanism after removing the side baffles;

[0035] Figure 3 This is a schematic diagram of the feeding mechanism;

[0036] Figure 4 for Figure 3 A schematic diagram of the bottom structure of the feeding mechanism;

[0037] Figure 5 A schematic diagram of the structure when the mode switching component is disconnected;

[0038] Figure 6 A schematic diagram of the structure when the mode switching component is connected.

[0039] In the diagram: 1-Main frame; 2-Clamping mechanism; 3-Feeding mechanism; 31-Drive motor; 32-Drive wheel of the first conveyor belt group; 33-Main shaft; 34-Drive wheel of the second conveyor belt group; 35-Mode switching component; 351-Telescopic cylinder; 352-Brake block; 353-Intermediate wheel; 354-Transmission component; 4-Transfer mechanism; 5-First conveyor belt group; 6-Second conveyor belt group; 7-Pattern; 8-Material platform; 9-Material box. Detailed Implementation

[0040] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0041] The purpose of this invention is to provide a semiconductor chip mounting and feeding device and method to solve the problems existing in the prior art, optimize equipment space, and reduce hardware and equipment maintenance costs.

[0042] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0043] Example 1

[0044] Combination Figure 1 This embodiment provides a semiconductor chip loading device, including a main frame 1, a material box 9, a loading mechanism 3, a clamping mechanism 2, and a transfer mechanism 4; the material box 9 is used to place a first material; the loading mechanism 3 is disposed on the main frame 1 and is used to transport the material box 9 containing the first material and the second material to a transfer station; the clamping mechanism 2 is used to transport the material box 9 containing the first material at the transfer station to the next station; the transfer mechanism 4 is used to pick up and transfer the second material at the transfer station to a material platform 8, and the clamping mechanism 2 transports the material platform 8 containing the second material to the next station.

[0045] In this embodiment, the feeding mechanism 3 is set on the main frame 1 and can transport the first material and the second material to the transfer station. The transfer station in this embodiment is the position where the front end of the feeding mechanism 3 can be gripped by the clamping mechanism 2. Both materials at the transfer station can be gripped and transported by the same clamping mechanism 2. The clamping mechanism 2 and the feeding mechanism 3 are shared between the two feeding modes, replacing two independent mechanical and control systems. This successfully solves the problem of large space occupation caused by the simple side-by-side arrangement of two systems in traditional composite feeding equipment, and also significantly reduces hardware costs and equipment maintenance costs.

[0046] like Figure 2 As shown in some examples, the transfer mechanism 4 is a flipping suction nozzle assembly. The flipping suction nozzle assembly can rotate forward around the first axis to the transfer station to adsorb the second material; it can also rotate backward around the first axis to the material platform 8 to place the second material on the material platform 8. By rotating forward and backward around a single axis, this flipping suction nozzle assembly naturally completes the flipping of the material during the transfer process, meeting the core requirements of specific processes such as material inversion for adjusting the material posture, simplifying the material suction, transfer and placement actions, forming an extremely short movement path, further optimizing the space inside the equipment, and at the same time, the rotational motion has good rigidity and low vibration, reducing the risk of material damage.

[0047] Preferably, the feeding mechanism 3 is movably mounted on the main frame 1 and can switch between a horizontal position and an inclined position;

[0048] When the feeding mechanism 3 is in a horizontal position, it is used to transport the material box 9 containing the first material to the first transfer station along the horizontal direction. The first transfer station is in a horizontal state and is used to support the material box 9 so that the material box 9 is also in a horizontal state. The clamping mechanism 2 is used to clamp the material box 9 on the first transfer station and transport it to the next station.

[0049] When the feeding mechanism 3 is in an inclined position, it is used to transport the second material to the second transfer station in an upward inclined direction. The second transfer station is in an inclined state and is used to support the second material so that the second material is also in an inclined state. The adsorbed surface of the second material in the inclined state extends upward in an inclined direction away from the flipping nozzle assembly. The flipping nozzle assembly is used to pick up and flip the second material on the second transfer station and place it on the material platform 8. The clamping mechanism 2 transports the material platform 8 containing the second material to the next station.

[0050] This embodiment utilizes a flexible, switchable feeding mechanism 3 to achieve feeding methods for both the first and second materials. When the feeding mechanism 3 is in a horizontal position, the transfer station is the first transfer station; when the feeding mechanism 3 is in an inclined position, the transfer station is the second transfer station. One system can adapt to two completely different material conveying processes without the need for separate equipment, greatly enhancing the flexibility and versatility of the equipment in handling multi-variety, small-batch production. The shared clamping mechanism 2 optimizes the overall machine space layout, simplifies the mechanical structure, and reduces costs. At the same time, integrating the flow paths of the two materials into a compact workstation area shortens the material transfer time and improves overall production efficiency.

[0051] It should be noted that the horizontally positioned feeding mechanism 3 is designed to provide a stable and reliable conveying environment for the material box 9 during horizontal conveying, ensuring that the material is in a stable and precise supported state throughout the entire process from conveying, transferring, to being removed. The inclined setting serves two purposes: first, it accommodates the maximum flipping angle of the flipping suction nozzle assembly. Due to the complex structure of the equipment, the maximum flipping angle of the flipping suction nozzle assembly is limited, and when the horizontally positioned feeding mechanism 3 conveys the second material, the suction nozzle of the flipping suction nozzle assembly cannot adsorb the material's adsorption surface; second, tilting the feeding mechanism 3 so that the material is placed perpendicular to the plane of the feeding mechanism 3 reduces the contact area between the material and the plane, effectively reducing the risk of material contamination.

[0052] In some examples, when the nozzle of the flip nozzle assembly moves to the same plane as the surface of the material being adsorbed, its axis is perpendicular to the surface of the material being adsorbed placed on the material platform 8.

[0053] In this embodiment, the axis of the flip-up suction nozzle assembly is strictly perpendicular to the surface of the material being adsorbed during adsorption, ensuring the sealing and reliability of the adsorption. This allows the nozzle end face to be completely in contact with the material surface, forming an optimal vacuum seal and effectively preventing the adsorption force from weakening or the material from falling off due to air leakage. At the same time, vertical adsorption ensures a uniform distribution of force and avoids stress concentration caused by tilted adsorption. This is crucial for handling thin and brittle materials and can effectively prevent them from bending or cracking.

[0054] In some examples, such as Figures 2 to 3 As shown, the feeding mechanism 3 includes a drive motor 31, a main shaft 33, a mode switching component 35, a first conveyor belt group 5, a second conveyor belt group 6, and a pallet 7. The drive motor 31 is used to drive the main shaft 33 to rotate. The drive wheel 32 of the first conveyor belt group is fixedly connected to the main shaft 33 and is directly driven by it. The drive wheel 34 of the second conveyor belt group is sleeved on the main shaft 33 through a bearing. The second conveyor belt group 6 and the pallet 7 are fixedly connected. The mode switching component 35 is used to switch the connection state between the drive wheel 34 of the second conveyor belt group and the main shaft 33 so that the drive wheel 34 of the second conveyor belt group and the main shaft 33 have a connected state and a disconnected state. When the feeding mechanism 3 is in an inclined state, the pallet 7 is used to support the second material when the feeding mechanism 3 is in an inclined position so that the second material is in an inclined state.

[0055] When the feeding mechanism 3 is in the horizontal position, it is in the disconnected state. When it is in the disconnected state, the drive motor 31 only drives the first conveyor belt group 5 to move so that the feeding mechanism 3 in the horizontal position can transport the material box 9 containing the first material to the first transfer station.

[0056] When the feeding mechanism 3 is in the horizontal position, it is in the disconnected state. When it is in the connected state, the drive motor 31 simultaneously drives the first conveyor belt group 5 and the second conveyor belt group 6 to move so that the feeding mechanism 3, which is in the inclined position, transports the pallet 7 containing the second material to the second transfer station.

[0057] In this embodiment, the feeding mechanism 3 cleverly integrates the first and second conveyor belt groups 6 onto the same main shaft 33 and drives them through the same drive motor 31. The mode switching component 35 enables the equipment to switch between driving only the first conveyor belt group 5 or driving both conveyor belt groups simultaneously, thus achieving dual functionality: it can transport the material box 9 to the first transfer station in a horizontal posture, and it can also transport the pallet 7 to the second transfer station in an inclined posture. The most direct benefit of this integrated and modular design is that it significantly reduces manufacturing and maintenance costs, while simplifying the control system.

[0058] It should be noted that the first conveyor belt group 5 can move in a cyclic manner, while the second conveyor belt group 6, due to its fixed connection with the pallet 7 and the structural complexity of the feeding mechanism 3, cannot achieve cyclic movement. Therefore, during the horizontal feeding process, the pallet 7 remains stationary, and the conveyor belt only drives the material box 9 to move. This avoids the situation where the pallet 7 moves with the material box 9 to the transfer station and cannot continue to move in a cyclic manner, requiring the control equipment to return the pallet 7 to its initial position. This saves the time of the pallet 7 returning empty and shortens the ineffective waiting time in each work cycle, thereby achieving a substantial improvement in production efficiency.

[0059] Preferably, the mode switching assembly includes a telescopic cylinder 351, a brake block 352, an intermediate wheel 353, and a transmission assembly 354; the brake block 352 and the intermediate wheel 353 are connected by the transmission assembly 354; the push rod of the telescopic cylinder 351 is fixedly connected to the intermediate wheel 353; the transmission assembly 354 is configured such that: when the push rod of the telescopic cylinder 351 retracts, it drives the brake block 352 to abut against the drive wheel 34 of the second conveyor belt group, thereby braking the drive wheel 34 of the second conveyor belt group and switching the first conveyor belt group 5 and the second conveyor belt group 6 to a disconnected state; when the push rod of the telescopic cylinder 351 extends, it drives the brake block 352 to separate from the drive wheel 34 of the second conveyor belt group, and simultaneously drives the intermediate wheel 353 to press between the drive wheel 32 of the first conveyor belt group and the drive wheel 34 of the second conveyor belt group, thereby establishing synchronous movement between the first conveyor belt group 5 and the second conveyor belt group 6, so that they switch to a connected state.

[0060] In this embodiment, the transmission component 354 adopts a lever-type structure, with its central part rotatably mounted on the main body. One end is hinged to the brake block 352, and the other end is hinged to the frame of the intermediate wheel 353. When the telescopic cylinder 351 controls the intermediate wheel 353 to retract, the transmission component 354 causes the brake block 352 to move in the opposite direction to the intermediate wheel 353, i.e., controls the brake block 352 to abut against the drive wheel 34 of the second conveyor belt group. By increasing friction, the drive wheel 34 of the second conveyor belt group is kept relatively stationary relative to the drive wheel 32 of the first conveyor belt group, thus keeping the pallet 7 stationary. When the telescopic cylinder 351 controls the intermediate wheel 353 to extend, the intermediate wheel 353 presses against the drive wheel 32 of the first conveyor belt group and the drive wheel 34 of the second conveyor belt group. Meanwhile, the intermediate wheel 353 causes the transmission assembly 354 to control the brake block 352 to move away from the drive wheel 34 of the second conveyor belt group. At this time, the drive motor 31 transmits power to the main shaft 33, the main shaft 33 transmits power to the drive wheel 32 of the first conveyor belt group, the drive wheel 32 of the first conveyor belt group transmits power to the intermediate wheel 353, and the intermediate wheel 353 transmits power to the drive wheel 34 of the second conveyor belt group, so as to realize the synchronous movement of the first conveyor belt group 5 and the second conveyor belt group 6. This structure uses an integrated cylinder rod mechanism driven by a single telescopic cylinder to control both power connection and braking modes, which significantly reduces the number of actuators, simplifies the overall mechanical structure, and is conducive to equipment miniaturization and reducing manufacturing costs.

[0061] It should be noted that the intermediate wheel 353 is rotatably mounted on the end of the push rod of the telescopic cylinder 351 via a movable frame.

[0062] In some examples, the intermediate pulley 353, the drive pulley 32 of the first conveyor belt group, and the drive pulley 34 of the second conveyor belt group are all made of polyurethane.

[0063] In this embodiment, the intermediate wheel 353 and the drive wheels of the two conveyor belt sets are all made of polyurethane material. Its high coefficient of friction ensures the reliability and immediacy of power transmission. At the same time, the material's excellent elasticity plays a role in buffering and shock absorption and reducing operating noise. In addition, the excellent wear resistance of polyurethane significantly extends the service life of key moving parts, which not only reduces maintenance costs but also ensures that the equipment can operate stably and efficiently for a long time.

[0064] Some examples also include a positioning and locking mechanism for positioning and locking the feeding mechanism 3 in a horizontal or inclined position.

[0065] The positioning and locking mechanism in this embodiment includes a locking nut and a positioning pin. The position of the feeding mechanism 3 is adjusted, and the positioning pin enables the feeding mechanism 3 to be quickly positioned between horizontal and inclined positions. The locking nut further locks the feeding mechanism 3, which significantly improves operational safety and maintenance convenience, and ultimately achieves the comprehensive and excellent effect of improving production efficiency and extending equipment life.

[0066] In some examples, a material sensor is installed at the end of the conveying path of the feeding mechanism 3 to detect whether the material has arrived at the transfer station and control the start and stop of the drive motor 31 accordingly.

[0067] This embodiment utilizes material sensors for closed-loop control of the conveying process, achieving precision and automation in the feeding action. It effectively prevents overshooting and errors in material conveying, ensuring precise connection with downstream processes to improve overall efficiency.

[0068] Example 2

[0069] This embodiment also provides a method for feeding semiconductor chip mounting devices. The method for feeding semiconductor chips using any one of the semiconductor chip mounting devices in Embodiment 1 includes the following steps:

[0070] The first material is fed, including:

[0071] Place the first material into the material box 9;

[0072] Place the material box 9 on the feeding mechanism 3;

[0073] The feeding mechanism 3 transports the material box 9 containing the first material to the transfer station;

[0074] The clamping mechanism 2 transports the material box 9 containing the first material at the transfer station to the next station;

[0075] The second material is fed, including:

[0076] Place the second material onto the feeding mechanism 3;

[0077] The feeding mechanism 3 transports the second material to the transfer station;

[0078] The transfer mechanism 4 is used to pick up and transfer the second material on the transfer station to the material platform 8;

[0079] The clamping mechanism 2 transports the material platform 8 containing the second material to the next workstation.

[0080] It should be noted that the structures, proportions, sizes, etc., depicted in the accompanying drawings of this specification are only used to complement the content disclosed in the specification, so as to enable those skilled in the art to understand and read them, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed in the present invention.

[0081] It should be noted that, for those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be regarded as exemplary and non-limiting in all respects, and the scope of the present invention is defined by the appended claims rather than the foregoing description. Therefore, it is intended that all changes falling within the meaning and scope of the equivalents of the claims be included within the present invention.

[0082] Specific examples have been used to illustrate the principles and implementation methods of this invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of this invention. Furthermore, those skilled in the art will recognize that, based on the ideas of this invention, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this invention.

Claims

1. A semiconductor chip mounting and feeding device, characterized in that, include: Main framework; Material box, used to hold the first material; The feeding mechanism, located on the main frame, is used to transport the material box containing the first material and the second material to the transfer station; A clamping mechanism is used to transport the material box containing the first material at the transfer station to the next station; The transfer mechanism is used to pick up and transfer the second material from the transfer station to the material platform. The clamping mechanism transports the material platform containing the second material to the next station. The transfer mechanism is a flipping suction nozzle assembly. The flipping suction nozzle assembly can rotate forward around the first axis to the transfer station to pick up the second material. It can also rotate in the opposite direction around the first axis to the material platform to place the second material on the material platform. The feeding mechanism is movably mounted on the main frame and can switch between a horizontal position and an inclined position; When the feeding mechanism is in a horizontal position, it is used to transport the material box containing the first material to the first transfer station along the horizontal direction. The first transfer station is in a horizontal state and is used to support the material box so that the material box is also in a horizontal state. The clamping mechanism is used to clamp the material box on the first transfer station and transport it to the next station. When the feeding mechanism is in an inclined position, it is used to transport the second material to the second transfer station in an upward inclined direction. The second transfer station is in an inclined state and is used to support the second material so that the second material is also in an inclined state. The adsorbed surface of the second material in the inclined state extends upward in an inclined direction away from the flipping nozzle assembly. The flipping nozzle assembly is used to pick up and flip the second material on the second transfer station and place it on the material platform. The clamping mechanism transports the material platform with the second material to the next station.

2. The semiconductor wafer mounting and feeding device according to claim 1, characterized in that, When the nozzle of the flip-over suction assembly moves to the same plane as the surface of the material being absorbed, its axis is perpendicular to the surface of the material being absorbed on the material platform.

3. The semiconductor chip loading device according to claim 2, characterized in that, The feeding mechanism includes a drive motor, a main shaft, a mode switching component, a first conveyor belt group, a second conveyor belt group, and a pallet. The drive motor drives the main shaft to rotate. The drive wheel of the first conveyor belt group is fixedly connected to and directly driven by the main shaft. The drive wheel of the second conveyor belt group is sleeved on the main shaft through a bearing. The second conveyor belt group and the pallet are fixedly connected. The mode switching component switches the connection state between the drive wheel of the second conveyor belt group and the main shaft so that the drive wheel of the second conveyor belt group and the main shaft have a connected state and a disconnected state. The feeding mechanism is in an inclined position, and the pallet supports the second material so that the second material is in an inclined state. When the feeding mechanism is in the horizontal position, it is in the disconnected state. The drive motor only drives the first conveyor belt group to move so that the feeding mechanism in the horizontal position can transport the material box containing the first material to the first transfer station. When the feeding mechanism is in the inclined position, it is in the connected state. The drive motor simultaneously drives the first conveyor belt group and the second conveyor belt group to move so that the feeding mechanism in the inclined position can transport the pallet containing the second material to the second transfer station.

4. The semiconductor wafer mounting and feeding device according to claim 3, characterized in that, The mode switching component includes a telescopic cylinder, a brake block, an intermediate wheel, and a transmission assembly; the brake block and the intermediate wheel are connected by the transmission assembly; the push rod of the telescopic cylinder is fixedly connected to the intermediate wheel; the transmission assembly is configured such that: when the push rod of the telescopic cylinder retracts, it drives the brake block to abut against the drive wheel of the second conveyor belt group, thereby braking the drive wheel of the second conveyor belt group and switching the first and second conveyor belt groups to a disconnected state; when the push rod of the telescopic cylinder extends, it drives the brake block to separate from the drive wheel of the second conveyor belt group, and simultaneously drives the intermediate wheel to press against the drive wheel of the first and second conveyor belt groups, thereby establishing synchronous movement between the first and second conveyor belts and switching to a connected state.

5. The semiconductor chip loading device according to claim 4, characterized in that, The intermediate wheel, the drive wheel of the first conveyor belt group, and the drive wheel of the second conveyor belt group are all made of polyurethane.

6. The semiconductor wafer mounting and feeding device according to claim 1, characterized in that, It also includes a positioning and locking mechanism for positioning and locking the feeding mechanism in a horizontal or inclined position.

7. The semiconductor wafer mounting and feeding device according to claim 3, characterized in that, A material sensor is installed at the end of the conveying path of the feeding mechanism to detect whether the material has arrived at the transfer station and control the start and stop of the drive motor accordingly.

8. A method for feeding semiconductor wafers using the semiconductor wafer loading apparatus as described in any one of claims 1-7, characterized in that, Includes the following steps: The first material is fed, including: Place the first material into the material box; Place the material box on the feeding mechanism; The feeding mechanism transports the material box containing the first material to the transfer station; The clamping mechanism transports the material box containing the first material at the transfer station to the next station; The second material is fed, including: Place the second material onto the feeding mechanism; The feeding mechanism transports the second material to the transfer station; The transfer mechanism is used to pick up and transfer the second material from the transfer station to the material platform; The gripping mechanism transports the material platform containing the second material to the next workstation.

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