Flat panel detector and manufacturing method thereof

Abstract

The invention provides a flat panel detector and a manufacturing method thereof, the flat panel detector comprises a laminated plate, and the laminated plate comprises a support plate; the protection plate is positioned on the front surface of the supporting plate; the flexible plate is located on the outer layer of the protection plate, and the flexible plate is bent downwards along the laminated side walls of the supporting plate and the protection plate, wraps the side walls, is bent to the back face of the supporting plate and covers the edge part of the back face of the supporting plate; and a photosensitive layer is arranged on the outer layer of the flexible plate on the front surface of the supporting plate. According to the flat panel detector, the problem of the service life of an existing flat panel detector is solved by comprehensively applying a flexible material and an advanced circuit integration technology, the manufacturing cost and the weight are remarkably reduced, the portability and the reliability of equipment are improved, and the comprehensive performance and the market competitiveness of the flat panel detector are remarkably improved.

Description

Technical Field

[0001] This application relates to the field of detector technology, and in particular to a flat panel detector and its manufacturing method. Background Technology

[0002] Mammography can detect tiny lesions in breast tissue in a timely manner, making it irreplaceable compared to other imaging techniques. Its working principle involves scanning and reading X-rays that penetrate the breast tissue to obtain image information for screening and diagnosis. Its development has progressed through stages including film, imaging panels, CCD, FFDM / DBT, CEDM, and CBBCT. The key component of the X-ray imaging system is the digital flat panel detector. Digital radiography (DR) is an imaging technique that uses X-rays and digital detectors. Unlike traditional film imaging, DR directly converts X-ray information into digital signals, facilitating storage, transmission, and processing.

[0003] Flat panel detectors for breast cancer detection require narrow bezels to ensure complete detection of breast lesions. However, conventional flat panel breast DR systems have bezels, resulting in some breast areas being undetectable during detection. Furthermore, X-rays can damage TFT devices, affecting their stability. The Gate-in-Panel (GIP) circuitry in the panel has high requirements for TFT stability. Therefore, if the GIP circuitry is integrated on the DR substrate above the protective plate, it will significantly shorten the detector's lifespan. Summary of the Invention

[0004] To address the aforementioned technical problems, the present invention provides a flat panel detector and its manufacturing method, comprising a laminated plate, the laminated plate comprising: a support plate; a protective plate located on the front side of the support plate; a flexible plate located on the outer layer of the protective plate, the flexible plate being bent downward along the laminated sidewall of the support plate and the protective plate, wrapping the sidewall, bending to the back side of the support plate, and covering the edge portion of the back side of the support plate; a photosensitive layer is provided on the outer layer of the flexible plate located on the front side of the support plate.

[0005] Optionally, the laminated plate further includes foam located between the protective plate and the flexible plate.

[0006] Optionally, an integrated circuit is disposed on the flexible plate on the back of the support plate.

[0007] Optionally, the flat panel detector further includes a circuit board located in the central region of the back of the support plate, wherein the circuit board in the central region of the back of the support plate and the flexible plate on the back of the support plate are located on the same layer.

[0008] Optionally, the photosensitive layer on the outer layer of the flexible plate on the front side of the support plate is located in the central region of the flexible plate; the outer layer of the flexible plate on the back side of the support plate is provided with peripheral circuits; and metal wires for connecting the photosensitive layer and the peripheral circuits are provided inside the flexible plate.

[0009] Optionally, the laminated plate is located within the cavity, which includes a rear cover and a top cover, as well as a metal frame that is perpendicular to the rear cover and the top cover and connects the edges of the rear cover and the top cover.

[0010] Optionally, the flexible plate is made of polyimide.

[0011] The present invention also provides a method for manufacturing a flat panel detector, comprising: providing a support plate; providing a protective plate on the front side of the support plate; providing a flexible plate on the outer layer of the protective plate, wherein the flexible plate is bent downward along the stacked sidewall of the support plate and the protective plate, wrapping the sidewall, bending to the back side of the support plate, and covering the edge portion of the back side of the support plate; and providing a photosensitive layer on the outer layer of the flexible plate on the front side of the support plate.

[0012] Optionally, the method for manufacturing the flat panel detector further includes: setting an integrated circuit on a flexible board on the back of the support plate; setting a circuit board in the central region of the back of the support plate, wherein the circuit board in the central region of the back of the support plate and the flexible board on the back of the support plate are located on the same layer; and setting a peripheral circuit on the outer layer of the flexible board on the back of the support plate.

[0013] Optionally, the method for manufacturing the flat panel detector further includes: forming a cavity, the cavity including a rear cover and a top cover, and a metal frame perpendicularly arranged to the rear cover and the top cover and connecting the edges of the rear cover and the top cover, for surrounding the support plate, protective plate, flexible plate and photosensitive layer.

[0014] Compared with the prior art, the technical solution of the present invention has the following beneficial effects:

[0015] The flat panel detector provided by this invention employs a flexible substrate with bending capabilities, enabling chip integration on the flexible substrate. This reduces the detector's bezel size, lowers costs, and improves overall process efficiency. Simultaneously, bending the circuitry below the protective plate effectively reduces direct X-ray exposure to the integrated circuit, extending the detector's lifespan and enhancing its adaptability. This allows the detector to be more suitable for detecting objects of different shapes in certain application scenarios. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of an existing flat panel detector;

[0018] Figure 2 This is a schematic diagram of the structure of a flat panel detector according to an embodiment of the present invention;

[0019] Figure 3 This is a schematic diagram of the manufacturing process of a flat panel detector according to an embodiment of the present invention. Detailed Implementation

[0020] Preferred embodiments of the invention will now be described in more detail. While preferred embodiments of the invention are described below, it should be understood that the invention can be implemented in various forms and should not be limited to the embodiments set forth herein.

[0021] In this invention, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower parts of the device in its normal operating state, while "inner" and "outer" refer to the parts relative to the outline of the device. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified. Since this invention pertains to electrical devices, connection and interconnection both refer to conductive interconnections. Because the accompanying drawings describe the same device, the same reference numerals denote the same components.

[0022] As mentioned in the background, DR is a process that uses the short wavelength of X-rays to easily penetrate and absorb different tissues differently. It achieves internal structural imaging by detecting the intensity of X-rays that pass through the target object: X-rays pass through the target object and are attenuated. The attenuated X-rays are converted into visible light by the scintillator layer, and then received by the sensor. After photoelectric conversion and analog-to-digital conversion, they are converted into digital signals and transmitted to the computer for processing to form an image.

[0023] like Figure 1As shown, the basic structure of a conventional flat panel detector 10 typically includes: a top cover 110 made of carbon fiber sheet for protecting internal components; a scintillator 120 that converts X-rays into visible light, typically made of cesium iodide (CsI); a sensor 130 containing a TFT array and an integrated circuit (IC) 140 mounted on the sensor using COF (Chip On Film) technology; a protective plate 150 made of lead or tungsten for blocking X-rays and protecting the electronic components below; a metal frame 160, including a frame and support, typically made of copper or aluminum, providing structural strength; a circuit board 170 containing a driver board, readout board, and main board; a metal back cover 180 made of copper or aluminum for providing overall protection; and a support plate 190. It is evident that in conventional flat panel detectors, all components are located on the side or top of the protective plate. However, since X-rays can damage TFT devices, long-term exposure can affect the stability of the TFTs. Since integrated circuits such as GIP circuits have high requirements for TFT stability, X-ray damage can further shorten the detector's lifespan. Therefore, when integrating GIP circuits on a DR substrate, if the GIP circuits are located above the protective plate, it will lead to a significant reduction in the detector's lifespan.

[0024] Therefore, to solve the above problems, the present invention provides a flat panel detector, including a laminated plate, the laminated plate including: a support plate; a protective plate located on the front side of the support plate; a flexible plate located on the outer layer of the protective plate, the flexible plate being bent downward along the laminated sidewall of the support plate and the protective plate, wrapping the sidewall, bending to the back side of the support plate, and covering the edge portion of the back side of the support plate; a photosensitive layer is provided on the outer layer of the flexible plate located on the front side of the support plate.

[0025] Specific embodiments of the present invention will now be described with reference to the accompanying drawings:

[0026] In this embodiment, as Figure 2 As shown, the flat panel detector 20 includes a laminated plate, which includes a support plate 210 arranged sequentially; a protective plate 220 located on the front side of the support plate 210; and a flexible plate 240 located on the outer layer of the protective plate 220. In this embodiment, the laminated plate of the flat panel detector 20 also includes foam 230 located between the protective plate 220 and the flexible plate 240. The flexible plate 240 bends downward along the laminated sidewall of the support plate 210, the protective plate 220, and the foam 230, wrapping the sidewall and bending to the back side of the support plate 210, covering the edge portion of the back side of the support plate 210.

[0027] In some embodiments, the support plate can be made of materials such as aluminum, copper, stainless steel, carbon fiber composites, and polyimide. In the design of flat panel detectors, the support plate is typically used to provide structural support and mechanical stability; therefore, the support plate material needs to have high strength, durability, and good processing performance to ensure the stability of the entire detector structure. Aluminum, copper, stainless steel, carbon fiber composites, and polyimide are commonly used support plate materials, each with its unique advantages and applicable scenarios. During the design and manufacturing process, appropriate materials should be selected according to specific application requirements; this invention does not impose any limitations on this selection.

[0028] In some embodiments, the protective plate can be made of materials such as lead, tungsten, aluminum, copper, and composite materials. In the design of flat panel detectors, the main function of the protective plate is to protect internal electronic components and sensors from physical, chemical, and radiation damage from the external environment. Commonly used protective plate materials possess good shielding performance, mechanical strength, and corrosion resistance. Lead, tungsten, aluminum, copper, and composite materials are commonly used protective plate materials, each with its unique advantages and applicable scenarios. During the design and manufacturing process, appropriate materials should be selected according to specific application requirements; this invention does not impose any limitations on this selection.

[0029] In some embodiments, the flexible plate is made of a flexible material. Specifically, in the embodiments of this disclosure, the flexible plate is a flexible polyimide (PI) substrate. PI is a polymer material with high heat resistance, good mechanical strength and chemical stability, widely used in flexible electronic devices and displays. It has high tensile strength and tear strength, can withstand bending and deformation, and has good insulation properties and a low dielectric constant, making it suitable for electronic circuit applications.

[0030] In some embodiments, an integrated circuit is disposed on a flexible board on the back side of the support plate. Specifically, in this embodiment, a GIP circuit 250 is integrated on a flexible board 240 on the back side of the support plate 210. The function of the GIP circuit 250 is to drive and control the TFT pixels. Figure 2 As shown, since the GIP circuit 250 is located on the flexible plate 240 below the protective plate 220, the protective plate 220 helps to protect the GIP circuit and reduce its direct exposure to X-rays, thereby extending the detector's lifespan.

[0031] In this embodiment of the disclosure, the flat panel detector 20 further includes a circuit board 260 located in the central region of the back of the support plate 210, and the circuit board 260 and the flexible plate 240 on the back of the support plate 210 are located on the same layer.

[0032] exist Figure 2In the illustrated embodiment, the laminated plate further includes a photosensitive layer 270 on the outer layer of the flexible plate 240 located on the front side of the support plate 210. In this embodiment, the photosensitive layer 270 is a scintillator layer. In some embodiments, the scintillator layer material is typically cesium iodide (CsI), a scintillator material used for X-ray detection that converts X-rays into visible light. The scintillator layer is typically located above the flat panel detector for capturing X-rays and generating optical signals.

[0033] In this embodiment, the outer layer of the flexible plate on the back of the support plate is further provided with peripheral circuitry. Metal wires for connecting the photosensitive layer and the peripheral circuitry are disposed within the flexible plate.

[0034] In some embodiments, the photosensitive layer is deposited only in the central region of the outer layer of the flexible plate on the front side of the support plate; while in the edge region of the outer layer of the flexible plate on the front side of the support plate, the CsI layer is not deposited, which means that the edge region only has metal wires, which can maintain the flexibility of the bending area and avoid possible damage to the scintillator layer during bending. For example, in an embodiment of this disclosure, the photosensitive layer 270 of the outer layer of the flexible plate 240 on the front side of the support plate 210 is located in the central region of the flexible plate 240 and does not cover the edge region.

[0035] In this embodiment of the disclosure, the flat panel detector 20 further includes a cavity 290 surrounding the laminated plate. The laminated plate is located within the cavity 290, which includes a rear cover 291 and an upper cover 292, and a metal frame 293 that is perpendicular to and connects the edges of the rear cover 291 and the upper cover 292.

[0036] The flat panel detector provided in this disclosure, by comprehensively utilizing flexible materials and advanced circuit integration technology, not only solves the lifespan problem of existing flat panel detectors, but also significantly reduces manufacturing costs and weight, improves the portability and reliability of the device, and significantly enhances its overall performance and market competitiveness.

[0037] This invention also provides a method for manufacturing a flat panel detector. Figure 3 This is a flowchart illustrating a method for manufacturing a flat panel detector according to an embodiment of the present invention. The following is a description of the process. Figure 2 and Figure 3 The manufacturing method of the flat panel detector will be further explained below. The manufacturing method of the flat panel detector includes the following steps:

[0038] S1: Provides a support plate.

[0039] First, a support plate 210 is provided. In some embodiments, the support plate can be made of materials such as aluminum, copper, stainless steel, carbon fiber composites, and polyimide. In the design of flat panel detectors, the support plate is typically used to provide structural support and mechanical stability; therefore, the support plate material needs to have high strength, durability, and good processing performance to ensure the stability of the entire detector structure. Aluminum, copper, stainless steel, carbon fiber composites, and polyimide are commonly used support plate materials, each with its unique advantages and applicable scenarios. During the design and manufacturing process, appropriate materials should be selected according to specific application requirements; this invention does not impose any limitations on this selection.

[0040] S2: A protective plate is installed on the front of the support plate.

[0041] Specifically, a protective plate 220 is fabricated using protective materials to ensure effective X-ray shielding. In some embodiments, the protective plate can be made of materials such as lead, tungsten, aluminum, copper, and composite materials. In the design of flat panel detectors, the primary function of the protective plate is to protect internal electronic components and sensors from physical, chemical, and radiation damage from the external environment. Commonly used protective plate materials possess good shielding performance, mechanical strength, and corrosion resistance. Lead, tungsten, aluminum, copper, and composite materials are commonly used protective plate materials, each with its unique advantages and applicable scenarios. During the design and manufacturing process, appropriate materials should be selected according to specific application requirements; this invention does not impose any limitations on this selection.

[0042] In this embodiment of the disclosure, after the protective plate is formed, the method further includes: providing foam 230 on the outer layer of the protective plate 220.

[0043] Foam is a porous material widely used in various industrial and consumer products. There are many types of foam materials, which can be classified into various categories based on their chemical composition and physical properties, suitable for different applications. In some embodiments, polyurethane foam can be used, which has good elasticity, softness, and shock absorption properties, and can be made into foams of different densities and hardnesses.

[0044] S3: A flexible plate is provided on the outer layer of the protective plate. The flexible plate bends downward along the stacked side wall of the support plate and the protective plate, wraps around the side wall, bends to the back of the support plate, and covers the edge portion of the back of the support plate.

[0045] exist Figure 2 In the embodiment shown, the flexible plate 240 is located outside the foam 230. The flexible plate 240 bends downward along the stacked sidewall of the support plate 210, the protective plate 220 and the foam 230, wraps the stacked sidewall, bends to the back of the support plate 210, and covers the edge portion of the back of the support plate 210.

[0046] Subsequently, a GIP circuit 250 is integrated on the flexible board 240 on the back of the support plate 210, i.e., the GIP circuit 250 is located below the protective plate 220. A circuit board 260 is disposed in the central region of the back of the support plate 210, so that the circuit board 260 in the central region of the back of the support plate 210 and the flexible board 240 on the back of the support plate 210 are on the same layer. In some embodiments, the circuit board 260 includes a driver board, a readout board, and a main board.

[0047] The GIP circuit is used to control the switching state of the TFT array, enabling signal readout and processing. During operation, the GIP circuit and other electronic components folded under the protective plate transmit signals to the main board for processing via the driver board and readout board. The main board then generates a digital image, which is output through a display device or storage device. This embodiment uses advanced GIP technology, improving circuit performance and reliability, and ensuring stable performance of the flat panel detector during long-term operation.

[0048] In some embodiments, LTPS or IGZO technology can be used to fabricate GIP circuits on a flexible substrate, eliminating the need for traditional Gate COF and thus simplifying the circuit structure.

[0049] For example, in one specific embodiment, the manufacturing process of the LTPS GIP circuit may include: cleaning the substrate to remove surface impurities; depositing a silicon oxide (SiO2) layer as the bottom insulating layer on the cleaned substrate; forming an amorphous silicon (a-Si) thin film using chemical vapor deposition; annealing the amorphous silicon using an excimer laser to form LTPS; patterning the polycrystalline silicon layer using photolithography and dry etching techniques to form the active region of the TFT; depositing and patterning the gate metal, and depositing the gate insulating layer; depositing and patterning the source / drain metal, and then etching open contact holes; depositing a protective layer and opening necessary contact holes; and finally encapsulating the manufactured TFT array to prevent environmental pollution and mechanical damage. The LTPS GIP circuit converts amorphous silicon to polycrystalline silicon through laser annealing, improving electromobility and enabling the TFT device to have higher switching speed and driving capability. It is suitable for high-resolution displays and high-performance detectors.

[0050] In one specific embodiment, the manufacturing process of the IGZO GIP circuit may include: cleaning the substrate to remove surface impurities; depositing a silicon oxide (SiO2) layer on the cleaned substrate as a bottom insulating layer; depositing an IGZO thin film as the active layer of the TFT; patterning the IGZO layer using photolithography and dry etching techniques to form the active region of the TFT; depositing and patterning the gate metal, and then depositing the gate insulating layer; depositing and patterning the source / drain metal (such as Al, Mo), and then etching open contact holes; depositing a protective layer and opening necessary contact holes; and encapsulating the manufactured TFT array to prevent environmental pollution and mechanical damage. IGZO material has high field-effect mobility and low leakage current characteristics, and can be deposited at low temperatures. The IGZO GIP circuit is suitable for flexible substrates and large-area displays.

[0051] GIP circuits made using LTPS or IGZO technology can eliminate the traditional Gate COF, simplify the manufacturing process, reduce material and manufacturing costs and complexity, while improving circuit performance and reliability.

[0052] In this embodiment, the flexible plate is made of flexible polyimide (PI). PI is a polymer material with high heat resistance, good mechanical strength, and chemical stability, widely used in flexible electronic devices and displays. Using a flexible PI substrate as the flexible plate enables the flat panel detector to have a certain degree of bending capability. This design not only helps to reduce the size of the detector bezel, allowing the flat panel detector to adapt more flexibly to various usage environments, especially when it is necessary to detect irregularly shaped objects, but also, by bending and placing circuits such as GIPs under the protective plate, they are protected by a lead or tungsten material protective layer, reducing the chance of direct exposure to X-rays. This reduces direct damage to the GIP circuits from X-rays, effectively protecting the GIP circuits and other sensitive electronic components, thereby improving the stability of the TFT and the lifespan and reliability of the detector. Furthermore, the flexible PI substrate not only provides bending capability but also significantly reduces the weight of the product, making the detector more portable and suitable for mobile and portable applications.

[0053] In this embodiment of the present disclosure, the manufacturing method further includes: setting peripheral circuits on the outer layer of the flexible plate 240 on the back side of the support plate 210.

[0054] By folding the chip banding area on the flexible board under the protective board, electronic components can be integrated under the protective board, saving space and simplifying the manufacturing process. This enables COP (Chip On Plastic) technology on the flat panel detector, further reducing product costs and improving overall process efficiency.

[0055] S5: A photosensitive layer is provided on the outer layer of the flexible plate on the front side of the support plate.

[0056] Specifically, a photosensitive layer 270 is deposited on the outer layer of the flexible substrate 240 for converting X-rays into visible light. In some embodiments, the photosensitive layer can be a scintillator layer. In this embodiment, the photosensitive layer material is CsI. During use, X-rays pass through the object being detected and reach the flat panel detector. The photosensitive layer converts the X-rays into visible light, and the TFT sensor array receives the light signal and converts it into an electrical signal. It should be noted that the photosensitive layer is only disposed on the outer layer of the flexible substrate on the front side of the support plate, and no photosensitive layer is deposited in the bending area. Therefore, in some embodiments, only metal wires for connecting the photosensitive layer and the peripheral circuit are present in the bending area of ​​the flexible substrate, thereby maintaining the flexibility of the bending area and avoiding possible damage to the photosensitive layer during bending. By using a flexible substrate and a reasonable layout of the photosensitive layer, the flat panel detector can adapt to different shapes and usage scenarios, which is not limited by this invention.

[0057] In some embodiments, the method for manufacturing the flat panel detector further includes assembling other structural components, including: an upper cover, a metal frame, a rear cover, etc., to ensure the stability and reliability of the overall structure. For example, in an embodiment of this disclosure, a cavity 290 is formed by the upper cover 292, the rear cover 291, and a metal frame 293 that is perpendicular to and connects the edges of the rear cover 291 and the upper cover 292, thereby surrounding the aforementioned laminated plate structure.

[0058] In some embodiments, after the flat panel detector is manufactured, a complete system test can be performed, including X-ray imaging test, circuit stability test, bending durability test, etc., to ensure that the product meets design requirements and performance standards.

[0059] The method for manufacturing a flat panel detector provided by this invention, by comprehensively utilizing flexible materials and advanced circuit integration technology, not only solves the problems of existing flat panel detectors in terms of lifespan, stability and cost, but also significantly reduces manufacturing costs and weight, and improves the portability and reliability of the device.

[0060] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, such as the combination of technical features between embodiments, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A flat panel detector, characterized in that, Includes a laminated plate, the laminated plate comprising: Support plate; A protective plate located on the front of the support plate; A flexible plate located on the outer layer of the protective plate, the flexible plate bends downward along the stacked sidewall of the support plate and the protective plate, wraps the sidewall, bends to the back of the support plate, and covers the edge portion of the back of the support plate; A photosensitive layer is provided on the outer layer of the flexible plate located on the front side of the support plate.

2. The flat panel detector as described in claim 1, characterized in that, The laminated plate further includes foam located between the protective plate and the flexible plate.

3. The flat panel detector as described in claim 1, characterized in that, An integrated circuit is disposed on the flexible plate on the back of the support plate.

4. The flat panel detector as described in claim 1, characterized in that, Also includes: The circuit board located in the central region of the back of the support plate and the flexible plate on the back of the support plate are on the same layer.

5. The flat panel detector as described in claim 1, characterized in that, The photosensitive layer on the outer layer of the flexible plate on the front side of the support plate is located in the central region of the flexible plate; the outer layer of the flexible plate on the back side of the support plate is provided with peripheral circuits; and metal wires for connecting the photosensitive layer and the peripheral circuits are provided inside the flexible plate.

6. The flat panel detector as described in any one of claims 1-5, characterized in that, The laminated plate is located inside the cavity, which includes a rear cover and a top cover, as well as a metal frame that is perpendicular to the rear cover and the top cover and connects the edges of the rear cover and the top cover.

7. The flat panel detector as described in any one of claims 1-5, characterized in that, The flexible plate is made of polyimide.

8. A method for manufacturing a flat panel detector as described in claim 1, characterized in that, include: Provide support plates; A protective plate is provided on the front side of the support plate; A flexible plate is provided on the outer layer of the protective plate. The flexible plate bends downward along the stacked sidewall of the support plate and the protective plate, wraps around the sidewall, bends to the back of the support plate, and covers the edge portion of the back of the support plate. A photosensitive layer is provided on the outer layer of the flexible plate on the front side of the support plate.

9. The method for manufacturing a flat panel detector as described in claim 8, characterized in that, Also includes: An integrated circuit is disposed on a flexible plate on the back side of the support plate; A circuit board is disposed in the central region of the back of the support plate, and the circuit board in the central region of the back of the support plate and the flexible plate on the back of the support plate are located on the same layer; An external circuit is provided on the outer layer of the flexible plate on the back of the support plate.

10. The method for manufacturing a flat panel detector as described in claim 9, characterized in that, Also includes: A cavity is formed, the cavity including a back cover and a top cover, and a metal frame perpendicular to and connecting the edges of the back cover and the top cover, for surrounding the support plate, protective plate, flexible plate and photosensitive layer.

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