Method for efficiently polishing copper roller

Abstract

The invention discloses a method for efficiently polishing a copper roller, which comprises the following steps of: polishing the copper roller by using a polishing grinding wheel to realize the polishing of the copper roller; the polishing grinding wheel comprises diamond, cerium oxide, alumina fibers and epoxy resin. In the copper plate roller machining process, a copper roller needs to be polished to achieve a smooth effect (preferably 0.1 mu m and below), and then the copper roller is conveyed to be engraved. At present, a method of combining a polishing pad with a polishing solution or directly adopting a polishing grinding wheel is adopted for polishing, and the purposes of good machining effect and machining efficiency are difficult to achieve. A new technical thought is adopted, the resin grinding wheel is developed, a new polishing method is provided, the polishing time is obviously shortened on the basis that the machining effect of 0.1 micron or below is achieved, and the copper roller good in machining quality is obtained.

Description

Technical Field

[0001] This invention belongs to the field of metal product processing technology and relates to a method for high-efficiency polishing of copper rollers. Background Technology

[0002] Gravure printing has always held a very important position in the packaging industry. Gravure printing rollers are one of the most important components of roll-to-roll gravure printing presses. These rollers are generally used for plate making, with a copper-plated surface. The pattern is then engraved using a gravure electronic engraving machine, followed by chrome plating, before being delivered to the printing plant. They are commonly used for printing on plastic packaging. After copper plating, the roller is called a copper roller and requires polishing. Existing technology discloses a gravure copper roller polishing device. After the gravure copper roller body is mounted on a support frame, a first motor drives the roller body to rotate clockwise. A second motor drives a transmission roller to rotate counterclockwise, causing a polishing belt to move counterclockwise, bringing the polishing belt into contact with the roller body for polishing. Alternatively, the roller body can be polished on a stationary polishing belt. After the polishing belt achieves its polishing effect on the current contact surface, the second motor drives the polishing belt to move, changing the contact surface. Existing technology also provides a copper roller grinding and polishing device. One end of the mounting shaft is threaded with a locking nut, and a wool polishing wheel is fixed inside the locking nut. The other end of the mounting shaft is equipped with a pulley. Polishing belts or wool polishing wheels do not contain abrasives and require the addition of polishing fluid. Furthermore, their processing efficiency is very low, typically requiring more than 12 hours to achieve an Ra of 0.1μm. Existing technology provides a fully automated intelligent integrated printing roller production line and its process, which significantly reduces the amount of wastewater generated during the printing roller electroplating process. During production, it improves safety and work efficiency, but the resulting copper surface roughness is 0.4–0.6μm, although the polishing effect is not as good as that achieved with polishing fluid.

[0003] Therefore, it is necessary to develop new polishing methods that can significantly shorten polishing time while achieving a processing effect of 0.1μm and obtaining copper rollers with good processing quality. Summary of the Invention

[0004] The typical processing of copperplate rollers involves nickel plating followed by copper plating. After achieving the desired copper layer thickness, the roller is polished to achieve a smooth finish (ideally 0.1μm or less) before being sent for engraving. Current polishing methods, such as using polishing pads combined with polishing fluid or directly using polishing wheels, struggle to achieve both high processing quality and efficiency. This invention employs a novel approach, developing a resin-based polishing wheel and providing a new polishing method. This significantly reduces polishing time while achieving a finish of 0.1μm or less, resulting in copper rollers with superior processing quality.

[0005] The present invention adopts the following technical solution.

[0006] A method for efficiently polishing a copper roller includes the following steps: polishing the copper roller using a polishing wheel; the polishing wheel includes diamond, cerium oxide, alumina fiber, and epoxy resin.

[0007] A method for processing copper plate rollers includes a method for polishing the high-efficiency copper roller. Furthermore, it also includes conventional processes such as nickel plating, engraving, and chrome plating.

[0008] In this invention, the copper roller is a copper-plated roller.

[0009] In this invention, the length of the copper roller is 2000-10000 mm; preferably, the length of the copper roller is 3000-9000 mm; more preferably, the length of the copper roller is 4000-8000 mm; and even more preferably, the length of the copper roller is 5000-7000 mm.

[0010] In this invention, the outer diameter of the copper roller is 100-500 mm; preferably, the outer diameter of the copper roller is 120-400 mm; more preferably, the outer diameter of the copper roller is 150-300 mm; even more preferably, the outer diameter of the copper roller is 170-250 mm; and more preferably, the outer diameter of the copper roller is 180-220 mm.

[0011] In this invention, the copper roller is used for gravure printing, and the surface roughness Ra after polishing is less than 0.15μm.

[0012] In this invention, the polishing wheel also includes a plastic substrate.

[0013] In this invention, diamond, cerium oxide, and a two-component epoxy resin are mixed to obtain diamond composite particles; alumina fibers and a two-component epoxy resin are mixed to obtain alumina composite particles; the diamond composite particles, alumina composite particles, and a two-component epoxy resin are mixed in a ball rolling machine to obtain composite particles; the composite particles, cerium oxide, and a two-component epoxy resin are then mixed to prepare the working layer of a polishing wheel; finally, it is composited with a plastic matrix to form a polishing wheel. In this invention, a conventional method is used to composite the polishing wheel working layer with a plastic matrix to obtain a polishing wheel.

[0014] This invention discloses a polishing copper roller prepared according to the above-described method for high-efficiency polishing copper rollers.

[0015] This invention discloses the application of the above-mentioned polishing copper roller in gravure printing.

[0016] Printing rollers are generally used for plate making. Their surface is copper-plated to form copper rollers, and their surface quality is crucial for subsequent printing. Therefore, polishing the copper rollers is a necessary step. Currently, customers require not only good surface quality but also improved processing efficiency. Existing processing methods struggle to simultaneously meet these requirements. This invention employs a novel technical approach, using a polishing wheel comprising diamond, cerium oxide, alumina fibers, and epoxy resin combined with a plastic substrate to polish copper rollers. This solves the problem of long processing times with existing polishing pads and overcomes the issue of scratching copper rollers caused by commercially available resin grinding wheels. Through production processing experiments polishing long, large-diameter copper rollers, the method disclosed in this invention can achieve a surface roughness Ra of less than 0.1 μm within 3 hours, and no scratching of the copper rollers occurred during the grinding wheel's processing life. Compared to existing copper roller processing methods, this invention represents a significant advancement in industrial applications. Attached Figure Description

[0017] Figure 1 This is a picture of a polishing wheel.

[0018] Figure 2 This is a picture of the actual copper roller.

[0019] Figure 3 This is a schematic diagram of copper roller polishing.

[0020] Figure 4 This is a photo of a copper roller polishing process. Detailed Implementation

[0021] The methods used for polishing copper workpieces on the market are mostly mechanical polishing, chemical polishing, and electrochemical polishing. Chemical and electrochemical polishing are mainly for thin-walled and complex-shaped workpieces with small dimensions. Mechanical polishing is primarily used when processing long copper workpieces with large processing areas and specific dimensional requirements (diameter 100-500mm, length 3000-9000mm). Mechanical polishing is mainly divided into two categories: polishing tools containing abrasives and non-abrasive polishing tools using polishing liquids or pastes. Commonly used abrasive polishing tools are prone to scratching long copper workpieces with large processing areas due to the softness of the workpiece, resulting in low workpiece yield. Using non-abrasive polishing tools with polishing liquids or pastes is extremely inefficient for such long tools, with processing time exceeding 10 hours for a single workpiece. The method disclosed in this invention can achieve a surface roughness Ra of less than 0.1 μm in 3 hours, and no scratches are found on the copper roller during the grinding wheel's processing life. Compared with existing methods for processing copper rollers, this invention can better achieve technological progress for industrial applications.

[0022] Preparation Example This invention involves mixing diamond, cerium oxide, and two-component epoxy resin to obtain diamond composite particles, with a mass ratio of diamond, cerium oxide, and two-component epoxy resin of 1:(0.5-0.7):(0.8-1.2); mixing alumina fibers and two-component epoxy resin to obtain alumina composite particles, with a mass ratio of alumina fibers and two-component epoxy resin of 1:(0.8-1.2); mixing the diamond composite particles, alumina composite particles, and two-component epoxy resin in a ball rolling machine to obtain composite particles, with a mass ratio of diamond composite particles, alumina composite particles, and two-component epoxy resin of 100:(3-7):(1.5-3); then mixing the composite particles, cerium oxide, and two-component epoxy resin to prepare a polishing wheel working layer, with a mass ratio of composite particles, cerium oxide, and two-component epoxy resin of 1:(1.2-1.5):(0.8-1.2); and finally, combining the composite particles with a plastic matrix to form a polishing wheel.

[0023] Specifically: ① Mix 100g of diamond (3000#), 60g of cerium oxide (8000#), and 100g of two-component epoxy resin (YT-CC302Q, cured at room temperature for 24 hours), then pour the mixture into a conventional spherical silicone mold for curing to obtain diamond composite particles with a particle size of 0.5mm. ② Mix 100g of alumina fiber (35-40μm long) and 100g of two-component epoxy resin, then pour the mixture into a conventional spherical silicone mold for curing to obtain coarse particles with a particle size of 6mm. Then crush the mixture using conventional methods to obtain alumina composite particles with a particle size of 60-80μm. ③ Add 100g of diamond composite particles to the existing ball rolling machine, and spray 10g of two-component epoxy resin while rolling (50rpm) and spray 2g of alumina composite particles. After 30 minutes, composite particles are obtained. ④ Mix 100g of composite particles, 130g of cerium oxide, and 100g of two-component epoxy resin, then pour the mixture into a conventional silicone mold and cure it to obtain the working layer. ⑤ The above working layer is combined with the nylon matrix to obtain a polishing wheel (referred to as polishing wheel #1). The specific bonding method is a conventional technique. Specifically, an epoxy resin system is applied to the contact surfaces of the working layer and the matrix, and then they are bonded together and left at room temperature for 24 hours to achieve bonding. Figure 1 The image shows the actual product of this polishing wheel. The abrasive layer is 12mm thick and the substrate is 55mm thick.

[0024] Following the above method, the substrate was replaced with a stainless steel substrate to obtain polishing wheel #2.

[0025] Following the method described above, replace the cerium oxide in step ① with silicon carbide (2000#) to obtain polishing wheel #3.

[0026] Following the method described above, omit the cerium oxide step ④ to obtain polishing wheel #4.

[0027] Referring to the above method, step ③ is adjusted as follows: 100g of diamond composite particles, 10g of two-component epoxy resin, and 2g of alumina composite particles are stirred in a mixer at 100rpm for 1 hour to obtain composite particles, which yields a No. 5 polishing wheel.

[0028] Currently, resin grinding wheels are the mainstream application in production as No. 6 polishing wheels.

[0029] The polishing pads / polishing fluids currently used in production are also used as the No. 7 polishing wheel.

[0030] Example The copper roller polishing equipment at the existing production end is used to polish the copper rollers after copper plating, and the processing objects are the same batch of copper-plated products. Figure 2 The image shows the actual product (7000mm in length, 300mm in outer diameter). The manufacturing process is conventional. (See attached image.) Figure 3 The processing diagram is shown below. For specific polishing production details, please refer to [link / reference]. Figure 4 The processing results of each polishing wheel are shown in Table 1.

[0031] Table 1. Processing results of each polishing wheel

[0032] This invention, through a defined formula and preparation method, yields a polishing resin wheel, achieving a technological advancement in both the quality and efficiency of copper roller polishing. In particular, compared to directly mixing diamond, cerium oxide, alumina fibers, and two-component epoxy resin in a mixer and then curing to prepare the working layer (the roughness of this wheel after 3 hours of polishing is greater than 0.2 μm), this invention first prepares diamond composite particles and alumina composite particles, then mixes them with two-component epoxy resin in a ball mill to obtain composite particles. Finally, the composite particles, cerium oxide, and two-component epoxy resin are mixed to prepare the polishing wheel working layer, achieving the following technical effects: The abrasive particles and processing layer prepared using a liquid epoxy resin mixing method exhibit more uniform dispersion of diamond abrasive and cerium oxide filler in the particles and processing layer compared to traditional mixing machines. During the preparation of the diamond composite spheres, the outer ring is essentially protected by a layer of fiber filaments. The long tendrils of the fiber layer strengthen the connection between the abrasive particles, and combined with the secondary bonding of the resin, improve the overall stability of the grinding wheel. Utilizing resin granulation and combining it with the fiber filaments, the abrasive particles "grow from small to large," with each particle composed of a dozen or more smaller particles, forming an infinite number of cutting edges, greatly improving cutting efficiency. Furthermore, the addition of fiber filaments not only strengthens the abrasive but also... This process enhances the strength of the abrasive itself, while the fibers also act as a polishing agent, improving polishing efficiency. After 3 hours of processing, the surface roughness Ra can reach 0.09μm (in contrast, the aramid fiber abrasive wheel developed at the same time, although with a slightly longer service life, cannot achieve a polishing effect of 0.1μm or less after 3 hours). By using a rolling method, the resin abrasive particles are first wetted and then bonded, effectively adhering the liquid-powder mixed composite layer to the surface of the resin abrasive particles. Combined with cerium oxide, it can prevent air bubbles from forming large pores inside the abrasive wheel, and also promotes polishing during processing while avoiding burns caused by overheating of the processed surface.

[0033] In current production processes, polishing copper rollers with resin grinding wheels often results in surface defects. Therefore, for some high-end applications, a combination of polishing pads and liquids is still used, but this method is inefficient. Both of these methods keep the cost of copper roller polishing high. Since copper roller polishing is a crucial step in the many processes of printing rollers, improving efficiency and yield while maintaining polishing quality is beneficial to the entire industry. This invention employs a novel technical approach to develop a new method for polishing copper rollers, unexpectedly achieving highly efficient and high-quality polishing.

Claims

1. A method for efficiently polishing copper rollers, characterized in that, The process includes the following steps: polishing a copper roller using a polishing wheel; the polishing wheel includes diamond, cerium oxide, alumina fiber, and epoxy resin.

2. The method for high-efficiency polishing copper rollers according to claim 1, characterized in that, The copper roller is a copper-plated roller.

3. The method for high-efficiency polishing copper rollers according to claim 1, characterized in that, The length of the copper roller is 2000-10000 mm; the outer diameter of the copper roller is 100-500 mm.

4. The method for high-efficiency polishing copper rollers according to claim 1, characterized in that, The length of the copper roller is 3000-9000 mm; the outer diameter of the copper roller is 120-400 mm.

5. The method for high-efficiency polishing copper rollers according to claim 1, characterized in that, The length of the copper roller is 4000-8000 mm; the outer diameter of the copper roller is 150-300 mm.

6. The method for high-efficiency polishing copper rollers according to claim 1, characterized in that, Copper rollers are used for gravure printing, and the surface roughness Ra after polishing is less than 0.15μm.

7. The method for high-efficiency polishing copper rollers according to claim 1, characterized in that, Polishing wheels also include a plastic base.

8. The method for high-efficiency polishing copper rollers according to claim 1, characterized in that, Diamond composite particles are obtained by mixing diamond, cerium oxide, and two-component epoxy resin; alumina composite particles are obtained by mixing alumina fibers and two-component epoxy resin; diamond composite particles, alumina composite particles, and two-component epoxy resin are mixed in a ball rolling machine to obtain composite particles; the composite particles, cerium oxide, and two-component epoxy resin are then mixed to prepare the working layer of a polishing wheel; finally, the composite particles are combined with a plastic matrix to form a polishing wheel.

9. A method for processing a copperplate roller, characterized in that, The method includes the high-efficiency polishing copper roller described in claim 1.

10. The polishing copper roller prepared by the method of the high-efficiency polishing copper roller according to claim 1, and the application of the polishing copper roller in gravure printing.

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