Self-adaptive fitting and polishing device based on circular parting

Abstract

The invention relates to a self-adaptive attaching and grinding device based on circular parting. The self-adaptive attaching and grinding device comprises a translation mechanism, a fixing frame, a lifting mechanism, an elastic assembly and a circular parting grinding module. The fixing frame is arranged on the translation mechanism; the lifting mechanism is arranged on the fixing frame; the elastic assembly is arranged on the lifting mechanism; the circular parting polishing module is arranged at the bottom of the elastic assembly. The circular parting grinding module comprises at least two sets of adjusting units, every two adjacent sets of adjusting units are connected through a linkage rotating mechanism, so that the lower adjusting unit can rotate relative to the upper adjusting unit, and a grinding layer is arranged at the bottom of the lowermost adjusting unit. The adjusting unit is a columnar supporting frame, the side face of the supporting frame comprises an arc-shaped face and a plane which are connected with each other, and the size of the adjusting unit is reduced from top to bottom. And the polishing layer is pressed on the surface of the pultrusion product through the elastic assembly. According to the grinding device, the irregular surface of the pultrusion product is ground through the circular parting grinding module, so that the applicability of the grinding device is higher.

Description

Technical Field

[0001] This application relates to the field of pultrusion product polishing technology, and in particular to an adaptive bonding polishing device based on circular parting. Background Technology

[0002] According to the requirements of the pultrusion process, a release agent needs to be added to the pultrusion resin. This results in weak interfacial strength between the outer surface of the pultruded product and other materials in subsequent processes. Release agent residue remains on the surface of the pultruded product, necessitating in-line sanding to improve its surface properties. CN115179150A describes surface treatment of carbon fiber pultruded sheets using abrasive belts; however, abrasive belts can only perform flat surface sanding and cannot meet the sanding requirements for different surface shapes of pultruded products.

[0003] In the existing technology, the surface of pultruded products is mainly treated by abrasive belts, but abrasive belts can only perform flat grinding and cannot meet the grinding needs of different surface shapes of pultruded products.

[0004] To address this, we propose an adaptive bonding and polishing device based on circular parting. Summary of the Invention

[0005] To address the shortcomings of existing production technologies, the applicant provides an adaptive bonding and polishing device based on a circular parting line. By incorporating a circular parting line polishing module, this device can adapt to the irregular surfaces of pultruded products. This allows the circular parting line polishing module to polish not only the flat surfaces of pultruded products but also their irregular surfaces, thus enhancing the applicability of the polishing device.

[0006] The technical solution adopted in this application is as follows: An adaptive bonding and polishing device based on circular parting lines, comprising: Translation mechanism; A fixed frame is mounted on a translation mechanism, which drives the fixed frame to translate. The lifting mechanism is mounted on a fixed frame. The elastic component is mounted on the lifting mechanism, which drives the elastic component to move up and down. The circular parting grinding module is located at the bottom of the elastic component; The circular parting grinding module includes at least two sets of adjustment units. The two adjacent sets of adjustment units are connected by a linkage rotation mechanism, so that the lower adjustment unit can rotate relative to the upper adjustment unit. The bottom of the lowest adjustment unit is provided with a grinding layer. The adjustment unit is a columnar support frame. The side of the support frame includes interconnected arc surfaces and planes. The size of the adjustment unit decreases from top to bottom. The grinding layer is pressed onto the surface of the pultruded product by an elastic component.

[0007] Its further features are: The circular parting grinding module includes two sets of adjustment units, namely a primary adjustment unit and a secondary adjustment unit. The arc-shaped surface of the primary adjustment unit is fixedly connected to the elastic component. The plane of the primary adjustment unit is set downward, and the plane of the primary adjustment unit is provided with a first arc-shaped groove. The arc-shaped surface of the secondary adjustment unit is movably set in the first arc-shaped groove through a linkage rotation mechanism, and the secondary adjustment unit can rotate in the first arc-shaped groove.

[0008] The linkage rotation mechanism includes a T-shaped rod and a T-shaped groove. The T-shaped rod is movably disposed in the T-shaped groove, one end of the T-shaped rod is fixed in the first arc-shaped groove, and the T-shaped groove is disposed on the arc-shaped surface of the secondary adjustment unit.

[0009] The translation mechanism is a linear motor, and the lifting mechanism is a cylinder.

[0010] The elastic component is a spring.

[0011] The polishing layer is made of flexible sandpaper and polishing cloth.

[0012] The circular parting grinding module includes three sets of adjustment units, namely a primary adjustment unit, a secondary adjustment unit, and a tertiary adjustment unit.

[0013] The circular parting grinding module includes four sets of adjustment units, two of which are a first-level adjustment unit, a second-level adjustment unit, a third-level adjustment unit, and a fourth-level adjustment unit.

[0014] It also includes a bonding detection component, which is located at the bottom of the polishing layer and is used to detect whether the polishing layer and the pultruded product are fully bonded.

[0015] The bonding detection component consists of multiple miniature pressure sensors, with an array of these sensors distributed at the bottom of the polished layer.

[0016] The beneficial effects of this application are as follows: This application features a compact and reasonable structure, and is easy to operate. The pultruded product is fixed below the circular parting-point grinding module. A lifting mechanism, via an elastic component, moves the circular parting-point grinding module downwards, pressing it against the surface of the pultruded product. The elastic component's compression of the module causes rotation between the adjusting units, ensuring the grinding layer adheres to the pultruded product. A bonding detection component checks whether the grinding layer and the pultruded product are completely bonded. When the pressure values ​​from multiple micro-pressure sensors are uniform, the grinding layer is considered to be in perfect contact. A translation mechanism, via a fixed frame, lifting mechanism, and elastic component, moves the circular parting-point grinding module, grinding the pultruded product through the grinding layer. By incorporating the circular parting-point grinding module, it can adapt to irregular surfaces of the pultruded product. This allows the circular parting-point grinding module to grind not only flat surfaces but also irregular surfaces of the pultruded product, making the grinding device more versatile.

[0017] In addition, this application also has the following advantages: (1) The bonding detection component consists of multiple micro pressure sensors. The array of multiple micro pressure sensors is distributed at the bottom of the polishing layer. After the polishing layer comes into contact with the pultruded product, when the pressure values ​​of the multiple micro pressure sensors are uniform, the polishing layer and the pultruded product are completely bonded. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of this application.

[0019] Figure 2 This is a cross-sectional schematic diagram of the circular parting grinding module of this application.

[0020] Figure 3 for Figure 2 Schematic diagram of the AA section.

[0021] Figure 4 This is a schematic diagram of the circular parting grinding module and the pultruded product of this application. Figure 1 .

[0022] Figure 5 This is a schematic diagram of the circular parting grinding module and the pultruded product of this application. Figure 2 .

[0023] Figure 6 This is a schematic diagram of the circular parting grinding module and the pultruded product of this application. Figure 3 .

[0024] Figure 7 This is a schematic diagram of the circular parting grinding module of this application. Figure 1 .

[0025] Figure 8 This is a schematic diagram of the circular parting grinding module of this application. Figure 2 .

[0026] Figure 9 This is a schematic diagram of the primary regulating unit of this application.

[0027] Figure 10 This is a schematic diagram of the polishing layer and bonding detection component of this application.

[0028] The components include: 1. Translation mechanism; 2. Fixing frame; 3. Lifting mechanism; 4. Elastic component; 5. Circular parting and grinding module; 6. Bonding and detection component; 7. Pultruded product; 51. Adjustment unit; 52. Linkage rotation mechanism; 53. Grinding layer; 511. Primary regulating unit; 512. Secondary regulating unit; 513. Tertiary regulating unit; 514. Quaternary regulating unit; 5111, First arc-shaped groove; 521. T-shaped bar; 522. T-shaped groove. Detailed Implementation

[0029] The specific embodiments of this application are described below with reference to the accompanying drawings.

[0030] like Figures 1-10 As shown, an adaptive bonding and polishing device based on circular parting includes a translation mechanism 1, a fixed frame 2, a lifting mechanism 3, an elastic component 4, a circular parting polishing module 5, and a bonding detection component 6. The fixed frame 2 is mounted on the translation mechanism 1, and the fixed frame 2 is moved horizontally by the translation mechanism 1; the lifting mechanism 3 is mounted on the fixed frame 2, the elastic component 4 is mounted on the lifting mechanism 3, and the elastic component 4 is lifted and lowered by the lifting mechanism 3; the round parting grinding module 5 is located at the bottom of the elastic component 4.

[0031] In one embodiment, the translation mechanism 1 can be a linear motor, and the fixing frame 2 is fixed on the displacement block of the linear motor, and the fixing frame 2 is driven to translate by the linear motor.

[0032] The translation mechanism 1 can also be other structures that can drive the fixed frame 2 to translate.

[0033] In one embodiment, the lifting mechanism 3 can be a cylinder, with one end of the cylinder fixedly connected to the fixed frame 2 and the other end of the cylinder fixedly connected to the elastic component 4.

[0034] The lifting mechanism 3 can also be other structures capable of lifting.

[0035] In one embodiment, the elastic component 4 can be a spring, or it can be other structures.

[0036] The circular parting polishing module 5 includes at least two sets of adjustment units 51. The two adjacent sets of adjustment units 51 are connected by a linkage rotation mechanism 52, so that the lower adjustment unit 51 can rotate relative to the upper adjustment unit 51. The bottom of the lowest adjustment unit 51 is provided with a polishing layer 53.

[0037] The adjustment unit 51 is a columnar support frame. The side of the support frame includes interconnected arc-shaped surfaces and flat surfaces. The size of the adjustment unit 51 decreases from top to bottom.

[0038] In one embodiment, the polishing layer 53 is flexible sandpaper or polishing cloth.

[0039] In one embodiment, the adjustment unit 51 is made of elastic metal.

[0040] In one embodiment, the circular parting grinding module 5 includes two sets of adjustment units 51, namely a primary adjustment unit 511 and a secondary adjustment unit 512. The arc-shaped surface of the primary adjustment unit 511 is fixedly connected to the elastic component 4. The plane of the primary adjustment unit 511 is set downward, and the plane of the primary adjustment unit 511 is provided with a first arc-shaped groove 5111. The arc-shaped surface of the secondary adjustment unit 512 is movably set in the first arc-shaped groove 5111 through a linkage rotation mechanism 52, and the secondary adjustment unit 512 can rotate in the first arc-shaped groove 5111.

[0041] The linkage rotation mechanism 52 includes a T-shaped rod 521 and a T-shaped groove 522. The T-shaped rod 521 is movably disposed in the T-shaped groove 522. One end of the T-shaped rod 521 is fixed in the first arc-shaped groove 5111. The T-shaped groove 522 is disposed on the arc-shaped surface of the secondary adjustment unit 512.

[0042] In one embodiment, such as Figure 7 As shown, the circular parting grinding module 5 includes three sets of adjustment units 51, two of which are a first-level adjustment unit 511, a second-level adjustment unit 512, and a third-level adjustment unit 513.

[0043] In one embodiment, such as Figure 8 As shown, the circular parting grinding module 5 includes four sets of adjustment units 51, two of which are a first-level adjustment unit 511, a second-level adjustment unit 512, a third-level adjustment unit 513, and a fourth-level adjustment unit 514.

[0044] The bonding detection component 6 is set at the bottom of the polishing layer 53. The bonding detection component 6 is used to detect whether the polishing layer 53 and the pultruded product 7 are completely bonded.

[0045] In one embodiment, a fixing device is provided below the circular parting grinding module 5 for fixing the pultruded product 7.

[0046] In one embodiment, the bonding detection component 6 is a plurality of miniature pressure sensors. The array of miniature pressure sensors is distributed at the bottom of the polishing layer 53. After the polishing layer 53 comes into contact with the pultruded product 7, when the pressure values ​​of the plurality of miniature pressure sensors 6 are uniform, the polishing layer 53 and the pultruded product 7 are completely bonded.

[0047] In practical use, the pultruded product 7 is fixed below the circular parting grinding module 5. The lifting mechanism 3 drives the circular parting grinding module 5 downward through the elastic component 4, so that the circular parting grinding module 5 presses against the surface of the pultruded product 7. The elastic component 4 elastically squeezes the circular parting grinding module 5, causing the adjusting units 51 to rotate, so that the grinding layer 53 adheres to the pultruded product 7. The adhesion detection component 6 detects whether the grinding layer 53 and the pultruded product 7 are completely adhered. When the pressure values ​​of the multiple micro pressure sensors 6 are uniform, the grinding layer 53 and the pultruded product 7 are completely adhered. The translation mechanism 1 works, and the translation mechanism 1 drives the circular parting grinding module 5 to move through the fixed frame 2, the lifting mechanism 3 and the elastic component 4, and grinds the pultruded product 7 through the grinding layer 53.

[0048] By incorporating the circular parting grinding module 5, the irregular surface of the pultruded product 7 can be adapted. This allows the circular parting grinding module 5 to grind not only the flat surfaces of the pultruded product 7 but also the irregular surfaces, thus increasing the applicability of the grinding device.

[0049] The above description is an explanation of this application and not a limitation thereof. The scope of this application is defined by the claims. Within the scope of protection of this application, any form of modification may be made.

Claims

1. An adaptive bonding and polishing device based on circular parting lines, characterized in that, include: Translation mechanism (1); The fixed frame (2) is set on the translation mechanism (1), and the fixed frame (2) is driven to translate by the translation mechanism (1); The lifting mechanism (3) is mounted on the fixed frame (2); The elastic component (4) is mounted on the lifting mechanism (3), and the lifting mechanism (3) drives the elastic component (4) to rise and fall. The circular parting grinding module (5) is set at the bottom of the elastic component (4); Among them, the round parting grinding module (5) includes at least two sets of adjustment units (51). The two sets of adjustment units (51) are connected by a linkage rotation mechanism (52), so that the lower adjustment unit (51) can rotate relative to the upper adjustment unit (51). The bottom of the lowest adjustment unit (51) is provided with a grinding layer (53). The adjustment unit (51) is a columnar support frame. The side of the support frame includes an interconnected arc surface and a plane. The size of the adjustment unit (51) decreases from top to bottom. The grinding layer (53) is pressed onto the surface of the pultruded product (7) by the elastic component (4).

2. The adaptive bonding and polishing device based on circular parting as described in claim 1, characterized in that: The circular parting grinding module (5) includes two sets of adjustment units (51), which are a first-level adjustment unit (511) and a second-level adjustment unit (512). The arc surface of the first-level adjustment unit (511) is fixedly connected to the elastic component (4). The plane of the first-level adjustment unit (511) is set downward, and the plane of the first-level adjustment unit (511) is provided with a first arc groove (5111). The arc surface of the second-level adjustment unit (512) is movably set in the first arc groove (5111) through the linkage rotation mechanism (52). The second-level adjustment unit (512) can rotate in the first arc groove (5111).

3. The adaptive bonding and polishing device based on circular parting as described in claim 2, characterized in that: The linkage rotation mechanism (52) includes a T-shaped rod (521) and a T-shaped groove (522). The T-shaped rod (521) is movably disposed in the T-shaped groove (522). One end of the T-shaped rod (521) is fixed in the first arc groove (5111). The T-shaped groove (522) is disposed on the arc surface of the secondary adjustment unit (512).

4. The adaptive bonding and polishing device based on circular parting as described in claim 1, characterized in that: The translation mechanism (1) is a linear motor, and the lifting mechanism (3) is a cylinder.

5. The adaptive bonding and polishing device based on circular parting as described in claim 1, characterized in that: The elastic component (4) is a spring.

6. The adaptive bonding and polishing device based on circular parting as described in claim 1, characterized in that: The polishing layer (53) is flexible sandpaper or polishing cloth.

7. The adaptive bonding and polishing device based on circular parting as described in claim 1, characterized in that: The circular parting grinding module (5) includes three sets of adjustment units (51), two of which are a first-level adjustment unit (511), a second-level adjustment unit (512), and a third-level adjustment unit (513).

8. The adaptive bonding and polishing device based on circular parting as described in claim 1, characterized in that: The circular parting grinding module (5) includes four sets of adjustment units (51), two of which are a first-level adjustment unit (511), a second-level adjustment unit (512), a third-level adjustment unit (513), and a fourth-level adjustment unit (514).

9. The adaptive bonding and polishing device based on circular parting as described in claim 1, characterized in that: It also includes a bonding detection component (6), which is set at the bottom of the polishing layer (53) and is used to detect whether the polishing layer (53) and the pultruded product (7) are fully bonded.

10. The adaptive bonding and polishing device based on circular parting as described in claim 9, characterized in that: The bonding detection component (6) consists of multiple micro pressure sensors, and the array of multiple micro pressure sensors is distributed at the bottom of the polishing layer (53).

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