Movable automatic grinding device and method

Abstract

The invention relates to a movable automatic grinding device and method. The movable automatic grinding device comprises a movable platform. The mechanical arm is arranged on the moving platform; the scanning component is arranged on the mechanical arm and is used for scanning surface defects and process characteristics of the workpiece to be polished; the polishing component is arranged on the mechanical arm and is used for polishing surface defects; the coordinate system establishing module is used for establishing a workpiece coordinate system according to the process characteristics and confirming defect position coordinates of the surface defects in the workpiece coordinate system; the coordinate conversion module is used for forming a spatial transformation matrix according to the relative pose relation between the workpiece coordinate system and the base coordinate system; the defect position coordinates of the surface defects in the workpiece coordinate system are converted into target position coordinates in the base coordinate system according to the spatial transformation matrix; and the path planning module is used for planning the motion path of the mechanical arm according to the target position coordinates of the surface defects in the base coordinate system. Through the technical scheme provided by the invention, the polishing precision can be improved.

Description

Technical Field

[0001] This application relates to the field of workpiece grinding technology, and in particular to mobile automated grinding devices and methods. Background Technology

[0002] Grinding devices are used to automate the grinding process on the surface of workpieces, thereby improving grinding efficiency and precision. A grinding device typically includes a robotic arm and a grinding tool located at the end of the robotic arm. The grinding tool moves along a preset path driven by the robotic arm to grind the surface of the workpiece.

[0003] In related technologies, to adapt to the production line processing of large workpieces, grinding devices typically include a moving platform, on which a robotic arm is mounted. When different areas of the workpiece need to be ground, the moving platform carries the entire robotic arm to position the grinding device at the grinding station. However, the positioning accuracy of the moving platform is relatively low, resulting in a large positioning deviation of the grinding device at the grinding station. The deviation in the stopping position of the moving platform affects the origin position accuracy of the robotic arm's base coordinate system, causing the grinding path of the grinding tool to deviate from the preset path, thus affecting the grinding accuracy. Summary of the Invention

[0004] Therefore, it is necessary to provide a mobile automated grinding device and method to address the problem that the low positioning accuracy of the mobile platform affects the grinding accuracy of the grinding device.

[0005] On the one hand, this application provides a mobile automated grinding device, which includes:

[0006] Mobile platform;

[0007] A robotic arm includes a base, which is mounted on a mobile platform, and the robotic arm has a base coordinate system.

[0008] The scanning component is mounted on the robotic arm and is used to scan the surface defects and process features of the workpiece to be polished.

[0009] The grinding component is mounted on the robotic arm and is used to grind surface defects.

[0010] The coordinate system establishment module is used to establish a workpiece coordinate system based on process characteristics and to confirm the position coordinates of surface defects in the workpiece coordinate system.

[0011] The coordinate transformation module is used to form a spatial transformation matrix based on the relative pose relationship between the workpiece coordinate system and the base coordinate system; and to convert the defect position coordinates of the surface defect in the workpiece coordinate system into the target position coordinates in the base coordinate system based on the spatial transformation matrix.

[0012] The path planning module is used to plan the motion path of the robotic arm based on the target position coordinates of the surface defect in the base coordinate system.

[0013] In one embodiment, the robotic arm includes a first docking portion, the scanning component includes a second docking portion, and the grinding component includes a third docking portion, wherein the first docking portion can be selectively connected to or disconnected from the second and third docking portions.

[0014] In one embodiment, the mobile automated polishing device further includes:

[0015] The reference part is fixed relative to the base and has a center;

[0016] A probe is disposed on the grinding component and is used to contact at least three measuring points on the reference part, wherein the at least three measuring points are not collinear;

[0017] The position calibration module is used to fit the fitting center of the reference part based on at least three measurement points and obtain the position of the fitting center in the coordinate system of the grinding component; and to obtain the installation offset between the third docking part and the first docking part based on the actual position coordinates of the fitting center in the actual coordinate system of the grinding component and the theoretical position coordinates of the center of the reference part in the theoretical coordinate system of the grinding component; the path planning module is used to correct the motion path of the robotic arm based on the installation offset.

[0018] In one embodiment, the mobile automated polishing device further includes:

[0019] A force sensor is installed on the grinding component and / or the robotic arm to detect the force exerted when the probe contacts the reference part. The force sensor is communicatively connected to the position calibration module and the probe. When the force sensor detects that the force exerted when the probe contacts the reference part is within a preset range, the position calibration module records the position information of the corresponding measurement point.

[0020] In one embodiment, the mobile automated polishing device further includes:

[0021] The first clamping part is disposed on the moving platform and is used to clamp or release the scanning component;

[0022] The second clamping part is provided on the moving platform and is used to clamp or release the grinding component.

[0023] In one embodiment, the mobile platform is provided with a first mounting cavity and a second mounting cavity, a first clamping part is disposed in the first mounting cavity, and a second clamping part is disposed in the second mounting cavity; the mobile automated grinding device further includes:

[0024] The first cover is disposed on the mobile platform and is used to block or open the first mounting cavity;

[0025] The second cover is set on the mobile platform and is used to seal or open the second mounting cavity.

[0026] In one embodiment, the first clamping part is movably disposed relative to the moving platform along the depth direction of the first mounting cavity to drive the scanning component in and out of the first mounting cavity; the second clamping part is movably disposed relative to the moving platform along the depth direction of the second mounting cavity to drive the grinding component in and out of the second mounting cavity.

[0027] On the other hand, this application provides a mobile automated polishing method, which applies the mobile automated polishing device of any of the above embodiments. The mobile automated polishing method includes the following steps:

[0028] The mobile platform moves to the target workstation;

[0029] The scanning component identifies surface defects and process features on the workpiece to be polished;

[0030] The coordinate system establishment module establishes the workpiece coordinate system based on the process characteristics and confirms the position coordinates of surface defects in the workpiece coordinate system.

[0031] The coordinate transformation module forms a spatial transformation matrix based on the relative pose relationship between the workpiece coordinate system and the base coordinate system, and converts the defect position coordinates of the surface defect in the workpiece coordinate system into the target position coordinates of the surface defect in the base coordinate system based on the spatial transformation matrix.

[0032] The path planning module plans the motion path of the robotic arm based on the target position coordinates of the surface defect in the base coordinate system;

[0033] The robotic arm drives the grinding components to grind surface defects along the motion path.

[0034] In one embodiment, the robotic arm includes a first docking portion, the scanning component includes a second docking portion, and the grinding component includes a third docking portion, wherein the first docking portion can be selectively connected to or disconnected from the second and third docking portions;

[0035] After the scanning component identifies the surface defects and process features on the workpiece to be polished, it disconnects the first and second docking parts and connects the first and third docking parts.

[0036] In one embodiment, after connecting the first docking part and the third docking part, the mobile automated grinding method further includes:

[0037] The installation offset between the third docking part and the first docking part is obtained; and the path planning module plans the motion path of the robotic arm based on the target position coordinates of the surface defect in the base coordinate system. The path planning module further corrects the motion path based on the installation offset; the robotic arm drives the grinding component to grind the surface defect along the corrected motion path.

[0038] The aforementioned mobile automated grinding device and method scans the surface defects and process features on the workpiece to be ground using a scanning unit mounted on a robotic arm. A coordinate system establishment module establishes a workpiece coordinate system based on the process features and confirms the defect position coordinates within this system. A coordinate transformation module then forms a spatial transformation matrix based on the relative pose relationship between the workpiece and base coordinate systems. This matrix transforms the defect position coordinates in the workpiece coordinate system to the target position coordinates in the base coordinate system. Finally, a path planning module plans the robotic arm's motion path based on the target position coordinates of the surface defect in the base coordinate system. The robotic arm then moves along this path, driving the grinding components to grind the surface defects. In this application, the workpiece coordinate system is directly associated with the actual shape and position of the workpiece to be ground. By transforming the defect position coordinates in the workpiece coordinate system to the target position coordinates in the base coordinate system, the planning reference for the robotic arm's motion path is determined by the workpiece's geometric features and position. Therefore, positional deviations of the moving platform do not affect the accuracy of calculating the target position coordinates of the surface defect in the base coordinate system, thus improving grinding accuracy. Attached Figure Description

[0039] Figure 1 This is a schematic diagram of a mobile automated grinding device.

[0040] Figure 2 This is a partial structural cross-sectional view of a mobile automated grinding device.

[0041] Figure 3 A schematic diagram showing the connection between the end of the robotic arm furthest from the base and the grinding component;

[0042] Figure 4 This is a flowchart illustrating a mobile automated grinding method.

[0043] Explanation of reference numerals in the attached figures:

[0044] 10. Mobile platform; 101. Reference unit; 1001. First mounting cavity; 1002. Second mounting cavity;

[0045] 11. Walking base; 12. Mounting shell;

[0046] 20. Robotic arm; 21. Base; 22. First docking part; 23. Joint component;

[0047] 30. Scanning component; 31. Second docking part;

[0048] 40. Grinding component; 41. Third mating part;

[0049] 50. Probe;

[0050] 60. Force sensor;

[0051] 71. First clamping part; 72. Second clamping part;

[0052] 81. First cover; 82. Second cover;

[0053] 91. First lifting section; 92. Second lifting section. Detailed Implementation

[0054] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0055] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0056] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0057] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0058] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0059] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0060] See Figure 1 and Figure 2A mobile automated grinding device includes a mobile platform 10, a robotic arm 20, a scanning component 30, a grinding component 40, a coordinate system establishment module, a coordinate transformation module, and a path planning module. The robotic arm 20 includes a base 21 mounted on the mobile platform 10 and has a base coordinate system. The scanning component 30 is mounted on the robotic arm 20 and used to scan surface defects and process features of the workpiece to be ground. The grinding component 40 is mounted on the robotic arm 20 and used to grind surface defects. The coordinate system establishment module is used to establish a workpiece coordinate system based on process features and to confirm the defect position coordinates of surface defects in the workpiece coordinate system. The coordinate transformation module is used to form a spatial transformation matrix based on the relative pose relationship between the workpiece coordinate system and the base coordinate system, and to convert the defect position coordinates of the surface defects in the workpiece coordinate system into target position coordinates in the base coordinate system based on the spatial transformation matrix. The path planning module is used to plan the motion path of the robotic arm 20 based on the target position coordinates of the surface defects in the base coordinate system.

[0061] The aforementioned mobile automated grinding device uses a scanning component 30 mounted on a robotic arm 20 to scan surface defects and process features on the workpiece to be ground. A coordinate system establishment module establishes a workpiece coordinate system based on the process features and confirms the defect position coordinates within the workpiece coordinate system. A coordinate transformation module then forms a spatial transformation matrix based on the relative pose relationship between the workpiece and base coordinate systems, transforming the defect position coordinates in the workpiece coordinate system to the target position coordinates in the base coordinate system. Finally, a path planning module plans the motion path of the robotic arm based on the target position coordinates of the surface defect in the base coordinate system. The robotic arm 20 then drives the grinding component 40 to grind the surface defects. In this application, the workpiece coordinate system is directly associated with the actual shape and position of the workpiece to be ground. By transforming the defect position coordinates in the workpiece coordinate system to the target position coordinates in the base coordinate system, the planning reference for the robotic arm's motion path is determined by the geometric features and position of the workpiece itself. Therefore, positional deviations of the moving platform do not affect the calculation accuracy of the target position coordinates of the surface defect in the base coordinate system, thus improving grinding accuracy.

[0062] See Figures 1 to 3The robotic arm 20 includes a first docking portion 22, the scanning component 30 includes a second docking portion 31, and the grinding component 40 includes a third docking portion 41. The first docking portion 22 can be selectively connected to or disconnected from the second docking portion 31 and the third docking portion 41. This arrangement allows the scanning component 30 to separate from the robotic arm 20 when the grinding component 40 is grinding surface defects, preventing dust generated during the grinding process from contaminating the scanning component 30 and preventing debris generated during the grinding process from damaging the scanning component 30, thus helping to extend the service life of the scanning component 30. Furthermore, since both the scanning component 30 and the grinding component 40 are mounted on the first docking portion 22, the two functional components can be replaced using only one first docking portion 22, simplifying the mechanical structure.

[0063] See Figure 1 and Figure 3 The robotic arm 20 has a six-axis structure. It also includes a joint component 23 mounted on a base 21. A first docking portion 22 is located at the end of the joint component 23 furthest from the base 21. The joint component 23 can drive the first docking portion 22 to move flexibly in space, thereby enabling the scanning component 30 and the grinding component 40 to perform their tasks. This configuration enhances the flexibility of the device.

[0064] In some embodiments, the mobile automated grinding device further includes a reference part 101, a probe 50, and a position calibration module. The reference part 101 is fixed relative to the base 21 and has a center. The probe 50 is disposed on the grinding component 40 and is used to contact at least three measurement points on the reference part 101, the at least three measurement points being non-collinear. The position calibration module is used to fit the fitting center of the reference part 101 based on the at least three measurement points and obtain the position of the fitting center in the actual grinding component coordinate system. It is also used to obtain the installation offset between the third docking part 41 and the first docking part 22 based on the actual position coordinates of the fitting center in the actual grinding component coordinate system and the theoretical position coordinates of the center of the reference part 101 in the theoretical grinding component coordinate system. The path planning module is used to correct the motion path of the robotic arm 20 based on the installation offset. After the third docking part 41 of the grinding component 40 is connected to the first docking part 22, there may be an installation deviation between the actual installation position of the third docking part 41 and the preset installation position. The setting of the reference part 101, the probe 50 and the position calibration module can confirm the installation offset between the third docking part 41 and the first docking part 22, and the movement path of the robotic arm 20 can be corrected in real time through the path planning module to further improve the grinding accuracy.

[0065] In some embodiments, a reference portion 101 is disposed on the mobile platform 10, and the reference portion 101 includes a sphere, with the center of the reference portion 101 being the center of the sphere. This arrangement improves the ease of confirming the center of the reference portion 101.

[0066] Understandably, after the third mating part 41 of the grinding component 40 is installed with the first mating part 22, the grinding component 40 is in its theoretical installation position relative to the first mating part 22, and the grinding component 40 has a theoretical grinding component coordinate system when it is in its theoretical installation position. Knowing the theoretical position coordinates of the center of the reference part 101 in the base coordinate system, the theoretical position coordinates of the center of the reference part 101 in the theoretical grinding component coordinate system can be determined. During actual installation, there may be an installation deviation between the grinding component 40 and the first mating part 22; at this time, the grinding component has an actual grinding component coordinate system.

[0067] Specifically, the position of the reference part 101 in the base coordinate system is fixed and known, and the position of the probe tip 50 in the actual grinding component coordinate system is fixed and known. When the first docking part 22 of the robotic arm 20 drives the grinding component 40 to move in various different postures, the probe 50 changes its posture with the movement of the grinding component 40 and contacts at least three non-collinear measurement points on the reference part 101, collecting spatial coordinate data of the probe 50 when it contacts the measurement points in each posture. The position calibration module fits the fitting center of the reference part 101 in the actual grinding component coordinate system based on multiple sets of data, and performs inverse kinematics calculation to solve for the installation offset after the third docking part 41 is connected to the first docking part 22.

[0068] In some embodiments, the mobile automated grinding device further includes a force sensor 60. The force sensor 60 is mounted on the grinding component 40 or the robotic arm 20 and is used to detect the force exerted when the probe 50 contacts the reference part 101. The force sensor 60 is communicatively connected to both the position calibration module and the probe 50. When the force sensor 60 detects that the force exerted when the probe 50 contacts the reference part 101 is within a preset range, the position calibration module records the position information of the corresponding measurement point. It is understood that if the force exerted when the probe 50 contacts the reference part 101 exceeds the preset range, there may be cases where the probe 50 does not make proper contact or is excessively compressed, affecting the accuracy of data acquisition at the measurement point, the accuracy of calculating the fitting center, the accuracy of calculating the installation offset, and consequently the accuracy of the motion path correction, thus affecting the grinding accuracy. The force sensor 60 improves the accuracy of data acquisition at the measurement point and the accuracy of calculating the fitting center.

[0069] In some embodiments, the force sensor 60 includes a six-dimensional force sensor. This configuration results in high detection accuracy for the force sensor 60.

[0070] Furthermore, the grinding component 40 includes a constant-force floating grinding head, and the force sensor 60 is communicatively connected to the constant-force floating grinding head to monitor the contact force during the grinding process in real time. Based on the contact force between the constant-force floating grinding head and the workpiece, the grinding component 40 controls the floating amplitude of the constant-force floating grinding head, reducing surface damage or insufficient grinding caused by excessive or insufficient local pressure at the contact point between the constant-force floating grinding head and the workpiece. This configuration further improves grinding accuracy.

[0071] See Figure 1 and Figure 2 The mobile automated grinding device also includes a first clamping part 71, which is disposed on the mobile platform 10 and is used to clamp or release the scanning component 30; this arrangement facilitates the fixation of the scanning component 30 during non-measurement periods.

[0072] Furthermore, the mobile automated polishing device also includes a second clamping part 72, which is disposed on the mobile platform 10 and is used to clamp or release the polishing component 40. This arrangement facilitates the fixation of the polishing component 40 during non-polishing periods.

[0073] In some embodiments, the mobile platform 10 is provided with a first mounting cavity 1001 and a second mounting cavity 1002. A first clamping part 71 is disposed in the first mounting cavity 1001, and a second clamping part 72 is disposed in the second mounting cavity 1002. The mobile automated polishing device also includes a first cover 81 and a second cover 82. The first cover 81 is disposed on the mobile platform 10 and is used to seal or open the first mounting cavity 1001. The second cover 82 is disposed on the mobile platform 10 and is used to seal or open the second mounting cavity 1002. This arrangement allows the scanning component 30 to be housed in the first mounting cavity 1001 and protected by the first cover 81 during non-measuring periods, reducing external environmental contamination or damage to the scanning component 30 and extending its service life. During non-polishing periods, the polishing component 40 is housed in the second mounting cavity 1002 and protected by the second cover 82, reducing external environmental contamination or damage to the polishing component 40 and extending its service life.

[0074] Furthermore, the first cover 81 is hinged to the mobile platform 10. The mobile automated polishing device also includes a first position sensor and a first drive component. The first drive component is mounted on the mobile platform 10 and drivenly connected to the first cover 81. The first position sensor is communicatively connected to the first drive component. The first position sensor is used to detect the position of the first docking part 22. When the first docking part 22 moves to a first preset position, the first position sensor sends a signal to the first drive component, controlling the first drive component to open or close the first cover 81. Additionally, the first position sensor is also used to detect the position of the first clamping part 71 and is communicatively connected to the first clamping part 71. When the first clamping part 71 moves to a second preset position, the first position sensor sends a signal to the first clamping part 71, controlling the first clamping part 71 to release or clamp the scanning component 30. This configuration improves the automation level of the process of picking up and placing the scanning component 30.

[0075] Furthermore, the second cover 82 is hinged to the mobile platform 10. The mobile automated polishing device also includes a second position sensor and a second drive component. The second drive component is mounted on the mobile platform 10 and drivenly connected to the second cover 82. The second position sensor is communicatively connected to the second drive component and is used to detect the position of the third docking part 41. When the third docking part 41 moves to a third preset position, the second position sensor sends a signal to the second drive component to control the second cover 82 to open or close. Additionally, the second position sensor is also used to detect the position of the second clamping part 72 and is communicatively connected to the second clamping part 72. When the third docking part 41 moves to a fourth preset position, the second position sensor sends a signal to the second clamping part 72 to control the second clamping part 72 to release or clamp the polishing component 40. This configuration improves the automation level of the process of picking up and placing the polishing component 40.

[0076] Furthermore, the first clamping part 71 is movably disposed relative to the moving platform 10 along the depth direction of the first mounting cavity 1001 to drive the scanning component 30 in and out of the first mounting cavity 1001; the second clamping part 72 is movably disposed relative to the moving platform 10 along the depth direction of the second mounting cavity 1002 to drive the grinding component 40 in and out of the second mounting cavity 1002. This arrangement ensures that when connecting the first docking part 22 and the second docking part 31 of the scanning component 30, the second docking part 31 is located outside the first mounting cavity 1001, facilitating the connection between the first docking part 22 and the second docking part 31. Furthermore, when connecting the first docking part 22 and the third docking part 41 of the grinding component 40, the third docking part 41 is located outside the second mounting cavity 1002, facilitating the connection between the first docking part 22 and the third docking part 41.

[0077] Specifically, both the first mounting cavity 1001 and the second mounting cavity 1002 extend along the height direction, and the openings of both the first mounting cavity 1001 and the second mounting cavity 1002 face upwards. This arrangement facilitates the installation and removal of the scanning component 30 and the polishing component 40 in the height direction, improving operational convenience.

[0078] In some embodiments, the first docking part 22 can be connected to the second docking part 31 or the third docking part 41 via a pneumatic structure, a mechanical quick-release structure, or a magnetic positioning structure. This configuration improves the efficiency of connecting and disconnecting the first docking part 22 to the second docking part 31 or the third docking part 41.

[0079] Furthermore, when the first clamping part 71 clamps the scanning component 30, the axial direction of the second docking part 31 of the scanning component 30 forms an angle with the horizontal direction. When the second clamping part 72 clamps the grinding component 40, the axial direction of the third docking part 41 of the grinding component 40 forms an angle with the horizontal direction. The moving platform 10 includes a walking base 11 and a mounting shell 12 disposed on the walking base 11. The mounting shell 12 is provided with a first mounting cavity 1001 and a second mounting cavity 1002 that are independent of each other. The mounting shell 12 is elastically connected to the walking base 11 along the height direction. When the first docking part 22 is connected to the second docking part 31 and the third docking part 41, a force is applied to the scanning component 30 and the grinding component 40. The component of this force along the height direction is transmitted to the mounting shell 12. The mounting shell 12 is elastically connected to the walking base 11 along the height direction, which can buffer the force in the height direction, reduce the impact of the force during installation on the scanning component 30 and the grinding component 40, and extend the service life of the scanning component 30 and the grinding component 40.

[0080] Furthermore, the mobile automated grinding device also includes a first lifting unit 91 and a second lifting unit 92. The first lifting unit 91 is disposed within the first mounting cavity 1001 and is drivenly connected to the first clamping unit 71 to drive the first clamping unit 71 to move along the height direction. The second lifting unit 92 is disposed within the second mounting cavity 1002 and is drivenly connected to the second clamping unit 72 to drive the second clamping unit 72 to move along the height direction. This configuration further enhances the automation level of the device.

[0081] On the other hand, this application provides a mobile automated polishing method that applies the mobile automated polishing device of any of the above embodiments, see reference. Figure 4 The mobile automated polishing method includes the following steps:

[0082] Step S100: The mobile platform 10 moves to the target workstation;

[0083] Step S200: Scanning component 30 identifies surface defects and process features on the workpiece to be polished;

[0084] Step S300: The coordinate system establishment module establishes a workpiece coordinate system based on the process characteristics and confirms the position coordinates of surface defects in the workpiece coordinate system;

[0085] Step S400: The coordinate transformation module forms a spatial transformation matrix based on the relative pose relationship between the workpiece coordinate system and the base coordinate system, and converts the defect position coordinates of the surface defect in the workpiece coordinate system into the target position coordinates of the surface defect in the base coordinate system based on the spatial transformation matrix.

[0086] Step S500: The path planning module plans the motion path of the robotic arm 20 based on the target position coordinates of the surface defect in the base coordinate system;

[0087] Step S900: The robotic arm 20 drives the grinding component 40 along the motion path to grind surface defects.

[0088] After the mobile platform 10 moves to the target work station, it is locked in the target work station by a locking mechanism to improve the stability of the mobile platform 10 during operation.

[0089] Furthermore, the mobile platform 10 is equipped with measurement sensors and wheel encoders to record the attitude and driving increments of the mobile platform 10 in real time.

[0090] Specifically, process features include stamped holes, locating pins, or datum surfaces. This setup offers greater ease of operation, allowing for the rapid establishment of the workpiece coordinate system without the need for additional dedicated markers.

[0091] In some embodiments, the robotic arm 20 includes a first docking portion 22, the scanning component 30 includes a second docking portion 31, and the grinding component 40 includes a third docking portion 41. The first docking portion 22 may be selectively connected to or disconnected from the second docking portion 31 and the third docking portion 41.

[0092] In step S500: After the path planning module plans the motion path of the robotic arm 20 according to the target position coordinates of the surface defect in the base coordinate system, the step S600 is further included: disconnecting the first docking part 22 and the second docking part 31, and connecting the first docking part 22 and the third docking part 41.

[0093] In some embodiments, after step S600: connecting the first docking part 22 and the third docking part 41, the mobile automated polishing method further includes:

[0094] Step S700: Obtain the installation offset between the third docking part 41 and the first docking part 22;

[0095] Step S800: The path planning module corrects the motion path of the robotic arm 20 based on the installation offset between the third docking part 41 and the first docking part 22;

[0096] Step S900: The robotic arm 20 drives the grinding component 40 to grind surface defects along the corrected motion path.

[0097] In some embodiments, the mobile automated polishing method specifically includes the following steps:

[0098] Step S100: The mobile platform 10 moves to the target work station, and the locking mechanism locks the mobile platform 10 to the work station;

[0099] Step S200: Scanning component 30 identifies surface defects on the workpiece to be ground, as well as stamping holes, locating pins, and reference surfaces on the workpiece to be ground;

[0100] Step S300: The coordinate system establishment module establishes the workpiece coordinate system based on the scanned process features and confirms the defect position coordinates of the surface defects in the workpiece coordinate system.

[0101] Step S400: The coordinate transformation module forms a spatial transformation matrix based on the relative pose relationship between the workpiece coordinate system and the base coordinate system, and converts the defect position coordinates of the surface defect in the workpiece coordinate system into the target position coordinates of the surface defect in the base coordinate system based on the spatial transformation matrix.

[0102] Step S500: The path planning module plans the motion path of the robotic arm 20 based on the target position coordinates of the surface defect in the base coordinate system;

[0103] Step S600: Disconnect the first docking part 22 from the scanning component 30, and then connect the first docking part 22 to the polishing component 40. Step S600 specifically includes:

[0104] Step S610: The robotic arm 20 moves the scanning component 30 closer to the first mounting cavity 1001 until the first docking part 22 moves to the first preset position. The first driving component drives the first cover 81 to open the first mounting cavity 1001. The first lifting part 91 drives the first clamping part 71 to rise. The first clamping part 71 moves to the second preset position and clamps the scanning component 30. The first docking part 22 disconnects from the second docking part 31. The first clamping part 71 moves the scanning component 30 back to the first mounting cavity 1001 and the first cover 81 closes.

[0105] Step S620: The robotic arm 20 moves the first docking part 22 closer to the second mounting cavity 1002 until the first docking part 22 moves to the third preset position. The second driving member drives the second cover 82 to open the second mounting cavity 1002. The second lifting part 92 drives the second clamping part 72 to rise. When the second clamping part 72 moves to the fourth preset position, the first docking part 22 connects with the third docking part 41, and the second clamping part 72 clamps the grinding part 40. The second lifting part 92 drives the grinding part 40 back to the second mounting cavity 1002, and the second cover 82 closes.

[0106] Step S700: Obtain the installation offset between the third mating part 41 and the first mating part 22 of the grinding component 40, wherein step S700 specifically includes:

[0107] Step S710: The robotic arm 20 drives the grinding component 40 to move, so that the probe 50 mounted on the grinding component 40 contacts at least three measurement points of the reference part 101 in different postures, and the at least three measurement points are not collinear.

[0108] Step S720: The position calibration module fits the fitting center of the reference part 101 according to at least three measurement points and obtains the actual position coordinates of the fitting center in the actual grinding component coordinate system; and obtains the installation offset of the first docking part 22 and the third docking part 41 according to the actual position coordinates of the fitting center in the theoretical grinding component coordinate system and the theoretical position coordinates of the center of the reference part 101 in the theoretical grinding component coordinate system.

[0109] Step S800: The path planning module corrects the motion path of the robotic arm 20 based on the installation offset between the third docking part 41 and the first docking part 22;

[0110] Step S900: The robotic arm 20 drives the grinding component 40 to grind surface defects along the corrected motion path.

[0111] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0112] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A mobile automated grinding device, characterized in that, include: Mobile platform (10); The robotic arm (20) includes a base (21) which is disposed on the mobile platform (10) and the robotic arm (20) has a base coordinate system; A scanning component (30) is mounted on the robotic arm (20) and is used to scan the surface defects and process features of the workpiece to be polished; A grinding component (40) is disposed on the robotic arm (20) and is used to grind the surface defects; The coordinate system establishment module is used to establish a workpiece coordinate system based on the process features and to confirm the defect position coordinates of the surface defect in the workpiece coordinate system. The coordinate transformation module is used to form a spatial transformation matrix based on the relative pose relationship between the workpiece coordinate system and the base coordinate system; The defect location coordinates are then converted into target location coordinates in the base coordinate system based on the spatial transformation matrix. The path planning module is used to plan the motion path of the robotic arm (20) based on the target position coordinates.

2. The mobile automated grinding device according to claim 1, characterized in that, The robotic arm (20) includes a first docking part (22), the scanning component (30) includes a second docking part (31), and the grinding component (40) includes a third docking part (41). The first docking part (22) can be selectively connected to or disconnected from the second docking part (31) and the third docking part (41).

3. The mobile automated grinding device according to claim 2, characterized in that, The mobile automated grinding device also includes: The reference part (101) is fixed relative to the base (21), and the reference part (101) has a center; A probe (50) is disposed on the polishing component (40) and is used to contact at least three measuring points on the reference part (101), wherein the at least three measuring points are not collinear; The position calibration module is used to fit the fitting center of the reference part (101) according to at least three measurement points and obtain the actual position coordinates of the fitting center in the actual grinding component coordinate system; and is used to obtain the installation offset between the third docking part (41) and the first docking part (22) according to the position of the fitting center in the actual grinding component coordinate system and the theoretical position coordinates of the center of the reference part (101) in the theoretical grinding component coordinate system; the path planning module is used to correct the motion path of the robotic arm (20) according to the installation offset.

4. The mobile automated grinding device according to claim 3, characterized in that, The mobile automated grinding device also includes: A force sensor (60) is disposed on the grinding component (40) and / or the robotic arm (20) and is used to detect the force exerted when the probe (50) contacts the reference part (101). The force sensor (60) is communicatively connected to the position calibration module and the probe (50). When the force sensor (60) detects that the force exerted when the probe (50) contacts the reference part (101) is within a preset range, the position calibration module records the position information of the corresponding measurement point.

5. The mobile automated grinding device according to claim 2, characterized in that, The mobile automated grinding device also includes: A first clamping part (71) is disposed on the mobile platform (10) and is used to clamp or release the scanning component (30). The second clamping part (72) is disposed on the mobile platform (10) and is used to clamp or release the polishing component (40).

6. The mobile automated grinding device according to claim 5, characterized in that, The mobile platform (10) is provided with a first mounting cavity (1001) and a second mounting cavity (1002), the first clamping part (71) is disposed in the first mounting cavity (1001), and the second clamping part (72) is disposed in the second mounting cavity (1002); the mobile automated grinding device further includes: The first cover (81) is disposed on the mobile platform (10) and is used to block or open the first mounting cavity (1001). The second cover (82) is disposed on the mobile platform (10) and is used to block or open the second mounting cavity (1002).

7. The mobile automated grinding device according to claim 6, characterized in that, The first clamping part (71) is movably disposed relative to the moving platform (10) along the depth direction of the first mounting cavity (1001) to drive the scanning component (30) in and out of the first mounting cavity (1001); the second clamping part (72) is movably disposed relative to the moving platform (10) along the depth direction of the second mounting cavity (1002) to drive the polishing component (40) in and out of the second mounting cavity (1002).

8. A mobile automated polishing method, characterized in that, The mobile automated polishing apparatus according to any one of claims 1 to 7, wherein the mobile automated polishing method comprises the following steps: The mobile platform (10) moves to the target workstation; The scanning component (30) identifies surface defects and process features on the workpiece to be polished; The coordinate system establishment module establishes a workpiece coordinate system based on the process characteristics and confirms the coordinates of the defect location; The coordinate transformation module forms a spatial transformation matrix based on the relative pose relationship between the workpiece coordinate system and the base coordinate system, and converts the defect position coordinates into the target position coordinates of the surface defect in the base coordinate system based on the spatial transformation matrix. The path planning module plans the motion path of the robotic arm (20) based on the target position coordinates; The robotic arm (20) drives the grinding component (40) to grind surface defects along the motion path.

9. The mobile automated polishing method according to claim 8, characterized in that, The robotic arm (20) includes a first docking part (22), the scanning component (30) includes a second docking part (31), and the grinding component (40) includes a third docking part (41). The first docking part (22) can be selectively connected to or disconnected from the second docking part (31) and the third docking part (41). After the scanning component (30) identifies the surface defects and process features on the workpiece to be polished, it disconnects the first docking part (22) and the second docking part (31) and connects the first docking part (22) and the third docking part (41).

10. The mobile automated polishing method according to claim 9, characterized in that, After connecting the first docking part (22) and the third docking part (41), the mobile automated polishing method further includes: The installation offset between the third docking part (41) and the first docking part (22) is obtained; and after the path planning module plans the motion path of the robotic arm (20) according to the target position coordinates, the path planning module further corrects the motion path according to the installation offset; the robotic arm (20) drives the grinding component (40) to grind surface defects along the corrected motion path.

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