An automatic thickness measuring apparatus for semiconductor wafers

Abstract

The application relates to the technical field of semiconductor device special equipment manufacturing, in particular to an automatic thickness measuring device for semiconductor wafers, which comprises a fixed mounting shell, a mounting sliding block is slidably connected to the fixed mounting shell, limiting sliding blocks are fixedly connected to the two sides of the mounting sliding block, a limiting groove is formed in the fixed mounting shell, the limiting sliding blocks are slidably connected with the limiting groove, the limiting groove is used for limiting the position of the mounting sliding block, a gear is rotatably connected to one side of the mounting sliding block, a square groove is formed in the middle of the gear, a sliding square rod is slidably connected in the square groove, and a placing disc is fixedly connected to one end of the sliding square rod and used for placing the wafer. When the thickness of the wafer is detected, the wafer can be automatically driven to slide below the laser detection head, and the wafer can also be driven to tilt, so that the laser detection head can detect each angle of the wafer.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device manufacturing equipment technology, specifically to an automatic thickness measurement device for semiconductor wafers. Background Technology

[0002] Automated thickness measurement equipment for semiconductor wafers emerged as a metrology instrument driven by the increasingly stringent requirements for manufacturing precision and efficiency in the semiconductor device manufacturing industry. In chip manufacturing, the thickness and flatness of wafers and their thin films are key parameters directly impacting circuit performance and production yield. To replace early, inefficient, and risky manual measurement methods, automated thickness measurement equipment integrates non-contact, high-precision measurement technologies such as spectral interferometry, along with automated transmission and control systems. It enables rapid and comprehensive thickness scanning and data analysis of the entire wafer. It has become an indispensable core piece of equipment for modern wafer fabs to achieve real-time quality monitoring, improve yield, and move towards closed-loop intelligent process control.

[0003] Existing automatic thickness measurement equipment for semiconductor wafers may not be able to accurately measure the thickness of wafers because the thickness of the wafers may not be completely uniform. This can result in different measurement values ​​when measuring the wafers at different angles, thus affecting the accuracy of the wafer thickness measurement. Summary of the Invention

[0004] The purpose of this invention is to provide an automatic thickness measurement device for semiconductor wafers, in order to solve the problem mentioned in the background art that existing automatic thickness measurement devices for semiconductor wafers may not be completely uniform in thickness measurement, resulting in different values ​​when measuring the wafer at different angles, thus affecting the wafer thickness measurement.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an automatic thickness measurement device for semiconductor wafers, comprising a fixed mounting shell, a mounting slider slidably connected to the fixed mounting shell, limiting sliders fixedly connected to both sides of the mounting slider, a limiting groove formed on the fixed mounting shell, the limiting slider slidably connected to the limiting groove, the limiting groove being used to limit the position of the mounting slider, a gear rotatably connected to one side of the mounting slider, a square groove formed in the middle of the gear, a sliding square rod slidably connected inside the square groove, and a placement tray fixedly connected to one end of the sliding square rod, the placement tray being used to place the wafer.

[0006] Furthermore, a sliding ball is fixedly connected to the other end of the sliding square rod, and the sliding ball is used to control the position of the placement tray.

[0007] Furthermore, a limiting block is fixedly connected to one end of the mounting slider, and the limiting block is located on the same side as the gear.

[0008] Furthermore, a limiting groove is provided on one side of the limiting block, the limiting groove is formed on the mounting slider, a first spring is fixedly connected to one side of the limiting block, and a sliding rack is fixedly connected to the other end of the first spring.

[0009] Furthermore, the sliding rack is slidably connected to the limiting groove, the limiting groove is used to limit the position of the sliding rack, and one side of the sliding rack is meshed with the gear.

[0010] Furthermore, a fixing block is fixedly connected to one end of the fixed mounting shell, and a hydraulic rod is fixedly connected to one side of the fixing block. The power output end of the hydraulic rod is fixedly connected to one side of the limiting block.

[0011] Furthermore, a retaining block is fixedly connected to one side of the fixed mounting housing, and one side of the retaining block is used to abut against one end of the sliding rack.

[0012] Furthermore, a sliding groove is provided inside the fixed mounting shell, the sliding square rod is slidably connected to the sliding groove, and wave grooves are provided on both sides of the sliding groove. The wave grooves are opened inside the fixed mounting shell, and the sliding ball is used to slidably connect with the wave grooves.

[0013] Furthermore, a fixed bracket is fixedly connected to the top of the fixed mounting shell, and multiple laser detection heads are fixedly mounted on the fixed bracket. The laser detection heads are used to detect the thickness of the wafer.

[0014] Furthermore, a sealing tube is fixedly installed on one side of the mounting slider, the sealing tube is located below the limiting block, a sliding sealing rod is slidably connected inside the sealing tube, a first sealing slider is slidably connected inside the sealing tube, a second spring is fixedly connected to one side of the first sealing slider, a second sealing slider is slidably connected to the other end of the sealing tube, a third spring is fixedly connected to one side of the second sealing slider, the sliding sealing rod passes through the second sealing slider, an air blowing pipe is fixedly connected to one end of the sealing tube, an air blowing port is fixedly connected to the air blowing pipe, an air suction pipe is provided inside the sliding sealing rod, an adsorption hole is fixedly connected to the air suction pipe, and the adsorption hole is opened on the placement plate.

[0015] The technical solution provided by this invention has the following advantages compared with the known prior art:

[0016] I. This invention, through the cooperation of a sliding ball and a wave groove, enables the device to automatically drive the wafer to reciprocate horizontally during a single detection stroke. This allows the fixed laser detection head above to scan multiple positions on the wafer without moving, achieving rapid coverage of a wider area of ​​the wafer surface and significantly improving the amount of data collected and the overall efficiency of a single detection. The instrument achieves the purpose of intelligent measurement.

[0017] Second, this invention, through the linkage of gears and sliding racks, can automatically generate a controllable tilt angle for the wafer at the end of the detection process. This effectively avoids the laser from being reflected back to the sensor directly by specular reflection on the smooth wafer surface, reducing optical interference and thus improving the accuracy of thickness data. At the same time, it allows the laser to irradiate the edge area of ​​the wafer at multiple angles, reducing the detection blind zone. The laser measurement instrument is more accurate, making the overall thickness assessment more precise and reliable.

[0018] Third, by driving the wafer to move horizontally and tilt at an angle, this invention not only enables the device to perform complex multi-angle detection tasks and adapt to different measurement needs, but also ensures that all moving parts operate stably within a preset trajectory through mechanical structures such as limiting grooves and limiting slides, effectively preventing shaking or positional deviation during movement, thereby ensuring the stability and repeatability of the detection process. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 This is a schematic diagram of the resisting block structure of the present invention;

[0022] Figure 3 For the present invention Figure 2 Enlarged structural diagram at point A in the middle;

[0023] Figure 4 This is a schematic diagram of the mounting slider structure of the present invention;

[0024] Figure 5 This is a schematic diagram of the wave groove structure of the present invention;

[0025] Figure 6 For the present invention Figure 5 Enlarged structural diagram at point B;

[0026] Figure 7 This is a schematic diagram of the tilted structure of the placement disk of the present invention;

[0027] Figure 8 This is a cross-sectional view of the sealing tube structure of the present invention.

[0028] In the diagram: 1. Fixed mounting shell; 2. Mounting slider; 3. Restricting slider; 4. Restricting groove; 5. Gear; 6. Square groove; 7. Sliding square rod; 8. Placement plate; 9. Sliding ball; 10. Restricting block; 11. Restricting groove; 12. First spring; 13. Sliding rack; 14. Fixed block; 15. Hydraulic rod; 16. Abutment block; 17. Sliding groove; 18. Wave groove; 19. Fixed bracket; 20. Laser detection head; 21. Sealing tube; 22. Sliding sealing rod; 23. First sealing slider; 24. Second spring; 25. Second sealing slider; 26. Third spring; 27. Air blowing pipe; 28. Air blowing port; 29. ​​Air suction pipe; 30. Adsorption hole. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0030] The present invention will be further described below with reference to embodiments.

[0031] Example: An automatic thickness measurement device for semiconductor wafers, such as... Figures 1-8As shown, the device includes a fixed mounting housing 1, on which a mounting slider 2 is slidably connected. The design of the mounting slider 2 provides robust support for other components, preventing wobbling during subsequent wafer thickness inspection. Limiting sliders 3 are fixedly connected to both sides of the mounting slider 2. A limiting groove 4 is provided on the fixed mounting housing 1, and the limiting sliders 3 are slidably connected to the limiting groove 4. The limiting groove 4 is used to limit the position of the mounting slider 2. Through the design of the limiting groove 4, when the limiting slider 3 drives the mounting slider 2 to slide, the position of the mounting slider 2 is limited by the guidance of the limiting groove 4, thereby preventing the mounting slider 2 from shifting during sliding and ensuring that the mounting slider 2 moves along the correct path. The device slides along a preset trajectory. A gear 5 is rotatably connected to one side of the mounting slider 2. A square groove 6 is opened in the middle of the gear 5. A sliding square rod 7 is slidably connected inside the square groove 6. Through the design of the square groove 6 and the sliding square rod 7, the sliding square rod 7 can rotate with the gear 5 under the constraint of the square groove 6. One end of the sliding square rod 7 is fixedly connected to a placement tray 8, which is used to place the wafer. Through the design of the fixed connection between the sliding square rod 7 and the placement tray 8, the sliding square rod 7 can rotate with the placement tray 8 when it rotates with the gear 5, thereby tilting the placement tray 8. At the same time, the placement tray 8 can also tilt the wafer. It should be noted that this device is a special device for semiconductor devices.

[0032] The other end of the sliding square rod 7 is fixedly connected to a sliding ball 9. The sliding ball 9 is used to control the position of the placement disk 8. Through the design of the sliding ball 9, when the sliding ball 9 slides, it can drive the sliding square rod 7 and the placement disk 8 to move together, so that the placement disk 8 can move with the chip.

[0033] One end of the mounting slider 2 is fixedly connected to a limiting block 10, and the limiting block 10 and the gear 5 are located on the same side.

[0034] A limiting groove 11 is provided on one side of the limiting block 10. The limiting groove 11 is opened on the mounting slider 2. A first spring 12 is fixedly connected to one side of the limiting block 10. A sliding rack 13 is fixedly connected to the other end of the first spring 12. Through the design of the first spring 12, the sliding rack 13 can be driven to move.

[0035] The sliding rack 13 is slidably connected to the limiting groove 11. The limiting groove 11 is used to limit the position of the sliding rack 13. By opening the limiting groove 11, the position of the sliding rack 13 can be prevented from shifting during the sliding process. At the same time, by opening the limiting groove 11, the sliding rack 13 can slide within the preset trajectory. One side of the sliding rack 13 is meshed with the gear 5. By meshing with the gear 5, the sliding rack 13 can drive the gear 5 to rotate during the sliding process. The rotation of the gear 5 can drive the sliding square rod 7 and the placement disk 8 to rotate together, thereby causing the placement disk 8 to tilt the wafer.

[0036] It should be noted that the sliding rack 13 and the gear 5 are always in a meshing state. This design can restrict the position of the gear 5, so that the gear 5 can drive the sliding square rod 7 and the placement plate 8 to a stable state, and the position of the gear 5 can always be in a predetermined state.

[0037] A fixing block 14 is fixedly connected to one end of the fixed mounting shell 1, and a hydraulic rod 15 is fixedly connected to one side of the fixing block 14. The power output end of the hydraulic rod 15 is fixedly connected to one side of the limiting block 10. This design allows the power output end of the hydraulic rod 15 to push the limiting block 10 to slide. While the limiting block 10 slides, it can also drive the mounting slider 2 to slide, so that the mounting slider 2 can drive the gear 5, sliding square rod 7, placement plate 8, sliding ball 9, limiting block 10 and sliding rack 13 to move together.

[0038] A retaining block 16 is fixedly connected to one side of the fixed mounting housing 1. One side of the retaining block 16 is used to abut against one end of the sliding rack 13. Through the design of the retaining block 16, when the sliding rack 13 slides together with the mounting slider 2, one end of the sliding rack 13 can abut against one side of the retaining block 16. Through the abutment between the sliding rack 13 and the retaining block 16, the position of the sliding rack 13 can be restricted, so that when the mounting slider 2 continues to slide, the gear 5 can cooperate with the sliding rack 13, so that the gear 5 can drive the sliding square rod 7 and the placement disk 8 to rotate. It should be noted that the rotation angle of the gear 5 is limited, and excessive rotation will not occur, to prevent the wafer from slipping off the placement disk 8 due to excessive rotation angle.

[0039] The fixed mounting housing 1 has a sliding groove 17 inside, and the sliding square rod 7 is slidably connected to the sliding groove 17. The sliding groove 17 has wave grooves 18 on both sides. The wave grooves 18 are opened inside the fixed mounting housing 1. The sliding ball 9 is used to slide in the wave groove 18. Through the design of the wave groove 18, the sliding ball 9 can slide in the wave groove 18 when it slides together with the mounting slider 2. Through the guidance of the wave groove 18, the sliding ball 9, the sliding square rod 7 and the placement plate 8 can be guided to slide back and forth.

[0040] A fixed bracket 19 is fixedly connected to the top of the fixed mounting housing 1. Multiple laser detection heads 20 are fixedly mounted on the fixed bracket 19. The design of multiple laser detection heads 20 allows for multi-angle detection of wafer thickness. The design of the fixed bracket 19 can fix the position of the laser detection heads 20, preventing them from affecting the subsequent detection of wafer thickness by the laser detection heads 20. The laser detection heads 20 are used to detect the thickness of the wafer. It should be noted that the laser detection heads 20 are existing technology, and their specific working principle will not be described in detail. Professionals in this field can choose freely.

[0041] A sealing tube 21 is fixedly installed on one side of the mounting slider 2. The sealing tube 21 is located below the limiting block 10. A sliding sealing rod 22 is slidably connected inside the sealing tube 21. A first sealing slider 23 is slidably connected inside the sealing tube 21. A second spring 24 is fixedly connected to one side of the first sealing slider 23. A second sealing slider 25 is slidably connected to the other end of the sealing tube 21. A third spring 26 is fixedly connected to one side of the second sealing slider 25. Through the design of the second sealing slider 25 and the third spring 26, after the subsequent wafer is adsorbed and fixed, the second sealing slider 25 will slide along the sealing rod 22. Together, they slide inside the sealing tube 21. Simultaneously, under the action of the third spring 26, the second sealing slider 25 can return to its initial state. The sliding sealing rod 22 passes through the second sealing slider 25. One end of the sealing tube 21 is fixedly connected to an air blowing pipe 27, which is fixedly connected to an air blowing port 28. An air suction pipe 29 is provided inside the sliding sealing rod 22, and the air suction pipe 29 is fixedly connected to an adsorption hole 30. The adsorption hole 30 is opened on the placement tray 8. Through the design of the adsorption hole 30, the wafer can be adsorbed onto the placement tray 8, preventing the wafer from slipping off during subsequent tilting. It should be noted that... Figure 8 An air hole is provided at one end of the sealing tube 21, so that the second sealing slider 25 can slide and prevent the second sealing slider 25 from getting stuck.

[0042] The wafer to be inspected is placed on the placement tray 8, and then the hydraulic rod 15 is activated. The hydraulic rod 15 drives the limiting block 10 and the mounting slider 2 to slide together. The sliding of the mounting slider 2 enables the mounting slider 2 to drive the gear 5, the sliding square rod 7, the placement tray 8, the sliding ball 9, the limiting block 10 and the sliding rack 13 to slide together, so that the wafer can slide under the laser detection head 20, so that the laser detection head 20 can detect the thickness of the wafer on the placement tray 8.

[0043] See Figure 5 As the mounting slider 2 slides, the sliding ball 9 slides along with it. Guided by the wave groove 18, the sliding ball 9 can drive the sliding square rod 7, the placement plate 8, and the wafer to move horizontally back and forth. Through the horizontal sliding of the wafer, the laser detection head 20 can measure the thickness of the wafer at different positions. There is no need to frequently move the laser detection head 20. The entire surface of the wafer can be covered by the sliding of the wafer alone, thereby obtaining thickness data at more positions in a single detection process, which greatly improves the detection efficiency.

[0044] As the hydraulic rod 15 continues to drive the mounting slider 2, when the hydraulic rod 15 moves the sliding rack 13 on the mounting slider 2 to the abutment block 16, the mounting slider 2 will continue to slide in the limiting groove 4 as the hydraulic rod 15 continues to push. At the same time, the sliding rack 13 will no longer slide with the mounting slider 2 under the restriction of the abutment block 16. At this time, the sliding rack 13 will be in a stationary state. The hydraulic rod 15 will continue to push the mounting slider 2 to slide, so that the gear 5 will continue to slide with the mounting slider 2. Through the sliding of the gear 5 and the cooperation of the sliding rack 13, the gear 5 will be driven to rotate. While the gear 5 is rotating, it will drive the sliding square rod 7 to rotate together through the square groove 6. While the sliding square rod 7 is rotating, it will drive the placement disk 8 and the chip placed on the placement disk 8 to rotate together. Through the design of the sliding square rod 7 passing through the square groove 6 inside the gear 5, the sliding square rod 7 can still slide under the guidance of the sliding ball 9 during the rotation process.

[0045] See Figure 8After the sliding rack 13 is abutted, the mounting slider 2 will continue to slide with the sealing tube 21, so that the sliding sealing rod 22 can slide inside the sealing tube 21. During the sliding process inside the sealing tube 21, the sliding sealing rod 22 will first push the first sealing slider 23 to slide to the left. At the same time, the second sealing slider 25 will remain stationary under the action of the third spring 26. During the sliding process, the sliding sealing rod 22 will suck air into the adsorption hole 30 under the action of the air suction tube 29, so that the wafer can be adsorbed on the placement tray 8. After the wafer is firmly adsorbed, the sealing tube 21 continues to slide, so that the sliding sealing rod 22 will slide together with the second sealing slider 25 while sliding. At the same time, the third spring 26 will deform. It should be noted that when the sliding sealing rod 22 first slides with the second sealing slider 25, the second sealing slider 25 will remain stationary under the action of the third spring 26. The third spring 26 has enough force to control the second sealing slider 25.

[0046] Once the wafer is firmly adsorbed, the sliding sealing rod 22 continues to slide to the left, causing the first sealing slider 23 to slide to the left as well. This causes the second spring 24 to deform. When the first sealing slider 23 passes the air blowing pipe 27, the sliding sealing rod 22 pushes the gas in the sealing tube 21 to be blown out through the air blowing pipe 27. This allows the gas to be blown towards the wafer through the air blowing port 28. This design allows the gas to be blown onto the surface of the wafer to clean it and prevent debris from adhering to the top of the wafer from affecting the detection of the wafer thickness.

[0047] The surface of a wafer is usually quite smooth. During the thickness measurement process of the wafer by the laser detection head 20, specular reflection may occur. When the light from the laser detection head 20 shines perpendicularly on the wafer surface for thickness measurement, the reflected light may return directly to the laser detection head 20, which can easily interfere with the detection and affect the accuracy of the thickness measurement. However, by driving the gear 5 through the sliding rack 13, the gear 5 causes the sliding square rod 7, the placement disk 8, and the wafer to tilt, which can deviate the receiving direction of the laser detection head 20, reduce the interference of surface reflection light on the detection signal, and thus obtain more accurate thickness data. Moreover, tilting the wafer can allow the detection light to shine on the edge area at different angles, increase the detection coverage of the edge area, and more accurately measure the edge thickness, avoiding the deviation in the overall thickness assessment caused by inaccurate edge detection.

[0048] While the wafer tilts, the sliding ball 9 continues to slide inside the wave groove 18, allowing the wafer to move back and forth while tilting. This design enables the laser detection head 20 to detect different areas of the wafer from multiple angles, reducing blind spots caused by single-angle detection, thereby obtaining the thickness information of the entire wafer more accurately and improving the accuracy and reliability of thickness measurement.

[0049] After the thickness of the wafer is measured, the hydraulic rod 15 is activated, which pulls the mounting slider 2 back to its initial position. At the same time, the sliding rack 13 is pushed to slide by the first spring 12, so that the sliding rack 13 can drive the gear 5 to rotate back, so that the gear 5, the sliding square rod 7 and the placement tray 8 can return to a horizontal state. At the same time, as the sliding rack 13 slides, it will also drive the sliding sealing rod 22 to slide together, so that the sliding sealing rod 22 can slide inside the sealing tube 21 and return to its initial position. Finally, the wafer on the placement tray 8 is removed to facilitate the inspection of the next wafer.

[0050] In this embodiment: the hydraulic rod 15 drives the mounting slider 2, gear 5, sliding square rod 7, placement disk 8, sliding ball 9, limiting block 10, and sliding rack 13 to slide together, allowing the wafer to move below the laser detection head 20. During the movement, guided by the wave groove 18 on the sliding ball 9, the wafer moves the sliding square rod 7, placement disk 8, and wafer together in a lateral forward and backward motion. This design allows the laser detection head 20 to cover the entire surface of the wafer, thereby obtaining thickness data from more locations in a single detection process, greatly improving detection efficiency. Simultaneously, when the sliding rack 13 slides to the abutment block 16, the abutment block 16... The position of the sliding rack 13 is restricted by the action of 6, so that the position of the sliding rack 13 is restricted during the subsequent sliding of the mounting slider 2. As the mounting slider 2 slides, the gear 5 is driven by the action of the sliding rack 13, so that the gear 5 can rotate. When the gear 5 rotates, it can drive the sliding square rod 7, the placement disk 8 and the wafer to rotate together. This causes the placement disk 8 to tilt the wafer, so that the laser of the laser detection head 20 can irradiate the wafer at different angles. At the same time, it can also detect the edge of the wafer, improving the accuracy and reliability of thickness measurement.

[0051] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. An automatic thickness measurement device for semiconductor wafers, comprising a fixed mounting housing (1), characterized in that: A mounting slider (2) is slidably connected to the fixed mounting shell (1). A limiting slider (3) is fixedly connected to both sides of the mounting slider (2). A limiting groove (4) is provided on the fixed mounting shell (1). The limiting slider (3) is slidably connected to the limiting groove (4). The limiting groove (4) is used to limit the position of the mounting slider (2). A gear (5) is rotatably connected to one side of the mounting slider (2). A square groove (6) is provided in the middle of the gear (5). A sliding square rod (7) is slidably connected inside the square groove (6). A placement plate (8) is fixedly connected to one end of the sliding square rod (7). The placement plate (8) is used to place the wafer. One end of the mounting slider (2) is fixedly connected to a limiting block (10), and the limiting block (10) and the gear (5) are located on the same side; A limiting groove (11) is provided on one side of the limiting block (10), the limiting groove (11) is opened on the mounting slider (2), a first spring (12) is fixedly connected to one side of the limiting block (10), and a sliding rack (13) is fixedly connected to the other end of the first spring (12); The sliding rack (13) is slidably connected to the limiting groove (11), the limiting groove (11) is used to limit the position of the sliding rack (13), and one side of the sliding rack (13) is meshed with the gear (5); One end of the fixed mounting shell (1) is fixedly connected to a fixing block (14), and a hydraulic rod (15) is fixedly connected to one side of the fixing block (14). The power output end of the hydraulic rod (15) is fixedly connected to one side of the limiting block (10). A retaining block (16) is fixedly connected to one side of the fixed mounting housing (1), and one side of the retaining block (16) is used to abut against one end of the sliding rack (13); A fixed bracket (19) is fixedly connected to the top of the fixed mounting shell (1), and a plurality of laser detection heads (20) are fixedly installed on the fixed bracket (19). The laser detection heads (20) are used to detect the thickness of the wafer.

2. The automatic thickness measurement device for semiconductor wafers according to claim 1, characterized in that: The other end of the sliding square rod (7) is fixedly connected to a sliding ball (9), which is used to control the position of the placement plate (8).

3. The automatic thickness measurement device for semiconductor wafers according to claim 2, characterized in that: The fixed mounting shell (1) has a sliding groove (17) inside. The sliding square rod (7) is slidably connected to the sliding groove (17). Wave grooves (18) are provided on both sides of the sliding groove (17). The wave grooves (18) are opened inside the fixed mounting shell (1). The sliding ball (9) is used to slidably connect with the wave grooves (18).

4. The automatic thickness measurement device for semiconductor wafers according to claim 1, characterized in that: A sealing tube (21) is fixedly installed on one side of the mounting slider (2). The sealing tube (21) is located below the limiting block (10). A sliding sealing rod (22) is slidably connected inside the sealing tube (21). A first sealing slider (23) is slidably connected inside the sealing tube (21). A second spring (24) is fixedly connected to one side of the first sealing slider (23). A second sealing slider (25) is slidably connected to the other end of the sealing tube (21). A third spring (26) is fixedly connected to one side of the second sealing slider (25). The sliding sealing rod (22) passes through the second sealing slider (25). A blowing pipe (27) is fixedly connected to one end of the sealing tube (21). A blowing port (28) is fixedly connected to the blowing pipe (27). An air suction pipe (29) is provided inside the sliding sealing rod (22). An adsorption hole (30) is fixedly connected to the adsorption hole (30). The adsorption hole (30) is opened on the placement plate (8).

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