Bus duct joint connection monitoring system and method of assembling same

Abstract

The invention relates to a bus duct joint connection monitoring system and a method of assembling the same. A power distribution busway joint monitoring sensor assembly is provided. A first sensor is configured to measure a first location temperature and generate a first signal indicative of the first location temperature, wherein the first location is proximate a busway joint. A second sensor is configured to measure a second location temperature and generate a second signal indicative of the second location temperature. A sensor controller is configured to: i) receive the first signal and the second signal; ii) processing the first signal and the second signal; and iii) generating a processed first signal and a processed second signal. A system controller is configured to receive the processed first signal and the processed second signal and generate an alarm when a temperature difference between the first location temperature and the second location temperature is greater than a predetermined threshold temperature.

Description

[0001] Related information of divisional application

[0002] The present application is a divisional application of the patent application with application number 201811232187.2 and titled "Busway Joint Connection Monitoring System and Method of Assembly thereof" filed on October 22, 2018. TECHNICAL FIELD

[0003] Embodiments described herein relate generally to busway joint connection monitoring systems, and more particularly to a temperature measurement and fault detection sensor assembly for power distribution busway joints and a method of assembly thereof. BACKGROUND

[0004] In commercial and industrial systems, power is transmitted using several methods. One of these methods includes the use of busbars to distribute power, which are generally easier to install and modify than cable duct assemblies. Busbars used in enclosed areas are referred to as busways. Busways are modular conductors that act as a common connection for two or more circuits and are typically constructed of aluminum or copper. Busways are easily connected together to quickly supply power to a desired location and are often used to supply power to high-rise buildings, data centers, and heavy equipment and ventilation equipment that serve industrial applications. Busways are typically joined together using bolted connections to form busway joints. Busway joints must be properly connected to ensure that power is efficiently transmitted through the joint and to prevent excessive heat buildup within the busway joint. However, loose busway joints can be difficult to detect because the joint is still able to carry current and can not fail during initial testing or during the start-up phase of the system.

[0005] At least some known busway joint systems incorporate installation torque requirements for busway joint assembly. At least some other known busway joint systems utilize torque-to-yield bolts to facilitate subjecting busway joints to proper torque during assembly. However, such systems can not result in properly assembled busway joints due to many factors, such as improper lubrication of the busway joint components or insufficient preventative maintenance. Furthermore, at least some known busway joint systems use infrared (IR) systems for monitoring, which are designed to detect loose and failed joints by identifying abnormal temperatures present in the busway joint. Utilizing IR analysis to detect abnormal busway joint conditions often requires the busway joint being inspected to be exposed to high current loads and can be difficult to identify failed joints when ambient temperatures have been relatively high. Therefore, there is a need for an efficient and effective method for detecting abnormal busway joints. SUMMARY

[0006] In one aspect, a power distribution busway joint monitoring sensor assembly is provided. The power distribution busway joint monitoring sensor assembly includes a busway joint cover, a first sensor, a second sensor, a sensor base, a sensor controller, and a system controller. The first sensor is configured to measure a first location temperature at a first location and generate a first signal indicative of the first location temperature, where the first location is proximate to a busway joint. The sensor base is coupled to the first sensor and the busway joint cover and is configured to hold the first sensor at the first location. The second sensor is configured to measure a second location temperature at a second location and generate a second signal indicative of the second location temperature, where the second location is different than the first location. The sensor controller is in communication with the first sensor and the second sensor and is configured to: i) receive the first signal and the second signal; ii) process the first signal and the second signal; and iii) generate a processed first signal and a processed second signal. The system controller is in communication with the sensor controller and is configured to: i) receive the processed first signal and the processed second signal; ii) determine a temperature difference between the first location temperature and the second location temperature based on a comparison between the processed first signal and the processed second signal; and iii) generate an alert when the temperature difference between the first location temperature and the second location temperature is greater than a predetermined threshold temperature.

[0007] In another aspect, a power distribution busway assembly is provided. The power distribution busway assembly includes a first busway including a first busbar and a second busway including a second busbar. The power distribution busway assembly also includes a busway joint including a joint stack coupled between the first busbar and the second busbar. The power distribution busway assembly includes a power distribution busway joint monitoring sensor assembly coupled to the busway joint proximate the joint stack. The power distribution busway joint monitoring sensor assembly includes a busway joint cover, a first sensor, a second sensor, a sensor base, a sensor controller, and a system controller. The first sensor is configured to measure a first location temperature at a first location and generate a first signal indicative of the first location temperature, where the first location is proximate a busway joint. The sensor base is coupled to the first sensor and the busway joint cover and is configured to hold the first sensor at the first location. The second sensor is configured to measure a second location temperature at a second location and generate a second signal indicative of the second location temperature, where the second location is different than the first location. The sensor controller is in communication with the first sensor and the second sensor and is configured to: i) receive the first signal and the second signal; ii) process the first signal and the second signal; and iii) generate a processed first signal and a processed second signal. The system controller is in communication with the sensor controller and is configured to: i) receive the processed first signal and the processed second signal; ii) determine a temperature difference between the first location temperature and the second location temperature based on a comparison between the processed first signal and the processed second signal; and iii) generate an alert when the temperature difference between the first location temperature and the second location temperature is greater than a predetermined threshold temperature.

[0008] In yet another aspect, a method of assembling a busway joint monitoring sensor assembly is provided. The method includes coupling a sensor base to a busway joint cover. The method also includes coupling a first sensor to the sensor base such that the first sensor is positioned at a first location, where the first sensor is configured to measure a temperature at the first location and generate a first signal indicative of the first location temperature. The method further includes positioning a second sensor at a second location different from the first location, where the second sensor is configured to measure a temperature at the second location and generate a second signal indicative of the second location temperature. The method includes coupling the first sensor and the second sensor to a sensor controller, where the sensor controller is configured to: i) receive the first signal and the second signal; ii) process the first signal and the second signal; and iii) generate a processed first signal and a processed second signal. The method also includes coupling the sensor controller to a system controller, where the system controller is configured to: i) receive the processed first signal and the processed second signal; ii) determine a temperature difference between the first location temperature and the second location temperature based on a comparison between the processed first signal and the processed second signal; and iii) generate an alert when the temperature difference between the first location temperature and the second location temperature is greater than a predetermined threshold temperature. BRIEF DESCRIPTION OF DRAWINGS

[0009] Figure 1 is an exploded perspective view of an exemplary embodiment of a power distribution busway assembly illustrating an exemplary busway joint and an exemplary power distribution busway joint monitoring sensor assembly;

[0010] Figure 2 is a block diagram of a controller for operating Figure 1 the power distribution busway joint monitoring sensor assembly shown;

[0011] Figure 3 is Figure 1 a top view of the busway joint shown illustrating an exemplary joint stack;

[0012] Figure 4 is Figure 1 an exploded perspective view of the power distribution busway joint monitoring sensor assembly shown illustrating an exemplary first sensor assembly;

[0013] Figure 5 is Figure 4 a perspective view of the first sensor assembly shown in

[0014] Figure 6 is a perspective view of an exemplary busway joint cover sensor mounting template; and

[0015] Figure 7 is a flowchart illustrating a method for assembling a power distribution busway joint monitoring sensor. DETAILED DESCRIPTION

[0016] In the following description and claims, reference will be made to a number of terms, which shall be defined as having the following meanings.

[0017] The singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise.

[0018] "Optional" or "optionally" means that the subsequently described event or circumstance can or can not occur, and that the description includes instances where the event occurs and instances where it does not.

[0019] Approximating language as used herein throughout the description and claims implies approximation to the mean within ten percent to the precision of the measurements. Approximating language can be applied to modify any quantitative representation that could permissibly vary from the stated magnitude. Accordingly, a value modified by a term or terms, such as "about" and "substantially" refers to a value that is not to be taken literally. As used throughout this description and claims, a value modified by the term "substantially similar" can be applied to modify any quantitative representation to within 5% of the stated quantitative representation, and more specifically, to within 1% of the stated quantitative representation. In at least some instances, the approximating language can correspond to the precision of an instrument used to measure the value. Ranges can be combined and / or interchanged, unless context or language dictates otherwise, such ranges are identified and include all sub-ranges contained therein.

[0020] As used herein, the terms "processor" and "computer" and related terms, e.g., "processing device," "computing device," and "controller," are not limited to just those integrated circuits known as computers, but broadly refers to a microcontroller, a microcomputer, a programmable logic controller (PLC), and other programmable circuits, and these terms are used interchangeably herein. In embodiments described herein, memory can include, but is not limited to, computer-readable media, such as random access memory (RAM), and computer-readable nonvolatile media, such as a flash memory. Alternatively, a floppy disk, a compact disc read only memory (CD-ROM), a magneto-optical disk (MOD), and / or a digital versatile disc (DVD) can also be used. Also, in embodiments described herein, additional input channels can be, but are not limited to, computer peripheral devices associated with an operator interface, such as a mouse and a keyboard. Alternatively, other computer peripheral devices can also be used, which can include, for example, but are not limited to, a scanner. Further, in an exemplary embodiment, additional output channels can include, but are not limited to, an operator interface monitor.

[0021] Additionally, as used herein, the terms "software" and "firmware" are interchangeable, and include any computer program stored in memory for execution by a personal computer, workstation, client, and / or server.

[0022] As used herein, the term "non-transitory computer-readable medium" is intended to be representative of any tangible computer-based device or instruments that enable short term and long term storage of information such as computer-readable instructions, data structures, program modules, and sub-modules, or other data, in any device. Therefore, the methods described herein can be encoded as executable instructions embodied in a tangible, non-transitory computer- readable medium such as a storage device and / or memory device. Such instructions, when executed by a processor, cause the processor to perform at least a portion of the methods described herein. Moreover, as used herein, the term "non-transitory computer- readable medium" includes all tangible, computer-readable media, including but not limited to non- transitory computer storage devices and media such as RAM, ROM, flash memory, CD-ROMs, hard disks, etc., as well as wires, physical transmission media, and any other medium that provides for the temporary or long term storage of digital or other information.

[0023] Further, as used herein, the term "real-time" refers to at least one of the time of occurrence of the associated event, the time of measurement and collection of predetermined data, the time of processing data, and the time of system response to events and environment. In embodiments described herein, these activities and events occur substantially instantaneously.

[0024] Embodiments described herein facilitate the use of busway joint monitoring sensor assemblies to detect loose and / or faulty busway joints. In particular, the busway joint monitoring sensor assemblies include a busway joint cover, a first sensor positioned in contact with and / or proximity to a busway joint and positioned within a sensor base coupled to the joint cover, a second sensor positioned at a different location than the first sensor, a sensor controller in communication with the first and second sensors, and a system controller in communication with the sensor controller. The system controller is configured to compare signals received from the first and second sensors, determine a temperature difference between temperatures present at the first and second sensors, and generate an alert or notification if the temperature difference exceeds a predetermined threshold based on test characterization data for power distribution busways. Temperature profiles and trends can be analyzed using data obtained from the first and second sensors. A temperature difference that exceeds the predetermined threshold indicates a loose and / or faulty connection within the busway joint. This configuration facilitates the efficient and rapid detection of loose, high resistance, and / or faulty connections within busway assemblies before significant energy loss to generate heat or complete failure of the joint, resulting in superior performance, reduced cost, and more efficient maintenance of busway systems. Remote monitoring and management capabilities of the busway joint monitoring sensor assemblies facilitate reducing the need for personnel to physically inspect busway joints, for example, with infrared scanners, and improve the safety of overall power distribution systems.

[0025] Figure 1 is an exploded perspective view of an exemplary embodiment of a power distribution busway assembly 100 illustrating a busway joint 116 and a busway joint monitoring sensor assembly 132. In the exemplary embodiment, the power distribution busway assembly 100 includes a first busway 102 including a first busbar 108 and a second busway 104 including a second busbar 110. The first busbar 108 has a first end 111 and a second end 112. The second busbar 110 has a first end 114 and a second end 113. The first busbar 108 and the second busbar 110 are configured to carry current via the first busway 102 and the second busway 104, respectively. In alternative embodiments, the first busway 102 and the second busway 104 can contain any type and number of busbars to enable the power distribution busway assembly 100 to function as described herein.

[0026] In the exemplary embodiment, the first end 111 of the first busway 108 is coupled to the second end 113 of the second busway 110 using the joint stack 130 to form a busway joint 116, enabling current to be delivered from the first busway 108 to the second busway 110. A plurality of busway joint covers 134 substantially enclose the busway joint 116 to shield the busway joint 116, the first end 111 of the first busway 108, and the second end 113 of the second busway 110 from unintended electrical delivery. The busway joint monitoring sensor assembly 132 includes one busway joint cover 134, a first sensor assembly 137 including a first sensor 136 coupled to the busway joint cover 134 and a sensor base 138, a second sensor 140 located away from the busway joint 116, a sensor controller 107 communicatively coupled to the first sensor 136 and the second sensor 140, and a system controller 106 communicatively coupled to the sensor controller 107. The sensor controller 107 includes a memory coupled to a processor and is configured to monitor temperatures measured by the first sensor 136 in a first location 146 and the second sensor 140 in a second location 148 for the purpose of sealing and processing information from the first sensor 136 and the second sensor 140. More specifically, in the exemplary embodiment, the sensor controller 107 performs digital signal processing on information received from the first sensor 136 and the second sensor 140 to normalize levels and / or states of digital signals contained within the information. The system controller 106 is configured to receive the sealed and processed information from the sensor controller 107 for the purpose of detecting failed and / or improperly assembled busway joints and alerting users of these conditions. In alternative embodiments, the busway joint monitoring sensor assembly 132 can contain any type and number of components to enable the busway joint monitoring sensor assembly 132 to function as described herein.

[0027] Figure 2 is used to operate the busway joint monitoring sensor assembly 132 Figure 1A block diagram of the system controller 106 is shown in FIG. 1. In the exemplary embodiment, the system controller 106 is in communication with a sensor controller 107, which is in communication with the first sensor 136 and the second sensor 140. The system controller 106 performs operations to control the operation of the busway joint monitoring sensor assembly 132 based at least in part on instructions from a human operator. The system controller 106 is programmed to generate an alert when a temperature difference between a temperature measured at the first sensor 136 and a temperature measured at the second sensor 140 exceeds a user-defined temperature difference stored in the system controller 106. For example, in one embodiment, the system controller 106 generates an audible alert. In another embodiment, the system controller 106 vibrates. In yet another embodiment, the system controller 106 emits an alert signal. Alternatively, the system controller 106 can generate any suitable alert. In the exemplary embodiment, the user-defined temperature difference is 50 degrees Celsius. In alternative embodiments, the system controller 106 and the sensor controller 107 can be any type of controller that enables the busway joint monitoring sensor assembly 132 to operate as described herein. In other alternative embodiments, the system controller 106 can perform any operations and be set to generate an alert for any temperature difference that enables the busway joint monitoring sensor assembly 132 to function as described herein.

[0028] In the exemplary embodiment, the system controller 106 includes a memory device 118 and a processor 120 coupled to the memory device 118. The processor 120 can include one or more processing units, such as, but not limited to, a multi-core configuration. The processor 120 is any type of processor that permits the system controller 106 to operate as described herein. In some embodiments, executable instructions are stored in the memory device 118. The system controller 106 can be configured to perform one or more operations described herein by programming the processor 120. For example, the processor 120 can be programmed by encoding an operation as one or more executable instructions and providing the executable instructions within the memory device 118. In the exemplary embodiment, the memory device 118 is one or more devices that enable storage and retrieval of information, such as executable instructions or other data. The memory device 118 can include one or more computer readable media, such as, and not by way of limitation, random access memory (RAM), dynamic RAM, static RAM, solid state disks, hard disks, read-only memory (ROM), erasable programmable ROM, electrically erasable programmable ROM, or nonvolatile RAM memory. The above memory types are exemplary only, and thus are not limiting, as to the types of memory that can be used to store a computer program.

[0029] The memory device 118 can be configured to store any type of data, including but not limited to temperature differentials that the busway joint monitoring sensor assembly 132 can permit. In some embodiments, the processor 120 removes or "purges" data from the memory device 118 based on the age of the data. For example, the processor 120 can overwrite previously recorded and stored data associated with a subsequent time or event. Additionally or alternatively, the processor 120 can remove data that is older than a predetermined time interval. Further, the memory device 118 includes, but is not limited to, sufficient data, algorithms, and commands to facilitate monitoring temperatures at the first sensor 136 and the second sensor 140 with the system controller 106 and generating an alert.

[0030] In some embodiments, the system controller 106 includes a presentation interface 122 coupled to the processor 120. The presentation interface 122 presents information, such as current temperatures measured at the first sensor 136 and the second sensor 140, to the user 124. In one embodiment, the presentation interface 122 includes a display adapter coupled to a display device (not shown), such as a cathode ray tube (CRT), a liquid crystal display (LCD), an organic LED (OLED) display, or an "e-ink" display. In some embodiments, the presentation interface 122 includes one or more display devices. Additionally or alternatively, the presentation interface 122 includes an audio output device (not shown), such as, but not limited to, an audio adapter or a speaker (not shown).

[0031] In some embodiments, the system controller 106 includes a user input interface 126. In an exemplary embodiment, the user input interface 126 is coupled to the processor 120 and receives input from the user 124. The user input interface 126 can include, for example, but is not limited to, a keyboard, a pointing device, a mouse, a stylus, a touch-sensitive panel (such as, but not limited to, a touchpad or a touchscreen), and / or an audio input interface (such as, but not limited to, a microphone). A single component, such as a touchscreen, can function as both a display device of the presentation interface 122 and the user input interface 126.

[0032] In an exemplary embodiment, the communication interface 128 is coupled to the processor 120 and is configured to couple in communication with one or more other devices, such as the first sensor 136 and the second sensor 140, and perform input and output operations for such devices while also performing as an input channel. For example, the communication interface 128 can include, but is not limited to, a wired network adapter, a wireless network adapter, a mobile telecommunication adapter, a serial communication adapter, or a parallel communication adapter. The communication interface 128 can receive data signals from one or more remote devices or transmit data signals to one or more remote devices.

[0033] Both the presentation interface 122 and the communication interface 128 can provide information suitable for use with the methods described herein, for example, providing information to the user 124 or the processor 120. Therefore, the presentation interface 122 and the communication interface 128 can be referred to as output devices. Similarly, the user input interface 126 and the communication interface 128 can receive information suitable for use with the methods described herein and can be referred to as input devices. Information related to the operation of the power distribution busbar assembly 100 can be used on a standard network manager using TCP / IP protocols such as SNMPv2C, SNMPv3, Modbus TCP, and TL1. Furthermore, the sensor controller 107 and the system controller 106 may have their own built-in Internet-enabled servers that allow users to retrieve information via a network connection using an Internet browser.

[0034] Figure 3 It is busbar connector 116 ( Figure 1 The top view shown in the image illustrates an exemplary joint stack 130. Figure 4 It is an exemplary busbar joint monitoring sensor assembly 132 ( Figure 1 An exploded perspective view (shown in the image) illustrates the exemplary first sensor assembly 137. Figure 5 It is the first sensor assembly 137 ( Figure 4 A perspective view (shown in the image). In an exemplary embodiment, the connector stack 130 is a connector configured to receive a first end 111 of a first busbar and a second end 113 of a second busbar. A connector stack fastener 152 is screwed into and through the threaded portion of the connector stack 130 until a certain amount of torque is reached by the fastener 152, thereby compressing the portions of the connector stack 130 and securing the first busbar 108 to the second busbar 110. In an alternative embodiment, the fastener 152 is a torque yielding fastener. In other alternative embodiments, the connector stack 130 may allow the power distribution busbar assembly 100 to secure the first busbar 108 to the second busbar 110 in any manner as described herein.

[0035] In an exemplary embodiment, the busbar connector monitoring sensor assembly 132 is coupled to a first busbar 102 and a second busbar 104 near the connector stack 130. The sensor base 138 includes a threaded portion 158 of length 160 extending through a busbar connector cover opening 154 of the busbar connector cover 134. The threaded portion 158 is threaded to receive a first nut 139 and a second nut 141. To secure the sensor base 138 to the busbar connector cover 134, the first nut 139 is screwed onto the threaded portion 158 and positioned against the outer surface 135 of the busbar connector cover 134, and the second nut 141 is screwed onto the threaded portion 158 and positioned against the inner surface 133 of the busbar connector cover 134. A marking 156 is affixed to the surface of the busbar connector cover 134 and contains information related to the type of cover and sensor used as part of the busbar connector monitoring sensor assembly 132. In an alternative embodiment, the busbar connector cover 134 may include any number and type of openings and identification markings to enable the busbar connector monitoring sensor assembly 132 to operate as described herein.

[0036] In an exemplary embodiment, sensor base 138 is configured to hold first sensor 136 in a first position 146, near busbar connector 116. The first position 146 can be changed by modifying the position of a first nut 139 and / or a second nut 141 on the threaded portion 158 relative to busbar connector cover 134 and / or by using an alternative sensor base 138 with a different length 160. In an alternative embodiment, when in the first position 146, the distance of the first sensor 136 from the busbar connector 116 can be any distance that allows the busbar connector monitoring sensor assembly 132 to operate as described herein, including touching at least a portion of the busbar connector 116. The first sensor 136 includes a probe 162 and is configured to measure a first position temperature at the first position 146 and generate a first signal. In an exemplary embodiment, the first sensor 136 is a 100 kΩ thermistor configured to generate a signal related to the temperature at the first position 146. In an exemplary embodiment, the sensor base 138 comprises a non-conductive plastic material with an Underwriters Laboratories (UL) vertical burn test (V) rating of 94. In an alternative embodiment, the first sensor 136 may be held in a first position 146 in any manner that allows the busbar connector monitoring sensor assembly 132 to operate as described herein. In other alternative embodiments, the probe 162 may be any type of sensor probe and may comprise any material that facilitates the operation of the first sensor 136 as described herein.

[0037] The second sensor 140 includes a probe 162 and is located away from the second position 148 (both are in...). Figure 1(As shown in the illustration). That is, the second position 148 is located away from the busbar connector 116, allowing the second sensor 140 to measure the ambient air temperature unaffected by the heat generated by the current carried through the busbar connector 116. In an exemplary embodiment, the second sensor 140 is a 100 kΩ thermistor and is configured to generate a second signal related to the temperature at the second position 148. In an alternative embodiment, the probe 162 can be any type of sensor probe and may contain any material that facilitates the operation of the second sensor 140 as described herein. In other alternative embodiments, the first sensor 136 and the second sensor 140 are any type of sensor that enables the busbar connector monitoring sensor assembly 132 to function as described herein.

[0038] In an exemplary embodiment, the first sensor 136 and the second sensor 140 communicate directly with the system controller 106. In an alternative embodiment, the first sensor 136 is coupled to a remote peripheral measurement (RPM) device located near the busbar connector cover 134. In an alternative embodiment, the RPM device includes the second sensor 140 and communicates with the system controller 106 to facilitate the modular implementation of the busbar connector monitoring sensor assembly 132 as part of the power distribution busbar assembly 100. In other alternative embodiments, the first sensor 136 and the second sensor 140 may be coupled to the system controller 106 in any manner that facilitates the operation of the busbar connector monitoring sensor assembly 132 as described herein.

[0039] Figure 6This is a perspective view of an exemplary busbar connector cover sensor mounting template 200. In an exemplary embodiment, a busbar connector cover 134 that does not include a busbar connector cover opening 154 can be modified to include at least one busbar connector cover opening 154 using the busbar connector cover sensor mounting template 200. The busbar connector cover sensor mounting template 200 includes a plurality of template positioning openings 202 and at least one probe base positioning opening 204. To modify the busbar connector cover 134 that does not include a busbar connector cover opening 154, the busbar connector cover sensor mounting template 200 is positioned against the outside 135 of the busbar connector cover. The template positioning openings 202 are aligned with the corresponding busbar connector cover mounting openings 150, and the busbar connector cover sensor mounting template 200 is fastened to the busbar connector cover 134. Using the probe base positioning opening 204 as a guide, material is removed from the busbar connector cover 134 to form the busbar connector cover opening 154. In an exemplary embodiment, material is removed from the busbar connector cover 134 using a drill bit to form the busbar connector cover opening 154 when the busbar connector cover 134 is disengaged from the busbar connector assembly 100. In an alternative embodiment, the busbar connector cover opening 154 can be formed in any manner that facilitates the operation of the busbar connector monitoring sensor assembly 132 as described herein.

[0040] Figure 7 This is a flowchart illustrating a method 300 for assembling a busbar connector monitoring sensor assembly 132. (See reference) Figures 1 to 5Method 300 includes connecting a sensor base 138 302 to a busbar connector cover 134. Method 300 further includes connecting a first sensor 136 304 to the sensor base 138 such that the first sensor 136 is positioned at a first location 146, wherein the first sensor 136 is configured to measure the temperature at the first location 146 and generate a first signal indicating the temperature at the first location. Method 300 further includes positioning a second sensor 140 306 at a second location 148 different from the first location 146, wherein the second sensor 140 is configured to measure the temperature at the second location 148 and generate a second signal indicating the temperature at the second location. Method 300 includes connecting the first sensor 136 and the second sensor 140 308 to a sensor controller 107, wherein the sensor controller 107 is configured to: i) receive the first signal and the second signal; ii) process the first signal and the second signal; and iii) generate the processed first signal and the processed second signal. Method 300 further includes connecting sensor controller 107 310 to system controller 106, wherein system controller 106 is configured to: i) receive the processed first signal and the processed second signal; ii) determine a temperature difference between the first location temperature and the second location temperature based on a comparison between the processed first signal and the processed second signal; and iii) generate an alarm when the temperature difference between the first location temperature and the second location temperature is greater than a predetermined threshold temperature.

[0041] The sensor assembly described above facilitates the detection of loose and / or faulty busbar joints using a busbar joint monitoring sensor assembly. Specifically, the busbar joint monitoring sensor assembly includes: a busbar joint cover; a first sensor positioned close to the busbar joint and located within a sensor base connected to the cover; a second sensor positioned at a different location from the first sensor; and a controller communicating with both the first and second sensors. The controller is configured to: compare signals received from the first and second sensors; and determine a temperature difference between the temperatures present at the first and second sensors, generating an alarm or notification if the temperature difference exceeds a predetermined threshold. The presence of a temperature difference exceeding the predetermined threshold indicates a loose and / or faulty connection within the busbar joint. This configuration facilitates efficient and rapid detection of loose and / or faulty connections within the busbar assembly before significant energy loss due to heat or complete joint failure, thereby contributing to superior performance of the busbar system, reduced costs, and more efficient maintenance.

[0042] The exemplary technical effects of the methods, systems and apparatus described herein include at least one of the following: (a) facilitating the detection of loose and / or faulty busbar connections in busbar systems; (b) reducing the operating costs of busbar systems; (c) reducing energy losses caused by loose and / or faulty busbar connections; and (d) reducing unplanned service interruptions caused by busbar connection failures.

[0043] The exemplary embodiments of the busbar joint monitoring sensor assembly have been described in detail above. The busbar joint monitoring sensor assembly and its assembly methods are not limited to the specific embodiments described herein; in fact, components of the system and / or steps of the method may be used independently and separately from other components and / or steps described herein. For example, the method may also be used in combination with other components of a busbar or busbar system, and is not limited to being practiced only with the systems and methods described herein. In practice, exemplary embodiments can be implemented and utilized in conjunction with many other power transmission applications that require connection of the monitoring sensor assembly.

[0044] While specific features of various embodiments of the invention may be shown in some figures but not in others, this is merely for convenience. According to the principles of the invention, any feature of any other drawing may be referenced to and / or claimed in the drawing.

[0045] This written description uses examples to disclose the invention, including the best mode, and also enables those skilled in the art to practice the invention, including making and using any apparatus or system and performing any incorporated methods. The patentable scope of the invention is defined by the claims and may include other instances that may occur to those skilled in the art. Such other instances are intended to be within the scope of the claims if they have structural elements identical to the literal language of the claims, or if they contain equivalent structural elements that are not substantially different from the literal language of the claims.

Claims

1. A power distribution busbar joint monitoring sensor assembly, comprising: A busbar connector cover configured to surround a busbar connector, wherein the inner surface of the busbar connector cover defines a substantially enclosed volume between the inner surface of the busbar connector cover and the busbar connector, the busbar connector including connector stack fasteners. A first sensor is configured to measure the temperature at a first location via a probe portion of the first sensor at a first location and generate a first signal indicating the temperature at the first location, wherein the first location is adjacent to the busbar joint and within the generally enclosed volume. A sensor base, which is coupled to the first sensor and the busbar connector cover and configured to hold the probe portion of the first sensor in the first position, the sensor base extending through the busbar connector cover into the generally enclosed volume, wherein the probe portion of the first sensor partially protrudes from the sensor base at the first position. A second sensor is configured to measure the temperature at a second location and generate a second signal indicating the temperature at the second location, wherein the second location is at ambient temperature. A sensor controller that communicates with the first sensor and the second sensor, the sensor controller being configured to: i) receive the first signal and the second signal; ii) Process the first signal and the second signal; and iii) generating the processed first signal and the processed second signal; as well as A system controller that communicates with the sensor controller, the system controller being configured to: i) receive the processed first signal and the processed second signal; ii) Determine the temperature difference between the first location temperature and the second location temperature based on a comparison between the processed first signal and the processed second signal; and iii) when the temperature difference between the first location temperature and the second location temperature is greater than a predetermined threshold temperature, an alarm is generated.

2. The power distribution busbar joint monitoring sensor assembly of claim 1, wherein the probe portion of the first sensor in the first position is configured to measure the temperature of the busbar joint, and wherein the first portion of the first sensor is positioned outside the generally enclosed volume.

3. The power distribution busbar joint monitoring sensor assembly according to claim 1, wherein the first sensor and the second sensor are each 100 kΩ thermistors.

4. The power distribution busbar joint monitoring sensor assembly according to claim 1, wherein the second sensor is located outside the generally enclosed volume.

5. The power distribution busbar connector monitoring sensor assembly according to claim 1, wherein the sensor base comprises a non-conductive plastic material with an Underwriters Laboratories UL Flammability Test V rating of 94.

6. The power distribution busbar connector monitoring sensor assembly according to claim 1, wherein the sensor base is threaded to receive a first nut and a second nut, and wherein the first nut is positioned against the outside of the busbar connector cover, and the second nut is positioned against the inner surface of the busbar connector cover.

7. The power distribution busbar joint monitoring sensor assembly according to claim 6, wherein the predetermined threshold temperature is approximately 50 degrees Celsius.

8. A power distribution busbar assembly, comprising: The first busbar trunking includes a first busbar row; The second busbar trunking includes a second busbar row; Busbar connectors, including: A connector stack, which connects the first busbar and the second busbar; and Joint stack fasteners; and A power distribution busbar joint monitoring sensor assembly, comprising: A busbar connector cover surrounding the busbar connector, wherein the inner surface of the busbar connector cover defines a substantially enclosed volume between the inner surface of the busbar connector cover and the busbar connector. A first sensor is configured to measure the temperature at a first location via a probe portion of the first sensor at a first location and generate a first signal indicating the temperature at the first location, wherein the first location is adjacent to the busbar joint and within the generally enclosed volume. A sensor base, which is coupled to the first sensor and the busbar connector cover and configured to hold the probe portion of the first sensor in the first position, the sensor base extending through the busbar connector cover into the generally enclosed volume, wherein the probe portion of the first sensor partially protrudes from the sensor base at the first position. A second sensor, configured to measure the temperature at a second location and generate a second signal indicating the temperature at the second location, wherein the second location is at ambient temperature; and A sensor controller, communicating with the first sensor and the second sensor, is configured to: i) receive the first signal and the second signal; ii) process the first signal and the second signal; and iii) generate the processed first signal and the processed second signal; and A system controller, which communicates with the sensor controller, is configured to: i) receive the processed first signal and the processed second signal; ii) determine the temperature difference between the first location temperature and the second location temperature based on a comparison between the processed first signal and the processed second signal; and iii) generate an alarm when the temperature difference between the first location temperature and the second location temperature is greater than a predetermined threshold temperature.

9. The power distribution busbar assembly of claim 8, wherein the probe portion of the first sensor in the first position is configured to measure the temperature of the busbar joint, and a portion of the first sensor is positioned outside the generally enclosed volume.

10. The power distribution busbar assembly according to claim 8, wherein the first sensor and the second sensor are each 100 kΩ thermistors.

11. The power distribution busbar assembly of claim 8, wherein the second sensor is located outside the generally enclosed volume.

12. The power distribution busbar assembly of claim 8, wherein the sensor base comprises a non-conductive plastic material with an Underwriters Laboratories UL Flammability Test V rating of 94.

13. The power distribution busbar assembly according to claim 8, wherein the sensor base is threaded to receive a first nut and a second nut, and wherein the first nut is positioned against the outside of the busbar connector cover, and the second nut is positioned against the inner surface of the busbar connector cover.

14. The power distribution busbar assembly of claim 13, wherein the predetermined threshold temperature is approximately 50 degrees Celsius.

15. A method for assembling a monitoring sensor assembly for a power distribution busbar connector, the method comprising: The sensor base is coupled to the busbar connector cover by extending the sensor base through the busbar connector cover, wherein the busbar connector cover is configured to surround the busbar connector and define a generally enclosed volume between the inner surface of the busbar connector cover and the busbar connector, the busbar connector including connector stack fasteners, and wherein the sensor base extends into the generally enclosed volume. A first sensor is coupled to the sensor base such that a probe portion of the first sensor partially protrudes from the sensor base and is positioned at a first location, wherein the first sensor is configured to measure the temperature at the first location via the probe portion and generate a first signal indicating the temperature at the first location, and wherein the first location is adjacent to the busbar connector. The second sensor is positioned at a second location different from the first location, wherein the second sensor is configured to measure the ambient temperature at the second location and generate a second signal indicating the temperature at the second location; The first sensor and the second sensor are connected to a sensor controller, wherein the sensor controller is configured to: i) receive the first signal and the second signal; ii) Process the first signal and the second signal; and iii) generating the processed first signal and the processed second signal; as well as The sensor controller is coupled to a system controller, wherein the system controller is configured to: i) receive the processed first signal and the processed second signal; ii) Determine the temperature difference between the first location temperature and the second location temperature based on a comparison between the processed first signal and the processed second signal; and iii) when the temperature difference between the first location temperature and the second location temperature is greater than a predetermined threshold temperature, an alarm is generated.

16. The method of claim 15, wherein connecting the sensor base to the busbar connector cover further comprises: Align the template with the busbar joint cover, so that the multiple template positioning openings are aligned with the corresponding multiple busbar joint cover installation openings; as well as The busbar joint cover opening is formed using the guide hole located in the template.

17. The method of claim 15, wherein connecting the first sensor to the sensor base comprises connecting a 100 kΩ thermistor to the sensor base.

18. The method of claim 15, wherein coupling the first sensor to the sensor base further comprises positioning a portion of the first sensor outside the generally enclosed volume.

19. The method of claim 15, wherein positioning the second sensor at the second location comprises positioning a 100 kΩ thermistor at the second location.

20. The method of claim 15, wherein attaching the sensor base to the busbar connector cover comprises attaching the sensor base to the busbar connector cover using a first nut positioned against the outside of the busbar connector cover and a second nut positioned against the inner surface of the busbar connector cover.

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