Light emitting assembly and optical module

Abstract

The invention discloses a light emitting assembly and an optical module. Wherein the light emitting assembly comprises a substrate, a silicon optical chip arranged on the substrate, a light emitter arranged on the surface of one side, opposite to an active surface, of the silicon optical chip, an optical module and a deflection lens, and the active surface of the silicon optical chip is electrically connected with the substrate; an optical transmission channel is arranged in the silicon optical chip, and a light beam emitted from the light emitter passes through the optical module, is deflected by the deflection lens, enters the optical transmission channel and is further coupled to a waveguide in the silicon optical chip. According to the light emitting component, the optical device is arranged on the non-active surface of the silicon optical chip by using an inverted mounting process, and the extension length of the whole light emitting component can be reduced in combination with the deflection design of an optical path, so that the miniaturization design of an optical module is met. Meanwhile, the coupling times of optical devices can be reduced, and the stability and the mass production yield of the optical module are improved.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of optical modules, and particularly relates to an optical transmitting assembly and an optical module. BACKGROUND

[0002] An optical module is an optoelectronic device for optical-electric and electric-optical conversion. An optical transmitting assembly of the optical module is used for converting an electrical signal into an optical signal, and an optical receiving assembly is used for converting an optical signal into an electrical signal. With the rapid development of optical module transmission rates from 1.25G, 10G to 400G, 800G or even 1.6T and above, the traditional Chip On Board packaging technology cannot meet the core needs of the new generation of products. Its inherent disadvantages are increasingly prominent in high-frequency and high-power scenarios, especially in terms of parasitic parameters, heat dissipation performance, reliability and structural integration.

[0003] The existing optical module scheme adopts a Chip On Board packaging scheme, and a silicon optical chip is directly mounted on a PCB board or a metal heat sink surface. A laser and a corresponding optical module are also fixed on a stacked structure composed of a metal heat sink and a ceramic gasket by using a mounting device. The laser, the optical module and the silicon optical chip are arranged in sequence, and the light beam emitted by the laser is coupled to the silicon optical chip after passing through the optical module.

[0004] In the existing optical module scheme, the Chip On Board process relies on a gold wire bonding electrical connection method to introduce too high parasitic inductance and capacitance, which leads to a sharp deterioration of signal integrity and has become the primary limiting factor for improving the rate and bandwidth. In addition, the laser, the optical module and the silicon optical chip are arranged in sequence, which increases the volume of the optical module and makes it difficult to design it to be small. Moreover, the optical path structure scheme for coupling the laser into the silicon optical chip is relatively long, and the silicon optical chip and the laser are arranged at different positions and heights, which leads to higher requirements for the stability and coupling alignment accuracy of the optical module, and it is difficult to achieve a high yield in production.

[0005] Therefore, in view of the above technical problems, it is necessary to provide an optical transmitting assembly and an optical module. SUMMARY

[0006] The present application aims to provide an optical transmitting assembly and an optical module, which can solve the problems of large volume, low coupling alignment accuracy and low processing yield of the optical module caused by the Chip On Board process.

[0007] To achieve the above object, one embodiment of the present application provides an optical emission assembly, comprising a substrate, a silicon optical chip arranged on the substrate, an optical emitter arranged on a side surface of the silicon optical chip opposite to an active surface, an optical module, and a deflection lens, the active surface of the silicon optical chip is electrically connected with the substrate; the silicon optical chip is provided with an optical transmission channel, after the light beam emitted from the optical emitter passes through the optical module, the light beam is deflected into the optical transmission channel through the deflection lens, and then is coupled to a waveguide in the silicon optical chip.

[0008] In one or more embodiments of the present application, the light incident port of the optical transmission channel is arranged on the side surface of the silicon optical chip opposite to the active surface, and the deflection lens is arranged to deflect the light beam towards the light incident port of the optical transmission channel.

[0009] In one or more embodiments of the present application, the deflection lens comprises an incident surface, a reflection surface, and an exit surface, the light beam incident from the incident surface is reflected by the reflection surface and then emitted from the exit surface.

[0010] In one or more embodiments of the present application, the side surface of the silicon optical chip opposite to the active surface is attached to the exit surface; and / or, the included angle between the exit surface and the reflection surface is 45°.

[0011] In one or more embodiments of the present application, the deflection lens is provided with an anti-reflection film on the incident surface and / or the exit surface; and / or, the deflection lens is provided with a high-reflection film on the reflection surface.

[0012] In one or more embodiments of the present application, the light beam enters the optical transmission channel after being reflected at least once by the deflection lens; and / or,

[0013] The light incident port of the optical transmission channel is directed towards the exit surface of the deflection lens; and / or,

[0014] The light beam is coupled to the waveguide in the silicon optical chip perpendicularly through the optical transmission channel.

[0015] In one or more embodiments of the present application, the optical module comprises a focusing lens and an isolator arranged on the side surface of the silicon optical chip opposite to the active surface, the light beam emitted from the optical emitter is sequentially focused by the focusing lens and then incident to the deflection lens after passing through the isolator.

[0016] In one or more embodiments of the present application, the optical module comprises a collimating lens, an isolator, and a focusing lens arranged on the side surface of the silicon optical chip opposite to the active surface, the light beam emitted from the optical emitter is collimated by the collimating lens, and then is focused by the focusing lens and incident to the deflection lens after passing through the isolator.

[0017] In one or more embodiments of the present application, the silicon optical chip comprises at least two groups of the optical transmitter and the optical module, the optical transmitting assembly further comprises at least two groups of corresponding fiber arrays, and the silicon optical chip is used for coupling light beams to the corresponding fiber arrays.

[0018] The optical module provided by the embodiment of the present application also comprises the optical transmitting assembly.

[0019] Compared with the prior art, in the optical transmitting assembly of the present application, the active surface of the silicon optical chip is electrically connected with the substrate, the optical transmitter, the optical module and the deflection lens are surface-mounted on the side surface of the silicon optical chip opposite to the active surface, the light beams pass through the optical module and the deflection lens in sequence from the optical transmitter, and finally are deflected into the optical transmission channel and coupled to the waveguide in the silicon optical chip. It can be seen that the optical transmitting assembly of the present application utilizes the flip-chip process to arrange the optical devices on the non-active surface of the chip, and combines the deflection design of the optical path, so that the extension length of the entire optical transmitting assembly can be reduced, and the miniaturization design requirement of the optical module is met. Secondly, the optical transmitter, the optical module and the deflection lens are mounted on the same surface of the silicon optical chip, the height tolerance in the same plane is controllable, and the reduction of the coupling precision of the three caused by the inconsistent thermal expansion coefficients of different materials when arranged at different positions is avoided, so that the stability and the yield of mass production of the optical module are improved. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments described in the present application, and other drawings can also be obtained by those skilled in the art without any creative effort.

[0021] Figure 1 FIG. 1 is a schematic diagram of the optical path of the optical transmitting assembly in an embodiment of the present application;

[0022] Figure 2 FIG. 2 is a schematic diagram of the optical path of the optical transmitting assembly in another embodiment of the present application;

[0023] Figure 3 FIG. 3 is a schematic diagram of the structure of the optical transmitting assembly in an embodiment of the present application;

[0024] Figure 4 FIG. 4 is a schematic diagram of the structure of the optical transmitting assembly in another embodiment of the present application.

[0025] Explanation of main reference signs:

[0026] 1, substrate; 2, silicon optical chip; 21, active surface; 3, optical transmitter; 4, optical module; 41, focusing lens; 42, isolator; 43, collimating lens; 5, folding lens; 51, entrance surface; 52, reflecting surface; 53, exit surface; 6, fiber array. DETAILED DESCRIPTION

[0027] In order to enable those skilled in the art to better understand the technical solutions in the present disclosure, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative labor should fall within the scope of protection of the present disclosure.

[0028] An optical module is an optoelectronic device for performing photoelectric and electro-optical conversion. The optical transmitting component of the optical module is used to convert an electrical signal into an optical signal, and the optical receiving component is used to convert an optical signal into an electrical signal. With the rapid development of the transmission rate of the optical module, the traditional Chip On Board packaging technology has been unable to meet the core needs of the new generation of products. Its inherent disadvantages are increasingly prominent in high-frequency and high-power scenarios, especially in terms of parasitic parameters, heat dissipation performance, reliability, and structural integration. Among them, the Chip On Board process described above is a packaging process in which a bare chip is directly fixed on a printed circuit board through an adhesive, and electrical connection is made using gold wire bonding, and finally protection is made through dispensing.

[0029] The existing optical module scheme adopts the Chip On Board packaging scheme, and the silicon optical chip is directly mounted on the PCB board or the surface of the metal heat sink. The laser and the corresponding optical module are also fixed on the stacked structure composed of the metal heat sink and the ceramic gasket by using the mounting equipment. The laser, the optical module and the silicon optical chip are arranged in sequence, and the light beam emitted by the laser is coupled to the waveguide of the silicon optical chip after passing through the optical module.

[0030] In the above design, since the laser, the optical module and the silicon optical chip are arranged in sequence on the substrate, it leads to a long extension length and a large volume of the entire optical module, which is not conducive to the miniaturization design of the optical module. At the same time, in the above design, the silicon optical chip and the laser are at different objects and heights, which leads to higher requirements for the stability and coupling alignment accuracy of the optical module, and it is difficult to achieve a high yield in mass production.

[0031] Based on the above problems, the purpose of the present application is to provide a light emitting assembly which can realize the miniaturization design of the optical module, can effectively reduce the coupling times in the later stage, and has a shorter optical path, which helps to reduce the transmission loss and has better performance. The present application provides a light emitting assembly, and the inventive concept is that the light emitting assembly comprises a substrate, a silicon optical chip, a light emitter, an optical module and a deflection lens. The active surface of the silicon optical chip is electrically connected with the substrate, and specifically, the active surface of the silicon optical chip is packaged with the substrate by Flip-chip packaging process. The light emitter, the optical module and the deflection lens are arranged on the side surface opposite to the active surface of the silicon optical chip. The Flip-chip packaging process is a packaging process in which the active surface of the silicon optical chip faces downward, and the convex points are directly electrically and mechanically interconnected with the substrate.

[0032] The active surface 21 of the silicon optical chip 2 is electrically connected with the substrate 1, and the light emitter 3, the optical module 4 and the deflection lens 5 are mounted on the side surface opposite to the active surface 21 of the silicon optical chip 2. The light beam passes through the optical module 4 and the deflection prism in sequence from the light emitter 3, and finally deflects into the optical transmission channel and is coupled into the waveguide in the silicon optical chip 2. It can be seen that the light emitting assembly of the present application uses the Flip-chip packaging process to arrange the optical devices on the non-active surface 21 of the chip, and combines the deflection design of the optical path, so that the extension length of the entire light emitting assembly can be reduced, and the miniaturization design requirement of the optical module can be met.

[0033] Further, since the light emitter, the optical module and the deflection lens inevitably have material tolerance or manufacturing tolerance, mounting them on the same surface of the silicon optical chip can control the same plane height tolerance, which can effectively reduce the coupling times in the later stage and improve the production yield. Secondly, the light emitting assembly inevitably generates heat during operation, which causes the thermal expansion coefficients of different materials to be inconsistent, resulting in a decrease in the coupling accuracy of the three. In the present application, since the three are located on the same plane, the slight expansion displacement tends to be synchronized, which can offset the negative effects of the displacement of a single optical element on the optical path coupling, thereby improving the overall stability and production yield.

[0034] In the above concept, the silicon optical chip is also provided with an optical transmission channel. After the light beam emitted from the light emitter passes through the optical module, it is deflected into the optical transmission channel by the deflection lens, and then coupled into the waveguide in the silicon optical chip. In the optical path design, the light beam passes through the optical module from the light emitter, is deflected into the optical transmission channel by the deflection prism, and is coupled into the waveguide in the silicon optical chip. The optical path of the light emitting assembly has a shorter path, which helps to reduce the transmission loss and has better performance.

[0035] The light emitting assembly of the present application will be described in detail below in conjunction with specific embodiments.

[0036] Based on the above inventive concept, please refer to Figure 1 The light emitting assembly in an embodiment of the present application comprises a substrate 1, a silicon optical chip 2 arranged on the substrate 1, a light emitter 3 arranged on a side surface of the silicon optical chip 2 opposite to the active surface 21, an optical module 4, and a deflection lens 5. The active surface 21 of the silicon optical chip 2 is electrically connected to the substrate 1. The silicon optical chip 2 is provided with an optical transmission channel. The light beam emitted from the light emitter 3 is deflected into the optical transmission channel by the deflection lens 5 after passing through the optical module 4, and then coupled to the waveguide in the silicon optical chip 2.

[0037] Specifically, the active surface 21 of the silicon optical chip 2 and the substrate 1 can be packaged by a Flip-chip packaging scheme. For example, the solder bumps of the active surface 21 of the silicon optical chip 2 and the surface pads of the substrate 1 are electrically connected by a reflow soldering process. The Flip-chip packaging scheme has been described above and will not be repeated here. In addition, the light emitter 3 can be a semiconductor laser, for example, a Distributed-feedback laser (DFB-LD) or an Electro-absorption Modulated Laser (EML). The optical transmission channel can be a through hole formed in the silicon optical chip 2, or a light transmission channel filled with silicon material and provided with a silica medium on the extension side of the channel. The difference in refractive index between silicon and silica is used to make the light beam totally reflected in the optical transmission channel and then transmitted along the optical path. The present embodiment does not make any limitation on this.

[0038] Compared to the comparative design, the silicon photonics chip 2 is directly mounted on the PCB board or metal heat sink using a Chip On Board (COP) packaging process. The light emitter 3, optical module 4, and silicon photonics chip 2 are arranged sequentially and fixed to a stacked structure composed of a metal heat sink and ceramic pads using a mounting device. In this invention, the light emitter 3, optical module 4, and deflecting lens 5 are all disposed on the side of the silicon photonics chip 2 opposite to the active surface 21. The light beam originates from the light emitter 3, passes sequentially through the optical module 4 and the deflecting prism, and is finally deflected into the light transmission channel and coupled to the waveguide within the silicon photonics chip 2. It can be seen that the light emitting component of this invention utilizes a flip-chip process to arrange optical devices on the non-active surface 21 of the chip. Combined with the deflection design of the optical path, the overall length of the light emitting component can be reduced, meeting the miniaturization design requirements of the optical module. In the above comparative design, since the silicon photonic chip 2 adopts the Chip On Board packaging scheme, its active surface 21 is away from the substrate 1 and needs to be electrically connected to the substrate 1 by gold wire bonding. As a result, the light emitter 3, optical module 4 and deflecting lens 5 cannot be set on its active surface 21. It can only arrange the light emitter 3, optical module and silicon photonic chip 2 in sequence in the plane, thus increasing the extension length of the light emission component and increasing the volume of the optical module.

[0039] Furthermore, since the light emitter 3, optical module 4, and deflecting lens 5 inevitably have material or manufacturing tolerances, in this embodiment, all three are mounted on the same side of the silicon photonic chip 2. Their height tolerance on the same plane is controllable, effectively reducing the number of subsequent coupling operations and improving production yield. In addition, the light emitting component inevitably generates heat during operation, which may cause thermal expansion deformation of the substrate 1 and silicon photonic chip 2 due to their different coefficients of thermal expansion. Since all three are located on the same plane, the resulting minute expansion displacements tend to be synchronized, mutually canceling the impact of individual component displacement on the optical path, thus improving overall stability and mass production yield. Finally, since the light emitter 3, optical module 4, and deflecting lens 5 are mounted on the same side of the silicon photonic chip 2, there is no need to consider interference between the optical components, nor is it necessary to design separate metal heat sinks for each optical component, making the packaging process more convenient.

[0040] In this embodiment, the light beam emitted from the light emitter 3 travels through the optical module 4 and is deflected by the deflecting lens 5 into the light transmission channel, where it is then coupled to the waveguide within the silicon photonics chip 2. Compared to the aforementioned comparative design, where the light emitter 3, optical module, and silicon photonics chip 2 are arranged sequentially, resulting in a longer optical path, the deflecting lens 5 in this embodiment deflects the light, allowing it to be quickly deflected to the light transmission channel of the silicon photonics chip 2 and coupled to the waveguide within it. Furthermore, since the deflecting lens 5 is positioned on the surface of the silicon photonics chip 2 opposite to the active surface 21, and the silicon photonics chip 2 directly has a light transmission channel, this embodiment significantly shortens the optical path compared to placing it in other locations, such as the side of the silicon photonics chip 2, or designing the silicon photonics chip 2 without a light transmission channel. This shorter optical path for the light emitting component helps reduce transmission loss and improves performance.

[0041] In this embodiment, the light entrance of the optical transmission channel is located on the side surface of the silicon photonics chip 2 opposite to the active surface 21, and the deflecting lens 5 is configured to deflect the light beam toward the light entrance of the optical transmission channel. The deflecting lens 5 deflects the light beam and allows it to directly enter the optical transmission channel, thus shortening the optical path as much as possible and reducing transmission loss. Based on this, the deflecting lens 5 may include an incident surface 51, a reflecting surface 52, and an exit surface 53. The light beam incident from the incident surface 51 is reflected by the reflecting surface 52 and exits from the exit surface 53. In this embodiment, the end face of the deflecting lens 5 can be triangular, trapezoidal, or other shapes, and can be correspondingly provided with the aforementioned incident surface 51, reflecting surface 52, and exit surface 53. To improve the incident effect of the light beam at the incident surface 51 and the exit effect at the exit surface 53, in this embodiment, the deflecting lens 5 is provided with an anti-reflection film on the incident surface 51 and / or the exit surface 53. Similarly, in order to improve the reflection effect of the light beam on the reflecting surface 52, the deflecting lens 5 in this embodiment is provided with a high-reflection coating on the reflecting surface 52.

[0042] Please refer to Figure 1 In one optional embodiment, the surface of the silicon photonic chip 2 opposite to the active surface 21 is bonded to the emitting surface 53. This ensures that the light beam, after being reflected by the reflecting surface 52, directly enters the optical transmission channel of the silicon photonic chip 2 and is then coupled to the waveguide of the silicon photonic chip 2. Specifically, optical adhesive can be used to bond and fix the surface of the silicon photonic chip 2 opposite to the active surface 21 to the emitting surface 53. The light entrance of the optical transmission channel can face the emitting surface 53 of the deflecting lens 5, so that the light beam, after passing through the deflecting lens 5, directly enters the optical transmission channel, thereby shortening the optical path as much as possible and reducing transmission loss.

[0043] Please refer to Figure 1The angle between the emitting surface 53 and the reflecting surface 52 is 45°. This angle setting allows the light beam to be vertically coupled to the waveguide within the silicon photonics chip 2 via the optical transmission channel. It is understood that in other embodiments, the light beam can also be incident obliquely onto the light entrance of the optical transmission channel, and a total internal reflection structure with the reflecting surface 52 can be provided within the optical transmission channel to allow the light beam to ultimately couple to the waveguide of the silicon photonics chip 2.

[0044] In this embodiment, the light beam enters the light transmission channel after being reflected at least once by the deflecting lens 5. In other embodiments, it may also enter the light transmission channel after being reflected two or three times, or other times, by the deflecting lens 5. It is understood that if multiple reflections are required, multiple reflecting surfaces 52 can be provided corresponding to the deflecting lens 5, or multiple deflecting lenses 5 can be provided, each deflecting lens 5 having a corresponding reflecting surface 52, to achieve the above-mentioned reflection effect.

[0045] Please refer to Figure 1 The optical module 4 includes a focusing lens 41 and an isolator 42 disposed on the surface of the silicon photonics chip 2 opposite to the active surface 21. The light beam emitted from the light emitter 3 is focused by the focusing lens 41 and then incident on the deflecting lens 5 after passing through the isolator 42. The light beam emitted from the light emitter 3 can be focused by the focusing lens 41 and then transmitted unidirectionally to the deflecting lens 5 via the isolator 42. Therefore, the converging light beam, after being deflected by the deflecting lens 5, can converge at the light entrance of the light transmission channel of the silicon photonics chip 2, and then couple to the waveguide of the silicon photonics chip 2. The light emitter 3 and the isolator 42 can be fixed to the silicon photonics chip 2 with adhesive, and the focusing lens 41 can be fixed to the silicon photonics chip 2 using a coupling process and adhesive.

[0046] Please refer to Figure 2 In another optional embodiment, the optical module 4 includes a collimating lens 43, an isolator 42, and a focusing lens 41 disposed on the surface of the silicon photonics chip 2 opposite to the active surface 21. The light beam emitted from the light emitter 3 is collimated by the collimating lens 43, passes through the isolator 42, and is focused by the focusing lens 41 before entering the deflecting lens 5. In this embodiment, the light beam emitted by the light emitter 3 can first be collimated by the collimating lens 43, then focused by the focusing lens 41, and then enter the deflecting lens 5. Similarly, the light emitter 3 and the isolator 42 can be fixed to the silicon photonics chip 2 with adhesive, and the collimating lens 43 and the focusing lens 41 can be fixed to the silicon photonics chip 2 by a coupling process using adhesive.

[0047] Please refer to Figure 3In this embodiment, the silicon photonic chip 2 is provided with a set of light emitters 3, optical modules 4, and deflecting lenses 5. The silicon photonic chip 2 is correspondingly provided with a set of fiber arrays 6, wherein the set of fiber arrays 6 may include two channels or four channels, etc. This application does not limit the number of channels of the fiber array 6. The light beam emitted from the light emitter 3 passes through the optical modules 4 and deflecting lenses 5 in sequence, and is coupled with the waveguide of the silicon photonic chip 2. Finally, it is split by the silicon photonic chip 2 and coupled into the channels of the fiber array 6.

[0048] Please refer to Figure 4 The silicon photonics chip 2 includes at least two sets of light emitters 3 and optical modules 4. The light emitting assembly also includes at least two corresponding fiber arrays 6. The silicon photonics chip 2 is used to couple light beams to the corresponding fiber arrays 6, which can meet the need for higher transmission rates. In one optional embodiment, two sets of light emitters 3 and optical modules 4 are disposed on the back side of the silicon photonics chip 2, and the silicon photonics chip 2 has two optical transmission channels. In this embodiment, two deflecting lenses 5 can be correspondingly disposed, and the light beams emitted by the two sets of light emitters 3 can be deflected by the two deflecting lenses 5 to the optical transmission channels of the silicon photonics chip 2 respectively. In another optional embodiment, only one longer deflecting lens 5 can be disposed, and the light beams emitted by the two sets of light emitters 3 can be deflected by the same deflecting lens 5 to the optical transmission channel of the silicon photonics chip 2. In other embodiments, the light emitters 3, optical modules 4, and corresponding fiber arrays 6 disposed on the back side of the silicon photonics chip 2 can also be three, four, or even more sets. The number of deflecting lenses 5 can be correspondingly set, or they can share the same longer deflecting lens 5. This application does not limit this.

[0049] Please refer to Figure 1 In one embodiment of the present invention, an optical module is also disclosed, including the aforementioned optical emitting component. It is understood that the optical module equipped with the aforementioned optical emitting component can achieve a miniaturized design. Simultaneously, it facilitates the packaging of the optical emitting component, reduces the number of coupling operations, and improves packaging efficiency. During operation, due to the arrangement of the deflecting lens 5 and the optical transmission channel of the silicon photonics chip 2, it has a shorter optical path, which can effectively reduce light transmission loss and improve the stability of the optical module's operation.

[0050] Therefore, the optical emitting component and optical module of the present invention have at least the following beneficial effects:

[0051] (1) The active surface 21 of the silicon photonic chip 2 is electrically connected to the substrate 1, so that the light emitter 3, the optical module 4 and the deflecting lens 5 can be installed on the side of the silicon photonic chip 2 opposite to the active surface 21. Compared with the comparative scheme in which the light emitter 3, the optical module 4 and the silicon photonic chip 2 are arranged in sequence, this scheme, combined with the deflection design of the optical path, can reduce the extension length of the entire light emitting component, which is conducive to achieving a more compact package size of multiple optical components and meeting the growing miniaturization requirements of optical modules. At the same time, stacking optical components on the silicon photonic chip 2 can reduce the area of ​​the substrate 1 and save space layout of the substrate 1.

[0052] (2) Material or manufacturing tolerances are unavoidable for the light emitter 3, optical module 4, and deflecting lens 5. By mounting the light emitter 3, optical module 4, and deflecting lens 5 on the same surface of the silicon photonic chip 2, their height tolerance on the same plane can be controlled, which can effectively reduce the number of subsequent couplings and improve production yield. Compared with the comparative scheme where the light emitter 3, optical module 4, and silicon photonic chip 2 are set on different metal heat sink structures, the coupling number is higher and the coupling accuracy is lower. In addition, by mounting the light emitter 3, optical module 4, and deflecting lens 5 on the same surface of the silicon photonic chip 2, there is no need to consider the interference between the structures, and there is no need to design a separate metal heat sink structure for each optical element, making the packaging process more convenient.

[0053] (3) The light emitting component inevitably generates heat during operation. The substrate 1 and the silicon photonic chip 2 may undergo thermal expansion deformation due to their different coefficients of thermal expansion. The fact that the three are located on the same plane can make the small displacements generated by the three tend to be synchronized. Their synchronized displacement can offset the negative impact of the displacement of a single optical element on the optical path coupling, resulting in better stability. Therefore, the light emitter 3, the optical module 4, and the deflecting lens 5 located on the same optical platform of the silicon photonic chip 2 have better optical path reliability.

[0054] (4) By setting a deflecting lens 5 and setting an optical transmission channel in the silicon photonic chip 2, the light beam is deflected by the deflecting lens 5 and enters the optical transmission channel, and then coupled to the waveguide in the silicon photonic chip 2. Compared with the comparative scheme in which the light emitter 3, optical module 4 and silicon photonic chip 2 are arranged in sequence, the optical path of the light emitting component of the present invention has a shorter optical path coupled to the waveguide, and the optical path of the light emitting component is shorter, and its transmission loss is also smaller.

[0055] (5) Traditional Chip On Board packaging solutions achieve electrical connections through gold wire bonding, which introduces large parasitic inductance and capacitance, becoming a "bottleneck" for high-speed signal transmission and severely limiting bandwidth. In this invention, the Flip-Chip packaging solution allows the active surface 21 of the silicon photonic chip 2 to be directly interconnected with the substrate 1. Its interconnection path is extremely short, which can minimize these parasitic parameters and support extremely high frequencies.

[0056] (6) The Flip-Chip packaging scheme allows the active surface 21 of the silicon photonic chip 2 to be directly connected to the external heat sink through the thermally conductive bumps (such as gold solder) and the substrate 1. The heat dissipation path is extremely short and the heat dissipation efficiency is much higher than that of wire bonding, which can ensure the lifespan and wavelength stability of the laser.

[0057] (7) Since the Flip-Chip packaging scheme is a bump array connection, the mechanical strength is higher than that of the gold wire connection, so the light emitting component of the present invention has better shock resistance and fatigue resistance.

[0058] In the description of the embodiments of the present invention, it should be understood that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use, or the orientation or positional relationship commonly understood by those skilled in the art. They are only used to facilitate the description of the present invention and to simplify the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0059] In the description of the embodiments of the present invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the present invention based on the specific circumstances.

[0060] It will be apparent to those skilled in the art that this disclosure is not limited to the details of the exemplary embodiments described above, and that this disclosure can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of this disclosure is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this disclosure. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0061] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A light emitting component, characterized in that, The device includes a substrate (1), a silicon photonic chip (2) disposed on the substrate (1), a light emitter (3) disposed on the side surface of the silicon photonic chip (2) opposite to the active surface (21), an optical module (4), and a deflecting lens (5). The active surface (21) of the silicon photonic chip (2) is electrically connected to the substrate (1). The silicon photonic chip (2) is provided with an optical transmission channel. The light beam emitted from the light emitter (3) passes through the optical module (4) and is deflected by the deflecting lens (5) into the optical transmission channel, and then coupled to the waveguide in the silicon photonic chip (2).

2. The light emitting component according to claim 1, characterized in that, The light inlet of the light transmission channel is located on the side surface of the silicon photonic chip (2) opposite to the active surface (21), and the deflecting lens (5) is configured to deflect the light beam toward the light inlet of the light transmission channel.

3. The optical emitting component according to claim 1, characterized in that, The deflecting lens (5) includes an incident surface (51), a reflecting surface (52), and an exit surface (53). The light beam incident from the incident surface (51) is reflected by the reflecting surface (52) and exits from the exit surface (53).

4. The light emitting component according to claim 3, characterized in that, The side surface of the silicon photonic chip (2) opposite to the active surface (21) is attached to the emitting surface (53); and / or, the angle between the emitting surface (53) and the reflecting surface (52) is 45°.

5. The light emitting component according to claim 3 or 4, characterized in that, The deflecting lens (5) is provided with an anti-reflection film on the incident surface (51) and / or the exit surface (53); and / or, the deflecting lens (5) is provided with a high-reflection film on the reflecting surface (52).

6. The optical emitting component according to claim 1, characterized in that, The light beam enters the light transmission channel after being reflected at least once by the deflecting lens (5); and / or, The light entrance of the light transmission channel faces the exit surface (53) of the deflecting lens (5); and / or, The light beam is vertically coupled to the waveguide inside the silicon photonic chip (2) via the optical transmission channel.

7. The optical emitting component according to claim 1, characterized in that, The optical module (4) includes a focusing lens (41) and an isolator (42) disposed on the side surface of the silicon photonic chip (2) opposite to the active surface (21). The light beam emitted from the light emitter (3) passes through the focusing lens (41) and the isolator (42) in sequence before entering the deflecting lens (5).

8. The light emitting component according to claim 1, characterized in that, The optical module (4) includes a collimating lens (43), an isolator (42), and a focusing lens (41) disposed on the side surface of the silicon photonic chip (2) opposite to the active surface (21). The light beam emitted from the light emitter (3) is collimated by the collimating lens (43), passes through the isolator (42), and is focused by the focusing lens (41) and incident on the deflecting lens (5).

9. The light emitting component according to claim 1, characterized in that, The silicon photonic chip (2) includes at least two sets of light emitters (3) and optical modules (4). The light emission components also include at least two sets of corresponding fiber arrays (6). The silicon photonic chip (2) is used to couple the light beam to the corresponding fiber array (6).

10. An optical module, characterized in that, Includes the light emitting component as described in any one of claims 1-9.

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