Photoresist synchronous baking and drying device system and method

Abstract

The invention provides a photoresist synchronous baking and drying device system and method.The photoresist synchronous baking and drying device system comprises a processing chamber, a solvent collecting module, a vacuum module and a heating module, one end of the solvent collection module is connected with the treatment chamber through a condensation pipeline, the other end of the solvent collection module is connected with the vacuum module through an air exhaust pipeline, so that the vacuum module is communicated with the treatment chamber, the heating module comprises a temperature control device and a heating device which are electrically connected, and the heating device is located in the treatment chamber. The problems that an existing baking process is low in process efficiency, high in solvent residue, poor in film thickness uniformity and the like are solved.

Description

Technical Field

[0001] This invention belongs to the field of display panel manufacturing technology, and relates to photoresist baking, and more particularly to a photoresist synchronous baking and drying apparatus system and method. Background Technology

[0002] In display panel manufacturing, photolithography plays a decisive role in panel quality. Coating and developing are the core steps of the photolithography process, and the evaporation of solvents from the coated photoresist is a crucial step that directly affects the quality of subsequent exposure and development. Residual solvents that haven't completely evaporated can easily react with photosensitive acids during the baking process after exposure and development, forming pores within the photoresist layer and leading to defects in the developed pattern. Currently, the photoresist layer is typically dried before and after the coating, exposure, and development processes to evaporate residual solvents.

[0003] Traditional baking processes use heat to induce physical and chemical changes within the photoresist, thereby stabilizing the film, promoting chemical reactions, and evaporating most of the solvent, transforming the liquid film into a solid film. However, current photoresist baking is generally performed at atmospheric pressure, with temperatures ranging from 60 to 150°C. The solvent evaporation rate is easily affected by fluctuations in ambient humidity or air pressure, and the solvent tends to form residual gradients within the photoresist layer, leading to deviations in film thickness uniformity. Besides baking, vacuuming can also promote solvent evaporation in the photoresist, with conventional vacuum levels controlled within the range of 10 to 100 Pa to reduce solvent residue. However, this method is inefficient, requiring 200 to 300 seconds per cycle, and the poor molecular fluidity of photoresist at low temperatures can easily lead to uneven shrinkage.

[0004] The existing process for solvent evaporation in photoresist is lengthy, requires substrate transfer, increases time consumption, and easily introduces environmental pollutants. It is also difficult to balance low solvent residue with high efficiency, ultimately resulting in a solvent residue rate of more than 1.2% in the photoresist layer, a film thickness uniformity deviation of more than 3%, and a linewidth deviation of more than 5% affecting the subsequent exposure and development of the pattern. Summary of the Invention

[0005] In view of the shortcomings of the existing technology, the purpose of this invention is to provide a photoresist synchronous baking and drying device system and method, which integrates the heating and baking of the coated substrate with vacuum drying, and solves the problems of low process efficiency, high solvent residue and poor film thickness uniformity.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] In a first aspect, the present invention provides a photoresist synchronous baking and drying apparatus system, the photoresist synchronous baking and drying apparatus system comprising a processing chamber, a solvent collection module, a vacuum module and a heating module, the processing chamber being used to accommodate a photoresist-coated substrate, one end of the solvent collection module being connected to the processing chamber via a condensation pipe, and the other end being connected to the vacuum module via an exhaust pipe, thereby connecting the vacuum module and the processing chamber, the heating module comprising an electrically connected temperature control device and a heating device, the heating device being located inside the processing chamber.

[0008] This invention uses a vacuum module to create a vacuum in the processing chamber and a heating module to heat and bake the photoresist-coated substrate, allowing the solvent in the photoresist layer to fully evaporate. At the same time, the vacuum airflow carries the evaporated solvent out of the processing chamber and condenses and collects it, achieving simultaneous baking and drying of the substrate and preventing the solvent from re-adhering to the surface of the photoresist layer and forming film defects.

[0009] As a preferred embodiment of the present invention, the vacuum module includes a vacuum pumping device, a pressure control device, and a plurality of pressure detection components; the vacuum pumping device is connected to the solvent collection module through the air extraction pipe and is connected to the processing chamber; the plurality of pressure detection components are evenly distributed on the inner wall of the processing chamber; the pressure control device is electrically connected to the vacuum pumping device and the pressure detection components respectively.

[0010] This invention provides an online detection and control system for the pressure inside the processing chamber. Based on the detected pressure data, the pressure control device adjusts the vacuum pumping device in real time to ensure that the pressure inside the processing chamber is at the required vacuum level.

[0011] In one embodiment of the present invention, the vacuuming device is provided with a regulating valve, and the pressure control device is electrically connected to the regulating valve.

[0012] As a preferred embodiment of the present invention, the solvent collection module further includes a solvent storage tank connected to the condensation pipe.

[0013] In this invention, the evaporated solvent enters the condensation pipe from the processing chamber with the vacuum airflow and falls into the solvent storage tank to fully discharge the solvent, prevent solvent residue from causing bubbles to form in the adhesive layer, and avoid the evaporated solvent from rising and falling back onto the adhesive layer surface after encountering cold air, thus forming defects that affect the uniformity of the adhesive layer.

[0014] Preferably, the solvent storage tank is equipped with a filter assembly inside.

[0015] This invention utilizes a filtration assembly to remove impurities from volatile solvents, enabling the recycling of clean solvents.

[0016] As a preferred embodiment of the present invention, the heating device includes a plurality of heating plates, which are evenly distributed on the inner sidewall and bottom of the processing chamber. The heating plate located at the bottom of the inner chamber is used to place the adhesive substrate.

[0017] The temperature control device includes a temperature sensing chip and a temperature adjustment component that are electrically connected. The temperature sensing chip is disposed inside the heating plate and is used to detect the temperature of the adhesive substrate. The temperature adjustment component is electrically connected to the heating plate and is used to adjust the heating power of the heating plate.

[0018] This invention provides online temperature detection of the adhesive-coated substrate and utilizes a temperature control component to adjust the heating temperature of the heating plate. This not only prevents excessively rapid solvent evaporation and accumulation on the adhesive surface, hindering subsequent solvent overflow, but also prevents excessively slow solvent evaporation, which could lead to incomplete evaporation and reduced productivity.

[0019] As a preferred embodiment of the present invention, the heating device further includes two auxiliary baffles, which are disposed opposite to each other above the heating plate located at the bottom of the inner cavity. A plurality of hot air blades are distributed on the auxiliary baffles to generate airflow in a preset direction.

[0020] This invention utilizes an auxiliary baffle to ensure that the volatile solvent rises along a set path, accelerating the contact between the volatile solvent and the vacuum gas flow. It also uses an upward hot gas flow to prevent the solvent from falling back onto the adhesive layer surface after cooling, which would cause defects on the adhesive layer surface, reduce uniformity, and lower the quality of subsequent exposures.

[0021] In one embodiment of the present invention, the hot air knife is also electrically connected to the temperature control component.

[0022] This invention regulates the airflow temperature of the hot air knife in real time to adapt to the solvent evaporation temperature and avoids causing the solvent to recondense after evaporation.

[0023] As a preferred embodiment of the present invention, the heating plate on which the adhesive substrate is placed includes a central temperature zone and an edge temperature zone arranged circumferentially along the central temperature zone, and the central temperature zone and the edge temperature zone are independently electrically connected to the temperature control device.

[0024] This invention independently controls the heating temperature of the central and edge regions of the heating plate, and the edge thickening effect ensures the uniformity of the adhesive layer.

[0025] As a preferred embodiment of the present invention, the side wall of the processing chamber is provided with an inlet and an outlet, and the inlet and outlet are provided with a sealing door.

[0026] In one embodiment of the present invention, a vacuum interface is provided at the top of the inner cavity of the processing chamber, and the vacuum interface is connected to the condensation pipe.

[0027] This invention draws the airflow from the top of the processing chamber, ensuring that the evaporated solvent rises and detaches from the surface of the photoresist layer, further preventing the solvent from falling back when it cools down and reducing the drying efficiency of the photoresist layer.

[0028] Secondly, the present invention provides a method for simultaneous baking and drying of photoresist. The method employs the photoresist simultaneous baking and drying apparatus system described in the first aspect. The method includes: sending a photoresist-coated substrate into a processing chamber and establishing an initial vacuum environment, and venting air from the processing chamber; using a heating module to heat the photoresist-coated substrate to a set temperature, while simultaneously extracting airflow from the processing chamber through a vacuum module to achieve a set pressure within the processing chamber, maintaining the temperature and pressure to evaporate the solvent within the photoresist-coated substrate; the evaporated solvent enters a solvent collection module through a condensation pipe along with the airflow.

[0029] As a preferred embodiment of the present invention, in the initial vacuum environment, the pressure in the processing chamber is 50~80Pa, for example, it can be 50Pa, 55Pa, 60Pa, 65Pa, 70Pa, 75Pa or 80Pa, but is not limited to the listed values, other unlisted values ​​within this range are also applicable.

[0030] As one embodiment of the present invention, the set temperature is 70~100℃, for example, it can be 70℃, 75℃, 80℃, 85℃, 90℃, 95℃ or 100℃, but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0031] The set pressure is 30~60Pa, for example, it can be 30Pa, 35Pa, 40Pa, 45Pa, 50Pa, 55Pa or 60Pa, but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0032] As one embodiment of the present invention, the heat preservation and pressure holding time is 60~120s, for example, it can be 60s, 70s, 80s, 90s, 100s, 110s or 120s, but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0033] As one embodiment of the present invention, the temperature inside the condensation pipe is -8~0℃, for example, it can be -8℃, -7℃, -6℃, -5℃, -4℃, -3℃, -2℃, -1℃ or 0℃, but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0034] As one embodiment of the present invention, after the heat preservation and pressure holding are completed, the heating of the heating module is stopped, the constant pressure is maintained, and then working gas is introduced into the processing chamber to depressurize and cool down.

[0035] As one embodiment of the present invention, the time for maintaining constant pressure is 5 to 10 seconds, for example, it can be 5 seconds, 6 seconds, 7 seconds, 8 seconds, 9 seconds or 10 seconds, but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0036] As one embodiment of the present invention, after the cooling process, once the temperature inside the processing chamber is ≤30°C, the adhesive-coated substrate is removed.

[0037] As a preferred technical solution of the present invention, the heating process includes: independently adjusting the heating power of the central temperature zone and the edge temperature zone of the heating module, so that the heating rate of the central temperature zone is greater than the heating rate of the edge temperature zone, and then performing the heat preservation and pressure maintenance after the temperatures of the central temperature zone and the edge temperature zone both reach the set temperature.

[0038] As one embodiment of the present invention, the heating rate of the central temperature zone is 5~10℃ / s, for example, it can be 5℃ / s, 6℃ / s, 7℃ / s, 8℃ / s, 9℃ / s or 10℃ / s, but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0039] As one embodiment of the present invention, the heating rate of the edge temperature zone is 3~8℃ / s, for example, it can be 3℃ / s, 4℃ / s, 5℃ / s, 6℃ / s, 7℃ / s or 8℃ / s, but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0040] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0041] This invention provides a photoresist synchronous baking and drying device system and method that achieves the coordinated processing of heating and baking of the coated substrate and vacuum drying, accelerates the evaporation of solvent in the photoresist layer, uses vacuum airflow to carry out and collect the evaporated solvent, reduces the solvent residue in the photoresist layer, greatly shortens the process flow, and improves the uniformity of the photoresist layer by real-time control of vacuum degree and temperature during the process. Attached Figure Description

[0042] Figure 1 This is a schematic diagram of the photoresist synchronous baking and drying apparatus system provided in Example 1.

[0043] Figure 2 This is a top view of the heating plate provided in Example 2.

[0044] Figure 3 This is a schematic diagram of the auxiliary baffle provided in Example 3.

[0045] The components are as follows: 1-Processing chamber; 101-Sealed door; 102-Vacuum interface; 2-Coated silicon wafer; 3-Solvent storage tank; 301-Filter assembly; 4-Condensation pipe; 5-Vacuum pumping device; 6-Pressure control device; 7-Pressure detection assembly; 8-Evacuation pipe; 9-Temperature control assembly; 10-Heating plate; 1001-Central temperature zone; 1002-Edge temperature zone; 11-Temperature measuring chip; 12-Auxiliary baffle; 13-Hot air knife. Detailed Implementation

[0046] It should be understood that in the description of this invention, the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. In the description of this invention, unless otherwise stated, "a plurality of" or "several" means two or more.

[0047] It should be noted that, in the description of this invention, unless otherwise explicitly specified and limited, the terms "set," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0048] Those skilled in the art should understand that the present invention necessarily includes the necessary pipelines, conventional valves and general pump equipment for achieving complete process, but the above content is not the main inventive point of the present invention. Those skilled in the art can add layouts based on process flow and equipment structure selection, and the present invention does not make any special requirements or specific limitations in this regard.

[0049] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0050] In one specific embodiment, the present invention provides a photoresist synchronous baking and drying apparatus system, including a processing chamber, a solvent collection module, a vacuum module, and a heating module. The processing chamber is used to contain the photoresist-coated substrate to be processed. One end of the solvent collection module is connected to the processing chamber via a condensation pipe, and the other end is connected to the vacuum module via a vacuum pipe, thereby connecting the vacuum module to the processing chamber to ensure that the processing chamber is under vacuum. The heating module includes an electrically connected temperature control device and a heating device, the heating device being located inside the processing chamber, and the temperature control device being used to adjust the heating power of the heating device in real time.

[0051] The processing chamber is a sealed cavity with inlets and outlets on its side walls, allowing the adhesive-coated substrate to enter and exit. Sealed doors are installed at the inlets and outlets. After the adhesive-coated substrate to be processed is fed in through the sealed doors, the sealed doors are closed. After baking and drying are completed, the sealed doors are opened, and the adhesive-coated substrate is then removed.

[0052] The processing chamber is equipped with a vacuum interface at the top of its inner cavity for connecting an external vacuum module. The vacuum module draws airflow from the processing chamber, causing the airflow to rise and exit from the top of the processing chamber.

[0053] The vacuum module includes a vacuum pumping device, a pressure control device, and several pressure detection components. The vacuum pumping device is connected to the solvent collection module via the air extraction pipe and is also connected to the processing chamber. The solvent collection module is connected in series between the vacuum pumping device and the processing chamber. The vacuum pumping device extracts airflow from the processing chamber, maintaining a vacuum state within it. The evaporated solvent is carried out of the processing chamber by the airflow and falls into the solvent collection module. Several pressure detection components are evenly distributed on the inner wall of the processing chamber for online monitoring of pressure data. The pressure control device is electrically connected to both the vacuum pumping device and the pressure detection components, adjusting the operating power of the vacuum pumping device based on the pressure data. Specifically, the vacuum pumping device is equipped with a regulating valve, and the pressure control device is electrically connected to the regulating valve to control its opening and closing, thereby adjusting the start / stop and operating power of the vacuum pumping device to achieve real-time pressure regulation within the processing chamber.

[0054] It should be noted that the inner cavity wall in this invention includes an inner cavity top, an inner cavity sidewall, and an inner cavity bottom. The inner cavity top and the inner cavity bottom are disposed opposite to each other, and the inner cavity sidewall is located between the inner cavity top and the inner cavity bottom, and connects the inner cavity top and the inner cavity bottom respectively.

[0055] The solvent collection module also includes a solvent storage tank connected to the condensation pipe. The evaporated solvent is carried out from the top of the processing chamber and enters the condensation pipe. The solvent condenses in the airflow and turns into liquid. As the vacuum device continuously extracts the airflow in the processing chamber, the liquid solvent falls into the solvent storage tank through the condensation pipe to complete the collection.

[0056] Furthermore, the solvent storage tank is equipped with a filter assembly inside to filter impurities in the solvent liquid and obtain clean solvent.

[0057] The heating device of the heating module includes several heating plates, which are evenly distributed on the inner sidewall and bottom of the processing chamber. The heating plate located at the bottom of the inner chamber is used to place and heat the photoresist substrate, accelerate the evaporation of solvent, and fully remove the solvent in the photoresist layer. The heating plate located on the inner sidewall ensures that the temperature in the processing chamber is within a preset range, and prevents the solvent that has detached from the surface of the photoresist layer from cooling back down, thereby reducing the uniformity of the photoresist layer.

[0058] The temperature control device includes a temperature sensing chip and a temperature adjustment component that are electrically connected. The temperature sensing chip is disposed inside the heating plate and is used to detect the temperature of the adhesive-coated substrate. The temperature adjustment component is electrically connected to the heating plate and is used to adjust the heating power of the heating plate according to the feedback from the temperature sensing chip.

[0059] In some embodiments, the heating device further includes two auxiliary baffles, which are positioned opposite each other above the heating plate located at the bottom of the inner cavity, causing the evaporated solvent to rise along a predetermined path.

[0060] The auxiliary baffle is equipped with several hot air knives to generate airflow in a preset direction. This airflow carries away the solvent that has detached from the photoresist layer and merges with the airflow drawn by the vacuum device before exiting the processing chamber. Residual solvent can alter the refractive index of the photoresist and lower its glass transition temperature, affecting the chemical contrast of the photoresist during exposure and development, leading to defects in subsequent processes. This invention, by adding an auxiliary baffle and hot air knives, ensures that the hot air knives generate airflow along the vertical upward direction of the evaporating solvent. This guarantees that all solvent rises along a predetermined path, completely detaching from the photoresist layer and preventing it from falling back onto the surface to form defects or bubbles, thus affecting the uniformity of the photoresist layer.

[0061] Furthermore, the hot air knife is electrically connected to the temperature control component to regulate the temperature of the airflow generated by the hot air knife in real time.

[0062] In some embodiments, the heating plate on which the photoresist-coated substrate is placed includes a central temperature zone and an edge temperature zone circumferentially disposed along the central temperature zone, the central temperature zone and the edge temperature zone being independently electrically connected to the temperature control device. Because the edge region of the photoresist-coated substrate has a larger surface area for easy evaporation compared to the central region, the solvent evaporation rate in this region is greater than that in the central region, easily leading to unevenness of the photoresist layer surface and increased viscosity at the edges. This invention, by independently controlling the heating temperature of different regions, can ensure that the solvent evaporation rate on the photoresist layer surface is relatively uniform, thus improving the uniformity of the photoresist layer.

[0063] In another specific embodiment, the present invention provides a method for simultaneous baking and drying of photoresist, employing a photoresist simultaneous baking and drying apparatus system as described in a specific embodiment. The method for simultaneous baking and drying of photoresist includes the following steps:

[0064] Step 1: Send the coated substrate into the processing chamber and establish an initial vacuum environment, then purge the air from the processing chamber.

[0065] In this invention, after the adhesive-coated substrate is sent into the processing chamber through a sealed door, the pressure inside the processing chamber is reduced to 50-80 Pa using a vacuum module to expel air and prevent it from interfering with solvent evaporation.

[0066] Step 2: Use the heating module to heat the substrate to the set temperature, and at the same time use the vacuum module to extract the airflow in the processing chamber to make the pressure in the processing chamber reach the set pressure. Maintain the temperature and pressure to fully evaporate the solvent in the substrate.

[0067] This invention uses a temperature control device to activate a heating plate to heat the adhesive substrate. The set temperature is 70~100℃, and the pressure in the processing chamber is maintained at a set pressure of 30~60Pa. The heat and pressure holding time is 60~120s, which allows the solvent to evaporate more quickly under vacuum and heating.

[0068] Simultaneously, the evaporated solvent is liquefied by the airflow through a condensation pipe with a temperature of -8~0℃ and then enters the solvent storage tank of the solvent collection module.

[0069] In some embodiments, the heating process includes: independently adjusting the heating power of the central temperature zone and the edge temperature zone of the heating module, such that the heating rate of the central temperature zone is greater than the heating rate of the edge temperature zone; and then, after both the central temperature zone and the edge temperature zone reach the set temperature, performing the heat preservation and pressure holding. The heating rate of the central temperature zone is 5~10℃ / s, and the heating rate of the edge temperature zone is 3~8℃ / s.

[0070] Step 3: After the heat preservation and pressure holding are completed, stop the heating of the heating module, and continue to work the vacuum device to maintain constant pressure for 5~10 seconds to further remove residual solvent.

[0071] Step 4: Then, introduce working gas into the processing chamber to depressurize the processing chamber to atmospheric pressure. At the same time, allow it to cool naturally until the temperature inside the processing chamber is ≤30℃. Then, open the sealed door and take out the coated substrate to proceed to the subsequent exposure process.

[0072] Example 1

[0073] This embodiment provides a photoresist synchronous baking and drying apparatus system, including a processing chamber 1, a solvent collection module, a vacuum module, and a heating module. Figure 1 As shown, the processing chamber 1 is a sealed cavity used to contain the adhesive-coated substrate to be processed. Its side walls have inlets and outlets, each equipped with a sealing door 101 to facilitate the insertion and removal of the adhesive-coated substrate. A vacuum interface 102 is also provided at the top of the inner cavity of the processing chamber 1. The solvent collection module includes a solvent storage tank 3. The inlet end of the solvent storage tank 3 is connected to the vacuum interface 102 of the processing chamber 1 via a condensation pipe 4, and its outlet end is connected to the vacuum module via an extraction pipe 8, thus connecting the processing chamber 1 and the vacuum module. A filter assembly 301 is installed inside the solvent storage tank 3. The vacuum module includes a vacuum pumping device 5, a pressure control device 6, and multiple pressure detection components 7. The vacuum pumping device 5 is equipped with a regulating valve and is connected to the extraction pipe 8 to connect to the processing chamber 1, used to extract airflow from the processing chamber 1. Multiple pressure detection components 7 are evenly distributed on the inner wall of the processing chamber 1 for online monitoring of pressure data within the processing chamber 1. The pressure control device 6 is electrically connected to the regulating valve of the vacuum device 5 and the pressure detection component 7, respectively, and is used to adjust the start-up, shutdown, and operating power of the vacuum device 5 according to the pressure data. The heating module includes a temperature control device and multiple heating plates 10. The multiple heating plates 10 are evenly distributed on the inner sidewall and bottom of the processing chamber 1. The temperature control device includes an electrically connected temperature sensing chip 11 and a temperature adjustment component 9. The temperature sensing chip 11 is located inside the heating plate 10 where the adhesive substrate is placed, and is used to detect the temperature of the adhesive substrate. The temperature adjustment component 9 is located outside the processing chamber 1 and is independently electrically connected to the multiple heating plates 10, and is used to adjust the heating power of the heating plates 10 according to the feedback from the temperature sensing chip 11.

[0074] Example 2

[0075] This embodiment provides a photoresist synchronous baking and drying apparatus system, which differs from Embodiment 1 in that: Figure 2As shown, the heating plate 10, which is located at the bottom of the inner cavity of the processing chamber 1 and has a coated substrate, includes a central temperature zone 1001 and an edge temperature zone 1002 arranged circumferentially along the central temperature zone 1001. The central temperature zone 1001 and the edge temperature zone 1002 are independently electrically connected to a temperature control device so as to adjust the heating temperature of the central temperature zone 1001 and the edge temperature zone 1002 respectively. The rest of the structure is the same as in Embodiment 1.

[0076] Example 3

[0077] This embodiment provides a photoresist synchronous baking and drying apparatus system, which differs from Embodiment 1 in that: Figure 3 As shown, the heating module also includes two auxiliary baffles 12, which are arranged opposite to each other above the heating plate 10 on which the adhesive substrate is placed. Multiple hot air blades 13 are distributed on the auxiliary baffles 12 to generate airflow in a preset direction. The hot air blades 13 are also electrically connected to the temperature control component 9 to control the temperature of the airflow generated by the hot air blades 13 in real time. The rest of the structure is exactly the same as in Embodiment 1.

[0078] Example 4

[0079] This embodiment provides a photoresist synchronous baking and drying apparatus system, which differs from Embodiment 3 in that: the heating plate 10, which is located at the bottom of the inner cavity of the processing chamber 1 and on which the photoresist substrate is placed, includes a central temperature zone 1001 and an edge temperature zone 1002 arranged circumferentially along the central temperature zone 1001. The central temperature zone 1001 and the edge temperature zone 1002 are independently electrically connected to a temperature control device so as to adjust the heating temperature of the central temperature zone 1001 and the edge temperature zone 1002 respectively. The rest of the structure is the same as that of Embodiment 3.

[0080] Application Example 1

[0081] This application example uses the photoresist synchronous baking and drying apparatus system provided in Example 1 to dry a silicon wafer coated with positive photoresist to remove the solvent—propylene glycol methyl ether acetate—from the photoresist layer. Specifically, the process includes the following steps:

[0082] (1) The coated silicon wafer 2 is sent into the processing chamber 1, and the air in the processing chamber 1 is extracted by the vacuum pumping device 5 until the pressure in the processing chamber 1 reaches 60Pa, thus completing the establishment of the initial vacuum environment and expelling the air in the processing chamber 1.

[0083] (2) Start heating plate 10 to heat up the coated silicon wafer 2 to 85°C. At the same time, the vacuum device 5 continuously extracts the airflow in the processing chamber 1 to make the pressure in the processing chamber 1 reach 50Pa. Maintain the temperature and pressure for 100s to fully evaporate the solvent in the coated silicon wafer 2. The evaporated solvent is liquefied by the airflow through the condensation pipe 4 at a temperature of -3°C and enters the solvent storage tank 3. It is then filtered by the filter assembly 301 to obtain clean solvent.

[0084] (3) After the heat preservation and pressure preservation are completed, the heating of the heating plate 10 is stopped, and the vacuum device 5 continues to work to maintain constant pressure for 8 seconds to further remove residual solvent.

[0085] (4) Nitrogen gas is then introduced into the processing chamber 1 to depressurize the processing chamber 1 to normal pressure and allow it to cool naturally until the temperature inside the processing chamber 1 is ≤30℃. Then, the sealing door 101 is opened to remove the coated silicon wafer 2 and proceed to the subsequent exposure process.

[0086] Application Example 2

[0087] This application example uses the photoresist synchronous baking and drying apparatus system provided in Example 2 to dry a silicon wafer coated with positive photoresist in order to remove the solvent in the photoresist layer. Specifically, it includes the following steps:

[0088] (1) The coated silicon wafer 2 is sent into the processing chamber 1, and the air in the processing chamber 1 is extracted by the vacuum pumping device 5 until the pressure in the processing chamber 1 reaches 80Pa, thus completing the establishment of the initial vacuum environment and expelling the air in the processing chamber 1.

[0089] (2) Start the heating of the heating plate 10 and independently adjust the heating power of the center temperature zone 1001 and the edge temperature zone 1002 of the heating plate 10 on which the coated silicon wafer 2 is placed, so as to ensure that the heating rate of the center temperature zone 1001 is 10℃ / s and the heating rate of the edge temperature zone 1002 is 8℃ / s, so as to heat up the coated silicon wafer 2 and make the temperature of the center temperature zone 1001 and the edge temperature zone 1002 reach 75℃. At the same time, the airflow in the processing chamber 1 is continuously extracted by the vacuum device 5 to make the pressure in the processing chamber 1 reach 60Pa. The temperature and pressure are maintained for 60s to fully evaporate the solvent in the coated silicon wafer 2. At the same time, the evaporated solvent is liquefied by the airflow through the condensation pipe 4 at a temperature of -5℃ and enters the solvent storage tank 3, and is filtered by the filter component 301 to obtain clean solvent.

[0090] (3) After the heat preservation and pressure preservation are completed, the heating of the heating plate 10 is stopped, and the vacuum device 5 continues to work to maintain constant pressure for 5 seconds to further remove residual solvent.

[0091] (4) Nitrogen gas is then introduced into the processing chamber 1 to depressurize the processing chamber 1 to normal pressure. At the same time, the temperature inside the processing chamber 1 is naturally cooled to ≤30℃. Then, the sealing door 101 is opened to take out the coated substrate and proceed to the subsequent exposure process.

[0092] Application Example 3

[0093] This application example uses the photoresist synchronous baking and drying apparatus system provided in Example 3 to dry a silicon wafer coated with positive photoresist in order to remove the solvent in the photoresist layer. Specifically, it includes the following steps:

[0094] (1) The coated silicon wafer 2 is sent into the processing chamber 1, and the air in the processing chamber 1 is extracted by the vacuum pumping device 5 until the pressure in the processing chamber 1 reaches 70Pa, thus completing the establishment of the initial vacuum environment and expelling the air in the processing chamber 1.

[0095] (2) The heating plate 10 is used to heat the coated silicon wafer 2 to 70°C, and the hot air knife 13 on the auxiliary baffle 12 is turned on to provide a vertical upward hot air flow of 70°C. At the same time, the air flow in the processing chamber 1 is continuously extracted by the vacuum device 5 to make the pressure in the processing chamber 1 reach 50Pa. The temperature and pressure are maintained for 80s to fully evaporate the solvent in the coated silicon wafer 2. At the same time, the evaporated solvent is liquefied by the air flow through the condenser pipe 4 at 0°C and enters the solvent storage tank 3. It is then filtered by the filter assembly 301 to obtain clean solvent.

[0096] (3) After the heat preservation and pressure preservation are completed, the heating of the heating plate 10 is stopped, and the vacuum device 5 continues to work to maintain constant pressure for 10 seconds to further remove residual solvent.

[0097] (4) Nitrogen gas is then introduced into the processing chamber 1 to depressurize the processing chamber 1 to normal pressure. At the same time, the temperature inside the processing chamber 1 is naturally cooled to ≤30℃. Then, the sealing door 101 is opened to take out the coated silicon wafer 2 and proceed to the subsequent exposure process.

[0098] Application Example 4

[0099] This application example uses the photoresist synchronous baking and drying apparatus system provided in Example 4 to dry a silicon wafer coated with positive photoresist in order to remove the solvent in the photoresist layer. Specifically, it includes the following steps:

[0100] (1) The coated silicon wafer 2 is sent into the processing chamber 1, and the air in the processing chamber 1 is extracted by the vacuum pumping device 5 until the pressure in the processing chamber 1 reaches 80Pa, thus completing the establishment of the initial vacuum environment and expelling the air in the processing chamber 1.

[0101] (2) Start heating the heating plate 10 and independently adjust the heating power of the center temperature zone 1001 and the edge temperature zone 1002 of the heating plate 10 on which the coated silicon wafer 2 is placed, to ensure that the heating rate of the center temperature zone 1001 is 8℃ / s and the heating rate of the edge temperature zone 1002 is 5℃ / s, to heat up the coated substrate, so that the temperature of the center temperature zone 1001 and the edge temperature zone 1002 both reach 90℃, and turn on the hot air knife 13 on the auxiliary baffle 12 to provide a vertical upward hot airflow of 90℃. At the same time, the airflow in the processing chamber 1 is continuously extracted by the vacuum device 5 to make the pressure in the processing chamber 1 reach 30Pa, and keep it at the temperature and pressure for 70s to fully evaporate the solvent in the coated substrate. At the same time, the evaporated solvent is liquefied by the airflow through the condensation pipe 4 at a temperature of -4℃ and enters the solvent storage tank 3, and is filtered by the filter assembly 301 to obtain clean solvent.

[0102] (3) After the heat preservation and pressure preservation are completed, the heating of the heating plate 10 is stopped, and the vacuum device 5 continues to work to maintain constant pressure for 6 seconds to further remove residual solvent.

[0103] (4) Nitrogen gas is then introduced into the processing chamber 1 to depressurize the processing chamber 1 to normal pressure. At the same time, the temperature inside the processing chamber 1 is naturally cooled to ≤30℃. Then, the sealing door 101 is opened to take out the coated substrate and proceed to the subsequent exposure process.

[0104] The applicant declares that the above description is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Those skilled in the art should understand that any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention fall within the protection and disclosure scope of the present invention.

Claims

1. A photoresist synchronous baking and drying apparatus system, characterized in that, The photoresist synchronous baking and drying device system includes a processing chamber, a solvent collection module, a vacuum module, and a heating module. The processing chamber is used to accommodate the photoresist-coated substrate. One end of the solvent collection module is connected to the processing chamber through a condensation pipe, and the other end is connected to the vacuum module through an air extraction pipe, so that the vacuum module is connected to the processing chamber. The heating module includes an electrically connected temperature control device and a heating device, and the heating device is located inside the processing chamber.

2. The photoresist synchronous baking and drying apparatus system according to claim 1, characterized in that, The vacuum module includes a vacuum pumping device, a pressure control device, and several pressure detection components; The vacuum pumping device is connected to the solvent collection module via the vacuum pipe and is also connected to the processing chamber; Several pressure detection components are evenly distributed on the inner wall of the processing chamber; The pressure control device is electrically connected to the vacuum pumping device and the pressure detection component respectively; Preferably, the vacuuming device is equipped with a regulating valve, and the pressure control device is electrically connected to the regulating valve.

3. The photoresist synchronous baking and drying apparatus system according to claim 1 or 2, characterized in that, The solvent collection module also includes a solvent storage tank connected to the condensation pipe; Preferably, the solvent storage tank is equipped with a filter assembly inside.

4. The photoresist synchronous baking and drying apparatus system according to any one of claims 1-3, characterized in that, The heating device includes several heating plates, which are evenly distributed on the inner sidewall and bottom of the processing chamber. The heating plate located at the bottom of the inner chamber is used to place the adhesive substrate. The temperature control device includes a temperature sensing chip and a temperature adjustment component that are electrically connected. The temperature sensing chip is disposed inside the heating plate and is used to detect the temperature of the adhesive substrate. The temperature adjustment component is electrically connected to the heating plate and is used to adjust the heating power of the heating plate.

5. The photoresist synchronous baking and drying apparatus system according to claim 4, characterized in that, The heating device also includes two auxiliary baffles, which are arranged opposite each other above the heating plate located at the bottom of the inner cavity. Several hot air knives are distributed on the auxiliary baffles to generate airflow in a preset direction. Preferably, the hot air knife is also electrically connected to the temperature control component.

6. The photoresist synchronous baking and drying apparatus system according to claim 4 or 5, characterized in that, The heating plate on which the adhesive-coated substrate is placed includes a central temperature zone and an edge temperature zone arranged circumferentially along the central temperature zone, and the central temperature zone and the edge temperature zone are independently electrically connected to the temperature control device.

7. The photoresist synchronous baking and drying apparatus system according to any one of claims 1-6, characterized in that, The processing chamber has an inlet and outlet on its side wall, and the inlet and outlet are equipped with sealed doors; Preferably, a vacuum interface is provided at the top of the inner cavity of the processing chamber, and the vacuum interface is connected to the condensation pipe.

8. A method for simultaneous baking and drying of photoresist, characterized in that, The photoresist synchronous baking and drying method described herein employs the photoresist synchronous baking and drying apparatus system according to any one of claims 1-7, and the photoresist synchronous baking and drying method includes: The adhesive-coated substrate is sent into the processing chamber, and an initial vacuum environment is established to remove the air from the processing chamber. The heating module is used to heat the coating substrate to a set temperature, while the vacuum module extracts the airflow in the processing chamber to make the pressure in the processing chamber reach the set pressure. The temperature and pressure are maintained to evaporate the solvent in the coating substrate. The evaporated solvent is carried by the airflow through the condensation pipe into the solvent collection module.

9. The method for simultaneous baking and drying of photoresist according to claim 8, characterized in that, In the initial vacuum environment, the pressure inside the processing chamber is 50~80 Pa; Preferably, the set temperature is 70~100℃ and the set pressure is 30~60Pa; Preferably, the heat preservation and pressure holding time is 60~120s; Preferably, the temperature inside the condensation pipe is -8~0℃; Preferably, after the heat preservation and pressure holding are completed, the heating of the heating module is stopped, the constant pressure is maintained, and then working gas is introduced into the processing chamber to depressurize and cool down; Preferably, the time for maintaining constant pressure is 5-10 seconds; Preferably, after the cooling process, once the temperature inside the processing chamber is ≤30°C, the coated substrate is removed.

10. The method for simultaneous baking and drying of photoresist according to claim 8 or 9, characterized in that, The heating process includes: independently adjusting the heating power of the central temperature zone and the edge temperature zone of the heating module, so that the heating rate of the central temperature zone is greater than the heating rate of the edge temperature zone, and then performing the heat preservation and pressure maintenance after the temperatures of the central temperature zone and the edge temperature zone both reach the set temperature. Preferably, the heating rate of the central temperature zone is 5~10℃ / s; Preferably, the heating rate of the edge temperature zone is 3~8℃ / s.

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