GIS heat tracing module arrangement optimization method and device based on finite element simulation
By optimizing the layout of the GIS heat tracing module through finite element simulation, the problems of heating power redundancy and cold spot hazards in the existing design were solved, and the stable operation of GIS equipment and energy saving were achieved in extreme environments.
Patent Information
- Application Number
- CN202511839377.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-08
- Publication Date
- 2026-02-10
AI Technical Summary
Existing GIS heat tracing module designs suffer from redundant heating power, potential localized cold spots, and a lack of iterative optimization mechanisms, leading to increased energy consumption and unstable equipment operation.
A finite element simulation-based method was used to construct a three-dimensional geometric model of the GIS structure, set the physical field, establish a temperature field simulation model, and determine the number, location, and power of the heat tracing modules through multiple iterations to achieve optimal arrangement.
This effectively avoids redundant heating power, prevents cold spots from forming, improves the stability and energy efficiency of the equipment in extreme environments, and shortens the on-site commissioning time.
Smart Images
Figure CN121503160A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of GIS technology, specifically a method and apparatus for optimizing the layout of GIS heat tracing modules based on finite element simulation. Background Technology
[0002] Gas-insulated switchgear (GIS) consists of circuit breakers, disconnectors, grounding switches, current transformers, voltage transformers, surge arresters, busbars, connectors, and outgoing terminals. Due to its excellent insulation and arc-extinguishing performance, it has become a key piece of equipment in high-voltage power transmission and transformation systems. SF6 gas is the primary insulating medium in GIS, possessing high dielectric strength and thermal stability. However, in extremely cold or high-altitude environments, the thermal properties of SF6, such as thermal conductivity, specific heat capacity, and density, significantly decrease. When the ambient temperature drops below -27°C, SF6 partially liquefies, leading to a decline in insulation performance and even partial discharge and breakdown faults. To ensure the safe operation of GIS under extreme low-temperature conditions, engineering practices typically involve installing electric heating modules on the outside of the GIS metal casing, along with an insulation layer. This converts electrical energy into heat energy, conducting it inward along the metal casing to increase the temperature of the circuit breaker cavity. However, current heat tracing module designs mainly rely on experience or experimental methods for power selection and module layout, resulting in the following problems:
[0003] (1) Heating power redundancy: In order to ensure safety margin, the design often reserves too high a power margin on the empirical basis, resulting in excessive heat tracing power configuration and a significant increase in energy consumption.
[0004] (2) Potential for local cold spots: Empirical layout methods are difficult to accurately predict the temperature distribution under complex geometric structures and multi-physical field coupling. Uneven temperature may occur in some areas of GIS, forming hidden cold spots.
[0005] (3) Lack of iterative optimization mechanism: Most existing solutions are based on single tests or simulations and have not formed a complete iterative evaluation process for multiple working conditions and multiple solutions, making it difficult to optimize the number, location and power of heat tracing modules at the same time.
[0006] The above-mentioned design process for heat tracing modules, which relies on experience or experimental methods, lacks a comprehensive analysis of the heating control mechanism for low-temperature operation of gas-insulated switchgear (GIS), and cannot achieve refined optimization of the heat tracing module layout under multiple environmental conditions. Summary of the Invention
[0007] This invention provides a method and apparatus for optimizing the layout of GIS heat tracing modules based on finite element simulation, which overcomes the shortcomings of the prior art. It can effectively solve the problem that the existing empirical GIS heat tracing module layout optimization methods cannot perform stable temperature field simulation of GIS heat tracing module parameters in advance, resulting in repeated physical test installations on the construction site, which is time-consuming and labor-intensive.
[0008] One of the technical solutions of this invention is achieved through the following measures: a GIS heat tracing module layout optimization method based on finite element simulation, comprising:
[0009] A three-dimensional geometric model of the GIS structure is constructed and a physical field is set. The three-dimensional geometric model includes a metal shell, an SF6 cavity, and an externally attached heat tracing module.
[0010] Based on the three-dimensional geometric model and physical field setting of the GIS structure, a GIS temperature field simulation model is constructed between the metal shell, SF6 cavity and heat tracing module;
[0011] Set up a parameter scheme for the heat tracing module, and determine a parameter scheme for the heat tracing module that meets the parameter evaluation criteria based on the GIS temperature field simulation model;
[0012] Determine whether the heating area and heating power corresponding to the heat tracing module parameter scheme are optimal. If not, return to adjust the heat tracing module parameter scheme.
[0013] The following are further optimizations and / or improvements to the above-mentioned technical solution:
[0014] The above-mentioned GIS temperature field simulation model includes:
[0015] The electric field solving module calculates Joule thermal power.
[0016] Q = Q0
[0017]
[0018] Where Q is the Joule heat; P is the Joule thermal power; Q0 is the initial Joule heat; P0 is the initial Joule thermal power; and V is the conductor volume.
[0019] Convection heat flux solution module:
[0020]
[0021] q0=h(T ext -T)
[0022] -n·q=q0
[0023] Where h is the heat transfer coefficient; K is the thermal conductivity; H is the shell height; Ra His the Rayleigh number; Pr is the Planck number; D is the shell diameter; Text is the outside air temperature; T is the shell temperature; n is the unit normal vector of the boundary; q0 is the convective heat flux; q is the convective heat flux vector;
[0024] The temperature distribution solution module uses the steady-state heat conduction control equation to simulate the steady-state temperature field and obtain the steady-state temperature distribution of each region in the shell, the heat tracing module and the SF6 cavity.
[0025]
[0026] Where ρ is the material density; C ρ denoted as _t_, where _t_ is the specific heat capacity of the material; _u_ is the fluid velocity vector; _T_ is the shell temperature; _q_ is the convective heat flux vector; _Q_ is the Joule heat; _Q0_ is the initial Joule heat; _K_ is the thermal conductivity.
[0027] The temperature simulation solution module extracts the minimum temperature and temperature difference index of the SF6 cavity from the steady-state temperature field simulation results.
[0028] T min =min (x，y，z)∈Ω T(x, y, z)
[0029] ΔT = max(T) - min(T)
[0030] Among them, T min ΔT is the lowest temperature of the SF6 cavity, which must be greater than -27℃; ΔT is the temperature difference index of the SF6 cavity; Ω is the three-dimensional spatial region of the SF6 cavity; T(x,y,z) is the temperature of each region in the three-dimensional spatial region of the SF6 cavity; max(T) is the highest temperature of the SF6 cavity; min(T) is the lowest temperature of the SF6 cavity.
[0031] The above-mentioned parameter setting scheme for the heat tracing module, based on the GIS temperature field simulation model, outputs parameter schemes for the heat tracing module that meet the parameter evaluation standards, including:
[0032] The parameters for setting up the heat tracing module include the number of heat tracing modules, the heating area of each module, the power density, and the installation location.
[0033] Substitute the parameters of the heat tracing module into the GIS temperature field simulation model to perform steady-state temperature field simulation and obtain the corresponding steady-state temperature field simulation results.
[0034] The simulation results of each steady-state temperature field are compared with the parameter evaluation criteria. If the criteria are met, the parameter scheme of the heat tracing module that meets the criteria is output. If the criteria are not met, the parameter scheme of the heat tracing module is adjusted.
[0035] The above parameter evaluation criteria include:
[0036] The lowest temperature T of the SF6 cavity min Greater than -27℃;
[0037] The temperature difference index ΔT of the SF6 cavity is less than 200℃, and the temperature distribution map shows that the temperature decreases from the middle to the top and bottom.
[0038] The above determination determines whether the heating area and heating power corresponding to the heat tracing module parameter scheme are optimal. If not, the heat tracing module parameter scheme is adjusted, including:
[0039] Determine whether the parameter scheme of the heat tracing module meets the optimization constraints;
[0040] qi max
[0041] A i >A min
[0042] If no response is received, adjust the parameters of the heat tracing module accordingly;
[0043] Therefore, the total heating area and total heating power corresponding to the parameter scheme of the heat tracing module are determined;
[0044]
[0045] Where, q i Let A be the power density of the i-th heat tracing module; i Let q be the heating area of the i-th heat tracing module; max This represents the maximum power density of the heat tracing module; A min P represents the minimum heating area of the heat tracing module; i represents the number of heat tracing modules; P 总 Total heating power; A 总 This represents the total heating area.
[0046] The above-mentioned construction of a three-dimensional geometric model of the GIS structure and the setting of the physical field include:
[0047] A three-dimensional geometric model of the GIS structure is established, which includes a metal shell, an SF6 cavity, and an externally attached heat tracing module.
[0048] The global domain of the 3D geometric model is divided using unstructured tetrahedral meshes;
[0049] Set the material and physical parameters of the 3D geometric model;
[0050] Establish the physical field for heat transfer in solids.
[0051] The second technical solution of the present invention is achieved through the following measures: a GIS heat tracing module layout optimization device based on finite element simulation, comprising:
[0052] The initial setup unit constructs a three-dimensional geometric model of the GIS structure and sets the physical field. The three-dimensional geometric model includes a metal shell, an SF6 cavity, and an externally attached heat tracing module.
[0053] The simulation model building unit constructs a GIS temperature field simulation model between the metal shell, SF6 cavity and heat tracing module based on the three-dimensional geometric model and physical field settings of the GIS structure.
[0054] The first optimization unit sets up the parameter scheme for the heat tracing module and determines the parameter scheme for the heat tracing module that meets the parameter evaluation criteria based on the GIS temperature field simulation model.
[0055] The second optimization unit determines whether the heating area and heating power corresponding to the heat tracing module parameter scheme have achieved the optimal result. If not, it returns to adjust the heat tracing module parameter scheme.
[0056] The following are further optimizations and / or improvements to the above-mentioned technical solution:
[0057] The aforementioned first optimization unit includes:
[0058] The solution preset module sets the parameters of the heat tracing module, which includes the number of heat tracing modules, the heating area of each module, the power density, and the installation location.
[0059] The temperature simulation module substitutes the parameters of the heat tracing module into the GIS temperature field simulation model to perform steady-state temperature field simulation and obtain the corresponding steady-state temperature field simulation results.
[0060] The scheme optimization module compares the simulation results of each steady-state temperature field with the parameter evaluation criteria. If the criteria are met, the module outputs a heat tracing module parameter scheme that meets the criteria; otherwise, the module adjusts the heat tracing module parameter scheme.
[0061] The aforementioned second optimization unit includes:
[0062] The constraint comparison module determines whether the parameter scheme of the heat tracing module meets the optimization constraints.
[0063] qi max
[0064] A i >A min
[0065] If the scheme adjustment module does not respond, the parameters of the heat tracing module will be adjusted accordingly.
[0066] Optimize the output module, and then determine the total heating area and total heating power corresponding to the parameter scheme of the heat tracing module;
[0067]
[0068] Where, q i Let A be the power density of the i-th heat tracing module; i Let q be the heating area of the i-th heat tracing module; max This represents the maximum power density of the heat tracing module; A min P represents the minimum heating area of the heat tracing module; i represents the number of heat tracing modules; P 总 Total heating power; A 总 This represents the total heating area.
[0069] This invention constructs a three-dimensional geometric model of the GIS structure and sets the physical field, then establishes a GIS temperature field simulation model. Based on the GIS temperature field simulation model, through multiple iterations of optimization, it accurately evaluates and optimizes parameters such as the number, location, heating power, and heating area of the heat tracing modules, thus completing the optimized layout of the GIS heat tracing modules. Its beneficial effects include:
[0070] (1) This invention establishes a GIS temperature field simulation model, which can perform steady-state temperature field simulation for any heat tracing module parameter scheme, determine the temperature distribution inside the GIS in advance after the heat tracing module is installed, provide data support for adjusting the heat tracing module parameter scheme, and avoid the problem of dangerous cold spots after the heat tracing module is installed. This effectively prevents failures caused by SF6 liquefaction, and enables the equipment to maintain stable operation in extremely cold environments.
[0071] (2) The present invention allows for flexible adjustment of the parameters of the heat tracing module in advance according to different working conditions, eliminating the need for repeated physical testing and installation at the construction site, greatly shortening the commissioning time and improving the flexibility and safety of on-site implementation.
[0072] (3) This invention optimizes the parameters of the heat tracing module through simulation, thereby minimizing heating power consumption while meeting the minimum temperature requirements. Compared with existing empirical GIS heat tracing module layout optimization methods, this invention avoids the problem of excessive power margin reserved on empirical benchmarks, which leads to over-configuration of heat tracing power and a significant increase in energy consumption; and effectively reduces operating costs. Attached Figure Description
[0073] Appendix Figure 1 This is a schematic diagram of the GIS heat tracing module layout optimization method based on finite element simulation provided in an embodiment of the present invention.
[0074] Appendix Figure 2 This is a schematic diagram illustrating the method for constructing a three-dimensional geometric model of a GIS structure and setting a physical field, as provided in an embodiment of the present invention.
[0075] Appendix Figure 3This is a schematic diagram of a three-dimensional geometric model of a GIS structure provided in an embodiment of the present invention.
[0076] Appendix Figure 4 This is a schematic diagram of the GIS temperature field simulation model provided in an embodiment of the present invention.
[0077] Appendix Figure 5 This is a schematic diagram of the parameter output method for the heat tracing module provided in an embodiment of the present invention.
[0078] Appendix Figure 6 This is a schematic diagram of the GIS heat tracing module layout optimization device based on finite element simulation provided in an embodiment of the present invention.
[0079] The codes in the attached diagram are as follows: 1 represents the metal casing, 2 represents the SF6 cavity, and 3 represents the heat tracing module. Detailed Implementation
[0080] The present invention is not limited to the following embodiments, and the specific implementation can be determined according to the technical solution of the present invention and the actual situation.
[0081] Those skilled in the art will understand that, unless otherwise stated, in the embodiments of this application, "module" or "unit" refers to a computer program or part of a computer program with a predetermined function, which works together with other related parts to achieve a predetermined goal, and can be implemented, wholly or partially, using software, hardware (such as processing circuitry or memory), or a combination thereof. Similarly, a processor (or multiple processors or memory) can be used to implement one or more modules or units. Furthermore, each module or unit can be part of an overall module or unit that includes the functionality of that module or unit.
[0082] In addition, in the embodiments of this application, "multiple" refers to two or more, and "first" and "second" are used to distinguish descriptions and should not be construed as implying relative importance.
[0083] Based on this, the technical solution of this application will be described and explained below with reference to several examples.
[0084] Example 1: As shown in the attached document Figure 1 As shown in the figure, this invention discloses a method for optimizing the layout of GIS heat tracing modules based on finite element simulation, including:
[0085] Step S110: Construct a three-dimensional geometric model of the GIS structure and set the physical field. The three-dimensional geometric model includes a metal shell 1, an SF6 cavity and an externally attached heat tracing module 3.
[0086] Step S120: Based on the three-dimensional geometric model and physical field settings of the GIS structure, construct a GIS temperature field simulation model between the metal shell 1, the SF6 cavity 2 and the heat tracing module 3.
[0087] Step S130: Set the parameter scheme for the heat tracing module and determine the parameter scheme for the heat tracing module that meets the parameter evaluation criteria based on the GIS temperature field simulation model;
[0088] Step S140: Determine whether the heating area and heating power corresponding to the heat tracing module parameter scheme are optimal. If not, return to step S130 to adjust the heat tracing module parameter scheme.
[0089] This invention discloses a method for optimizing the layout of GIS heat tracing modules based on finite element simulation. A three-dimensional geometric model of the GIS structure is constructed and a physical field is defined. Then, a GIS temperature field simulation model is established. Based on this simulation model, the number, location, heating power, and heating area of the heat tracing modules are accurately evaluated and optimized through multiple iterations, thus completing the optimized layout of the GIS heat tracing modules. Compared to existing empirical methods for optimizing the layout of GIS heat tracing modules, this method can determine an accurate layout of the GIS heat tracing modules by combining stable temperature field simulation, effectively avoiding problems such as redundant heating power and hidden cold spots.
[0090] Example 2: As shown in the attached document Figure 2 As shown, this embodiment of the invention is a further optimization of the above embodiment, wherein constructing a three-dimensional geometric model of the GIS structure and setting the physical field includes:
[0091] Step S210: Establish a three-dimensional geometric model of the GIS structure, wherein the three-dimensional geometric model includes a metal shell 1, an SF6 cavity and an externally attached heat tracing module 3;
[0092] In this step, the three-dimensional geometric model can be constructed using COMSOL software, as shown in the attached figure. Figure 3 As shown, the heat tracing module 3 comprises three parts: a heating module, an insulation layer, and an outer shell; the metal shell 1 has a cylindrical geometry; and the heat tracing module 3 has an arc-shaped sheet structure. The GIS structure here can be a 220kV GIS structure.
[0093] Step S220: Use an unstructured tetrahedral mesh to divide the global domain of the three-dimensional geometric model;
[0094] This step uses COMSOL software to perform regional meshing of the three-dimensional geometric model using unstructured tetrahedral meshes, thereby achieving localized refinement of the shell and heat tracing contact area and the interior of SF6 cavity 2, improving convergence and the accuracy of temperature field simulation.
[0095] Step S230: Set the material and physical parameters of the three-dimensional geometric model;
[0096] This step uses COMSOL software to set the material and physical parameters, specifically:
[0097] (1) The material type of each part is determined based on the physical structure of GIS. For example, the material of SF6 cavity container is steel, the material of heating layer of heat tracing is copper, the material of heat insulation layer of heat tracing is polyvinyl chloride, and the material of heat tracing protective layer is aluminum oxide.
[0098] (2) Set the corresponding physical parameters according to the physical properties of the material, including thermal conductivity, specific heat capacity, density, electrical conductivity, and SF6 gas parameters.
[0099] Specifically, the physical parameters set for the metal casing 1, SF6 gas, and heat tracing element are respectively assigned the following: (material) thermal conductivity K, (material) specific heat capacity C. ρ (Material) density ρ, (Material) conductivity σ h (Heating elements only) SF6 gas is assumed to be a static, homogeneous heat transfer medium, and its phase change and convection are ignored.
[0100] Step S240, establish the solid heat transfer physical field, including:
[0101] Add a physics field: Select solid heat transfer. In simulation software (such as COMSOL, Fluent, etc.), enter the physics field addition module, select "solid heat transfer" under the "heat transfer" category. This physics field is based on Fourier's law (the fundamental law of heat conduction) and is used to simulate the steady-state / transient heat conduction process inside a solid.
[0102] Add a domain heat source: Define an internal heat source;
[0103] Taking "Heat Tracing Module 3" as an example, in solid heat transfer, the heat source is the heat source distribution inside the solid (such as the Joule heat generated by Heat Tracing Module 3). The operating steps include:
[0104] Select "Heat Tracing Module 3" as the heat source area (the geometry of Heat Tracing Module 3 needs to be created in the geometry module first);
[0105] Setting the Joule heating power (unit: W): If the heating module 3 is a resistance heater, the Joule heating power can be calculated using the formula P = I 2 Calculate R (where I is current and R is resistance), or directly input the design power;
[0106] The software automatically converts heat source power into heat source density (unit: W / m³). 3 As a heat source within the solid, it drives the heat conduction process.
[0107] Add boundary convective heat flux: Define the convective heat transfer between the solid and the surroundings, and configure the following parameters:
[0108] Boundary selection: Select the outer wall of the housing and the outer shell of the heat tracing module 3 (these boundaries need to be defined in the geometry module);
[0109] Geometric parameters: Set the cylinder diameter and height (used to calculate the boundary area, and then the heat transfer coefficient for convective heat transfer);
[0110] Environmental parameters: Set the ambient temperature (T) env ) and atmospheric pressure (used to calculate the thermal properties of air, such as thermal conductivity and convective heat transfer coefficient).
[0111] Example 3: As shown in the attached document Figure 4 As shown, this embodiment of the invention is a further optimization of the above embodiment. Based on the three-dimensional geometric model and physical field settings of the GIS structure, a GIS temperature field simulation model is constructed between the metal shell 1, the SF6 cavity 2, and the heat tracing module 3, including:
[0112] (1) Electric field solution module, calculate Joule thermal power;
[0113] Q = Q0
[0114]
[0115] Where Q is Joule heat; P is Joule heat power; Q0 is initial Joule heat; P0 is initial Joule heat power; V is conductor volume, used to correlate heat with spatial scale;
[0116] Joule heat is the heat generated when an electric current passes through a conductor, as resistance impedes the work done by the current. It is the result of the conversion of electrical energy into thermal energy. In this embodiment, the initial Joule heat (a pre-set heat reference value) is set as the Joule heat power. Joule heat power is the amount of Joule heat generated per unit time, reflecting the "heating intensity" of the heat source.
[0117] (2) Convection heat flux solution module:
[0118]
[0119] q0=h(T ext -T)
[0120] -n·q=q0
[0121] Where h is the heat transfer coefficient; K is the thermal conductivity; H is the shell height; Ra H is the Rayleigh number; Pr is the Planck number; D is the shell diameter; Text is the external air temperature; T is the shell temperature; n is the unit normal vector of the boundary; q0 is the convective heat flux; q is the convective heat flux vector.
[0122] The aforementioned convective heat flux is used to describe the heat exchange between the GIS structure and the external environment.
[0123] The negative sign of -n·q above indicates that heat flows out from the shell surface (if T>T).ext Numerically, it is equal to the scalar convective heat flux.
[0124] (3) Temperature distribution solution module: The steady-state temperature field is simulated using the steady-state heat conduction control equation to obtain the steady-state temperature distribution of each region of the shell, heat tracing module 3 and SF6 cavity.
[0125]
[0126] Where ρ is the material density; C ρ denoted as _t_, where _t_ is the specific heat capacity of the material; _u_ is the velocity vector of the fluid; _T_ is the shell temperature; _q_ is the convective heat flux vector; _Q_ is the Joule heat; _Q0_ is the initial Joule heat; and _K_ is the thermal conductivity.
[0127] (4) Temperature simulation solution module: Extract the minimum temperature and temperature difference index of SF6 cavity from the steady-state temperature field simulation results;
[0128] T min =min (x,y,z)∈Ω T(x,y,z)
[0129] ΔT = max(T) - min(T)
[0130] Among them, T min ΔT is the lowest temperature of SF6 cavity 2, which must be greater than -27℃; ΔT is the temperature difference index of SF6 cavity 2; Ω is the three-dimensional spatial region of SF6 cavity 2; T(x,y,z) is the temperature of each region in the three-dimensional spatial region of SF6 cavity 2; max(T) is the highest temperature of SF6 cavity 2; min(T) is the lowest temperature of SF6 cavity 2.
[0131] This embodiment establishes a GIS temperature field simulation model, which can perform steady-state temperature field simulation for any heat tracing module parameter scheme, determine the temperature distribution inside the GIS in advance after the heat tracing module 3 is arranged, provide data support for adjusting the heat tracing module parameter scheme, and avoid the problem of dangerous cold spot areas after the heat tracing module 3 is arranged.
[0132] Example 4: As shown in the appendix Figure 5 As shown, this embodiment of the invention is a further optimization of the above embodiment, wherein the heat tracing module parameter scheme is set, and the heat tracing module parameter scheme that meets the parameter evaluation criteria is output based on the GIS temperature field simulation model, including:
[0133] Step S410: Set the parameter scheme for the heat tracing module, which includes the number of heat tracing modules 3, the heating area of each module, the power density, and the installation position; it should be noted that the number of heat tracing modules 3 ∈ {1,2}.
[0134] Step S420: Substitute the heat tracing module parameter schemes into the GIS temperature field simulation model to perform steady-state temperature field simulation and obtain the corresponding steady-state temperature field simulation results; the simulation process here can be executed in COMSOL software;
[0135] Step S430: Compare the simulation results of each steady-state temperature field with the parameter evaluation criteria. If the criteria are met, output the parameter scheme of the heat tracing module that meets the parameter evaluation criteria. If the criteria are not met, adjust the parameter scheme of the heat tracing module.
[0136] The above parameter evaluation criteria are set as needed. In this embodiment, the parameter evaluation criteria include:
[0137] The lowest temperature T of the SF6 cavity min Greater than -27℃;
[0138] The temperature difference index ΔT of the SF6 cavity is less than 200℃, and the temperature distribution map shows that the temperature decreases from the middle to the top and bottom.
[0139] If the parameter evaluation criteria are met, the temperature uniformity is considered reasonable.
[0140] Example 5: This embodiment of the invention is a further optimization of the above embodiments, wherein it determines whether the heating area and heating power corresponding to the heat tracing module parameter scheme are optimal; if not, the heat tracing module parameter scheme is adjusted, including:
[0141] Step S510: Determine whether the parameter scheme of the heat tracing module meets the optimization constraints;
[0142] q i max
[0143] A i >A min
[0144] Step S520: If the response is no, then adjust the parameters of the heat tracing module.
[0145] In step S530, the response is as follows: the total heating area and total heating power corresponding to the parameter scheme of the heat tracing module are determined.
[0146]
[0147] Where, q i Let A be the power density of the i-th heat tracing module 3; i q represents the heating area of the i-th heat tracing module 3; max The maximum power density of heat tracing module 3; A min P represents the minimum heating area of heat tracing module 3; i represents the number of heat tracing modules 3; P 总 Total heating power; A总 This represents the total heating area.
[0148] It should also be noted that if the parameter scheme of the heat tracing module does not meet the optimization constraints and the parameter scheme of the heat tracing module needs to be adjusted, the power density and heating area of the heat tracing module 3 can be adjusted separately. After meeting the corresponding optimization constraints, the next parameter can be adjusted.
[0149] This embodiment optimizes the parameters of the heat tracing module 3 through simulation, minimizing heating power consumption while meeting minimum temperature requirements. Compared to existing empirical GIS heat tracing module layout optimization methods, this avoids the problem of excessively high power margins based on empirical benchmarks, leading to over-configuration of heat tracing power and a significant increase in energy consumption; effectively reducing operating costs.
[0150] Example 6: As attached Figure 6 As shown, this embodiment of the invention discloses a GIS heat tracing module layout optimization device based on finite element simulation, comprising:
[0151] The initial setup unit constructs a three-dimensional geometric model of the GIS structure and sets the physical field. The three-dimensional geometric model includes a metal shell 1, an SF6 cavity 2, and an externally attached heat tracing module 3.
[0152] The simulation model building unit constructs a simulation model of the GIS temperature field between the metal shell 1, the SF6 cavity 2 and the heat tracing module 3, based on the three-dimensional geometric model and physical field settings of the GIS structure.
[0153] The first optimization unit sets up the parameter scheme for the heat tracing module and determines the parameter scheme for the heat tracing module that meets the parameter evaluation criteria based on the GIS temperature field simulation model.
[0154] The second optimization unit determines whether the heating area and heating power corresponding to the heat tracing module parameter scheme have achieved the optimal result. If not, it returns to adjust the heat tracing module parameter scheme.
[0155] The first optimization unit includes:
[0156] The scheme preset module sets the parameter scheme for the heat tracing module, which includes the number of heat tracing modules, the heating area of each module, the power density, and the installation location.
[0157] The temperature simulation module substitutes the parameters of the heat tracing module into the GIS temperature field simulation model to perform steady-state temperature field simulation and obtain the corresponding steady-state temperature field simulation results.
[0158] The scheme optimization module compares the simulation results of each steady-state temperature field with the parameter evaluation criteria. If the criteria are met, the module outputs a heat tracing module parameter scheme that meets the criteria; otherwise, the module adjusts the heat tracing module parameter scheme.
[0159] The second optimization unit includes:
[0160] The constraint comparison module determines whether the parameter scheme of the heat tracing module meets the optimization constraints.
[0161] qi max
[0162] A i >A min
[0163] If the scheme adjustment module does not respond, the parameters of the heat tracing module will be adjusted accordingly.
[0164] Optimize the output module, and then determine the total heating area and total heating power corresponding to the parameter scheme of the heat tracing module;
[0165]
[0166] Where, q i Let A be the power density of the i-th heat tracing module 3; i q represents the heating area of the i-th heat tracing module 3; max The maximum power density of heat tracing module 3; A min P represents the minimum heating area of heat tracing module 3; i represents the number of heat tracing modules 3; P 总 Total heating power; A 总 This represents the total heating area.
[0167] The above content is only a specific embodiment of this application, which has strong adaptability and implementation effect. However, the protection scope of this application is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the protection scope of this application. Therefore, equivalent changes made in accordance with the claims of this application are still within the scope of this application.
Claims
1. A method for optimizing the layout of GIS heat tracing modules based on finite element simulation, characterized in that, include: A three-dimensional geometric model of the GIS structure is constructed and a physical field is set. The three-dimensional geometric model includes a metal shell, an SF6 cavity, and an externally attached heat tracing module. Based on the three-dimensional geometric model and physical field setting of the GIS structure, a GIS temperature field simulation model is constructed between the metal shell, SF6 cavity and heat tracing module. Set up a parameter scheme for the heat tracing module, and determine a parameter scheme for the heat tracing module that meets the parameter evaluation criteria based on the GIS temperature field simulation model; Determine whether the heating area and heating power corresponding to the heat tracing module parameter scheme are optimal. If not, return to adjust the heat tracing module parameter scheme.
2. The GIS heat tracing module layout optimization method based on finite element simulation according to claim 1, characterized in that, GIS temperature field simulation model, including: The electric field solving module calculates Joule thermal power. Q = Q0 Where Q is the Joule heat; P is the Joule thermal power; Q0 is the initial Joule heat; P0 is the initial Joule thermal power; and V is the conductor volume. Convection heat flux solution module: -n·q=q0 Where h is the heat transfer coefficient; K is the thermal conductivity; H is the shell height; Ra H is the Rayleigh number; Pr is the Planck number; D is the shell diameter; Text is the outside air temperature; T is the shell temperature; n is the unit normal vector of the boundary; q0 is the convective heat flux; q is the convective heat flux vector; The temperature distribution solution module uses the steady-state heat conduction control equation to simulate the steady-state temperature field and obtain the steady-state temperature distribution of each region in the shell, the heat tracing module and the SF6 cavity. Where ρ is the material density; C ρ denoted as _t_i, where _t_i is the specific heat capacity of the material; _u_i is the fluid velocity vector; _T_i is the shell temperature; _q_i is the convective heat flux vector; _Q_i is the Joule heat; _Q_0_i is the initial Joule heat; _K_i is the thermal conductivity. The temperature simulation solution module extracts the minimum temperature and temperature difference index of the SF6 cavity from the steady-state temperature field simulation results. T m =min (x，y，z)∈Ω T(x,y,z) ΔT = max(T) - min(T) Among them, T min ΔT is the lowest temperature of the SF6 cavity, which must be greater than -27℃; ΔT is the temperature difference index of the SF6 cavity; Ω is the three-dimensional spatial region of the SF6 cavity; T(x, y, z) is the temperature of each region in the three-dimensional spatial region of the SF6 cavity; max(T) is the highest temperature of the SF6 cavity; min(T) is the lowest temperature of the SF6 cavity.
3. The GIS heat tracing module layout optimization method based on finite element simulation according to claim 1 or 2, characterized in that, Configure the parameter scheme for the heat tracing module, and output the parameter scheme for the heat tracing module that meets the parameter evaluation criteria based on the GIS temperature field simulation model, including: The parameters for setting up the heat tracing module include the number of heat tracing modules, the heating area of each module, the power density, and the installation location. Substitute the parameters of the heat tracing module into the GIS temperature field simulation model to perform steady-state temperature field simulation and obtain the corresponding steady-state temperature field simulation results. The simulation results of each steady-state temperature field are compared with the parameter evaluation criteria. If the criteria are met, the parameter scheme of the heat tracing module that meets the criteria is output. If the criteria are not met, the parameter scheme of the heat tracing module is adjusted.
4. The GIS heat tracing module layout optimization method based on finite element simulation according to claim 3, characterized in that, Parameter evaluation criteria, including: The lowest temperature T of the SF6 cavity min Greater than -27℃; The temperature difference index ΔT of the SF6 cavity is less than 200℃, and the temperature distribution map shows that the temperature decreases from the middle to the top and bottom.
5. The GIS heat tracing module layout optimization method based on finite element simulation according to claim 1, 2, or 4, characterized in that, Determine whether the heating area and heating power corresponding to the heat tracing module parameter scheme are optimal. If not, adjust the heat tracing module parameter scheme, including: Determine whether the parameter scheme of the heat tracing module meets the optimization constraints; q i <q max A i >A min If no response is received, adjust the parameters of the heat tracing module accordingly; Therefore, the total heating area and total heating power corresponding to the parameter scheme of the heat tracing module are determined; Where, q i Let A be the power density of the i-th heat tracing module; i Let q be the heating area of the i-th heat tracing module; max This represents the maximum power density of the heat tracing module; A min P represents the minimum heating area of the heat tracing module; i represents the number of heat tracing modules; P 总 Total heating power; A 总 This represents the total heating area.
6. The GIS heat tracing module layout optimization method based on finite element simulation according to any one of claims 1 to 5, characterized in that, Construct a three-dimensional geometric model of the GIS structure and set the physical field, including: A three-dimensional geometric model of the GIS structure is established, which includes a metal shell, an SF6 cavity, and an externally attached heat tracing module. The global domain of the 3D geometric model is divided using unstructured tetrahedral meshes; Set the material and physical parameters of the 3D geometric model; Establish the physical field for heat transfer in solids.
7. A GIS heat tracing module layout optimization device based on finite element simulation applied to the method described in any one of claims 1 to 6, characterized in that, include: The initial setup unit constructs a three-dimensional geometric model of the GIS structure and sets the physical field. The three-dimensional geometric model includes a metal shell, an SF6 cavity, and an externally attached heat tracing module. The simulation model building unit constructs a GIS temperature field simulation model between the metal shell, SF6 cavity and heat tracing module based on the three-dimensional geometric model and physical field settings of the GIS structure. The first optimization unit sets up the parameter scheme for the heat tracing module and determines the parameter scheme for the heat tracing module that meets the parameter evaluation criteria based on the GIS temperature field simulation model. The second optimization unit determines whether the heating area and heating power corresponding to the heat tracing module parameter scheme have achieved the optimal result. If not, it returns to adjust the heat tracing module parameter scheme.
8. The GIS heat tracing module layout optimization device based on finite element simulation according to claim 7, characterized in that, The first optimization unit includes: The solution preset module sets the parameters of the heat tracing module, which includes the number of heat tracing modules, the heating area of each module, the power density, and the installation location. The temperature simulation module substitutes the parameters of the heat tracing module into the GIS temperature field simulation model to perform steady-state temperature field simulation and obtain the corresponding steady-state temperature field simulation results. The scheme optimization module compares the simulation results of each steady-state temperature field with the parameter evaluation criteria. If the criteria are met, the module outputs a heat tracing module parameter scheme that meets the criteria; otherwise, the module adjusts the heat tracing module parameter scheme.
9. The GIS heat tracing module layout optimization device based on finite element simulation according to claim 7 or 8, characterized in that, The second optimization unit includes: The constraint comparison module determines whether the parameter scheme of the heat tracing module meets the optimization constraints. q i <q max A i >A min If the scheme adjustment module does not respond, the parameters of the heat tracing module will be adjusted accordingly. Optimize the output module, and then determine the total heating area and total heating power corresponding to the parameter scheme of the heat tracing module; Where, q i Let A be the power density of the i-th heat tracing module; i Let q be the heating area of the i-th heat tracing module; max This represents the maximum power density of the heat tracing module; A min P represents the minimum heating area of the heat tracing module; i represents the number of heat tracing modules; P 总 Total heating power; A 总 This represents the total heating area.