Manufacturing method of resistor and resistor

Abstract

The invention discloses a resistor manufacturing method and a resistor. The manufacturing method comprises the following steps: forming a metal coating on the upper surface of a metal substrate through a cold spraying process; carrying out an annealing process; and performing a first calendaring process to obtain an electrode coating, wherein the reduction rate of the first calendaring process is greater than or equal to 0 and less than 10%.

Description

Technical Field

[0001] This invention relates to a resistor, and more specifically to a resistor and its manufacturing method. Background Technology

[0002] Passive components are electronic components that do not generate electricity but store or release it and can work in conjunction with active electronic components. Common examples of passive components include resistors, which are among the most frequently used and indispensable components in electronic products. Summary of the Invention

[0003] The purpose of this invention is to provide a resistor and its manufacturing method that are different from those manufactured by known technologies.

[0004] To achieve the above objectives, the present invention proposes a method for manufacturing a resistor, comprising: forming a metal coating on the upper surface of a metal substrate by a cold spraying process; performing an annealing process; and performing a first rolling process to obtain an electrode coating, wherein the reduction rate of the first rolling process is greater than or equal to 0 and less than 10%.

[0005] To achieve the above objectives, the present invention also proposes a resistor comprising a metal substrate and an electrode coating. The metal substrate has an upper surface. The electrode coating is disposed on the upper surface and includes two electrodes located on two opposite sides of the upper surface; wherein the electrode coating is formed on the metal substrate by a cold spraying process, followed by a sequential annealing process and a first rolling process, wherein the reduction rate of the first rolling process is greater than or equal to 0 and less than 10%.

[0006] In one embodiment, the metal substrate is a manganese copper alloy plate, a nickel copper alloy plate, a nickel chromium alloy plate, an iron chromium alloy plate, an aluminum plate, a copper plate, ceramic alumina, an aluminum nitride plate, silicon carbide, gallium nitride, a graphite sheet, an engineering plastic plate, or a BT plate.

[0007] In one embodiment, the material of the metal coating includes copper powder, gold powder, silver powder, nickel powder, aluminum powder, tin powder, manganese copper alloy powder, nickel copper alloy powder, nickel chromium alloy powder, iron chromium alloy powder, or graphite powder.

[0008] In one embodiment, in the cold spraying process, the metal coating covers the entire upper surface, and the manufacturing method further includes performing a processing step so that the metal coating covers only a portion of the upper surface.

[0009] In one embodiment, in a cold spray process, a masking fixture is used to ensure that the metal coating covers only a portion of the upper surface.

[0010] In one embodiment, the manufacturing method further includes performing a stamping process.

[0011] In one embodiment, the manufacturing method further includes performing an insulating coating process.

[0012] In one embodiment, the manufacturing method further includes: spraying a first metal layer onto the electrode coating and performing a second rolling process; and spraying a second metal layer onto the first metal layer and performing a third rolling process.

[0013] In one embodiment, the resistor further includes an insulating layer disposed on the upper surface and located between the electrodes.

[0014] In one embodiment, the resistor further includes a first metal layer and a second metal layer. The first metal layer is disposed on the electrode. The second metal layer is disposed on the first metal layer.

[0015] In summary, in the resistor manufacturing method and resistor of the present invention, a metal coating is formed on the upper surface of a metal substrate by cold spraying, followed by annealing and rolling to obtain an electrode coating. The rolling process has a reduction rate greater than or equal to 0 and less than 10%, making the present invention a resistor and its manufacturing method that are different from those manufactured by known technologies. Attached Figure Description

[0016] Figure 1 This is a schematic flowchart illustrating a method for manufacturing a resistor according to an embodiment of the present invention.

[0017] Figures 2A to 2E This is a schematic diagram of the manufacturing process of a resistor according to an embodiment of the present invention.

[0018] Figure 3 This is a schematic diagram of another manufacturing process of a resistor according to an embodiment of the present invention.

[0019] Figure 4 This is another schematic diagram of a resistor manufacturing method according to an embodiment of the present invention.

[0020] Figure 5 and Figure 6 These are schematic diagrams of resistors according to different embodiments of the present invention. Detailed Implementation

[0021] The following description, with reference to the accompanying drawings, will illustrate a method for manufacturing a resistor according to an embodiment of the present invention, wherein the same components will be described using the same reference numerals.

[0022] The components shown in the following examples are only used to illustrate their relative relationships and do not represent the proportions or sizes of the actual components.

[0023] Figure 1 This is a schematic flowchart illustrating a method for manufacturing a resistor according to an embodiment of the present invention. Figures 2A to 2E This is a schematic diagram illustrating the manufacturing process of a resistor according to an embodiment of the present invention. Figure 3 This is a schematic diagram of another manufacturing process of a resistor according to an embodiment of the present invention.

[0024] like Figure 1 As shown, the method for manufacturing the resistor of the present invention may include: forming a metal coating on the upper surface of a metal substrate by a cold spraying process (step S01); performing an annealing process (step S02); and performing a first rolling process to obtain an electrode coating, wherein the reduction rate of the first rolling process is greater than or equal to 0 and less than 10% (step S03). Additionally, the method for manufacturing the resistor of the present invention may further include: performing a stamping process to obtain a plurality of resistors (step S04).

[0025] Please refer to the following. Figure 1 and cooperate Figures 2A to 2E The following diagram illustrates the manufacturing process of resistor 1 according to an embodiment of the present invention.

[0026] First, such as Figure 2A As shown, step S01 is performed first: a metal coating 12 is formed on the upper surface 111 of the metal substrate 11 using a cold spraying process. For example... Figure 2B As shown, the metal coating 12 in this embodiment covers the entire upper surface 111 of the metal substrate 11. In one embodiment, the metal substrate 11 may be a manganese copper alloy plate, a nickel copper alloy plate, a nickel-chromium alloy plate, an iron-chromium alloy plate, an aluminum plate, a copper plate, ceramic alumina (Al2O3), aluminum nitride (AlN), silicon carbide (SiC), gallium nitride (GaN), graphite sheet, engineering plastic plate, or BT (Bismaleimide Triazine) plate. In one embodiment, the metal coating 12 includes metal particles, the material of which may include copper powder, gold powder, silver powder, nickel powder, aluminum powder, tin powder, manganese copper alloy powder, nickel copper alloy powder, nickel-chromium alloy powder, iron-chromium alloy powder, or graphite powder. In one embodiment, the thickness of the metal substrate 11 may be, for example, between 0.1 mm and 5.0 mm, while the thickness of the metal coating 12 may be, for example, between 0.05 mm and 2.0 mm. In one embodiment, a metal roll continuously coated with the metal coating 12 can be obtained, which is convenient for storage and transportation.

[0027] Cold spraying is a high-pressure spraying technique that uses high-pressure inert gas (such as helium or argon) or air to agitate metal powder against a solid substrate below its melting point to form a thin film. The metal powder is propelled at high speed against the substrate surface using a high-pressure inert gas (such as helium or argon) or air at temperatures below the metal's melting point, causing the metal particles to stack into a thick film during superplastic deformation. The pressure used to spray the metal powder is preferably in the range of, for example, 0.5 to 3.0 MPa. If the pressure is below 0.5 MPa, it is difficult to obtain the particle velocity required for depositing the metal powder. When the pressure exceeds 3.0 MPa, the increase in metal particle velocity is minimal, resulting in a low effect on improving adhesion efficiency, and continuous coating consumes excessive energy, placing a heavy burden on the equipment.

[0028] Compared to high-temperature spraying for resistor fabrication, this invention employs cold spraying technology because the metal substrate 11 is very thin. If high-temperature spraying, such as laser cladding or thermal spraying, is used to form the metal coating 12, the thin metal substrate 11 is prone to thermal deformation, leading to a decrease in yield. Cold spraying, on the other hand, can produce a dense thin film that does not oxidize in the atmosphere, has minimal thermal impact on material particles, inhibits thermal degradation, and has a fast film formation rate, allowing for a thicker metal coating 12 with high adhesion efficiency.

[0029] In the cold spraying process (step S01) of this embodiment, the metal coating 12 covers the entire upper surface 111 of the metal substrate 11. Therefore, the resistor manufacturing method may further include: performing a processing step so that the metal coating 12 only covers a portion of the upper surface 111. In one embodiment, such as Figure 2C As shown, the metal coating 12 can be processed by, for example, machining (e.g., milling, grooving) or chemical methods (e.g., etching, electroplating) to form a plurality of parallel grooves U, making the metal coating 12 patterned so that the metal coating 12 only covers the upper surface 111 of a portion of the metal substrate 11. However, it is not limited to this; in different embodiments, such as Figure 3 As shown, in the cold spraying process, the metal coating 12 can be made to cover only the upper surface 111 of the metal substrate 11 by using the masking fixture 2. Here, the masking fixture 2 is located between the cold spray nozzle and the metal substrate 11. When the sprayed metal powder material passes through the masking fixture 2, a patterned metal coating 12 can be directly formed on the upper surface 111 of the metal substrate 11 (e.g., ...). Figure 2C As shown in the figure, this omits the subsequent processing steps.

[0030] Next, step S02 is performed: an annealing process is carried out. The annealing (heat treatment) process is performed at a temperature below the melting point of the metal particles, which softens the inner layer of the metal coating 12 (metal particles) that constitutes the cold spray film and increases the hardness ratio with the oxide film covering the particle surface, thereby increasing the adhesion between the metal coating 12 and the metal substrate 11 and forming a continuous film with excellent smoothness.

[0031] After that, as Figure 2D As shown, step S03 is performed: a first rolling process is carried out to obtain the electrode coating 13, wherein the reduction rate of the first rolling process is greater than or equal to 0 and less than 10%. This allows an electrode coating 13 with excellent adhesion and high smoothness to be formed on the metal substrate 11. The rolling (cold rolling) process is used to break down the oxide film present on the surface of particles in the film formed by cold spraying, thereby reducing the porosity of the film, improving the adhesion between the metal coating 12 and the metal substrate 11, and smoothing the surface of the metal coating 12, thus obtaining the electrode coating 13.

[0032] Finally, step S04 involves performing a stamping process to obtain multiple resistors 1. For example... Figure 2E As shown, after the stamping process, each resistor 1 may include a metal substrate 11 and two electrodes 131, 132 located on the upper surface 111 of the metal substrate 11. A trench U is located between the two electrodes 131, 132. In some embodiments, the resistor 1 can be obtained by sheet stamping (multiple resistors 1 are obtained in one stamping) or single stamping (only one resistor 1 is obtained in one stamping). In one embodiment, the manufacturing method of the resistor 1 may further include an impedance adjustment process and a testing process.

[0033] Therefore, as Figure 2E As shown, the resistor 1 in this embodiment includes a metal substrate 11 and an electrode coating 13. The metal substrate 11 has an upper surface 111, and the electrode coating 13 is disposed on the upper surface 111 of the metal substrate 11. The electrode coating 13 includes two electrodes 131 and 132, which are located on two opposite sides of the upper surface 111. In this embodiment, the electrode coating 13 (electrodes 131 and 132) is formed on the metal substrate 11 by a cold spraying process to form a metal coating 12, and then the metal coating 12 is sequentially subjected to an annealing process and a rolling process (a first rolling process). Here, the reduction rate of the rolling process can be greater than or equal to 0 and less than 10%.

[0034] in addition, Figure 4 This is another schematic flowchart illustrating a resistor manufacturing method according to an embodiment of the present invention. Figure 5 and Figure 6 These are schematic diagrams of resistors according to different embodiments of the present invention.

[0035] Please refer to this first. Figure 4 The manufacturing method of the resistor in this embodiment is largely the same as that in the previous embodiment. The difference lies in that the manufacturing method of the resistor in this embodiment may further include steps S05 and S06. Step S05 involves spraying a first metal layer 141 onto the electrode coating 13 (electrodes 131, 132) and performing a second rolling process. Step S06 involves spraying a second metal layer 142 onto the first metal layer 141 and performing a third rolling process. Here, the processes for spraying the first metal layer 141 and the second metal layer 142 are still cold spray processes, while the reduction rate of the second rolling process can be 0% to 10%, and the reduction rate of the third rolling process can be 0% to 10%. Therefore, as... Figure 5 As shown, the first metal layer 141 is disposed on the electrode coating 13 (electrodes 131, 132), while the second metal layer 142 is disposed on the first metal layer 141.

[0036] In one embodiment, the material of the first metal layer 141 is, for example, but not limited to, nickel powder, and the thickness of the first metal layer 141 may be less than 10 micrometers (μm); the material of the second metal layer 142 is, for example, but not limited to, tin powder, and the thickness of the second metal layer 142 may be less than 10 micrometers (μm). The purpose of using a cold spraying process to set the first metal layer 141 and the second metal layer 142 in this embodiment is that: currently, resistors must be chemically electroplated with nickel and tin to bond with the circuitry of the PCB board, but this embodiment uses cold spraying instead of chemical electroplating, which can completely avoid the environmental pollution problems caused by the electroplating process. It is understood that the processes of spraying the first metal layer 141 (step S05) and spraying the second metal layer 142 (step S06) can also be performed before the stamping process (step S04), and this invention is not limited thereto.

[0037] It is particularly important to note that in one embodiment, such as Figure 6 As shown, the method for manufacturing the resistor may further include: performing an insulating coating process to form an insulating layer 15 on the upper surface 111. In this embodiment, the insulating layer 15 is disposed on the upper surface 111 of the metal substrate 11 and located between the electrodes 131 and 132, i.e., within the trench U. It is understood that the insulating coating process can be performed before the stamping process (step S04), or it can be performed after the stamping process (step S04), and the present invention is not limited thereto.

[0038] In summary, in the resistor manufacturing method and resistor of the present invention, a metal coating is formed on the upper surface of a metal substrate by cold spraying, followed by annealing and sequential rolling processes to obtain an electrode coating. The rolling process has a reduction rate greater than or equal to 0 and less than 10%, making the present invention a resistor and its manufacturing method that are different from those manufactured by known technologies.

[0039] The above description is merely illustrative and not restrictive. Any equivalent modifications or alterations made without departing from the spirit and scope of this invention should be included in the appended claims.

Claims

1. A method for manufacturing a resistor, comprising: A metal coating is formed on the upper surface of a metal substrate using a cold spraying process; Perform the annealing process; as well as A first calendering process is performed to obtain an electrode coating, wherein the reduction rate of the first calendering process is greater than or equal to 0 and less than 10%.

2. The manufacturing method according to claim 1, wherein the metal substrate is a manganese copper alloy plate, a nickel copper alloy plate, a nickel chromium alloy plate, an iron chromium alloy plate, an aluminum plate, a copper plate, ceramic alumina, an aluminum nitride plate, silicon carbide, gallium nitride, graphite sheet, engineering plastic plate, or BT plate.

3. The manufacturing method according to claim 1, wherein the material of the metal coating includes copper powder, gold powder, silver powder, nickel powder, tin powder, aluminum powder, manganese copper alloy powder, nickel copper alloy powder, nickel chromium alloy powder, iron chromium alloy powder, or graphite powder.

4. The manufacturing method according to claim 1, wherein, In the cold spraying process, the metal coating covers the entire upper surface, and the manufacturing method further includes: The processing technology is carried out so that the metal coating only covers a portion of the upper surface.

5. The manufacturing method according to claim 1, wherein, In the cold spraying process, a masking fixture is used to ensure that the metal coating only covers a portion of the upper surface.

6. The manufacturing method according to claim 4 or 5, further comprising: Perform the stamping process.

7. The manufacturing method according to claim 1, further comprising: Perform the insulation coating process.

8. The manufacturing method according to claim 1, further comprising: A first metal layer is sprayed onto the electrode coating, followed by a second rolling process; and A second metal layer is sprayed onto the first metal layer, and a third rolling process is performed.

9. A resistor comprising: A metal substrate having an upper surface; as well as An electrode coating is disposed on the upper surface and includes two electrodes located on two opposite sides of the upper surface; The electrode coating is formed on the metal substrate by cold spraying, and then annealing and first rolling processes are performed in sequence. The reduction rate of the first rolling process is greater than or equal to 0 and less than 10%.

10. The resistor according to claim 9, wherein the metal substrate is a manganese copper alloy plate, a nickel copper alloy plate, a nickel chromium alloy plate, an iron chromium alloy plate, an aluminum plate, a copper plate, ceramic alumina, an aluminum nitride plate, silicon carbide, gallium nitride, a graphite sheet, an engineering plastic plate, or a BT plate.

11. The resistor according to claim 9, wherein the material of the metal coating includes copper powder, gold powder, silver powder, nickel powder, tin powder, aluminum powder, manganese copper alloy powder, nickel copper alloy powder, nickel chromium alloy powder, iron chromium alloy powder, or graphite powder.

12. The resistor according to claim 9, further comprising: An insulating layer is disposed on the upper surface and located between the electrodes.

13. The resistor according to claim 9, further comprising: A first metal layer is disposed on the electrode; and A second metal layer is disposed on the first metal layer.

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