Power supply device

Abstract

The invention relates to a power supply device which comprises a plurality of modules arranged on a main circuit board, the main circuit board comprises a first side, a second side, a third side and a fourth side, the first side and the second side are oppositely arranged and extend along a first direction, and the third side and the fourth side are oppositely arranged and extend along a second direction; the input / output module is arranged on the main circuit board and is adjacent to the fourth side; the capacitor module is adjacent to the third side; the rectifier module is arranged on the main circuit board, is positioned between the input / output module and the capacitor module, and is adjacent to the input / output module; the EMI module is arranged on the main circuit board and located between the capacitor module and the input and output module. The first inductor module, the resonance module and the power semiconductor device module are all arranged on the main circuit board and located between the capacitor module and the rectifier module.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of power electronics, and in particular to a power supply device. BACKGROUND

[0002] Miniaturization and high power density have gradually become the development trend of power supply devices. In the field of power supply devices, the arrangement of various modules in the power supply device is not reasonable, which results in low space utilization, long signal transmission path and large power loss of high-power power supply devices. Therefore, how to improve the space utilization of the power supply device in a limited size, optimize the transmission path and improve the efficiency at the same time is an important issue.

[0003] Therefore, how to develop a power supply device to overcome the above-mentioned shortcomings is an urgent need at present. SUMMARY

[0004] The purpose of the present application is to provide a power supply device, by arranging the rectifier module adjacent to the input and output module, the output power path is shortened; by arranging the first inductor module and the resonance module adjacent to the power semiconductor device module, the connection path between the first inductor module, the resonance module and the power semiconductor device module is shortened, thereby improving the space utilization in the power supply device, optimizing the signal transmission path and effectively improving the efficiency. In addition, by arranging the vertically inserted busbar connection plate on the main board, the capacitor module and the power semiconductor device module are connected, not only shortening the connection path between the capacitor module and the power semiconductor device module, but also suspending the capacitor module on one side of the circuit board, reducing the material of the PCB and saving the cost of the power supply device.

[0005] To achieve the above purpose, the present application provides a power supply device, comprising a main circuit board, an input and output module, a capacitor module, a rectifier module, an EMI module, a first inductor module, a resonance module and a power semiconductor device module. The main circuit board comprises a first side, a second side, a third side and a fourth side, the first side and the second side are arranged opposite to each other and extend along a first direction, and the third side and the fourth side are arranged opposite to each other and extend along a second direction. The input and output module is arranged on the main circuit board and adjacent to the fourth side. The capacitor module is adjacent to the third side. The rectifier module is arranged on the main circuit board between the input and output module and the capacitor module, and adjacent to the input and output module. The EMI module is arranged on the main circuit board between the capacitor module and the input and output module. The first inductor module, the resonance module and the power semiconductor device module are all arranged on the main circuit board and between the capacitor module and the rectifier module.

[0006] To achieve the above objectives, this application provides a power supply system comprising at least one of the aforementioned power supply devices and a water-cooled plate. At least one side of the water-cooled plate includes a plurality of bosses and a plurality of potting grooves. The side of the water-cooled plate, including the plurality of bosses and the plurality of potting grooves, is attached to at least one power supply device. Attached Figure Description

[0007] Figure 1 This is a block diagram showing the layout of the power supply device in the first embodiment of this case.

[0008] Figure 2 for Figure 1 The diagram shows a topology diagram of one type of three-phase circuit in the power supply device.

[0009] Figure 3 This is a block diagram showing the layout of the power supply device in the second embodiment of this case.

[0010] Figure 4 This is a block diagram showing the layout of the power supply device in the third embodiment of this case.

[0011] Figure 5 This is a block diagram showing the layout of the power supply device in the fourth embodiment of this case.

[0012] Figure 6 This is a block diagram showing the layout of the power supply device according to the fifth embodiment of this case.

[0013] Figure 7 This is a block diagram showing the layout of the power supply device in the sixth embodiment of this case.

[0014] Figure 8 This is a block diagram showing the layout of the power supply device in the seventh embodiment of this case.

[0015] Figure 9 This is a block diagram showing the layout of the power supply device in the eighth embodiment of this case.

[0016] Figure 10 This is a block diagram showing the layout of the power supply device in the ninth embodiment of this case.

[0017] Figure 11 This is a block diagram showing the layout of the power supply device in the tenth embodiment of this case.

[0018] Figure 12A This is a three-dimensional structural diagram of the power supply system in the first embodiment of this case.

[0019] Figure 12B for Figure 12A The side view of the power supply system shown.

[0020] Figure 12C for Figure 12A The diagram shows the exploded structure of the power system.

[0021] Figure 13A This is a three-dimensional structural diagram of the power supply system in the second embodiment of this case.

[0022] Figure 13B for Figure 13A The side view of the power supply system shown.

[0023] Figure 13C for Figure 13A The diagram shows the exploded structure of the power system.

[0024] Figure 14 This is a block diagram showing the layout of the power supply device in the eleventh embodiment of this case.

[0025] List of reference numerals

[0026] 1, 1a, 1b, 1c, 1d, 1e, 1f, 1g, 1h, 1i, 1m: Power supply device

[0027] 1j, 1k: Power system

[0028] 10: Input terminals

[0029] 11: Output terminals

[0030] 2a: EMI module

[0031] 2b: PFC module

[0032] 2c: LLC module

[0033] 21: EMI circuit

[0034] 22: PFC inductor

[0035] 23: PFC power semiconductor devices

[0036] 24: PFC output capacitor

[0037] 25: LLC primary-side power switch

[0038] 261: Transformer

[0039] 263: Resonant capacitor

[0040] 264: Resonant Inductor

[0041] 265: LLC secondary rectifier switch

[0042] C1: LLC output capacitor

[0043] 3: Main circuit board

[0044] 3a: First main circuit board

[0045] 3b: Second main circuit board

[0046] 31: First side

[0047] 32: Second side

[0048] 33: Third side

[0049] 34: Fourth side

[0050] X: First direction

[0051] Y: Second direction

[0052] 41: Input / Output Module

[0053] 42: Capacitor Module

[0054] 421: Capacitor connection board

[0055] 422: Energy storage capacitor

[0056] 423: Conductor

[0057] 43: Rectifier Module

[0058] 431: Transformer

[0059] 432: First filter capacitor

[0060] 433: Second filter capacitor

[0061] 434: Rectifier switch

[0062] 44: EMI Module

[0063] 45: Power Semiconductor Device Module

[0064] 46: First Inductor Module

[0065] 47: Resonance Module

[0066] 471: Resonant capacitor plate

[0067] 472: Second Inductor Module

[0068] 51: Input connection board

[0069] 52: Busbar connection plate

[0070] 6: Water-cooled plate

[0071] 651: convex platform

[0072] 652: Glue Dispensing Tank

[0073] 71: First heating element

[0074] 72: Second heating element Detailed Implementation

[0075] Some typical embodiments that embody the features and advantages of this invention will be described in detail in the following description. It should be understood that this invention can have various variations in different forms, all of which do not depart from the scope of this invention, and the descriptions and illustrations therein are for illustrative purposes only, and are not intended to limit this invention.

[0076] The terms "comprising," "including," "having," and "containing" used in this case are all open-ended terms, meaning they include but are not limited to. The following detailed description of some embodiments of this case is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other, and similar concepts or processes may not be repeated in some embodiments.

[0077] Please see Figure 1 and Figure 2 ,in Figure 1 This is a schematic block diagram of the layout of the power supply device according to the first embodiment of this case. Figure 2 for Figure 1 The diagram shows a schematic topology of one type of three-phase circuit in a power supply device. (See attached diagram.) Figure 2 As shown, the power supply device 1 in this embodiment receives and converts AC power provided by an external power source to supply power to a load (not shown). Specifically, the circuit topology corresponding to the power supply device 1 includes three circuit modules: EMI module 2a, PFC module 2b, and LLC module 2c. EMI module 2a includes an EMI circuit 21, which includes a common-mode inductor, an X capacitor (a type of safety capacitor), and a Y capacitor (another type of safety capacitor) (not shown), used to eliminate electromagnetic interference in the circuit. PFC module 2b includes a PFC inductor 22, a PFC power semiconductor switch 23, and a PFC output capacitor 24, used to control the waveform of the input current to synchronize it with the waveform of the input voltage, thereby improving the power factor. Figure 2 The diagram shows a three-phase totem-pole PFC circuit. Each phase includes two PFC inductors 22 and four PFC power semiconductor switches 23. The three phases share two PFC output capacitors 24. It should be noted that the PFC output capacitor 24 can be a single capacitor or the equivalent capacitance of multiple capacitors. The LLC module 2c includes an LLC primary-side power switch 25, a resonant capacitor 263, a resonant inductor 264, a transformer 261, an LLC secondary-side rectifier switch 265, and an LLC output capacitor C1. It should be noted that the LLC output capacitor C1 can be the equivalent capacitance of multiple capacitors.

[0078] Furthermore, corresponding Figure 1The actual circuit structure described herein includes a power supply device 1 comprising a main circuit board 3, an input / output module 41, a capacitor module 42, a rectifier module 43, an EMI module 44, a power semiconductor device module 45, a first inductor module 46, and a resonant module 47. Among them, EMI module 2a is connected to input terminal 10, which is located at input / output module 41; in PFC module 2b, PFC inductor 22 is located at first inductor module 46, all PFC power semiconductor switches 23 are located at power semiconductor device module 45, and PFC output capacitor 24 is located at capacitor module 42; in LLC module 2c, LLC primary-side power switch 25 is located at power semiconductor device module 45, resonant inductor 264 and resonant capacitor 263 are located at resonant module 47, transformer 261, LLC secondary-side rectifier switch 265 and LLC output capacitor C1 are located at rectifier module 43; finally, LLC output capacitor C1 is connected to output terminal 11, which is located at input / output module 41.

[0079] Specifically, in the actual structural portion, the main circuit board 3 includes a first side 31, a second side 32, a third side 33, and a fourth side 34. The first side 31 and the second side 32 are arranged opposite each other and extend along a first direction X. The third side 33 and the fourth side 34 are located between the first side 31 and the second side 32, arranged opposite each other, and extend along a second direction Y. In this embodiment, the first direction X is perpendicular to the second direction Y; for example, the first direction X is the X-axis direction, and the second direction Y is the Y-axis direction. An input / output module 41 is disposed on the main circuit board 3 and adjacent to the fourth side 34. A capacitor module 42 is adjacent to the third side 33. A rectifier module 43 is disposed on the main circuit board 3 and located between the input / output module 41 and the capacitor module 42, and is adjacent to the input / output module 41 relative to the capacitor module 42. An EMI module 44 is disposed on the main circuit board 3 and located between the capacitor module 42 and the rectifier module 43, and is adjacent to the first side 31. A power semiconductor device module 45 is disposed on the main circuit board 3, located between the capacitor module 42 and the rectifier module 43, and adjacent to the second side 32. A first inductor module 46 is disposed on the main circuit board 3, located between the EMI module 44 and the power semiconductor device module 45, and between the capacitor module 42 and the rectifier module 43, and adjacent to the capacitor module 42 relative to the rectifier module 43. A resonant module 47 is disposed on the main circuit board 3, located between the EMI module 44 and the power semiconductor device module 45, and between the capacitor module 42 and the rectifier module 43, and adjacent to the rectifier module 43 relative to the capacitor module 42.

[0080] As can be seen from the above, the power supply device 1 of this case arranges the first inductor module 46 and the resonant module 47 side by side and adjacent to the power semiconductor device module 45, so that the connection path between the first inductor module 46 and the resonant module 47 and the power semiconductor device module 45 is the shortest, which helps to reduce power loss and improve the space utilization of the power supply device 1.

[0081] Please see Figure 3 This is a schematic block diagram of the layout of the power supply device in the second embodiment of this case. Compared to Figure 1 The power supply device 1 shown in this embodiment has its resonant module 47 partially located between the EMI module 44 and the rectifier module 43, and partially located between the first inductor module 46 and the rectifier module 43. This circuit layout allows for a reduction in the length of the resonant module 47, thereby reducing the overall length of the power supply device 1a. Compared to the first embodiment, the second embodiment is more suitable for application on a wider and shorter main circuit board 3.

[0082] Please see Figure 4 This is a schematic block diagram of the layout of the power supply device in the third embodiment of this case. Compared to Figure 1 The power supply device 1 shown in this embodiment further includes an input connection board 51 and a bus connection board 52. The input connection board 51 is vertically inserted into the first side 31 of the main circuit board 3 to connect to the main circuit board 3, and is used to connect the input / output module 41 and the EMI module 44, so that the input / output module 41 transmits the input signal to the EMI module 44 through the input connection board 51. The bus connection board 52 is vertically inserted into the second side 32 of the main circuit board 3 to connect to the main circuit board 3, and is used to connect the capacitor module 42 and the power semiconductor device module 45. Since the capacitor module 42 is located on the third side 33 of the main circuit board, and the power switches in the power semiconductor device module 45 need to be electrically connected to it, in high-power applications, the traces of the positive and negative terminals of the capacitor need to be implemented by laying a large amount of copper. In addition, there are often driving circuits around the power semiconductor devices. Under the premise of limited size of the power supply device 1b, the connection of the capacitors in the capacitor module 42 and the power semiconductor devices in the power semiconductor device module 45 through the bus connection board 52 can simultaneously meet the requirements of large copper area and saving the size of the power supply device 1b. It should be noted that the lengths of the input connection plate 51 and the busbar connection plate 52 are not limited to those shown in the attached figure; it is sufficient to achieve their respective electrical connections.

[0083] In this embodiment, the input signal passes sequentially through the input / output module 41, the input connection board 51, the EMI module 44, the first inductor module 46, the power semiconductor device module 45, the capacitor module 42, the resonant module 47, the rectifier module 43, and the input / output module 41. This circuit layout results in a shorter signal transmission path when the input signal is converted into an output signal, further reducing the power loss of the power supply device 1 while fully utilizing its space.

[0084] Please see Figure 5 This is a block diagram showing the layout of the power supply device in the fourth embodiment of this case. Compared to Figure 3 The power supply device 1a shown in this embodiment, and the power supply device 1c in this embodiment, further include an input connection board 51 and a bus connection board 52. The input connection board 51 is vertically inserted into the first side 31 of the main circuit board 3 to connect to the main circuit board 3, and is used to connect the input / output module 41 and the EMI module 44, so that the input / output module 41 transmits the input signal to the EMI module 44 through the input connection board 51. The bus connection board 52 is vertically inserted into the second side 32 of the main circuit board 3 to connect to the main circuit board 3, and is used to connect the capacitor module 42 and the power semiconductor device module 45.

[0085] Please see Figure 6 This is a schematic block diagram of the layout of the power supply device according to the fifth embodiment of this case. Compared to Figure 4 The power supply device 1b shown, and the rectifier module 43 of the power supply device 1d in this embodiment, include three transformers 431 and a first filter capacitor 432. Each transformer 431 is also equipped with a set of rectifier switches (not shown) for rectifying the output of the transformer 431. The three transformers 431 are arranged sequentially from the first side 31 of the main circuit board 3 along the second direction Y toward the second side 32. This arrangement of the three transformers 431 results in a shorter output path for the rectifier module 43. The first filter capacitor 432 can be configured as follows: Figure 2 The LLC output capacitor C1 of the LLC module 2c shown is included. The number of first filter capacitors 432 can be set according to actual needs and is not limited here. In this embodiment, the resonant module 47 includes a resonant capacitor plate 471 and a second inductor module 472. The resonant capacitor plate 471 is vertically inserted into the main circuit board 3 for connection to the main circuit board 3, and the resonant capacitor plate 471 is located between the second inductor module 472 and the EMI module 44. Furthermore, multiple resonant capacitors can be disposed on the resonant capacitor plate 471, further reducing the area occupied by the main circuit board 3. In addition, in some embodiments, the position of the resonant capacitor plate 471 can be adjusted according to needs, for example, adjacent to the first inductor module 46, or adjacent to the power semiconductor device module 45, or adjacent to the transformer 431.

[0086] Please seeFigure 7 This is a schematic block diagram of the layout of the power supply device in the sixth embodiment of this case. Compared to Figure 5 The power supply device 1c shown, and the rectifier module 43 of the power supply device 1e in this embodiment, include three transformers 431 and a first filter capacitor 432. Each transformer 431 is also equipped with a set of rectifier switches (not shown) for rectifying the output of the transformer 431. The three transformers 431 are arranged sequentially from the first side 31 of the main circuit board 3 along the second direction Y toward the second side 32. The arrangement of the three transformers 431 makes the output path of the rectifier module 43 shorter. The first filter capacitor 432 can be configured as follows: Figure 2 The LLC output capacitor C1 of the LLC module 2c in the rectifier module 25 shown is located between the three transformers 431 and the input / output module 41. The number of the first filter capacitors 432 can be set according to actual needs and is not limited here. In this embodiment, the resonant module 47 includes a resonant capacitor plate 471 and a second inductor module 472. The resonant capacitor plate 471 has multiple resonant capacitors and is connected to the main circuit board 3. The resonant capacitor plate 471 is located between the second inductor module 472 and the rectifier module 43.

[0087] Please see Figure 8 This is a schematic block diagram of the layout of the power supply device in the seventh embodiment of this case. Compared to Figure 7 The power supply device 1e shown in this embodiment, and the rectifier module 43 of the power supply device 1f in this embodiment, further include three sets of second filter capacitors 433 and three sets of rectifier switches 434. The three sets of second filter capacitors 433 and the three sets of rectifier switches 434 are respectively disposed between the corresponding transformer 431 and the main circuit board 3. The three sets of rectifier switches 434 can constitute Figure 2 The LLC secondary rectifier switch 265 is shown. The three sets of second filter capacitors 433 and the first filter capacitor together constitute... Figure 2 The LLC output capacitor C1 is shown. It should be understood that, without considering cost, the rectifier module also includes multiple filter inductors (not shown), which, together with the filter capacitor, form a CLC filter circuit.

[0088] In some embodiments, the capacitor module may include a capacitor connection board and an energy storage capacitor, as described below. Figure 4 The power supply device 1b shown is illustrated as an example; of course, other embodiments can also be configured in a similar manner. Please refer to... Figure 9 This is a block diagram showing the layout of the power supply device in the eighth embodiment of this case. Compared to Figure 4The power supply device 1b shown in this embodiment, and the capacitor module 42 of the power supply device 1g in this embodiment, further include two capacitor connection plates 421 and multiple energy storage capacitors 422. Of course, the number of capacitor connection plates 421 and the number of energy storage capacitors 422 are not limited, provided that the circuit functions are satisfied. In this embodiment, the two capacitor connection plates 421 are vertically inserted into the main circuit board 3 and connected to the bus connection plate 52 via the main circuit board 3. Each energy storage capacitor 422 is inserted into a corresponding capacitor connection plate 421, and the energy storage capacitor 422 is electrically connected to the power semiconductor device module 45 via the capacitor connection plate 421, the main circuit board 3, and the bus circuit board 52. This further reduces the area occupied by the main circuit board 3 and optimizes the signal transmission path.

[0089] In some embodiments, the capacitor module 42 and the main circuit board 3 may be arranged along a first direction X.

[0090] Please see Figure 10 This is a block diagram showing the layout of the power supply device in the ninth embodiment of this case. Compared to Figure 4 The power supply device 1b shown in this embodiment, and the capacitor module 42 of the power supply device 1h in this embodiment, further include two capacitor connection plates 421 and multiple energy storage capacitors 422. The two capacitor connection plates 421 are vertically inserted onto the bus connection plate 52. Each energy storage capacitor 422 is inserted onto its corresponding capacitor connection plate 421, and the energy storage capacitor 422 is electrically connected to the power semiconductor device module 45 via the capacitor connection plate 421 and the bus circuit board 52. In this embodiment, the main circuit board does not need to be installed at the bottom of the energy storage capacitor 422, thereby reducing the installation area of ​​the main circuit board 3 of the power supply device 1h and decreasing the overall installation cost. It should be understood that, without considering cost, the main circuit board can also be installed at the location of the energy storage capacitor 422.

[0091] Please see Figure 11 This is a block diagram showing the layout of the power supply device according to the tenth embodiment of this case. Compared to Figure 4The power supply device 1b shown in this embodiment, the capacitor module 42 of the power supply device 1i further includes two capacitor connection plates 421, multiple energy storage capacitors 422, and two wires 423. The two capacitor connection plates 421 are respectively connected to the bus connection plate 52 via corresponding wires 423. Each energy storage capacitor 422 is inserted into the corresponding capacitor connection plate 421, and the energy storage capacitor 422 is electrically connected to the power semiconductor device module 45 via the capacitor connection plate 421, the wires 423, and the bus circuit board 52. In another embodiment, the wires 423 can also be connected to the main circuit board 3. In this embodiment, the main circuit board does not need to be set at the bottom of the energy storage capacitor 422, thereby reducing the setting area of ​​the main circuit board 3 of the power supply device 1h, reducing the overall setting cost, and the setting of the wires 423 does not require wave soldering, improving the convenience of the manufacturing process. It should be understood that, without considering cost, the main circuit board can also be set at the position of the energy storage capacitor 422.

[0092] It should be understood that the above embodiments can be applied to air-cooled heat dissipation applications, water-cooled heat dissipation applications, or other applications such as air-cooled and water-cooled hybrid heat dissipation, and the present invention does not limit them.

[0093] Please see Figure 12A , 12B and 12C, of ​​which Figure 12A This is a three-dimensional structural diagram of the power supply system according to the first embodiment of this case. Figure 12B for Figure 12A The side view of the power system shown. Figure 12C for Figure 12A The diagram shows an exploded view of the power supply system. As shown, the power supply system 1j in this embodiment is a single-power supply structure, comprising a main circuit board (first main circuit board 3a), multiple first heating elements 71, and a water-cooled plate 6. The multiple first heating elements 71 are, for example,... Figure 1 The capacitor module 42, rectifier module 43, EMI module 44, power semiconductor device module 45, first inductor module 46, and resonant module 47 shown are disposed on the first main circuit board 3a. The water-cooled plate 6 includes multiple bosses 651 and multiple potting grooves 652. The multiple bosses 651 and multiple potting grooves 652 are disposed on the side of the water-cooled plate 6 facing the first main circuit board 3a, and their positions correspond to and are attached to the first heat-generating element 71 to dissipate heat from the first heat-generating element 71.

[0094] Please see Figure 13A , Figure 13B and Figure 13C ,in Figure 13A This is a three-dimensional structural diagram of the power supply system according to the second embodiment of this case. Figure 13B for Figure 13A The side view of the power system shown. Figure 13C for Figure 13AThe diagram shows an exploded view of the power supply system. As shown, the power supply system 1k in this embodiment has a dual-power supply structure and includes two main circuit boards (a first main circuit board 3a and a second main circuit board 3b), multiple first heating elements 71, multiple second heating elements 72, and a water-cooled plate 6. The first main circuit board 3a and the second main circuit board 3b are arranged opposite each other, that is, each side of the water-cooled plate 6 is an independent power supply. The multiple first heating elements 71 are, for example, Figure 1 The capacitor module 42, rectifier module 43, EMI module 44, power semiconductor device module 45, first inductor module 46, and resonant module 47 shown are mounted on the first main circuit board 3a. The multiple second heating elements 72 are, for example, Figure 1 The capacitor module 42, rectifier module 43, EMI module 44, power semiconductor device module 45, first inductor module 46, and resonant module 47 shown are disposed on the second main circuit board 3b, wherein multiple first heating elements 71 and multiple second heating elements 72 are located between the first main circuit board 3a and the second main circuit board 3b. A water-cooled plate 6 is located between the first main circuit board 3a and the second main circuit board 3b, and the water-cooled plate 6 includes multiple bosses 651 and multiple potting grooves 652. The multiple bosses 651 and multiple potting grooves 652 are respectively disposed on opposite sides of the water-cooled plate 6. The multiple bosses 651 and multiple potting grooves 652 located between the water-cooled plate 6 and the first main circuit board 3a are positioned corresponding to and attached to the first heating elements 71 to dissipate heat from the first heating elements 71; the multiple bosses 651 and multiple potting grooves 652 located between the water-cooled plate 6 and the second main circuit board 3b are positioned corresponding to and attached to the second heating elements 72 to dissipate heat from the second heating elements 72.

[0095] Please see Figure 14This is a block diagram showing the layout of the power supply device according to the eleventh embodiment of this case. Specifically, the input / output module 41 of the power supply device 1m in this embodiment is disposed on the main circuit board 3 and adjacent to the fourth side 34. The capacitor module 42 is adjacent to the third side 33. The rectifier module 43 is disposed on the main circuit board 3 and is located between the input / output module 41 and the capacitor module 42, and is adjacent to the input / output module 41 relative to the capacitor module 42. The EMI module 44 is disposed on the main circuit board 3 and is located between the capacitor module 42 and the input / output module 43, and is adjacent to the first side 31. The power semiconductor device module 45 is disposed on the main circuit board 3 and is located between the capacitor module 42 and the rectifier module 43, and is adjacent to the second side 32. The first inductor module 46 is disposed on the main circuit board 3 and is located between the EMI module 44 and the power semiconductor device module 45, and is located between the capacitor module 42 and the rectifier module 43, and is adjacent to the capacitor module 42 relative to the rectifier module 43. The resonant module 47 is disposed on the main circuit board 3, located between the EMI module 44 and the power semiconductor device module 45, and between the capacitor module 42 and the rectifier module 43, and adjacent to the rectifier module 43 relative to the capacitor module 42. Furthermore, in some embodiments, Figure 4 , Figure 9 , Figure 10 , Figure 11 Alternatively, the layout of this embodiment can be used to further omit the input connection board 51, thereby improving space utilization.

[0096] In summary, the EMI module of the power supply device in this case is located between the capacitor module and the input / output module, and the first inductor module, resonant module and power semiconductor device module are located between the capacitor module and the rectifier module. Furthermore, the first inductor module and resonant module are positioned adjacent to the power semiconductor device module, thereby shortening the connection paths between the first inductor module and resonant module and the power semiconductor device module, thus improving the space utilization within the power supply device, optimizing the signal transmission path, and effectively improving efficiency.

Claims

1. A power supply device, comprising: A main circuit board includes a first side, a second side, a third side and a fourth side, the first side and the second side are disposed opposite to each other and extend along a first direction, and the third side and the fourth side are disposed opposite to each other and extend along a second direction. An input / output module is mounted on the main circuit board and is adjacent to the fourth side; A capacitor module is located adjacent to the third side; A rectifier module is disposed on the main circuit board, located between the input / output module and the capacitor module, and adjacent to the input / output module; as well as An EMI module is mounted on the main circuit board and located between the capacitor module and the input / output module; A first inductor module, a resonant module, and a power semiconductor device module are all mounted on the main circuit board and located between the capacitor module and the rectifier module.

2. The power supply device as claimed in claim 1, wherein the EMI module is adjacent to the first side, the power semiconductor device module is adjacent to the second side, the first inductor module and the resonant module are respectively located between the EMI module and the power semiconductor device module, wherein the first inductor module is adjacent to the capacitor module, and the resonant module is adjacent to the rectifier module.

3. The power supply device as claimed in claim 1, wherein the EMI module is adjacent to the first side and located between the capacitor module and the rectifier module, the power semiconductor device module is adjacent to the second side, the first inductor module is located between the EMI module and the power semiconductor device module and adjacent to the capacitor module, and the resonant module is located between the EMI module and the rectifier module and between the first inductor module and the rectifier module.

4. The power supply device as claimed in claim 1, wherein the power supply device includes an input connection board connected to the main circuit board and located on the first side, wherein the input / output module transmits input signals to the EMI module via the input connection board.

5. The power supply device as claimed in claim 1, wherein the power supply device includes a busbar connection board connected to the main circuit board and located on the second side, wherein the capacitor module is connected to the power semiconductor device module via the busbar connection board.

6. The power supply device of claim 1, wherein the rectifier module includes at least one transformer, at least one filter capacitor and a plurality of rectifier switches, the at least one transformer being arranged sequentially from the first side toward the second side along the second direction.

7. The power supply device of claim 6, wherein the at least one filter capacitor includes at least one first filter capacitor, the at least one first filter capacitor being disposed between the at least one transformer and the input / output module.

8. The power supply device as claimed in claim 7, wherein the at least one filter capacitor further includes at least one second filter capacitor, and the at least one second filter capacitor and the plurality of rectifier switches are respectively disposed between the corresponding transformer and the main circuit board.

9. The power supply device as claimed in claim 1, wherein the resonant module includes a resonant capacitor plate and a second inductor module, wherein the resonant capacitor plate has a plurality of resonant capacitors, and the resonant capacitor plate is connected to the main circuit board.

10. The power supply device of claim 9, wherein the resonant capacitor plate is located between the second inductor module and the EMI module.

11. The power supply device of claim 9, wherein the resonant capacitor plate is located between the second inductor module and the rectifier module.

12. The power supply device of claim 1, wherein the capacitor module includes at least one capacitor connection plate and a plurality of energy storage capacitors, each of the energy storage capacitors being inserted into the corresponding capacitor connection plate and electrically connected to the power semiconductor device module.

13. The power supply device of claim 12, wherein the capacitor module is disposed on the main circuit board, and the at least one capacitor connection plate is vertically connected to the main circuit board.

14. The power supply device of claim 12, wherein the at least one capacitor connection plate is connected to a bus connection plate for electrical connection with the power semiconductor device module, wherein the bus connection plate is connected to the main circuit board and is located on the second side.

15. The power supply device of claim 12, wherein the capacitor module includes a wire, and the at least one capacitor connection plate is electrically connected to the power semiconductor device module via the wire.

16. The power supply device of claim 1, wherein the input / output module includes an input terminal and an output terminal, the input terminal being connected to the EMI module and the output terminal being connected to the rectifier module.

17. The power supply device of claim 1, wherein the first inductor module and a portion of the power semiconductor device module constitute a PFC circuit, and the resonant module, the remaining portion of the power semiconductor device module, and the rectifier module constitute an LLC circuit.

18. A power supply system, comprising: At least one power supply device as claimed in claim 1; and A water-cooled plate, of which, At least one side of the water-cooled plate includes multiple bosses and multiple glue-filling grooves; The water-cooled plate includes the plurality of bosses and the plurality of glue-filling grooves, the side of which is attached to the at least one power supply device.

19. The power supply system of claim 18, wherein the boss and the potting groove are in contact with the heating element in the at least one power supply device.

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