A heat dissipation device based on bellows liquid metal cell array and manufacturing process

Abstract

This invention relates to the field of thermal control technology for aerospace electronic equipment, and discloses a heat dissipation device and manufacturing process based on a corrugated liquid metal unit array. The heat dissipation device includes several corrugated metal units, a heat sink substrate located at the top of the corrugated metal units, and a unit base plate located at the bottom of the corrugated metal units. The number and position of the corrugated metal units are matched with those of the components on the component substrate. Each corrugated metal unit includes one or more corrugated metals. One side of each corrugated metal is sealed to the heat sink substrate, and the other side is sealed to the unit base plate. The corrugated metals are filled with liquid metal for heat transfer. This invention achieves pressure control and efficient heat conduction by independently elastically deforming the corrugated metal units to adaptively compensate for the height differences of the electronic components below, thus solving the problems existing in the heat dissipation design of spacecraft electronics boxes.

Description

Technical Field

[0001] This invention relates to the field of thermal control technology for aerospace electronic equipment, specifically to a heat dissipation device and manufacturing process based on a corrugated liquid metal unit array. Background Technology

[0002] The thermal design of electronics enclosures in high-orbit spacecraft is a typical complex multidisciplinary challenge. With the continuous advancement of aerospace technology, the power density of aerospace electronic equipment is constantly increasing, and the requirements of space missions are becoming increasingly stringent. This presents numerous challenging issues for the thermal design of electronics enclosures, among which space particle radiation, extreme temperature cycling, and mechanical stress caused by inconsistent soldering heights of PCB components are particularly prominent, severely restricting the stable operation and long-term reliability of aerospace electronic equipment.

[0003] The challenges of heat dissipation design for electronics enclosures in high-orbit spacecraft are complex and diverse. The rampant presence of high-energy charged particles in space can trigger single-event effects and total dose effects on components, directly threatening their long-term reliability. Extreme temperature cycling ranges from -55℃ to +125℃, and this huge temperature difference causes a mismatch in the thermal expansion coefficients of materials, resulting in alternating thermal stress. In multi-chip component packages, the soldering height difference between different PCB components can reach 0.4mm, potentially causing localized stress concentration.

[0004] Currently, the integrated heat dissipation designs commonly used in aerospace electronic equipment, such as metal substrates, thermally conductive silicone, and elastic thermally conductive materials like metal spring composite structures, all have significant shortcomings. While integrated thermal interface materials can adapt to height differences to some extent, their thermal conductivity is typically below 5 W / (m·K), becoming a major thermal resistance bottleneck in the heat dissipation path. Moreover, under long-term temperature cycling, silicone-based materials are prone to stress relaxation and aging, leading to decreased contact pressure and increased contact thermal resistance. Metal springs provide elasticity, but their contact with the component surface is a rigid point / line contact, resulting in extremely high contact thermal resistance. While vapor chambers have excellent thermal conductivity, they are rigid structures that cannot adapt to height differences; forcibly pressing them can damage parts of the PCB board or components.

[0005] The functionally graded materials proposed in patent application CN117612744A attempt to achieve performance transition at the material level, but they are difficult to control precisely at the microscale and cannot adapt to the independent height changes of each component. Another patent application CN110211744A achieves radiation protection through system architecture optimization, but it does not address the key mechanical problem of precise control of installation stress. Summary of the Invention

[0006] To address existing problems, this invention provides a heat dissipation device based on a bellows-type liquid metal unit array. It aims to solve problems in the heat dissipation design of electronic boxes in high-orbit spacecraft, such as stress concentration caused by varying component heights, the contradiction between thermal conductivity and flexibility, and insufficient long-term reliability. This device achieves precise pressure control and efficient heat conduction by independently compensating for the height differences of the electronic components below through the independent elastic deformation of the metal bellows units. Through a discrete distributed design, it achieves excellent heat dissipation performance, adaptive mechanical stress capability, and long-life reliability, making it particularly suitable for the thermal management of aerospace electronic equipment.

[0007] To achieve the above objectives, the present invention provides the following technical solution.

[0008] This invention provides a heat dissipation device based on a corrugated liquid metal unit array, comprising a plurality of metal corrugated unit units, a heat sink substrate located at the top of the metal corrugated unit units, a unit base plate located at the bottom of the metal corrugated unit units, a fine-adjusting nut, a fine-adjusting screw, and a pressure sensor; the number and position of the metal corrugated unit units are matched with those of the components on the component substrate, and each metal corrugated unit includes one or more metal corrugated tubes; one side of each metal corrugated tube is sealed to the heat sink substrate, and the other side is sealed to the unit base plate; the interior of each metal corrugated tube is filled with liquid metal for heat transfer; the fine-adjusting nut is located at the center of the unit base plate and is fixedly connected to the unit base plate; the fine-adjusting screw passes through a hole on the heat sink substrate that matches the metal corrugated unit and engages with the fine-adjusting nut; the fine-adjusting nuts and fine-adjusting screws arranged in the same metal corrugated unit engage with each other; the pressure sensor is located between the unit base plate and the component substrate.

[0009] As a further improvement of the present invention, the plurality of metal bellows in the metal bellows unit are arranged in a centrally symmetrical manner.

[0010] As a further improvement of the present invention, the metal bellows is made of one or more of phosphor bronze, stainless steel and beryllium copper alloy.

[0011] As a further improvement of the present invention, the liquid metal is a gallium-based alloy; the melting point of the gallium-based alloy is below -10°C.

[0012] As a further improvement of the present invention, the liquid metal has a space filling rate of 85%-95% within the metal bellows.

[0013] As a further improvement of the present invention, a shielding block is also included; the position of the shielding block matches the position of the metal bellows unit, and the shielding block is disposed on the side of the heat sink substrate away from the metal bellows unit.

[0014] The present invention also provides a method for using a heat dissipation device based on a corrugated liquid metal unit array, comprising the following steps: assembling a metal corrugated unit, a heat sink substrate, and a unit base plate, ensuring that one side of the metal corrugated tube is sealed to the heat sink substrate and the other side is sealed to the unit base plate; by adjusting the extension and retraction of the metal corrugated tube, multiple metal corrugated units are made to fit tightly against the components on their corresponding component substrates.

[0015] The present invention also provides a manufacturing process for a heat dissipation device based on a bellows liquid metal unit array, comprising the following steps:

[0016] The metal bellows are formed by precision stamping and then recrystallized and annealed to eliminate internal stress.

[0017] A fixed amount of liquid metal alloy is filled into the metal bellows under conditions where the oxygen content is less than 1 ppm.

[0018] Pulsed laser welding is used to seal the opening of the metal bellows;

[0019] The sealed metal bellows unit was tested using a helium mass spectrometer leak detector to ensure a leakage rate of less than 1×10⁻⁶. -9 Pa·m 3 / s;

[0020] The qualified metal bellows unit array is integrated onto the heat sink substrate by electron beam welding, and finally the overall flatness is processed to ensure that the flatness is less than 0.1mm.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] This device utilizes a metal bellows unit for precise heat dissipation of components. Liquid metal flows within the bellows, rapidly and evenly transferring heat from the heat-generating components to the heat sink substrate in an aerospace environment, thus effectively improving heat dissipation efficiency. The elastic deformation of the bellows buffers external vibrations and allows for adjustment of the gap between the unit base plate and the components, ensuring ample space for heat transfer. It also creates a "pumping" circulation effect on the liquid metal, enhancing heat exchange uniformity and efficiency. A fine-tuning nut is positioned at the center of the unit base plate, and corresponding fine-tuning screws are located on the heat sink substrate at the bellows unit positions, working in tandem. This design allows for adjustment of the gap between the unit base plate and each component during installation and use, better adapting to different installation environments and requirements to avoid localized compression or excessive gaps, ensuring a tight fit between the unit base plate and the components. Pressure sensors are installed on both the unit base plate and the component substrate to monitor the pressure between them in real time. During the operation of the heat dissipation device, abnormal pressure (such as excessive or insufficient pressure) may affect the normal operation of the metal bellows, thereby affecting the flow of liquid metal and the heat transfer effect. Timely pressure signal feedback from a pressure sensor allows for rapid detection of problems and appropriate adjustments, such as adjusting the fine-tuning nut and screw, to ensure the normal operation of the heat dissipation device and prevent heat dissipation failure or damage to the heat dissipation device and electronic equipment due to pressure issues.

[0023] Preferably, the metal bellows in the metal bellows unit are arranged in a centrally symmetrical manner. This layout allows for more uniform heat transfer within the unit, preventing localized heat concentration and damage to components due to uneven thermal expansion and contraction. During the flow of liquid metal, a more stable heat transfer path is formed, improving the uniformity and stability of the entire heat dissipation device, thereby enhancing heat dissipation performance and extending the lifespan of electronic equipment.

[0024] Preferably, the metal bellows is made of one or more of phosphor bronze, stainless steel, or beryllium copper alloy, which have good thermal conductivity, corrosion resistance, and mechanical properties. Good thermal conductivity ensures rapid heat transfer from the metal bellows to the liquid metal; corrosion resistance allows the metal bellows to operate stably for extended periods in various working environments (such as humid or chemically exposed environments) without easily being damaged; and the mechanical properties ensure that the metal bellows will not deform or break under certain external forces, thus ensuring the reliability and stability of the heat dissipation device.

[0025] Preferably, the liquid metal is a gallium-based alloy. Gallium-based alloys have a high thermal conductivity. Compared with some other liquid materials, they can quickly absorb the heat transferred from the components by the metal bellows and rapidly diffuse the heat, accelerating the entire heat dissipation process and effectively improving the heat dissipation performance of the heat dissipation device to meet the high-efficiency heat dissipation requirements of electronic devices. The melting point of gallium-based alloys is below -10°C, which means that gallium-based alloys can remain liquid in low-temperature environments.

[0026] Preferably, this allows the heat dissipation device to function normally in low-temperature working scenarios (such as cold outdoor environments, low-temperature laboratories, etc.), expanding the applicable temperature range of the heat dissipation device and enhancing its reliability and stability in different environments.

[0027] Preferably, the liquid metal fills 85%-95% of the space within the metal bellows. Within this range, sufficient liquid metal is ensured for effective heat transfer while maintaining adequate flow space within the bellows. If the fill rate is too low, insufficient liquid metal will reduce heat transfer efficiency; conversely, if the fill rate is too high, insufficient flow space will increase flow resistance, also affecting heat transfer. Therefore, this fill rate range optimizes the flow of liquid metal and the heat transfer process, improving heat dissipation efficiency.

[0028] Preferably, a shielding block is placed on the side of the heat sink substrate away from the metal bellows unit, corresponding to the position of the metal bellows unit. This effectively shields the electromagnetic interference that the metal bellows unit may generate during operation. Components in electronic devices are highly sensitive to electromagnetic interference; excessive electromagnetic interference may affect the normal operation of components, leading to performance degradation or even damage to the device. The shielding block reduces the impact of electromagnetic interference on surrounding electronic components, improving the stability and reliability of the entire electronic device.

[0029] The method of using this invention involves rotating a fine-tuning screw to ensure that multiple metal bellows units are in close contact with the components on their corresponding component substrates. This operation ensures that each metal bellows unit can make good contact with its corresponding component, allowing heat to be transferred evenly and efficiently from each component to the metal bellows unit. This avoids local heat concentration that could lead to pressure damage, thereby improving the heat dissipation uniformity and efficiency of the entire heat dissipation device and enhancing the heat dissipation effect.

[0030] In the manufacturing process of this invention, the metal bellows is precision stamped and then recrystallized and annealed, which eliminates internal stress, improves its toughness and dimensional stability, and facilitates subsequent processing. Liquid metal alloy is filled using a precision injection pump in a low-oxygen vacuum glove box, avoiding oxidation, ensuring alloy purity and performance, and allowing for precise control of the filling amount. Pulsed laser welding seals the openings, resulting in good sealing performance, a small heat-affected zone, and ensuring the integrity of the bellows structure. Helium mass spectrometry leak detection ensures an extremely low leakage rate, preventing liquid metal leakage from affecting heat dissipation and safety. Electron beam welding integrates the metal bellows unit array to the component substrate, resulting in a strong connection and minimal heat-affected zone. Overall flatness processing ensures a flatness of less than 0.1 mm, guaranteeing good fit with components and improving the heat dissipation efficiency and reliability of the heat dissipation device. Attached Figure Description

[0031] The accompanying drawings described herein are for illustrative purposes only and are not intended to limit the scope of the invention in any way. Furthermore, the shapes and proportions of the components in the drawings are merely schematic to aid in understanding the invention and are not intended to specifically limit the shapes and proportions of the components. In the drawings:

[0032] Figure 1 This is a schematic diagram of a heat dissipation device based on a bellows liquid metal unit array in Example 1;

[0033] Figure 2 This is a schematic diagram of the metal bellows before and after adjustment in Example 1;

[0034] Figure 3 This is a schematic diagram showing the height difference between a heat dissipation device based on a bellows liquid metal unit array and multiple components after assembly in Example 4.

[0035] Figure 4 This is a step diagram illustrating the usage method of a heat dissipation device based on a corrugated pipe liquid metal unit array in Example 4;

[0036] Figure 5 This is a flowchart illustrating the manufacturing process of a heat dissipation device based on a corrugated pipe liquid metal unit array in Example 5.

[0037] The components include: 1. Metal bellows unit; 2. Heat sink substrate; 3. Unit base plate; 4. Components; 5. Metal bellows; 6. Liquid metal; 7. Fine-tuning nut; 8. Fine-tuning screw; 9. Shielding block; 10. Metal welding plate; 11. Component substrate. Detailed Implementation

[0038] To enable those skilled in the art to better understand the technical solutions of this invention, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this invention.

[0039] It should be noted that when an element is referred to as being "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only embodiments.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0041] Example 1

[0042] like Figure 1 As shown, this embodiment provides a heat dissipation device based on a corrugated liquid metal unit array, including several metal corrugated unit 1, a heat sink substrate 2 located on top of the metal corrugated unit 1, and a unit base plate 3 located at the bottom of the metal corrugated unit 1. The corrugated unit achieves reliable sealing through high-energy beam welding (such as laser welding or electron beam welding) and is integrated onto the heat sink substrate 2 by brazing or electron beam welding.

[0043] Optionally, a metal welding plate 10 may be provided between the heat sink substrate 2 and the metal bellows unit 1 to facilitate welding the two together.

[0044] Each of the aforementioned metal bellows units 1 corresponds to a component 4 on the component substrate 11. When the device is pressed onto components 4 of varying heights, each bellows unit acts like a miniature "spring," independently stretching and providing a contact force matching the amount of stretching, thereby automatically achieving precise stress control. Through discretely distributed independent adaptive units, independent adaptation to the height of each electronic component 4 is achieved, thereby realizing precise pressure distribution control, efficient heat conduction, and integrated local radiation resistance, fundamentally solving the problem of coordinated thermal-mechanical-radiation control faced by high-orbit electronics boxes.

[0045] The number and position of the metal bellows units are matched with those of the components on the component substrate. Each metal bellows unit 1 includes one or more metal bellows 5, a fine-tuning nut 7, and a fine-tuning screw 8. The metal bellows 5 are formed by laser welding multiple stacked metal bellows sheets. One side of the metal bellows 5 is sealed to the heat sink substrate 2, and the other side is sealed to the unit base plate 3. Multiple independent and discretely distributed bellows units are fixed to the bottom surface of the heat sink substrate 2. Specifically, in this embodiment, there are four metal bellows 5 arranged in a rectangular array. Each bellows unit is a sealed miniature adaptive "heat-to-force converter". The units can be evenly distributed in a rectangular array, or a non-uniform array distribution can be adopted according to the layout of the components 4 below. Preferably, the metal bellows 5 in the metal bellows unit 1 are arranged in a centrally symmetrical manner.

[0046] In this embodiment, the center-to-center spacing of each corrugated pipe unit is 12mm, and they are evenly distributed in a rectangular array.

[0047] Specifically, the heat sink substrate 2 serves as the main structural support and the final heat diffusion path. It can be made of a high thermal conductivity material such as silicon carbide aluminum (SiC / Al) composite material. The dimensions of the heat sink substrate 2 are 150mm × 100mm × 10mm.

[0048] The metal bellows 5 is made of a highly elastic metal material (such as phosphor bronze, stainless steel, or beryllium copper alloy) to provide axial compliance and restoring force. In this embodiment, the metal bellows 5 has a wall thickness of 0.05-0.2 mm, an outer diameter of 2-6 mm, and a height of 2-5 mm. The metal bellows 5 is made of one or more of phosphor bronze, stainless steel, or beryllium copper alloy. In this embodiment, the metal bellows 5 is made of phosphor bronze C51000, with a wall thickness of 0.1 mm, an outer diameter of 4 mm, and a height of 3 mm.

[0049] The metal bellows 5 is filled with liquid metal 6 for heat transfer. In this embodiment, the liquid metal 6 is a gallium indium tin alloy. After heat is transferred from the component 4 to the liquid metal 6, the fluidity of the liquid metal 6 creates a passive "pumping" circulation effect inside the bellows, combining convection and conduction—two highly efficient heat transfer modes—to rapidly diffuse heat to the bellows wall and then conduct it to the heat sink substrate 2. This is a passive "pumping" effect, where contact pressure drives micro-deformation of the bellows, inducing internal flow of the liquid metal 6. The liquid metal 6 is sealed inside the metal bellows 5, serving as the core heat transfer medium. The filling rate of the liquid metal 6 is recommended to be between 85% and 95% to allow for thermal expansion. In this embodiment, the filling rate of the gallium indium tin alloy is approximately 90%. Its fluidity allows heat to be rapidly transferred to the bellows wall through convection within the unit, and then guided to the heat sink substrate 2 via lateral thermal diffusion through the bellows wall.

[0050] Preferably, the liquid metal 6 is a gallium-based alloy; the gallium-based alloy (such as gallium indium tin alloy) has a melting point below -10°C. Its thermal conductivity is typically not less than 25 W / m·K.

[0051] The fine-tuning nut 7 is located at the center of the unit base plate 3 and is fixedly connected to the unit base plate 3. The fine-tuning screw 8 passes through a hole on the radiator substrate 2 that matches the metal bellows unit 1 and engages with the fine-tuning nut 7. Fine-tuning nuts and fine-tuning screws arranged in the same metal bellows unit engage with each other. Specifically, the pitch of the fine-tuning screw 8 is no greater than 0.5mm (e.g., an M1.6 screw with a pitch of 0.35mm), and the fine-tuning screw 8 is continuously adjustable in height within the range of 0-1.0mm. By rotating the screw, a displacement of 0.35mm can be produced in a single turn, achieving a precise fine-tuning of approximately 0.05mm. The fine-tuning nut 7 and fine-tuning screw 8 can be used to apply independent pre-tension force to a single or a group of bellows adaptive units to compensate for greater height differences. Figure 2 As shown, the height difference ΔH1 = H1 - H0, where H1 is the distance between the heat sink substrate 2 and the component 4, and H0 is the length of the metal corrugated pipe 5.

[0052] When the device is pressed onto components 4 of varying heights, each bellows unit stretches independently, increasing its internal pressure. The contact force provided is non-linearly related to the amount of stretching, thus achieving a smooth transition from "soft contact" (initial low-pressure adaptation) to "hard contact" (operating high-pressure protection), and precisely controlling the pressure at each point within a safe range of 0.5-1.2 MPa.

[0053] Heat from component 4 is transferred through the bottom of the metal bellows unit 1, stimulating convection within the liquid metal 6. The heat is then rapidly transferred to the entire inner wall of the bellows and diffused to a larger contact area through lateral thermal conduction within the bellows wall, ultimately being efficiently transferred to the heat sink substrate 2. This path cleverly combines two efficient heat transfer modes: convection and conduction.

[0054] Example 2

[0055] The main difference between this embodiment and Embodiment 1 is:

[0056] It also includes a shielding block 9; the position of the shielding block 9 matches the position of the metal bellows unit 1, and the shielding block 9 is disposed on the side of the heat sink substrate 2 away from the metal bellows unit 1.

[0057] On the heat sink substrate 2, locally thickened radiation-resistant shielding blocks 9 can be integrated at the locations of radiation-sensitive components 4 (such as FPGAs and memory chips). The material of the shielding blocks 9 can be a high-density metal such as tungsten, tantalum, or molybdenum. In this embodiment, the shielding blocks 9 are integrated on the component substrate 11 at the locations of the FPGA and memory chips; the shielding blocks 9 are 0.5 mm thick tantalum foil.

[0058] Example 3

[0059] The main difference between this embodiment and Embodiment 1 is:

[0060] It also includes a pressure sensor; the pressure sensor is disposed between the unit base plate 3 and the component substrate 11.

[0061] During installation, a thin-film pressure sensor pad is placed between the heat dissipation device (the unit base plate 3) and the PCB board (component substrate 11) to monitor the pressure distribution;

[0062] Tighten the mounting screws using the step torque method: apply torques of 0.3 N·m (initial tightening), 0.6 N·m (intermediate tightening), and 0.9 N·m (final tightening) in sequence.

[0063] In this embodiment, the verification results show that the pressure at each component's contact point is uniformly distributed within the ideal range of 0.5-1.2 MPa.

[0064] By employing this method, the discretely distributed metal bellows units 1 can deform independently, achieving precise adaptation to components 4 with varying heights. Pressure distribution uniformity is greater than 90%, effectively eliminating localized stress concentrations. Utilizing the excellent thermal conductivity of liquid metal 6, combined with passive convection induced by deformation within the metal bellows, the contact thermal resistance is significantly reduced (down to 0.05-0.12 K·cm). 2 / W), improving overall heat dissipation efficiency by more than 40%.

[0065] Pressure sensors are installed on the unit base plate 3 and the component substrate 11 to monitor the pressure between them in real time. During the operation of the heat dissipation device, abnormal pressure (such as excessive or insufficient pressure) may affect the normal operation of the metal bellows 5, thereby affecting the flow of liquid metal 6 and the heat transfer effect. During the assembly and testing phase, timely pressure signal feedback from the pressure sensors allows for rapid detection of problems and corresponding adjustments, such as adjusting the fine-tuning nut 7 and fine-tuning screw 8, ensuring the normal operation of the heat dissipation device and preventing heat dissipation failure or damage to the heat dissipation device and electronic equipment due to pressure issues.

[0066] Example 4

[0067] like Figure 4As shown, this embodiment discloses a method for using a heat dissipation device based on a corrugated liquid metal unit array, including the following steps: assembling a metal corrugated unit 1, a heat sink substrate 2, and a unit base plate 3, ensuring that one side of the metal corrugated pipe 5 is sealed to the heat sink substrate 2 and the other side is sealed to the unit base plate 3.

[0068] By adjusting the expansion and contraction of the metal bellows 5, multiple metal bellows units 1 are made to fit tightly with the components 4 on their corresponding component substrates 11.

[0069] Rotate the fine-tuning screw 8, as follows Figure 2 As shown, before the state adjustment on the left side, ΔH1 = H1 - H0 > 0, and after the state adjustment on the right side, ΔH1 = 0.

[0070] Specifically, a 3D scan is performed on the assembled PCB board to determine the height difference of component 4 (this difference is determined by its height relative to the surface height of standard component 4, i.e., ...). Figure 3 The height of the metal bellows unit 1 on the left (at this time, no adjusting screw needs to be turned) is 0.3mm (e.g. Figure 3 (Metal bellows unit 1, left 2); Based on the height difference of component 4, the initial pre-stretch amount (ΔH1) of the bellows unit is set to 0.3mm;

[0071] For the metal bellows unit corresponding to component 4 with a height difference of 0.1mm (such as...) Figure 3 The metal bellows unit 1 (left 3) is pre-stretched by 0.1 mm by rotating the fine-tuning screw 8 on it.

[0072] For the metal bellows unit corresponding to component 4 with a height difference of 0.2mm (such as...) Figure 3 The metal bellows unit 1 (left 3) is pre-stretched by 0.2 mm by rotating the fine-tuning screw 8 on it.

[0073] By turning the adjusting screws of different metal bellows units 1, multiple metal bellows units 1 can be tightly fitted with the components 4 on their corresponding component substrates 11.

[0074] The all-metal structure (metal bellows 5 and liquid metal 6) in this embodiment exhibits stable performance under extreme temperature cycling (-55℃ to +125℃), with performance degradation of less than 3% after 1000 cycles, meeting the requirements for long lifespan of spacecraft (e.g., 15 years).

[0075] Discrete units can effectively absorb and disperse vibration energy, exhibiting excellent vibration resistance. The integrated local shielding design can specifically reduce the radiation dose to sensitive components by 50%-70%.

[0076] Example 5

[0077] like Figure 5 As shown, this embodiment also provides a manufacturing process for a heat dissipation device based on a bellows liquid metal unit array, including the following steps:

[0078] The metal bellows 5 is formed by precision stamping and then recrystallized and annealed to eliminate internal stress.

[0079] In a vacuum glove box with an oxygen content of less than 1 ppm, a precise injection pump is used to fill a metal bellows 5 with a measured amount of liquid metal alloy 6.

[0080] The five openings of the metal bellows are sealed using pulsed laser welding.

[0081] The sealed metal bellows unit 1 was tested using a helium mass spectrometer leak detector, with a required leakage rate of less than 1 × 10⁻⁶. -9 Pa·m 3 / s;

[0082] The qualified metal bellows unit 1 is arrayed and integrated onto the heat sink substrate 2 by electron beam welding. Finally, the overall flatness is processed to ensure that the flatness is less than 0.1mm.

[0083] Liquid metal alloy 6 is filled using a precision injection pump in a low-oxygen vacuum glove box, which avoids oxidation, ensures alloy purity and performance, and allows for precise control of the filling amount. Pulsed laser welding seals the opening, resulting in good sealing performance, a small heat-affected zone, and ensuring the integrity of the bellows structure.

[0084] In this embodiment, the heat sink substrate 2 can be made of high-purity alumina ceramic substrate or carbon fiber reinforced polymer (CFRP) substrate, the latter of which can be made by fiber layup process; the unit base plate 3 can be made of aluminum alloy or titanium alloy and made by die casting process.

[0085] The above embodiments are merely one of the implementation methods for achieving the technical solution of the present invention. The scope of protection claimed by the present invention is not limited to this embodiment, but also includes any variations, substitutions and other implementation methods that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention.

Claims

1. A heat dissipation device based on a bellows liquid metal unit array, characterized in that, The system includes several metal bellows units (1), a heat sink substrate (2) located on top of the metal bellows units (1), a unit base plate (3) located at the bottom of the metal bellows units (1), a fine-tuning nut (7), a fine-tuning screw (8), and a pressure sensor; the number and position of the metal bellows units (1) are matched with the number of components (4) on the component substrate (11), and each metal bellows unit (1) includes one or more metal bellows (5); one side of the metal bellows (5) is sealed to the heat sink substrate (2), and the other side is sealed to the unit base plate (3). The metal bellows (5) is filled with liquid metal (6) for heat transfer; the fine-tuning nut (7) is located at the center of the unit base plate (3) and is fixedly connected to the unit base plate (3); the fine-tuning screw (8) passes through the hole on the heat sink substrate (2) that matches the metal bellows unit (1) and cooperates with the fine-tuning nut (7); the fine-tuning nut (7) and the fine-tuning screw (8) arranged in the same metal bellows unit (1) cooperate with each other; the pressure sensor is located between the unit base plate (3) and the component substrate (11).

2. The heat dissipation device based on a corrugated pipe liquid metal unit array according to claim 1, characterized in that, The multiple metal bellows (5) in the metal bellows unit (1) are arranged in a centrally symmetrical manner.

3. The heat dissipation device based on a corrugated pipe liquid metal unit array according to claim 1, characterized in that, The metal bellows (5) is made of one or more of phosphor bronze, stainless steel and beryllium copper alloy.

4. A heat dissipation device based on a bellows liquid metal unit array according to claim 1, characterized in that, The liquid metal (6) is a gallium-based alloy; the melting point of the gallium-based alloy is below -10°C.

5. A heat dissipation device based on a bellows liquid metal unit array according to claim 1, characterized in that, The liquid metal (6) fills 85%-95% of the space within the metal bellows (5).

6. A heat dissipation device based on a corrugated pipe liquid metal unit array according to claim 1, characterized in that, It also includes a shielding block (9); the position of the shielding block (9) matches the position of the metal bellows unit (1), and the shielding block (9) is disposed on the side of the heat sink substrate (2) away from the metal bellows unit (1).

7. A method of using a heat dissipation device based on a corrugated pipe liquid metal unit array according to claims 1 to 6, characterized in that, Includes the following steps: Assemble the metal corrugated pipe unit (1), the heat sink base plate (2), and the unit base plate (3) to ensure that one side of the metal corrugated pipe (5) is sealed to the heat sink base plate (2) and the other side is sealed to the unit base plate (3). By adjusting the expansion and contraction of the metal bellows (5), multiple metal bellows units (1) are made to fit tightly with the components (4) on their corresponding component substrates (11).

8. The manufacturing process of the heat dissipation device based on a corrugated liquid metal unit array according to any one of claims 1 to 6, characterized in that, Includes the following steps: The metal corrugated pipe (5) is formed by precision stamping process and then recrystallization annealing is performed to eliminate internal stress. Under conditions where the oxygen content is less than 1 ppm, a fixed amount of liquid metal (6) is filled into the metal bellows (5); The opening of the metal bellows (5) is sealed by pulsed laser welding; The sealed metal bellows unit (1) was tested to ensure that the leakage rate was below 1×10⁻⁶. -9 Pa·m 3 / s; The qualified metal bellows unit (1) array is integrated onto the heat sink substrate (2) by electron beam welding, and finally the overall flatness is processed to ensure that the flatness is less than 0.1mm.

Images