A transfer device and an edge erosion machine

Abstract

The present application relates to the technical field of semiconductor manufacturing, and in particular to a transfer device and an edge etching machine. The transfer device comprises a horizontal slide, a mechanical shaft, a tooling and a second rotary drive module, wherein: the horizontal slide is installed on a machine body; the upper end of the mechanical shaft and the second rotary drive module are both installed on the horizontal slide; the tooling comprises a containing frame, a clamping plate and two pressing plates, the containing frame is fixedly arranged on the lower end of the mechanical shaft, a plurality of wafers are sequentially stacked along a first center line in the containing frame, a clamping plate is clamped between every two adjacent wafers in the containing frame, and the two pressing plates are used for clamping all the wafers and all the clamping plates in the containing frame; and the second rotary drive module is configured to drive the two pressing plates to rotate around the first center line. The transfer device can form a physical barrier to block the flow of etching liquid to the central area of the wafer, improve the processing efficiency and etching position accuracy of the wafer, and avoid the existence of etching blind area.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor manufacturing, and in particular to a transfer device and an edge etching machine. BACKGROUND

[0002] In the process of semiconductor manufacturing, a semiconductor wafer needs to go through many processes to meet the high standards in the semiconductor industry. In the advanced process of semiconductor wafers, the edge of the wafer is required to be uniform, flat, damage-free and smooth. The edge etching machine is a device for automatically etching and cleaning the edge of the wafer.

[0003] In order to avoid the center non-etching area of the wafer from contacting the etching liquid during the etching process, a protective film is currently manually attached to the center surface of the wafer to expose the periphery of the wafer, and then the wafer is placed in the etching tank of the edge etching machine for etching. This manual film attaching method has the disadvantages of low processing efficiency and poor etching position accuracy. In addition, in the process of etching the wafer by the existing edge etching machine, the wafer or the tooling containing the wafer is usually directly placed in the etching tank for immersion, and the wafer is fixed during the immersion process, which is prone to have etching blind area. SUMMARY

[0004] The first object of the present application is to provide a transfer device to solve the technical problems of low processing efficiency, poor etching position accuracy and easy etching blind area of the wafer in the prior art.

[0005] In order to achieve the above object, the present application adopts the following technical solutions:

[0006] A transfer device applied to an edge etching machine, the edge etching machine comprising a machine body and an etching tank body installed on the machine body, the transfer device being used for placing a wafer into the etching tank body, the transfer device comprising a horizontal sliding seat, a mechanical shaft, a tooling and a second rotary drive module, wherein:

[0007] The horizontal sliding seat is installed on the machine body;

[0008] The upper end of the mechanical shaft and the second rotary drive module are both installed on the horizontal sliding seat;

[0009] The tooling comprises a containing frame, a clamping plate and two pressing plates, the containing frame being fixedly arranged at the lower end of the mechanical shaft, the containing frame being used for sequentially stacking a plurality of wafers along a first center line, each adjacent two wafers in the containing frame being clamped with a clamping plate, each clamping plate being tightly attached to the periphery or the whole of the non-etching area of the two adjacent wafers on both sides, and the two pressing plates being used for clamping all the wafers and all the clamping plates in the containing frame;

[0010] The second rotary drive module is configured to drive the two platens to rotate around the first center line.

[0011] In some embodiments, the second rotary drive module comprises a fourth drive source and a transmission mandrel, wherein:

[0012] The fourth drive source is installed on the horizontal slide and is used to drive the transmission mandrel to rotate around its own axis;

[0013] The transmission mandrel is coaxially arranged inside the mechanical shaft in a through manner, the upper end of the transmission mandrel is connected to the power output end of the fourth drive source, and the lower end of the transmission mandrel is connected to one of the platens, and the transmission mandrel is configured to drive the platen to rotate around the first center line during rotation around its own axis.

[0014] In some embodiments, the tooling further comprises a hanger fixed to the mechanical shaft, and the containing frame is fixed to the hanger;

[0015] The second rotary drive module further comprises an input bevel gear and an output bevel gear, the input bevel gear is sleeved on the lower end of the transmission mandrel, and the output bevel gear is rotationally arranged on the hanger and is in transmission connection with one of the platens.

[0016] In some embodiments, the second rotary drive module further comprises an input gear and an output gear rotationally arranged on the hanger, wherein:

[0017] The input gear is coaxially fixedly installed with the output bevel gear, and the input gear is connected with the output gear;

[0018] The output gear and the containing frame are respectively installed on two oppositely arranged mounting surfaces of the hanger, and the tooling further comprises an adapter shaft, the adapter shaft penetrates through one side frame wall of the containing frame and the hanger and is connected between the output gear and one of the platens.

[0019] In some embodiments, the second rotary drive module further comprises a plurality of transition gears rotationally arranged on the hanger, the input gear, the plurality of transition gears, and the output gear are sequentially arranged from top to bottom and are in meshing connection.

[0020] In some embodiments, the fourth drive source is a motor, the body of the fourth drive source is installed on the horizontal slide, and the output shaft of the fourth drive source is connected to the upper end of the transmission mandrel through a third belt transmission assembly.

[0021] In some embodiments, the edge etching machine comprises a plurality of etching tank bodies sequentially arranged along a first horizontal direction;

[0022] The transport device further comprises a linear drive module for driving the mechanical shaft to translate along the first horizontal direction and a lifting drive module for driving the mechanical shaft to lift and lower.

[0023] In some embodiments, the linear drive module comprises a first drive source, a rack and a drive gear, wherein:

[0024] The first drive source is specifically a motor, a body of the first drive source is fixedly arranged on the horizontal slide, and the horizontal slide is slidingly arranged on the body along the first horizontal direction;

[0025] The rack extends along the first horizontal direction and is fixedly arranged on the body;

[0026] The drive gear is sleeved on an output shaft of the first drive source and is in meshing connection with the rack.

[0027] In some embodiments, the lifting drive module comprises a third drive source and a lifting slide, the third drive source is arranged on the horizontal slide and has a power output end connected to the lifting slide, and the lifting slide is slidingly arranged on the horizontal slide along a vertical direction;

[0028] The mechanical shaft is rotationally arranged on the lifting slide around an axis of the mechanical shaft, and the second rotary drive module is arranged on the lifting slide.

[0029] A second object of the present application is to provide an edge corrosion machine comprising the transport device as described in any one of the above.

[0030] The present application has the following beneficial effects:

[0031] The present application provides a transport device and an edge corrosion machine, the transport device is used for placing a wafer into a corrosion tank of the edge corrosion machine, and the transport device comprises a horizontal slide, a mechanical shaft, a tooling and a second rotary drive module, wherein: the horizontal slide is arranged on a body; the upper end of the mechanical shaft and the second rotary drive module are both arranged on the horizontal slide; the tooling comprises a containing frame, a clamping plate and two pressing plates, the containing frame is fixedly arranged on the lower end of the mechanical shaft, the containing frame is used for sequentially stacking multiple wafers along a first center line, each clamping plate is clamped between every two adjacent wafers in the containing frame, each clamping plate is tightly fitted with the periphery or the whole of the non-corrosion area of the wafers adjacent to the two sides of the clamping plate, and the two pressing plates are used for clamping all the wafers and all the clamping plates in the containing frame; and the second rotary drive module is configured to drive the two pressing plates to rotate around the first center line.

[0032] The aforementioned transfer device utilizes clamps to form a physical barrier preventing the etchant from flowing to the central area of ​​the wafer, ensuring that the etchant only contacts the areas of the wafer requiring etching. Compared to the existing method of manually applying a film to the central surface of the wafer, this application improves wafer processing efficiency and etching position accuracy. Furthermore, during the wafer etching process, the second rotary drive module drives two pressure plates to rotate around the first centerline. These two pressure plates, in turn, cause all wafers and clamps between them to rotate synchronously, ensuring that the edge etching zone of the wafer contacts the liquid more evenly, improving the uniformity of etching and the cleanliness of cleaning, and avoiding the existence of etching blind spots. Attached Figure Description

[0033] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0034] Figure 1 This is a longitudinal cross-sectional schematic diagram of an edge etching machine provided in an embodiment of the present invention;

[0035] Figure 2 A longitudinal cross-sectional schematic diagram of the transfer device provided in an embodiment of the present invention;

[0036] Figure 3 A three-dimensional schematic diagram of the accommodating frame and its components provided in an embodiment of the present invention;

[0037] Figure 4 This is a schematic diagram of the structure after the clamping plate, pressure plate, and wafer are all loaded into the receiving frame according to an embodiment of the present invention.

[0038] Figure 5 for Figure 3 The structure shown is a front view after removing one wall of the accommodating frame;

[0039] Figure 6 A three-dimensional schematic diagram of the tooling provided in an embodiment of the present invention;

[0040] Figure 7 A schematic diagram of the longitudinal section of the tooling provided in an embodiment of the present invention;

[0041] Figure 8 This is a partial three-dimensional schematic diagram of the transfer device provided in an embodiment of the present invention;

[0042] Figure 9 for Figure 8 A three-dimensional schematic diagram of the structure shown from another angle;

[0043] Figure 10 A three-dimensional schematic view of an edge etching machine provided for an embodiment of the present application;

[0044] Figure 11 A partial schematic view of an edge etching machine provided for an embodiment of the present application;

[0045] Figure 12 A longitudinal sectional schematic view of an etching device and tooling provided for an embodiment of the present application;

[0046] Figure 13 A longitudinal sectional schematic view of a cleaning tank and tooling provided for an embodiment of the present application.

[0047] Icon:

[0048] 1 - machine body;

[0049] 2 - etching device; 21 - etching tank; 22 - etching spray module;

[0050] 3 - rinsing device; 31 - cleaning tank;

[0051] 4 - transfer device; 41 - tooling; 411 - containing frame; 412 - clamping plate; 413 - pressing plate; 414 - suspension frame; 4141 - mounting through hole; 415 - adapter shaft; 416 - pressing knob; 4161 - pressing screw; 4162 - hand wheel; 4163 - pressing wheel; 42 - mechanical shaft; 43 - linear drive module; 431 - first drive source; 432 - horizontal sliding seat; 433 - drive gear; 434 - first guide assembly; 435 - rack; 44 - first rotary drive module; 441 - second drive source; 442 - first belt drive assembly; 45 - lifting drive module; 451 - third drive source; 452 - lifting sliding seat; 453 - screw drive assembly; 454 - second belt drive assembly; 455 - second guide assembly; 46 - second rotary drive module; 461 - fourth drive source; 462 - transmission mandrel; 463 - input bevel gear; 464 - output bevel gear; 465 - input gear; 466 - output gear; 467 - transition gear; 468 - third belt drive assembly;

[0052] 100 - wafer. DETAILED DESCRIPTION

[0053] The technical solutions of the present application will be described clearly and completely below in conjunction with embodiments. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0054] It should be noted that in the description of the present application, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0055] It should be noted that in the description of the present application, the terms "connection" and "installation" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be directly connected, or connected through an intermediate medium; it can be mechanical connection, or electrical connection. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0056] With reference to Figure 1 , the first aspect embodiment of the present application provides a transfer device 4 applied to an edge corrosion machine, the edge corrosion machine comprising a machine body 1 and a corrosion tank body 21 installed on the machine body 1, the transfer device 4 being used for placing a wafer 100 into the corrosion tank body 21, so that the wafer 100 completes a corrosion process in the corrosion tank body 21. With reference to Figure 2 , the transfer device 4 comprises a horizontal sliding seat 432, a mechanical shaft 42, a tooling 41 and a second rotary drive module 46, wherein: the horizontal sliding seat 432 is installed on the machine body 1; the upper end of the mechanical shaft 42 and the second rotary drive module 46 are both installed on the horizontal sliding seat 432; with reference to Figure 3 , the tooling 41 comprises a containing frame 411, a clamping plate 412 and two pressing plates 413, the containing frame 411 being fixedly arranged at the lower end of the mechanical shaft 42, the containing frame 411 being used for sequentially stacking a plurality of wafers 100 along a first center line, each clamping plate 412 being clamped between every two adjacent wafers 100 in the containing frame 411, each clamping plate 412 being tightly fitted with the periphery or the whole of the non-corrosion area of the two adjacent wafers 100 on both sides thereof, and the two pressing plates 413 being used for clamping all the wafers 100 and all the clamping plates 412 in the containing frame 411; the second rotary drive module 46 is configured to drive the two pressing plates 413 to rotate around the first center line.

[0057] In the process of etching the wafer 100 by using the above-mentioned transfer device 4, the clamping plate 412 is tightly attached to the position 5mm inside the edge of the wafer 100 (the size can be adjusted according to the actual situation), so that the edge of the wafer 100 that needs to be etched is exposed outside and forms an etching zone. The clamping plate 412 forms a physical barrier to prevent the etching liquid from flowing to the central area of the wafer 100. Whether it is a spray etching or a soaking etching, the liquid can be prevented from penetrating, so that the etching liquid can only contact the area of the wafer 100 that needs to be etched, thereby reducing the amount of etching liquid and reducing the waste of etching liquid. Compared with the way of manually attaching a film on the central surface of the wafer 100 in the prior art, the wafer processing efficiency and etching position accuracy can be improved. In addition, in the process of etching the wafer 100, the second rotary drive module 46 drives the two pressing plates 413 to rotate around the first center line, and the two pressing plates 413 in turn drive all the wafers 100 and all the clamping plates 412 between them to rotate synchronously, so that the edge etching zone of the wafer 100 can more evenly contact the liquid, improve the uniformity of etching and the cleanliness of cleaning, and avoid the existence of etching blind area.

[0058] It should be noted that the transfer device 4 provided in the embodiment can be used in both spray etching and soaking etching. In addition, the transfer device 4 can also be used in the cleaning and drying of the wafer 100.

[0059] Continuing to refer to Figure 3 As an optional embodiment, the accommodating frame 411 is a rectangular structure with openings at the upper and lower ends (other embodiments can have only one end opening). Each frame wall of the accommodating frame 411 is a hollow plate, which means that the plate has through holes. The above-mentioned arrangement, on the one hand, enables the wafers 100 in the accommodating frame 411 to be fully in contact with the etching liquid and the cleaning liquid during etching and cleaning, and on the other hand, facilitates the discharge of the liquid in the frame and avoids the accumulation of the liquid in the frame.

[0060] In the above-mentioned structure, in each adjacent one of the clamping plates 412 and one wafer 100, the clamping plate 412 can be tightly attached to the periphery of the non-etching area of the wafer 100 or can be tightly attached to the entire non-etching area of the wafer 100. Both of the above-mentioned two embodiments can isolate the non-etching area of the wafer 100 from the etching liquid during etching. Referring to Figure 4 In the embodiment, the clamping plate 412 includes a clamping plate main body and two sealing rings respectively arranged on the two side end faces of the clamping plate main body. After the clamping plate 412 is tightly pressed against the wafer 100, the sealing rings are tightly attached to the periphery of the non-etching area of the wafer 100, so as to reduce the contact area between the clamping plate 412 and the wafer 100 and reduce the pressure on the wafer 100.

[0061] As an optional embodiment, the clamping plate body and the sealing ring are integrally formed, and the clamping plate 412 is made of fluororubber (resistant to corrosion by various chemical liquids); alternatively, the clamping plate body is made of a corrosion-resistant hard material, and the sealing rings on both ends of the clamping plate body are made of fluororubber. The sealing ring is made of fluororubber, which has certain elasticity and advantages such as corrosion resistance, good sealing performance, and no damage to the wafer 100.

[0062] Continue to refer to Figure 4 As an optional embodiment, the diameter of the clamping plate body is the same as the diameter of the wafer 100 to be etched. After the wafer 100 and the clamping plate 412 are loaded into the frame, the outer peripheral surface of the clamping plate body and the outer peripheral surface of the wafer 100 are on the same cylindrical surface, which facilitates positioning of the two during loading.

[0063] Reference Figure 5 In this embodiment, the following method is used to achieve the rotation of wafer 100:

[0064] Tooling 41 also includes a transition shaft 415 and a clamping knob 416, wherein: the transition shaft 415 is rotatably mounted on one side wall of the receiving frame 411 around the first center line via a bearing (bearing connection is optional, or direct insertion connection is also possible), the cross-section of the end of the transition shaft 415 located inside the receiving frame 411 is non-circular (e.g., quadrilateral, hexagonal, or other polygonal or irregular shape), and the end of the transition shaft 415 located outside the receiving frame 411 is connected to the second rotary drive module 46; a pressure plate 413 near the transition shaft 415 ( Figure 2 The right pressure plate 413 is provided with a first positioning groove that is adapted to the aforementioned cross-section and is used for the insertion of the adapter shaft 415; the clamping knob 416 is screwed through to the other side of the frame wall of the receiving frame 411, and one end of the clamping knob 416 located inside the receiving frame 411 is connected to another pressure plate 413.

[0065] The loading method of the wafer 100 using the above-mentioned tooling 41 is as follows: First, the pressure plate 413 with the first positioning groove is placed in the receiving frame, and the adapter shaft 415 is inserted into the first positioning groove on the pressure plate 413; then, multiple wafers 100 and multiple clamping plates 412 are alternately placed in the receiving frame 411 along the first center line; after all the wafers 100 are placed, another pressure plate 413 is placed in, and then the clamping knob 416 is turned, so that the clamping knob 416 pushes the pressure plate 413 placed in afterward to move towards the pressure plate 413 placed in front, until all the wafers 100 and all the clamping plates 412 are clamped between the two pressure plates 413. After loading is completed, when a torque is applied to the adapter shaft 415, the adapter shaft 415 will drive the two pressure plates 413, all the wafers 100 and all the clamping plates 412 to rotate simultaneously during rotation.

[0066] Further, the pressing knob 416 specifically comprises a pressing screw 4161, a hand wheel 4162 fixedly connected to the outer end of the pressing screw 4161, and a pressing wheel 4163 rotatably mounted on the inner end of the pressing screw 4161 about the first center line, and a second positioning groove for the insertion of the pressing wheel 4163 is arranged on one of the pressing plates 413 close to the pressing knob 416.

[0067] According to the principle of mechanical transmission, when the hand wheel 4162 is screwed, the pressing knob 416 will move as a whole in the direction of approaching or moving away from the pressing plate 413, so as to realize the clamping and releasing of the wafers 100 and the clamping plates 412 therebetween; after all the wafers 100 are tightly clamped between the two pressing plates 413, rotating the adapter shaft 415 will drive the two pressing plates 413 and the wafers 100 and the clamping plates 412 therebetween to rotate synchronously.

[0068] With reference to Figure 6 and Figure 7 , as an optional embodiment, the tooling 41 further comprises a hanger 414 for being fixed to the mechanical shaft 42, and the containing frame 411 can be detachably fixed to the hanger 414 by screw connection or clamping, etc. In this embodiment, the upper end of the hanger 414 is provided with a mounting through hole 4141 for being sleeved on the mechanical shaft 42, and a through hole for the screw to penetrate and connect the mechanical shaft 42 is arranged on the hole wall of the mounting through hole 4141, and the hanger 414 is fixed to the mechanical shaft 42 by the screw.

[0069] With reference to Figure 7 and Figure 8 , as an optional embodiment, the second rotary drive module 46 comprises a fourth driving source 461 and a transmission mandrel 462, wherein: the fourth driving source 461 is arranged on the horizontal sliding seat 432 and is used to drive the transmission mandrel 462 to rotate about its own axis; the transmission mandrel 462 is coaxially arranged inside the mechanical shaft 42 in a penetrating manner, the upper end of the transmission mandrel 462 is connected to the power output end of the fourth driving source 461, and the lower end thereof is connected to one of the pressing plates 413, and the transmission mandrel 462 is configured to drive the pressing plate 413 to rotate about the first center line in the process of rotating about its own axis.

[0070] Specifically, the lower end of the transmission mandrel 462 is connected to the adapter shaft 415. When the fourth driving source 461 is started, the power of the fourth driving source 461 is transmitted to the adapter shaft 415 through the transmission mandrel 462, so that the adapter shaft 415, the two pressing plates 413, all the wafers 100 and all the clamping plates 412 rotate synchronously about the first center line.

[0071] With reference to Figure 7On the basis of the above structure, the second rotary drive module 46 further comprises an input bevel gear 463 and an output bevel gear 464. The input bevel gear 463 is sleeved on the lower end of the transmission shaft 462, and the output bevel gear 464 is rotatably arranged on the suspension frame 414 and in transmission connection with one of the pressing plates 413. The above arrangement changes the transmission direction of force through bevel gears.

[0072] Further, the second rotary drive module 46 further comprises an input gear 465 and an output gear 466 rotatably arranged on the suspension frame 414. The input gear 465 is coaxially fixedly installed with the output bevel gear 464, and the input gear 465 is connected with the output gear 466. The output gear 466 and the containing frame 411 are respectively installed on two oppositely arranged mounting surfaces of the suspension frame 414. The adapter shaft 415 penetrates through one side wall of the containing frame 411 and the suspension frame 414 and is connected between the output gear 466 and one of the pressing plates 413.

[0073] The connection mode of the adapter shaft 415 and the pressing plate 413 adjacent thereto has been described above and will not be repeated here. In the present embodiment, the connection mode of the adapter shaft 415 and the output gear 466 is that the cross section of one end of the adapter shaft 415 penetrating out of the containing frame 411 is non-circular (for example, polygonal such as quadrilateral, hexagonal, or special-shaped), and the output gear 466 is provided with a third positioning groove adapted to the aforementioned cross section and used for inserting the adapter shaft 415. After the containing frame 411 is fixedly installed on the suspension frame 414, the outer end of the adapter shaft 415 penetrates through the suspension frame 414 and is inserted into the third positioning groove on the output gear 466. The purpose of such arrangement is to enable the output gear 466 to drive the adapter shaft 415 to rotate simultaneously in the process of rotation.

[0074] In other embodiments, the adapter shaft 415 and the output gear 466 can also be fixedly connected through screws. The connection mode of the adapter shaft 415 and the output gear 466 only needs to satisfy the condition that they can rotate synchronously.

[0075] As an optional embodiment, the second rotary drive module 46 further comprises a plurality of transition gears 467 rotatably arranged on the suspension frame 414. The input gear 465, the plurality of transition gears 467, and the output gear 466 are arranged in sequence from top to bottom and are in meshing connection. In the present embodiment, the number of the transition gears 467 is one. In other embodiments, the number of the transition gears 467 can be two, or three, or more than three, or the transition gears 467 can not be arranged and the input gear 465 and the output gear 466 are directly meshed. The number of the transition gears 467 is adjusted according to actual requirements (for example, the groove depth of the corrosion tank 21).

[0076] Continuing to refer to Figure 8As an optional embodiment, the fourth drive source 461 is specifically a motor. The body of the fourth drive source 461 is mounted on a horizontal slide 432, and its output shaft is connected to the upper end of the transmission spindle 462 via a third belt drive assembly 468. Specifically, the third belt drive assembly 468 includes a third input pulley, a third output pulley, and a third belt connecting the third input pulley and the third output pulley. The third input pulley is mounted on the output shaft of the fourth drive source 461, and the third output pulley is mounted on the upper end of the transmission spindle 462.

[0077] Continue to refer to Figure 1 and Figure 2 In some embodiments, the edge etching machine includes multiple components along a first horizontal direction (i.e., Figure 1 The etching tanks 21 are arranged sequentially (perpendicular to the plane of the paper); multiple etching tanks 21 are used to hold different types of etching solutions to accommodate different contaminants such as oxide layers / metal residues. In addition, the transfer device 4 also includes a linear drive module 43 for driving the mechanical shaft 42 to translate along a first horizontal direction and a lifting drive module 45 for driving the mechanical shaft 42 to rise and fall. The linear drive module 43 drives the mechanical shaft 42 to translate along the first horizontal direction, allowing the tooling 41 at the lower end of the mechanical shaft 42 to move directly above any etching tank 21; the lifting drive module 45 drives the mechanical shaft 42 to rise and fall, allowing the tooling 41 at the lower end of the mechanical shaft 42 to move into or out of any etching tank 21.

[0078] As an optional embodiment, the linear drive module 43 includes a first drive source 431, a rack 435, and a drive gear 433, wherein: the first drive source 431 is specifically a motor, the body of the first drive source 431 is fixed on a horizontal slide 432, and the horizontal slide 432 is slidably disposed on the body 1 along a first horizontal direction; the rack 435 extends along the first horizontal direction and is fixed on the body 1; the drive gear 433 is fitted on the output shaft of the first drive source 431 and meshes with the rack 435. Using the above technical solution, when the first drive source 431 is started, the first drive source 431 drives the drive gear 433 to rotate, causing the drive gear 433, the horizontal slide 432, and all components on the horizontal slide 432 to translate along the extension direction of the rack 435.

[0079] In order to limit the translational trajectory of the horizontal slide 432 on the body 1, the linear drive module 43 also includes a first guide component 434. The first guide component 434 includes a first guide rail and a first slider. The first guide rail is fixedly installed on the body 1 and extends along a first horizontal direction. The first slider is slidably disposed on the first guide rail and fixed to the bottom of the horizontal slide 432.

[0080] Reference Figure 8 and Figure 9As an optional embodiment, the lifting driving module 45 comprises a third driving source 451 and a lifting slide 452, the third driving source 451 is installed on the horizontal slide 432 and its power output end is connected to the lifting slide 452, the lifting slide 452 is slidingly arranged on the horizontal slide 432 along the vertical direction; the mechanical shaft 42 is rotationally arranged on the lifting slide 452 around its axis, and the second rotary driving module 46 is installed on the lifting slide 452. Specifically, the body of the second driving source 441 and the body of the fourth driving source 461 are both fixedly installed on the lifting slide 452, the mechanical shaft 42 is rotationally installed on the lifting slide 452 through a bearing, the transmission core shaft 462 and the mechanical shaft 42 are coaxially sleeved through a bearing, and the upper end of the transmission core shaft 462 is led out from the mechanical shaft 42 and connected to the output shaft of the fourth driving source 461 through the third belt transmission assembly 468.

[0081] As an optional embodiment, the third driving source 451 is a motor, the body of the third driving source 451 is fixedly installed on the horizontal slide 432, and its output shaft is connected to the lifting slide 452 through a screw transmission assembly 453. Specifically, the screw in the screw transmission assembly 453 is connected to the output shaft of the third driving source 451 through a second belt transmission assembly 454, and the nut in the screw transmission assembly 453 is fixedly installed on the lifting slide 452.

[0082] In order to limit the lifting track of the lifting slide 452 on the horizontal slide 432, the lifting driving module 45 further comprises a second guide assembly 455, the second guide assembly 455 comprises a second guide rail and a second slide block, the second guide rail is fixedly installed on the horizontal slide 432 and extends along the vertical direction, and the second slide block is slidingly arranged on the second guide rail and fixedly installed on the lifting slide 452.

[0083] Continuing to refer to Figure 1 and Figure 2 In some embodiments, the edge etching machine comprises a plurality of cleaning tank bodies 31 arranged in sequence along a first horizontal direction (i.e. the direction perpendicular to the paper surface in Figure 1 the drawings), and a plurality of etching tank bodies 21 and a plurality of cleaning tank bodies 31 are arranged one by one, and a corresponding etching tank body 21 and a corresponding cleaning tank body 31 are distributed side by side along a second horizontal direction (i.e. the left-right direction in Figure 1 the drawings). On this basis, the transfer device 4 further comprises a first rotary driving module 44, which is used to drive the mechanical shaft 42 to rotate around its axis, so as to switch the position of the tooling 41 between above the corresponding etching tank body 21 and the corresponding cleaning tank body 31. When the containing frame 411 on the mechanical shaft 42 is located directly above an etching tank body 21, the mechanical shaft 42 is controlled to rotate 180° around the axis, so that the containing frame 411 is rotated to be directly above the cleaning tank body 31 corresponding to the etching tank body 21.

[0084] As an optional embodiment, the first rotating driving module 44 comprises a second driving source 441 and a first belt transmission assembly 442, the second driving source 441 is specifically a motor, the body of the second driving source 441 is fixedly installed on the lifting slide 452, and the output shaft of the second driving source 441 is connected to the mechanical shaft 42 through the first belt transmission assembly 442. Specifically, the first belt transmission assembly 442 comprises a first input pulley, a first output pulley and a first belt connected between the first input pulley and the first output pulley, the first input pulley is sleeved on the output shaft of the second driving source 441, and the first output pulley is sleeved on the mechanical shaft 42.

[0085] In summary, the transfer device 4 applied to the edge etching machine provided by the embodiment has the following advantages:

[0086] (1) The clamping plates 412 form a physical barrier to block the flow of the etching liquid to the central area of the wafer 100, thereby improving the processing efficiency of the wafer and the etching position accuracy.

[0087] (2) During the etching and cleaning of the wafer 100, the two pressing plates 413, all the wafers 100 and all the clamping plates 412 rotate synchronously, so that the edge etching zone of the wafer 100 is more uniformly contacted with the liquid, thereby improving the uniformity of etching and the cleanliness of cleaning, and avoiding the existence of etching and cleaning blind area.

[0088] (3) The mechanical shaft 42 has three degrees of freedom of translation along the first horizontal direction, lifting and rotating around its own axis, and can drive the tooling 41 and the wafer 100 in the tooling 41 to switch positions between each etching tank 21 and each cleaning tank 31, without the need for manual transfer of the wafer 100 by the staff, thereby improving the etching and cleaning efficiency of the wafer 100, avoiding the safety hazard of the staff contacting the etching liquid, and also reducing the time length of the wafer 100 exposed to the air.

[0089] The second aspect embodiment of the present application provides an edge etching machine, referring to Figure 10 and Figure 11 The edge etching machine comprises the transfer device 4 of any of the above embodiments, and further comprises a body 1, an etching device 2 and a flushing device 3, the etching device 2, the flushing device 3 and the transfer device 4 are all arranged inside the body 1.

[0090] Referring to Figure 11 In some embodiments, the number of the etching device 2 and the flushing device 3 is multiple, the multiple etching devices 2 are arranged in sequence along the first horizontal direction, and the multiple flushing devices 3 are arranged in sequence along the first horizontal direction; the multiple etching devices 2 and the multiple flushing devices 3 are arranged one by one, and a corresponding etching device 2 and a corresponding flushing device 3 are distributed side by side along the second horizontal direction. Wherein, the first horizontal direction and the second horizontal direction are perpendicular to each other.

[0091] Reference Figure 12 The corrosion device 2 includes a corrosion tank 21 and a corrosion spray module 22 for spraying corrosive liquid into the corrosion tank 21. A corrosive liquid drain port is provided at the bottom of the corrosion tank 21. (Refer to...) Figure 13 The rinsing device 3 includes a cleaning tank 31 and a cleaning spray module for spraying cleaning fluid into the cleaning tank 31. A cleaning fluid drain port is provided at the bottom of the cleaning tank 31. Specifically, the rinsing device 3 is a QDR (Quick Dump Rinser), which can quickly remove residual chemical solutions and particulate impurities from the surface of the wafer 100, ensuring wafer cleanliness.

[0092] The working process of the aforementioned edge etching machine is as follows:

[0093] S1, Loading wafer 100:

[0094] First, remove the receiving frame 411 from the hanging bracket 414 and place it on the operating table. Insert the front pressure plate 413 (the front refers to the end near the adapter shaft 415) into the receiving frame 411 and insert the adapter shaft 415 into the first positioning groove on the front pressure plate 413. Next, alternately place multiple wafers 100 and multiple clamping plates 412 into the receiving frame 411. After all the wafers 100 are placed, place the rear pressure plate 413 into the receiving frame 411. After placement, ensure that the circumferential surface of the wafers 100, the circumferential surface of the clamping plate body, and the circumferential surface of the pressure plate 413 are on the same cylindrical surface. Then, turn the clamping knob 416 so that the clamping wheel 4163 on the clamping knob 416 is inserted into the second positioning groove on the rear pressure plate 413, and clamp all the wafers 100 and all the clamping plates 412 between the two pressure plates 413. Finally, fix the receiving frame 411 on the hanging bracket 414.

[0095] S2, Move the mechanical shaft 42 and its tooling 41 until the tooling 41 is located in an etching tank 21 (e.g., ...). Figure 11 Directly above the first corrosion tank 21 from the left.

[0096] S3. Control the lifting drive module 45 to drive the mechanical shaft 42 and its tooling 41 to descend, so that the accommodating frame 411 enters the corrosion tank 21.

[0097] S4. The etching liquid is sprayed into the etching tank 21 through the etching spray module 22. At the same time, the second rotation drive module 46 is controlled to drive the two pressure plates 413, all wafers 100 and all clamping plates 412 to rotate synchronously around the first center line, so that the exposed surface of the wafers 100 is uniformly in contact with the etching liquid.

[0098] S5, after a period of corrosion, control the lifting drive module 45 to drive the mechanical shaft 42 and the tooling 41 thereon to rise to a position where the tooling 41 is directly above the etching tank 21, then control the first rotary drive module 44 to drive the mechanical shaft 42 to rotate by 180°, so that the tooling 41 is rotated to be directly above the cleaning tank 31 (i.e. the first cleaning tank 31 from the left in FIG. 2) corresponding to the etching tank 21, then control the lifting drive module 45 to drive the mechanical shaft 42 and the tooling 41 thereon to descend, so that the containing frame 411 enters the cleaning tank 31. Figure 11

[0099] S6, input cleaning liquid into the cleaning tank 31 through the cleaning spray module, at the same time, control the second rotary drive module 46 to drive the two pressing plates 413, all the wafers 100 and all the clamping plates 412 to rotate synchronously around the first center line.

[0100] S7, after a period of cleaning, control the wafer drive mechanism to drive the mechanical shaft 42 and the tooling 41 thereon to move to a position where the tooling 41 is directly above the next etching tank 21 (i.e. the second etching tank 21 from the left in FIG. 2), then the subsequent steps are the same as S3-6. Figure 11

[0101] Repeat the above steps S3-7 until all the etching and cleaning processes are completed.

[0102] The edge etching machine provided in the present application has all the technical features and effects of the above-described transfer device 4, and thus will not be described here again.

[0103] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the above embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.​​

Claims

1. A transfer device for use on an edge etching machine, the edge etching machine comprising a body (1) and an etching tank (21) mounted on the body (1), the transfer device being used to place a wafer (100) into the etching tank (21), characterized in that, The transport device comprises a horizontal slide (432), a mechanical shaft (42), a tooling (41) and a second rotary drive module (46), wherein: The horizontal slide (432) is arranged on the machine body (1); The upper end of the mechanical shaft (42) and the second rotary drive module (46) are both arranged on the horizontal slide (432); The tooling (41) comprises a containing frame (411), a clamping plate (412) and two pressing plates (413), the containing frame (411) is fixedly arranged on the lower end of the mechanical shaft (42), a plurality of wafers (100) are sequentially stacked along a first center line in the containing frame (411), one clamping plate (412) is clamped between every two adjacent wafers (100) in the containing frame (411), each clamping plate (412) is tightly attached to the peripheral edge or the whole of the non-etching area of the wafers (100) adjacent to it on both sides, and the two pressing plates (413) are used for clamping all the wafers (100) and all the clamping plates (412) in the containing frame (411); The second rotary drive module (46) is configured to drive the two pressing plates (413) to rotate around the first center line; The second rotary drive module (46) comprises a fourth drive source (461) and a transmission mandrel (462), wherein: The fourth drive source (461) is arranged on the horizontal slide (432) and is used for driving the transmission mandrel (462) to rotate around its own axis; The transmission mandrel (462) is arranged in the interior of the mechanical shaft (42) in a penetrating coaxial manner, the upper end of the transmission mandrel (462) is connected to the power output end of the fourth drive source (461), the lower end of the transmission mandrel (462) is connected to one of the pressing plates (413), and the transmission mandrel (462) is configured to drive the pressing plate (413) to rotate around the first center line in the process of rotating around its own axis.

2. The transfer device of claim 1, wherein, The tooling (41) further comprises a suspension frame (414) fixedly arranged on the mechanical shaft (42), and the containing frame (411) is fixedly arranged on the suspension frame (414); The second rotary drive module (46) further comprises an input bevel gear (463) and an output bevel gear (464), the input bevel gear (463) is sleeved on the lower end of the transmission mandrel (462), and the output bevel gear (464) is rotationally arranged on the suspension frame (414) and is in transmission connection with one of the pressing plates (413).

3. The transfer device of claim 2, wherein, The second rotary drive module (46) further comprises an input gear (465) and an output gear (466) rotationally arranged on the suspension frame (414), wherein: The input gear (465) is coaxially and fixedly installed with the output bevel gear (464), and the input gear (465) is connected with the output gear (466); The second rotary drive module (46) further comprises an input gear (465) and an output gear (466) rotationally arranged on the suspension frame (414), wherein: The input gear (465) is coaxially and fixedly installed with the output bevel gear (464), and the input gear (465) is connected with the output gear (466); The output gear (466) and the containing frame (411) are respectively installed on two opposite installation surfaces of the hanger (414), and the tooling (41) further comprises an adapter shaft (415) penetrating through a side wall of the containing frame (411) and the hanger (414) and connected between the output gear (466) and one of the pressing plates (413).

4. The transfer device of claim 3, wherein, The second rotary drive module (46) further comprises a plurality of transition gears (467) rotatably arranged on the hanger (414), and the input gear (465), the transition gears (467) and the output gear (466) are sequentially arranged from top to bottom and connected in meshing.

5. The transfer device of claim 1, wherein, The fourth drive source (461) is specifically a motor, and a body of the fourth drive source (461) is installed on the horizontal sliding seat (432), and an output shaft of the fourth drive source (461) is connected to an upper end of the transmission shaft (462) through a third belt transmission assembly (468).

6. The transfer device of claim 1, wherein, The edge etching machine comprises a plurality of etching groove bodies (21) sequentially arranged along a first horizontal direction. The transfer device further comprises a linear drive module (43) for driving the mechanical shaft (42) to translate along the first horizontal direction and a lifting drive module (45) for driving the mechanical shaft (42) to lift.

7. The transfer device of claim 6, wherein, The linear drive module (43) comprises a first drive source (431), a rack (435) and a drive gear (433), wherein: The first drive source (431) is specifically a motor, and a body of the first drive source (431) is fixedly arranged on the horizontal sliding seat (432), and the horizontal sliding seat (432) is slidingly arranged on the body (1) along the first horizontal direction; The rack (435) extends along the first horizontal direction and is fixedly arranged on the body (1); The drive gear (433) is sleeved on an output shaft of the first drive source (431) and is connected in meshing with the rack (435).

8. The transfer device of claim 6, wherein, The lifting drive module (45) comprises a third drive source (451) and a lifting sliding seat (452), the third drive source (451) is installed on the horizontal sliding seat (432) and a power output end thereof is connected to the lifting sliding seat (452), and the lifting sliding seat (452) is slidingly arranged on the horizontal sliding seat (432) along a vertical direction; The mechanical shaft (42) is rotatably arranged on the lifting sliding seat (452) around an axis thereof, and the second rotary drive module (46) is installed on the lifting sliding seat (452).

9. An edge erosion machine characterized by, The transfer device comprises the device as claimed in any one of claims 1 to 8.

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