Cooperative process for precise cleaning of CKD valve and helium mass spectrum leak detection in semiconductor diffusion equipment

Abstract

The invention discloses a CKD valve precision cleaning and helium mass spectrum leak detection collaborative process in semiconductor diffusion equipment, and relates to the technical field of semiconductor equipment valve cleaning. The method comprises the following steps: firstly, disassembling a valve, transferring a corrugated pipe, a cover plate and a three-way cavity which need to be cleaned to a cleaning section, and transferring accessories such as a motor which cannot be cleaned to a testing section; then, the core component is sequentially subjected to alkali liquor soaking and rinsing, steam-water gun washing, hot water alkali removing, polishing and washing, ultrasonic cleaning and blow-drying; cleaning uncleaned accessories and then assembling, and replacing an original factory sealing ring; then resistance and sealing performance testing is carried out; and finally, purging the valve body with nitrogen in a dust-free room, and packaging after checking to be qualified. On one hand, core components can be thoroughly cleaned, surface sediments can be effectively removed, on the other hand, it can be guaranteed that accessories which cannot be cleaned are not affected by chemical reagents and physical operation in the cleaning process, and therefore it is guaranteed that the basic electrical performance of the valve is not damaged.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of valve cleaning for semiconductor equipment, and particularly relates to a precision cleaning and helium mass spectrum leak detection collaborative process for a CKD valve in a semiconductor diffusion device. BACKGROUND

[0002] In semiconductor manufacturing, CKD valves play a crucial role, mainly used for the delivery control of substances such as photoresist, etchant, and reaction gas. The valve has good sealing performance and precise flow regulation capability, which is essential for ensuring the stability of the production process and product quality.

[0003] However, the cleaning of CKD valves faces many difficulties. On the one hand, the motor and bellows need to be separated during the cleaning process, and improper separation operation can easily cause damage to the components. On the other hand, after cleaning and assembly, it is necessary to ensure that the valve meets the sealing performance standard, which is a key prerequisite for normal use. At the same time, the influence of temperature factors on various components is different, which leads to the change of the sealing performance of the valve with temperature. In order to make the test results more valuable and truly reflect the performance of the valve in the actual working environment, it is necessary to simulate the temperature of the valve in the machine environment for related tests.

[0004] In view of the above problems in the prior art, there is an urgent need for a process to effectively solve the cleaning problem of CKD valves and ensure that the key performance such as sealing performance and electrical performance of the valve meets the standard after cleaning, meeting the use requirements of the valve in semiconductor manufacturing. SUMMARY

[0005] The purpose of the present application is to provide a precision cleaning and helium mass spectrum leak detection collaborative process for a CKD valve in a semiconductor diffusion device, which can effectively remove the deposits on the surface of the core components of the valve, and at the same time can simulate the temperature of the valve in the machine environment for sealing performance measurement, thereby meeting the requirements of valve recycling and various process parameters.

[0006] To achieve the above purpose, the technical solution of the present application is: a precision cleaning and helium mass spectrum leak detection collaborative process for a CKD valve in a semiconductor diffusion device, comprising: Step one: disassemble the CKD valve, and transfer the bellows, cover plate, and tee cavity that need to be cleaned to the cleaning section; transfer the motor, wire, heating tape, and protection belt accessories that cannot be cleaned to the test section; Step two: immerse the bellows, cover plate, and tee cavity in alkali solution, and after soaking, rinse the above-mentioned components; Step three: use a steam gun to thoroughly rinse the bellows, cover plate, and tee cavity, with a focus on rinsing the bellows part to ensure thorough cleaning of the key area; Step 4: Immerse the bellows, cover plate and tee cavity after rinsing with a water gun in hot water to remove residual alkaline solution from the surface of the parts. Step 5: Use an appropriate grinding method to grind the bellows, cover plate and tee cavity to remove marks on the surface of the parts; after grinding, rinse the parts again with a steam gun. Step Six: Place the bellows, cover plate and tee cavity in an ultrasonic cleaning device for ultrasonic cleaning to remove fine impurities from the surface of the components; Step 7: First, blow dry the bellows, cover plate and tee cavity to remove the moisture attached to the surface; then put the parts into the oven for drying. Step 8: Use acetone to wipe and clean the uncleaned parts in the test section to remove stains from the surface of the parts; after cleaning, assemble all parts. Step 9: Conduct two tests on the assembled CKD valve body: first, a resistance test to check the resistance of the valve body heating wire; second, a sealing test to check the sealing performance of the valve body. Step 10: In a cleanroom environment, purge the valve body that has completed the test with nitrogen gas; after purging, conduct a comprehensive inspection of the valve body, and package it after confirming that it is qualified.

[0007] In another implementation of the present invention, the alkaline solution in step two is an aqueous solution of KOH and hydrogen peroxide, wherein the concentration of KOH is 5-10%, the concentration of hydrogen peroxide is 3-5%, the temperature of the alkaline solution is controlled at 50-60℃, and the soaking time is 3-6h.

[0008] In another implementation of the present invention, the temperature of the rinsing operation in step two is controlled at 55-65°C.

[0009] In another implementation of the present invention, in step three, the steam gun uses a spiral rinsing method to rinse the corrugated pipe, cover plate and the inner side of the three-way cavity, and the rinsing time is 40-70s. It also uses a circular rinsing method to rinse the outer side of the corrugated pipe, cover plate and three-way cavity, and the rinsing time is 40-70s.

[0010] In another implementation of the present invention, the hot water temperature in step four is 55-65℃, and the immersion time of the corrugated pipe, cover plate and tee cavity in the hot water is 30-40 minutes.

[0011] In another implementation of the present invention, in step five, the bellows, cover plate and tee cavity are uniformly polished by pneumatic polishing. The polishing material needs to be selected according to the actual condition of the bellows, cover plate and tee cavity, and 8698#, 7447# and 7448# are used in combination. After polishing, the bellows, cover plate and tee cavity are rinsed with steam and water gun. The rinsing time for the inner side is 15-25s and the rinsing time for the outer side is 15-25s.

[0012] In still another implementation form of the present application, the ultrasonic cleaning in step six is performed at an ultrasonic intensity of 12-20 W / inch 2 , and for a time period of 30-40 min.

[0013] In still another implementation form of the present application, the drying temperature in step seven is set to 100-105 DEG C, and the drying time is 1-2 h.

[0014] In still another implementation form of the present application, in step eight, the original sealing ring is replaced by a factory original sealing ring during the assembly of the component.

[0015] In still another implementation form of the present application, in step nine, the resistance test is a test of the resistance of the heating wire to ensure that the heating wire is not damaged; and the sealing test is performed by connecting an automatic constant temperature heating device, which includes a heating sheet and a temperature control table, the temperature control table being used to display real-time temperature and having an over-temperature protection function, and the temperature tolerance being ±2 DEG C, so as to detect the opening and closing state of the valve body and the sealing performance of the valve body.

[0016] The present application can achieve the following technical effects due to the adoption of the above technical solutions. 1. The present application can effectively protect the basic electrical performance of the motor by classifying and processing the CKD valve after disassembly, transferring the corrugated pipe, cover plate and tee cavity that need to be cleaned to the cleaning section, and transferring the motor and wire that cannot be cleaned to the test section, so as to lay a foundation for the normal operation of the valve.

[0017] 2. The present application can accurately determine whether the heating wire has faults such as disconnection and poor contact by resistance value after the valve body is assembled, so as to timely investigate the damage of the heating wire, ensure the integrity of the heating wire, avoid the failure of the valve to realize temperature control function after being put on the machine due to the fault of the heating wire, and meet the process requirements of the semiconductor diffusion equipment on the temperature regulation of the valve.

[0018] 3. In the sealing test link after assembly, on the one hand, the valve opening and closing function is verified by the valve body opening and closing cycle test, so as to ensure that the valve can realize basic opening and closing control; on the other hand, the sealing test is simultaneously performed, and the automatic constant temperature heating device is used in the test process to simulate the temperature environment of the customer end, effectively avoid the sealing performance misjudgment caused by the difference between normal temperature test and actual working temperature, make the sealing test result more accurate and reliable, and ensure that the sealing performance of the valve after assembly meets the standard. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative effort on the basis of these drawings.

[0020] Figure 1 It is a disassembled schematic diagram of CKD valve; Figure 2 It is a whole test schematic diagram of CKD valve; The serial number in the figure is explained as follows: 1, motor; 2, corrugated pipe; 3, cover plate; 4, three-way cavity; 5, heating belt; 6, protective belt; 7, constant temperature heating device; 8, electric wire. DETAILED DESCRIPTION

[0021] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict. The technical solutions in the embodiments of the present application will be described in detail below with reference to the drawings and in combination with the embodiments.

[0022] In order to make the purpose, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. The description of the at least one exemplary embodiment is actually only illustrative, but not as any limitation on the present application and its application or use. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present application.

[0023] It should be noted that the terms used herein are only for describing specific embodiments, and are not intended to limit the exemplary embodiments according to the present application. As used herein, the singular form is intended to include the plural form unless the context clearly indicates otherwise, and it should also be understood that when the terms "comprise" and / or "include" are used in the specification, there is a feature, step, operation, device, component and / or combination thereof.

[0024] The relative arrangement of parts and steps, numerical expressions, and numerical values set forth in the examples herein are not intended to limit the scope of the application unless specifically so stated. It should also be appreciated that the size of the various parts shown in the drawings is not to scale for ease of illustration. Techniques, methods, and devices known to those of ordinary skill in the relevant art can not be discussed in detail, but should be considered as part of the description of the application. In all examples shown and discussed herein, any specific value should be interpreted as merely an example, and not as a limitation. Thus, other examples of the exemplary embodiments can have different values.

[0025] The semiconductor diffusion equipment provided by the application can realize the precision cleaning and helium mass spectrum leak detection of the CKD valve through the following specific embodiments, so as to ensure the standardization of the process operation and the reliability of the valve cleaning and testing effect.

[0026] Embodiment 1 This embodiment is aimed at the CKD valve of a commonly used model of semiconductor diffusion equipment, and the precision cleaning and helium mass spectrum leak detection are carried out according to the following steps: Step 1: disassembly and classification The CKD valve is disassembled to separate the core components (corrugated pipes, cover plates, and three-way cavities) that need to be cleaned and the accessories (motors, wires, heating tapes, and protective tapes) that cannot be cleaned. The corrugated pipes, cover plates, and three-way cavities are transported to a special cleaning section, and the motors, wires, heating tapes, and protective tapes are transported to a testing section together and placed in a dry and dust-free processing area for subsequent operation.

[0027] Step 2: alkali immersion and rinsing Prepare an alkali solution: prepare a KOH and hydrogen peroxide aqueous solution according to the concentration ratio, with a KOH concentration of 5% and a hydrogen peroxide concentration of 5%. Heat the prepared alkali solution to 55°C and maintain the temperature, then completely immerse the corrugated pipes, cover plates, and three-way cavities in the alkali solution, and continue to soak for 4 hours. After soaking, take out the parts and transfer them to a rinsing station to rinse the surface of the parts with clean water to remove the residual alkali solution.

[0028] Step 3: targeted washing with steam gun Use a steam gun with pressure regulation function to thoroughly wash the rinsed corrugated pipes, cover plates, and three-way cavities: for the inside of the parts, use a spiral washing path, continuously wash for 40 seconds to ensure that the inside cavity wall is clean without dead angles; for the outside of the parts, use a winding washing path, also continuously wash for 40 seconds, focusing on repeatedly washing the corrugated folds of the corrugated pipes to completely remove impurities attached to the corrugated gaps.

[0029] Step 4: hot water soaking to remove alkali Prepare hot water with constant temperature of 55℃, and put the corrugated pipe, cover plate and tee cavity after being washed by the steam gun into the hot water, fully immerse and keep soaking for 30 min; through the soaking effect of hot water, fully dissolve and remove the residual alkali components on the surface of the components, to avoid the corrosion of residual alkali to the material of the components or affect the subsequent cleaning steps.

[0030] Step 5: pneumatic polishing and secondary washing Pneumatic polishing tool is used for polishing the components: first, 8698# polishing material is selected to preliminarily polish the stubborn traces (such as oxidation layer, sediment residual traces) on the surface of the corrugated pipe, cover plate and tee cavity; after the preliminary polishing is completed, 7448# polishing material is replaced to finely polish the surface of the components, to ensure the surface is smooth and has no obvious traces; after the polishing is completed, the components are washed again by using the steam gun, the inside is washed for 15 s and the outside is washed for 15 s, to remove the debris generated in the polishing process.

[0031] Step 6: ultrasonic cleaning Put the polished and washed corrugated pipe, cover plate and tee cavity into the cleaning tank of the ultrasonic cleaning equipment, and add cleaning liquid meeting the semiconductor cleaning standard; set the ultrasonic cleaning parameters: the ultrasonic intensity is adjusted to 12-16 W / inch 2 , and the ultrasonic cleaning time is set to 35 min; start the ultrasonic cleaning equipment, and remove the fine impurities on the surface of the components and in the small gaps through the high-frequency vibration effect, to realize deep cleaning.

[0032] Step 7: blow drying and drying Clean compressed air is used to blow dry the components after ultrasonic cleaning, to remove the water adhered to the surface by sequentially blowing the inside, outside and corrugated gap of the components; after blow drying, the components are put into a constant temperature oven, the oven temperature is set to 100℃, and the drying time is 2 h; through the drying operation, it is ensured that the inside and surface of the components are completely dry, to avoid water residue causing rust or affecting the sealing performance in the subsequent assembly.

[0033] Step 8: cleaning of accessories and assembly Take the motor, wire, heating tape, protective tape and other accessories to be processed in the test section, dip the accessories in clean dust-free cloth soaked with acetone, and wipe and clean the surface of the accessories to remove oil stains, dust and other stains on the surface; after cleaning is completed, all components (cleaned and dried core components and cleaned non-cleanable accessories) are assembled, and during the assembly process, the original sealing ring (Oring) is removed and replaced with the original sealing ring matched by the original manufacturer of CKD valve, to ensure that the sealing ring is accurately matched with the interface size of the components.

[0034] Step 9: resistance test and sealing test Two core tests are carried out on the assembled CKD valve body: Resistance test: connect the heating wire interface of the valve body with a multimeter, measure the resistance value of the heating wire, and determine whether the heating wire has problems such as disconnection or poor contact by whether the resistance value is within the standard range, to ensure that the heating wire is intact; Sealing test: connect the valve body to a constant temperature heating device and a helium detector, start the constant temperature heating device, and when the valve body temperature rises to 190°C (simulating the customer's on-machine use temperature) and stabilizes, first perform valve opening and closing action confirmation, and repeatedly operate the valve opening and closing 5-10 times to check whether the opening and closing action is smooth and free of jamming; then start the helium detector to perform helium mass spectrometry on the valve body sealing interface to detect whether the valve body sealing performance meets the standard and ensure that there is no gas leakage.

[0035] Step 10: Nitrogen purging, inspection and packaging Transfer the valve body that has passed the sealing test to a ten-level clean room, use high-purity nitrogen to purge the valve body surface and interface, and continue purging for 5-8 minutes to remove any residual helium and small impurities on the surface; after purging, the quality inspection personnel use a combination of visual inspection and precision gauge detection to comprehensively inspect the valve body appearance, size and assembly integrity; after confirming that it is qualified, place the valve body in an anti-static and dust-proof special packaging container, complete the packaging, and wait for subsequent transportation or on-machine use.

[0036] The specific preferred parameters and operation standards of each step in this embodiment can effectively remove the deposits on the surface of the core components of the CKD valve, ensure that the electrical performance and sealing performance of the assembled valve meet the standards, and meet the cleanliness, sealing performance and recycling requirements of the semiconductor diffusion equipment for the valve.

[0037] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent replacements for some technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A synergistic process for precision cleaning of CKD valves and helium mass spectrometry leak detection in semiconductor diffusion equipment, characterized in that, include: Step 1: Disassemble the CKD valve and transfer the bellows, cover plate, and tee cavity that need to be cleaned to the cleaning section. The non-cleanable parts were transferred to the testing section together; Step 2: Immerse the bellows, cover plate and tee cavity in alkaline solution. After soaking, rinse the above components. Step 3: Use a water gun to thoroughly rinse the bellows, cover plate and T-junction cavity, paying special attention to rinsing the corrugated part of the bellows to ensure that key areas are thoroughly cleaned; Step 4: Immerse the bellows, cover plate and tee cavity after rinsing with a water gun in hot water to remove residual alkaline solution from the surface of the parts. Step 5: Use an appropriate grinding method to grind the bellows, cover plate and tee cavity to remove marks on the surface of the parts; after grinding, rinse the parts again with a steam gun. Step Six: Place the bellows, cover plate, and tee cavity into the ultrasonic cleaning equipment for ultrasonic cleaning; Step 7: First, blow dry the bellows, cover plate and tee cavity to remove the moisture attached to the surface; then put the parts into the oven for drying. Step 8: Use acetone to wipe and clean the uncleaned parts in the test section to remove stains from the surface of the parts; After cleaning is complete, assemble all parts; Step 9: Conduct two tests on the assembled CKD valve body: first, a resistance test to check the resistance of the valve body heating wire; second, a sealing test to check the sealing performance of the valve body. Step 10: In a cleanroom environment, purge the valve body that has completed the test with nitrogen gas; after purging, conduct a comprehensive inspection of the valve body, and package it after confirming that it is qualified.

2. The synergistic process of CKD valve precision cleaning and helium mass spectrometry leak detection in the semiconductor diffusion equipment according to claim 1, characterized in that, include: The alkaline solution in step two is an aqueous solution of KOH and hydrogen peroxide, wherein the concentration of KOH is 5-10% and the concentration of hydrogen peroxide is 3-5%, the temperature of the alkaline solution is controlled at 50-60℃, and the soaking time is 3-6 hours.

3. The synergistic process of CKD valve precision cleaning and helium mass spectrometry leak detection in the semiconductor diffusion equipment according to claim 1, characterized in that, The temperature of the rinsing operation in step two is controlled at 55-65℃.

4. The synergistic process of CKD valve precision cleaning and helium mass spectrometry leak detection in the semiconductor diffusion equipment according to claim 1, characterized in that, In step three, the steam gun uses a spiral rinsing method to rinse the corrugated pipe, cover plate, and the inner side of the T-junction cavity for 40-70 seconds, and a circular rinsing method to rinse the outer side of the corrugated pipe, cover plate, and T-junction cavity for 40-70 seconds.

5. The synergistic process of CKD valve precision cleaning and helium mass spectrometry leak detection in the semiconductor diffusion equipment according to claim 1, characterized in that, In step four, the hot water temperature is 55-65℃, and the corrugated pipe, cover plate, and tee cavity are immersed in the hot water for 30-40 minutes.

6. The synergistic process of CKD valve precision cleaning and helium mass spectrometry leak detection in the semiconductor diffusion equipment according to claim 1, characterized in that, In step five, the bellows, cover plate and tee cavity are uniformly polished using pneumatic polishing. The polishing material should be selected according to the actual condition of the bellows, cover plate and tee cavity, and 8698#, 7447# and 7448# should be used in combination. After polishing, the bellows, cover plate and tee cavity are rinsed with steam and water gun. The rinsing time for the inner side is 15-25s and the rinsing time for the outer side is 15-25s.

7. The synergistic process of CKD valve precision cleaning and helium mass spectrometry leak detection in the semiconductor diffusion equipment according to claim 1, characterized in that, When performing ultrasonic cleaning in step six, the ultrasonic intensity is set to 12-20 W / inch. 2 The ultrasonic cleaning time should be controlled between 30 and 40 minutes.

8. The synergistic process of CKD valve precision cleaning and helium mass spectrometry leak detection in the semiconductor diffusion equipment according to claim 1, characterized in that, In step seven, the drying temperature of the oven is set to 100-105℃, and the drying time is 1-2 hours.

9. The synergistic process of CKD valve precision cleaning and helium mass spectrometry leak detection in the semiconductor diffusion equipment according to claim 1, characterized in that, In step eight, during the assembly of the components, the original sealing ring is replaced with the original factory sealing ring.

10. The synergistic process of CKD valve precision cleaning and helium mass spectrometry leak detection in the semiconductor diffusion equipment according to claim 1, characterized in that, In step nine, the resistance test is to test the resistance of the heating wire to ensure that the heating wire is not damaged; during the sealing test, an automatic constant temperature heating device is connected. This device includes a heating element and a temperature controller. The temperature controller is used to display the real-time temperature and has an over-temperature protection function. The sealing test is used to detect the valve body's opening and closing status and the valve body's sealing performance.

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