Radiator welding device for electronic product

Abstract

The radiator welding device for the electronic product comprises a high-frequency welding machine, a non-metal cover plate, a plurality of non-metal bases and a plurality of non-metal carrier plates, the non-metal cover plate is located above the non-metal carrier plates, and the area where an induction coil is arranged comprises the area located below a first containing groove and the area located below a second containing groove; a first pair of pins and a second pair of pins are arranged at the two ends of the non-metal carrier plate respectively, a first protruding strip and a second protruding strip which are located at the two ends of the non-metal cover plate respectively are embedded into the first pair of pins and the second pair of pins respectively, a third groove is formed in the surface, opposite to the non-metal carrier plate, of the non-metal cover plate, and a cooling pipe is installed in the third groove. And the high-frequency welding machine is connected with the induction coil. According to the radiator welding device for the electronic product, pipe expansion of a heat pipe is avoided, so that the production quality is guaranteed, the welding time and energy consumption are greatly shortened, damage to the heat pipe due to high temperature and long time is avoided, and the quality of a notebook radiator is improved.

Description

Technical Field

[0001] This invention relates to the technical field of welding apparatus, and more particularly to a welding apparatus for heat sinks used in electronic products. Background Technology

[0002] With the rapid development of the electronics industry, such as the significant increase in the processing speed of electronic components in computers, the heat generated has also increased dramatically. How to dissipate the heat of electronic components to ensure their normal operation has always been a problem that manufacturers must solve. Existing heat pipe radiator welding fixtures have welding materials between the heat pipes and copper blocks, and between the heat pipes and fins. These fixtures need to be heated in a tunnel furnace. The welding fixture is first preheated, and then the welding materials are melted to connect the heat pipes to the copper blocks and the fins. The melting time of the solder paste is relatively long, and the subsequent cooling time is also long, resulting in low production efficiency. Furthermore, the prolonged exposure of the fixture to high temperatures can damage the heat pipes in the radiator, such as causing pipe expansion, which also affects the quality of the laptop radiator. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a heat sink welding device for electronic products. This heat sink welding device for electronic products avoids the expansion of heat pipes, thereby ensuring production quality, and also greatly shortens welding time and energy consumption. It also avoids damage to heat pipes caused by high temperature and long time, thereby improving the quality of laptop heat sinks.

[0004] To achieve the above objectives, the technical solution adopted by the present invention is: a heat sink welding device for electronic products, wherein the heat sink includes heat pipes, copper blocks and fins, and includes: a high-frequency welding machine, a non-metallic cover plate, a plurality of non-metallic bases and a plurality of non-metallic carrier plates, wherein the upper surface of the non-metallic carrier plate has a first groove for placing heat pipes, a first receiving groove for placing copper blocks and solder and a second receiving groove for placing fins and solder; The non-metallic cover plate is located above the non-metallic carrier plate, and an induction coil is provided between the non-metallic carrier plate and the non-metallic base. The area where the induction coil is provided includes the area located below the first receiving groove and the second receiving groove. The non-metallic carrier plate has a first pair of pins and a second pair of pins at both ends. The first and second protrusions at both ends of the non-metallic cover plate are respectively embedded in the first pair of pins and the second pair of pins. The non-metallic cover plate has a third groove on the surface opposite to the non-metallic carrier plate. A cooling pipe is installed in this third groove. The high-frequency welding machine is connected to the induction coil.

[0005] The following is a further improvement to the above technical solution: 1. In the above scheme, the bottom of the first receiving groove and the second receiving groove are each provided with several through holes.

[0006] 2. In the above scheme, the cooling pipe is a cooling copper pipe.

[0007] 3. In the above scheme, the number of first receiving slots of the non-metallic carrier plate is 2, and the second receiving slot is located between the 2 first receiving slots.

[0008] 4. In the above scheme, the two second receiving slots are located at both ends of the non-metallic carrier plate.

[0009] 5. In the above scheme, the surface of the non-metallic base facing the non-metallic carrier plate has a second groove for placing the induction coil.

[0010] 6. In the above scheme, the non-metallic cover plate and non-metallic carrier plate are bakelite board, synthetic stone board or FR-4 board.

[0011] 7. In the above scheme, the non-metallic base is a bakelite board, a synthetic stone board, or an FR-4 board.

[0012] 8. In the above scheme, a spring is provided on each side of the copper block.

[0013] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art: 1. The present invention relates to a heat sink welding device for electronic products, comprising a high-frequency welding machine, a non-metallic cover plate, a plurality of non-metallic bases, and a plurality of non-metallic carrier plates. The non-metallic carrier plates have a first groove, a first receiving groove, and a second receiving groove on their upper surface. The non-metallic cover plate is located above the non-metallic carrier plates. An induction coil is disposed between the non-metallic carrier plates and the non-metallic bases. The area where the induction coil is disposed includes the area below the first and second receiving grooves. A high-frequency welding machine is connected to the induction coil. The high-frequency induction coil design, which mimics the shape of a heat pipe, enables simultaneous heating of multiple heat sinks, improving efficiency. Furthermore, the direct and rapid heat transfer to the solder significantly shortens welding time and energy consumption, and ensures uniform heat distribution. This also avoids damage to the heat pipes due to high temperatures and prolonged use, thereby improving the quality of laptop heat sinks.

[0014] 2. The present invention relates to a heat sink welding device for electronic products, wherein a first pair of pins and a second pair of pins are respectively provided at both ends of a non-metallic carrier plate, and a first protrusion and a second protrusion located at both ends of a non-metallic cover plate are respectively embedded in the first pair of pins and the second pair of pins. The high-frequency welding machine is connected to an induction coil, which can accurately place the non-metallic cover plate in the correct position and can also quickly pick up and put away the cover plate, thereby improving production efficiency. Furthermore, it realizes that one non-metallic cover plate corresponds to multiple non-metallic bases and non-metallic carrier plates, which reduces costs and greatly improves production efficiency. However, since heat will accumulate when the non-metallic cover plate is used repeatedly, a third groove is provided on the surface of the non-metallic cover plate and the non-metallic carrier plate opposite to each other. A cooling pipe is installed in this third groove, which effectively controls the heat of the cover plate and avoids the expansion of the heat pipe, thereby ensuring production quality. Attached Figure Description

[0015] Appendix Figure 1 This is a schematic diagram of the heat sink welding device for electronic products according to the present invention; Appendix Figure 2 This is an exploded perspective view of the heat sink welding device for electronic products according to the present invention.

[0016] In the above attached diagram: 1. Heat pipe; 2. Copper block; 3. Fin; 4. Non-metallic cover plate; 5. Non-metallic base; 6. Non-metallic carrier plate; 7. First groove; 8. First receiving groove; 9. Second receiving groove; 10. Induction coil; 11. Second groove; 12. Cooling pipe; 13. Third groove; 141. First pair of pins; 142. Second pair of pins; 151. First protrusion; 152. Second protrusion; 16. Through hole; 17. High-frequency welding machine; 18. Spring. Detailed Implementation

[0017] The present patent can be further understood through the specific embodiments given below, but they are not intended to limit the present patent.

[0018] The present invention will be further described below with reference to embodiments: Example 1: A heat sink welding device for electronic products, the heat sink includes heat pipe 1, copper block 2 and fins 3, including: high frequency welding machine 17, non-metallic cover plate 4, several non-metallic bases 5 and several non-metallic carrier plates 6, the upper surface of the non-metallic carrier plate 6 has a first groove 7 for placing heat pipe 1, a first receiving groove 8 for placing copper block 2 and solder and a second receiving groove 9 for placing fins 3 and solder; The non-metallic cover plate 4 is located above the non-metallic carrier plate 6. An induction coil 10 is provided between the non-metallic carrier plate 6 and the non-metallic base 5. The area where the induction coil 10 is located includes the area below the first receiving groove 8 and the second receiving groove 9. The non-metallic carrier plate 6 has a first pair of pins 141 and a second pair of pins 142 at its two ends. The first protrusion 151 and the second protrusion 152 at the two ends of the non-metallic cover plate 4 are respectively embedded in the first pair of pins 141 and the second pair of pins 142. The non-metallic cover plate 4 has a third groove 13 on the surface opposite to the non-metallic carrier plate 6. A cooling pipe 12 is installed in the third groove 13. The high-frequency welding machine 17 is connected to the induction coil 10.

[0019] The bottom of the first receiving groove 8 and the second receiving groove 9 are each provided with several through holes 16.

[0020] The two second receiving slots are located at both ends of the non-metallic carrier plate 6.

[0021] The aforementioned non-metallic cover plate 4 and non-metallic carrier plate 6 are FR-4 plates, and the aforementioned non-metallic base 5 is a synthetic stone slab.

[0022] A spring clip 18 is provided on each side of the aforementioned copper block 2.

[0023] Example 2: A heat sink welding device for electronic products, the heat sink including heat pipe 1, copper block 2 and fins 3, including: high frequency welding machine 17, non-metallic cover plate 4, several non-metallic bases 5 and several non-metallic carrier plates 6, the upper surface of the non-metallic carrier plate 6 having a first groove 7 for placing the heat pipe 1, a first receiving groove 8 for placing the copper block 2 and solder, and a second receiving groove 9 for placing the fins 3 and solder; The non-metallic cover plate 4 is located above the non-metallic carrier plate 6. An induction coil 10 is provided between the non-metallic carrier plate 6 and the non-metallic base 5. The area where the induction coil 10 is located includes the area below the first receiving groove 8 and the second receiving groove 9. The non-metallic carrier plate 6 has a first pair of pins 141 and a second pair of pins 142 at its two ends. The first protrusion 151 and the second protrusion 152 at the two ends of the non-metallic cover plate 4 are respectively embedded in the first pair of pins 141 and the second pair of pins 142. The non-metallic cover plate 4 has a third groove 13 on the surface opposite to the non-metallic carrier plate 6. A cooling pipe 12 is installed in the third groove 13. The high-frequency welding machine 17 is connected to the induction coil 10.

[0024] The bottom of the first receiving groove 8 and the second receiving groove 9 are each provided with several through holes 16.

[0025] The aforementioned cooling pipe 12 is a copper cooling pipe.

[0026] The non-metallic carrier plate 6 has two first receiving slots 8, and the second receiving slot 9 is located between the two first receiving slots 8; the two second receiving slots are located at both ends of the non-metallic carrier plate 6.

[0027] The surface of the non-metallic base 5 facing the non-metallic carrier plate 6 has a second groove 11 for placing the induction coil 10.

[0028] The aforementioned non-metallic cover plate 4 and non-metallic carrier plate 6 are bakelite boards.

[0029] The aforementioned non-metallic base 5 is an FR-4 plate.

[0030] When using the above-mentioned electronic product heat sink welding device, it has a non-metallic cover plate, several non-metallic bases and several non-metallic carrier plates, and a first groove, a first receiving groove and a second receiving groove on the upper surface of the non-metallic carrier plate; the non-metallic cover plate is located above the non-metallic carrier plate, and an induction coil is set between the non-metallic carrier plate and the non-metallic base. The area where the induction coil is set includes the area below the first receiving groove and the second receiving groove. A high-frequency welding machine is connected to the induction coil. The high-frequency induction coil design, which is modeled after a heat pipe, not only realizes the simultaneous heating of multiple heat sinks and improves efficiency, but also greatly shortens the welding time and energy consumption because the heat is directly and quickly transferred to the solder. In addition, the heat distribution is uniform, and the damage to the heat pipe caused by high temperature and long time is avoided, thereby improving the quality of the laptop heat sink. Furthermore, it can accurately place non-metallic covers in the correct positions and quickly pick them up and put them away, thereby improving production efficiency. Also, it enables one non-metallic cover to correspond to multiple non-metallic bases and non-metallic carrier plates, reducing costs and greatly improving production efficiency. However, since heat will accumulate when a non-metallic cover is used repeatedly, it has a third groove on the opposite surface of the non-metallic cover and the non-metallic carrier plate. A cooling pipe is installed in this third groove, which effectively controls the heat of the cover and avoids the expansion of the heat pipe, thereby ensuring production quality.

[0031] The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They should not be construed as limiting the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A heat sink welding apparatus for electronic products, the heat sink comprising a heat pipe (1), a copper block (2), and fins (3), characterized in that: include: A high-frequency welding machine (17), a non-metallic cover plate (4), several non-metallic bases (5) and several non-metallic carrier plates (6), wherein the upper surface of the non-metallic carrier plate (6) has a first groove (7) for placing a heat pipe (1), a first receiving groove (8) for placing a copper block (2) and solder, and a second receiving groove (9) for placing fins (3) and solder. The non-metallic cover plate (4) is located above the non-metallic carrier plate (6), and an induction coil (10) is provided between the non-metallic carrier plate (6) and the non-metallic base (5). The area where the induction coil (10) is located includes the area below the first receiving groove (8) and the second receiving groove (9). The non-metallic carrier plate (6) is provided with a first pair of pins (141) and a second pair of pins (142) at both ends. The first protrusion (151) and the second protrusion (152) located at both ends of the non-metallic cover plate (4) are respectively embedded in the first pair of pins (141) and the second pair of pins (142). The non-metallic cover plate (4) has a third groove (13) on the surface opposite to the non-metallic carrier plate (6). A cooling pipe (12) is installed in this third groove (13). The high-frequency welding machine (17) is connected to the induction coil (10).

2. The heat sink welding apparatus for electronic products according to claim 1, characterized in that: The bottom of the first receiving groove (8) and the second receiving groove (9) are each provided with several through holes (16).

3. The heat sink welding apparatus for electronic products according to claim 1, characterized in that: The cooling pipe (12) is a copper cooling pipe.

4. The heat sink welding apparatus for electronic products according to claim 1, characterized in that: The non-metallic carrier plate (6) has two first receiving slots (8), and the second receiving slot (9) is located between the two first receiving slots (8).

5. The heat sink welding apparatus for electronic products according to claim 1, characterized in that: The two second receiving slots are located at both ends of the non-metallic carrier plate (6).

6. The heat sink welding apparatus for electronic products according to claim 1, characterized in that: The surface of the non-metallic base (5) facing the non-metallic carrier plate (6) has a second groove (11) for placing the induction coil (10).

7. The heat sink welding apparatus for electronic products according to claim 1, characterized in that: The non-metallic cover plate (4) and non-metallic carrier plate (6) are bakelite, synthetic stone or FR-4 board.

8. The heat sink welding apparatus for electronic products according to claim 1, characterized in that: The non-metallic base (5) is a bakelite board, a synthetic stone board, or an FR-4 board.

9. The heat sink welding apparatus for electronic products according to claim 1, characterized in that: A spring clip (18) is provided on each side of the copper block (2).

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