Container plate laser cutting machining device and cutting method
By designing a laser cutting processing device for container panels, the device utilizes adjustment and conveying components to achieve accurate positioning and stable conveying of corrugated panels, solving the problem of inaccurate positioning during panel segmentation cutting and improving cutting effect and equipment utilization efficiency.
Patent Information
- Application Number
- CN202511733320.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-24
- Publication Date
- 2026-02-13
AI Technical Summary
In the existing technology, the inaccurate movement of the plate during the segmented cutting process of container plates leads to poor processing results. In addition, large laser cutting machines occupy a large area, are costly, and are difficult to transport.
A laser cutting processing device for container panels was designed, including a base, a toothed plate, a laser cutting head, a clamping plate, a support assembly, and a pre-placement platform. The device achieves accurate positioning and stable conveying of the corrugated panels through the adjustment assembly and the conveying assembly, and uses the support assembly and the clamping plate to prevent the panels from shifting position and being damaged during the cutting process.
It improves the accuracy and efficiency of sheet metal cutting, reduces the equipment footprint and cost, and avoids positional shift and damage to the sheet metal during the cutting process.
Smart Images
Figure CN121514712A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of laser cutting, in particular to a container plate laser cutting device and cutting method. BACKGROUND
[0002] The production of a container is by extruding a steel plate into a corrugated plate, then cutting and punching the corrugated plate. After the surface of the corrugated plate is punched, the parts can be installed and the plate materials constituting the container can be connected, thereby obtaining the container. In the current manufacturing process of the container, the cutting and processing of the plate is mostly carried out by using a laser cutting machine. The cutting position is set according to the structure of the container, and the laser cutting device moves along the set path to cut.
[0003] In the prior art, due to the large size of the container, the length of the corrugated plate used is mostly long, mostly about 6 to 14 meters. Currently, some manufacturers use large laser cutting machines. The moving range of the laser cutting head on the large laser cutting machine is large, and the entire corrugated plate can be processed. However, such a laser cutting machine has a large floor area and high cost, and it is difficult to handle when loading and unloading large plate parts. At present, the laser cutting device with a smaller processing range is still used. When processing long plate parts on these laser cutting devices, the plate parts need to be moved repeatedly for segmented cutting. In the moving process, it is inevitable that there will be differences in the moving position of the plate parts, which may cause the cutting point to be inaccurate during subsequent connection processing, affecting the processing effect. SUMMARY
[0004] To overcome the above-mentioned defects, the embodiments of the present application provide a container plate laser cutting device and cutting method, which solves the technical problem that the position of the moving plate may not be accurate when the longer plate on the container is segmented cut in the prior art, affecting the processing effect.
[0005] The utility model provides a kind of container plate laser cutting processing device, including base, toothed plate and laser cutting head, multiple toothed plate is fixedly connected on the base, for placing wave plate, laser cutting head is slidably connected on the base, it further includes hold-down plate, support assembly and pre-placement terrace, multiple hold-down plate is slidably connected on the base respectively, the side of hold-down plate and wave plate contact is provided with the protrusion corresponding with wave plate, multiple support assembly is arranged on the toothed plate, when wave plate is slid on the toothed plate, the support assembly can push up wave plate, and separate from the toothed plate, so that wave plate is contacted with support assembly when sliding, pre-placement terrace is arranged in the side of the base, wave plate is placed on the pre-placement terrace before moving to the base, platform one and platform two are arranged on the pre-placement terrace, platform one is arranged on the pre-placement terrace on the side away from the base, adjusting assembly is arranged on platform one, conveying assembly is arranged on platform two, the adjusting assembly is used to drive wave plate and conveying assembly alignment, conveying assembly is used to drive wave plate to move, hold-down plate and conveying assembly are aligned.
[0006] The hold-down plate is slidably connected with the base by the fitting assembly, the fitting assembly includes a fixed frame, a drive cylinder one and a sliding block, the fixed frame is fixedly connected to the base, the drive cylinder one is installed on the fixed frame, the sliding block is fixedly arranged on both sides of the hold-down plate, the sliding block is slidably connected to the fixed frame, the output end of the drive cylinder one is connected to the sliding block, and the hold-down plate can be obliquely slid on the fixed frame through the sliding block.
[0007] Multiple protrusions on the hold-down plate are each provided with a heat dissipation hole, the hold-down plate is fitted with the wave plate, and the side of the hold-down plate close to the conveying assembly is arc-shaped.
[0008] The support assembly includes a V-shaped frame, a cover plate and a rotating shaft, the V-shaped frame is rotatably connected to the toothed plate, one end at the upper end of the toothed plate is rotatably connected to a rotating drum, the rotating drum can contact the side of the wave plate close to the toothed plate, the cover plate is fixedly connected to the base, a drive cylinder two is rotatably connected below, the rotating shaft is rotatably connected to one end of the V-shaped frame away from the rotating drum, the output end of the drive cylinder two is slidably connected to the rotating shaft, a spring is sleeved on the rotating shaft, the output end of the drive cylinder two and the rotating shaft are respectively connected to both ends of the spring, the drive cylinder two, the spring and the rotating shaft are always below the cover plate, and the position of the V-shaped frame rotatably connected to the rotating shaft can be rotated below the cover plate.
[0009] When the output end of the second driving cylinder is extended, the output end can directly push the rotating shaft to move; when the output end of the second driving cylinder is shortened, the spring can pull the rotating shaft to move; the rotating shaft can drive the V-shaped frame to rotate to support the wave plate on the rotating drum; the side of the V-shaped frame away from the cover plate is arranged in an arc shape; when the wave plate moves and contacts the V-shaped frame, the V-shaped frame can be squeezed to rotate and move above the V-shaped frame; at this time, the rotating drum contacts the wave plate; when the V-shaped frame is squeezed to rotate, the spring is stretched and elongated.
[0010] The output end of the second driving cylinder can be shortened to pull the spring to drive the V-shaped frame to rotate and lift the wave plate; the output end of the second driving cylinder can be extended to push the rotating shaft and then push the V-shaped frame to rotate and place the wave plate on the tooth plate; the spring can be used as a shock-absorbing device when the wave plate is on the rotating drum; when the edge of the wave plate squeezes the V-shaped frame, the spring can be stretched to support the wave plate at the bottom of the V-shaped frame.
[0011] The adjusting assembly comprises a screw shaft and a driving component; the screw shaft is rotationally connected to the platform one; the protrusion on the wave plate is opposite to the protrusion of the screw on the screw shaft; the driving component is arranged on the platform one and can drive the screw shaft to rotate; the screw shaft can drive the wave plate to slide when the screw shaft rotates.
[0012] The conveying assembly comprises a wave roller one and a wave roller two; the wave roller one is vertically and slidably connected to the platform two; the wave plate is placed on the wave roller one; the wave roller two is vertically and slidably connected to the platform two; the wave roller two is arranged above the wave plate; the wave roller one and the wave roller two are arranged in a staggered manner; the wave roller one and the wave roller two are provided with a plurality of cams; the cams of the wave roller one and the wave roller two correspond to the recessed positions on the two sides of the wave plate; the wave roller one can rotate to drive the wave plate to move.
[0013] A container plate laser cutting processing method, according to the above-mentioned container plate laser cutting processing device, comprises the following steps: Step one, plate placement: place the wave plate on the screw shaft and align the protrusion on the wave plate with the screw thread on the screw shaft; Step two, horizontal pushing: the driving component drives the screw shaft to rotate and drives the wave plate to slide horizontally, so that the gap between the wave roller one and the wave roller two is aligned with the wave plate; Step three, alignment sliding: the wave plate slides between the wave roller one and the wave roller two; the wave roller one and the wave roller two drive the wave plate to move above the tooth plate and drive the wave plate to move towards the tooth plate; Step four, plate conveying: the output end of the driving cylinder one is elongated to push the pressing plate to slide obliquely upwards, the output end of the driving cylinder two is shortened to pull the V-shaped frame to rotate, so that the rotating drum supports the wave plate, when the wave plate contacts the V-shaped frame, the spring is stretched and elongated; Step five, preparation for cutting: the output end of the driving cylinder two is elongated to push the V-shaped frame to rotate, the rotating drum is separated from the wave plate, the wave roller one and the wave roller two drive the wave plate to move downwards, the output end of the driving cylinder two is shortened to separate the rotating drum from the wave plate, and the output end of the driving cylinder one is shortened to drive the pressing plate to contact the wave plate; Step six, segmented movement: the laser cutting head cuts the wave plate, after cutting the wave plate in the cutting range, the wave plate is moved again, and the uncut part is cut again.
[0014] The beneficial effects of the present application are: When the traditional laser cutting machine cuts the container plate, a large cutting machine or manual segmented movement of the plate is used for processing. In the segmented movement, the position after the movement is inevitably offset, and the unstable placement affects the processing effect. In the present application, a pre-placement platform is arranged on the side of the base, which serves as a support for the longer part of the plate and drives the plate to move horizontally and vertically, so that the protrusions and depressions of the wave plate are fixed in the correct position. The components for pressing and lifting the wave plate are arranged on the base and the tooth plate respectively, so that the wave plate will not be damaged by friction with the teeth on the tooth plate during segmented transportation. The protrusions on the pressing plate cooperate with the conveying assembly to prevent the wave plate from sliding and offsetting during transportation. BRIEF DESCRIPTION OF DRAWINGS
[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the description of the embodiments of the present application will be briefly introduced. Obviously, the drawings in the following description are only some example embodiments of the present application. Those skilled in the art can obtain other drawings according to the content of the example embodiments of the present application and the drawings without creating any creative labor.
[0016] Fig. 1 It is a whole structure schematic diagram of a container plate laser cutting processing device in an embodiment of the present application; Fig. 2 It is another perspective structure schematic diagram of the whole container plate laser cutting processing device of the present application; Fig. 3 It is a local structure schematic diagram of the fitting assembly and the pressing plate in the present application; Fig. 4 It is a local sectional structure schematic diagram of the supporting assembly in the present application; Fig. 5 Figure 2 is a schematic diagram of the partial structure of the driving cylinder two and the rotating shaft in the application; Fig. 6 Figure 3 is a schematic diagram of the structure of the adjusting assembly and the conveying assembly in the application.
[0017] In the figure: 1, base; 2, toothed plate; 3, laser cutting head; 4, pressing plate; 5, pre-placing platform; 6, platform one; 7, platform two; 8, fixing frame; 9, driving cylinder one; 10, sliding block; 11, heat dissipation hole; 12, V-shaped frame; 13, rotating cylinder; 14, cover plate; 15, driving cylinder two; 16, rotating shaft; 17, spring; 18, screw shaft; 19, driving part; 20, wave roller one; 21, wave roller two. DETAILED DESCRIPTION
[0018] The application will be further described below in conjunction with the drawings and examples. It can be understood that the specific examples described herein are only used to explain the application, but not to limit the application.
[0019] In order to make the drawing simple, only the parts related to the application are shown in each figure, which does not represent the actual structure of the product. In addition, in order to make the drawing simple and easy to understand, in some figures, only one of the parts with the same structure or function is shown, or only one of them is marked. In this text, "one" not only means "only one", but also means "more than one", and "several" includes "two" and "more than two".
[0020] In this text, it is necessary to point out that, unless otherwise explicitly specified and limited, the terms "mounting", "connection" and "connection" should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or the communication inside two elements. For ordinary skilled in the art, the specific meaning of the above terms in the application can be understood according to the specific circumstances.
[0021] In the application, unless otherwise explicitly specified and limited, the "upper" or "lower" of the first feature to the second feature can include the direct contact of the first and second features, or the indirect contact of the first and second features through another feature between them. Moreover, the "upper", "upper" and "upper" of the first feature to the second feature includes the vertical and oblique above of the first feature to the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The "below", "below" and "below" of the first feature to the second feature includes the vertical and oblique below of the first feature to the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.
[0022] In the description of this embodiment, terms such as "upper," "lower," "left," and "right" are based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of description and simplification of operation, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.
[0023] Furthermore, in the description of this application, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0024] Example 1 like Figs. 1-6 The diagram illustrates a laser cutting device for container panels according to an embodiment of the present invention. It includes a base 1, toothed plates 2, and a laser cutting head 3. Multiple toothed plates 2 are fixedly connected to the base 1 for placing corrugated plates. The laser cutting head 3 is slidably connected to the base 1. The device also includes a clamping plate 4, support components, and a pre-placement platform 5. Multiple clamping plates 4 are slidably connected to the base 1. Each clamping plate 4 has a protrusion corresponding to the corrugated plate on its contact side. Multiple support components are disposed on the toothed plates 2. When the corrugated plate slides on the toothed plates 2, the support components can push the corrugated plate upwards and separate it from the toothed plates 2, allowing the corrugated plate to contact the support components during sliding. The pre-placement platform 5 is disposed on the side of the base 1. The corrugated plate is placed on the pre-placement platform 5 before moving onto the base 1. On platform 5, a platform 6 and a platform 7 are provided on the pre-placement platform 5. Platform 6 is located on the side of the pre-placement platform 5 away from the base 1. An adjustment component is provided on platform 6, and a conveying component is provided on platform 7. The adjustment component is used to align the wave plate with the conveying component, and the conveying component is used to move the wave plate. The clamping plate 4 is aligned with the conveying component. In this application, platform 6 is higher than platform 7 in the pre-placement platform 5. The wave plate is first adjusted on platform 6 by the adjustment component so that the conveying component and the clamping plate 4 can be aligned with the wave plate. By corresponding with the protrusions and depressions on the wave plate, it is easy to position the wave plate. At the same time, the wave plate will not come into contact with the toothed plate 2 when it slides, thus avoiding damage to the surface of the wave plate.
[0025] like Figs. 1-3As shown, the pressing plate 4 is connected with the base 1 through the fitting assembly, the fitting assembly comprises a fixing frame 8, a driving cylinder 9 and a sliding block 10, the fixing frame 8 is fixedly connected on the base 1, the driving cylinder 9 is installed on the fixing frame 8, the sliding block 10 is fixedly arranged on both sides of the pressing plate 4, the sliding block 10 is slidably connected on the fixing frame 8, the output end of the driving cylinder 9 is connected with the sliding block 10, the pressing plate 4 can be obliquely slid on the fixing frame 8 through the sliding block 10, a plurality of heat dissipation holes 11 are arranged on the pressing plate 4, the pressing plate 4 is fitted with the wave plate, and one side of the pressing plate 4 close to the conveying assembly is arranged in a circular arc shape, the pressing plate 4 is fitted with the wave plate, a large amount of heat is diffused when the wave plate is cut, after the heat is transmitted to the pressing plate 4, the pressing plate 4 and the heat dissipation holes 11 can accelerate the heat diffusion on the wave plate, and the deformation of the wave plate caused by excessive heating during laser cutting is reduced, in the embodiment, the fitting assembly and the pressing plate 4 are both provided with two groups, which are arranged on both sides of the base 1, the laser cutting head 3 moves between the two pressing plates 4 to process, and at the same time, the pressing plate 4 can fix the wave plate on the tooth plate 2 during processing, so as to avoid the warping and fluctuation caused by the overlong wave plate, at the same time, the circular arc shape on the pressing plate 4 can facilitate the wave plate to slide without being scratched and damaged when the upper surface of the wave plate contacts the pressing plate 4, the inclined sliding of the pressing plate 4 can adjust the pressing degree of the wave plate by extending the sliding length of the pressing plate 4, and the overstrong pressing force is easy to cause damage to the surface of the wave plate, recesses are arranged on both sides of the base 1 where the wave plate slides, so that the wave plate directly contacts the tooth plate 2 after being slid on the base 1.
[0026] As Figs. 4-5As shown, the support assembly comprises a V-shaped frame 12, a cover plate 14 and a rotating shaft 16, the V-shaped frame 12 is rotationally connected to the tooth plate 2, one end of the V-shaped frame 12 at the upper end of the tooth plate 2 is rotationally connected to a rotating drum 13, the rotating drum 13 can be in contact with the wave plate close to the side of the tooth plate 2, the cover plate 14 is fixedly connected to the base 1, and a driving cylinder two 15 is rotationally connected below the cover plate 14, the rotating shaft 16 is rotationally connected to one end of the V-shaped frame 12 away from the rotating drum 13, the rotating shaft 16 is slidably connected to the output end of the driving cylinder two 15, the spring 17 is sleeved on the rotating shaft 16, and the output end of the driving cylinder two 15 and the rotating shaft 16 are connected to two ends of the spring 17 respectively, the driving cylinder two 15, the spring 17 and the rotating shaft 16 are always below the cover plate 14, the position of the V-shaped frame 12 rotationally connected to the rotating shaft 16 can be rotated to below the cover plate 14, a slot corresponding to the rotating drum 13 is formed in the tooth plate 2, when the output end of the driving cylinder two 15 is elongated, the output end and the rotating shaft 16 slide to the abutting position, the output end of the driving cylinder two 15 directly pushes the rotating shaft 16, and then the V-shaped frame 12 drives the rotating drum 13 to rotate into the slot in the tooth plate 2, when the output end of the driving cylinder two 15 is shortened, the output end and the rotating shaft 16 slide relative to each other, at this time, the spring 17 is stretched and elongated to drive the V-shaped frame 12 to rotate, the rotating drum 13 is in contact with the wave plate, at this time, the wave plate slides on the rotating drum 13, when one end of the wave plate is sliding to above the tooth plate 2, the edge is in contact with the arc edge of the V-shaped frame 12 to drive the V-shaped frame 12 to rotate, at this time, the rotating shaft 16 stretches the spring 17, and the rotating drum 13 gradually rotates below the wave plate along with the rotation of the V-shaped frame 12, and in the movement process of the wave plate, the wave plate may shake, the spring 17 and the V-shaped frame 12 can form a damping device, the spring 17 can damp the shaking of the spring 17 plate and keep the sliding of the spring 17 plate, and part of the molten waste debris and the like is generated in the laser cutting, the cover plate 14 is arranged, so that the amount of debris falling on the driving cylinder two 15 and the spring 17 is reduced, and damage caused by the debris is avoided.
[0027] As Figs. 1-5As shown, when the output end of the second driving cylinder 15 is extended, it can directly push the rotating shaft 16 to move, and when the output end of the second driving cylinder 15 is shortened, it can pull the rotating shaft 16 to move through the spring 17. The rotating shaft 16 can drive the V-shaped frame 12 to rotate to make the rotating drum 13 support the wave plate. The side of the V-shaped frame 12 away from the cover plate 14 is arc-shaped. When the wave plate moves and contacts the V-shaped frame 12, the V-shaped frame 12 can be squeezed to rotate and move above the V-shaped frame 12. At this time, the rotating drum 13 is in contact with the wave plate. When the V-shaped frame 12 is squeezed to rotate, the spring 17 is stretched and elongated. The second driving cylinder 15 and the spring 17 are below the cover plate 14, which can reduce the influence of debris. The spring 17 is arranged to stretch the V-shaped frame 12 to support the wave plate, which can support the wave plate on the tooth plate 2. At the same time, when the V-shaped frame 12 contacts the edge of the wave plate, the V-shaped frame 12 can be rotated to reduce the shock effect. At the same time, the output end of the second driving cylinder 15 pushes the rotating shaft 16 to make the rotating drum 13 move into the groove on the tooth plate 2, which can avoid the problem that the rotating drum 13 is still in contact with the wave plate due to incomplete pushing.
[0028] As shown in Fig. 1 and Fig. 6 The adjusting assembly includes a spiral shaft 18 and a driving part 19. The spiral shaft 18 is rotatably connected to the platform 6. The protrusions on the wave plate are opposite the protrusions of the spiral on the spiral shaft 18. The driving part 19 is arranged on the platform 6 and can drive the plurality of spiral shafts 18 to rotate simultaneously. The spiral shaft 18 can drive the wave plate to slide when it rotates. In the embodiment, the spiral shaft 18 is provided with two, and the positions of the protrusions on the two spiral shafts 18 correspond to each other. The two spiral shafts 18 are driven by the driving part 19 to rotate at the same speed. First, the wave plate is placed on the spiral shaft 18. When the spiral shaft 18 rotates, the protrusions of the spiral push the protrusions on the wave plate to make the wave plate slide horizontally, so that the protrusions and the depressions are aligned with the wave roller one 20 and the wave roller two 21.
[0029] As shown in Fig. 6As shown, the conveying assembly comprises wave rollers one 20 and wave rollers two 21, a plurality of wave rollers one 20 are vertically and slidingly connected on the platform two 7, the wave plate is placed on the wave rollers one 20, a plurality of wave rollers two 21 are vertically and slidingly connected on the platform two 7, the wave rollers two 21 are arranged above the wave plate, the wave rollers one 20 and the wave rollers two 21 are staggered, and a plurality of cams are arranged on the wave rollers one 20 and the wave rollers two 21, and the cams on the wave rollers one 20 and the wave rollers two 21 correspond to the recessed positions on the two sides of the wave plate, the wave rollers one 20 can rotate to drive the wave plate to move, in the embodiment, the wave rollers two 21 are provided with two, the wave rollers one 20 are provided with three, and driving devices are arranged on the connecting positions of the wave rollers one 20 and the wave rollers two 21 in the platform two 7 to drive the wave rollers one 20 and the wave rollers two 21 to lift, the output end of the motor is in transmission connection with the wave rollers one 20, for driving the wave rollers one 20 to rotate to convey the wave plate, and the wave plate slides on the spiral shaft 18 when moving, and the spiral shaft 18 does not rotate.
[0030] In the embodiment, the device for conveying the wave plate is arranged on the existing laser cutting machine, so that the long wave plate can be automatically segmented and cut, the moving distance and the processing position can be set each time, and the horizontal position of the wave plate during transportation is maintained, compared with the traditional manual movement, the efficiency and the accuracy can be greatly improved, when processing, the processing position near the pressing plate 4 is pressed to avoid the shaking of the long wave plate or the shaking of the wave plate due to the stress change after the heating of part positions, the stability of the processing position is improved, the heat dissipation of the wave plate is accelerated, the deformation caused by excessive heat accumulation is reduced, and the V-shaped frame 12 is arranged at the position of the tooth plate 2 to dynamically support the wave plate when the wave plate slides, so that the tooth plate 2 does not scratch the wave plate below, which is a problem that cannot be avoided by manual transportation.
[0031] Embodiment two The application also provides a container plate laser cutting processing and cutting method, and the container plate laser cutting processing device comprises the following steps: Step one, plate placement: the wave plate is placed on the spiral shaft 18, and the protrusions on the wave plate are aligned with the threads on the spiral shaft 18; Step two, horizontal pushing: the driving part 19 drives the spiral shaft 18 to rotate, drives the wave plate to slide horizontally, and makes the gap between the wave rollers one 20 and the wave rollers two 21 align with the wave plate; Step three, alignment sliding: the wave plate slides to the gap between the wave rollers one 20 and the wave rollers two 21, the wave rollers one 20 and the wave rollers two 21 drive the wave plate to move above the tooth plate 2 and drive the wave plate to move to the tooth plate 2; Step four, plate conveying: the output end of the driving cylinder 1 is extended to push the pressing plate 4 to slide obliquely upward, the output end of the driving cylinder 2 is shortened to pull the V-shaped frame 12 to rotate, so that the rotating drum 13 supports the wave plate, and when the wave plate contacts the V-shaped frame 12, the spring 17 is stretched and elongated; Step five, preparation for cutting: the output end of the driving cylinder 2 is extended to push the V-shaped frame 12 to rotate, the rotating drum 13 is separated from the wave plate, the wave roller 1 and the wave roller 2 drive the wave plate to move downward, the output end of the driving cylinder 2 is shortened to separate the rotating drum 13 from the wave plate, and the output end of the driving cylinder 1 is shortened to drive the pressing plate 4 to contact the wave plate; Step six, segmented movement: the laser cutting head 3 cuts the wave plate, after cutting the wave plate in the cutting range, the wave plate is moved again, and the uncut part is cut again.
[0032] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present application and are not limited. Although the present application has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present application can be modified or replaced equivalently without departing from the spirit and scope of the technical solutions of the present application, which should be covered in the scope of the claims of the present application.
Claims
1. A container plate laser cutting processing device, comprising a base (1), a toothed plate (2) and a laser cutting head (3), a plurality of said toothed plates (2) are fixedly connected on the base (1) for placing corrugated plates, the laser cutting head (3) is slidingly connected on the base (1), characterized in that, Also include: A plurality of pressing plates (4) are respectively connected in sliding connection on the base (1), and a side of the pressing plate (4) in contact with the wave plate is provided with a protrusion corresponding to the wave plate; A plurality of support assemblies are provided on the tooth plate (2), and the support assemblies can push the wave plate upward when the wave plate slides on the tooth plate (2), and are separated from the tooth plate (2), so that the wave plate is in contact with the support assembly when sliding; A pre-placement platform (5) is provided on the side of the base (1), and the wave plate is placed on the pre-placement platform (5) before moving to the base (1), and the pre-placement platform (5) is provided with a platform one (6) and a platform two (7), the platform one (6) is provided on the side of the pre-placement platform (5) away from the base (1), the platform one (6) is provided with an adjusting assembly, the platform two (7) is provided with a conveying assembly, the adjusting assembly is used to align the wave plate with the conveying assembly, and the conveying assembly is used to move the wave plate; The pressing plate (4) is aligned with the conveying assembly.
2. The laser cutting apparatus for a container plate according to claim 1, wherein The pressing plate (4) is connected in sliding connection with the base (1) through a fitting assembly, and the fitting assembly comprises: A fixed frame (8) is fixedly connected to the base (1), and a drive cylinder one (9) is installed on the fixed frame (8); A sliding block (10) is fixedly arranged on both sides of the pressing plate (4), and the sliding block (10) is connected in sliding connection with the fixed frame (8), and the output end of the drive cylinder one (9) is connected with the sliding block (10); The pressing plate (4) can be obliquely slid on the fixed frame (8) through the sliding block (10).
3. The laser cutting apparatus for a container plate according to claim 2, wherein A plurality of protrusions on the pressing plate (4) are provided with heat dissipation holes (11), the pressing plate (4) is fitted with the wave plate, and a side of the pressing plate (4) close to the conveying assembly is arc-shaped.
4. The apparatus according to claim 2, wherein The support assembly comprises: A V-shaped frame (12) is rotatably connected to the tooth plate (2), one end of the V-shaped frame (12) at the upper end of the tooth plate (2) is rotatably connected with a rotating cylinder (13), and the rotating cylinder (13) can be in contact with a side of the wave plate close to the tooth plate (2); A cover plate (14) is fixedly connected to the base (1), and a drive cylinder two (15) is rotatably connected below the cover plate (14); A rotating shaft member (16) is rotatably connected to one end of the V-shaped frame (12) away from the rotating cylinder (13), the output end of the drive cylinder two (15) is connected in sliding connection with the rotating shaft member (16), a spring (17) is sleeved on the rotating shaft member (16), and the output end of the drive cylinder two (15) and the rotating shaft member (16) are respectively connected with both ends of the spring (17).
5. The apparatus according to claim 4, wherein When the output end of the drive cylinder two (15) is elongated, the rotating shaft member (16) can be directly pushed to move, when the output end of the drive cylinder two (15) is shortened, the rotating shaft member (16) can be pulled to move through the spring (17), and the rotating shaft member (16) can drive the V-shaped frame (12) to rotate so that the rotating cylinder (13) supports the wave plate.
6. The apparatus according to claim 5, wherein The adjusting assembly comprises: A plurality of spiral shafts (18) are rotationally connected to the first platform (6), and the protrusions on the wave plate are connected to the protrusions of the spiral threads on the spiral shafts (18); A driving component (19) is arranged on the first platform (6) and can drive the plurality of spiral shafts (18) to rotate simultaneously, and the spiral shafts (18) can drive the wave plate to slide when rotating.
7. The apparatus according to claim 6, wherein The conveying assembly comprises: A plurality of wave rollers one (20) are vertically and slidably connected to the second platform (7), and the wave plate is placed on the wave rollers one (20); A plurality of wave rollers two (21) are vertically and slidably connected to the second platform (7), the wave rollers two (21) are arranged above the wave plate, the wave rollers one (20) and the wave rollers two (21) are arranged alternately, and a plurality of cams are arranged on the wave rollers one (20) and the wave rollers two (21), and the cams on the wave rollers one (20) and the wave rollers two (21) correspond to the recessed positions on the two sides of the wave plate; The wave rollers one (20) can rotate to drive the wave plate to move.
8. The apparatus according to claim 4, wherein The side of the V-shaped frame (12) away from the cover plate (14) is arranged in a circular arc shape, and when the wave plate moves and contacts the V-shaped frame (12), the V-shaped frame (12) can be squeezed to rotate and move above the V-shaped frame (12), at this time, the rotating drum (13) contacts the wave plate, and when the V-shaped frame (12) is squeezed to rotate, the spring (17) is stretched and elongated.
9. The apparatus according to claim 4, wherein The driving cylinder two (15), the spring (17) and the rotating shaft (16) are always below the cover plate (14), and the position of the V-shaped frame (12) rotationally connected to the rotating shaft (16) can rotate below the cover plate (14).
10. A laser cutting method for cutting a container plate, the laser cutting method being characterized by using the laser cutting apparatus according to any one of claims 1 to 9. The method comprises the following steps: S1, placing the plate: placing the wave plate on the spiral shaft (18), and aligning the protrusions on the wave plate with the spiral threads on the spiral shaft (18); S2, pushing horizontally: the driving component (19) drives the spiral shaft (18) to rotate, drives the wave plate to slide horizontally, and aligns the gap between the wave rollers one (20) and the wave rollers two (21) with the wave plate; S3, aligning and sliding: the wave plate slides between the wave rollers one (20) and the wave rollers two (21), the wave rollers one (20) and the wave rollers two (21) drive the wave plate to move above the tooth plate (2) and drive the wave plate to move towards the tooth plate (2); S4, conveying the plate: the output end of the driving cylinder one (9) is elongated to push the pressing plate (4) to slide obliquely upwards, the output end of the driving cylinder two (15) is shortened to pull the V-shaped frame (12) to rotate, so that the rotating drum (13) supports the wave plate, and when the wave plate contacts the V-shaped frame (12), the spring (17) is stretched and elongated. S5, preparation cutting: drive cylinder two (15) output end elongation push V type frame (12) rotation, rotating drum (13) and wave plate separation, wave roller one (20) and wave roller two (21) drive wave plate downward movement, drive cylinder two (15) output end shortening makes rotating drum (13) and wave plate separation, drive cylinder one (9) output end shortening drive compression plate (4) and wave plate contact; S6, subsection movement: laser cutting head (3) to wave plate cutting, to the wave plate cutting range cutting is completed, again drive wave plate movement, again to the part of the cutting.