Epoxy resin composition and packaging material

Abstract

The invention discloses an epoxy resin composition and a packaging material, and relates to the technical field of packaging materials. The epoxy resin composition comprises epoxy resin, an anhydride curing agent and a curing accelerator, wherein the curing agent comprises a tung oil-based anhydride curing agent, and the curing accelerator comprises a compound as shown in the following formula (1). The epoxy resin composition provided by the embodiment of the invention has relatively low warping degree.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of packaging materials, in particular to an epoxy resin composition and a packaging material. BACKGROUND

[0002] High-performance storage products are rapidly developing to meet the high demand in the era of artificial intelligence. Smaller, faster, higher bandwidth, and better performance are the iterative directions that will also bring new challenges to the development of the next generation of products, namely, excessive heat. SK Hynix has developed a new advanced packaging technology called Mass Reflow-Molded Underfill (MR-MUF), which can effectively improve the heat dissipation performance of chips. In the MR-MUF advanced packaging technology, a key packaging material, Liquid Molded Underfill (LMUF), is used as a protective material to fill the gaps between chips, and has excellent mechanical properties, electrical insulation, heat resistance, and high reliability.

[0003] However, due to the high restrictions of the Joint Electron Device Engineering Council (JEDEC) on High Bandwidth Memory (HBM), the subsequent technology iteration direction of HBM must both maintain the increase in the number of stacked chips and control the product thickness. Therefore, how to control the warpage of the molded product has become a key technical problem in the development of LMUF. SUMMARY

[0004] Therefore, the present application provides an epoxy resin composition and a packaging material, aiming to improve at least one of the above technical problems.

[0005] In a first aspect, the present application provides an epoxy resin composition, which comprises: an epoxy resin, an acid anhydride curing agent, and a curing accelerator. The acid anhydride curing agent comprises a tung oil-based acid anhydride curing agent, and the curing accelerator comprises a compound represented by the following formula (1). Formula (1).

[0006] In some embodiments of the present application, the epoxy resin composition further comprises an inorganic filler, and the epoxy resin composition comprises the epoxy resin 0.5 to 25 parts by mass; the acid anhydride curing agent 1 to 20 parts; the inorganic filler 60 to 92 parts; and the curing accelerator 0.1 to 1 part.

[0007] In some embodiments of the present application, the anhydride curing agent comprises a first curing agent and a second curing agent, the first curing agent being the tung oil-based anhydride curing agent; the second curing agent comprising at least one of alkyl hexahydrophthalic anhydride, alkyl tetrahydrophthalic anhydride, nadic anhydride, succinic anhydride, trimellitic anhydride, and pyromellitic anhydride.

[0008] In some embodiments of the present application, the tung oil-based anhydride curing agent accounts for 20% to 80% of the anhydride curing agent by mass; Preferably, the tung oil-based anhydride curing agent accounts for 40% to 60% of the anhydride curing agent.

[0009] In some embodiments of the present application, the epoxy resin comprises a first epoxy resin and a second epoxy resin; wherein the first epoxy resin comprises at least one of bisphenol A type epoxy resin, bisphenol F type epoxy resin, naphthalene type epoxy resin, or alicyclic epoxy resin; and the second epoxy resin is a polyol-modified epoxy resin.

[0010] In some embodiments of the present application, the second epoxy resin is at least one of glycerol triglycidyl ether, butanediol diglycidyl ether, sorbitol glycidyl ether, and castor oil triglycidyl ether; And / or, the epoxy equivalent weight of the first epoxy resin is 150 g / eq - 180 g / eq; And / or, the mass ratio of the first epoxy resin to the second epoxy resin is 1: (1-1.5).

[0011] In some embodiments of the present application, the curing accelerator comprises a first curing accelerator and a second curing accelerator, the curing accelerator being a compound represented by formula (1), and the ratio of the first curing accelerator to the curing accelerator is not less than 20% by mass fraction.

[0012] In some embodiments of the present application, the viscosity of the epoxy resin composition at room temperature is not more than 300 Pa·s; And / or, the warpage of the cured product of the epoxy resin composition is not more than 3.2 mm.

[0013] In some embodiments of the present application, the mass fraction of the epoxy resin is 10 parts to 15 parts; the mass fraction of the anhydride curing agent is 7 parts to 12 parts; the mass fraction of the inorganic filler is 75 parts to 80 parts; and the mass fraction of the curing accelerator is 0.1 part to 1 part.

[0014] The second aspect of the present application provides a packaging material, which is obtained by curing the epoxy resin composition.

[0015] Beneficial effects: The epoxy resin composition provided by the embodiment of the present application comprises an epoxy resin, a tung oil-based anhydride curing agent and a curing accelerator with the structure of formula (1). The epoxy resin composition in the present application has a low warpage after curing through the synergistic effect of the tung oil-based anhydride curing agent and the curing accelerator with the structure of formula (1). DETAILED DESCRIPTION

[0016] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of the present application. In addition, it should be understood that the specific embodiments described herein are only for the purpose of illustration and explanation of the present application, and are not intended to limit the present application.

[0017] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terminology used in the description of the present application herein only for the purpose of describing the specific embodiments and is not intended to limit the present application. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0018] In the present application, "and / or" describes the association relationship of the associated objects, which means that there can be three kinds of relationships, for example, A and / or B, which can represent the following cases: A exists alone, A and B exist simultaneously, and B exists alone. Wherein A and B can be singular or plural.

[0019] In the present application, "at least one" means one or more, and "multiple" means two or more. "One or more", "at least one of the following" or the like means any combination of these items, including any combination of single item or multiple items. For example, "at least one of a, b, or c", or "at least one of a, b, and c", can represent a, b, c, a-b (i.e. a and b), a-c, b-c, or a-b-c, wherein a, b, and c can be single or multiple.

[0020] Various embodiments of the present application can exist in a range of forms; it should be understood that the description in a range form is merely for the convenience and brevity, and should not be understood as a hard limitation on the scope of the present application; therefore, it should be considered that the range described has specifically disclosed all possible sub-ranges and single values within the range. For example, it should be considered that the range description from 1 to 6 has specifically disclosed sub-ranges, such as from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6, etc., as well as single values within the range, such as 1, 2, 3, 4, 5, and 6, regardless of the range. In addition, whenever a numerical range is indicated herein, it refers to any cited number (fraction or integer) within the indicated range.

[0021] High-performance storage products are rapidly developing to meet the high demand in the era of artificial intelligence. Smaller, faster, higher bandwidth, better performance, these iterative directions will also bring new challenges to the development of the next generation of products, that is, excessive heat. SK Hynix has developed a new advanced packaging technology called Mass Reflow-Molded Underfill (MR-MUF), which can effectively improve the heat dissipation performance of chips. In the MR-MUF advanced packaging technology, a key packaging material, Liquid Molded Underfill (LMUF), is used as a protective material to fill the gap between chips, with excellent mechanical properties, electrical insulation, heat resistance, and high reliability.

[0022] However, due to the high restrictions of JEDEC on HBM, the subsequent technology iteration direction of HBM needs to both maintain the increase in the number of stacked chips and control the product thickness. Therefore, how to control the warpage of the product after molding has become a key technical problem in the development of LMUF.

[0023] In view of this, the embodiments of the present application provide an epoxy resin composition, and the material after curing of the epoxy resin composition has a lower warpage.

[0024] Specifically, the epoxy resin composition in the present application includes, in mass parts: epoxy resin 0.5 to 25 parts; anhydride curing agent 1 to 20 parts; inorganic filler 60 to 92 parts; curing accelerator 0.1 to 1 part; wherein the curing agent includes a tung oil-based anhydride curing agent, and the curing accelerator includes a compound represented by the following formula (1).

[0025] Formula (1).

[0026] The epoxy resin composition provided by the embodiments of the present application has a low viscosity at room temperature through the synergistic effects of the above, meets the requirement of low viscosity for the underfill process, and has good thermal conductivity and low warpage. The possible reason is that the tung oil-based anhydride curing agent has a suitable flexible segment, and the flexible segment in the tung oil-based anhydride curing agent provides space for dynamic exchange; the curing accelerator having the structure of formula (1) can reduce the dynamic exchange barrier, and the tung oil-based anhydride curing agent and the curing accelerator cooperate to promote dynamic exchange. In the process of dynamic exchange, the stress can be well released, thereby being conducive to reducing the warpage of the product obtained by curing the epoxy resin composition in the present application.

[0027] Exemplarily, in the epoxy resin composition provided by the embodiments of the present application, the mass fraction of the epoxy resin is 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts, 11 parts, 12 parts, 13 parts, 14 parts, 15 parts, 16 parts, 17 parts, 18 parts, 19 parts, 20 parts, and a range value between any two of the above values.

[0028] In some embodiments of the present application, the mass fraction of the epoxy resin in the epoxy resin composition is 5 parts to 20 parts. Further, the mass fraction of the epoxy resin in the epoxy resin composition is 10 parts to 15 parts, and more further, the mass fraction of the epoxy resin in the epoxy resin composition is 12 parts to 13 parts. In this way, it is conducive to having a more suitable ratio between the epoxy resin and the inorganic filler in the epoxy resin composition, reducing the warpage of the cured product, and at the same time, making the epoxy resin composition have a more suitable viscosity and processability, and at the same time, having good heat resistance.

[0029] In some embodiments of the present application, the epoxy resin includes a first epoxy resin and a second epoxy resin; wherein the first epoxy resin includes at least one of bisphenol A type epoxy resin, bisphenol F type epoxy resin, naphthalene type epoxy resin or alicyclic epoxy resin; and the second epoxy resin is a polyol modified epoxy resin. The epoxy resin in this embodiment includes the first epoxy resin and the second epoxy resin of the types as above, which is conducive to the warpage of the material after curing of the epoxy resin composition. The possible reason is that the second epoxy resin contains a flexible segment to provide a suitable dynamic stress release space, and the hydroxyl and ester groups in part of the epoxy resin can simultaneously provide dynamic sites, which is conducive to improving the rate of dynamic exchange, promoting stress release, and thereby reducing the warpage of the material after curing of the epoxy resin composition.

[0030] In some embodiments of the present application, the epoxy equivalent weight of the first epoxy resin is 150 g / eq - 180 g / eq. Illustratively, the epoxy equivalent weight of the first epoxy resin is 150 g / eq, 155 g / eq, 160 g / eq, 165 g / eq, 170 g / eq, 175 g / eq, 180 g / eq, and a range between any two of the above values. Illustratively, the epoxy equivalent weight of the first epoxy resin is 155 g / eq - 176 g / eq. In this way, the epoxy equivalent weight of the first epoxy resin is in the range of 150 g / eq to 180 g / eq, which is advantageous for the epoxy resin composition in the present application to have better application performance.

[0031] In some embodiments of the present application, the mass ratio of the first epoxy resin and the second epoxy resin is 1: (1-1.5). In this way, it is advantageous to further reduce the warpage of the material after the epoxy resin composition is cured.

[0032] Illustratively, the mass ratio of the first epoxy resin and the second epoxy resin is 1:1, 1:1.1, 1:1.2, 1:1.3, 1:1.4, 1:1.5, and a range between any two of the above values.

[0033] It should be noted that the first epoxy resin and the second epoxy resin are not the main improvement points of the present application. Taking the first epoxy resin as an example, the first epoxy resin can be an existing epoxy resin on the market, or an epoxy resin prepared by existing epoxidation process from bisphenol A, bisphenol F, bisphenol AD, dihydroxy naphthalene, aminophenol, polyalkylene glycol, etc. Compounds, which are not limited here.

[0034] In some embodiments of the present application, the second epoxy resin is at least one of glycerol triglycidyl ether, butanediol diglycidyl ether, sorbitol glycidyl ether, and castor oil triglycidyl ether. The second epoxy resin is at least one of the above glycerol triglycidyl ether, butanediol diglycidyl ether, sorbitol glycidyl ether, and castor oil triglycidyl ether. The second epoxy resin contains a flexible segment to provide a suitable dynamic stress release space. The hydroxyl and ester groups in part of the epoxy resin can simultaneously provide dynamic sites, which is advantageous for increasing the rate of dynamic exchange, promoting stress release, and thus reducing the warpage of the material after the epoxy resin composition is cured.

[0035] Illustratively, the second epoxy resin is glycerol triglycidyl ether, the structure of which is shown in the following formula (2), and its CAS number is 13236-02-7.

[0036] Formula (2) Illustratively, the second epoxy resin is butanediol diglycidyl ether, the structure of which is shown in the following formula (3), and its CAS number is 2425-79-8.

[0037] Formula (3) Exemplarily, the second epoxy resin is sorbitol glycidyl ether, the structure of which is shown in the following Formula (4), and the CAS number thereof is 68412-01-1.

[0038] Formula (4) Exemplarily, the second epoxy resin is castor oil triglycidyl ether, the structure of which is shown in the following Formula (5), and the CAS number thereof is 74398-71-3.

[0039] Formula (5) In some embodiments of the present application, the mass fraction of the acid anhydride curing agent in the epoxy resin composition is 1 part to 20 parts, exemplarily, the mass fraction of the acid anhydride curing agent in the epoxy resin composition is 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts, 11 parts, 12 parts, 13 parts, 14 parts, 15 parts, and a range value between any two of the above-mentioned values. Exemplarily, the mass fraction of the acid anhydride curing agent in the epoxy resin composition is 7 parts to 12 parts. Exemplarily, the mass fraction of the acid anhydride curing agent in the epoxy resin composition is 9.5 parts to 10.5 parts.

[0040] In some embodiments of the present application, the tung oil-based acid anhydride curing agent is a compound shown in the following Formula (6).

[0041] Formula (6).

[0042] In some embodiments of the present application, the acid anhydride curing agent comprises a first curing agent and a second curing agent, the first curing agent is the tung oil-based acid anhydride curing agent; and the second curing agent comprises at least one of alkyl hexahydrophthalic anhydride, alkyl tetrahydrophthalic anhydride, nadic anhydride, succinic anhydride, trimellitic anhydride, and pyromellitic anhydride.

[0043] Exemplarily, the second curing agent comprises at least one of hexahydrophthalic anhydride, alkyl hexahydrophthalic anhydride such as methyl hexahydrophthalic anhydride, tetrahydrophthalic anhydride, alkyl tetrahydrophthalic anhydride such as 3-methyl tetrahydrophthalic anhydride, nadic anhydride, succinic anhydride, trimellitic anhydride, and pyromellitic anhydride. Preferably, the second curing agent further comprises at least one of methyl tetrahydrophthalic anhydride and methyl hexahydrophthalic anhydride.

[0044] In some embodiments of the present application, the tung oil based anhydride curing agent accounts for 20% to 80% of the total anhydride curing agent by mass. Illustratively, the tung oil based anhydride curing agent accounts for 20%, 30%, 40%, 50%, 60%, 70%, 80% of the total anhydride curing agent and ranges between any two of the aforementioned values. In this way, the epoxy resin composition of the present application is facilitated to have both low warpage and high heat resistance after curing.

[0045] In some embodiments of the present application, the second curing agent has an anhydride equivalent weight of 150g / eq to 180g / eq. Illustratively, the second curing agent has an anhydride equivalent weight of 150g / eq, 155g / eq, 160g / eq, 165g / eq, 170g / eq, 175g / eq, 180g / eq and ranges between any two of the aforementioned values. Illustratively, the second curing agent has an anhydride equivalent weight of 161g / eq to 166g / eq. In this way, the first epoxy resin has an epoxy equivalent weight of 161g / eq to 166g / eq, which facilitates the epoxy resin composition of the present application to have better application performance.

[0046] In some embodiments of the present application, the mass ratio of the first curing agent to the second curing agent is 1:(0.1 to 5). Illustratively, the mass ratio of the first curing agent to the second curing agent is 1:0.1, 1:0.2, 1:0.3, 1:0.4, 1:0.5, 1:0.6, 1:0.7, 1:0.8, 1:0.9, 1:1, 1:1.5, 1:2, 1:2.5, 1:3, 1:3.5, 1:4, 1:4.5, 1:5 and ranges between any two of the aforementioned values. In this way, the warpage of the product after curing of the epoxy resin composition of the present application is further reduced.

[0047] In some embodiments of the present application, the mass ratio of the first curing agent to the second curing agent is 1:(0.1 to 1). In this way, the warpage of the product after curing of the epoxy resin composition of the present application is further reduced.

[0048] In some embodiments of the present application, the mass fraction of the curing accelerator in the epoxy resin composition is 0.05 parts to 2 parts. Illustratively, the mass fraction of the curing accelerator in the epoxy resin composition is 0.05, 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2 parts and ranges between any two of the aforementioned values. Illustratively, the mass fraction of the curing accelerator in the epoxy resin composition is 0.1 parts to 1 part.

[0049] In some embodiments of the present application, the curing accelerator comprises a first curing accelerator and a second curing accelerator, the first curing accelerator is a compound represented by formula (1), and the ratio of the first curing accelerator to the curing accelerator is not less than 20% by mass fraction. For example, the ratio of the first curing accelerator to the curing accelerator is 20%, 30%, 40%, 50%, 60%, 70%, 80%, 90%, 95%, 99%, or a range between any two of the above values. In this way, the amount of warping deformation of the cured product can be further reduced.

[0050] For example, the second curing accelerator comprises an imidazole compound. For example, the second curing accelerator comprises at least one of 2-methylimidazole, 2-phenylimidazole, and 2-phenyl-4-methylimidazole.

[0051] In some embodiments of the present application, the mass ratio of the first curing accelerator to the second curing accelerator is 1:(0.1-1). For example, the mass ratio of the first curing accelerator to the second curing accelerator is 1:(0.4-0.7). In this way, the warpage of the epoxy resin composition in the present application can be further reduced, while the epoxy resin composition has good application performance.

[0052] In some embodiments of the present application, the mass fraction of the inorganic filler in the epoxy resin composition is 60-92 parts. For example, the mass fraction of the inorganic filler in the epoxy resin composition is 60, 62, 64, 66, 68, 70, 72, 74, 76, 77, 78, 80, 82, 84, 86, 88, 90, 92, or a range between any two of the above values. For example, the mass fraction of the inorganic filler in the epoxy resin composition is 70-85 parts. For another example, the mass fraction of the inorganic filler in the epoxy resin composition is 75-80 parts.

[0053] In some embodiments of the present application, the average particle size of the inorganic filler is 1-15 μm. For example, the average particle size of the inorganic filler is 1, 2, 3, 4, 5, 5.5, 6, 6.5, 7, 7.5, 8, 8.5, 9, 9.5, 10, 10.5, 11, 11.5, 12, 12.5, 13, 13.5, 14, 14.5, 15 μm, or a value between any two of the above values. For example, the average particle size of the inorganic filler is 3-10 μm. Further, the average particle size of the inorganic filler is 3-6 μm. In this way, the epoxy resin composition in the present application can fill smaller gaps and can be applied to the application scenario of narrow-gap liquid plastic packaging.

[0054] In some embodiments of this application, the inorganic filler may include at least one selected from silica, alumina, aluminum nitride, silicon carbide (SiC), boron nitride, zircon, calcium silicate, calcium carbonate, and barium titanate. Exemplarily, the inorganic filler is fused silica. This is advantageous for reducing the viscosity of the epoxy resin composition in this application and lowering raw material costs.

[0055] In some embodiments of this application, the inorganic filler is a spherical filler. This is advantageous for further reducing the viscosity of the epoxy resin composition while maintaining the same mass percentage of filler in the epoxy resin composition.

[0056] In some embodiments of this application, the viscosity of the epoxy resin composition at room temperature (25°C) is between 300 Pa·s and 800 Pa·s. Thus, the epoxy resin composition in this application exhibits good flowability and can be used as a liquid molding compound. It should be noted that "viscosity" in this application refers to the viscosity at room temperature (25°C). The viscosity of the epoxy resin can be measured using a viscometer, and is not limited thereto.

[0057] In some embodiments of this application, the inorganic filler is an inorganic filler modified with a silane coupling agent, that is, the surface of the inorganic filler has a silane coupling agent. Exemplarily, the silane coupling agent includes γ-(2,3-epoxypropoxy)propyltrimethoxysilane, trimethyloxyphenylsilane, 3-aminopropyltriethoxysilane, 3-(isobutenoyloxy)propyltrimethoxysilane, vinyltrimethoxysilane, (3-aminopropyl)triethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-ureapropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, γ-anilinopropyltrimethoxysilane, γ-anilinopropyltrimethoxysilane. At least one of the following: triethoxysilane, γ-anilinopropylmethyldimethoxysilane, γ-anilinopropylmethyldiethoxysilane, γ-anilinopropylethyldiethoxysilane, γ-anilinopropylethyldimethoxysilane, γ-anilinomethyltrimethoxysilane, γ-anilinomethyltriethoxysilane, γ-anilinomethylmethyldimethoxysilane, γ-anilinomethylmethyldiethoxysilane, γ-anilinomethylethyldiethoxysilane, and γ-anilinomethylethyldimethoxysilane.

[0058] In some embodiments of this application, the epoxy resin composition further includes a colorant.

[0059] In some embodiments of the present application, the mass fraction of the colorant in the epoxy resin composition is 0.2 to 1 parts by mass. Illustratively, the mass ratio of the colorant to the epoxy resin composition is 0.2 parts, 0.3 parts, 0.4 parts, 0.5 parts, 0.6 parts, 0.7 parts, 0.8 parts, 0.9 parts, 1 part, and a value between any two of the above-mentioned points. Further, the mass ratio of the colorant to the epoxy resin composition is 0.1 to 0.6 parts. It should be noted that the specific type of colorant is not the main improvement point of the present application, and is not limited herein. Illustratively, the colorant is carbon black.

[0060] The epoxy resin composition in the present application is further described below in combination with experimental examples and experimental test results.

[0061] Experimental Examples 1 to 10 and Comparative Examples 1 to 2 The raw materials in Tables 1 and 2 were added to a reaction kettle according to the mass ratio, and dispersed and mixed at a temperature of 20 to 60°C to obtain a liquid epoxy resin composition.

[0062] Table 1 Raw materials for experiments

[0063] Table 2

[0064] Note: " / " means not added.

[0065] Experimental test Viscosity determination: determined using an E-type viscometer at 25 revolutions per minute, and the viscosity unit is Pa.s.

[0066] Warpage determination: the sealing resin composition was compression molded using a compression molding machine at 5 MPa and 125°C for 5 minutes to obtain a packaging material with a thickness of 500 μm on a wafer with a thickness of 750 μm and a diameter of 300 mm. The compression molded sample prepared was cured at 150°C for 2 hours to obtain a sample for warpage testing. The warpage of the sample was determined using the TMD (topology deformation measurement) method: the wafer after encapsulation was placed on a TMD device for high-precision three-dimensional topology scanning to obtain surface topography data; the warpage degree was calculated by analyzing the height deviation and deformation of the surface of the sample.

[0067] The viscosity, warpage deformation, and glass transition temperature of each experimental example were tested, and the test results are shown in Table 2.

[0068] The epoxy resin compositions of Example 1 to Example 10 all have a viscosity of less than 300 Pa.s at room temperature (25°C), have good flowability, can fill the gaps between chips, and can be used as liquid molding underfill adhesive for advanced packaging. Meanwhile, the epoxy resin compositions are added with tung oil-based anhydride curing agent and curing accelerator of formula (1), and have a low warpage deformation amount. The difference between Example 1 and Comparative Example 1 is that no curing accelerator of formula (1) is added in Comparative Example 1, and the difference between Example 1 and Comparative Example 2 is that no tung oil-based anhydride curing agent is added in Comparative Example 2. As can be seen from Table 2, compared with Comparative Examples 1 and 2, the warpage deformation amount of the cured product in Example 1 is reduced by 38% and 18.8% respectively, which has a surprising effect. The possible reason is that the tung oil-based anhydride curing agent has a suitable flexible segment, and the flexible segment in the tung oil-based anhydride curing agent provides space for dynamic exchange; the curing accelerator of formula (1) can reduce the dynamic exchange barrier, and it cooperates with the tung oil-based anhydride curing agent to promote dynamic exchange. During the dynamic exchange process, the stress can be well released, which is conducive to reducing the warpage of the product obtained by curing the epoxy resin composition in the present application.

[0069] The difference between Example 1 and Example 4 is that the second epoxy resin in the resin composition is different, and the second epoxy resin is the epoxy resin represented by formula (3) or formula (4) or formula (5), which is conducive to further reducing the warpage of the cured product.

[0070] The difference between Example 1, Example 5 to Example 7 and Example 10 is that the content of the tung oil-based anhydride curing agent is different. As can be seen, with the increase of the tung oil-based anhydride curing agent, the warpage and glass transition temperature of the resin composition after curing are gradually reduced. When the tung oil-based anhydride curing agent accounts for 20% to 80% of the total amount of the curing agent in the resin composition, and further accounts for 40% to 60%, the resin composition after curing has a low warpage and a high glass transition temperature, so that the cured material has a low warpage deformation amount and a high heat resistance temperature.

[0071] The difference between Example 1, Example 8 and Example 9 is that the composition of the curing accelerator is different, and the resin composition includes multiple curing accelerators. As can be seen from Table 1, when the total amount of the curing accelerator in the composition is unchanged, the content of the curing accelerator of formula (1) is not less than 20% of the total curing accelerator, which is conducive to reducing the warpage deformation amount of the cured product.

[0072] The technical solutions provided by the embodiments of the present application are described in detail above, and the principles and implementation manners of the present application are described by applying specific examples. The above description of the embodiments is only used to help understand the method of the present application and its core idea; meanwhile, for those skilled in the art, the specific implementation manners and application ranges will be changed according to the idea of the present application. In conclusion, the content of the specification should not be understood as a limitation of the present application.

Claims

1. An epoxy resin composition, characterized by comprising: The epoxy resin composition comprises: an epoxy resin, an anhydride curing agent, and a curing accelerator; The anhydride curing agent comprises a tung oil-based anhydride curing agent, and the curing accelerator comprises a compound represented by formula (1) as follows: Formula (1).

2. The epoxy resin composition according to claim 1, wherein The epoxy resin composition further comprises an inorganic filler, and the epoxy resin composition comprises the epoxy resin in an amount of 0.5 to 25 parts by mass; The anhydride curing agent is in an amount of 1 to 20 parts by mass; The inorganic filler is in an amount of 60 to 92 parts by mass; The curing accelerator is in an amount of 0.1 to 1 part by mass.

3. The epoxy resin composition according to claim 1, wherein The anhydride curing agent comprises a first curing agent and a second curing agent, the first curing agent being the tung oil-based anhydride curing agent, and the second curing agent comprising at least one of alkylhexahydrophthalic anhydride, alkyltetrahydrophthalic anhydride, nadic anhydride, succinic anhydride, trimellitic anhydride, and pyromellitic anhydride.

4. The epoxy resin composition according to claim 3, wherein The tung oil-based anhydride curing agent accounts for 20% to 80% of the anhydride curing agent in terms of mass; Preferably, the tung oil-based anhydride curing agent accounts for 40% to 60% of the anhydride curing agent in terms of mass.

5. The epoxy resin composition according to claim 1, wherein The epoxy resin comprises a first epoxy resin and a second epoxy resin, the first epoxy resin comprising at least one of bisphenol A type epoxy resin, bisphenol F type epoxy resin, naphthalene type epoxy resin, or alicyclic epoxy resin, and the second epoxy resin being a polyol-modified epoxy resin.

6. The epoxy resin composition according to claim 5, wherein The second epoxy resin is at least one of glycerol triglycidyl ether, butanediol diglycidyl ether, sorbitol glycidyl ether, and castor oil triglycidyl ether. The first epoxy resin has an epoxy equivalent weight of 150 g / eq to 180 g / eq. The mass ratio of the first epoxy resin to the second epoxy resin is 1: (1-1.5).

7. The epoxy resin composition according to claim 1, wherein The curing accelerator comprises a first curing accelerator and a second curing accelerator, the curing accelerator being the compound represented by formula (1), and the ratio of the first curing accelerator to the curing accelerator is not less than 20% in terms of mass.

8. The epoxy resin composition according to claim 1, wherein The viscosity of the epoxy resin composition at room temperature is not more than 300 Pa·s. The warpage of the cured product of the epoxy resin composition is not more than 3.2 mm.

9. The epoxy resin composition according to claim 1, wherein The epoxy resin is in an amount of 10 parts to 15 parts by mass, the anhydride curing agent is in an amount of 7 parts to 12 parts by mass, the inorganic filler is in an amount of 75 parts to 80 parts by mass, and the curing accelerator is in an amount of 0.1 part to 1 part by mass.

10. An encapsulant material, characterized by, The encapsulating material is obtained by curing the epoxy resin composition according to any one of claims 1 to 9.

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