Conductive device and manufacturing method thereof

Abstract

The invention discloses a conductive device which is used for being electrically connected with an electronic component, the electronic component comprises a plurality of conductive contacts, and the conductive device comprises an insulating substrate and a plurality of elastic conductive units. The insulating substrate comprises a first surface, a second surface and a plurality of through holes penetrating from the first surface to the second surface; the positions of the plurality of through holes are in one-to-one correspondence with the positions of the plurality of conductive contacts; the plurality of elastic conductive units are longitudinally arranged in the plurality of through holes respectively, and two ends of each elastic conductive unit protrude out of the upper surface and the lower surface respectively; the invention also discloses a method for manufacturing the conductive device. The conductive device provided by the invention has the advantages of simple structure, low cost and difficulty in damage.

Description

Technical Field

[0001] This invention relates to the field of electronic component testing technology, and in particular to a conductive device for testing electronic components and its manufacturing method. Background Technology

[0002] After integrated circuits (ICs) are packaged, their functions need to be tested to screen qualified finished products. During testing, probes intermittently touch the chip pins at high frequency, causing wear. Traditional testing methods use test probes or spring-loaded structures. Test probes are relatively expensive, and spring-loaded structures require mold design, which is very costly, thus increasing testing costs.

[0003] In the field of electrical connection between electronic components and PCBs, traditional electrical signal connections are achieved by means of soldering, anisotropic conductive adhesive (ACF), or conductive zebra strips. However, when the component is large (such as a large chip), the component itself has a certain warp, or the travel difference between the contact points of the same component is large (uneven height), the above-mentioned electrical signal connection methods cannot guarantee a complete connection. Summary of the Invention

[0004] The purpose of this invention is to provide an improved conductive device and its manufacturing method, addressing the problems mentioned in the background section above.

[0005] The technical solution adopted by this invention to solve its technical problem is:

[0006] A conductive device is constructed for electrical connection with electronic components, wherein the electronic components include multiple conductive contacts, and the conductive device includes an insulating substrate and multiple elastic conductive units.

[0007] The insulating substrate includes a first surface, a second surface, and a plurality of through holes extending from the first surface to the second surface;

[0008] Each of the multiple through holes corresponds to one of the multiple conductive contacts;

[0009] The plurality of elastic conductive units are respectively arranged longitudinally in the plurality of through holes, and the two ends of each elastic conductive unit protrude from the first surface and the second surface, respectively.

[0010] Each elastic conductive unit includes a conductive spring.

[0011] In some embodiments, the insulating substrate includes an elastic body portion and a rigid frame portion, and at least a portion of the plurality of through holes are formed on the body portion;

[0012] The elastic main body is sheet-shaped and includes an upper surface and a lower surface opposite to the upper surface, and at least some of the through holes extend from the upper surface to the lower surface;

[0013] The frame portion defines a through mounting hole, the elastic main body portion is disposed in the mounting hole and is peripherally defined by the frame portion; the extension direction of at least a portion of the through hole is parallel to the extension direction of the mounting hole.

[0014] In some embodiments, the conductive spring includes a columnar spring portion and a conical spring portion, the conical spring portion being integrally connected to the columnar spring portion along the axial direction; the columnar spring portion includes a first end and a second end opposite to the first end, the first end protruding from one of the first surface and the second surface; the conical spring portion includes a smaller top end and a bottom end opposite to the top end, the bottom end being connected to the second end, the top end protruding from the other of the first surface and the second surface.

[0015] In some embodiments, the conductive spring further includes a pin disposed axially on the top end.

[0016] In some embodiments, each elastic conductive unit further includes a conductor, the conductive spring being columnar and including a third end and a fourth end opposite to the third end, the third end protruding from one of the first surface and the second surface; the conductor includes at least one tip and an end opposite to the at least one tip, the end being connected to the fourth end, the at least one tip protruding from the other of the first surface and the second surface.

[0017] In some embodiments, the at least one tip includes at least three tips that are evenly distributed around the longitudinal axis of the conductor and define a cavity between them.

[0018] In some embodiments, the conductive spring is sheet-shaped and includes a first contact portion, a second contact portion, and a bent portion. The two ends of the bent portion are electrically connected to one end of the first contact portion and one end of the second contact portion, respectively. The other end of the first contact portion protrudes from one of the first surface and the second surface; the other end of the second contact portion protrudes from the other of the first surface and the second surface.

[0019] The other end of the first contact portion includes at least one contact end.

[0020] A method for manufacturing the above-mentioned conductive device includes the following steps:

[0021] S1. Provide the insulating substrate;

[0022] S2. A plurality of through holes are formed on the insulating substrate, such that the through holes correspond one-to-one with the plurality of conductive contacts;

[0023] S3. Provide the plurality of elastic conductive units;

[0024] S4. The plurality of elastic conductive units are respectively arranged longitudinally in the plurality of through holes, and the two ends of each elastic conductive unit protrude from the first surface and the second surface respectively;

[0025] S4. The plurality of elastic conductive units are bonded to the insulating substrate by dispensing or potting.

[0026] A method for manufacturing the above-mentioned conductive device includes the following steps:

[0027] S1. A mold is provided, the mold having a forming cavity, and the forming cavity having a plurality of upright pins corresponding one-to-one with conductive contacts;

[0028] S2. Insulating material is injected into the molding cavity, and after demolding, an insulating substrate with multiple through holes is formed;

[0029] S3. Provide a plurality of elastic conductive units, wherein the plurality of elastic conductive units are respectively longitudinally disposed in the plurality of through holes, and the two ends of each elastic conductive unit protrude from the first surface and the second surface respectively;

[0030] S4. The plurality of elastic conductive units are bonded to the insulating substrate by dispensing or potting.

[0031] A method for manufacturing the above-mentioned conductive device includes the following steps:

[0032] S1. A mold is provided, the mold having a forming cavity;

[0033] S2. Provide the plurality of elastic conductive units, and arrange the plurality of elastic conductive units longitudinally in the molding cavity, and each unit corresponds to one of the plurality of conductive contacts;

[0034] S3. Insulating material is injected into the molding cavity, and a conductive device is formed after demolding.

[0035] Implementing this invention has the following beneficial effects:

[0036] This conductive device has a simple structure, can be arranged in a targeted manner for different electronic components under test, is inexpensive, not easily damaged, and is applicable to electronic components of different sizes and structures. It has a stronger inclusiveness for different contact points and effectively solves the above problems. Attached Figure Description

[0037] The present invention will be further described below with reference to the accompanying drawings and embodiments. In the accompanying drawings:

[0038] Figure 1 This is a schematic diagram of the conductive device in the first embodiment of the present invention;

[0039] Figure 2 yes Figure 1 A schematic cross-sectional view of the conductive device along direction AA.

[0040] Figure 3 yes Figure 2 A schematic diagram of the structure of the elastic conductive unit in the conductive device;

[0041] Figure 4 This is a cross-sectional structural diagram of the conductive device in the second embodiment;

[0042] Figure 5 This is a cross-sectional structural diagram of the conductive device in the third embodiment;

[0043] Figure 6 This is a schematic diagram of the structure of the elastic conductive unit in the conductive device in the fourth embodiment;

[0044] Figure 7 This is a schematic diagram of the structure of the elastic conductive unit in the conductive device in the fifth embodiment;

[0045] Figure 8 This is a schematic diagram of the structure of the elastic conductive unit in the conductive device in the sixth embodiment;

[0046] Figure 9 This is a schematic diagram of the structure of the elastic conductive unit in the conductive device in the seventh embodiment;

[0047] Figure 10 This is a schematic diagram of the structure of the elastic conductive unit in the conductive device in the eighth embodiment;

[0048] Figure 11 This is a schematic diagram of the structure of the elastic conductive unit in the conductive device in the 9th embodiment.

[0049] in:

[0050] 1. Conductive device; 2. Electronic component under test; 3. Test circuit board;

[0051] 10. Insulating substrate; 20. Elastic conductive unit;

[0052] 11. Frame section; 12. Main body section; 13. Through hole; 14. Protective film; 15. Positioning hole;

[0053] 21. Conductive spring; 22. Conductor;

[0054] 211. Columnar spring section; 212. Conical spring section; 213. Insert pin; Bending section; 214.

[0055] First contact portion 215; second contact portion 216; 221. Tip. Detailed Implementation

[0056] To provide a clearer understanding of the technical features, objectives, and effects of the present invention, specific embodiments of the invention will now be described in detail with reference to the accompanying drawings. In the following description, it should be understood that the orientations or positional relationships indicated by terms such as "front," "rear," "upper," "lower," "left," "right," "vertical," "horizontal," "bottom," "inner," "further," and "outer" are based on the orientations or positional relationships shown in some of the accompanying drawings, and are constructed and operated in a specific orientation. They are only for the convenience of describing the technical solution and do not indicate that the device or element referred to must have a specific orientation; therefore, they should not be construed as limitations on the present invention.

[0057] It should also be noted that, unless otherwise explicitly specified and limited, terms such as "installation," "connection," "linking," "fixing," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. When an component is referred to as being "on" or "below" another component, the component can be located "directly" or "indirectly" on the other component, or there may be one or more intermediary components. The terms "first," "second," etc., are only for the convenience of describing this technical solution and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances.

[0058] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of the invention. However, those skilled in the art will understand that the invention can be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods are omitted so as not to obscure the description of the invention with unnecessary detail.

[0059] like Figure 1 and Figure 2As shown, the present invention provides a conductive device 1 for electrically connecting an electronic component under test 2 to a test circuit board 3. The conductive device 1 includes an insulating substrate 10 and a plurality of elastic conductive units 20. The insulating substrate 10 is placed between the test circuit board 3 and the electronic component under test 2, supporting the elastic conductive units 20. The plurality of elastic conductive units 20 are arranged in a certain position, extending from a first surface to a second surface of the insulating substrate 10, with both ends of each elastic conductive unit protruding from the first and second surfaces of the insulating substrate 10, respectively, for electrically connecting the test circuit board 3 and the electronic component under test 2, thus establishing a conductive path.

[0060] In some embodiments, the insulating substrate 10 includes a first surface and a second surface. The surface perpendicular to the central axis of the insulating substrate 10 and located at the top is defined as the first surface (i.e., the upper surface), and the surface perpendicular to the central axis of the insulating substrate 10 and located at the bottom is defined as the second surface (i.e., the lower surface). The insulating substrate 10 also includes a frame portion 11, a main body portion 12, a plurality of through holes 13, a protective film 14, and at least one positioning hole 15. The frame portion 11 is a square sheet-like thin plate made of rigid insulating material, including an upper surface and a lower surface opposite to the upper surface. It is hollow inside and defines a mounting hole that extends from the upper surface to the lower surface of the thin plate for mounting the main body portion 12. It provides rigid support and definition for the main body portion 12, and plays a positioning role to prevent the main body portion 12 from deforming during operation, which would lead to inaccurate testing. In some embodiments, the outer contour of the frame portion 11 can also be circular, polygonal, or irregular in shape. In some embodiments, the frame portion 11 can be made of insulating materials such as ceramic or rubber, or it can be made of other non-insulating materials with an insulating layer attached to the surface.

[0061] like Figure 1 and Figure 2 As shown, the main body 12 is an insulating elastic sheet-like gel, including an upper surface and a lower surface opposite to the upper surface. It is disposed in the mounting hole of the frame part 11 and is defined by the frame part 11. Several elastic conductive units 20 are arranged and fixed in the main body 12 in a certain order, extending from the upper surface to the lower surface of the main body. The two ends of each elastic conductive unit protrude from the upper and lower surfaces of the main body 12, respectively, serving as a support carrier for the elastic conductive unit 20. During the test, when the electronic component under test 2 located above the conductive device 1 is pressed down onto the upper surface of the conductive device 1, the main body 12 can undergo slight deformation, allowing the elastic conductive unit 20 to conduct electricity with the electronic component under test 2 and the test circuit board 3. After the electronic component under test 2 has been tested, the main body 12 can also elastically return to its initial state, which helps to prevent damage to the conductive device 1. In some embodiments, the main body 12 may be made of silicone, elastic resin or other elastic insulating materials.

[0062] In this embodiment, the thickness of the main body 12 is slightly greater than the thickness of the frame 11, and its outer contour shape is adapted to the inner contour shape of the frame 11. With this design, the insulating substrate 10 allows the elastic conductive unit 20 to have a larger pressing stroke during the pressure test of the electronic component 2 under test, ensuring effective contact between the two ends of the elastic conductive unit 20 and the electronic component 2 under test and the test circuit board 3. In some embodiments, the frame 11 and the main body 12 can be integrally manufactured, or they can be manufactured separately and then bonded together with adhesive. The thickness of the main body 12 can be equal to or greater than the thickness of the frame 11. When the thickness of the main body 12 is greater than the thickness of the frame 11, the contour shape of its protruding portion from the frame 11 can also be greater than the inner contour shape of the frame 11, or adapted to the outer contour of the frame 11, or the frame 11 can be entirely enclosed within the main body 12. The different sizes and shapes of the main body 12 are mainly adapted to the specific conditions of the customized mold and the electronic component 2 under test.

[0063] In some embodiments, a plurality of through holes 13 are formed on the main body 12. These through holes 13 extend from the upper surface to the lower surface of the main body 12, and their extending direction is parallel to the extending direction of the mounting holes. Each through hole 13 corresponds one-to-one with the location of the conductive contacts of the electronic component 2 under test, and its diameter is approximately equal to the size of the connection point of the electronic component. These through holes 13 are used to house elastic conductive units 20, which are longitudinally arranged in the through holes 13 and then in the main body 12, allowing for the testing of each conductive contact of the electronic component 2 under test. By ensuring that the number and location of the through holes 13 correspond one-to-one with the connection points of the electronic component 2 under test, and that their diameters are approximately equal to the size of the connection points, the number of through holes 13 and elastic conductive units 20 used can be significantly reduced, reducing manufacturing costs. Furthermore, the through holes 13 offer greater tolerance to dust and other substances, and better current flow performance, thereby increasing the testing accuracy and lifespan of the conductive device 1 to a certain extent. In some embodiments, the plurality of through holes 13 may also be partially formed on the main body 12 and partially formed on the frame 11.

[0064] In some embodiments, the protective film 14 is an insulating material and covers at least the contact surface between the main body 12 and the electronic component 2 under test. In this embodiment, the protective film 14 covers the upper and lower surfaces of the main body 12 to protect its surface and prevent damage to the frame 11 and the main body 12 during operation, thereby effectively extending the service life of the conductive device 1.

[0065] In some embodiments, at least one positioning hole 15 is provided on the frame portion 11. In this embodiment, four holes are provided, located at the four corners of the square frame portion 11, extending from the upper surface to the lower surface of the frame portion 11. These holes are used to fix the frame portion 11 onto the test circuit board 3, thereby fixing the insulating substrate 10 onto the test circuit board 3, and electrically connecting the elastic conductive unit 20 to the test circuit board 3. In some embodiments, the position of the positioning hole 15 can be set according to the layout of the through hole 13 and the electronic component 2 under test.

[0066] like Figure 2 and Figure 3 As shown, the plurality of elastic conductive units 20 are longitudinally disposed in the plurality of through holes 13, perpendicular to the upper and lower surfaces of the insulating substrate 10, and protruding from the upper and lower surfaces of the main body 12 at both ends, respectively. They can be fixed to the insulating substrate 10 by potting or dispensing to prevent it from shaking or tilting during testing. In some embodiments, the longitudinal length of the elastic conductive unit 20 is 0.1-10 mm, and the maximum outer diameter is 0.05-2 mm. Specifically, the elastic conductive unit 20 includes a conductive spring 21, which includes a columnar spring portion 211 and a conical spring portion 212. The conical spring portion 212 includes a top end with a smaller outer diameter and a bottom end opposite to the top end, and the outer diameter of the conical spring portion 212 gradually decreases from the bottom end to the top end. The columnar spring portion 211 includes a first end and a second end opposite to the first end, the first end protruding from either the first surface or the second surface of the insulating substrate 10. The bottom end is connected to the second end. In this embodiment, the lower end of the columnar spring portion 211 protrudes from the lower surface of the insulating substrate 10 for electrical connection with the test circuit board 3. The upper end of the columnar spring portion 211 is integrally connected to the bottom end of the conical spring portion 212, and the top end of the conical spring portion 212 protrudes from the upper surface of the insulating substrate 10 for electrical connection with the electronic component 2 under test. In some embodiments, the outer diameter of the columnar spring portion 211 is 0.05-2 mm.

[0067] The conical spring portion 212, with its unique shape, can accommodate conductive contacts of electronic components 2 of varying sizes, ensuring better contact. When the conductive contact is small, the smaller outer diameter of the top end of the conical spring portion 212 fits it. When the conductive contact is large, the top end of the conical spring portion 212 is compressed towards the bottom when pressed, increasing the contact area with the contact being tested. This effectively accommodates various types of contacts, such as protruding solder balls, flat contacts, and recessed contacts, making it widely applicable. In some embodiments, the diameter of the elastic conductive unit 20 is approximately the same as the size of the connection point of the electronic component. This allows the elastic conductive unit 20 to better fit the contact point of the electrical component, preventing inaccurate testing due to incomplete contact and ensuring optimal overcurrent performance, thus avoiding burnout caused by excessive overcurrent.

[0068] In some embodiments, the conductive spring 21 may also be provided with different pitches, such that the pitches at both ends that are electrically connected to the electronic component 2 under test and the test circuit board 3 are greater than or less than the pitch of the middle part, or the pitch of the columnar spring portion 211 is greater than or less than the pitch of the conical spring portion 212.

[0069] The present invention also provides a method for preparing the conductive device 1. See below for details. Figures 1-3 The following describes the manufacturing method of the conductive device 1 in this embodiment:

[0070] Includes the following steps:

[0071] S1. Provide the insulating substrate 10;

[0072] S2. A plurality of through holes 13 are formed on the insulating substrate 10, such that the through holes 13 correspond one-to-one with the plurality of conductive contacts;

[0073] S3. Provide the plurality of elastic conductive units 20;

[0074] S4. The plurality of elastic conductive units 20 are respectively longitudinally disposed in the plurality of through holes 13, and the two ends of each elastic conductive unit 20 protrude from the first surface and the second surface respectively;

[0075] S5. The plurality of elastic conductive units 20 are respectively bonded to the insulating substrate 10 by dispensing or potting.

[0076] Specifically, step S1 further includes: providing a rigid insulating frame portion 11 (the frame portion 11 can be formed by machining a rigid insulating plate to create mounting holes, thereby forming the frame portion 11), and providing a mold, placing the frame portion 11 into the mold, pouring an insulating adhesive into the mold, and demolding after standing to form an insulating substrate 10. Alternatively, a mold can be provided, and an insulating adhesive can be poured into the mold, and after standing, demolding can form a main body portion 12. The main body portion 12 is then fixed within the mounting holes of the frame portion 11 to form the insulating substrate 10.

[0077] Specifically, in step S2, a plurality of through holes 13 are formed on the insulating substrate 10, which can be done by machining or laser processing. Machining is more suitable for mass production, while laser processing is more suitable for small-batch customization.

[0078] Specifically, step S3 further includes performing coupling treatment on the surfaces of the plurality of elastic conductive units 20 respectively. This step can increase the bonding force between the elastic conductive units 20 and the insulating substrate 10, preventing the elastic conductive units 20 and the fixing members 30 from moving relative to each other during subsequent transportation and use, thereby preventing shaking or falling off.

[0079] Specifically, in step S4, multiple elastic conductive units 20 can be placed in the through hole 13 in batches by means of mechanical vibration. The mechanical vibration can allow a large number of elastic conductive units 20 to fall into the through hole 13 efficiently and quickly, avoiding the need to put them in one by one.

[0080] In some embodiments, the conductive device 1 of this embodiment can also be manufactured by the following method:

[0081] S1. A mold is provided, the mold having a forming cavity, and the forming cavity having a plurality of upright pins corresponding one-to-one with conductive contacts;

[0082] S2. Insulating material is injected into the molding cavity, and after demolding, an insulating substrate 10 with multiple through holes 13 is formed;

[0083] S3. Provide a plurality of elastic conductive units 20, wherein the plurality of elastic conductive units 20 are respectively longitudinally disposed in the plurality of through holes 13, and the two ends of each elastic conductive unit 20 protrude from the first surface and the second surface respectively;

[0084] S4. The plurality of elastic conductive units 20 are respectively bonded to the insulating substrate 10 by dispensing or potting.

[0085] The purpose of setting the ejector pin in step S1 is to reserve the position of the through hole 13, so that the part where the ejector pin is located after demolding directly forms the through hole 13, reducing the drilling steps.

[0086] Specifically, step S2 further includes: providing a frame portion 11, placing the frame portion 11 into the molding cavity, and injecting insulating material into the molding cavity.

[0087] Specifically, in step S3, multiple elastic conductive units 20 can be placed in the through hole 13 in batches by means of mechanical vibration. The mechanical vibration can allow a large number of elastic conductive units 20 to fall into the through hole 13 efficiently and quickly, avoiding the need to put them in one by one.

[0088] In some embodiments, the conductive device 1 of this embodiment can also be manufactured by the following method:

[0089] S1. A mold is provided, the mold having a forming cavity;

[0090] S2. Provide the plurality of elastic conductive units 20, and arrange the plurality of elastic conductive units 20 longitudinally in the molding cavity, and each of them corresponds to the plurality of conductive contacts;

[0091] S3. Insulating material is injected into the molding cavity, and a conductive device 1 is formed after demolding.

[0092] Specifically, step S1 further includes: setting multiple grooves in the molding cavity, each groove corresponding to a conductive contact of the electronic component 2 under test.

[0093] Specifically, step S2 further includes: providing a frame portion 11, placing the frame portion 11 and multiple elastic conductive units 20 into the molding cavity, and placing the elastic conductive units 20 into the grooves in the molding cavity by means of mechanical vibration or the like, so that the elastic conductive units 20 correspond one-to-one with the conductive contacts.

[0094] In some embodiments, before potting, the protective film 14 and the frame portion 11 can be placed into the mold together, and then the insulating substrate 10 with the protective film 14 can be formed by potting and demolding. Alternatively, after potting and demolding, the protective film 14 can be disposed on a portion of the surface of the insulating substrate 10.

[0095] Figure 4The conductive device 1 according to the second embodiment of the present invention is shown. Its main difference from the first embodiment is that the insulating substrate 10 is composed only of a main body 12 of rigid insulating material. It is placed between two electronic components to fix the elastic conductive unit 20, electrically connecting it to the connection point of the two electronic components. The insulating substrate 10, composed only of the main body 12, allows for a more fixed position of the elastic conductive unit 20, preventing lateral elastic deformation and thus preventing positional changes in the through-hole 13 and the elastic conductive unit 20 within it due to elastic deformation. This ensures more accurate test results. The main body 12 includes an upper surface and a lower surface opposite to the upper surface, and is provided with multiple through-holes 13 and at least one positioning hole 15. All through-holes 13 and at least one positioning hole 15 extend from the upper surface to the lower surface of the main body 12. The conductive device 1 with this structure is less expensive and has a simpler manufacturing process.

[0096] The main difference between the manufacturing method of the conductive device 1 in this embodiment and that in the first embodiment is:

[0097] In some embodiments, when the main body 12 is made of ceramic, a ceramic blank with multiple through holes 13 can be made first, with each through hole 13 corresponding to a conductive contact. After firing, the main body 12 with through holes is formed. Then, the elastic conductive unit 20 is placed inside the through hole 13 by means of mechanical vibration, etc., and the two ends of each elastic conductive unit 20 protrude from the first surface and the second surface, respectively. Finally, it is bonded to the main body 12 by dispensing or potting.

[0098] Figure 5 The conductive device 1 in the third embodiment of the present invention is shown. Its main difference from the first embodiment is that the insulating substrate 10 is composed only of a main body 12 of elastic insulating material. The main body 12 includes an upper surface and a lower surface opposite to the upper surface, and is provided with a plurality of through holes 13 and at least one positioning hole 15. The plurality of through holes 13 and at least one positioning hole 15 all penetrate from the upper surface of the main body 12 to the lower surface.

[0099] Figure 6 The fourth embodiment of the present invention illustrates the elastic conductive unit 20 in the conductive device 1. Its main difference from the first embodiment is that the top end of the conical spring portion 212 of the elastic conductive unit 20 is provided with a pin 213, which is integrally integrated with the top end of the conical spring portion 212. The elastic conductive unit 20 with the pin 213 is more suitable for testing electrical components with recessed or perforated electrical connection points, ensuring effective contact between the elastic conductive unit 20 and the connection points.

[0100] Figure 7The fifth embodiment of the present invention illustrates an elastic conductive unit 20 in the conductive device 1. Its main difference from the first embodiment is that the elastic conductive unit 20 further includes a conductor 22, and the conductive spring 21 is columnar, including a third end and a fourth end opposite to the third end. The third end protrudes from either the first surface or the second surface of the insulating substrate 10. The conductor 22 includes a conical tip 221 and an end opposite to the tip 221, the end being connected to the fourth end. The tip protrudes from the other of the first and second surfaces. In this embodiment, the conductive spring 21 includes an upper end and a lower end. The lower end protrudes from the lower end face of the insulating substrate 10 and is used for electrical connection with the test circuit board 3. The end of the conductor 22 is columnar, its diameter matching the inner diameter of the upper end of the conductive spring 21, and is fixed to the upper end. The tip 221 of the conductor 22 is electrically connected to the electronic component 2 under test.

[0101] Figure 8 The sixth embodiment of the present invention illustrates an elastic conductive unit 20 in the conductive device 1. Its main difference from the first embodiment is that the elastic conductive unit 20 further includes a conductor 22, and the conductive spring 21 is columnar, including a third end and a fourth end opposite to the third end. The third end protrudes from either the first surface or the second surface of the insulating substrate 10. The conductor 22 includes three tapered tips 221 and an end opposite to the tips 221, which is connected to the fourth end. The tips protrude from the other of the first and second surfaces. In this embodiment, the conductive spring 21 includes an upper end and a lower end. The lower end protrudes from the lower end face of the insulating substrate 10 and is used for electrical connection with the test circuit board 3. The end of the conductor 22 is columnar, and its diameter matches the inner diameter of the upper end of the conductive spring 21, and it is fixed to the upper end. The three tips 221 of the conductor 22 are used for electrical connection with the electronic component 2 under test. The three tips are evenly distributed around the longitudinal axis of the conductor 22, presenting a claw shape, and define a cavity between them. This structure is designed for connection points of electronic components with an oxide layer on the surface. Multiple tips can pierce the oxide layer or dust and other substances on the surface, resulting in better contact.

[0102] Figure 9 The seventh embodiment of the present invention illustrates an elastic conductive unit 20 in the conductive device 1. Its main difference from the first embodiment is that the conductive spring 21 of the elastic conductive unit 20 is sheet-shaped and includes a bending portion 214, a first contact portion 215, and a second contact portion 216. One end of the first contact portion 215 is electrically connected to one end of the bending portion 214, and the other end protrudes from one of the first surface and the second surface. One end of the second contact portion 216 is electrically connected to the other end of the bending portion 214, and the other end protrudes from the other of the first surface and the second surface.

[0103] Specifically, the bending portion 214, the first contact portion 215, and the second contact portion 216 each include an upper end and a lower end. The lower end of the first contact portion 215 is electrically connected to the upper end of the bending portion 214, and the lower end of the bending portion 214 is electrically connected to the upper end of the second contact portion 216. The upper end of the first contact portion 215 is provided with a first contact end 2151, which is arranged in a right-angled trapezoid and is located on one side of the central axis of the first contact portion 215. The lower end is adapted to the width of the first contact portion 215.

[0104] In some embodiments, the bent portion 214, the first contact portion 215, and the second contact portion 216 are integrally formed, which can effectively reduce their contact resistance. Furthermore, the conductive spring 21 adopts a sheet-like structure, which can effectively increase the size of the needle (i.e., the first contact portion 215 or the second contact portion 216) that contacts the electronic component 2 under test, thereby improving the service life of the conductive device 1.

[0105] Figure 10 The eighth embodiment of the present invention illustrates the elastic conductive unit 20 in the conductive device 1. Its main difference from the seventh embodiment is that the first contact end 2151 of the conductive spring 21 is arranged in an isosceles trapezoidal shape. In some embodiments, the width of the upper end of the first contact end 2151 can be changed according to the specific structure of the electronic component 2 under test. Compared to a circular probe, the contact end of the sheet-like trapezoidal structure can increase the cross-sectional size and contact area, thereby enabling the conductive device 1 to obtain a stronger current-carrying capacity.

[0106] Figure 11 The ninth embodiment of the present invention illustrates the elastic conductive unit 20 in the conductive device 1. Its main difference from the seventh embodiment is that the upper end of the first contact portion 215 in the conductive spring 21 is provided with two contact ends: a second contact end 2152 and a third contact end 2153. These two contact ends 2152 and 2153 are arranged parallel to each other and their extending directions are both parallel to the longitudinal axis of the first contact portion 215. Specifically, the upper width of both the second contact end 2152 and the third contact end 2153 is slightly larger than the lower width to ensure sufficient contact area with the electronic component 2 under test and increase the current carrying capacity. The provision of two contact ends improves the stability of the conductive device 1 during testing.

[0107] Compared to existing testing devices, the conductive device 1 constructed in this invention can set elastic conductive units 20 with different shapes and structures on the insulating substrate 10 for different electronic component connection point structures. Furthermore, it can strategically arrange corresponding through-holes 13 at the connection point locations, enabling targeted testing of the same type of electronic component 2. Moreover, by providing a frame portion 11 or a main body portion 12, the insulating substrate 10 relatively fixes the position of the elastic conductive units 20, avoiding inaccurate testing caused by elastic deformation of the conductive adhesive during testing. It is also low-cost, not easily damaged, and easy to replace, reducing maintenance costs.

[0108] It is understood that the above embodiments only illustrate preferred embodiments of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can freely combine the above technical features without departing from the concept of the present invention, and can also make several modifications and improvements, all of which fall within the protection scope of the present invention. Therefore, all equivalent transformations and modifications made with respect to the scope of the claims of the present invention should fall within the scope of the claims of the present invention.

Claims

1. A conductive device for electrically connecting to an electronic component, said electronic component comprising a plurality of conductive contacts, characterized in that: The conductive device includes an insulating substrate (10) and a plurality of elastic conductive units (20); The insulating substrate (10) includes a first surface, a second surface, and a plurality of through holes (13) extending from the first surface to the second surface; Each of the plurality of through holes (13) corresponds to one of the plurality of conductive contacts; The plurality of elastic conductive units (20) are respectively longitudinally disposed in the plurality of through holes (13), and the two ends of each elastic conductive unit (20) protrude from the first surface and the second surface respectively; Each elastic conductive unit (20) includes a conductive spring (21).

2. The conductive device according to claim 1, characterized in that: The insulating substrate (10) includes an elastic main body (12) and a rigid frame (11), and at least some of the plurality of through holes (13) are formed on the main body (12). The elastic main body (12) is sheet-shaped and includes an upper surface and a lower surface opposite to the upper surface, and the at least some of the through holes (13) all extend from the upper surface to the lower surface; The frame portion (11) defines a through mounting hole, the elastic main body portion (12) is disposed in the mounting hole and is peripherally defined by the frame portion (11); the extension direction of at least part of the through hole (13) is parallel to the extension direction of the mounting hole.

3. The conductive device according to claim 1, characterized in that: The conductive spring (21) includes a columnar spring portion (211) and a conical spring portion (212), the conical spring portion (212) being integrally connected to the columnar spring portion (211) along the axial direction; the columnar spring portion (211) includes a first end and a second end opposite to the first end, the first end protruding from one of the first surface and the second surface; the conical spring portion (212) includes a smaller top end and a bottom end opposite to the top end, the bottom end being electrically connected to the second end, the top end protruding from the other of the first surface and the second surface.

4. The conductive device according to claim 3, characterized in that: The conductive spring (21) also includes a pin (213) which is axially disposed on the top end.

5. The conductive device according to claim 1, characterized in that: Each elastic conductive unit (20) further includes a conductor (22), the conductive spring (21) being columnar and including a third end and a fourth end opposite to the third end, the third end protruding from one of the first surface and the second surface; the conductor (22) includes at least one tip (221) and an end opposite to the at least one tip (221), the end being connected to the fourth end, the at least one tip (221) protruding from the other of the first surface and the second surface.

6. The conductive device according to claim 5, characterized in that: The at least one tip (221) includes at least three tips (221) that are evenly distributed around the longitudinal axis of the conductor (22) and define a cavity between them.

7. The conductive device according to claim 1, characterized in that, The conductive spring (21) is sheet-shaped and includes a first contact portion (215), a second contact portion (216), and a bent portion (214). The two ends of the bent portion (214) are electrically connected to one end of the first contact portion (215) and one end of the second contact portion (216), respectively. The other end of the first contact portion (215) protrudes from one of the first surface and the second surface; the other end of the second contact portion (216) protrudes from the other of the first surface and the second surface. The other end of the first contact portion (215) includes at least one contact end.

8. A method for manufacturing a conductive device according to any one of claims 1 to 7, characterized in that, Includes the following steps: S1. Provide the insulating substrate (10); S2. A plurality of through holes (13) are prepared on the insulating substrate (10), such that the through holes (13) correspond one-to-one with the plurality of conductive contacts; S3. Provide the plurality of elastic conductive units (20); S4. The plurality of elastic conductive units (20) are respectively longitudinally disposed in the plurality of through holes (13), and the two ends of each elastic conductive unit (20) protrude from the first surface and the second surface respectively; S5. The plurality of elastic conductive units (20) are bonded to the insulating substrate (10) by dispensing or potting.

9. A method for manufacturing a conductive device according to any one of claims 1 to 7, characterized in that, Includes the following steps: S1. A mold is provided, the mold having a forming cavity, and the forming cavity having a plurality of upright pins corresponding one-to-one with conductive contacts; S2. Insulating material is injected into the molding cavity, and after demolding, an insulating substrate (10) with multiple through holes (13) is formed; S3. Provide a plurality of elastic conductive units (20), wherein the plurality of elastic conductive units (20) are respectively longitudinally disposed in the plurality of through holes (13), and the two ends of each elastic conductive unit (20) protrude from the first surface and the second surface respectively; S4. The plurality of elastic conductive units (20) are bonded to the insulating substrate (10) by dispensing or potting.

10. A method for manufacturing a conductive device according to any one of claims 1 to 7, characterized in that, Includes the following steps: S1. A mold is provided, the mold having a forming cavity; S2. Provide the plurality of elastic conductive units (20), and arrange the plurality of elastic conductive units (20) longitudinally in the molding cavity, and each of them corresponds to the plurality of conductive contacts; S3. Insulating material is injected into the molding cavity, and a conductive device is formed after demolding.

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