Aging test equipment for tight crimping device

Abstract

The tight crimping device aging test equipment comprises a vertical frame, a detection bin is mounted in the vertical frame, a mounting table is arranged at the bottom of the vertical frame, a moving rail is arranged on one side of the mounting table, a heat dissipation base is arranged on the mounting table, a transmission base is arranged on one side of the mounting table, and a clamping device is arranged on the transmission base. The mounting table is connected with the transmission seat through a transmission copper plate, a to-be-tested device is mounted in the heat dissipation seat, a test assembly is arranged in the detection bin, and the to-be-tested device is fed into the test assembly through movement of the moving rail. The to-be-tested device after the aging test is timely cooled, the to-be-tested device on the mounting table can be timely sent out, the automation degree is high, meanwhile, the to-be-tested device can be cooled in the first time, the process is simple, and the problem that the to-be-tested device is damaged during the aging test due to the fact that the test temperature is not timely fed back is solved.

Description

Technical Field

[0001] This invention relates to the technical field of aging testing, and more particularly to an aging testing device for tightly pressed devices. Background Technology

[0002] In the field of semiconductor chip reliability testing, chip aging testing is a crucial step in assessing the long-term operational stability of chips and predicting product lifespan. Currently, chip aging testing has become a standardized process and is widely used in chip research and development, production, and quality control.

[0003] Existing fixtures for aging tests of tightly pressed devices have significant shortcomings in practical applications. When testing multiple chips simultaneously, inconsistent pressing pressure between chips leads to poor repeatability of test results, failing to meet the requirements of high-precision reliability testing. Existing fixtures lack quick-change and positioning functions, requiring readjustment when changing to different chip specifications, resulting in low testing efficiency and an inability to meet the high-density, multi-specification testing needs of modern chips. Furthermore, they cannot provide immediate cooling for the devices under test. Therefore, we propose a new aging test device for tightly pressed devices to address these issues. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of current chip testing methods, such as inconsistent crimping pressure between chips during simultaneous chip testing, which leads to poor repeatability of test results and fails to meet the requirements of high-precision reliability testing; existing fixtures lack quick replacement and positioning functions, requiring readjustment when changing to different specifications of chips, resulting in low testing efficiency and inability to meet the high-density, multi-specification testing requirements of modern chips, as well as the inability to cool down the device under test in a timely manner. Therefore, this invention proposes a tightly crimped device aging test device.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: An aging test device for tightly pressed components includes a stand, a test chamber installed inside the stand, a mounting platform at the bottom of the stand, a moving rail on one side of the mounting platform, a heat sink on the mounting platform, and a transmission seat on one side of the mounting platform. The mounting platform and the transmission seat are connected by a transmission copper plate. The device under test is installed inside the heat sink, and a test assembly is installed inside the test chamber. The device under test is moved into the test assembly via the moving rail for aging testing.

[0006] Preferably, the moving rail is provided with a slide rail, and a clamp is slidably connected to the slide rail. The moving rail clamps the device under test on the mounting platform through the clamp.

[0007] Preferably, the test component is installed at the bottom of the test chamber via a telescopic rod. The test component is provided with a clamping frame, and a contact needle plate is provided at the bottom of the clamping frame. The test component abuts against the device under test via the contact needle plate to perform aging tests.

[0008] Preferably, the testing chamber is provided with a mounting frame, the testing component is located at the bottom of the mounting frame, and a circuit board is on the mounting frame, the circuit board being electrically connected to the testing component.

[0009] Preferably, the heat sink is provided with a heat sink body, the device under test is installed in the heat sink body, an input board is provided on one side of the heat sink body, the input board is electrically connected to the transmission copper plate, an air inlet is connected to one side of the heat sink body, the air inlet is connected to an external cooling air source, and a clamping column is provided on the top of the heat sink body, when the test component clamps the heat sink, it abuts against the clamping column.

[0010] Preferably, both ends of the moving rail are provided with stops.

[0011] Preferably, a vertical pole is installed inside the frame, and a cylinder is provided on the vertical pole. The detection chamber is powered by the cylinder and moves up and down along the vertical pole inside the frame.

[0012] Compared with the prior art, the beneficial effects of the present invention are: 1. By using the heat sink, air inlet and mounting platform together, cooling gas can be quickly delivered into the heat sink to dissipate heat from the device under test after aging test. 2. By using the moving rail, mounting platform and clamping plate together, the device under test on the mounting platform can be sent out in a timely manner, with a high degree of automation. At the same time, the device under test can be cooled down immediately. 3. By using the test chamber, mounting platform and stand together, the test components can be pressed onto the device under test for testing to ensure test accuracy. At the same time, the test results are sent out in time through the circuit board and the test temperature is fed back, so that abnormal devices under test can be removed and cooled in time. In summary, this invention provides a method to quickly deliver cooling gas into the heat sink, promptly dissipate heat from the device under test (DUT) after aging tests, and promptly remove the DUT from the mounting platform. It is highly automated and can cool the DUT immediately, offering the advantages of simple process and avoiding the problem of untimely temperature feedback leading to DUT damage during aging tests. Attached Figure Description

[0013] Figure 1 This is an overall schematic diagram of an aging test device for tightly pressed devices proposed in this invention; Figure 2 This is a schematic diagram of the testing chamber of an aging test device for tightly pressed components proposed in this invention; Figure 3 This is a front view of the testing chamber of an aging test device for tightly pressed devices proposed in this invention; Figure 4 This is a schematic diagram of the mounting platform and connecting components of an aging test equipment for tightly pressed devices proposed in this invention; Figure 5 This is a schematic diagram of the mounting platform and connecting components of an aging test equipment for tightly pressed devices proposed in this invention.

[0014] In the diagram: 10. Frame; 11. Pole; 12. Cylinder; 20. Test chamber; 21. Circuit board; 22. Mounting frame; 23. Test assembly; 24. Telescopic rod; 25. Clamping frame; 26. Contact pin plate; 30. Moving rail; 31. Stop block; 32. Slide rail; 33. Clamping plate; 40. Mounting platform; 50. Heat sink base; 51. Heat sink body; 52. Compression post; 53. Air inlet; 54. Input plate; 60. Transmission base; 61. Transmission copper plate. Detailed Implementation

[0015] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the examples in the specification.

[0016] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0017] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that is mutually exclusive with other embodiments.

[0018] Unless otherwise specified, all raw materials used in the examples were commercially purchased.

[0019] like Figures 1-5As shown, this application discloses an aging test device for tightly pressed devices, including a stand 10, a test chamber 20 installed inside the stand 10, a vertical rod 11 installed inside the stand 10, a cylinder 12 mounted on the vertical rod 11, the test chamber 20 being powered by the cylinder 12 and moving up and down along the vertical rod 11 within the stand 10, a mounting platform 40 at the bottom of the stand 10, a moving rail 30 on one side of the mounting platform 40, a heat sink 50 on the mounting platform 40, and a transmission seat 60 on one side of the mounting platform 40, the mounting platform 40 and the transmission seat 60 being connected by a transmission copper plate 61, a device under test installed inside the heat sink 50, and a test assembly 23 inside the test chamber 20, the device under test being moved into the test assembly 23 via the moving rail 30 for aging testing.

[0020] In the above embodiment, the moving rail 30 is provided with a slide rail 32, and a clamping plate 33 is slidably connected to the slide rail 32. Both ends of the moving rail 30 are provided with a stop block 31. The moving rail 30 clamps the device under test on the mounting platform 40 through the clamping plate 33. Alternatively, the clamping plate 33 can be replaced with a suction cup, and the device under test can be moved by adsorption or other means.

[0021] The test component 23 is installed at the bottom of the test chamber 20 via a telescopic rod 24. The test component 23 is provided with a clamping frame 25, and the bottom of the clamping frame 25 is provided with a contact needle plate 26. The test component 23 abuts against the device under test through the contact needle plate 26 to perform aging tests.

[0022] like Figure 1-3 As shown, in a preferred embodiment, the detection chamber 20 is provided with a mounting frame 22, the test component 23 is located at the bottom of the mounting frame 22, and a circuit board 21 is on the mounting frame 22, which is electrically connected to the test component 23.

[0023] In the above embodiment, the heat sink 50 is provided with a heat sink body 51, the device under test is installed in the heat sink body 51, an input plate 54 is provided on one side of the heat sink body 51, the input plate 54 is electrically connected to the transmission copper plate 61, an air inlet 53 is connected to one side of the heat sink body 51, the air inlet 53 is connected to an external cooling air source, and a clamping post 52 is provided on the top of the heat sink body 51. When the test component 23 clamps the heat sink 50, it abuts against the clamping post 52.

[0024] In use, the device under test (DUT) is placed on the mounting platform 40. Power is transmitted through the transmission copper plate 61 of the transmission base 60 and sent to the DUT via the input board 54 of the heat sink 50. At the same time, the test chamber 20 provides power through the cylinder 12 to press the test component 23 onto the DUT for aging test. The test information is adjusted and output in a timely manner through the circuit board 21. After the test, the DUT is clamped onto the heat sink 50 of another mounting platform 40 by the clamping plate 33 on the moving rail 30. Cooling nitrogen is introduced through the air inlet 53 of the heat sink body 51 to cool the DUT in a timely manner after the test.

[0025] It should be noted that the foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. An aging test device for tightly pressed components, comprising a stand, characterized in that, The stand contains a testing chamber, and the bottom of the stand has a mounting platform. A moving rail is provided on one side of the mounting platform, a heat sink is provided on the mounting platform, and a transmission seat is provided on one side of the mounting platform. The mounting platform and the transmission seat are connected by a transmission copper plate. The device under test is installed in the heat sink, and a testing assembly is provided in the testing chamber. The device under test is moved into the testing assembly via the moving rail for aging testing.

2. The aging test equipment for tightly pressed devices according to claim 1, characterized in that, The moving rail is equipped with a slide rail, and a clamping plate is slidably connected to the slide rail. The moving rail clamps the device under test on the mounting platform through the clamping plate.

3. The aging test equipment for tightly pressed devices according to claim 1, characterized in that, The test assembly is installed at the bottom of the test chamber via a telescopic rod. The test assembly is equipped with a clamping frame, and the bottom of the clamping frame is equipped with a contact needle plate. The test assembly abuts against the device under test via the contact needle plate to perform aging tests.

4. The aging test equipment for tightly pressed devices according to claim 3, characterized in that, The testing chamber is equipped with a mounting frame, the testing component is located at the bottom of the mounting frame, and a circuit board is mounted on the mounting frame. The circuit board is electrically connected to the testing component.

5. The aging test equipment for tightly pressed devices according to claim 1, characterized in that, The heat sink is equipped with a heat sink body, and the device under test is installed inside the heat sink body. An input board is provided on one side of the heat sink body, and the input board is electrically connected to the transmission copper plate. An air inlet is connected to one side of the heat sink body, and the air inlet is connected to an external cooling air source. A clamping column is provided on the top of the heat sink body, and when the test component clamps the heat sink, it abuts against the clamping column.

6. The aging test equipment for tightly pressed devices according to claim 2, characterized in that, Both ends of the moving rail are equipped with stops.

7. The aging test equipment for tightly pressed devices according to claim 1, characterized in that, The frame is equipped with a vertical pole, and the vertical pole is equipped with a cylinder. The detection chamber is powered by the cylinder and moves up and down along the vertical pole within the frame.

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