Photonic device based on flexible substrate and design method thereof

Abstract

The invention belongs to the technical field of semiconductor devices, and particularly relates to a photonic device based on a flexible substrate and a design method thereof.The photonic device comprises the flexible substrate, a core layer and a flexible protection layer which are sequentially arranged from bottom to top; the core layer at least comprises a first functional area with a first bending radius, a second functional area with a second bending radius and a third functional area with a third bending radius which are sequentially divided from the outer edge to the center, and the first bending radius, the second bending radius and the third bending radius are sequentially increased; the first functional area, the second functional area and the third functional area are respectively provided with a first-class component, a second-class component and a third-class component, and the multifunctional photonic device with the partitioned arrangement and the buffer anti-warping structure is comprehensively provided for flexible / wearable / non-planar calculation and other scenes needing repeated bending.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of semiconductor devices, and particularly relates to a flexible-substrate-based photonic device and a design method thereof. BACKGROUND

[0002] With the rapid development of wearable devices, flexible electronics and optoelectronics, flexible-substrate-based photonic devices have shown wide application prospects in biomedical sensing, flexible display, smart fabric, Internet of Things and other fields due to their characteristics of being bendable, foldable and conformable to non-planar surfaces.

[0003] For example, the Chinese utility model with publication number CN215985737U discloses a flexible resonance type optical chip and a sensor applying the chip, which comprises a carrier, i.e., a flexible substrate, using a flexible light-transparent polymer material; and a low-refractive-index buffer layer formed on a surface of the carrier. The utility model also discloses a sensor applying the flexible resonance type optical chip. Since the utility model uses a flexible polymer material to replace the rigid substrate such as glass and silicon that has been used all the time, the mechanical flexibility is greatly improved, and the utility model is not easy to break, and experimental tests show that the optical properties are not affected by the change of the substrate material.

[0004] That is, the scheme can improve flexibility while ensuring that the optical properties are not affected by the change of the substrate material through the cooperation of the flexible substrate and the low-refractive-index buffer layer. However, some optical devices need to integrate multiple functional components such as waveguides, multimode interference (MMI) devices, filters, micro-ring resonators, etc. on the flexible substrate to realize the transmission, processing and modulation of optical signals. Due to the differences in material properties, structure size and stress response of different functional devices, stress concentration and uneven distribution are prone to occur during bending or stretching. Such uneven stress not only may cause interlayer interface peeling and degradation of device performance, but also may cause warping or fracture of the overall structure, affecting the reliability of the device and shortening its service life.

[0005] Therefore, there is an urgent need for a flexible photonic device that can prevent warping and maintain optical stability in a repeated bending environment. SUMMARY

[0006] The application aims to provide a flexible-substrate-based photonic device and a design method thereof to partially alleviate or solve the above problems, realize multi-functional integration, and ensure the stability between various components (especially different material layers).

[0007] In order to solve the above-mentioned technical problems, the application specifically adopts the following technical solutions: The first aspect of the present application provides a flexible substrate-based photonic device, comprising a flexible substrate, a core layer and a flexible protective layer arranged in sequence from bottom to top, the core layer comprising at least a first functional area with a first bending radius, a second functional area with a second bending radius and a third functional area with a third bending radius arranged in sequence from the outer edge to the center, the first bending radius, the second bending radius and the third bending radius increasing in sequence, the first functional area, the second functional area and the third functional area being provided with a first type of component, a second type of component and a third type of component respectively, the first type of component comprising at least a waveguide, the second type of component comprising at least one of an MMI component, a filter, a diffraction structure, and the third type of component comprising at least one of a microring resonator, a modulator, a photonic crystal component.

[0008] As an improvement, the first type of component further comprises at least one of an edge coupler, a grating and a photodetector; the photonic device comprises at least one redundant unit, the redundant unit being composed of a plurality of functionally identical edge couplers, or a plurality of functionally identical gratings, or a plurality of functionally identical photodetectors.

[0009] As an improvement, the density of the first type of component in the first functional area is 15%-25%, the density of the second type of component in the second functional area is 45%-55%, and the density of the third type of component in the third functional area is 65%-75%.

[0010] As an improvement, the shortest distance d1 from any point in the first functional area to the outer edge of the core layer satisfies d1≤ 5%·Rmin, the shortest distance d2 from any point in the second functional area to the outer edge of the core layer satisfies 5%·Rmin<d2≤ 20%·Rmin, and the shortest distance d3 from any point in the third functional area to the outer edge of the core layer satisfies d3>20%·Rmin; wherein Rmin is the minimum bending radius of the photonic device.

[0011] As an improvement, a transition layer is arranged between the flexible substrate and the core layer.

[0012] As an improvement, the thickness of the flexible substrate is 50 um -500um, the thickness of the transition layer is 2 um-10um, the thickness of the core layer is 0.5 um -1um, and the thickness of the flexible protective layer is >2um.

[0013] As an improvement, the waveguide extends to the second functional area and the third functional area, the waveguide has a plurality of bending structures so that the waveguide is in a serpentine shape, the bending radius of the waveguide in the first functional area is 5R-10R, the bending radius of the waveguide in the second functional area is 2R-5R, and the bending radius of the waveguide in the third functional area is R.

[0014] As an improvement, the material of the transition layer is silicon dioxide and / or SU8 photoresist, and the material of the waveguide is titanium dioxide or silicon nitride.

[0015] The second aspect of the application provides a design method of a flexible substrate-based photonic device, based on the photonic device, comprising the steps of: S100, obtaining the bending resistance of the current component, and classifying the component into a corresponding component set according to the bending resistance; the component set at least includes the first to third sets.

[0016] S200, distributing the components to the corresponding mounting areas according to the component sets, the mounting areas at least include the first to third functional areas, wherein each component set corresponds to a functional area.

[0017] S300, obtaining the straight-line distance between any two components and the functional correlation degree of the two components, if the distance is greater than a preset distance and the functional correlation degree is greater than a preset correlation degree, a preset correction method is adopted to correct the positions of the two components; wherein the correction method is to move the component close to the edge of the photonic device to the next functional area, so that the distance between the two components is less than the preset distance.

[0018] As an improvement, the method further comprises the steps of: S400, obtaining the attribute of the current component, the attribute at least includes the functional attribute and the auxiliary attribute; when the attribute is the auxiliary attribute, the current position is maintained, and if the attribute is the functional attribute, S500 is entered; S500, determining whether the component is located in the third functional area, if yes, the current position is maintained, otherwise, the component is moved from the current functional area to the center of the photonic device by at least one functional area.

[0019] The principle and beneficial technical effects of the application are: For the flexible / wearable / non-planar computing and other scenarios that require repeated bending, the application comprehensively proposes a multifunctional photonic device with partition arrangement and buffer anti-warping structure (the multifunctional photonic device refers to the internal integration of multiple functional devices, such as MMI devices, filters, micro-ring resonators, modulators, etc.), which can at least partially alleviate or solve the stress uneven problem caused by multi-component integration and the warping problem caused by stress unevenness when bending.

[0020] Specifically, firstly, this application provides a scheme for multi-device partitioning integration on a flexible substrate. By matching the degree of bending and device properties in different regions through specific partitioning design and device density distribution, the possibility of device damage can be reduced. Furthermore, by setting a transition layer with a specific thickness and structure between the flexible substrate and the core layer, the adhesion between the substrate and the core layer can be improved, and the warping problem caused by repeated folding and uneven stress distribution in multi-device partitioning can be reduced.

[0021] Furthermore, this application also provides a scheme for triple-controlling the position of devices. The devices are first classified based on their performance (e.g., bending resistance). Then, based on the first classification, the devices are corrected by the degree of correlation between them, and the devices are corrected again by their importance. Through the above three-level classification and control mechanism, the devices can be arranged more reasonably on the substrate, balancing the lifespan of the devices and the coordination ability between them.

[0022] Furthermore, this application sets up redundant units in the vulnerable area to provide alternative solutions for vulnerable components located in the first region with a large bending radius, which can further improve the service life of photonic devices. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. The elements or parts in the drawings are not necessarily drawn to scale. Obviously, the drawings described below are some embodiments of the present invention, and those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0024] Figure 1 This is a schematic diagram of the first structure of a photonic device in an exemplary embodiment of the present invention; Figure 2 This is a schematic diagram of the second structure of a photonic device in an exemplary embodiment of the present invention; Figure 3 This is a schematic diagram of the partitioning of the core layer in an exemplary embodiment of the present invention; Figure 4 This is a schematic diagram of the partitioning of a photonic device when it is bent in an exemplary embodiment of the present invention; Figure 5 This is a schematic diagram of a serpentine waveguide in an exemplary embodiment of the present invention; Figure 6 This is a flowchart of the design method in Embodiment 2 of the present invention.

[0025] In the diagram, the markings are: 100, flexible substrate; 200, transition layer; 300, core layer; 310, first functional area; 320, second functional area; 330, third functional area; and 400, flexible protective layer. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0027] In this document, suffixes such as "module," "component," or "unit" used to denote elements are used solely for the purpose of illustrative purposes and have no specific meaning in themselves. Therefore, "module," "component," or "unit" may be used interchangeably. In this document, terms such as "upper," "lower," "inner," "outer," "front," "rear," "one end," and "the other end," indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0028] In this document, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," and "connected," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances. In this document, "multiple" means two or more, that is, it includes two, three, four, five, etc.

[0029] In this article, "warping" refers to the unexpected bending, twisting, or wrinkling deformation of a flexible photonic device, either as a whole or in a localized area, caused by the mismatch of thermal expansion coefficients between different layers of material and / or uneven internal stress distribution during the manufacturing or use of the device.

[0030] In this article, "bending radius" refers to the radius of curvature of the bent portion when the device is bent, and a larger bending radius indicates a smaller degree of bending; "bending radius" refers to the radius of curvature of the geometry of the optical waveguide itself formed on the core layer.

[0031] Example 1 See Figures 1-5 This invention provides a photonic device based on a flexible substrate 100, comprising a flexible substrate 100, a core layer 300, and a flexible protective layer 400 arranged sequentially from bottom to top. The core layer 300 includes at least a first functional region 310 with a first bending radius, a second functional region 320 with a second bending radius, and a third functional region 330 arranged sequentially from the outer edge to the center. The first bending radius, the second bending radius, and the third bending radius increase sequentially. The first functional region 310, the second functional region 320, and the third functional region 330 are respectively provided with a first-class component, a second-class component, and a third-class component. The first-class component includes at least one of waveguide, the second-class component includes at least one of MMI (multimode interferometer), filter, and diffraction structure, and the third-class component includes at least one of microring resonator, modulator, and photonic crystal component.

[0032] In some embodiments, the refractive index of the core layer 300 is greater than that of the protective layer. By providing a core layer 300 and a protective layer with a refractive index difference, this refractive index difference can be used for strong confinement of light within the waveguide and signal transmission calculations.

[0033] In some embodiments, the bending strength of the first type of component, the second type of component, and the third type of component decreases sequentially. Bending strength refers to the ability of a material or structure to resist fracture or performance degradation when bent. It can be quantified by measuring the number of times a device is repeatedly bent at a specific bending radius until failure (cycle life), or by the minimum bending radius that causes a significant change in its optical performance (such as insertion loss) (e.g., an increase of 1 dB).

[0034] Photonic devices with the above structure can protect components to a certain extent by strategically placing different components in different regions. For example, placing components with strong bending resistance in the first region with a larger bending radius and components with weak bending resistance in the third region with a smaller bending radius. This can prevent rapid damage caused by excessive performance differences.

[0035] In some embodiments, the first type of components further includes at least one of an edge coupler, a grating, and a photodetector; the photon device includes at least one redundant unit, and the redundant unit is composed of multiple edge couplers with the same function, or multiple gratings with the same function, or multiple photodetectors with the same function. For the vulnerable area with a large bending degree, a redundant unit is specifically set, that is, a backup structure is provided for some or all of the components in this area. Without excessively increasing the complexity of the device, it can, to a certain extent, alleviate or solve the problem of the short lifespan of the entire photon device caused by the rapid damage of the components in the vulnerable area. It should be noted that multiple components with the same function in the redundant unit can all be in the working state to share the load in the initial state, or some can be in the working state while some are in cold backup or hot backup; when a failure of the working component is detected, the backup component can be enabled through a built-in switching mechanism (such as an optical switch or an electrical routing) to maintain the overall function of the system.

[0036] In some embodiments, the setting densities of the first type of components, the second type of components, and the third type of components gradually increase. For example, the density of the first type of components in the first functional area 310 is 15% - 25%, the density of the second type of components in the second functional area 320 is 45% - 55%, and the density of the third type of components in the third functional area 330 is 65% - 75%. By setting different densities for different components in different areas, the space utilization rate of the entire photon device can be maximized as much as possible. That is to say, in this application, the components are divided both in terms of area and density. While improving the space utilization rate of the photon device and ensuring the working efficiency of each component, the service life of the photon device can also be guaranteed.

[0037] In some embodiments, the shortest distance d1 from any point in the first functional area 310 to the outer edge of the core layer 300 satisfies d1 ≤ 5%·Rmin, the shortest distance d2 from any point in the second functional area 320 to the outer edge of the core layer 300 satisfies 5%·Rmin < d2 ≤ 20%·Rmin, and the shortest distance d3 from any point in the third functional area 330 to the outer edge of the core layer 300 satisfies d3 > 20%·Rmin. Here, Rmin is the minimum bending radius of the photon device.

[0038] In some embodiments, a transition layer 200 is provided between the flexible substrate 100 and the core layer 300. By setting the transition layer 200 to buffer between the flexible substrate 100 and the core layer 300 with different materials, the warping phenomenon can be alleviated to a certain extent.

[0039] In some embodiments, the thickness of the flexible substrate 100 is 50 μm-500 μm, the thickness of the transition layer 200 is 2 μm-10 μm, the thickness of the core layer 300 is 0.5 μm-1 μm, and the thickness of the flexible protective layer 400 is >2 μm.

[0040] In some embodiments, the waveguide extends to the second functional region 320 and the third functional region 330, and the waveguide has a plurality of bends to make the waveguide serpentine (see...). Figure 5 ).

[0041] In some embodiments, the bending radii of the first functional region 310, the second functional region 320, and the third functional region 330 gradually decrease. The bending radius of the waveguide in the first functional region 310 is 5R-10R, the bending radius of the waveguide in the second functional region 320 is 2R-5R, and the bending radius of the waveguide in the third functional region 330 is R. Here, R is a reference bending radius, meaning that the ratio of the bending radii of the first functional region 310, the second functional region 320, and the third functional region 330 is 5-10:2-5:1.

[0042] By setting serpentine waveguides with different bending radii, the waveguides can adapt to different regions with different bending radii, thereby improving the stability of photonic devices. Specifically, by setting different waveguide bending radii in different functional regions, the waveguides can use a larger bending radius in regions with severe bending (such as the first functional region 310) to reduce losses, and a smaller bending radius in regions with gentle bending (such as the third functional region 330) to save space.

[0043] In some embodiments, the transition layer 200 is made of silicon dioxide (SiO2) and / or SU8 photoresist, and the waveguide is made of titanium dioxide (TiO2) or silicon nitride (Si3N4).

[0044] In some embodiments, the flexible substrate 100 is made of PI (polyimide) or PET (polyethylene terephthalate), and the flexible protective layer 400 is a polymer protective layer, which may be made of one of polydimethylsiloxane (PDMS), polyurethane (PU), polymethyl methacrylate (PMMA), and their modified materials.

[0045] In summary, for scenarios requiring repeated bending, such as flexible / wearable / non-planar computing, this application proposes a multifunctional photonic device with partitioned arrangement and buffer anti-warping structure (multifunctional photonic device refers to a device that can integrate multiple functional devices, such as MMI devices, filters, micro-ring resonators, modulators, etc.), which can at least partially alleviate or solve the problem of uneven stress caused by the integration of multiple components and the warping problem caused by uneven stress during bending.

[0046] Specifically, firstly, this application provides a scheme for multi-device partitioning integration on a flexible substrate 100. By matching the degree of bending and device properties in different regions through specific partitioning design and device density distribution, the possibility of device damage can be reduced. Furthermore, a transition layer 200 with a specific thickness and structure is provided between the flexible substrate 100 and the core layer 300, which can improve the adhesion between the substrate and the core layer 300 and reduce the warping problem caused by repeated folding and uneven stress distribution in multi-device partitioning.

[0047] Furthermore, this application also provides a scheme for triple-controlling the position of devices. The devices are first classified based on their performance (e.g., bending resistance). Then, based on the first classification, the devices are corrected by the degree of correlation between them, and the devices are corrected again by their importance. Through the above three-level classification and control mechanism, the devices can be arranged more reasonably on the substrate, balancing the lifespan of the devices and the coordination ability between them.

[0048] Furthermore, this application sets up redundant units in the vulnerable area to provide alternative solutions for vulnerable components located in the first region with a large bending radius, which can further improve the service life of photonic devices.

[0049] Example 2 See Figure 6 The present invention also provides a design method for a photonic device based on a flexible substrate, applicable to the photonic device in Embodiment 1, comprising the following steps: S100, obtain the bending strength of the current component, and classify the component into the corresponding component set according to the bending strength; the component set includes at least the first to third sets.

[0050] S200, the components are assigned to corresponding installation areas according to the component sets, the installation areas including at least first to third functional areas, wherein each component set corresponds to one functional area.

[0051] S300: Obtain the straight-line distance between any two components and the functional correlation degree between the two components. If the distance is greater than a preset distance and the functional correlation degree is greater than a preset correlation degree, then a preset correction method is used to correct the positions of the two components. The correction method involves moving the component closer to the edge of the photonic device to the next functional area, so that the distance between the two components is less than the preset distance. In other words, the component closer to the edge of the photonic device is moved towards the center of the photonic device.

[0052] The straight-line distance between two components refers to the length of the line connecting the center points of the two components.

[0053] Functional interdependence refers to the degree of interdependence and close collaboration among different functional components in a photonic integrated system or device when achieving specific optical functions. It reflects the coupling strength and information interaction requirements of the system's components at the functional level. For example: high interdependence: deep influence between device performance, requiring collaboration during operation; low interdependence: devices operate independently, without affecting other devices.

[0054] In this paper, a functional correlation degree greater than the preset correlation degree indicates that the two components are highly correlated, and that they influence and coordinate with each other. The two components should avoid being overly dispersed.

[0055] The preset distance and preset correlation degree are preset by those skilled in the art based on experience or obtained from a large amount of experimental data.

[0056] For example, the component set includes a first set, a second set, and a third set, and the functional area includes a first functional area, a second functional area, and a third functional area. The first set corresponds to the first functional area, the second set corresponds to the second functional area, and the third set corresponds to the third functional area. The first functional area, the second functional area, and the third functional area are arranged sequentially from the outside to the inside, that is, sequentially arranged along the outer edge to the center of the photonic device.

[0057] Obtain the straight-line distance between the first component located in the first functional area and the second component located in the third functional area, as well as the functional correlation between the first component and the second component; when it is determined that the straight-line distance is greater than a preset distance and the functional correlation is greater than a preset correlation, move the first component from the first functional area to the second functional area or the third functional area until the distance between the first component and the second component is less than the preset distance.

[0058] The above design method provides a scheme with dual control. First, the components are initially divided into different regions according to their key attributes (bending resistance). Then, their positions are corrected according to the degree of correlation between the components. This ensures that the components meet the bending requirements of the current region while avoiding the problem of reduced component operating efficiency caused by excessive dispersion of related components.

[0059] In some embodiments, S400, the attributes of the current component are obtained, the attributes including at least functional attributes and auxiliary attributes; when the attribute is an auxiliary attribute, the current position is maintained; if the attribute is a functional attribute, the process proceeds to S500. S500, determine whether the component is located in the third functional area. If so, maintain the current position; otherwise, move the component from the current functional area to the center of the photonic device across at least one functional area.

[0060] Among them, the "functional attributes" of a component refer to its ability to directly realize core optical signal processing, with typical functions including light generation, transmission, modulation, routing, and detection; the "auxiliary attributes" of a component refer to the support capabilities it provides to ensure the normal operation of core optical functions, such as power supply, control, status monitoring, and interface management, and it does not directly participate in or change the physical state of the optical signal.

[0061] Based on the above dual control scheme, by controlling the position of the core component (the component with functional attributes), it is possible to avoid placing the core component in the edge area with a large bending radius, thereby further reducing the possibility of damage to the core component during frequent bending and improving the service life of photonic devices.

[0062] In summary, this application provides a triple control scheme that arranges the components in a targeted manner based on key parameters of finiteness (the bending resistance of the components, the degree of correlation between the components, and the properties of the components), so as to meet the durability requirements in frequent bending scenarios while ensuring the working efficiency of the entire photonic device.

[0063] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0064] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of the present invention without departing from the spirit and scope of the claims. All of these forms are within the protection scope of the present invention.

Claims

1. A photonic device based on a flexible substrate, characterized in that, The system includes a flexible substrate (100), a core layer (300), and a flexible protective layer (400) arranged sequentially from bottom to top. The core layer (300) includes at least a first functional region (310) with a first bending radius, a second functional region (320) with a second bending radius, and a third functional region (330) with a third bending radius arranged sequentially from the outer edge to the center. The first bending radius, the second bending radius, and the third bending radius increase sequentially. The first functional region (310), the second functional region (320), and the third functional region (330) are respectively provided with a type I component, a type II component, and a type III component. The type I component includes at least a waveguide, the type II component includes at least one of an MMI component, a filter, and a diffraction structure, and the type III component includes at least one of a microring resonator, a modulator, and a photonic crystal component.

2. The photonic device based on a flexible substrate according to claim 1, characterized in that, The aforementioned type of component also includes at least one of an edge coupler, a grating, and a photodetector; The photonic device includes at least one redundant unit, which is composed of multiple edge couplers with the same function, or multiple gratings with the same function, or multiple photodetectors with the same function.

3. A photonic device based on a flexible substrate according to claim 1, characterized in that, The density of the first type of component in the first functional area (310) is 15%-25%, the density of the second type of component in the second functional area (320) is 45%-55%, and the density of the third type of component in the third functional area (330) is 65%-75%.

4. A photonic device based on a flexible substrate according to claim 1, characterized in that, The shortest distance d1 from any point in the first functional region (310) to the outer edge of the core layer (300) satisfies d1 ≤ 5%·Rmin, the shortest distance d2 from any point in the second functional region (320) to the outer edge of the core layer (300) satisfies 5%·Rmin < d2 ≤ 20%·Rmin, and the shortest distance d3 from any point in the third functional region (330) to the outer edge of the core layer (300) satisfies d3 > 20%·Rmin; where Rmin is the minimum bending radius of the photonic device.

5. A photonic device based on a flexible substrate according to claim 1, characterized in that, A transition layer (200) is provided between the flexible substrate (100) and the core layer.

6. A photonic device based on a flexible substrate according to claim 5, characterized in that, The thickness of the flexible substrate (100) is 50 μm - 500 μm, the thickness of the transition layer (200) is 2 μm - 10 μm, the thickness of the core layer (300) is 0.5 μm - 1 μm, and the thickness of the flexible protective layer (400) is > 2 μm.

7. A photonic device based on a flexible substrate according to claim 1, characterized in that, The waveguide extends to the second functional region (320) and the third functional region (330), and the waveguide has a number of bends to make the waveguide serpentine; the bend radius of the waveguide in the first functional region (310) is 5R-10R, the bend radius of the waveguide in the second functional region (320) is 2R-5R, and the bend radius of the waveguide in the third functional region (330) is R.

8. A photonic device based on a flexible substrate according to claim 1, characterized in that, The transition layer (200) is made of silicon dioxide and / or SU8 photoresist, and the waveguide is made of titanium dioxide or silicon nitride.

9. A design method for a photonic device based on a flexible substrate, wherein the photonic device is based on any one of claims 1-8, characterized in that, Including the following steps: S100, obtain the bending strength of the current component, and classify the component into the corresponding component set according to the bending strength; the component set includes at least the first to third sets; S200, the components are assigned to corresponding installation areas according to the component sets, the installation areas including at least first to third functional areas, wherein each component set corresponds to one functional area; S300, obtain the straight-line distance between any two components and the functional correlation degree between the two components. If the distance is greater than a preset distance and the functional correlation degree is greater than a preset correlation degree, then adopt a preset correction method to correct the position of the two components. The correction method is to move the component closer to the edge of the photonic device to the next functional area so that the distance between the two components is less than the preset distance.

10. The design method for photonic devices based on flexible substrates according to claim 9, characterized in that, It also includes the following steps: S400: Obtain the attributes of the current component, which include at least functional attributes and auxiliary attributes; if the attribute is an auxiliary attribute, maintain the current position; if the attribute is a functional attribute, proceed to S500. S500, determine whether the component is located in the third functional area. If so, maintain the current position; otherwise, move the component from the current functional area to the center of the photonic device across at least one functional area.

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