Connector

Abstract

A connector is provided with: a top pin group (120) having a plurality of contact pins (121, 122) arranged in a predetermined direction; and a bottom pin group that has a plurality of contact pins arranged in a predetermined direction, is disposed so as to face the top pin group (120), and is positioned on the mounting substrate side, each of the contact pins (121, 122) being at least one of a signal pin (122) for signal use and a ground pin (121) for ground use, and each of the contact pins (121, 122) being one of the signal pin (122) for signal use and the ground pin (121) for ground use. The top pin group (120) has a double ground structure in which two signal pins (122) are arranged between two ground pins (121) so as to be adjacent to each other in a prescribed direction.

Description

[0001] This application is a divisional application of the Chinese Invention Application No. 202310743394.9, filed on June 21, 2023, with the title of “Connector”.

[0002] This application claims priority to U.S. Application No. 63 / 354,809, filed on June 23, 2022. TECHNICAL FIELD

[0004] The present application relates to a connector. BACKGROUND

[0006] For example, in Patent Literature 1 (U.S. Patent No. 9531129 Specification), an electrical connector having a first conductor array and a second conductor array arranged in the up-down direction is disclosed.

[0007] The structure disclosed in Patent Literature 1 describes a case where sub-arrays composed of G-S-S-G are arranged in a manner of repeating G-S-S-G-S-S-G-S-S-G.

[0008] Further, a case where the sub-arrays can also be arranged in a manner of repeating G-S-S-G-G-S-S-G-G-S-S-G (for convenience, this arrangement will be referred to as “double ground structure”) is described.

[0009] In addition, G refers to ground, and S refers to signal.

[0010] However, in the case of super-high speed transmission (for example, high speed transmission exceeding 100 Gbps based on PAM4 modulation method), if the sub-arrays are arranged in the manner of G-S-S-G-G-S-S-G-G-S-S-G, heat generation can become a problem.

[0011] Therefore, an object of the present application is to provide a connector that adopts a double ground structure capable of easily cooling heat generation. SUMMARY

[0013] In order to solve the above problem, the connector of the present application adopts the following means.

[0014] The connector according to the first aspect of the present application includes a top pin group having a plurality of contact pins arranged in a predetermined direction, and a bottom pin group having a plurality of contact pins arranged in the predetermined direction, and configured to face the top pin group, and positioned on a substrate side, each of the contact pins being either a signal pin for signal or a ground pin for ground, the top pin group being a double ground structure in which each group having two signal pins arranged between two ground pins is arranged adjacent to each other in the predetermined direction.

[0015] According to the connector according to the present aspect, since at least the top pin group is a double ground structure (when G is ground and S is signal, a structure of G-S-S-G-G-S-S-G-…-G-S-S-G is obtained), crosstalk at the time of high-speed transmission in the top pin group can be reduced.

[0016] Further, in a state in which the connector is mounted to the substrate (or in a state in which the connector is connected to another connector mounted to the substrate), the top pin group using the double ground structure faces the bottom pin group positioned on the substrate side, that is, the top pin group is positioned above the bottom pin group on the substrate. Therefore, in the connector, a margin is generated in space on the top pin group side. Therefore, it is possible to secure a space for providing a heat sink or the like for cooling a heat generated at the time of super-high-speed transmission on the top pin group side.

[0017] In addition, the "super-high-speed transmission" referred to herein means high-speed transmission of more than 100 Gbps, for example, based on a PAM4 modulation scheme.

[0018] The connector according to the present aspect is, for example, a main connector mounted to a substrate, or a plug connector connected to the main connector.

[0019] The connector according to the second aspect of the present application is the connector according to the first aspect, and is used for high-speed transmission of 100 Gbps or more.

[0020] The connector according to the third aspect of the present application is the connector according to the first aspect or the second aspect, and includes an electrically conductive member electrically connected to two ground pins adjacent to each other in the top pin group.

[0021] According to the connector according to the present aspect, the electrically conductive member is provided to electrically connect two ground pins adjacent to each other in the top pin group, and thus it is possible to attenuate noise by the electrically conductive member.

[0022] The connector according to the fourth aspect of the present application is the connector according to the third aspect, and the electrically conductive member has a protruding shape configured to be positioned between two ground pins adjacent to each other in the top pin group.

[0023] According to the connector related to the present aspect, the conductive member has a protruding shape arranged between two adjacent ground pins in the top pin group, and thus the area of the conductive member opposite to each ground pin can be increased by the protruding shape.

[0024] The connector related to the fifth aspect of the present invention is the connector of the third or fourth aspect, in which the conductive member is electrically connected to each ground pin of the bottom pin group.

[0025] According to the connector related to the present aspect, since the conductive member is electrically connected to each ground pin of the bottom pin group, the conductive member contacts the ground pins of the top pin group and the ground pins of the bottom pin group with one member. Thus, compared to a case in which a conductive member that contacts the ground pins of the top pin group and a conductive member that contacts the ground pins of the bottom pin group are respectively provided, the number of components can be reduced, and thus cost reduction can be achieved. Further, by being one component, the mountability can also be improved.

[0026] The connector related to the sixth aspect of the present invention is the connector of any one of the third to fifth aspects, in which the contact pin has a mounting portion mounted to a substrate, a standing portion standing from the mounting portion in a substantially vertical direction, and a substantially straight portion extending from the standing portion in a substantially horizontal direction and including a contact point with a terminal of a counterpart, and the conductive member is electrically connected to the standing portion of the ground pin of the top pin group.

[0027] The connector related to the seventh aspect of the present invention is the connector of any one of the third to sixth aspects, in which the dimension of the conductive member in the height direction is 50% or more of the dimension of the standing portion.

[0028] According to the connector related to the present aspect, since the dimension of the conductive member in the height direction is 50% or more of the dimension of the standing portion, the volume of the conductive member increases, and the noise attenuation performance of the conductive member can be improved.

[0029] The connector related to the eighth aspect of the present invention is the connector of any one of the third to seventh aspects, in which the conductive member is electrically connected to the front surface of each standing portion, and the connector includes a back surface member located at the back surface of the standing portion of each ground pin of the top pin group and sandwiching the standing portion of each ground pin of the top pin group between the conductive member.

[0030] According to the connector described herein, since a back member has an upright portion for inserting each ground pin of the top pin group between itself and a conductive member, the ground pin can be pressed onto the conductive member via the back member. This allows the ground pin to reliably contact the conductive member.

[0031] The connector according to the ninth aspect of the present invention is in the first aspect of the connector, wherein the connector has a housing that holds the top pin group and the bottom pin group, the front end portion of the contact pin including the contact point with the other terminal extends obliquely from the housing, a first wall is formed in the housing, the first wall extends along the extension direction of the contact pin and separates the oblique portions extending from the housing from the contact pin from each other.

[0032] According to the connector involved in this method, since a first wall is formed in the housing to separate the inclined portions of each contact pin from each other, crosstalk can be reduced and impedance adjustment can be performed through the first wall.

[0033] The connector according to the tenth aspect of the present invention, in the connector of the first or ninth aspect, has a second wall extending along the extension direction of the contact pin and facing the inner surface of the inclined portion of each contact pin.

[0034] According to the connector described herein, since a second wall is formed in the housing opposite to the inner surface of the inclined portion of each contact pin, impedance adjustment can be performed via the second wall. Furthermore, by extending the first wall from the second wall, the root of the first wall can be reinforced by the second wall.

[0035] In addition, the "inner surface" mentioned here refers to the surface facing the space where the substrate is inserted.

[0036] The connector according to the eleventh aspect of the present invention, in any one of the first, ninth and tenth aspects, includes a housing that holds the top pin group and the bottom pin group, wherein a portion of the contact pin including the front end of the contact point with the other terminal extends obliquely from the housing, and the oblique portion extending from the housing of each contact pin has a length of 2 mm or more from its root to the contact point.

[0037] According to the connector described in this method, since the inclined portion extending from the housing of each contact pin has a length of 2 mm or more from the base to the contact point, it can appropriately accommodate changes in the thickness of the substrate. For example, even if the thickness of the substrate into which the connector is inserted increases, the change in thickness can be absorbed by the bending displacement of the inclined portion due to its longer length.

[0038] The connector according to the twelfth aspect of the present invention comprises: a top pin group having a plurality of contact pins arranged in a predetermined direction; and a bottom pin group having a plurality of contact pins arranged in the predetermined direction, configured opposite to the top pin group and located on a substrate side, wherein each of the contact pins is at least one of a signal pin for signaling and a ground pin for grounding, the connector comprising a conductive member in contact with each of the ground pins, the contact pin having: a mounting portion mounted on a substrate; an upright portion erected substantially vertically from the mounting portion; and a substantially straight portion extending substantially horizontally from the upright portion and including a contact point with a terminal of the other party, the conductive member being electrically connected to the upright portion of the ground pin of the top pin group, the dimension in the height direction being 50% or more of the dimension of the upright portion.

[0039] In the connector of the thirteenth aspect of the present invention, in the connector of the twelfth aspect, the conductive member is electrically connected to the front side of each of the raised portions, the connector having a back side member located on the back side of the raised portion of each of the ground pins of the top pin group, and the raised portion of each of the ground pins of the top pin group is sandwiched between the back side member and the conductive member.

[0040] The connector according to the fourteenth aspect of the present invention comprises: a first contact pin group having a plurality of contact pins arranged in a predetermined direction; a second contact pin group having a plurality of contact pins arranged in the predetermined direction and configured opposite to the first contact pin group; and a housing holding the first contact pin group and the second contact pin group, wherein a portion of the contact pin including a front end side of a terminal contact with the other party extends obliquely from the housing, a first wall is formed in the housing, the first wall extending along the extending direction of the contact pin and separating the oblique portions extending from the housing of the contact pin from each other.

[0041] The connector according to the fifteenth aspect of the present invention, in the connector of the fourteenth aspect, has a second wall formed in the housing, the second wall extending along the extending direction of the contact pins and facing the inner surface of the inclined portion of each of the contact pins.

[0042] In the connector according to the sixteenth aspect of the present invention, in the connector of the fourteenth or fifteenth aspect, the contact pin is at least one of a signal pin for signaling and a ground pin for grounding, and at least one of the first contact pin group and the second contact pin group is a double grounding structure, wherein the double grounding structure arranges two groups of the signal pins adjacent to each other in the predetermined direction between the two ground pins.

[0043] The connector involved in the seventeenth aspect of the present invention is the same as that in the sixteenth aspect, and the connector is used for high-speed transmission of 100Gbps or more.

[0044] In the connector according to the eighteenth aspect of the present invention, in any one of the fourteenth to seventeenth aspects of the connector, the length of each of the inclined portions from the root to the contact point is 2 mm or more. Attached Figure Description

[0046] Figure 1 This is a 3D view of the module installed on the mounting base plate.

[0047] Figure 2 yes Figure 1 The cut line AA is shown in the cross-sectional view.

[0048] Figure 3 This is a three-dimensional view of the main connector viewed from the front and above.

[0049] Figure 4 This is a 3D view of the main connector viewed from the top rear.

[0050] Figure 5 This is a cross-sectional view of the main connector.

[0051] Figure 6 This is a cross-sectional view of the housing of the main connector.

[0052] Figure 7 This is an exploded perspective view of the main connector from the top rear.

[0053] Figure 8 This is a 3D view of a portion of the top pin group.

[0054] Figure 9 This is a 3D view of a portion of the bottom pin group.

[0055] Figure 10 This is a three-dimensional view of the conductive components from the bottom back.

[0056] Figure 11 This is a three-dimensional view of the aligned components viewed from above the back.

[0057] Figure 12 This is a top view of the aligned components after partial magnification.

[0058] Figure 13 This is an enlarged rear view of the area near the press-in groove of the main connector after the backplate has been removed.

[0059] Figure 14 It is a magnified 3D view of the area near the press-in groove of the main connector after the backplate has been removed.

[0060] Figure 15 This is a perspective view of the components, including the conductive and alignment members, viewed from above the back.

[0061] Figure 16 This is a 3D view of the back side of one end of the main connector (before backplate welding).

[0062] Figure 17 This is a 3D view of the back side of one end of the main connector (after backplate welding).

[0063] Figure 18 This is a rear view of the main connector after the backplate has been removed.

[0064] Figure 19 yes Figure 18 The cut line BB is shown in a cross-sectional view.

[0065] Figure 20 Is Figure 19 The diagram shows a cross-sectional view of the main connector with the backplate installed.

[0066] Figure 21 This is a 3D view of the plug connector viewed from the top rear.

[0067] Figure 22 This is a three-dimensional view of the plug connector viewed from the front and above.

[0068] Figure 23 This is an exploded perspective view of the plug connector from the front and above.

[0069] Figure 24 This is a cross-sectional view of a plug connector with a base plate inserted into it.

[0070] Figure 25 This is a cross-sectional view (through the contact pins) of the plug connector inserted into the main connector.

[0071] Figure 26 This is a cross-sectional view (not through the contact pins) of the plug connector inserted into the main connector.

[0072] Figure 27 This is a magnified 3D view of a portion of the outer casing viewed from the top of the back.

[0073] Figure 28 This is a magnified 3D view of a portion of the outer casing viewed from the front and top.

[0074] Figure 29 This is a magnified 3D view of a portion of the plug connector, viewed from the front and above.

[0075] Figure 30 This is a 3D view of a portion of the top pin group.

[0076] Figure 31 This is a 3D view of a portion of the bottom pin group.

[0077] Figure 32 This is a cross-sectional view of a plug connector with a base plate inserted into it.

[0078] Figure 33 This is a diagram showing crosstalk in double-grounded and single-grounded systems (horizontal axis: frequency, vertical axis: crosstalk). Detailed Implementation

[0080] Below, refer to Figures 1 to 32 The connector involved in one embodiment of this disclosure will be described.

[0081] In this embodiment, the connector is a device that connects the electrical connection module 320 and the mounting substrate 310 (substrate).

[0082] like Figure 1 and Figure 2 As shown, module 320 includes a plug connector substrate 321 and a housing 322 for housing the plug connector substrate 321. Furthermore, a heat sink 323 may be provided on the upper surface of the housing 322 for effective cooling.

[0083] The plug connector substrate 321 is electrically connected to the mounting substrate 310 via the main connector 100 mounted on the mounting substrate 310 and the plug connector 200 connecting the main connector 100 and the plug connector substrate 321.

[0084] The connectors in this embodiment are the main connector 100 and / or the plug connector 200 described above. These connectors are designed for ultra-high-speed transmission.

[0085] In addition, the "ultra-high-speed transmission" mentioned here refers to, for example, high-speed transmission exceeding 100Gbps based on PAM4 modulation.

[0086] [Main Connector]

[0087] The main connector 100 will be described below.

[0088] <Overview of the structure of the main connector>

[0089] The main connector 100 is a connector that is mounted on the mounting base plate 310 and into which the plug connector 200 is inserted. That is, it is a connector used to connect the mounting base plate 310 and the plug connector 200.

[0090] like Figures 3 to 7 As shown, the main connector 100 includes a housing 110, a top pin group 120, a bottom pin group 130, a conductive member 140, an alignment member 150, and a backplate 160 (back panel member).

[0091] The housing 110 is a component with a generally rectangular shape, which houses and holds the top pin group 120, the bottom pin group 130, the conductive member 140, and the alignment member 150.

[0092] The outer casing 110 is a non-conductive component, for example, molded from resin or the like.

[0093] like Figure 5 and Figure 6 As shown, a plug insertion space 112 and a component receiving space 114 are formed inside the housing 110.

[0094] A front opening 111 communicating with the plug insertion space 112 is provided on the front of the housing 110.

[0095] The back and a portion of the lower surface of the housing 110 have a back opening 113 that communicates with the component receiving space 114.

[0096] The plug insertion space 112 is a space for the plug connector 200 to be inserted through the front opening 111.

[0097] The component receiving space 114 is a space that receives the conductive component 140 and the alignment component 150.

[0098] Furthermore, each contact pin of the top pin group 120 and the bottom pin group 130 is housed in the plug insertion space 112 and the component housing space 114.

[0099] like Figure 8 As shown, the top pin group 120 is a group of contact pins formed by arranging a plurality of top ground pins 121 and a plurality of top signal pins 122 in a specified direction.

[0100] In the top pin group 120, multiple top ground pins 121 and multiple top signal pins 122 are arranged according to a specified rule. Details are described later.

[0101] like Figure 7 As shown, the arrangement direction of each contact pin in the top pin group 120 is consistent with the length direction of the housing 110.

[0102] The top grounding pin 121 is an elongated metal terminal for achieving conductivity, having a mounting portion 121a, an upright portion 121b, and a generally straight portion 121c.

[0103] Mounting portion 121a is a portion mounted on mounting substrate 310, extending horizontally on the base end side of top ground pin 121.

[0104] The erected portion 121b is at approximately a right angle from the mounting portion 121a (in Figure 8 The part that stands upright (approximately vertical). The length of the upright part 121b is sufficiently larger than the length of the mounting part 121a.

[0105] The roughly straight section 121c is from the upright section 121b at a roughly right angle (in) Figure 8 The middle part extends in a roughly horizontal direction.

[0106] The length of the generally straight portion 121c is sufficiently larger than the length of the mounting portion 121a. Furthermore, it is preferable that the length of the generally straight portion 121c is greater than the length of the erected portion 121b.

[0107] A plug insertion space 112 is formed on the front end side of the generally straight portion 121c (see reference). Figure 5 The contact portion 121d is bent into a convex shape. The contact portion 121d becomes the contact with the top grounding pin 221 of the plug connector 200, described later. (As...) Figure 5 As shown, a portion of the generally straight portion 121c, including the contact portion 121d, extends into the plug insertion space 112.

[0108] The top signal pin 122 is a slender metal terminal for achieving conduction, having a mounting portion 122a, an upright portion 122b, and a generally straight portion 122c.

[0109] The structure of mounting portion 122a, erecting portion 122b, and generally straight portion 122c is the same as that of mounting portion 121a, erecting portion 121b, and generally straight portion 121c of the top grounding pin 121.

[0110] Additionally, the contact portion 122d formed in the generally straight section 122c becomes a contact with the top signal pin 222 of the plug connector 200, which will be described later.

[0111] like Figure 9 As shown, the bottom pin group 130 is a group of contact pins formed by arranging a plurality of bottom ground pins 131 and a plurality of bottom signal pins 132 in a specified direction.

[0112] Multiple bottom ground pins 131 and multiple bottom signal pins 132 are arranged in the bottom pin group 130. Details will be described later.

[0113] like Figure 7 As shown, the arrangement direction of each contact pin in the bottom pin group 130 is consistent with the length direction of the housing 110.

[0114] The bottom grounding pin 131 is a slender metal terminal for achieving conductivity, having a mounting portion 131a, an upright portion 131b, and a generally straight portion 131c.

[0115] Mounting portion 131a is a portion mounted on mounting substrate 310, extending horizontally on the base end side of bottom ground pin 131.

[0116] The erected portion 131b is at approximately a right angle from the mounting portion 131a (in Figure 9 The part that stands upright (approximately vertical). The length of the upright part 131b is greater than the length of the mounting part 131a.

[0117] The roughly straight section 131c is from the upright section 131b at a roughly right angle (in) Figure 9 The middle part extends in a roughly horizontal direction.

[0118] The length of the generally straight portion 131c is sufficiently larger than the length of the mounting portion 131a. Furthermore, the length of the generally straight portion 131c is greater than the length of the erected portion 131b.

[0119] A plug insertion space 112 is formed on the front end side of the generally straight portion 131c (see reference). Figure 5 The contact portion 131d is bent into a convex shape. The contact portion 131d becomes the contact with the bottom grounding pin 231 of the plug connector 200, described later. (As...) Figure 5 As shown, a portion of the generally straight portion 131c, including the contact portion 131d, extends into the plug insertion space 112.

[0120] The bottom signal pin 132 is a slender metal terminal for achieving conduction, having a mounting portion 132a, an upright portion 132b, and a generally straight portion 132c.

[0121] The structure of mounting portion 132a, erecting portion 132b, and generally straight portion 132c is the same as that of mounting portion 131a, erecting portion 131b, and generally straight portion 131c of bottom grounding pin 131.

[0122] Additionally, the contact portion 132d formed in the generally straight section 132c becomes a contact with the bottom signal pin 232 of the plug connector 200 described later.

[0123] With the top pin group 120 and bottom pin group 130 assembled in the housing 110 and the main connector 100 mounted on the mounting substrate 310, as follows: Figure 3 and Figure 5As shown, the top pin group 120 (more specifically, generally straight portions 121c and 122c) is configured within the housing 110 to be positioned above and opposite the bottom pin group 130 (more specifically, generally straight portions 131c and 132c).

[0124] In other words, the bottom pin group 130 is configured within the housing 110 to be positioned downwards and opposite to the top pin group 120. That is, when the main connector 100 is mounted on the mounting substrate 310, the bottom pin group 130 is positioned closer to the mounting substrate 310 (on the mounting substrate 310 side) than the top pin group 120.

[0125] like Figures 5 to 7 and Figure 10 As shown, the conductive component 140 is a block-shaped part that is roughly rectangular.

[0126] like Figure 5 As shown, the conductive member 140 is housed in the member housing space 114 inside the housing 110 with the alignment member 150 mounted on the lower surface.

[0127] The conductive component 140 is a component having a specified conductivity, for example, molded from a resin in which conductive particles are dispersed or an antistatic resin. The "specified conductivity" referred to here is, for example, 10 S / m or more and 200 S / m or less, preferably 30 S / m or more and 150 S / m or less.

[0128] like Figures 5 to 7 and Figure 11 As shown, the alignment member 150 is a plate-shaped component that is roughly rectangular.

[0129] like Figure 5 As shown, the alignment member 150 is housed in the member housing space 114 inside the housing 110 while mounted on the lower surface of the conductive member 140.

[0130] Alignment member 150 is a non-conductive member, for example, molded from resin or the like.

[0131] like Figure 11 and Figure 12 As shown, a plurality of back side alignment grooves 151 and a plurality of front side alignment grooves 152 are formed on each edge along the length direction of the alignment member 150.

[0132] Each contact pin constituting the top pin group 120 is housed in each rear side alignment groove 151, thereby aligning the contact pins at equal intervals.

[0133] Each contact pin constituting the bottom pin group 130 is housed in each front side alignment groove 152, thereby aligning the contact pins at equal intervals.

[0134] like Figures 3 to 5 and Figure 7 As shown, the backplate 160 is a block-shaped component with a roughly rectangular parallelepiped shape.

[0135] like Figure 5 As shown, the back panel 160 is mounted on the back of the housing 110 in such a way that it closes a portion of the back opening 113 of the housing 110.

[0136] The back plate 160 is molded from, for example, resin. The back plate 160 can be a conductive component or a non-conductive component.

[0137] like Figure 3 and Figure 4 As shown, the main connector 100 is constructed by assembling the housing 110, top pin group 120, bottom pin group 130, conductive member 140, alignment member 150 and back plate 160 constructed in the manner described above.

[0138] At this time, as Figure 13 and Figure 14 As shown, the assembly of conductive member 140 and alignment member 150 (refer to...) Figure 15 They are fixed to the housing 110 by pressing their two ends into the press-in grooves 116 formed on the two inner sides of the housing 110.

[0139] Specifically, the extrusion ribs 116a formed on the upper surface of the press-in groove 116 are flattened by the conductive member 140, thereby pressing both ends of the component into the press-in groove 116.

[0140] In addition, such as Figure 5 As shown, the bottom pin group 130 is fixed to the housing 110 in a state where it is positioned by the alignment member 150 fixed to the housing 110.

[0141] In addition, such as Figure 4 and Figure 7 As shown, approximately semi-circular protrusions 115 (protruding downwards) are formed at both ends of the outer casing 110. In addition, approximately semi-circular protrusions 143 (protruding upwards) are formed at both ends of the conductive member 140.

[0142] And, as Figure 16 As shown, when the assembly of the conductive member 140 and the alignment member 150 is housed in the housing 110, each protrusion 115 and each protrusion 143 overlap, thereby forming an axial portion at each end.

[0143] And, as Figure 17As shown, with each shaft portion inserted into the fixing holes 162 formed at both ends of the back plate 160, the front end of each shaft portion is welded relative to the back plate 160, thereby fixing the back plate 160 to the back of the housing 110.

[0144] In addition, such as Figure 5 As shown, the top pin group 120 is fixed to the housing 110 in a state where it is positioned by the alignment member 150 fixed to the housing 110.

[0145] In the main connector 100 constructed in the manner described above, as Figure 3 As shown, the fixing accessory 170 and each contact pin installed on the housing 110 are soldered to the mounting base 310.

[0146] By soldering the fixing fitting 170 to the mounting base 310, the main connector 100 can be rigidly fixed to the mounting base 310. In addition, by soldering each contact pin to the mounting base 310, the main connector 100 can be fixed to the mounting base 310, and each contact pin can be electrically connected to the mounting base 310.

[0147] <Details regarding the arrangement of contact pins and the configuration of pin groups>

[0148] like Figure 8 As shown, in the top pin group 120, when the top ground pin 121 is set to "G" and the top signal pin 122 is set to "S", the contact pins are arranged in the manner of GSSGGSSG-...-GSSG. That is, there are multiple groups of GSSGs of the two top signal pins 122 forming a differential pair arranged between the two top ground pins 121 in a specified direction. At this time, the top ground pin 121 located at the end (e.g., the right end) of the first group is adjacent to the top ground pin 121 located at the end (e.g., the left end) of the second group.

[0149] In this embodiment, such an arrangement is referred to as a "dual-grounding structure". By adopting a dual-grounding structure, crosstalk during ultra-high-speed transmission can be reduced.

[0150] like Figure 9 As shown, in the bottom pin group 130, the bottom pin group 130 has, for example, portions arranged in a manner of GSSGSSG-…-SSG.

[0151] As described above, by configuring the top pin group 120 (specifically, the generally straight portions 121c and 122c) within the housing 110 at a position higher than the bottom pin group 130 (specifically, the generally straight portions 131c and 132c), such that... Figure 1 and Figure 2As shown, there is a margin in space above the top pin group 120.

[0152] On the other hand, since there is a mounting substrate 310 on the bottom pin group 130 side, there is no space available.

[0153] Because high-speed signals are configured on the top pin group 120 with a dual ground structure, the top pin group 120 is more prone to heat generation than the bottom pin group 130 during ultra-high-speed transmission. However, by configuring the top pin group 120 higher than the bottom pin group 130, the heat sink 323 for cooling the top pin group 120 can be configured in the secured space.

[0154] In other words, the top pin group 120, which is prone to heat generation, is actively configured above the housing 110, which has ample space and is easy to install heat sinks 323, etc.

[0155] Alternatively, the dual-ground structure can be used only in the top pin group 120, or in both the top pin group 120 and the bottom pin group 130.

[0156] <Details regarding conductive components>

[0157] Figure 18 The image shows a rear view of the main connector 100 with the backplate 160 removed. Furthermore, Figure 19 The middle shows Figure 18 The sectional view shown in the cut line BB.

[0158] like Figure 10 and Figure 19 As shown, a plurality of back-side contact protrusions 141 are formed on the back side of the conductive member 140.

[0159] The back side contact protrusion 141 is a protrusion that extends along the height direction (thickness direction) of the conductive member 140 and is formed at equal intervals along the length direction of the conductive member 140.

[0160] like Figure 5 and Figure 19 As shown, the rear side contact protrusion 141 is electrically connected to the front side of the raised portion 121b of the two adjacent top ground pins 121 in the top pin group 120. Thus, the top ground pins 121 are electrically connected to the conductive member 140, thereby enabling noise attenuation.

[0161] Here, the back-side contact protrusion 141 can either physically contact the top ground pin 121 or have a small gap between it and the top ground pin 121. The term "small gap" here refers to a gap sufficient to allow for electrical connection at high frequencies above 1 GHz, for example, a range of 0.05 mm to 0.1 mm. Furthermore, the back-side contact protrusion 141 neither physically contacts nor is electrically connected to the top signal pin 122.

[0162] A strip-shaped protrusion 141a (protruding shape) is formed on the surface of the contact protrusion 141 on the back side.

[0163] The strip protrusion 141a is an elongated protrusion extending along the height direction (thickness direction) of the conductive member 140, and one is formed in the central region of each back side contact protrusion 141.

[0164] The strip protrusion 141a protrudes between the top ground pin 121 and the top ground pin 121, thereby increasing the area of ​​the conductive member 140 opposite to the top ground pin 121.

[0165] like Figure 10 and Figure 19 As shown, a plurality of front-side contact protrusions 142 are formed on the front side of the conductive member 140.

[0166] The front side contact protrusion 142 is a protrusion that extends along the height direction (thickness direction) of the conductive member 140 and is formed throughout the length direction of the conductive member 140.

[0167] like Figure 5 and Figure 19 As shown, the front-side contact protrusion 142 is electrically connected to the back side of the raised portion 131b of the bottom ground pin 131 of the bottom pin group 130. Thus, the bottom ground pin 131 is electrically connected to the conductive member 140, thereby enabling noise attenuation.

[0168] Here, the front-side contact protrusion 142 can either physically contact the bottom ground pin 131 or have a small gap between it and the bottom ground pin 131. The term "small gap" here refers to a gap that separates the distance for high-frequency electrical connections above 1 GHz, for example, in the range of 0.05 mm to 0.1 mm.

[0169] In addition, the front side contact protrusion 142 and the bottom signal pin 132 are neither physically in contact nor electrically connected.

[0170] Furthermore, when the bottom pin group 130 adopts a dual grounding structure, the front side contact protrusion 142 can also be made to have the same shape as the back side contact protrusion 141 (including the strip protrusion 141a).

[0171] like Figure 5 As shown, the height dimension of the conductive member 140 is more than 50% of the dimension of the raised portion 121b of the top grounding pin 121.

[0172] Therefore, the back side contact protrusion 141 (including the strip protrusion 141a) contacts more than 50% of the area of ​​the raised portion 121b that extends across the top ground pin 121.

[0173] Furthermore, in order to achieve this, the conductive member 140 needs to be increased in the height direction. In this case, the proportion of the conductive member 140 occupying the component housing space 114 inside the housing 110 will necessarily increase.

[0174] This improves the noise attenuation performance of the conductive component 140.

[0175] In addition, the conductive component 140 preferably occupies 50% to 90% of the component housing space 114.

[0176] <Details about the back panel>

[0177] Figure 20 The text is a jumbled collection of characters and phrases, seemingly from different sources and lacking coherent sentences. A direct translation wouldn't be meaningful. Figure 19 The backplate 160 is shown mounted on the main connector 100.

[0178] like Figure 20 As shown, a plurality of contact protrusions 161 are formed on the front side of the back plate 160.

[0179] The contact protrusion 161 is a protrusion that extends along the height direction (thickness direction) of the back plate 160 and is formed at equal intervals along the length direction of the back plate 160.

[0180] like Figure 5 and Figure 20 As shown, the contact protrusion 161 is located on the back side of the raised portion 121b of two adjacent top ground pins 121 in the top pin group 120. In this case, the contact protrusion 161 preferably contacts the back side of each of the two raised portions 121b.

[0181] like Figure 20As shown, the position of the contact protrusion 161 corresponds to the position of the back side contact protrusion 141, so the top grounding pin 121 can be clamped between the contact protrusion 161 and the back side contact protrusion 141. Thus, when the contact protrusion 161 is in contact with the back side of the raised portion 121b of the top grounding pin 121, the top grounding pin 121 can be pressed against the back side contact protrusion 141, thereby improving contact.

[0182] Furthermore, the conductive member 140 is pressed towards the bottom ground pin 131 by the pressing force applied from the back plate 160 to the top ground pin 121, thus enabling the front side contact protrusion 142 to be pressed against the bottom ground pin 131, thereby improving contact.

[0183] A strip-shaped protrusion 161a is formed on the surface of the contact protrusion 161.

[0184] The strip protrusion 161a is a slender protrusion extending along the height direction (thickness direction) of the back plate 160, and one is formed in the central region of each contact protrusion 161.

[0185] The strip protrusion 161a protrudes between the top ground pin 121 and the top ground pin 121, thereby increasing the area of ​​the back plate 160 opposite to the top ground pin 121.

[0186] [Plug Connector]

[0187] The plug connector 200 will be described below.

[0188] <An overview of the structure of the plug connector>

[0189] The plug connector 200 is a connector that is inserted into the main connector 100 and into the plug connector base plate 321. That is, it is a connector used to connect the main connector 100 and the plug connector base plate 321.

[0190] like Figures 21 to 24 As shown, the plug connector 200 includes a housing 210, a first contact pin group 220, and a second contact pin group 230.

[0191] With the plug connector 200 inserted into the main connector 100, the first contact pin group 220 contacts the top pin group 120 of the main connector 100, and the second contact pin group 230 contacts the bottom pin group 130 of the main connector 100. Therefore, in the following description, the first contact pin group 220 is referred to as the top pin group 220, and the second contact pin group 230 is referred to as the bottom pin group 230.

[0192] The housing 210 is a component having a plate-shaped portion 211 and a protrusion 212 protruding from the back of the plate-shaped portion 211, which houses and holds the top pin group 220 and the bottom pin group 230.

[0193] The outer casing 210 is a non-conductive component, for example, molded from resin.

[0194] like Figure 24 As shown, a substrate insertion space 213 is formed inside the outer casing 210.

[0195] The substrate insertion space 213 is a space for inserting the substrate 321 for the plug connector.

[0196] A front opening 214 communicating with the substrate insertion space 213 is provided on the front of the outer casing 210.

[0197] like Figure 25 and Figure 26 As shown, the protrusion 212 is the portion that is inserted into the plug insertion space 112 of the main connector 100.

[0198] The front end of the protrusion 212 is tapered. This allows it to be easily inserted into the main connector 100.

[0199] like Figure 27 As shown, a plurality of pin slots 212a are formed on the upper surface of the protrusion 212 along the protrusion direction of the protrusion 212 (i.e., the insertion direction toward the main connector 100).

[0200] The pin slots 212a are formed at equal intervals along the length of the housing 210.

[0201] In addition, the same pin groove 212a is also formed on the lower surface of the protrusion 212.

[0202] like Figure 27 and Figure 28 As shown, a through hole 211a is formed in the plate-shaped portion 211, connecting the front and back sides. Each contact pin is inserted into the through hole 211a from the front side of the plate-shaped portion 211.

[0203] The positions of each through hole 211a along the length of the housing 210 correspond to the positions of each pin groove 212a formed on the protrusion 212. Therefore, each contact pin inserted into the through hole 211a engages through the pin groove 212a.

[0204] like Figure 28 As shown, a plurality of partition portions 211b (first wall) and inclined portions 211c (second wall) are formed on the front side of the plate-shaped portion 211.

[0205] The partition 211b is a plate-shaped wall / rib that extends in the insertion direction (extension direction of the contact pin) of the contact pin and is erected in the height direction of the housing 210, and is formed at equal intervals throughout the length direction of the housing 210.

[0206] The positions of the gaps formed between adjacent partitions 211b correspond to the positions of each through hole 211a. Therefore, as Figure 29 As shown, each contact pin inserted into the through hole 211a passes through gaps formed between adjacent separators 211b. In other words, the separators 211b separate adjacent contact pins.

[0207] like Figure 28 As shown, the inclined facet 211c protrudes from the front of the plate-shaped portion 211 toward the insertion direction of the contact pin, and is formed continuously throughout the length direction of the housing 210.

[0208] At this time, the inclined surface 211c is located in the region at the root of the partition 211b. In other words, each partition 211b extends from the inclined surface 211c along the insertion direction of the contact pin.

[0209] The inclined face 211c tapers at the front end by tilting the two sides facing outward relative to the horizontal direction.

[0210] The inclined surface of the inclined surface 211c faces the inner surface of the contact pin. Furthermore, the inclination angle (slope) of the inclined surface roughly corresponds to the inclination angle of the inclined portions 221b, 222b, 231b, 232b (described later) when each contact pin is inserted into the through hole 211a in an unloaded state (e.g., when the plug connector substrate 321 is not inserted).

[0211] Therefore, the inclined portions 221b, 222b, 231b, and 232b of each contact pin inserted into the housing 210 can be supported by the inclined surface 211c, or the contact pins can be prevented from bending inward due to external loads.

[0212] Furthermore, other functions of the partition 211b and the inclined face 211c will be described later.

[0213] like Figure 30 As shown, the top pin group 220 is a group of contact pins formed by arranging multiple top ground pins 221 and multiple top signal pins 222 in a specified direction.

[0214] In the top pin group 220, a plurality of top ground pins 221 and a plurality of top signal pins 222 are arranged in accordance with the arrangement of the contact pins of the top pin group 120 of the main connector 100. That is, the top pin group 220 is a double ground structure corresponding to the top pin group 120 of the main connector 100.

[0215] like Figure 23 As shown, the arrangement direction of each contact pin in the top pin group 220 is consistent with the length direction of the housing 210.

[0216] like Figure 30 As shown, the top ground pin 221 is an elongated metal terminal for achieving conduction, having a base portion 221a and a sloping portion 221b.

[0217] The base portion 221a is the portion that contacts the contact portion 121d of each top ground pin 121 of the main connector 100, and extends in a generally horizontal direction.

[0218] The base portion 221a is held in the housing 210 by the through hole 211a and the pin slot 212a.

[0219] The inclined portion 221b is the portion that is inclined relative to the base portion 221a.

[0220] An insertion space 213 facing the substrate is formed on the front end side of the inclined portion 221b (see reference). Figure 24 The contact portion 221c is bent into a convex shape. The contact portion 221c becomes the contact with the plug connector substrate 321.

[0221] When the inclined portion 221b is inserted into and held in the housing 210 by the top grounding pin 221, it extends from the back of the plate-shaped portion 211 through the gaps formed between adjacent partitions 211b.

[0222] The top signal pin 222 is a slender metal terminal for achieving conduction, having a base portion 222a and a slanted portion 222b.

[0223] The structure of the base portion 222a, the inclined portion 222b, and the contact portion 222c is the same as that of the base portion 221a, the inclined portion 221b, and the contact portion 221c of the top grounding pin 221.

[0224] In addition, the base portion 222a contacts each of the top signal pins 122 of the main connector 100.

[0225] like Figure 31As shown, the bottom pin group 230 is a group of contact pins formed by arranging multiple bottom ground pins 231 and multiple bottom signal pins 232 in a specified direction.

[0226] In the bottom pin group 230, a plurality of bottom ground pins 231 and a plurality of bottom signal pins 232 are arranged in accordance with the arrangement of the contact pins of the bottom pin group 130 of the main connector 100.

[0227] like Figure 23 As shown, the arrangement direction of each contact pin in the bottom pin group 230 is consistent with the length direction of the housing 210.

[0228] like Figure 31 As shown, the bottom ground pin 231 is a slender metal terminal for achieving conduction, having a base portion 231a and a sloping portion 231b.

[0229] The base portion 231a is the portion that contacts the contact portion 131d of each bottom ground pin 131 of the main connector 100, and extends in a generally horizontal direction.

[0230] The base portion 231a is held in the housing 210 by the through hole 211a and the pin slot 212a.

[0231] The inclined portion 231b is the portion that is inclined relative to the base portion 231a.

[0232] An insertion space 213 facing the substrate is formed on the front end side of the inclined portion 231b (see reference). Figure 24 The contact portion 231c is bent into a convex shape. The contact portion 231c becomes a contact with the plug connector substrate 321.

[0233] When the inclined portion 231b is inserted into and held in the housing 210 by the bottom grounding pin 231, it extends from the back of the plate-shaped portion 211 through the gaps formed between adjacent partitions 211b.

[0234] The bottom signal pin 232 is a slender metal terminal for achieving conduction, having a base portion 232a and a tilted portion 232b.

[0235] The structure of the base portion 232a, the inclined portion 232b, and the contact portion 232c is the same as that of the base portion 231a, the inclined portion 231b, and the contact portion 231c of the bottom grounding pin 231.

[0236] In addition, the base portion 232a contacts each of the bottom signal pins 132 of the main connector 100.

[0237] With the top pin group 220 and bottom pin group 230 assembled in the housing 210, and the plug connector 200 inserted into the main connector 100 already mounted on the mounting substrate 310, as follows Figure 21 and Figure 22 As shown, the top pin group 220 (specifically, the inclined portions 221b and 222b) is configured to be positioned higher than the bottom pin group 230 (specifically, the inclined portions 231b and 232b) and opposite to the bottom pin group 230.

[0238] In other words, the bottom pin group 230 is configured to be lower than and opposite to the top pin group 220. That is, when the plug connector 200 is inserted into the main connector 100, the bottom pin group 230 is configured to be closer to the mounting substrate 310 (the position on the mounting substrate 310 side) than the top pin group 220.

[0239] With this configuration, similar to the main connector 100, space is created above the top pin group 220.

[0240] like Figure 21 and Figure 22 As shown, a plug connector 200 is formed by assembling the housing 210, the top pin group 220 and the bottom pin group 230 configured as described above.

[0241] <Regarding the partition and slanted face>

[0242] like Figure 29 As shown, the outer casing 210 has the aforementioned plurality of partitions 211b and inclined surfaces 211c.

[0243] Here, each separator 211b separates two adjacent contact pins. This reduces crosstalk between the contact pins and allows for impedance adjustment.

[0244] Furthermore, impedance adjustment can be performed by tilting the face 211c. Additionally, the tilted face 211c also functions as a part for reinforcing the root of each partition 211b.

[0245] <Regarding the length dimensions of the inclined section>

[0246] like Figure 24 As shown, it is preferable to set the length L of the inclined portion 221b to, for example, 2 mm or more.

[0247] Here, the length dimension L is the distance from the root of the inclined portion 221b (the boundary between the inclined portion 221b and the base portion 221a) to the contact portion 221c formed in the inclined portion 221b.

[0248] The same applies to the other inclined sections 222b, 231b, and 232b.

[0249] By setting the length dimension L to 2mm or more, it is possible to properly accommodate variations in the thickness of the plug connector substrate 321 that is inserted between the top pin group 220 and the bottom pin group 230.

[0250] use Figure 24 and Figure 32 The variation in suitable plate thickness is explained. Furthermore, here is a specific example.

[0251] Figure 32 The thickness of the substrate 321 for the plug connector shown is greater than... Figure 24 The thickness dimension of the substrate 321 for the plug connector shown.

[0252] Assuming that the length dimension L is short (e.g., less than 1 mm), since the bending displacement of the inclined portion 221b is small, if the thickness dimension of the plug connector substrate 321 increases, for example, the root of the inclined portion 221b will undergo plastic deformation.

[0253] In addition, "bending displacement" refers to, for example, the displacement of the contact portion 221c when the root of the inclined portion 221b is used as the fixed end in the top grounding pin 221, the inclined portion 221b rotates elastically and deforms around the fixed end.

[0254] On the other hand, when the length dimension L is relatively long (for example, more than 2 mm), the radius of rotation around the fixed end becomes longer, and the displacement of the contact portion 221c becomes larger.

[0255] Therefore, the change in the thickness dimension of the substrate 321 for the plug connector can be absorbed by the bending displacement of the inclined portion 221b.

[0256] The thickness of the substrate 321 for the plug connector is, for example, 2 mm or more, preferably 3.20 ± 0.32 mm.

[0257] [The function and effect of connectors]

[0258] The connector according to this embodiment has the following effects.

[0259] At least the top pin groups 120 and 220 are dual-grounded, which reduces crosstalk during high-speed transmission in the top pin groups 120 and 220.

[0260] exist Figure 33 In the diagram, solid lines represent crosstalk in a double-grounded structure, and dashed lines represent crosstalk in a single-grounded structure. From... Figure 33It can be seen that crosstalk is reduced by using a double grounding structure.

[0261] Furthermore, when the main connector 100 is mounted on the mounting substrate 310 (or when the plug connector 200 is connected to the main connector 100 mounted on the mounting substrate 310), the top pin groups 120 and 220, which employ a dual-ground structure, are opposite to the bottom pin groups 130 and 230 located on the mounting substrate 310 side. That is, the top pin groups 120 and 220 are positioned higher on the mounting substrate 310 than the bottom pin groups 130 and 230. Therefore, in the connectors 100 and 200, there is a spatial margin on the side of the top pin groups 120 and 220. Thus, space can be ensured on the side of the top pin groups 120 and 220 for providing space for heat sinks 323 and the like to cool the heat generated during ultra-high-speed transmission.

[0262] In addition, the "ultra-high-speed transmission" mentioned here refers to, for example, high-speed transmission exceeding 100Gbps based on PAM4 modulation.

[0263] Furthermore, since the main connector 100 has conductive members 140 that contact the two adjacent top ground pins 121, noise can be attenuated through the conductive members 140.

[0264] Furthermore, since a strip-shaped protrusion 141a is formed on the conductive member 140, the area of ​​the conductive member 140 opposite to the two adjacent top ground pins 121 can be increased by the strip-shaped protrusion 141a.

[0265] Furthermore, since the conductive member 140 also contacts each of the bottom ground pins 131, a single member is used to contact both the top ground pin 121 and the bottom ground pin 131. Therefore, compared to having separate conductive members contacting the top ground pin 121 and the bottom ground pin 131, the number of components can be reduced, thus achieving cost reduction. Moreover, by using a single component, installation convenience can be improved.

[0266] Furthermore, the height dimension of the conductive member 140 is more than 50% of the dimension of the upright portion 121b of the top grounding pin 121. Therefore, the volume of the conductive member 140 is increased, which can improve the noise attenuation performance of the conductive member 140.

[0267] Furthermore, a back plate 160 is provided, in which the raised portions 121b of each top grounding pin 121 are sandwiched between the conductive member 140 and the back plate 160, so that the top grounding pin 121 can be pressed against the conductive member 140. Thus, the top grounding pin 121 can reliably contact the conductive member 140.

[0268] Furthermore, in the plug connector 200, since a partition 211b is formed in the housing 210, crosstalk can be reduced and impedance can be adjusted through the partition 211b.

[0269] Furthermore, in the plug connector 200, since a sloped portion 211c is formed in the housing 210, impedance adjustment can be performed via the sloped portion 211c. Additionally, by extending the separator 211b from the sloped portion 211c, the root of the separator 211b can be reinforced via the sloped portion 211c.

[0270] Furthermore, in the plug connector 200, since the length L of the inclined portions 221b, 222b, 231b, and 232b of each contact pin is 2mm or more, it can appropriately accommodate changes in the thickness of the substrate 321 for the plug connector.

[0271] For example, even if the thickness of the substrate 321 for the plug connector increases, the change in thickness can be absorbed by the bending displacement of the inclined portions 221b, 222b, 231b, and 232b.

[0272] In addition, in the above embodiments, the dual grounding structure of the top pin groups 120 and 220 is not a necessary structure.

Claims

1. A connector comprising: The first contact pin group has a plurality of contact pins arranged in a specified direction; The second contact pin group has a plurality of contact pins arranged in the predetermined direction, configured opposite to the first contact pin group; and The housing holds the first contact pin group and the second contact pin group. The portion of the contact pin, including the front end side of the contact point with the terminal of the other party, extends obliquely from the housing. A first wall is formed in the housing, the first wall extending along the extending direction of the contact pin and separating the inclined portions of the housing extending from the contact pin from each other. A second wall is formed in the housing, the second wall extending along the extension direction of the contact pins and facing the inner surface of the inclined portion of each of the contact pins.

2. The connector according to claim 1, wherein, Each of the aforementioned contact pins is at least one of a signal pin for signaling and a ground pin for grounding. At least one of the first contact pin group and the second contact pin group is a double ground structure, wherein the double ground structure arranges two groups of the signal pins between the two ground pins in an adjacent manner in the specified direction.

3. The connector according to claim 2, wherein, The connector is used for high-speed transmission of 100Gbps and above.

4. The connector according to claim 1, wherein, The length of each inclined portion from its root to its joint is 2 mm or more.

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