Circuit board processing method and circuit board processing equipment

Abstract

The invention relates to the technical field of circuit board processing, in particular to a circuit board processing method and circuit board processing equipment. The circuit board processing method comprises the following steps: acquiring position information detected by a plurality of position detection devices on a processing platform where a circuit board is located in the same movement direction; determining that the processing platform moves to a target processing position according to the position information; acquiring actual parameter information of a light spot of the laser pulse emitted by the laser; the actual parameter information is detected according to the preset condition, and if the actual parameter information does not meet the preset condition, the transmission parameters of the laser pulses are adjusted, so that the method and the device are beneficial to reducing the occupancy of computing power and processing resources, then the system computing load can be reduced, and the processing efficiency can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board processing, and more particularly to a circuit board processing method and a circuit board processing device. BACKGROUND

[0002] With the continuous progress of electronic manufacturing technology, especially the maturity and popularity of emerging technologies such as artificial intelligence computing power and 5G communication, electronic components carrying functions such as processing, communication and data transmission are rapidly developing towards miniaturization and light weight. As the key carrier for interconnection and conduction between chips and electronic components, the processing precision of circuit boards is also continuously improved, such as further reduction of hole size, reduction of line width and line spacing, etc. These trends have put forward more stringent requirements on the positioning accuracy, optical path stability and overall processing quality of the processing equipment. The current processing equipment usually processes the optical path calibration, light spot monitoring and motion platform control as real-time parallel tasks, that is, whether the motion platform is in motion or not, the light spot position detection and optical path calibration will be continuously performed according to the set time period. Although this method can ensure the processing precision to a certain extent, the frequent real-time calibration will occupy a large amount of computing power and processing resources during the platform motion stage, resulting in high system operation load and possibly reducing the overall production efficiency.

[0003] It should be noted that the information disclosed in the above background section is only used to strengthen the understanding of the background of the present application, and therefore can include information that does not constitute prior art known to those of ordinary skill in the art. SUMMARY

[0004] The purpose of the embodiments of the present application is to provide a circuit board processing method and a circuit board processing device, which aims to solve the technical problem that real-time calibration in the related art occupies a large amount of computing power and processing resources, resulting in high system operation load and possibly reducing the overall production efficiency.

[0005] To achieve the above-mentioned purpose, the technical solution adopted by the present application is: The present application provides a circuit board processing method, comprising: moving a processing platform to a target processing position; acquiring actual parameter information of a light spot of a laser pulse emitted by a laser; detecting the actual parameter information according to a preset condition, wherein if the actual parameter information does not meet the preset condition, adjusting the transmission parameter of the laser pulse; and if the actual parameter information meets the preset condition, causing the laser to emit a laser pulse to process a preset processing position of the circuit board; After the laser processes the preset processing position, the processing platform is moved to another target processing position, and the actual parameter information is acquired again to perform next detection and processing.

[0006] In some implementations, the moving the processing platform to the target processing position comprises: acquiring position information detected by a plurality of position detection devices of the processing platform on which the circuit board is located in the same movement direction; determining the movement of the processing platform to the target processing position according to the position information.

[0007] In some implementations, the actual parameter information comprises at least one of an actual position of the light spot, an actual shape of the light spot, an actual size of the light spot, and an actual energy density distribution of the light spot.

[0008] In some implementations, the transmission parameter comprises at least one of a transmission path of the laser pulse, a beam shape of the laser pulse, a beam energy density distribution of the laser pulse, and an output power of the laser pulse.

[0009] In some implementations, the acquiring the actual parameter information of the light spot of the laser pulse emitted by the laser comprises: if the processing platform moves to the target processing position, causing the laser to emit at least one laser pulse; acquiring actual parameter information of a light spot of the at least one laser pulse.

[0010] In some implementations, the position detection device comprises at least one of a grating ruler, a magnetic grating ruler, and an encoder.

[0011] In some implementations, the determining the movement of the processing platform to the target processing position according to the position information comprises: obtaining a calculated position value by averaging or weighting processing a plurality of the position information; if a deviation between the calculated position value and a target position value is less than or equal to a preset threshold value, determining that the processing platform is moved to the target position and outputting a to-position information.

[0012] The application provides a circuit board processing device, comprising: a processing platform, a moving device, a position detection device, a laser processing device, a light spot detection device, and a controller. The processing platform is used for carrying the circuit board. The moving device is used for moving the processing platform to a target processing position, wherein the moving device can move the processing platform in a first direction and / or move the processing platform in a second direction, and the first direction and the second direction are arranged non-parallel to each other. a plurality of position detection devices are arranged in the first direction to obtain position information of the machining platform in the first direction; a plurality of position detection devices are arranged in the second direction to obtain position information of the machining platform in the second direction; The laser machining device comprises a laser, which is configured to emit a laser pulse to the circuit board; The spot detection device is configured to obtain actual parameter information of the spot of the laser pulse; The controller is configured to detect the actual parameter information according to a preset condition, wherein if the actual parameter information does not satisfy the preset condition, the transmission parameter of the laser pulse is adjusted; if the actual parameter information satisfies the preset condition, the laser emits a laser pulse to machine a preset machining position of the circuit board; After the laser machines the preset machining position, the moving device moves the machining platform to another target machining position, and the actual parameter information is obtained again by the spot detection device to perform the next detection and machining.

[0013] In some implementations, the spot detection device comprises at least one of a spot analyzer and a position sensitive detector; The position detection device comprises at least one of a grating ruler, a magnetic grating ruler and an encoder.

[0014] In some implementations, the actual parameter information comprises at least one of an actual position of the spot, an actual shape of the spot, an actual size of the spot and an actual energy density distribution of the spot; The transmission parameter comprises at least one of a transmission path of the laser pulse, a beam shape of the laser pulse, a beam energy density distribution of the laser pulse and an output power of the laser pulse.

[0015] The circuit board machining method and the circuit board machining device provided by the present application have the following advantages: The actual parameter information of the spot is detected after the machining platform moves to the target machining position each time, so that the transmission parameter of the laser pulse is adjusted when the actual parameter information does not satisfy the preset condition, thereby realizing the adjustment and calibration of the actual parameter information of the spot to satisfy the preset condition. This can avoid frequent real-time calibration during movement, thereby reducing the occupation of computing power and processing resources, and then reducing the system operation load and improving the machining efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or prior art description will be briefly introduced. Obviously, the drawings in the following description only constitute some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0017] Figure 1 is a flowchart of the circuit board processing method provided by the embodiments of the present application; Figure 2 is a logic flowchart of the circuit board processing method provided by the embodiments of the present application; Figure 3 is a partial structure schematic diagram of the circuit board processing equipment provided by the embodiments of the present application; Figure 4 is Figure 3 a top view of the circuit board processing equipment in Figure 5 is Figure 3 a front view of the circuit board processing equipment in Figure 6 is Figure 5 a partial enlarged structure schematic diagram of A in Figure 7 is Figure 3 a right view of the circuit board processing equipment in Figure 8 is Figure 7 a partial enlarged structure schematic diagram of B in Figure 9 is a structure schematic diagram of the laser processing device provided by the embodiments of the present application.

[0018] Main figure mark explanation: 101, processing platform; 102, first grating ruler; 1021, first scale grating; 1022, first grating reading head; 103, second grating ruler; 1031, second scale grating; 1032, second grating reading head; 104, machine tool; 105, base; 106, first linear slide rail; 107, second linear slide rail; 108, laser; 109, reflecting mirror; 200, circuit board. DETAILED DESCRIPTION

[0019] In the related art, the laser processing device usually processes the light path calibration, the spot monitoring and the control of the motion platform as real-time parallel tasks, that is, whether the motion platform is in a motion state or not, the detection of the spot position and the light path calibration will be continuously performed according to the set time period. Although this method can ensure the processing accuracy to a certain extent, the frequent real-time calibration will occupy a large amount of computing power and processing resources during the platform motion stage, which will cause the system operation load to be too high and may reduce the overall production efficiency.

[0020] Therefore, the embodiment of the present application provides a circuit board processing method and a circuit board processing device to solve the problems in the related art.

[0021] In order to make the technical problems, technical solutions and beneficial effects of the present application clearer, the present application will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and do not limit the present application.

[0022] In combination with Figures 1 to 3 the drawings, the circuit board processing method provided by the embodiment of the present application can include at least a part or all of the following steps.

[0023] Step S10, moving the processing platform to a target processing position, so that different positions of the circuit board on the processing platform can be processed.

[0024] Step S20, acquiring actual parameter information of a spot of a laser pulse emitted by the laser 108, so that the actual processing performance of the laser pulse on the circuit board carried on the processing platform 101 can be understood.

[0025] Step S30, detecting the actual parameter information according to a preset condition, wherein if the actual parameter information does not satisfy the preset condition, the transmission parameter of the laser pulse is adjusted. If the actual parameter information satisfies the preset condition, the laser 108 emits the laser pulse to process a preset processing position of the circuit board 200, wherein the laser pulse corresponds to the preset processing position when the processing platform 101 moves to the target processing position; the preset processing position can be a processing point or a processing area. In this way, whether the spot can be used to process the circuit board 200 can be identified, and the transmission parameter is adjusted when the condition is not satisfied, so as to correct the deviation. The preset condition can be the relationship between the actual parameter information and the target parameter information of the known spot, and after comparing the actual parameter information with the target parameter information, the quality of the spot can be understood.

[0026] In the embodiment of the present application, the circuit board processing method further comprises: after the laser 108 completes processing on the preset processing position, moving the processing platform 101 to another target processing position and acquiring the actual parameter information again. For example, after the laser 108 completes processing on each preset processing position; whether the circuit board 200 is processed completely can also be determined according to the processing information, when it is determined that the circuit board 200 is not processed completely, the processing platform 101 moves to another target processing position, and then the above steps S10 to S30 are repeatedly executed; until it is determined that the circuit board is processed completely, the laser 108 ends processing. Since each target processing position is subjected to high-precision positioning and calibration of the light spot parameters, the consistency of the processing quality on the entire circuit board 200 can be ensured, and the defect rate is reduced. In addition, after each target processing position is completed, the next target processing position is moved to, and the light spot parameter detection and adjustment are performed as needed, thereby avoiding the waste of resources caused by continuous real-time calibration in the related art.

[0027] The circuit board processing method provided in the embodiment of the present application detects the actual parameter information of the light spot after the processing platform 101 moves to the target processing position each time, so that when the actual parameter information does not meet the preset condition, the transmission parameter of the laser pulse is adjusted, thereby realizing adjustment and calibration of the actual parameter information of the light spot to meet the preset condition. This can avoid frequent real-time calibration during movement, thereby being beneficial to reducing the occupation of calculation power and processing resources, and then the system operation load can be reduced and the processing efficiency can be improved.

[0028] In some embodiments, for step S10, the method for moving the processing platform to the target processing position comprises: Step S101, obtaining position information detected by multiple position detection devices in the same movement direction of the processing platform 101 where the circuit board 200 is located. For the circuit board 200, which can be a printed circuit board (PCB), a flexible printed circuit (FPC), a rigid-flex board, a high-density interconnection board (HDI), an integrated circuit substrate, a metal substrate, a glass substrate, a ceramic substrate, etc., in addition, the circuit board 200 can be divided into a single-layer circuit board 200 and a multi-layer circuit structure according to the function and structure. The circuit board 200 can be fixed on the processing platform 101 by a clamp or a suction mechanism, so that when the processing platform 101 moves, the circuit board 200 will move together. For the processing platform 101, it can move in two directions, for example, the processing platform 101 can only move in the first direction, the processing platform 101 can only move in the second direction, or the processing platform 101 can move in the first direction and the second direction at the same time. The first direction and the second direction can be non-parallel, and the angle between the two directions can be a right angle, an acute angle or an obtuse angle. In the first direction, multiple detection devices can be provided; in the second direction, multiple detection devices can also be provided; in this way, when the processing platform 101 moves in the first direction and / or the second direction, the position information detected by the multiple position detection devices in the corresponding direction can be obtained, so as to improve the positioning accuracy and reduce the positioning time. Each position detection device in each direction (first direction, second direction) can detect the position information of the processing platform 101 in the corresponding direction, that is, the multiple position detection devices in the same movement direction can obtain multiple position information to jointly determine whether the processing platform 101 moves to the target processing position.

[0029] Step S102, determining that the processing platform 101 moves to the target processing position according to the position information. Since each position detection device in the same movement direction (first direction or second direction) can detect the position information of the processing platform 101, multiple position information can be obtained in the same movement direction to jointly determine whether the processing platform moves to the target processing position. Compared with the case where there is only one position detection device in the same movement direction, the case where the single position detection device in the same direction has instantaneous interference (such as the part of the scale position of the position detection device is blocked by the dust in the equipment, which causes the corresponding position information cannot be quickly and accurately obtained) in part of the measurement position can be analyzed and excluded in time. In this way, according to the multiple position information, the problem of low measurement accuracy and long setting time of the processing platform 101 caused by the unavoidable instantaneous interference of the position detection device can be reduced or avoided, thereby improving the positioning efficiency and positioning accuracy of the position of the processing platform 101.

[0030] In one specific embodiment, the method for determining the movement of the machining platform 101 to the target machining position according to the position information comprises: obtaining a calculated position value by averaging or weighting a plurality of position information in the same movement direction; if the deviation between the calculated position value and the target position value is less than or equal to a preset threshold, it is determined that the machining platform 101 is moved to the target position and the in-position information is output, so as to determine the movement of the machining platform 101 to the target machining position according to the position information. If the deviation between the calculated position value and the target position value is greater than the preset threshold, the machining platform 101 can continue to move until the deviation between the calculated position value and the target position value is less than or equal to the preset threshold, so as to realize closed-loop control.

[0031] In this way, by steps S101 and S102, the accurate position information of the machining platform 101 in the same direction is obtained by using a plurality of position detection devices, which can reduce the time for determining whether the machining platform 101 is moved to the target machining position, and is conducive to ensuring that the machining platform 101 accurately reaches the target machining position, thereby reducing the machining deviation caused by positioning error.

[0032] In some embodiments, the position detection device comprises at least one of a grating ruler, a magnetic grating ruler and an encoder. The grating ruler can realize nanoscale resolution, the magnetic grating ruler is suitable for complex environment, and the encoder provides reliable incremental or absolute position feedback, so that high-precision measurement can ensure that the position error of the machining platform 101 is extremely small, thereby supporting the machining requirements of micron-level aperture and line width pitch. For example, the number of position detection devices in each direction can be two, three or four. The position detection device can only include a grating ruler, which mainly consists of a scale grating and a grating reading head, and the grating reading head can move relative to the scale grating to realize position measurement. It can be understood that when the number of position detection devices is two, i.e. two grating rulers are arranged in each direction, noise reduction can be realized by signal fusion. Since the random noise of the two grating reading heads is independent and unrelated, according to the noise averaging theory, the noise standard deviation of the fused signal is reduced to , about 30% noise level is reduced, thereby improving stability and accuracy of position feedback. When one of the grating rulers is subject to instantaneous interference (such as vibration or electromagnetic interference), abnormal readings can be detected and eliminated through difference analysis, avoiding control instability caused by position signal jump, thereby improving the accuracy of position positioning of the machining platform 101. Therefore, in the circuit board processing method of the embodiments of the present application, the use of two grating rulers can significantly improve the positioning accuracy and positioning efficiency; at the same time, the reduced noise level allows higher gain to be used, improving positioning accuracy (corresponding to reducing the error range of positioning), the reduced positioning error range further shortens the setting time by about 30%, thereby improving the positioning efficiency of the machining platform 101 and the processing efficiency of the circuit board processing equipment, and reducing the positioning error caused by instantaneous interference.

[0033] It should be noted that the setting time can refer to all the time required for the machining platform 101 to receive the control instruction, move and finally stabilize at the target machining position. In addition, in some other possible embodiments, the position detection device can also include only a magnetic grating ruler, or only an encoder, or include a grating ruler and a magnetic grating ruler, or include a grating ruler and an encoder, or include a magnetic grating ruler and an encoder, or include a grating ruler, a magnetic grating ruler and an encoder. When the position detection device includes two or more of the grating ruler, the magnetic grating ruler and the encoder, this can be beneficial to cross-verify position information and improve positioning accuracy.

[0034] In some embodiments, for step S20, the method for obtaining the actual parameter information of the light spot of the laser pulse emitted by the laser 108 includes: Step S201, if the machining platform 101 moves to the target machining position, the laser 108 emits at least one laser pulse; Step S202, obtaining the actual parameter information of the light spot of the at least one laser pulse.

[0035] Compared with continuously detecting the light spot and calibrating the light path regardless of whether the machining platform 101 moves in the related art, the embodiment of the present application only emits a laser pulse after the machining platform 101 reaches the target machining position and acquires the actual parameter information of the light spot. This on-demand acquisition mode avoids the waste of resources in the continuous real-time detection in the related art, significantly reduces the consumption of computing resources and processing time, and is conducive to reducing the system operation load. In addition, since the acquisition of the actual parameter information of the light spot is performed at a stable machining position, the interference of vibration or displacement during movement on the light spot can be avoided, and the alignment of the light spot and the preset machining position on the circuit board 200 can be accurately reflected. For example, after the machining platform 101 moves to the target position, the laser 108 can be caused to emit a laser pulse, and the actual parameter information of the light spot of the laser pulse can be acquired. Then, the actual parameter information can be judged according to the preset condition. In addition, the light spot can be formed on the circuit board 200 or other components, such as a test board.

[0036] It can be understood that in some other possible embodiments, two or three laser pulses can be emitted by the laser 108 after the machining platform 101 moves to the target position, and the actual parameter information of the light spot of the laser pulse can be acquired. Then, the actual parameter information can be judged according to the preset condition. When the actual parameter information of the light spot corresponding to the two or three laser pulses does not satisfy the preset condition, the transmission parameter of the laser pulse is adjusted. In this way, the detection error can be eliminated.

[0037] In some embodiments, in step S30, after the transmission parameter of the laser pulse is adjusted when the actual parameter information does not satisfy the preset condition, the adjusted actual parameter information can be acquired again until the preset condition is satisfied. In this way, the actual parameter information is controlled in a closed loop to satisfy the preset condition, so as to ensure the machining precision of the circuit board. It can be understood that in some other possible embodiments, after the transmission parameter of the laser pulse is adjusted when the actual parameter information does not satisfy the preset condition, the adjusted actual parameter information does not need to be acquired again, but the preset machining position of the circuit board is directly machined after adjustment. In this way, the number of detections can be reduced.

[0038] In some embodiments, the actual parameter information includes at least one of an actual position of the light spot, an actual shape of the light spot, an actual size of the light spot, and an actual energy density distribution of the light spot. By monitoring the characteristics (position, shape, size, energy density distribution) of the light spot of the laser pulse, data basis can be provided for subsequent judgment of whether the actual parameter information of the light spot meets the preset condition and dynamic adjustment of the transmission parameter. For example, the actual parameter information can include the actual position of the light spot, the actual shape of the light spot, the actual size of the light spot, and the actual energy density distribution of the light spot, which can be beneficial to guarantee the processing quality of the circuit board 200. The target parameter information of the light spot includes at least one of a target position of the light spot, a target shape of the light spot, a target size of the light spot, and a target energy density distribution of the light spot. The preset condition can include at least one of whether an error between the actual position and the target position is within a first set error range, whether an error between the actual shape and the target shape is within a second set error range, whether an error between the actual size and the target size is within a third set error range, and whether an error between the actual energy density distribution and the target energy density distribution is within a fourth set error range. By comparing the actual value (actual position, actual shape, actual size, or actual energy density distribution) with the target value (target position, target shape, target size, or target energy density distribution), it can be determined whether the actual parameter information meets the preset condition. It can be understood that when the actual parameter information includes the actual position of the light spot, the actual shape of the light spot, the actual size of the light spot, and the actual energy density distribution of the light spot, the corresponding target parameter information of the light spot includes the target position of the light spot, the target shape of the light spot, the target size of the light spot, and the target energy density distribution of the light spot. The preset condition includes the above four conditions. When the above four conditions are all within the corresponding set error range, it can be determined that the actual parameter information meets the preset condition. When at least one of the above four conditions is not within the corresponding set error range, it can be determined that the actual parameter information does not meet the preset condition.

[0039] It should be noted that in some other possible embodiments, when at least two of the above four conditions are not within the corresponding set error range, it can be determined that the actual parameter information does not meet the preset condition, and when the other conditions are met, it can be determined that the actual parameter information meets the preset condition.

[0040] In some embodiments, the transmission parameter includes at least one of a transmission path of the laser pulse, a beam shape of the laser pulse, a beam energy density distribution of the laser pulse, and an output power of the laser pulse. In this way, adjustment of the transmission path can achieve adjustment of the actual position of the spot, the actual shape of the spot, and the actual size of the spot, so as to enable them to meet the preset conditions; and adjustment of the output power of the laser pulse can achieve adjustment of the actual energy density distribution of the spot, so as to enable it to meet the preset conditions. Since the errors between the actual position and the target position, the actual shape and the target shape, the actual size and the target size, and the actual energy density distribution and the target energy density distribution have been obtained, when the transmission parameter is adjusted, only compensation according to the error value is needed, and the actual parameter information can meet the preset conditions. For example, the transmission path of the laser pulse can achieve accurate transmission of the laser pulse along a predetermined direction and accurate emission of the laser pulse to the processing position on the workpiece in the predetermined direction; adjustment of the transmission path of the laser pulse can be adjustment of the mirror 109, for example, the reflection angle of the light path can be adjusted by the mirror 109 to achieve adjustment of the transmission path, and adjustment of the mirror 109 can be electrically adjusted by a motor or a telescopic device. The beam shape of the laser pulse can be a beam cross-sectional shape, which includes shape and size, and can be adjusted by a diaphragm and / or a beam scaling mechanism. The beam energy density distribution can be adjusted by at least one of a beam shaping component (for example, a shaper for adjusting a Gaussian flat-top shape), a diaphragm (for filtering edge stray light), and a beam scaling mechanism, to control the energy distribution of the beam at the processing position; adjustment of the output power of the laser pulse can be achieved by adjusting the output power of the laser, so as to facilitate control of the beam energy density or the processing spot power of the laser pulse.

[0041] In some embodiments, for step S30, adjustment of the transmission parameter of the laser pulse can be that the actual parameter information of the spot is obtained while the circuit board 200 is being processed (such as drilling), and the transmission parameter of the laser pulse is dynamically adjusted according to the preset conditions; or the laser 108 can pause the pulse emission of the laser 108 after emitting a preset number of laser pulses for detection, adjust the transmission parameter when it is detected that the actual parameter of the spot does not meet the preset conditions, and then resume the pulse emission and processing after the parameter adjustment is completed.

[0042] In combination with Figures 3 to 5As shown, the embodiments of the present application also provide a circuit board processing device, comprising: a processing platform 101, a moving device, a position detection device, a laser processing device, a light spot detection device and a controller; the processing platform 101 is used for carrying a circuit board 200; the moving device is used for moving the processing platform 101 to a target processing position, wherein the moving device can move the processing platform 101 in a first direction and / or move the processing platform 101 in a second direction, the first direction and the second direction are arranged non-parallelly; a plurality of position detection devices are arranged in the first direction, which are used for acquiring position information of the processing platform 101 in the first direction; a plurality of position detection devices are arranged in the second direction, which are used for acquiring position information of the processing platform 101 in the second direction. Referring to Figure 9 As shown, the laser processing device comprises a laser 108, which is used for emitting a laser pulse to the circuit board 200; the light spot detection device is used for acquiring actual parameter information of a light spot of the laser pulse; the controller is used for detecting the actual parameter information according to a preset condition, wherein if the actual parameter information does not satisfy the preset condition, the transmission parameter of the laser pulse is adjusted; if the actual parameter information satisfies the preset condition, the laser emits the laser pulse to process a preset processing position of the circuit board; wherein after the laser completes processing of the preset processing position, the moving device moves the processing platform to another target processing position, and the actual parameter information is acquired again by the light spot detection device to perform the next detection and processing. The above-mentioned circuit board processing device has the same technical effects as the circuit board processing method provided in the foregoing embodiments, which will not be described here.

[0043] Referring to Figure 9 As shown, in some embodiments, the laser processing device further comprises a mirror 109, which is used for adjusting the transmission direction of the light beam, so that the laser pulse emitted by the laser 108 exits to the processing platform 101 in a predetermined transmission direction.

[0044] It can be understood that, in the case that the actual parameter information satisfies the preset condition, the laser pulse corresponds to the preset processing position when the processing platform 101 is located at the target processing position. The control can include: a central processing unit (CPU), a field programmable gate array (FPGA), a programmable logic array (PLA), a microcontroller unit (MCU) or other programmable logic devices.

[0045] In some embodiments, the mobile device comprises a first moving mechanism and a second moving mechanism, the first moving mechanism is configured to move the processing platform 101 in a first direction, and the second moving mechanism is configured to move the processing platform 101 in a second direction; the first direction is perpendicular to the second direction. For example, the circuit board processing device further comprises a machine tool 104 and a base 105, the first moving mechanism comprises a first linear slide rail 106, the second moving mechanism comprises a second linear slide rail 107, the processing platform 101 is fixedly connected with a sliding block of the first linear slide rail 106, a guide rail of the first linear slide rail 106 is fixed on the base 105, the base 105 is fixedly connected with a sliding block of the second linear slide rail 107, and a guide rail of the second linear slide rail 107 is fixed on the machine tool 104. The number of the first linear slide rail 106 can be multiple, which can be two, three or four. The number of the second linear slide rail 107 can be multiple, which can be two, three or four; the guide rails of the multiple first linear slide rails 106 are arranged in parallel, and the guide rails of the multiple second linear slide rails 107 are arranged in parallel.

[0046] For the convenience of description, in the embodiments of the present application, the first direction is defined as the X-X direction, and the second direction is defined as the Y-Y direction.

[0047] In combination Figures 5 to 8In some embodiments, the position detection device includes at least one of a grating ruler, a magnetic grating ruler, and an encoder. It can be understood that the number of position detection devices in each direction can be two, three, or four. For example, the position detection device can be a grating ruler; the length direction of the grating ruler in the first direction can be parallel to the length direction of the first linear slide rail 106, and the grating rulers in the first direction are spaced apart along the second direction; the length direction of the grating ruler in the second direction can be parallel to the length direction of the second linear slide rail 107, and the grating rulers in the second direction are spaced apart along the first direction. In order to distinguish the grating rulers in the first direction and the grating rulers in the second direction, in the embodiments of the present application, the grating ruler in the first direction (X-X direction) is defined as the first grating ruler 102, and the grating ruler in the second direction (Y-Y direction) is defined as the second grating ruler 103; the scale grating of the first grating ruler 102 is the first scale grating 1021, and the grating reading head of the first grating ruler 102 is the first grating reading head 1022; the scale grating of the second grating ruler 103 is the second scale grating 1031, and the grating reading head of the second grating ruler 103 is the second grating reading head 1032; the first scale grating 1021 is fixed on the base 105, and the first grating reading head 1022 is fixedly connected with the machining platform 101. The second scale grating 1031 is fixed on the machine tool 104, and the second grating reading head 1032 is fixed on the base 105; the first grating ruler 102 can detect the position information of the machining platform 101 in the first direction, and the second grating ruler 103 can detect the position information of the machining platform 101 in the second direction.

[0048] In some embodiments, the light spot detection device includes at least one of a light spot analyzer and a position sensitive detector. For example, the light spot detection device can be arranged on the laser processing device to obtain the actual parameter information of the light spot.

[0049] In summary, the circuit board processing method and the circuit board processing device provided in the embodiments of the present application set multiple position detection devices in a single direction of the machining platform 101, and then compare the actual parameter information of the light spot with the target parameter information after the machining platform 101 completes the positioning action. If the vibration caused by the movement of the machining platform 101 causes the light spot to deviate, the transmission parameter is calibrated; if there is no deviation, the processing is directly carried out. Unlike the real-time parallel correction method in the related art, the embodiments of the present application adjust the transmission parameter, the parameter information of the light spot, and the movement control of the machining platform 101 from real-time parallel processing to serial processing after the machining platform 101 is positioned, which not only improves the positioning accuracy and processing accuracy of the machining platform 101, but also effectively shortens the platform setting time and reduces the system algorithm consumption, thereby realizing high-precision and high-efficiency processing of the circuit board 200.

[0050] It should be understood that, in the embodiments of the present application, unless specifically defined and limited otherwise, the terms "connected", "fixedly connected", "contacting" and the like should be understood in a broad sense. Those skilled in the art can understand the specific meanings of the above-mentioned various terms in the embodiments of the present application according to specific circumstances.

[0051] Exemplarily, for "connection", it can be various connection modes such as fixed connection, rotary connection, flexible connection, sliding connection, one-piece forming, electrical connection, contact connection, etc.; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements or the interaction relationship of two elements.

[0052] Exemplarily, for "fixed connection", one element can be directly or indirectly fixedly connected to another element; fixed connection can include mechanical connection, welding, bonding or one-piece forming, etc., wherein the mechanical connection can include riveting, bolt connection, threaded connection, key pin connection, buckle connection, lock connection, plug-in connection, etc., and the bonding can include adhesive bonding and solvent bonding, etc.

[0053] It should also be understood that the "parallel" or "perpendicular" described in the embodiments of the present application can be understood as "approximately parallel" or "approximately perpendicular".

[0054] It should also be understood that the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. The features limited by "first", "second" can explicitly or implicitly include one or more of the features.

[0055] In the embodiments of the present application, unless specifically defined and limited otherwise, the first feature is "on" or "under" the second feature can be that the first feature and the second feature are in direct contact, or the first feature and the second feature are indirectly in contact through an intermediate medium. Moreover, the first feature "above", "over" and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "under" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0056] It should also be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, if any, are used for description only and that devices and elements of one embodiment can be located at positions other than those specifically associated with the described terms.

[0057] The above description is only the preferred embodiment of the present application, but the protection scope of the present application is not limited to this. Any modification or replacement within the technical range disclosed by the present application can be easily thought by those skilled in the art, and should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims. In summary, the above description is only the preferred embodiment of the technical solution of the present application, and is not used to limit the protection scope of the present application. Any modification, equivalent replacement, improvement, etc. within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A method for processing a circuit board, characterized in that, include: Move the processing platform to the target processing location; Obtain the actual parameter information of the laser pulse emitted by the laser; The actual parameter information is detected according to preset conditions. If the actual parameter information does not meet the preset conditions, the transmission parameters of the laser pulse are adjusted. If the actual parameter information meets the preset conditions, the laser emits a laser pulse to process the preset processing position of the circuit board. After the laser finishes processing the preset processing position, the processing platform is moved to another target processing position, and the actual parameter information is acquired again to perform the next detection and processing.

2. The circuit board processing method as described in claim 1, characterized in that, The moving processing platform to the target processing position includes: Acquire position information detected by multiple position detection devices on the processing platform where the circuit board is located in the same direction of movement; Based on the location information, the machining platform is moved to the target machining position.

3. The circuit board processing method as described in claim 2, characterized in that, The actual parameter information includes at least one of the following: the actual position of the light spot, the actual shape of the light spot, the actual size of the light spot, and the actual energy density distribution of the light spot.

4. The circuit board processing method according to any one of claims 1-3, characterized in that, The transmission parameters include at least one of the following: the transmission path of the laser pulse, the beam shape of the laser pulse, the beam energy density distribution of the laser pulse, and the output power of the laser pulse.

5. The circuit board processing method according to any one of claims 1-3, characterized in that, The acquisition of the actual parameter information of the laser pulse spot emitted by the laser includes: If the processing platform moves to the target processing position, the laser emits at least one laser pulse. Obtain the actual parameter information of the spot of at least one of the laser pulses.

6. The circuit board processing method as described in claim 2, characterized in that, The position detection device includes at least one of an optical grating ruler, a magnetic grating ruler, and an encoder.

7. The circuit board processing method as described in claim 2, characterized in that, The step of determining the movement of the processing platform to the target processing position based on the position information includes: The calculated position value is obtained by averaging or weighting multiple position information values ​​in the same direction of movement; if the deviation between the calculated position value and the target position value is less than or equal to a preset threshold, the processing platform is determined to have moved into position and the position information is output.

8. A circuit board processing equipment, characterized in that, include: Processing platform, moving device, position detection device, laser processing device, spot detection device, and controller; The processing platform is used to support the circuit board; The moving device is used to move the processing platform to the target processing position, wherein the moving device is capable of moving the processing platform along a first direction and / or moving the processing platform along a second direction, wherein the first direction and the second direction are not parallel. Multiple position detection devices are provided in the first direction to acquire the position information of the processing platform in the first direction; Multiple position detection devices are provided in the second direction to acquire the position information of the processing platform in the second direction; The laser processing apparatus includes a laser, which is used to emit laser pulses toward the circuit board; The spot detection device is used to acquire the actual parameter information of the spot of the laser pulse; The controller is used to detect the actual parameter information according to preset conditions. If the actual parameter information does not meet the preset conditions, the transmission parameters of the laser pulse are adjusted. If the actual parameter information meets the preset conditions, the laser emits a laser pulse to process the preset processing position of the circuit board. After the laser finishes processing the preset processing position, the moving device moves the processing platform to another target processing position and obtains the actual parameter information again through the spot detection device to perform the next detection and processing.

9. The circuit board processing equipment as described in claim 8, characterized in that, The spot detection device includes at least one of a spot analyzer and a position-sensitive detector; The position detection device includes at least one of an optical grating ruler, a magnetic grating ruler, and an encoder.

10. The circuit board processing equipment as described in claim 8 or 9, characterized in that, The actual parameter information includes at least one of the following: the actual position of the light spot, the actual shape of the light spot, the actual size of the light spot, and the actual energy density distribution of the light spot; The transmission parameters include at least one of the following: the transmission path of the laser pulse, the beam shape of the laser pulse, the beam energy density distribution of the laser pulse, and the output power of the laser pulse.

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