Flexible circuit board pressing device

Abstract

The invention provides a flexible circuit board pressing device which comprises a mold closing rack module, a magnetic change shape taking module and a uniform pressure relief module, the magnetic change shape taking module is arranged on one side of the pressing face of two mold closing racks and used for conducting surface shape taking on a flexible circuit board to be pressed, and the uniform pressure relief module is arranged in the two mold closing racks and used for conducting surface shape taking on the flexible circuit board to be pressed. According to the invention, the die assembly rack module, the magnetic change shaping module and the uniform pressure release module are arranged, and the flexible pressure head is driven to generate self-adaptive deformation under the action of a controllable magnetic field, so that the layout and concave-convex compensation of components with height change on the surface of a circuit board are actively fitted; dynamic balance and stress release of regional pressure are achieved in the pressing process, and component damage or substrate deformation caused by local stress concentration is effectively avoided.

Description

Technical Field

[0001] This invention relates to the field of lamination equipment technology, and in particular to a flexible circuit board lamination equipment. Background Technology

[0002] A flexible circuit board laminating device is a specialized piece of equipment used to firmly bond multiple layers of flexible materials, such as cover films, reinforcing plates, and pure adhesives, to a flexible circuit substrate under specific temperature, pressure, and time conditions.

[0003] Chinese Patent Publication No. CN110191591B discloses a fully automatic pressing device for flexible circuit boards, including a high-speed press and a robotic arm. The high-speed press includes a pressing zone for high-temperature pressing of the flexible circuit board wrapped with a release film and a power element. An upper pressure plate and a lower pressure plate are respectively arranged above and below the pressing zone. The power element drives the upper and lower pressure plates to move closer or further apart. The robotic arm includes a film material conveying mechanism for outputting the release film, a film support structure for supporting the film material output by the film material conveying mechanism to form at least one upper and lower double-layer film structure, an opening and closing mechanism for driving the upper and lower layers of the upper and lower double-layer film structure to open or close, and a robotic arm for transporting the flexible circuit board to be pressed into the upper and lower double-layer film structure or removing the pressed flexible circuit board from the upper and lower double-layer film structure. The upper and lower double-layer film structure is formed in the pressing zone, realizing fully automatic pressing.

[0004] In actual operation, especially for high-precision, irregularly shaped or flexible circuit boards with protruding components, traditional rigid pressure plates can cause excessive or insufficient local pressure. Therefore, there is an urgent need for a structure that can adaptively adjust the regional pressure through multi-zone pressure compensation to achieve "surface contact" rather than "point contact" and avoid damaging components or causing false pressure. Summary of the Invention

[0005] In view of the shortcomings of the existing technology, the purpose of this invention is to provide a flexible circuit board pressing device to solve the problems mentioned in the background art.

[0006] To achieve the above technical solution, the present invention provides the following technical solution: A flexible circuit board pressing device includes a mold clamping frame module, a magnetic shaping module, and a uniform pressure release module; The mold clamping frame module is provided with a first mold clamping frame and a second mold clamping frame that are opposite each other. The first mold clamping frame and the second mold clamping frame are mirror images of each other on both sides of the flexible circuit board to be pressed. The two sets of magnetic shape-taking modules are respectively arranged on one side of the pressing surface of the first mold-closing frame and the second mold-closing frame, and are used to perform surface shaping on the flexible circuit board to be pressed. The uniform pressure relief module is installed inside the first and second mold clamping frames to balance the uneven force during the pressing process.

[0007] As a further embodiment of the present invention, the mold clamping frame module includes a frame assembly, the frame assembly includes a bottom support plate, a top support plate and limiting holes, the top support plate is fixedly assembled to one side of the bottom support plate, and a plurality of limiting holes are arranged in an array on the top support plate, the limiting holes being used to limit the movement direction of the magnetic shape-taking module.

[0008] As a further embodiment of the present invention, the magnetic rheological shaping module includes a shaping component, which includes a top support plate, a shaping bag, a guide rod, and an elastic element. A plurality of the top support plates are arranged in an array on one side of the top support plate. A shaping bag is mounted on the surface of the top support plate near the pressing surface. The shaping bag is filled with magnetorheological fluid. A guide rod is fixedly connected to the other end of the top support plate. The guide rod is slidably inserted into a limiting hole, and an elastic element is also sleeved on the outside of the guide rod. A linkage bracket is also fixedly connected to the bottom of the guide rod.

[0009] As a further embodiment of the present invention, the shaping bag has a first surface and a second surface opposite to each other, a plurality of the first surfaces being disposed facing one end of the flexible circuit board to be pressed, and the second surface being the bonding surface of two adjacent sets of shaping bags.

[0010] As a further embodiment of the present invention, the flexible circuit board pressing device further includes a locking assembly. The locking assembly includes a driver, a transmission frame, an external traction rod, an external slider, an internal traction rod, and an internal slider. The driver is fixedly arranged on one side of the top support plate. One end of the transmission frame is fixedly connected to the movable shaft of the driver, and the other end of the transmission frame is slidably inserted into the top support plate. The external traction rod and the internal traction rod are also fixedly arranged on the transmission frame. The external traction rod and the internal traction rod are respectively arranged on both sides of the top support plate. A plurality of external sliders and internal sliders are respectively arrayed on the external traction rod and the internal traction rod.

[0011] As a further embodiment of the present invention, the locking assembly further includes a locking slider, an external locking groove, and an internal locking groove. A plurality of the locking sliders are slidably inserted into the top support plate, with one end of the locking slider fixedly connected to the top support plate and the other end of the locking slider fixedly connected to the linkage bracket. The locking slider is also independently provided with an external locking groove and an internal locking groove. The external locking groove and the internal locking groove are arranged on both sides of the top support plate, and the external locking groove and the internal locking groove are respectively slidably engaged and matched with the external slider and the internal slider.

[0012] As a further embodiment of the present invention, both the external locking groove and the internal locking groove are trapezoidal grooves.

[0013] As a further embodiment of the present invention, the uniform pressure relief module includes a hydraulic component, which includes a hydraulic oil reservoir, a flow divider, an adjusting shaft, and a piston. The hydraulic oil reservoir is fixedly arranged on one side of the base support plate, and several flow dividers are arranged in an array on the hydraulic oil reservoir. One end of the adjusting shaft is slidably assembled in the flow divider, and the other end of the adjusting shaft is fixedly connected to the linkage support. The adjusting shaft is also equipped with a piston inside the flow divider.

[0014] As a further embodiment of the present invention, the interior of the hydraulic oil reservoir is configured as a first cavity, and the portion of the distributor cylinder connected to the first cavity is configured as a second cavity. Several of the second cavities are connected to the first cavities, and the first and second cavities together constitute an inner cavity with a constant volume.

[0015] By adopting the above technical solution, the present invention has the following beneficial effects: This invention incorporates a mold clamping frame module, a magnetic deformation shaping module, and a uniform pressure relief module. The magnetic deformation shaping module utilizes a controllable magnetic field to drive a flexible pressure head to generate adaptive deformation, thereby actively conforming to the component layout and unevenness compensation of the circuit board surface with varying heights. The uniform pressure relief module, through multi-level pressure buffering and distributed pressure relief structure, achieves dynamic balance and stress release of regional pressure during the pressing process, effectively avoiding component damage or substrate deformation caused by local stress concentration, thus ensuring tight contact and integrity of the pressing interface globally. Attached Figure Description

[0016] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of a flexible circuit board pressing device provided in one embodiment of the present invention.

[0018] Figure 2 This is a schematic diagram of the pressing direction of a flexible circuit board pressing device provided in one embodiment of the present invention.

[0019] Figure 3 This is a schematic diagram of the flexible circuit board pressing device provided in one embodiment of the present invention.

[0020] Figure 4 for Figure 3 Enlarged schematic diagram of reference numeral A in the attached figure.

[0021] Figure 5This is a side view of the flexible circuit board pressing device provided in one embodiment of the present invention.

[0022] Figure 6 for Figure 5 Enlarged schematic diagram of reference numeral B in the attached figure.

[0023] Reference numerals: 1-Frame assembly, 101-Bottom support plate, 102-Top support plate, 103-Limiting hole, 2-Shaping assembly, 201-Top support plate, 202-Shaping bag, 203-Guide rod, 204-Elastic element, 205-Linkage bracket, 3-Locking assembly, 301-Driver, 302-Transmission frame, 303-External traction rod, 304-External slider, 305-Internal traction rod, 306-Internal slider, 307-Locking slider, 308-External locking groove, 309-Internal locking groove, 4-Hydraulic assembly, 401-Hydraulic oil reservoir, 402-Diverter cylinder, 403-Adjusting shaft, 404-Piston, a1-First mold closing frame, a2-Second mold closing frame, b1-First surface, b2-Second surface, c1-First cavity, c2-Second cavity. Detailed Implementation

[0024] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0025] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0026] Please see Figures 1-6According to one embodiment of the present invention, a flexible circuit board pressing device has opposing first directions x, second directions y, and third directions z. The flexible circuit board pressing device includes a mold clamping frame module, a magnetic deformation shaping module, and a uniform pressure relief module. The mold clamping frame module is provided with opposing first mold clamping frames a1 and second mold clamping frames a2, which are mirror images of each other on both sides of the flexible circuit board to be pressed. The two sets of magnetic deformation shaping modules are respectively arranged on one side of the pressing surface of the first mold clamping frame a1 and the second mold clamping frame a2, and are used to perform surface shaping on the flexible circuit board to be pressed. The uniform pressure relief module is arranged inside the first mold clamping frame a1 and the second mold clamping frame a2, and is used to balance the uneven force during the pressing process.

[0027] In practical application, the flexible circuit board pressing device in this embodiment includes a mold clamping frame module, a magnetic deformation shaping module, and a uniform pressure release module. The mold clamping frame module is provided with a first mold clamping frame a1 and a second mold clamping frame a2 facing each other. The first mold clamping frame a1 and the second mold clamping frame a2 are movably arranged along the third direction z, and both the first mold clamping frame a1 and the second mold clamping frame a2 are driven by an external drive source. The two are respectively driven by an external drive source to achieve precise displacement control along the Z-axis, forming a dynamically adjustable mold clamping system. The first mold clamping frame a1 and the second mold clamping frame a2 are mirror images of the two sides of the flexible circuit board to be pressed, and the magnetic deformation shaping module is assembled on the side surface of the first mold clamping frame a1 and the second mold clamping frame a2 facing the flexible circuit board, which is used to achieve adaptive bonding and pressure transmission to the surface of the circuit board during the pressing process.

[0028] In the actual pressing process, the device needs to sequentially complete several precise control stages, including locking the shaping module, first-stage pressing, solidifying the shaping module, first-stage separation, unlocking the shaping module, and second-stage pressing. In the initial stage, the magnetostrictive shaping module is rigidly connected to the corresponding mold clamping frame through a high-precision mechanical locking mechanism to maintain a strictly constant relative spatial position between the two, providing a stable geometric reference for the subsequent pressing process. Subsequently, the system enters the first-stage pre-pressing process, where the upper and lower mold clamping frames perform high-precision opposite displacement under the control of the servo drive system, so that the working interface of the magnetostrictive shaping module... Initial contact is made with the upper and lower surfaces of the flexible circuit board. During this pre-pressing process, the special magnetorheological material encapsulated inside the shaping module is in an unmagnetized state, exhibiting typical liquid Newtonian fluid characteristics. Its viscosity does not change with the shear rate, and it has extremely low yield stress and excellent flow properties. Under relatively low initial pressure conditions, it can achieve adaptive filling and full-area bonding of the micro-geometry of the flexible circuit board surface, including the arrangement of micro-electronic components, the routing of conductor lines, and various irregular structures, based on Pascal's principle, thereby achieving a preliminary balance between shape conformality and pressure distribution.

[0029] Subsequently, the system activates the controllable electromagnetic field generator to apply an excitation magnetic field with preset spatial distribution and temporal characteristics to the magnetic deformation shaping module. Under the action of the magnetic field, the magnetic particles in the magnetorheological material are polarized along the direction of the magnetic field lines and form chain-like and columnar microstructures, inducing a significant magnetorheological effect. This causes the material to undergo a dramatic change in rheological properties within millisecond to sub-millisecond time, rapidly transforming from an initial liquid Newtonian fluid into a solid-like body with significant yield strength. This achieves in-situ rapid solidification and geometric morphology locking, thereby forming a customized pressing mold that highly matches the surface morphology of the circuit board and has specific structural stiffness. Immediately afterwards, the system performs a first-stage separation operation. Through the precise positioning and retraction of the mold clamping frame, the solidified magnetic deformation shaping module and the flexible circuit board surface achieve controllable interface separation. At this point, the three-dimensional topographic information of the circuit board surface, including the height difference of components, the circuit routing and the irregular structural features, has been accurately transferred and fixed to the working surface of the shaping module through reverse replication, forming a pressing interface with a specific geometric negative shape. Subsequently, the system releases the mechanical locking connection between the shaping module and the mold clamping frame, allowing the magnetic deformation shaping module to switch from a rigid connection state to a multi-degree-of-freedom floating state linked with the uniform pressure release module.

[0030] In the final two-stage pressing process, the uniform pressure release module, through its internally integrated multi-zone pressure control system, applies a high-precision pressing load with a specific pressure gradient distribution, optimized by finite element analysis, to the floating magnetic deformation shaping module. Under the influence of high pressing force in this stage, and with the help of the rigid mold interface formed in the previous stage, it ensures that various microelectronic components, fine conductor lines, and irregularly shaped grooves on the surface of the flexible circuit board achieve interface contact without local voids or stress concentrations during the pressing process. This process significantly improves the physical bonding strength and electrical connection reliability of the pressing interface, effectively avoiding local overpressure or underpressure caused by uneven pressure distribution. It is particularly suitable for the stringent requirements of interface quality and long-term reliability in current high-precision, high-integration flexible circuit board micro-assembly processes.

[0031] Please see Figure 3 In a preferred embodiment of the present invention, the mold clamping frame module includes a frame assembly 1, the frame assembly 1 includes a bottom support plate 101, a top support plate 102 and limiting holes 103, the top support plate 102 is fixedly assembled to one side of the bottom support plate 101, and a plurality of limiting holes 103 are arranged in an array on the top support plate 102, the limiting holes 103 being used to limit the movement direction of the magnetic deformation shaping module.

[0032] In practical application, the two sets of bottom support plates 101 move in opposite directions along the third direction z. Above each bottom support plate 101, a top support plate 102 is correspondingly provided. The top support plate 102 is machined with an array of multiple limiting holes 103. These limiting holes 103 serve as guide structures to strictly constrain the sliding trajectory of the magnetic deformation shaping module inside, thereby ensuring that the module moves accurately along the preset direction. The spacing of the limiting holes 103 is precisely designed, and the hole spacing has a clear matching relationship with the unit width of the magnetic deformation shaping module when it is laid out. This matching principle aims to ensure that the module can be smoothly guided during movement and that the relative displacement between adjacent modules can be effectively controlled, thereby achieving high-precision deformation control and position positioning in the overall structure.

[0033] Please see Figure 4 In a preferred embodiment of the present invention, the magnetic rheological shaping module includes a shaping component 2, which includes a top support plate 201, a shaping bag 202, a guide rod 203, and an elastic element 204. A plurality of the top support plates 201 are arranged in an array on one side of the top support plate 102. A shaping bag 202 is mounted on the side surface of the top support plate 201 near the pressing surface. The shaping bag 202 is filled with magnetorheological fluid. A guide rod 203 is fixedly connected to the other end of the top support plate 201. The guide rod 203 is slidably inserted into the limiting hole 103, and an elastic element 204 is also sleeved on the outside of the guide rod 203. A linkage bracket 205 is also fixedly connected to the bottom of the guide rod 203.

[0034] In practical application, the top support plate 201 is slidably assembled with the top support plate 102 along the third direction z via a precision sliding pair. A flexible shaping bag 202 is rigidly connected to the end of the top support plate 201. The shaping bag 202 is filled with a magnetorheological fluid with field-induced rheological properties. The guide rod 203 is slidably inserted into the limiting hole 103 of the top support plate 102 with a clearance fit. An elastic element 204 with a preload is fitted on its outer cylindrical surface. The elastic element 204 continuously provides axial restoring force, so that when the system is in a non-load-bearing state, each top support plate 201 can automatically reset in the third direction Z and maintain an equal height alignment.

[0035] This height-maintaining mechanism is achieved as follows: the pre-compression of the elastic element 204 generates a continuous upward force, pushing the assembly of the top support plate 201 and guide rod 203 towards the reference plane; when a top support plate 201 is subjected to a downward external force, the corresponding guide rod 203 undergoes axial displacement within the limiting hole 103, while the elastic element 204 accumulates potential energy; after the external force is removed, the elastic element 204 releases its potential energy, driving the top support plate 201 to precisely return to its initial height position. This design ensures that the multi-top support plate system maintains coplanarity in the non-working state, providing a stable reference plane for subsequent forming processes.

[0036] Please see Figure 4 In a preferred embodiment of this embodiment, the shaping bag 202 has opposing first surfaces b1 and second surfaces b2, with a plurality of the first surfaces b1 facing one end of the flexible circuit board to be pressed, and the second surfaces b2 being the bonding surfaces of two adjacent sets of shaping bags 202.

[0037] In practical applications, when multiple shaping bags 202 are arrayed and collaboratively extruded along the normal of the flexible circuit board, their first contact surface b1 forms a stable conformal fit with the surface of the flexible circuit board under preset pressure conditions. During this dynamic coupling process, the magnetorheological fluid filled inside the shaping bag undergoes a significant rheological characteristic transformation due to the compressive load in the third direction z: the liquid medium undergoes directional migration along the xoy plane while maintaining its volume incompressibility, forming a fluid redistribution dominated by the planar stress field. At the same time, adjacent shaping bag units generate interaction forces at the contact boundary, and their lateral second contact surface b2 achieves tight fit by minimizing surface energy. This adaptive reconstruction of the contact interface makes the three-dimensional gap field formed between the multiple units and the flexible circuit board continuously converge. Based on the real-time phase transformation of the magnetorheological fluid and the collaborative deformation of the multi-body contact interface, the active perception and dynamic morphology matching of the curved surface are realized, ultimately achieving a high-precision adaptive shaping function.

[0038] Please see Figure 6 In a preferred embodiment of the present invention, the flexible circuit board pressing device further includes a locking component 3. The locking component 3 includes a driver 301, a transmission frame 302, an external traction rod 303, an external slider 304, an internal traction rod 305, and an internal slider 306. The driver 301 is fixedly arranged on one side of the top support plate 102. One end of the transmission frame 302 is fixedly connected to the movable shaft of the driver 301, and the other end of the transmission frame 302 is slidably inserted into the top support plate 102. The external traction rod 303 and the internal traction rod 305 are also fixedly arranged on the transmission frame 302. The external traction rod 303 and the internal traction rod 305 are respectively arranged on both sides of the plate surface of the top support plate 102. A plurality of external sliders 304 and internal sliders 306 are respectively arrayed on the external traction rod 303 and the internal traction rod 305.

[0039] In practical application, the driver 301 is rigidly connected to the end of the top support plate 102. Its output actuator is directly connected to the transmission frame 302 via a rigid coupling structure. This structure ensures that the driver 301 can transmit the driving force to the transmission frame 302 without loss when the output shaft performs linear reciprocating motion, thereby precisely controlling the transmission frame 302 to achieve synchronous telescopic movement along the first direction x. The transmission frame 302, as the core transmission component, has an external traction rod 303 and an internal traction rod 305 fixedly mounted at both ends using a high-precision positioning method. These two sets of traction rods are arranged at the ends of two opposite side plates, based on the plate structure of the top support plate 102, forming a hollow... The symmetrical traction layout allows the transmission frame 302 to move in the first x direction when driven by the driver 301. Through a rigid connection, the external traction rod 303 and the internal traction rod 305 achieve strictly synchronous movement. This motion transmission mechanism enables the two sets of traction rods to move precisely and collaboratively in the first x direction while maintaining a constant relative position. Each traction rod is equipped with multiple precisely positioned external sliders 304 and internal sliders 306. Driven by the traction rod, these slider groups maintain a perpendicular constraint relationship with the traction rod while achieving unified linear movement in the first x direction. This converts the linear output of the driver into synchronous displacement of multiple sets of sliders in a specified direction, forming a highly efficient power transmission system.

[0040] Furthermore, the locking assembly 3 also includes a locking slider 307, an external locking groove 308, and an internal locking groove 309. A plurality of the locking sliders 307 are slidably inserted into the top support plate 102, with one end of each slider fixedly connected to the top support plate 201 and the other end fixedly connected to the linkage bracket 205. Each locking slider 307 also has an independently provided external locking groove 308 and an internal locking groove 309, which are arranged on both sides of the top support plate 102, and are respectively connected to the external locking groove 308 and the internal locking groove 309. The sliding block 304 and the built-in sliding block 306 are slidably fitted together. Multiple locking sliding blocks 307 are interlocked and assembled on the top support plate 102 in a restricted sliding manner through a precision guide structure. One end of each locking sliding block 307 is rigidly connected to the top support plate 201, and the other end is fixedly connected to the linkage bracket 205, thereby forming a linkage relationship in the third direction z. Each locking sliding block 307 is independently machined with an external locking groove 308 and an internal locking groove 309. The locking grooves are symmetrically located on both sides of the top support plate 102 in terms of spatial layout. Their structural contours form geometrically complementary sliding pairs with the external sliding block 304 and the built-in sliding block 306, respectively. In the cooperative relationship, when the driver 301 starts and drives the transmission frame 302 to move linearly in the negative direction of the first direction x, the external slider 304 and the internal slider 306, which are connected to the external traction rod 303 and the internal traction rod 305 respectively, slide along the preset trajectory under the drive of the traction rod. During this process, the two sliders are precisely embedded in the external locking groove 308 and the internal locking groove 309 on the corresponding locking slider 307, forming a high-precision groove interlocking cooperation. This interlocking state effectively restricts the degree of freedom of the locking slider 307 in the third direction z, thereby allowing the top support plate 201 connected to the locking slider 307 to move linearly. The spatial position of the linkage bracket 205 is completely locked. In this locked state, when the magnetic deformation shaping module is attached to the flexible circuit board, all the top support plates 201 and linkage brackets 205 maintain a stable relative position, effectively resisting the displacement caused by external loads. Conversely, when the transmission mechanism moves in the opposite direction, causing the external slider 304 and the internal slider 306 to disengage from the corresponding locking groove, the constraint of the locking slider 307 in the third direction z is released. At this time, the displacement of the top support plate 201 and linkage bracket 205 is further controlled by the uniform pressure relief module, realizing the controllable deformation and pressure distribution adjustment of the system under pressure.

[0041] Furthermore, both the external locking groove 308 and the internal locking groove 309 are trapezoidal grooves, and the matching external slider 304 and internal slider 306 are trapezoidal slider structures. When the trapezoidal slider slides into the corresponding trapezoidal groove along the axial direction, the two achieve self-centering and radial constraint through the guide and wedging effect of the trapezoidal inclined surface, thereby driving the locking slider 307 to move along the preset trajectory to the mechanical fixed position. In this locked state, an interference fit and geometric interlock are formed between the slider and the groove, effectively restricting each degree of freedom of motion, thereby enabling all top support plates 201 to be synchronously reset under the action of the linkage mechanism and accurately restored to the initial set position.

[0042] Please see Figure 5 In a preferred embodiment of the present invention, the uniform pressure relief module includes a hydraulic component 4, which includes a hydraulic oil reservoir 401, a diverter cylinder 402, an adjusting shaft 403, and a piston 404. The hydraulic oil reservoir 401 is fixedly arranged on one side of the base support plate 101, and a plurality of diverter cylinders 402 are arranged in an array on the hydraulic oil reservoir 401. One end of the adjusting shaft 403 is slidably assembled in the diverter cylinder 402, and the other end of the adjusting shaft 403 is fixedly connected to the linkage bracket 205. The adjusting shaft 403 is also equipped with a piston 404 inside the diverter cylinder 402.

[0043] In practical application, the main oil storage chamber inside the hydraulic oil reservoir 401 is connected to the oil inlet ports of several branch cylinders 402 through multiple evenly distributed hydraulic oil circuit interfaces. The inner cavity of each branch cylinder 402 is precision honed to form a high-precision cylindrical guide surface. The output end of the adjusting shaft 403 is rigidly connected to a set of bidirectional pistons 404 through an interference fit. The piston assembly is fitted in a form where its outer diameter maintains a precise dynamic seal with the inner hole of the branch cylinder 402 and is limited in the pressurization chamber of the branch cylinder 402. When the linkage bracket 205, which is connected to the adjusting shaft 403 by a flange, is displaced along the third direction z, the linear motion transmitted by the adjusting shaft 403 will drive the piston 404 to slide synchronously axially within the branch cylinder 402. This linkage mechanism ensures that the displacement of the hydraulic actuator maintains a strict proportional relationship with the input command of the control system, and at the same time, the parallel structure of multiple branch cylinders achieves a uniform distribution of load pressure.

[0044] Furthermore, the hydraulic oil reservoir 401 is internally configured with a first cavity c1, and the portion of the diverter 402 connected to the first cavity c1 is configured as a second cavity c2. Several second cavities c2 are connected to the first cavities c1, and the first cavities c1 and the second cavities c2 together form an inner cavity with a constant volume. Since the total volume of the system remains constant, when the top support plate 201 on one side and its surface-cured shaping bag 202 press against the partially convex structure of the flexible circuit board along the third direction z, the axial displacement of the top support plate on that side will increase accordingly. During this dynamic process, under the mechanical action of the axial advancement of the top support plate, the working hydraulic medium in the corresponding second cavity c2 is subjected to... Compression creates a directional flow, which is then forcibly pumped into the first cavity c1 through the internal flow channel of the system. This hydraulic transmission behavior not only realizes the dynamic redistribution of the pressure medium within the system, but also structurally triggers a negative pressure compensation mechanism corresponding to the second cavity c2 on the other side of the local concave area of ​​the circuit board. This cavity automatically absorbs the excess hydraulic oil released due to volume changes through the hydraulic circuit, thereby maintaining transient hydraulic balance at the overall system level. The hydraulic adaptive adjustment mechanism based on Pascal's principle effectively ensures that the forming pressure on the flexible circuit board tends to be consistent in different morphological regions, significantly improving the bonding accuracy of irregular components and the structural adaptability of three-dimensional morphology in the pressing process, and ultimately achieving highly uniform surface pressure distribution and optimized forming quality.

[0045] The above embodiments of the present invention provide a flexible circuit board lamination device. By setting up a mold clamping frame module, a magnetic deformation shaping module, and a uniform pressure relief module, the magnetic deformation shaping module uses a controllable magnetic field to drive the flexible pressure head to generate adaptive deformation, thereby actively conforming to the component layout and unevenness compensation of the circuit board surface with varying heights. The uniform pressure relief module achieves dynamic balance and stress release of regional pressure during the lamination process through multi-level pressure buffering and distributed pressure relief structure, effectively avoiding component damage or substrate deformation caused by local stress concentration, thereby ensuring tight contact and bonding integrity of the lamination interface in the global range.

[0046] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A flexible circuit board pressing device, characterized in that, The flexible circuit board pressing device includes: Mold clamping frame module, magnetic shape taking module, and uniform pressure release module; The mold clamping frame module is provided with a first mold clamping frame and a second mold clamping frame that are opposite each other. The first mold clamping frame and the second mold clamping frame are mirror images of each other on both sides of the flexible circuit board to be pressed. The two sets of magnetic shape-taking modules are respectively arranged on one side of the pressing surface of the first mold-closing frame and the second mold-closing frame, and are used to perform surface shaping on the flexible circuit board to be pressed. The uniform pressure relief module is installed inside the first and second mold clamping frames to balance the uneven force during the pressing process.

2. The flexible circuit board pressing device according to claim 1, characterized in that, The mold clamping frame module includes a frame assembly, which includes a bottom support plate, a top support plate, and limiting holes. The top support plate is fixedly mounted on one side of the bottom support plate, and a plurality of limiting holes are arranged in an array on the top support plate. The limiting holes are used to limit the movement direction of the magnetic shape-taking module.

3. The flexible circuit board pressing device according to claim 1, characterized in that, The magnetic rheological shaping module includes a shaping component, which includes a top support plate, a shaping bag, a guide rod, and an elastic element. Several top support plates are arranged in an array on one side of a top support plate. A shaping bag is mounted on the surface of the top support plate near the pressing surface. The shaping bag is filled with magnetorheological fluid. A guide rod is fixedly connected to the other end of the top support plate. The guide rod is slidably inserted into a limiting hole, and an elastic element is also sleeved on the outside of the guide rod. A linkage bracket is also fixedly connected to the bottom of the guide rod.

4. The flexible circuit board pressing device according to claim 3, characterized in that, The shaping bag has a first surface and a second surface opposite each other. Several of the first surfaces are arranged facing one end of the flexible circuit board to be pressed, and the second surface is the bonding surface of two adjacent shaping bags.

5. The flexible circuit board pressing device according to claim 1, characterized in that, The flexible circuit board pressing device also includes a locking assembly, which includes a driver, a transmission frame, an external traction rod, an external slider, an internal traction rod, and an internal slider. The driver is fixedly arranged on one side of the top support plate. One end of the transmission frame is fixedly connected to the movable shaft of the driver, and the other end of the transmission frame is slidably inserted into the top support plate. The external traction rod and the internal traction rod are also fixedly arranged on the transmission frame. The external traction rod and the internal traction rod are respectively arranged on both sides of the top support plate. Several external sliders and internal sliders are respectively arrayed on the external traction rod and the internal traction rod.

6. The flexible circuit board pressing device according to claim 3, characterized in that, The locking assembly further includes a locking slider, an external locking groove, and an internal locking groove. Several locking sliders are slidably inserted into the top support plate, with one end of the locking slider fixedly connected to the top support plate and the other end of the locking slider fixedly connected to the linkage bracket. The locking slider is also independently provided with an external locking groove and an internal locking groove. The external locking groove and the internal locking groove are arranged on both sides of the top support plate, and the external locking groove and the internal locking groove are respectively slidably engaged and matched with the external slider and the internal slider.

7. The flexible circuit board pressing device according to claim 6, characterized in that, Both the external locking groove and the internal locking groove are trapezoidal grooves.

8. The flexible circuit board pressing device according to claim 1, characterized in that, The uniform pressure relief module includes a hydraulic component, which includes a hydraulic oil reservoir, a flow divider, an adjusting shaft, and a piston. The hydraulic oil reservoir is fixedly arranged on one side of the base support plate, and several flow dividers are arranged in an array on the hydraulic oil reservoir. One end of the adjusting shaft is slidably assembled in the flow divider, and the other end of the adjusting shaft is fixedly connected to the linkage support. The adjusting shaft is also equipped with a piston inside the flow divider.

9. A flexible circuit board pressing device according to claim 8, characterized in that, The hydraulic oil reservoir is configured with a first cavity, and the part of the distributor cylinder connected to the first cavity is configured as a second cavity. Several second cavities are connected to the first cavity, and the first cavity and the second cavity together form an inner cavity with a constant volume.

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