Middle frame of electronic equipment, processing method of middle frame of electronic equipment and electronic equipment

Abstract

The embodiment of the invention provides a middle frame of electronic equipment, a processing method of the middle frame of the electronic equipment and the electronic equipment. The requirements of combining and fixing the display panel and the middle frame as well as the requirements of optimizing antenna performance and enhancing signal strength can be considered. The middle frame comprises a third face located on the outer side of the middle frame, and further comprises a middle frame body which comprises a middle frame body second face facing the display panel and a middle frame body fourth face located on the inner side of the middle frame and used for being connected with an antenna reed. The middle frame protruding part comprises a middle frame protruding part fourth face located on the inner side of the middle frame, the middle frame protruding part is connected to the middle frame body, and the connecting position of the middle frame protruding part and the middle frame body is located between the middle frame body second face and the edge close to the middle frame body fourth face and between the middle frame body fourth face and the edge close to the middle frame body second face. The middle frame protruding part is used for being connected with a display panel. The distance between the fourth face and the third face of the middle frame protruding part is larger than that between the fourth face and the third face of the middle frame body.

Description

Technical Field

[0001] This application relates to the field of electronic device technology, and in particular to a mid-frame of an electronic device, a method for processing the mid-frame of an electronic device, and an electronic device. Background Technology

[0002] With the continuous development of electronic technology, mobile phones, tablets, and other electronic devices are widely used in people's daily lives and work, bringing great convenience to their daily routines and work. These electronic devices include a display panel and a mid-frame. The glass cover frame of the display panel is bonded to the mid-frame of the electronic device, achieving the function of combining and fixing the display panel to the mid-frame.

[0003] However, in order to increase the screen-to-body ratio and thus display more content on electronic devices of the same size, electronic devices are being improved towards narrower bezels. Figure 1 A schematic diagram of the structure of an electronic device provided for related technologies. Figure 2 For along Figure 1 A cross-sectional view of an electronic device taken along the AA' direction, see [reference]. Figure 1 and Figure 2 The electronic device 100 may include a mid-frame 10, a back cover 20, and a display panel 30. The display panel 30 includes a glass cover 31 and a super clean foam (SCF) layer 32. To make the visual black border area of ​​the electronic device narrower, the bezel width of the glass cover 31 needs to be reduced. However, because the bezel of the glass cover 31 is too narrow, it is impossible to use the bezel of the glass cover 31 to bond with the mid-frame 10 to achieve the purpose of fixing the display panel 30 to the mid-frame 10. Therefore, it is necessary to increase the thickness of the mid-frame 10 in the length and width directions of the electronic device, so that the super clean foam (SCF) layer 32 of the display panel 30 can be bonded to the mid-frame 10 by adhesive 33 and has sufficient bonding area.

[0004] However, the thickness of the middle frame 10 in both the length and width directions of the electronic device is relatively large. The excessive thickness of the middle frame 10 results in an excessively large distance between the antenna spring welded to the inner side of the middle frame 10 and the outer side of the middle frame 10, which reduces the antenna performance. Summary of the Invention

[0005] To address the aforementioned technical problems, this application provides a mid-frame for an electronic device, a method for processing the mid-frame, and an electronic device, which can simultaneously meet the requirements of fixing the display panel to the mid-frame, as well as optimizing antenna performance and enhancing signal strength.

[0006] In a first aspect, the embodiments of the present application provide a middle frame of an electronic device, the middle frame comprising a third surface located on an outer side of the middle frame, the middle frame further comprising: a middle frame body comprising a second surface of the middle frame body facing a display panel, and a fourth surface of the middle frame body located on an inner side of the middle frame and used for connecting an antenna spring; a middle frame protruding portion comprising a fourth surface of the middle frame protruding portion located on the inner side of the middle frame, the middle frame protruding portion being connected to the middle frame body, a connection position of the middle frame protruding portion and the middle frame body being located between the second surface of the middle frame body, an edge of the fourth surface of the middle frame body close to the second surface of the middle frame body, and an edge of the fourth surface of the middle frame body close to the second surface of the middle frame body, the middle frame protruding portion being used for connecting the display panel; wherein a distance between the fourth surface of the middle frame protruding portion and the third surface is greater than a distance between the fourth surface of the middle frame body and the third surface.

[0007] The middle frame of the embodiments of the present application is provided with the middle frame protruding portion and the middle frame body close to the side of the display panel, the display panel can be bonded by the middle frame protruding portion, and the display panel and the middle frame are fixed. The middle frame is not provided with the middle frame protruding portion close to the side of the back shell, and only the middle frame body is provided. Therefore, the distance between the inner side surface and the outer side surface of the middle frame in this region is close, that is, the middle frame is thin, and is suitable for conducting communication signals such as radio signals. It can be seen that the above setting mode considers the needs of the combination and fixation of the display panel and the middle frame, and the needs of optimizing the antenna performance and enhancing the signal strength.

[0008] In some possible implementation modes, the middle frame protruding portion comprises a first surface of the middle frame protruding portion facing away from the display panel, the first surface of the middle frame protruding portion comprises a first sub-surface of the middle frame protruding portion; for the middle frame protruding portion extending in a direction parallel to the length direction of the electronic device, a plane in which the first sub-surface of the middle frame protruding portion is located and the width direction of the electronic device form a first preset angle; for the middle frame protruding portion extending in a direction parallel to the width direction of the electronic device, a plane in which the first sub-surface of the middle frame protruding portion is located and the length direction of the electronic device form a second preset angle; so that the middle frame presents that the higher the clearance height of the electronic device in the thickness direction of the area where the antenna spring is located, the closer to the geometric center of the middle frame. The first sub-surface of the middle frame protruding portion is provided as an inclined plane, which can facilitate the subsequent operation of welding the antenna spring to the middle frame, thereby improving the assembly efficiency and reducing the assembly difficulty.

[0009] In some possible implementation modes, the first preset angle and / or the second preset angle is 10-15 degrees. The above preset angle can not only ensure that the middle frame protruding portion has sufficient structural strength, but also form appropriate space required for subsequent assembly, thereby facilitating the assembly of the antenna spring.

[0010] In some possible implementation modes, the middle frame protruding portion comprises a first surface of the middle frame protruding portion facing away from the display panel, and an avoiding space is provided between the space where the antenna spring is located and the first surface of the middle frame protruding portion. The above setting mode can provide appropriate avoiding space, thereby facilitating the assembly of the antenna spring.

[0011] In some possible implementation manners, the first surface of the frame protrusion is parallel to the length direction and the width direction of the electronic device. Such an arrangement manner has the characteristic of easy processing.

[0012] In some possible implementation manners, the antenna spring and the antenna flexible circuit board are further included, the antenna flexible circuit board includes a flexible circuit board body, a spring connecting portion, a communication portion and a hollow portion, the communication portion and the hollow portion are arranged between the flexible circuit board body and the spring connecting portion, the flexible circuit board body and the spring connecting portion are connected through the communication portion and disconnected at the hollow portion; and the spring connecting portion is used for connecting with the antenna spring. Considering that there may be errors in assembling the antenna spring and the antenna FPC to the frame, the antenna FPC is provided with the hollow portion, which is more easy to stretch or compress the length, so as to absorb the length deformation of the antenna FPC caused by the assembly error, and further ensure the welding precision of the antenna spring.

[0013] In some possible implementation manners, the antenna spring and the fourth surface of the frame body are connected through a laser spot welding process. The laser spot welding process is mature and can ensure that the antenna spring is effectively welded to the frame body, and has high reliability.

[0014] In some possible implementation manners, the antenna spring and the spring connecting portion are connected through a laser surface assembly technology. The laser surface assembly technology is mature and has high reliability.

[0015] In a second aspect, the embodiments of the present application further provide a processing method of an electronic device frame, used for processing and preparing the frame of any one of the above electronic devices, and the processing method comprises the following steps of:

[0016] obtaining an electronic device frame to-be-processed part;

[0017] milling the fourth surface of the frame body and a first R angle by using a first size milling cutter;

[0018] forming an opening window on a side of the frame away from the display panel;

[0019] extending a second size milling cutter into the opening window, milling the fourth surface of the frame body and a second R angle at the first R angle position;

[0020] wherein the first R angle is greater than the second R angle.

[0021] By twice processing the R angle position by using a small size milling cutter, the large R angle can be processed into the fourth surface of the frame body and a small r angle. The R angle is made smaller, and the space occupation is reduced. Such a benefit is that the antenna spring can be made closer to the antenna slot, the antenna performance is optimized, and the signal strength is enhanced.

[0022] In some possible implementation manners, after the fourth surface of the frame body and the second R angle are milled, the method further comprises filling the opening window.

[0023] In a third aspect, the embodiments of the present application further provide an electronic device, comprising the middle frame of any of the above electronic devices, or using the processing method of any of the above electronic device middle frames. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 A structural schematic diagram of an electronic device provided by the related art;

[0025] Figure 2 A cross-sectional view of an electronic device along Figure 1 AA' direction;

[0026] Figure 3 A structural schematic diagram of a mobile phone provided by the embodiments of the present application;

[0027] Figure 4 A structural schematic diagram of a mobile phone along Figure 3 BB' direction;

[0028] Figure 5 A structural schematic diagram of a middle frame along Figure 3 BB' direction;

[0029] Figure 6 A cross-sectional view of a mobile phone middle frame edge along Figure 3 BB' direction;

[0030] Figure 7 Another cross-sectional view of a mobile phone middle frame edge along Figure 3 BB' direction;

[0031] Figure 8 A cross-sectional view of another mobile phone middle frame edge along Figure 3 BB' direction;

[0032] Figure 9 A cross-sectional view of still another mobile phone middle frame edge along Figure 3 BB' direction;

[0033] Figure 10 A cross-sectional view of a mobile phone middle frame edge before milling processing along Figure 3 BB' direction;

[0034] Figure 11 A cross-sectional view of a mobile phone middle frame edge during milling processing along Figure 3 BB' direction;

[0035] Figure 12 A structural schematic diagram of a mobile phone middle frame provided by the embodiments of the present application;

[0036] Figure 13 A structural schematic diagram of a flexible circuit board of a mobile phone antenna is provided in the embodiments of the present application. DETAILED DESCRIPTION

[0037] The technical solutions in the embodiments of the present application will be clearly and completely described in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0038] The term "and / or" used herein only describes an association relationship of associated objects, and means that three relationships can exist, for example, A and / or B can mean that A exists alone, A and B exist together, and B exists alone.

[0039] The words such as "up", "down", "left", "right" and the like used herein for indicating directions only have the purpose of clearly explaining the embodiments, so as to describe a possible arrangement manner or arrangement form of the components. It is not a limitation on the relationship between the components or the setting direction.

[0040] The terms "first" and "second" and the like in the description and claims of the embodiments of the present application are used to distinguish different objects, and are not used to describe a specific order of the objects. For example, the first target object and the second target object are used to distinguish different target objects, and are not used to describe a specific order of the target objects.

[0041] In the embodiments of the present application, the words such as "exemplary" or "for example" are used to mean an example, illustration or description. Any embodiment or design scheme described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as more preferred or more advantageous than other embodiments or design schemes. Rather, the words such as "exemplary" or "for example" are intended to present the relevant concept in a specific manner.

[0042] In the description of the embodiments of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more. For example, a plurality of processing units means two or more processing units; a plurality of systems means two or more systems.

[0043] The embodiments of the present application provide an electronic device. The electronic device provided by the embodiments of the present application can be a mobile phone, a tablet computer, a personal digital assistant (PDA), a vehicle-mounted computer, a smart wearable device, a smart home device, and the like. The embodiments of the present application do not specially limit the specific form of the above electronic device. Figure 3This is a schematic diagram of the structure of a mobile phone provided in an embodiment of this application. See also... Figure 3 For ease of explanation, the following description uses a mobile phone as an example. To clearly describe the various structural features and their positional relationships, the X, Y, and Z axes are used to define the positional relationships of the structures within the phone. The X-axis represents the width of the phone, the Y-axis represents its length, and the Z-axis represents its thickness.

[0044] See also Figure 3 The mobile phone 200 includes a mid-frame 10, a back cover 20, and a display panel 30. The back cover 20 and the display panel 30 are positioned opposite each other, and the mid-frame 10 is located between the back cover 20 and the display panel 30.

[0045] Figure 4 For along Figure 3 A schematic diagram of a mobile phone structure obtained by cross-section along the BB' direction, see [reference]. Figure 3 and Figure 4 ,in Figure 4 The back cover 20 is omitted. The mid-frame 10 includes a first surface 101 and a second surface 102 arranged opposite to each other, and a third surface 103 and a fourth surface 104 connecting the first surface 101 and the second surface 102. The third surface 103 is located, for example, on the outside of the mobile phone 200, that is, on the outside of the mid-frame 10, and is the outer side of the mid-frame 10. The fourth surface 104 is located, for example, on the inside of the mobile phone 200, that is, on the inside of the mid-frame 10, and is the inner side of the mid-frame 10. The third surface 103 and the fourth surface 104 are arranged opposite to each other. The back cover 20 is disposed on the first surface 101, and the display panel 30 is disposed on the second surface 102, with the first surface 101 and the second surface 102 arranged opposite to each other. The mid-frame 10, the back cover 20, and the display screen 30 can form a receiving cavity. The receiving cavity is provided with an antenna spring 40, a motherboard (not shown in the figure), a battery (not shown in the figure), and a retaining wall (not shown in the figure) for fixing the battery. The motherboard is provided with a processor and a memory. The memory is used to store computer program code. Computer program code includes computer instructions. The processor is used to invoke computer instructions to cause the mobile phone 200 to perform corresponding operations.

[0046] The material of the middle frame 10 includes conductive materials, such as metals like aluminum or steel. Figure 5 For along Figure 3 A schematic diagram of a mid-frame structure obtained by sectioning along the BB' direction, see [reference]. Figure 5The middle frame 10 includes a first part 10001 and a second part 10002, and an antenna slot 10003 is arranged between the first part 10001 and the second part 10002. The material of the antenna slot 10003 can be an insulating material, for example, plastic. The antenna slot 10003 blocks the radio signal transmission between the first part 10001 and the second part 10002. For example, the antenna spring 40 is electrically connected to the first part 10001. The mainboard is also provided with a radio frequency module and an antenna flexible printed circuit board 50 (FPC). The radio frequency module is electrically connected to the antenna spring 40 through the antenna FPC 50, so that the first part 10001 not only serves as a part of the middle frame 10, but also functions as an antenna to cooperate with the radio frequency module to complete the work of sending and receiving radio signals.

[0047] The material of the back shell 20 can include, for example, opaque materials such as plastic, leather, and glass fiber; or transparent materials such as glass. The embodiments of the present application do not limit the material of the back shell 20.

[0048] The display panel 30 can include, for example, a liquid crystal display (LCD) panel, an organic light emitting diode (OLED) display panel, and an LED display panel, for example, a Micro-LED display panel or a Mini-LED display panel. The embodiments of the present application do not limit the type of the display panel 30. The display panel 30 includes a glass cover plate farthest from the back shell 20 and an SCF layer closest to the back shell 20. In the assembly process, the SCF layer can be adhered to the second surface 102 by adhesive.

[0049] Figure 6 For the edge of the middle frame of the mobile phone, the edge of the middle frame is cut along the BB' direction. Figure 3 A cross-sectional view of the edge of the middle frame of the mobile phone cut along the BB' direction, as shown in FIG. 4B. Figure 6The middle frame 10 includes a middle frame body 1001 and a middle frame protruding portion 1002. The middle frame protruding portion 1002 is arranged on the fourth side 104 of the middle frame 10, connected to the middle frame body 1001, and arranged close to the display panel 30. The direction in which the middle frame protruding portion 1002 protrudes is a direction extending away from the third side 103. The first side 101 includes a middle frame body first side 1011 and a middle frame protruding portion first side 1012. The second side 102 includes a middle frame body second side 1021 and a middle frame protruding portion second side 1022. The fourth side 104 includes a middle frame body fourth side 1041 and a middle frame protruding portion fourth side 1042. The middle frame protruding portion second side 1022 can be bonded to the display panel 30, for assembling the display panel 30 to the middle frame 10. The middle frame protruding portion second side 1022 can be smoothly connected to the middle frame body second side 1021. Such an arrangement is more conducive to the middle frame protruding portion second side 1022 and the middle frame body second side 1021 being bonded to the display panel 30. This is more conducive to the display panel 30 being closely bonded to the middle frame 10. Of course, the above only exemplarily introduces an arrangement of the middle frame body second side 1021. The embodiments of the present application do not limit the shape of the middle frame protruding portion. In some embodiments, the middle frame protruding portion first side 1012 can be parallel to the directions of the X-axis and Y-axis of the mobile phone.

[0050] The middle frame body fourth side 1041 is not provided with the middle frame protruding portion 1002. Therefore, the antenna spring can be directly electrically connected to the middle frame body 1001 through the middle frame body fourth side 1041 by welding or the like. The advantage of this is that the antenna spring 40 is electrically connected to the middle frame body fourth side 1041, and radio waves need to be conducted from the third side 103 to the fourth side 104. If the distance between the third side 103 and the fourth side 104 is too large, it is not conducive to the reception of radio waves. The embodiments of the present application arrange the middle frame protruding portion 1002 on the side of the middle frame body 1001 close to the display panel 30. The middle frame protruding portion 1002 can be bonded to the display panel 30, thereby increasing the bonding area between the display panel 30 and the middle frame 10 and ensuring the bonding strength. At the same time, the middle frame protruding portion 1002 is not arranged on the side of the middle frame body 1001 close to the rear shell 20, so that the middle frame body fourth side 1041 is exposed. This allows the antenna spring 40 to be directly connected to the middle frame body fourth side 1041. The distance between the middle frame body fourth side 1041 and the third side 103 is smaller than the distance between the middle frame protruding portion fourth side 1042 and the third side 103. This is conducive to reducing the distance between the antenna spring 40 and the outer surface of the middle frame 10, thereby improving the quality of the reception of radio signals by the antenna spring 40. It can be seen that such an arrangement not only meets the bonding area requirement between the display panel 30 and the middle frame 10, but also ensures the quality of the reception and transmission of radio signals by the electronic device.

[0051] The connecting mode between the middle frame body 1001 and the antenna spring 40 is not limited in the embodiment of the application, and any process capable of forming electrical connection between the middle frame body 1001 and the antenna spring 40 can be used. For example, the combination between the middle frame body 1001 and the antenna spring 40 can be completed by laser welding. For the scheme of combining the middle frame body 1001 and the antenna spring 40 by laser welding, considering that the laser welding head needs to bypass the middle frame protruding part 1002 and extend into the middle frame body fourth surface 1041 exposed by the middle frame body 1001 to weld the middle frame body 1001 and the antenna spring 40. Figure 7 For the purpose of Figure 3 Fig. 8 is another sectional view of a mobile phone middle frame edge along the direction of BB', and Fig. 9 is a sectional view of a mobile phone middle frame edge along the direction of BB'. Figure 7 The existence of the middle frame protruding part 1002 makes the welding process inconvenient to operate, and therefore the middle frame protruding part first surface 1012 can include a middle frame protruding part first sub-surface 10121. For the middle frame protruding part 1002 whose extension direction is parallel to the Y axis, the plane where the middle frame protruding part first sub-surface 10121 is located and the X axis form a first preset angle a. For the middle frame protruding part 1002 whose extension direction is parallel to the X axis, the plane where the middle frame protruding part first sub-surface 10121 is located and the Y axis form a second preset angle b. The first preset angle a and / or the second preset angle b can be determined according to actual needs. For example, the first preset angle a and / or the second preset angle b is 10-15 degrees. The Z axis clearance height of the position where the antenna spring 40 is located presents the effect that the closer to the geometric center of the middle frame 10, the higher the Z axis clearance height. In other words, in order to facilitate the welding operation and leave the welding head tilt angle required during the welding operation for the welding head, an inclined inclined surface, i.e., the middle frame protruding part first sub-surface 10121, is arranged on the middle frame protruding part first surface 101. Compared with the design that the middle frame protruding part first surface 101 is parallel to the X axis and the Y axis of the mobile phone, the middle frame protruding part first sub-surface 10121 avoids the space required for the welding head tilt operation, and provides convenience for the operation of welding the middle frame body 1001 and the antenna spring 40 into one.

[0052] It should be noted that the posture of the middle frame body fourth surface 1041 is not limited in the embodiment of the application. It can not only be perpendicular to the Z axis as shown in Figs. 1-3 and 8-9, but also can be at a certain angle with the Z axis as shown in Figs. 4-7. Figure 6 The middle frame body fourth surface 1041 can be perpendicular to the Z axis as shown in Figs. 1-3 and 8-9. Figure 7 The middle frame body fourth surface 1041 can be at a certain angle with the Z axis as shown in Figs. 4-7. Figure 8 Fig. 4 is a sectional view of another mobile phone middle frame edge along the direction of BB', and Fig. 5 is a sectional view of another mobile phone middle frame edge along the direction of BB'. Figure 3 Fig. 4 is a sectional view of another mobile phone middle frame edge along the direction of BB', and Fig. 5 is a sectional view of another mobile phone middle frame edge along the direction of BB'. Figure 8 The middle frame body fourth surface 1041 can be perpendicular to the Z axis as shown in Figs. 1-3 and 8-9.

[0053] Figure 9for along Figure 3 A cross-sectional view of another phone middle frame edge along the direction of BB' is shown in FIG. 10B. Figure 9 To solve the problem of how to avoid the space required for the welding head operation, the middle frame protruding portion first surface 1012 can also be set as a complete plane, for example, the middle frame protruding portion first surface 1012 can be parallel to the directions of the X-axis and Y-axis of the phone, and an avoiding space can be set between the area where the antenna spring 40 is located and the middle frame protruding portion first surface 1012. The avoiding space leaves out the space required for the welding head operation, and provides convenience for the operation of welding the middle frame body 1001 and the antenna spring 40 into one.

[0054] The material of the middle frame 10 can be determined according to actual needs, for example, it can be a pure metal material, or a sandwich structure with plastic or other materials on both sides of the metal. The antenna spring 40 needs to be welded on the metal material of the middle frame 10.

[0055] For the forming method and process of the middle frame body fourth surface 1041, the following can be used.

[0056] Figure 10 for along Figure 3 A cross-sectional view of a phone middle frame edge before milling processing along the direction of BB' is shown in FIG. 11A, Figure 11 for along Figure 3 A cross-sectional view of a phone middle frame edge during milling processing along the direction of BB' is shown in FIG. 11B, Figure 10 and Figure 11 The T-shaped knife 300 can be used to mill the middle frame material on the side of the middle frame protruding portion first surface 1012 close to the back shell 20, exposing the middle frame body fourth surface 1041. In other words, before processing, the side of the middle frame protruding portion first surface 1012 close to the back shell 20 has middle frame material, and the purpose of processing is to remove the middle frame material on the side of the middle frame protruding portion first surface 1012 close to the back shell 20, and to thin the thickness of the corresponding area of the middle frame 10. In this step, the T-shaped knife 300 can be inserted into the to-be-processed part through the side of the middle frame 10 close to the display panel 30 for processing.

[0057] In some other embodiments, in order to ensure that the step of milling the middle frame material to a sufficient thickness, a large size T-shaped cutter with a large depth of blade is selected, and the blade is inserted into the first surface 1012 of the convex part of the middle frame 10 close to the rear shell 20, and the middle frame material to be removed is milled. For example, a cutter head with a width of 3 mm can be selected to mill the middle frame material with a thickness of 1.1 mm. However, the end of the cutting position formed by the T-shaped cutter during processing has a round corner (i.e. R angle), and the larger the width of the cutter head, the larger the R angle. If a cutter head with a width of 3 mm is used, the R angle is 1.5 mm. Since the R angle is an arc surface, it is not conducive to welding the antenna spring 40, and therefore the R angle on the middle frame 10 needs to be avoided, and the antenna spring 40 is welded to the fourth surface 1041 of the middle frame body. Referring to Figure 5 However, the middle frame 10 is provided with a first part 10001 and a second part 10002, and an antenna slit 10003 is arranged between the first part 10001 and the second part 10002 to block the electrical signal conduction of the first part 10001 and the second part 10002. The antenna spring 40 should be arranged as close to the antenna slit 10003 as possible, so as to improve the radio signal transmission quality of the antenna. The antenna spring 40 can be arranged on the first part 10001 and / or the second part 10002 of the edge of the middle frame 10, and the fourth surface 1041 of the middle frame body milled by the T-shaped cutter is located on the first part 10001 of the edge of the middle frame 10. Due to the limitations of the process, there is at least an R angle milled by the T-shaped cutter between the fourth surface 1041 of the middle frame body and the antenna slit 10003, and if the R angle is large, the distance between the end of the fourth surface 1041 of the middle frame body close to the antenna slit 10003 and the antenna slit 10003 is large. Figure 12 A structural schematic diagram of a middle frame of a mobile phone is provided for the embodiments of the present application, referring to Figure 12 and referring to Figure 5The fourth surface 1041 of the middle frame body can be machined by a large size T-shaped cutter, and after forming the first R angle R1, the window 11 is formed on the first surface 101 of the middle frame 10, a small size T-shaped cutter is inserted into the window 11, and milling is performed. The purpose of this step is to at least re-machine the first R angle R1 between the fourth surface 1041 of the middle frame body and the antenna slot 10003, and on this basis, a small size second R angle R2 is formed. Thus, the interval distance between the end of the fourth surface 1041 of the middle frame body close to the antenna slot 10003 and the antenna slot 10003 is reduced. For example, the cutter head of the small size T-shaped cutter can be selected to have a cutter head width of 1 mm, so that the re-formed second R angle R2 is 0.5 mm. Compared with the original first R angle R1 of 1.5 mm, the second R angle R2 of 0.5 mm can reduce the interval distance between the end of the fourth surface 1041 of the middle frame body close to the antenna slot 10003 and the antenna slot 10003 by 1 mm, which means that the welding position of the antenna spring 40 can be moved towards the antenna slot 10003 by 1 mm. Such a setting improves the antenna performance.

[0058] For the window 11 mentioned above, after the new second R angle R2 is machined, the filler can be used for plugging. For example, the filler can be Mylar, plastic sheet or glue.

[0059] For the process used to form the connection between the antenna FPC 50 and the antenna spring 40, the embodiments of the present application are not limited, and any process that can form an electrical connection between the antenna FPC 50 and the antenna spring 40 can be used. For example, the connection between the antenna FPC 50 and the antenna spring 40 can be achieved by surface mounting technology (Surface Mounted Technology, SMT). Figure 13 A structural schematic diagram of a mobile phone antenna flexible circuit board provided by the embodiments of the present application is shown in FIG. 5. Figure 13 The antenna FPC 50 can include an FPC body 51 and a spring connecting portion 52, and the FPC body 51 and the spring connecting portion 52 include a communication portion 53 and a hollow portion 54 therebetween. The FPC body 51 and the spring connecting portion 52 are connected through the communication portion 53 and disconnected at the hollow portion 54. The spring connecting portion 52 is used to connect with the antenna spring 40, and the spring connecting portion 52 is electrically connected with the FPC body 51 through the communication portion 53. The FPC body 51 can be connected to the mainboard of the mobile phone, and the above structure is used to achieve the transmission and reception of wireless signals. Considering that there can be errors in assembling the antenna spring 40 and the antenna FPC 50 to the middle frame 10, the antenna FPC 50 is provided with the hollow portion 54, which is easier to stretch or compress the length, thereby absorbing the length deformation of the antenna FPC 50 caused by the assembly error, and further ensuring the welding precision of the antenna spring 40.

[0060] The connection between the middle frame 10 and the antenna spring 40 is only exemplarily described above. In fact, the middle frame 10 can be connected with multiple antenna springs 40. For example, the middle frame 10 includes a first part, a second part, a third part and a fourth part, each of which can be used as an antenna. Each of the first part, the second part, the third part and the fourth part is connected with an antenna spring 40. The connection between any one part and the antenna spring 40 can adopt the above setting mode. In other words, the connection mode between the middle frame 10 and the antenna spring 40 in this document can be applied to any one or more positions where the middle frame 10 and the antenna spring 40 need to be connected.

[0061] The embodiments of the present application are described above in combination with the drawings, but the present application is not limited to the above specific embodiments, and the above specific embodiments are only illustrative but not restrictive. Those skilled in the art can make many forms under the inspiration of the present application without departing from the scope of the present application and the scope protected by the claims.

Claims

1. A middle frame of an electronic device, characterized in that, The middle frame includes a third surface on the outer side of the middle frame, and the middle frame further includes: a middle frame body including a second surface of the middle frame body facing the display panel, and a fourth surface of the middle frame body on the inner side of the middle frame for connecting the antenna spring; a middle frame protrusion including a fourth surface of the middle frame protrusion on the inner side of the middle frame, the middle frame protrusion being connected to the middle frame body, the connection position of the middle frame protrusion to the middle frame body being between the second surface of the middle frame body and the edge of the fourth surface of the middle frame body close to the second surface of the middle frame body, and the fourth surface of the middle frame body close to the edge of the second surface of the middle frame body, the middle frame protrusion being used for connecting the display panel; wherein the distance between the fourth surface of the middle frame protrusion and the third surface is greater than the distance between the fourth surface of the middle frame body and the third surface. 2.The middle frame of the electronic device of claim 1, wherein, The middle frame protrusion includes a first surface of the middle frame protrusion facing away from the display panel, the first surface of the middle frame protrusion including a first sub-surface of the middle frame protrusion; For the middle frame protrusion extending in a direction parallel to the length direction of the electronic device, the plane in which the first sub-surface of the middle frame protrusion lies forms a first preset angle with the width direction of the electronic device; for the middle frame protrusion extending in a direction parallel to the width direction of the electronic device, the plane in which the first sub-surface of the middle frame protrusion lies forms a second preset angle with the length direction of the electronic device; and the closer to the geometric center of the middle frame, the higher the clearance height in the thickness direction of the electronic device in the area in which the antenna spring lies. 3.The middle frame of the electronic device of claim 2, wherein, The first preset angle and / or the second preset angle is 10-15 degrees. 4.The middle frame of the electronic device of claim 1, wherein, The middle frame protrusion includes a first surface of the middle frame protrusion facing away from the display panel, and a clearance space is provided between the space in which the antenna spring lies and the first surface of the middle frame protrusion. 5.The middle frame of the electronic device of claim 4, wherein, The first surface of the middle frame protrusion is parallel to the length direction and the width direction of the electronic device. 6.The middle frame of the electronic device of claim 1, wherein, The antenna spring and an antenna flexible circuit board are further included, the antenna flexible circuit board including a flexible circuit board body, a spring connecting portion, a communication portion, and a hollowed portion, the communication portion and the hollowed portion being provided between the flexible circuit board body and the spring connecting portion, the flexible circuit board body and the spring connecting portion being connected through the communication portion and disconnected at the hollowed portion; wherein the spring connecting portion is used for connecting the antenna spring. 7.The middle frame of the electronic device of claim 6, wherein, The antenna spring and the fourth surface of the middle frame body are connected through a laser spot welding process. 8.The middle frame of the electronic device of claim 6, wherein, The antenna spring and the spring connecting portion are connected through a laser surface assembly technology.

9. A processing method of a middle frame of an electronic device, used for processing and preparing the middle frame of the electronic device according to any one of claims 1-8, characterized in that, The method includes: obtaining a middle frame workpiece to be processed in an electronic device; milling the fourth surface of the middle frame body and a first R angle using a first size milling cutter; forming an opening on the side of the middle frame away from the display panel; extending a second size milling cutter into the opening, and milling the fourth surface of the middle frame body and a second R angle at the position of the first R angle; wherein the first R angle is greater than the second R angle.

10. The processing method of the electronic device middle frame according to claim 9, wherein, After the fourth surface of the middle frame body and the second R angle are milled, the opening is further filled.

11. An electronic device, comprising: The middle frame of the electronic device according to any one of claims 1-8, or a processing method of the middle frame of the electronic device according to claim 9 or 10.

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