Electronic device

Abstract

The invention relates to the technical field of electronics, and discloses electronic equipment, which comprises a circuit board, an electronic device, a heat dissipation piece, a first elastic heat-conducting sheet and a first graphene sheet, and is characterized in that the electronic device is electrically connected to the circuit board; wherein the first elastic heat-conducting sheet is arranged on the side, away from the circuit board, of the electronic device, the first graphene sheet is arranged on the side, close to the circuit board, of the heat dissipation piece, and the first graphene sheet is used for blocking electromagnetic noise conduction and heat conduction; the first graphene sheet and the first elastic heat-conducting sheet are in at least partial area contact. According to the technical scheme, efficient heat dissipation of the electronic device can be achieved, electromagnetic noise of the electronic device can be prevented from being transmitted to the outside, and therefore the electronic device can balance good heat dissipation and electromagnetic compatibility. In addition, as the first elastic heat-conducting fins have flexibility and elasticity, the first elastic heat-conducting fins can be in good contact with other parts respectively, heat conduction and heat dissipation are facilitated, and the heat dissipation efficiency is improved. In addition, the device is simple in structure, good in stability, suitable for an existing assembly process and high in universality.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the electronic technical field, and particularly relate to an electronic device. BACKGROUND

[0002] Generally, there are multiple electronic devices such as chips in an electronic device. Meanwhile, as the electronic device operates, the electronic devices work and generate heat, which needs to be dissipated in time through the heat-conducting silica gel. However, the heat-conducting silica gel, while dissipating heat, also radiates and conducts the electromagnetic noise generated by the electronic devices, which easily interferes with other devices or other electronic devices, thereby causing electromagnetic compatibility (EMC) problems. Therefore, the conventional electronic device cannot effectively balance heat dissipation and electromagnetic compatibility. SUMMARY

[0003] In view of this, some embodiments of the present application provide an electronic device that can balance good heat dissipation and electromagnetic compatibility.

[0004] In a first aspect, some embodiments of the present application provide an electronic device, which includes a circuit board, an electronic device, and a heat dissipation member, the electronic device being electrically connected to the circuit board. The electronic device further includes a first elastic heat-conducting sheet and a first graphene sheet; the first elastic heat-conducting sheet is arranged on a side of the electronic device away from the circuit board, and the first graphene sheet is arranged on a side of the heat dissipation member close to the circuit board, the first graphene sheet being at least partially in contact with the first elastic heat-conducting sheet. The first graphene sheet is used to hinder electromagnetic noise conduction and heat conduction.

[0005] In the above technical solution, electronic devices generate a large amount of heat during operation. This heat is mainly concentrated on the electronic devices and circuit boards, forming a heat concentration area. Since both the first elastic thermal conductive sheet and the first graphene sheet have excellent thermal conductivity, the electronic devices are in direct contact with the first elastic thermal conductive sheet, and the first elastic thermal conductive sheet is in at least partial contact with the first graphene sheet, thus forming a heat conduction channel from the first elastic thermal conductive sheet to the first graphene sheet. In this way, heat can be quickly conducted from the aforementioned heat concentration area to a larger area of ​​heat sink through this heat conduction channel, achieving efficient heat dissipation. Simultaneously, because the first graphene sheet has low magnetic permeability, it can effectively hinder the conduction of electromagnetic noise generated by the electronic devices to the outside, thereby improving electromagnetic compatibility. Thus, both efficient heat dissipation of the electronic devices and the prevention of electromagnetic noise propagation to the outside are achieved, allowing the electronic device to balance good heat dissipation and electromagnetic compatibility. Furthermore, because the first elastic thermal conductive sheet is flexible, it can make good contact with both the electronic devices and the first graphene sheet, avoiding the problem of affecting heat conduction efficiency due to hard contact, which is beneficial for heat dissipation and improves heat dissipation efficiency. Furthermore, the aforementioned improvements to electronic devices are simple in structure, have good stability, are suitable for existing assembly processes, are highly versatile, and can be widely used.

[0006] In some embodiments, the thickness of the first graphene sheet ranges from 0.5 mm to 2 mm. This thickness range balances strength, assembly process, and material waste. If the thickness of the first graphene sheet is less than 0.5 mm, its strength is low, it is easily damaged, its magnetic permeability is affected, and its performance in hindering electromagnetic noise transmission is weakened, which is detrimental to achieving electromagnetic compatibility. Furthermore, an excessively thin first graphene sheet is difficult to fix to a heat sink, increasing the burden of the assembly process. If the thickness of the first graphene sheet is greater than 2 mm, it is not conducive to miniaturization design and also results in material waste.

[0007] In some embodiments, the surface of the first graphene sheet near the heat sink is provided with adhesive. The first graphene sheet has its own adhesive, which makes it easy for operators to fix the first graphene sheet to the heat sink, thereby facilitating the installation of the first graphene sheet without increasing the burden of the assembly process.

[0008] In some embodiments, the first elastic thermally conductive sheet includes a thermally conductive silicone pad. The thermally conductive silicone pad enables the first elastic thermally conductive sheet to have good thermal conductivity while ensuring reliable contact between the first elastic thermally conductive sheet and the electronic device and the first graphene sheet. This reduces the problem of thermal conductivity being affected by hard-to-hard contact, thus facilitating heat dissipation and improving heat dissipation efficiency.

[0009] In some embodiments, the thickness of the heat-conductive silica gel sheet ranges from 0.5 mm to 15 mm. The heat-conductive silica gel sheet with the thickness ranging from 0.5 mm to 15 mm can balance the strength, assembly process, and material waste problem. If the thickness of the heat-conductive silica gel sheet is less than 0.5 mm, the strength is low and the heat-conductive silica gel sheet is easy to break, which leads to the reduction of the heat-conductive performance and is not conducive to achieving high-efficiency heat dissipation. In addition, the heat-conductive silica gel sheet that is too thin is not convenient to fix on the electronic device, which increases the burden of the assembly process. If the thickness of the heat-conductive silica gel sheet is greater than 15 mm, it is not conducive to achieving miniaturization design and will also cause material waste.

[0010] In some embodiments, the first graphene sheet completely covers the first elastic heat-conductive sheet. In this way, the first graphene sheet can quickly disperse the heat concentrated on the first elastic heat-conductive sheet and conduct the heat to the heat-dissipating member, which is conducive to improving the heat dissipation efficiency. In addition, the first graphene sheet covers the first elastic heat-conductive sheet, that is, the first graphene sheet can completely shield the electronic device, so as to greatly hinder the electromagnetic noise from being conducted to the outside world, reduce the electromagnetic noise leakage, and be conducive to improving the electromagnetic compatibility.

[0011] In some embodiments, the electronic device further comprises a second elastic heat-conductive sheet arranged on the side of the circuit board away from the electronic device and facing the electronic device. In this scheme, the electronic device is mounted on the circuit board, and the second elastic heat-conductive sheet is arranged on the area of the back surface of the circuit board opposite to the position of the electronic device, so as to quickly conduct the heat concentrated on the electronic device to the outside through the base material of the circuit board and the second elastic heat-conductive sheet, thereby achieving high-efficiency heat dissipation. In this way, the heat generated by the electronic device can be dissipated from both sides, so as to improve the heat dissipation efficiency and effect.

[0012] In some embodiments, the electronic device further comprises a support plate and a second graphene sheet arranged on one side of the support plate; the circuit board is mounted on the support plate, and the second graphene sheet at least partially contacts the second elastic heat-conductive sheet. In this embodiment, the second graphene sheet can hinder the electromagnetic noise from being conducted to the outside world from the side away from the electronic device, thereby reducing the electromagnetic noise leakage. In this way, the electromagnetic noise propagation can be effectively improved by hindering the electromagnetic noise from being conducted from both sides. In addition, the second graphene sheet can quickly conduct the heat concentrated on the second elastic heat-conductive sheet to the support plate, thereby achieving rapid heat dissipation.

[0013] In some embodiments, the thickness of the second graphene sheet ranges from 0.5 mm to 2 mm, and / or the surface of the second graphene sheet close to the support plate is provided with an adhesive. The second graphene sheet with the thickness ranging from 0.5 mm to 2 mm can balance the strength, assembly process, and material waste problem. The second graphene sheet is provided with an adhesive, which is convenient for the operator to fix the second graphene sheet on the support plate by the adhesive, thereby facilitating the installation of the second graphene sheet and not increasing the burden of the assembly process.

[0014] In some embodiments, the electronic device further comprises a housing, and the support plate is a part of the housing. In this embodiment, the part of the housing as the support plate is advantageous to simplify the structure of the electronic device and save the space inside the electronic device.

[0015] The above description is only a summary of the technical solutions of the present application. In order to enable one skilled in the art to better understand the technical means of the present application, the contents of the specification can be implemented, and in order to enable the above and other purposes, features and advantages of the present application to be more obvious and easy to understand, the following specific embodiments of the present application are described. BRIEF DESCRIPTION OF DRAWINGS

[0016] One or more embodiments are illustrated by way of example in the drawings that are for illustrative purposes only, and not for the limitation of the embodiments, elements with the same reference numerals in the drawings represent similar elements, unless otherwise specified, the drawings do not constitute a proportional limit.

[0017] Figure 1 The structure of the electronic device in some embodiments of the present application is shown schematically;

[0018] Figure 2 The partial cross-sectional view of the electronic device in some embodiments of the present application is shown schematically;

[0019] Figure 3 The partial cross-sectional view of the electronic device in some embodiments of the present application is shown schematically;

[0020] Figure 4 The positional relationship between the first elastic heat-conducting sheet and the first graphene sheet in some embodiments of the present application is shown schematically;

[0021] Figure 5 The partial cross-sectional view of the electronic device in some embodiments of the present application is shown schematically.

[0022] BRIEF DESCRIPTION OF DRAWINGS

[0023] 100, electronic device;

[0024] 10, circuit board; 20, electronic device; 30, first elastic heat-conducting sheet; 40, first graphene sheet; 50, heat-dissipating member; 60, second elastic heat-conducting sheet; 70, second graphene sheet; 80, support plate; 90, housing.

[0025] The drawings herein are incorporated into the specification and form part of the specification, show embodiments consistent with the present application, and together with the specification serve to explain the principles of the present application. DETAILED DESCRIPTION

[0026] The application will be described in detail below with specific embodiments. The following examples will help those skilled in the art to further understand the application, but do not limit the application in any form. It should be noted that for those skilled in the art, without departing from the concept of the application, a number of modifications and improvements can be made. These are within the scope of protection of the application.

[0027] In order to make the purpose, technical scheme and advantages of the application clearer, the application will be further described in detail below in combination with the drawings and examples. It should be understood that the specific embodiments described herein are only used to explain the application and do not limit the application.

[0028] It should be noted that the various features in the embodiments of the application can be combined with each other without conflict, and are within the scope of protection of the application. In addition, although the functional modules are divided in the device schematic diagram, and the logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in a different order from the module division in the device or the order in the flowchart. In addition, the "first", "second", "third" and the like used herein do not limit the data and execution order, but only distinguish the same items or similar items with basically the same function and effect.

[0029] Unless otherwise defined, all technical and scientific terms used in the specification have the same meaning as understood by those skilled in the art to which the application belongs. The terms used in the specification of the application are only for the purpose of describing the specific embodiments and are not used to limit the application. The term "and / or" used in the specification includes any and all combinations of one or more related listed items.

[0030] In addition, the technical features involved in each embodiment of the application described below can be combined with each other as long as there is no conflict.

[0031] In the embodiments of the application, the electronic device refers to a device composed of integrated circuits, transistors, electron tubes and other electronic devices, which applies electronic technology software to play a role. For example, the electronic device can be a recording and broadcasting device, a computer device for teaching or a video camera.

[0032] For electronic devices, there is usually one or more chips inside, such as a processor chip for computing control, a chip for voltage boosting and voltage reduction, or a chip for storage. The chip will generate heat during operation, and there will also be electromagnetic noise radiation. Heat is easy to cause hardware to burn out due to high temperature, and electromagnetic noise radiation will cause the device electromagnetic wave interference radiation to exceed the standard, causing electromagnetic compatibility problems. With the increasing speed of chip operation, electromagnetic compatibility problems and heat dissipation problems are becoming more and more difficult to solve.

[0033] In some solutions known to the inventors of the present application, heat-conducting silica gel pads are used for heat dissipation. However, the heat-conducting silica gel pads, while dissipating heat, also radiate and conduct electromagnetic noise generated by the electronic devices such as chips, thereby causing electromagnetic compatibility problems. That is, the electronic devices cannot effectively balance heat dissipation and electromagnetic compatibility.

[0034] To solve the above problems, some embodiments of the present application provide an electronic device, which comprises a first elastic heat-conducting sheet arranged on an electronic device, and a first graphene sheet with high heat conductivity and low magnetic permeability arranged on a heat dissipation member. After the heat dissipation member is installed, the first elastic heat-conducting sheet is at least partially in contact with the first graphene sheet.

[0035] When the electronic device is running, a large amount of heat is generated by the electronic device, which is mainly concentrated on the electronic device and the circuit board to form a heat concentration area. Based on the fact that the first elastic heat-conducting sheet and the first graphene sheet both have good heat conductivity, the electronic device is in direct contact with the first elastic heat-conducting sheet, and the first elastic heat-conducting sheet is at least partially in contact with the first graphene sheet, thereby forming a heat conduction channel from the first elastic heat-conducting sheet to the first graphene sheet. Thus, the heat can be quickly conducted from the aforementioned heat concentration area to the heat dissipation member with a large area through the heat conduction channel, thereby achieving efficient heat dissipation. At the same time, based on the fact that the first graphene sheet has low magnetic permeability, it can effectively hinder the electromagnetic noise generated by the electronic device from being conducted to the outside, thereby improving the electromagnetic compatibility problem. In this way, both efficient heat dissipation of the electronic device and hindering the electromagnetic noise generated by the electronic device from being propagated to the outside are achieved, so that the electronic device can balance and take into account good heat dissipation and electromagnetic compatibility. In addition, since the first elastic heat-conducting sheet has flexibility, it can be in good contact with the electronic device and the first graphene sheet, respectively, and there is no problem of affecting the heat conduction efficiency due to hard contact, which is conducive to heat conduction and heat dissipation and improves the heat dissipation efficiency. Furthermore, the improvement of the electronic device has a simple structure, good stability, is suitable for existing assembly processes, has strong universality, and can be widely used.

[0036] Figure 1 A structural schematic diagram of the electronic device 100 provided by the embodiments of the present application is shown in FIG. 1. Figure 1 , Figure 1 The electronic device 100 is exemplarily shown as a recording and broadcasting device. Of course, the electronic device 100 can also be a teaching device, a display, a video camera, a smart tablet or a smart sound, etc., which has a demand for chip heat dissipation and a demand for chip electromagnetic compatibility. The embodiments of the present application do not specially limit the specific type of the electronic device.

[0037] Among them, Figure 2 A partial cross-sectional schematic diagram of the electronic device 100 provided by some embodiments of the present application is shown in FIG. 2. Figure 2The electronic device 100 includes a circuit board 10, electronic components 20, a first elastic heat-conducting sheet 30, a first graphene sheet 40, and a heat sink 50. The circuit board 10 can be a printed circuit board (PCB), on which various electronic components 20 for different functions are electrically connected. Some of these electronic components 20 generate electromagnetic noise and a significant amount of heat during use. For example, one of these electronic components 20 can be a chip.

[0038] In some embodiments, conductive lines are printed on the first side of the PCB board, and multiple electronic devices 20 are arranged on this first side. In this case, the PCB board is a single-sided PCB board, wherein one or more electronic devices 20 require heat dissipation and improved electromagnetic compatibility. In some embodiments, conductive lines are printed on both the first and second sides of the PCB board, and multiple electronic devices 20 are arranged on both the first and second sides. In this case, the PCB board is a double-sided PCB board, wherein one or more electronic devices 20 requiring heat dissipation and improved electromagnetic compatibility can be distributed on either the first or second side of the PCB board. In this embodiment, no restrictions are placed on the arrangement of the PCB board.

[0039] The following is an illustrative example using any electronic device 20 on circuit board 10 that requires heat dissipation and improved electromagnetic compatibility. Figure 2 As shown, the first elastic thermal conductive sheet 30 is disposed on the side of the electronic device 20 away from the circuit board 10, and the first graphene sheet 40 is disposed on the side of the heat sink 50 close to the circuit board 10. The first graphene sheet 40 is in at least partial contact with the first elastic thermal conductive sheet 30.

[0040] The first elastic thermally conductive sheet 30 and the first graphene sheet 40 have high thermal conductivity. It is understood that higher thermal conductivity corresponds to lower thermal resistance. The first elastic thermally conductive sheet 30 is disposed on the surface of the electronic device 20 away from the circuit board 10. Therefore, the first elastic thermally conductive sheet 30 can quickly conduct the heat generated by the electronic device 20 to the first graphene sheet 40 and the heat sink 50, thereby achieving heat dissipation for the electronic device 20.

[0041] In some embodiments, the material of the first elastic thermally conductive sheet 30 may be selected from thermally conductive silicone, highly elastic silicone gel, or a composite material of nano-silver flowers and highly elastic and thermally conductive materials. For example, the material of the first elastic thermally conductive sheet 30 includes thermally conductive silicone, which has a thermal conductivity of 2.0 to 6.0 and low thermal resistance, thereby exhibiting good thermal conductivity.

[0042] The first graphene sheet 40 also has a low magnetic permeability. It can be understood that the lower the magnetic permeability, the greater the electromagnetic conduction impedance, which is conducive to hindering the electromagnetic noise from propagating to the outside. The first elastic heat-conducting sheet 30 is arranged on the electronic device 20, and the first graphene sheet 40 is at least partially in contact with the first elastic heat-conducting sheet 30, that is, the first graphene sheet 40 is located in the first direction of the electronic device 20 (the direction away from the circuit board 10 from the front surface of the circuit board 10) and shields at least part of the electronic device 20. Thus, the electromagnetic noise radiated by the electronic device 20 in the first direction can be hindered from propagating when encountering the first graphene sheet 40, reducing the propagation to the outside, thereby improving the electromagnetic compatibility.

[0043] In some embodiments, the magnetic permeability of the first graphene sheet 40 is about 2.1 x 10 -4 times the vacuum magnetic permeability, has a high magnetic conduction impedance, and thus can hinder electromagnetic noise conduction.

[0044] Thus, the first elastic heat-conducting sheet 30 and the first graphene sheet 40 form a heat-conducting channel, reducing the heat conduction impedance, and the heat generated by the electronic device 20 is mainly concentrated in the heat concentration area formed by the electronic device and the circuit board, so that the heat can be transferred from the heat concentration area to the heat dissipation member 50 through the heat-conducting channel, and then to the external air or other structural members, to achieve efficient heat dissipation of the electronic device 20. In addition, the first graphene sheet 40 has a low magnetic permeability, increasing the electromagnetic conduction impedance, and the electromagnetic noise generated by the electronic device 20 is hindered from propagating by the first graphene sheet 40, making it difficult to propagate to the outside, thereby improving the electromagnetic compatibility problem. It can be seen that both efficient heat dissipation of the electronic device 20 and hindering the electromagnetic noise generated by the electronic device 20 from propagating to the outside are achieved, and the electronic device 100 can balance good heat dissipation and electromagnetic compatibility.

[0045] Please refer again to Figure 2 , the first elastic heat-conducting sheet 30 is arranged on the side of the heat dissipation member 50 close to the circuit board 10, and the first graphene sheet 40 is arranged on the side of the electronic device 20 away from the circuit board 10.

[0046] The material of the heat dissipation member 50 can be metal or ceramic, thereby improving the heat dissipation effect of the heat dissipation member 50 on the electronic device 20. For example, the heat dissipation member 50 is an aluminum sheet. The area of the heat dissipation member 50 is greater than that of the first graphene sheet 40, and the heat dissipation member 50 with a larger area is conducive to dispersing heat and improving the heat dissipation efficiency.

[0047] In some embodiments, the heat sink 50 is mounted on the circuit board 10, for example, by welding or clamping on the circuit board 10, and the welding points or clamps are located in the blank area (the area not printed with conductive lines and electronic devices 20) on the circuit board 10. In this way, the heat sink 50 is covered above the electronic device 20, and the first graphene sheet 40 provided on the heat sink 50 is in contact with the first elastic heat-conducting sheet 30. It can be understood that in other embodiments, the heat sink 50 can also be mounted in other structural members of the electronic device 100, for example, the heat sink 50 is mounted on the shell 90 by welding or clamping. In other embodiments, the electronic device 100 includes a shell 90, and the heat sink 50 can reuse the shell 90 of the electronic device 100, that is, part of the shell 90 can be used as the heat sink 50, so as to save the internal space of the electronic device 100.

[0048] The present application does not limit the structure and mounting of the heat sink 50, as long as the first graphene sheet 40 provided on the heat sink 50 is at least partially in contact with the first elastic heat-conducting sheet 30 provided on the electronic device 20 after mounting. It can be seen that the first elastic heat-conducting sheet 30 and the first graphene sheet 40 contact each other as a heat-conducting medium between the electronic device 20 and the heat sink 50, provide a heat dissipation channel, and achieve efficient heat dissipation. In addition, the first graphene sheet 40 hinders the propagation of electromagnetic noise to the outside, and can effectively improve the electromagnetic compatibility.

[0049] In this embodiment, the first elastic heat-conducting sheet 30 has a flexible elasticity and can be in good contact with the electronic device 20 and the first graphene sheet 40, respectively. It can be understood that if the heat-conducting sheet is a non-elastic hard material, when it is in contact with the electronic device 20, there may be a gap between the heat-conducting medium and the heat source (electronic device 20) due to uneven contact surface and hard contact, resulting in reduced heat conduction efficiency. Similarly, if the heat-conducting sheet is a non-elastic hard material, when it is in contact with the first graphene sheet 40, there may be a gap in the heat-conducting medium due to uneven contact surface and hard contact, resulting in reduced heat conduction efficiency.

[0050] It can be seen that in the present embodiment, the first elastic heat-conducting sheet 30 has a flexible elasticity and can be in full contact with the electronic device 20 and the first graphene sheet 40 on both sides, and there is no problem of reduced heat conduction efficiency due to hard contact, which is conducive to heat conduction and heat dissipation and improves the heat dissipation efficiency.

[0051] In summary, the electronic device generates a large amount of heat when the electronic device is running, and the heat is mainly concentrated on the electronic components and the circuit board to form a heat concentration area. Based on the fact that the first elastic heat-conducting sheet and the first graphene sheet both have good heat-conducting performance, the electronic components are in direct contact with the first elastic heat-conducting sheet, and the first elastic heat-conducting sheet is at least partially in contact with the first graphene sheet, thereby forming a heat-conducting channel from the first elastic heat-conducting sheet to the first graphene sheet. In this way, the heat can be quickly conducted from the aforementioned concentration area to the larger-area heat-dissipating member through the heat-conducting channel for high-efficiency heat dissipation. At the same time, based on the fact that the first graphene sheet has a low magnetic permeability, the electromagnetic noise generated by the electronic components can be effectively hindered from being conducted to the outside world, thereby improving the electromagnetic compatibility problem.

[0052] In this way, both high-efficiency heat dissipation of the electronic components and hindering of the electromagnetic noise generated by the electronic components from being conducted to the outside world are achieved, so that the electronic device can balance and take into account good heat dissipation and electromagnetic compatibility. In addition, since the first elastic heat-conducting sheet has flexibility, it can be in good contact with the electronic components and the first graphene sheet, respectively, and there is no problem of affecting the heat-conducting efficiency due to hard contact, which is conducive to heat conduction and heat dissipation and improves the heat dissipation efficiency. In addition, the above improvement for the electronic device has simple structure, good stability, is suitable for existing assembly process, has strong universality, and can be widely used.

[0053] In some embodiments, the first elastic heat-conducting sheet 30 includes a heat-conducting silica gel sheet. Illustratively, the heat-conducting silica gel sheet is an organic silica gel heat-conducting sheet, an inorganic silica gel heat-conducting sheet, or a composite heat-conducting silica gel sheet. The heat-conducting silica gel sheet has good heat-conducting performance, insulation, and flexibility, so that the first elastic heat-conducting sheet 30 has good heat-conducting performance, and at the same time, the reliability of the contact of the first elastic heat-conducting sheet 30 with the electronic components 20 and the first graphene sheet 40 can be ensured. Therefore, the problem of affecting the heat-conducting efficiency due to hard contact can be reduced, which is conducive to heat conduction and heat dissipation and improves the heat dissipation efficiency.

[0054] In some embodiments, the thickness of the heat-conducting silica gel sheet ranges from 0.5 mm to 15 mm. For example, the thickness of the heat-conducting silica gel sheet can be 0.5 mm, 0.8 mm, 1 mm, 5 mm, 7 mm, 11 mm, 12.5 mm, 13 mm, 15 mm, or within a range consisting of any of the above values.

[0055] Generally, the thicker the heat-conductive silica gel sheet is, the higher the strength is, but the larger the installation space required is, and the more material waste is caused. The thinner the heat-conductive silica gel sheet is, the lower the strength is, and the smaller the installation space required is. The inventors have found that when the thickness of the heat-conductive silica gel sheet is less than 0.5 mm, the strength is low, and the heat-conductive silica gel sheet is easy to break, which leads to a decrease in the heat-conductive performance, and is not conducive to achieving high-efficiency heat dissipation. In addition, the heat-conductive silica gel sheet that is too thin is not convenient to fix on the electronic device 20, and increases the burden of the assembly process. The inventors have found that when the thickness of the heat-conductive silica gel sheet is greater than 15 mm, a larger installation space is required, which is not conducive to achieving miniaturization design, and also causes material waste.

[0056] Therefore, controlling the thickness of the heat-conductive silica gel sheet in the range of 0.5 mm to 15 mm can balance the strength, assembly process, and material waste. In addition, the heat-conductive silica gel sheet has insulation, and can achieve heat conduction while achieving insulation between the electronic device 20 and the first graphene sheet 40, avoiding electric leakage or short circuit.

[0057] It should be noted that the thickness has the meaning known in the art, and can be measured according to known methods and instruments. For example, the thickness of the heat-conductive silica gel sheet can be measured according to the provisions in the standard GB / T 20220-2006.

[0058] In some embodiments, the first graphene sheet 40 is a sheet prepared from graphene material. The magnetic permeability of graphene is about 2.1 x 10 -4 times the vacuum magnetic permeability, has a higher magnetic conduction impedance, that is, has poor magnetic conduction performance, so that the first graphene sheet 40 can hinder the propagation of electromagnetic noise to the outside, achieving good electromagnetic compatibility. At the same time, the thermal conductivity of graphene is 2000-5000 W / m·K, and has a lower thermal conduction impedance, so that the first graphene sheet 40 has good heat conduction performance. That is, the first graphene sheet 40 has good heat conduction performance, and can quickly conduct heat from the first elastic heat-conductive sheet 30 to the heat-dissipating member 50, improving the heat dissipation efficiency.

[0059] In this embodiment, by providing the first graphene sheet 40, not only can the propagation of electromagnetic noise to the outside be effectively hindered, achieving good electromagnetic compatibility, but also the thermal conduction impedance on the heat conduction channel can be reduced, and the heat dissipation efficiency can be improved.

[0060] In some embodiments, the thickness of the first graphene sheet 40 ranges from 0.5 mm to 2 mm. For example, the thickness of the first graphene sheet 40 can be 0.5 mm, 0.7 mm, 0.9 mm, 1.2 mm, 1.5 mm, 1.7 mm, 1.9 mm, 2 mm, or in the range consisting of any of the above values.

[0061] Generally, the thicker the first graphene sheet 40, the higher its strength, but the larger the installation space required, and the more material is wasted. Conversely, the thinner the first graphene sheet 40, the lower its strength, and the smaller the installation space required. Furthermore, the inventors found that when the thickness of the first graphene sheet 40 is less than 0.5 mm, its strength is low, making it prone to breakage, resulting in lower electromagnetic impedance and reduced performance in hindering electromagnetic noise transmission, which is detrimental to achieving electromagnetic compatibility. In addition, an excessively thin first graphene sheet 40 is difficult to fix to the heat sink 50, increasing the assembly process burden. The inventors also found that when the thickness of the first graphene sheet 40 is greater than 2 mm, it is not conducive to miniaturization design and also results in material waste.

[0062] Therefore, controlling the thickness of the first graphene sheet 40 within the range of 0.5mm to 2mm can balance the issues of strength, assembly process, and material waste.

[0063] In some embodiments, the surface of the first graphene sheet 40 near the heat sink 50 is provided with an adhesive backing (not shown). The adhesive backing includes an adhesive layer formed by coating an adhesive onto the surface of the graphene sheet. In some embodiments, the adhesive backing is covered by release paper, which is removed by an operator when installing the first graphene sheet 40, and then the sheet is adhered to the heat sink 50 by the adhesive backing.

[0064] In this embodiment, the first graphene sheet 40 has its own adhesive backing, which makes it easy for operators to fix the first graphene sheet 40 to the heat sink 50 with the adhesive backing, thereby facilitating the installation of the first graphene sheet 40 without increasing the burden of the assembly process.

[0065] In some embodiments, the first graphene sheet 40 completely covers the first elastic thermally conductive sheet 30. For example, as shown... Figure 3 As shown, the length and width of the first elastic heat-conducting sheet 30 are approximately the same as the length and width of the electronic device 20; the length and width of the first graphene sheet 40 are both greater than the length and width of the first elastic heat-conducting sheet 30, and the area of ​​the surface of the first graphene sheet 40 that contacts the first elastic heat-conducting sheet 30 is greater than the area of ​​the surface of the first elastic heat-conducting sheet 30 that contacts the graphene sheet 40.

[0066] like Figure 4 As shown, the projection of the first elastic heat-conducting sheet 30 on the circuit board 10 lies within the projection of the first graphene sheet 40 on the circuit board 10. That is, in the projection direction, the first graphene sheet 40 covers the first elastic heat-conducting sheet 30. Thus, on the one hand, the larger area of ​​the first graphene sheet 40 can completely shield the electronic device 20, thereby significantly hindering the conduction of electromagnetic noise to the outside in the first direction, reducing electromagnetic noise leakage, and improving electromagnetic compatibility. On the other hand, the larger area of ​​the first graphene sheet 40 can quickly disperse the heat from the first elastic heat-conducting sheet 30 and conduct it to the heat sink 50, which helps improve heat dissipation efficiency.

[0067] In some embodiments, referring to Figure 5 , the electronic device 100 further comprises a second elastic heat-conducting sheet 60, which is arranged on the side of the circuit board 10 away from the electronic component 20, and the second elastic heat-conducting sheet 60 is opposite to the electronic component 20.

[0068] The second elastic heat-conducting sheet 60 is the same as the first elastic heat-conducting sheet 30, and the material and performance of the second elastic heat-conducting sheet 60 can refer to the description of the first elastic heat-conducting sheet 30. For example, the second elastic heat-conducting sheet 60 comprises a heat-conducting silica gel sheet. The thickness of the heat-conducting silica gel sheet ranges from 0.5mm to 15mm.

[0069] It can be understood that the electronic component 20 is mounted on the circuit board 10, and the area on the back of the circuit board 10 away from the electronic component 20 and corresponding to the electronic component 20 can not be arranged with other electronic components, so that the second elastic heat-conducting sheet 60 can be arranged in the area. The second elastic heat-conducting sheet 60 can quickly conduct the heat concentrated on the electronic component 20 to the outside through the base material of the circuit board 10 and the second elastic heat-conducting sheet 60, so as to achieve high-efficiency heat dissipation.

[0070] That is, the heat generated by the electronic component 20 can be dissipated through two heat dissipation channels, the first heat dissipation channel comprising the first elastic heat-conducting sheet 30, the first graphene sheet 40 and the heat-dissipating piece 50, and the second heat dissipation channel comprising the base material of the circuit board 10 and the second elastic heat-conducting sheet 60. In this way, the heat generated by the electronic component 20 can be dissipated through double-sided heat dissipation channels, so as to improve the heat dissipation efficiency and heat dissipation effect.

[0071] In other embodiments, without affecting the layout of the circuit board 10, the area of the second elastic heat-conducting sheet 60 can be larger than the area of the electronic component 20 on the circuit board 10, so as to improve the heat dissipation efficiency.

[0072] In some embodiments, as shown in Figure 5 , the electronic device 100 further comprises a support plate 80 and a second graphene sheet 70, and the second graphene sheet 70 is arranged on one side of the support plate 80.

[0073] The support plate 80 is used to support the circuit board 10. The circuit board 10 is fixed on the support plate 80, for example, by screws or buckles. When the circuit board 10 is fixed on the support plate 80, the second graphene sheet 70 is at least partially in contact with the second elastic heat-conducting sheet 60. In some embodiments, the support plate 80 can be a metal material, for example, an aluminum plate. On the one hand, the support plate 80 provides reliable support for the circuit board 10. On the other hand, the support plate 80 can also act as a heat dissipation member 50 to dissipate heat. The heat is conducted to the support plate 80 with a larger area through the second elastic heat-conducting sheet 60 and the second graphene sheet 70, which is conducive to heat dissipation, thereby improving the heat dissipation efficiency and heat dissipation effect.

[0074] The second graphene sheet 70 is the same as the first graphene sheet 40. The material and performance of the second graphene sheet 70 can be referred to the description of the first graphene sheet 40. For example, the thickness of the second graphene sheet 70 ranges from 0.5 mm to 2 mm. The second graphene sheet 70 with the thickness range can balance the strength, assembly process, and material waste problem. For example, the second graphene sheet 70 is provided with an adhesive on the surface close to the support plate. The second graphene sheet 70 is provided with an adhesive, which facilitates the operator to fix the second graphene sheet 70 on the support plate through the adhesive, thereby facilitating the installation of the second graphene sheet 70 and not increasing the burden of the assembly process.

[0075] Based on the fact that the second elastic heat-conducting sheet 60 is arranged on the back surface of the circuit board 10 away from the electronic device 20 and corresponds to the position occupied by the electronic device 20, the second graphene sheet 70 is at least partially in contact with the second elastic heat-conducting sheet 60. It can be known that the second graphene sheet 70 is located in the second direction of the electronic device 20 (the direction away from the circuit board 10 from the back surface of the circuit board 10) and shields at least a part of the electronic device 20. Therefore, the electromagnetic noise radiated by the electronic device 20 in the second direction can be hindered from propagating by the second graphene sheet 70, thereby reducing the electromagnetic noise leakage.

[0076] In this embodiment, by hindering the propagation of electromagnetic noise from both sides, the electromagnetic noise leakage can be effectively reduced, and the electromagnetic compatibility can be improved. In addition, the second graphene sheet 70 can quickly conduct the heat from the second elastic heat-conducting sheet 60 to the support plate 80, thereby achieving rapid heat dissipation.

[0077] Understandably, in this embodiment, the area of ​​the surface of the second graphene sheet 70 in contact with the second elastic heat-conducting sheet 60 is greater than or equal to the area of ​​the surface of the second elastic heat-conducting sheet 60 in contact with the second graphene sheet 70, and the second graphene sheet 70 completely covers the second elastic heat-conducting sheet 60. Thus, on the one hand, the larger area of ​​the second graphene sheet 70 can completely shield the electronic device 20, thereby significantly hindering the conduction of electromagnetic noise to the outside in the second direction, reducing electromagnetic noise leakage, and improving electromagnetic compatibility. On the other hand, the larger area of ​​the second graphene sheet 70 can quickly disperse the heat concentrated on the second elastic heat-conducting sheet 60 and conduct it to the support, which is beneficial for improving heat dissipation efficiency.

[0078] In some embodiments, such as Figure 1 As shown, the electronic device 100 also includes a housing 90, and a support plate 80 is part of the housing 90. Exemplarily, the circuit board 10 is directly mounted to the housing 90 by screws or clips. By reusing the structure of the electronic device 100, support for the circuit board 10 and heat dissipation for the electronic components 20 can also be achieved. Furthermore, it is beneficial to simplify the structure of the electronic device 100 and save its internal space.

[0079] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them; under the concept of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of this application as described above, which are not provided in detail for the sake of brevity; although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An electronic device comprising a circuit board, an electronic component, and a heat dissipating member, the electronic component being electrically connected to the circuit board, characterized in that, The application relates to an electronic device, comprising: a first elastic heat-conducting sheet arranged on the side of the heat-dissipating member away from the circuit board; a first graphene sheet arranged on the side of the heat-dissipating member close to the circuit board, the first graphene sheet being used for hindering electromagnetic noise conduction and heat conduction; the first graphene sheet is at least partially in contact with the first elastic heat-conducting sheet.

2. The electronic device of claim 1, wherein, The thickness of the first graphene sheet ranges from 0.5 mm to 2 mm.

3. The electronic device of claim 1, wherein, The surface of the first graphene sheet close to the heat-dissipating member is provided with back glue.

4. The electronic device of claim 1, wherein, The first elastic heat-conducting sheet comprises a heat-conducting silica gel sheet.

5. The electronic device of claim 4, wherein, The thickness of the heat-conducting silica gel sheet ranges from 0.5 mm to 15 mm.

6. The electronic device of any of claims 1-5, wherein, The first graphene sheet completely covers the first elastic heat-conducting sheet.

7. The electronic device of claim 6, wherein, The application further comprises a second elastic heat-conducting sheet arranged on the side of the circuit board away from the electronic device, and the second elastic heat-conducting sheet is opposite to the electronic device.

8. The electronic device of claim 7, wherein, The application further comprises a support plate and a second graphene sheet arranged on one side of the support plate; the circuit board is arranged on the support plate, the second graphene sheet is at least partially in contact with the second elastic heat-conducting sheet, and the second graphene sheet is used for hindering electromagnetic noise conduction and heat conduction.

9. The electronic device of claim 8, wherein, The thickness of the second graphene sheet ranges from 0.5 mm to 2 mm, and / or the surface of the second graphene sheet close to the support plate is provided with back glue.

10. The electronic device of claim 8 or 9, wherein, The application further comprises a shell, and the support plate is a part of the shell.

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