Data center energy management system

Abstract

The invention discloses an energy management system of a data center. The energy management system comprises a liquefied air energy storage module, a chip cooling module and a control and energy management module, the liquefied air energy storage module is used for inputting electric power to compress air into a liquid state for electric power storage in an energy storage stage of an electric power sufficient period or an electricity price valley period, and releasing a stored medium to cool the chip cooling module and / or generate electricity in an energy release-cooling cooperation stage of an electric power shortage period or an electricity price peak period; the chip cooling module is used for cooling the IT equipment to be cooled by the stored medium; and the control and energy management module is used for monitoring an environment state in real time, determining a signal entering an energy release-cooling coordination stage, and coordinating energy interaction of the power grid, the renewable energy source and the liquefied air energy storage module, so that energy storage and cooling coordination is realized, the comprehensive energy efficiency is improved, and the requirements of a high-density data center are met.

Description

Technical Field

[0001] This invention relates to the field of data center energy management and cooling technology, and specifically to a data center energy management system. Background Technology

[0002] With the development of the digital economy, the demand for computing power in data centers has surged, and the contradiction between their high energy consumption and high heat dissipation requirements and low energy utilization efficiency and poor cooling system efficiency has become increasingly prominent.

[0003] On the one hand, data centers require a continuous and stable power supply. Existing energy storage solutions mostly rely on battery energy storage, which suffers from short lifespan, high cost, and insufficient capacity to adapt to large-scale, long-term energy storage needs, and also fails to coordinate with cooling requirements. On the other hand, the high-density operation of IT equipment generates a large amount of heat. Traditional air-cooling and liquid-cooling systems have limited cooling efficiency and require additional electricity, further increasing energy consumption. At the same time, the significant difference between peak and off-peak electricity prices means that data centers have high operating costs during peak electricity price periods and cannot effectively absorb renewable energy sources such as photovoltaic and wind power, leading to energy waste and increased carbon emissions. Summary of the Invention

[0004] The purpose of this invention is to provide a data center energy management system, comprising: a liquefied air energy storage module, a chip cooling module, and a control and energy management module; the liquefied air energy storage module is used to input electricity to compress air into a liquid state for energy storage during the energy storage phase when electricity is abundant or during off-peak hours, and to release the stored medium to cool the chip cooling module and / or generate electricity during the energy release-cooling coordination phase when electricity is scarce or during peak hours; the chip cooling module is used to cool the IT equipment to be cooled using the stored medium; the control and energy management module is used to monitor the environmental status in real time, determine the signal to enter the energy release-cooling coordination phase, and coordinate the energy interaction between the power grid, renewable energy sources, and the liquefied air energy storage module.

[0005] The liquefied air energy storage module includes a compression module, a liquefaction module, a liquid air storage module, a vaporization module, an expansion module, a heat storage module, and a cold storage module. The compression module compresses input air using the input electricity. The liquefaction module liquefies the compressed high-temperature, high-pressure air into a liquid state using the cold energy released by the cold storage module. The liquid air storage module stores the liquid air generated by the liquefaction module. The heat storage module stores the heat of compression generated by the compression module. The vaporization module vaporizes the liquid air stored in the liquid air storage module. The expansion module generates electricity using the vaporized air from the vaporization module and the air cooled by the chip cooling module.

[0006] The input power includes: prioritizing the dispatch of electricity output from the renewable energy source, and then connecting it to the grid as needed; the control and energy management module is also used to: determine that the renewable energy source has power output, prioritize the use of the renewable energy power for cooling, and use the correspondingly reduced medium to increase power generation; the control and energy management module is also used to: use part of the power output from the power generation for the operation of the IT equipment, and feed the other part back to the grid.

[0007] The control and energy management module is also used to monitor the server IT load, chip temperature, liquefied air tank level in the liquid air storage module, and grid power supply capacity in real time, and allocate the proportion of liquid air used for cooling and power generation according to the monitoring results.

[0008] The chip cooling module includes a direct immersion unit and a cold plate cooling unit; the cold energy stored in the cold storage module is used to cool the chip cooling module; liquid air is used as a supplement to the cold energy or directly as a cooling medium to cool the chip cooling module; the liquid air cools the IT equipment in the direct immersion unit, and after vaporization, it is introduced into the expansion module; the liquid air cools the IT equipment in the cold plate cooling unit, and after vaporization, it is introduced into the expansion module.

[0009] In the energy storage phase, the chip cooling module only activates the cold plate cooling unit to cool it using the cooling capacity provided by the cold storage module; in the energy release-cooling synergy phase, the vaporization module uses the heat of compression stored in the heat storage module to vaporize the liquid air.

[0010] The chip cooling module is a duct-type cooling unit; the vaporization module includes a first-stage heat exchanger and a second-stage heat exchanger; when the control and energy management module detects that the temperature of the IT device exceeds a preset threshold, it uses low-temperature air to cool the chip cooling module; the first-stage heat exchanger is pre-cooled using the cold energy stored in the cold storage module; the first-stage heat exchanger receives the liquid air input from the liquid air storage module and uses the cold energy to initially vaporize it; the second-stage heat exchanger exchanges heat with the ambient air to form the low-temperature air after initial vaporization.

[0011] The compression module employs a three-stage screw compressor; the liquefaction module uses a throttling expansion and plate-fin heat exchanger; the liquid air storage module uses a vacuum-insulated cryogenic storage tank; the vaporization module uses a shell-and-tube vaporizer; the expansion module uses a screw expander; the heat storage module is a high-temperature phase change heat storage tank filled with molten salt; and the cold storage module is a low-temperature cold storage tank filled with an aqueous ethylene glycol solution.

[0012] In the chip cooling module, the direct immersion unit adopts a sealed cooling chamber, the chamber body is made of polytetrafluoroethylene insulating material, the bottom of the cooling chamber is provided with a liquid air inlet, and the top is provided with a vaporized air outlet; the cold plate cooling unit adopts a microchannel cold plate, which is attached to the surface of the server CPU / GPU through a thermal interface material.

[0013] The chip cooling module adopts a duct-type structure, with a sealed duct on the outside of the server array. The duct inlet is connected to the low-temperature air outlet of the vaporization module. A centrifugal fan is installed inside the duct, and the inner wall of the duct is lined with an insulation layer. The vaporization module is composed of a series of shell-and-tube heat exchangers in stages. The first-stage heat exchanger is connected to the cold storage module, and the second-stage heat exchanger exchanges heat with the ambient air to ensure that the liquid air vaporizes to form low-temperature air at a stable temperature.

[0014] This invention integrates a liquid air energy storage module, a chip cooling module, and a control and energy management module to construct an integrated system for coordinated energy storage and cooling. This effectively addresses the shortcomings of traditional data centers in energy utilization, cooling efficiency, and system management, achieving improvements in multiple technical aspects. In terms of energy utilization, the system prioritizes the dispatch of electricity from renewable energy sources, reducing direct dependence on grid power. Simultaneously, by storing energy during off-peak hours and releasing it for cooling and power generation during peak hours, the system reduces electricity costs for data centers during periods of high electricity prices, minimizing unnecessary energy consumption. Furthermore, the liquid air energy storage module's thermal storage module stores and recycles compression heat, while the cold storage module stores and recycles cold energy, further reducing energy loss and improving overall energy efficiency.

[0015] In terms of cooling performance, the chip cooling module offers three heat exchange methods that can be adapted to the heat dissipation needs of ultra-high density, medium-high density, and medium-low density IT equipment, respectively, ensuring that different types of IT equipment can operate in a stable temperature environment and avoid equipment failure or performance degradation due to excessive temperature. Liquid air, as a cooling medium or cold energy supplement, has higher heat dissipation efficiency than traditional air cooling and mechanical cooling methods, which can meet the growing heat dissipation needs of high-density data centers.

[0016] At the system management level, the control and energy management module monitors server IT load, chip temperature, liquid air tank level, and grid power supply capacity in real time. Based on the monitoring results, it dynamically adjusts the ratio of liquid air used for cooling and power generation. While prioritizing the cooling needs of IT equipment, it flexibly adapts to changes in power supply and demand, improving the stability and flexibility of system operation. Furthermore, the system integrates energy storage and cooling functions, eliminating the need for separate energy storage and cooling equipment. This not only reduces the space occupied by data center equipment and lowers initial investment costs but also simplifies equipment operation and maintenance processes, promoting the development of data centers towards green, efficient, compact, and reliable architectures. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the data center energy management system structure under the first heat exchange method and the second heat exchange method.

[0019] Figure 2 This is a schematic diagram of the direct immersion unit structure under the first heat exchange method.

[0020] Figure 3 This is a schematic diagram of the cold plate cooling unit structure under the second heat exchange method.

[0021] Figure 4 This is a schematic diagram of the data center energy management system under the third heat exchange method.

[0022] Figure 5 This is a schematic diagram of a duct-type chip cooling unit structure under the third heat exchange method. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0024] Before describing the data center energy management system of the present invention in conjunction with the accompanying drawings, it is necessary to clarify the three ways in which the chip cooling module realizes heat exchange. These three methods are adapted to the equipment insulation requirements, heat dissipation requirements and density scenarios of different data centers, and their principles and adaptable modules have their own characteristics.

[0025] The first heat exchange method is direct immersion cooling with liquid air. This method uses liquid air as the direct cooling medium, completely immersing the IT equipment to be cooled in liquid air within a sealed cooling chamber. The heat generated by the IT equipment is directly absorbed by the liquid air, causing a gas-liquid phase change. During this phase change, the heat is efficiently carried away from the equipment, achieving rapid cooling. The resulting high-pressure, low-temperature air is then piped out and ultimately introduced into the expansion module of the liquefied air energy storage module to participate in subsequent combined power generation, achieving secondary recovery and utilization of cold and pressure energy.

[0026] This method corresponds to the direct immersion unit in the chip cooling module. This unit uses a sealed cooling chamber made of PTFE insulating material. The bottom of the cooling chamber has a liquid air inlet, which branches off to the outlet pipe of the liquid air storage module to ensure stable medium input. The top has a vaporized air outlet, which connects to the expansion module inlet via an insulated pipe to ensure efficient delivery of vaporized air. It is suitable for the cooling needs of ultra-high-density IT equipment, such as AI computing clusters and supercomputing center computing modules. It achieves high heat dissipation capacity while keeping chip temperature fluctuations within a small range, meeting high-precision thermal management requirements. This method can dissipate heat up to 1000W / cm², quickly removing the heat generated by ultra-high-density IT equipment. Under stable operation, chip temperature fluctuations can be controlled within ±2℃, meeting the high-precision thermal management requirements of AI computing clusters and supercomputing centers.

[0027] The second heat exchange method is indirect cooling with a liquid air cold plate. This method uses a cold plate as a heat transfer medium. First, the microchannel cold plate is tightly bonded to the high-heat-generating parts of the IT equipment using a thermal interface material to ensure efficient heat transfer. Then, liquid air is introduced into the microchannels inside the cold plate. As the liquid air flows within the channels, it absorbs the heat conducted by the IT equipment from the cold plate, undergoing a gas-liquid phase change and heating up. The vaporized high-pressure air flows out from the cold plate outlet and merges with the high-pressure, low-temperature air from the first heat exchange method. Together, they are connected to the expansion module to participate in power generation. Simultaneously, the cold plate maintains a stable surface temperature of the IT equipment through phase change cooling. Thermal interface materials include thermally conductive grease, thermally conductive gel, thermally conductive silicone pads, and thermally conductive foam. Thermally conductive grease is preferred in this invention because the heat dissipation efficiency of the liquid air cold plate depends on a seamless fit between the cold plate and the heat-generating surface of the IT equipment. Even with tight assembly achieved through mechanical pressure, micron-level gaps will still exist at the contact surface, and the extremely low thermal conductivity of air will create significant interfacial thermal resistance. Thermal grease is a paste-like fluid with excellent leveling and wetting properties. It can actively fill these tiny gaps, completely expel air between interfaces, and directly establish an efficient heat conduction path between the heating surface of IT equipment and the cold plate. This is a core advantage that is difficult to replace by materials such as thermally conductive silicone pads and thermally conductive foam. It can minimize interfacial thermal resistance and ensure that heat is quickly transferred to the cold plate.

[0028] This method corresponds to the cold plate cooling unit in a chip cooling module. The cold plate is made of a metal alloy with a high thermal conductivity and features a dense microchannel design to increase the contact area with liquid air. The cold plate inlet is connected to the liquid air storage module pipeline via an electromagnetic shut-off valve, and the outlet is connected to the expansion module inlet via a manifold. A flow sensor is installed on the pipeline, and the control and energy management module adjusts the liquid air input in real time to match the dynamic heat dissipation needs of the IT equipment. It is suitable for medium- to high-density IT equipment in scenarios with high requirements for equipment sealing, such as financial data centers and enterprise-level server clusters. It can achieve good heat dissipation capacity while ensuring the insulation safety of the equipment, balancing cooling efficiency and equipment reliability. This method has a heat dissipation capacity of 3000W / cm². Through the tight fit between the microchannel cold plate and the heat-generating components, heat can be efficiently transferred, ensuring stable surface temperature of medium- to high-density IT equipment and preventing temperature fluctuations from affecting equipment performance.

[0029] The third heat exchange method is low-temperature air duct convection cooling. This method first vaporizes the liquid air, then uses the vaporized low-temperature air as the cooling medium. After being extracted from the storage module, the liquid air first enters the staged heat exchanger of the vaporization module. After two stages of heat exchange, it vaporizes and stabilizes at a preset low temperature, forming low-temperature air. Subsequently, the low-temperature air is sent by a centrifugal fan into the sealed duct of the chip cooling module. The duct surrounds the server array. As the low-temperature air flows over the surface of the IT equipment within the duct, it absorbs heat from the equipment and heats up through convection heat exchange. The heated air is then discharged from the duct outlet and directly introduced into the expansion module to generate electricity, completing the closed loop of cooling and energy recovery.

[0030] This approach corresponds to the duct-type cooling unit in a chip cooling module. This unit includes a sealed, insulated duct surrounding the server array, a centrifugal fan at the duct inlet, and a temperature sensor inside the duct. The vaporization module consists of two-stage shell-and-tube heat exchangers connected in series. The first-stage heat exchanger utilizes the cooling capacity of the cold storage module to initially vaporize the liquid air, while the second-stage heat exchanger regulates the temperature through heat exchange with ambient air, ensuring a stable output low-temperature air temperature. It is suitable for low- to medium-density IT equipment where direct contact with liquid media is strictly limited, such as storage servers and network switching equipment in traditional data centers. It provides a certain level of heat dissipation while avoiding the risk of equipment failure due to direct contact with liquid air, thus extending equipment maintenance cycles. This method has a heat dissipation capacity of 100W / cm². During the energy storage phase, the temperature inside the duct can be maintained between -40℃ and 35℃, providing a stable cooling environment for low- to medium-density IT equipment while avoiding the risk of equipment failure due to direct contact with liquid media.

[0031] For the low-temperature air duct convection cooling method, the vaporization module's staged vaporization submodule consists of shell-and-tube heat exchangers connected in series. The first-stage heat exchanger is connected to the cold storage module. Before the system starts the cooling process, the cold energy released by the cold storage module pre-cools the first-stage heat exchanger, preparing it for the initial vaporization of liquid air. When liquid air enters the first-stage heat exchanger from the liquid air storage module, it completes initial vaporization under the action of the cold energy. The initially vaporized air enters the second-stage heat exchanger, where it exchanges heat with the ambient air. By absorbing heat from the ambient air, the temperature of the initially vaporized air is adjusted to a stable range, ensuring that the final low-temperature air temperature output to the duct-type cooling unit meets the chip cooling requirements, avoiding excessively low temperatures that could cause condensation on the chip or excessively high temperatures that could affect the cooling effect.

[0032] All three heat exchange methods are dynamically regulated through the control and energy management module. During the energy release-cooling synergy phase, cooling demand is prioritized while the amount of liquid air is flexibly allocated. During the energy storage phase, the direct immersion unit of the first heat exchange method is suspended, and only the cold plate cooling unit of the second heat exchange method is activated. The cooling capacity of the cold storage module is used to maintain basic heat dissipation, reduce liquid air waste, and ensure that the system energy efficiency is at its best.

[0033] Below, in conjunction with Figures 1-5 The data center energy management system of the present invention will be described. Figure 1 This is a schematic diagram of the data center energy management system structure under the first heat exchange method and the second heat exchange method.

[0034] like Figure 1 As shown, the data center energy management system of the present invention includes: a liquefied air energy storage module, a chip cooling module, and a control and energy management module; the liquefied air energy storage module is used to input electricity to compress air into a liquid state for energy storage during the energy storage phase when electricity is abundant or the electricity price is low, and to release the stored medium to cool the chip cooling module and / or generate electricity during the energy release-cooling coordination phase when electricity is scarce or the electricity price is high; the chip cooling module is used to cool the IT equipment to be cooled using the stored medium; the control and energy management module is used to monitor the environmental status in real time, determine the signal to enter the energy release-cooling coordination phase, and coordinate the energy interaction between the power grid, renewable energy sources, and the liquefied air energy storage module.

[0035] Specifically, Figure 1 The structure of the air liquefaction (ALS) energy storage module includes a compression module, a liquefaction module, a liquid air storage module, a vaporization module, an expansion module, a thermal storage module, and a cold storage module. The compression module compresses the input air using electricity, transferring the heat generated during compression to the thermal storage module, which stably stores the heat of compression for later use. The compressed, high-temperature, high-pressure air then enters the liquefaction module, which employs a throttling expansion and plate-fin heat exchanger. The air liquefaction is completed using the cooling capacity released by the cold storage module, which continuously provides a stable cold source. The liquefied air is then transported to the liquid air storage module, a vacuum-insulated cryogenic tank that effectively maintains a low-temperature environment and prevents vaporization loss. During the energy release-cooling synergy phase, the liquid air is transported through pipelines to the vaporization module, which uses a shell-and-tube vaporizer. The vaporized air, along with air discharged from the chip cooling module, enters the expansion module, a screw-type expander that generates electricity through air drive.

[0036] The performance parameters of each submodule of the liquefied air energy storage module are as follows: The compression module uses four three-stage screw compressors with a total discharge capacity of 800 m³ / h, which can meet the high-efficiency requirements of air compression; the liquefaction module adopts a combination of throttling expansion and plate-fin heat exchangers, with a cooling capacity of 500 kW, which can quickly liquefy the high-temperature and high-pressure compressed air; the liquid air storage module is a 100 m³ vacuum insulated cryogenic storage tank, with an operating temperature maintained at -196℃ and a design pressure of 0.8 MPa, which can stably store liquid air and reduce vaporization losses; the expansion module is equipped with two 1.5 MW screw expanders, with a total power generation capacity of 3 MW, which can efficiently convert the pressure energy of vaporized air into electrical energy; the energy storage efficiency of the entire liquefied air energy storage module is about 65%, which can achieve efficient energy storage and conversion under typical data center operating conditions.

[0037] The cryogenic pipeline of the liquefied air energy storage module adopts a double-layer vacuum insulation structure and is equipped with a leakage alarm device. When the leakage alarm device detects a liquid air leak, the control and energy management module will respond immediately, closing the electromagnetic shut-off valves before and after the leak point to cut off the liquid air delivery path. Simultaneously, it will activate the ventilation system near the pipeline to accelerate air circulation in the leak area, preventing freezing damage or abnormal increases in local oxygen concentration that could lead to safety risks. The vacuum-insulated cryogenic storage tank of the liquid air storage module is equipped with a safety valve on top. When the pressure inside the tank exceeds the design pressure due to the accumulation of liquid air vaporization, the safety valve automatically opens to release pressure. The released gas is led to a safe outdoor area through a dedicated exhaust pipeline, preventing damage from overpressure and ensuring the stable operation of the entire energy storage module under cryogenic and high-pressure conditions.

[0038] Chip cooling module in Figure 1 The unit is divided into a direct immersion unit and a cold plate cooling unit, which correspond to the first and second heat exchange methods, respectively. Figure 2 This is a schematic diagram of the direct immersion unit structure under the first heat exchange method. (Example) Figure 2 As shown, the direct immersion unit is a sealed cooling chamber. The IT equipment to be cooled is placed inside the chamber. The bottom of the chamber has a liquid air inlet, and the top has a vaporized air outlet. Liquid air enters through the inlet, directly contacts the IT equipment, and absorbs heat. The vaporized, high-pressure, low-temperature air is then discharged through the outlet and connected to an expansion module to participate in power generation. This method achieves highly efficient heat dissipation and is suitable for ultra-high-density IT equipment. It can control chip temperature fluctuations within a small range, meeting high-precision thermal management requirements.

[0039] Figure 3 This is a schematic diagram of the cold plate cooling unit structure under the second heat exchange method. (Example) Figure 3As shown, the cold plate cooling unit employs a microchannel cold plate. The cold plate is tightly bonded to the surface of heat-generating components such as the server CPU and GPU using thermally conductive silicone grease. Liquid air enters the internal channels of the cold plate, absorbs heat, and vaporizes. The vaporized air then flows into the expansion module. The microchannel design of the cold plate increases the heat exchange area and improves heat transfer efficiency. While ensuring the insulation safety of the equipment, it can adapt to the cooling needs of medium- and high-density IT equipment, balancing cooling performance and equipment reliability. During the energy storage phase, the chip cooling module only activates the cold plate cooling unit, utilizing the cooling capacity provided by the cold storage module for basic cooling, avoiding unnecessary consumption of liquid air and reducing energy waste during the energy storage phase.

[0040] During the energy release-cooling coordination phase, the control and energy management module allocates liquid air according to the principle of prioritizing cooling. After being output from the storage module, the liquid air first meets the needs of the chip cooling module. A portion of the liquid air enters the direct immersion unit, where it vaporizes after direct heat exchange with the server chip. Another portion enters the cold plate cooling unit, where it vaporizes after heat exchange with the chip through the cold plate channels. Once the cooling requirements are met, the remaining liquid air enters the vaporization module, where it vaporizes after heat exchange with the compressed heat released by the heat storage module. Subsequently, it merges with the high-pressure, low-temperature air generated by the vaporization of the cooling module and together enters the expansion module to drive power generation. If the chip temperature is below the cooling requirement threshold, the control module reduces the amount of liquid air entering the cooling module and correspondingly increases the amount of liquid air entering the vaporization module to improve power output. If the chip temperature is close to or exceeds the cooling requirement threshold, the amount of liquid air entering the cooling module is increased to ensure that the chip temperature remains stable within a safe range.

[0041] The control and energy management module, presented as an integrated control unit in Figure 1, connects sensors and actuators of various system modules via wiring. It monitors key parameters in real time, such as server IT load, chip temperature, liquid air storage tank level, and grid power supply capacity. Based on this monitoring data, the control module intelligently allocates the ratio of liquid air used for cooling and power generation, prioritizing the cooling needs of IT equipment and adjusting power output based on the remaining medium. Simultaneously, this module coordinates energy interaction between the grid and renewable energy sources, prioritizing the dispatch of electricity from renewable energy sources. If renewable energy has power output, it will be prioritized for cooling, thus reducing liquid air consumption. The saved liquid air can be used to increase power output, further improving the system's energy efficiency and economy.

[0042] The system can integrate renewable energy generation equipment such as photovoltaic and wind power. The control and energy management module will prioritize the dispatch of electricity output from renewable energy sources. For photovoltaic energy, during daytime photovoltaic output, it is prioritized for the operation of chip cooling modules, such as supplying fans to equipment like cold plate cooling units and duct-type cooling units. If photovoltaic output exceeds cooling demand, the excess electricity will drive the compression and liquefaction modules of the liquefied air energy storage module to convert electrical energy into liquid air for storage, replenishing the liquefied air storage module's reserves. For wind power, when wind power is at its peak output, the control module will dynamically adjust the operating time of the energy storage phase, prioritizing the activation of the air liquefaction process. This utilizes wind power to complete air compression and liquefaction, reducing dependence on grid electricity and further enhancing the system's ability to absorb renewable energy.

[0043] The system's energy storage phase and energy release-cooling synergy phase are set to fixed time periods based on electricity prices and grid load characteristics. The energy storage phase is from 23:00 to 7:00 the next day, which is during the off-peak electricity price period, prioritizing the use of low-cost electricity for air compression and liquefaction storage. The energy release-cooling synergy phase is from 10:00 to 15:00 and from 18:00 to 22:00 daily, which correspond to the peak electricity price and high grid load periods, during which liquid air is released for cooling and power generation.

[0044] Meanwhile, the control and energy management module has the ability to regulate abnormal operating conditions. When the temperature around the liquid air pipeline is detected to be below -50℃ or the oxygen concentration in the air is detected to be above 23%, it is determined to be a liquid air leak. The electromagnetic shut-off valves before and after the leak point are immediately closed, and the explosion-proof ventilation system near the pipeline is activated within 1 second and continues to operate until the oxygen concentration in the leak area recovers to below 21%. When the output of renewable energy is detected to drop by more than 30% within 1 minute, it is determined to be a sudden drop in output. The amount of liquid air supplied to the chip cooling module is increased within 10 seconds, and the expansion module is activated to generate electricity at full load to make up for the energy supply gap. When the liquid level in the liquid air storage module tank is below 20%, it is determined to be too low. The proportion of liquid air used for cooling is automatically reduced to 50%, and the remaining medium is reserved to cope with sudden cooling needs, so as to avoid the depletion of medium and affect the safe operation of IT equipment.

[0045] Through such an overall structural design Figure 1 The system shown can achieve coordinated operation of energy storage and cooling, effectively improving the overall energy efficiency of data centers, adapting to the operational needs of high-density data centers, while reducing energy waste and carbon emissions, and promoting the development of data centers towards a green and efficient direction.

[0046] According to an embodiment of the present invention, a liquefied air energy storage module includes a compression module, a liquefaction module, a liquid air storage module, a vaporization module, an expansion module, a heat storage module, and a cold storage module. The compression module is used to compress input air using the input electricity. The liquefaction module is used to liquefy the compressed high-temperature and high-pressure air into a liquid state using the cold energy released by the cold storage module. The liquid air storage module is used to store the liquid air generated by the liquefaction module. The heat storage module is used to store the heat of compression generated by the compression module. The vaporization module is used to vaporize the liquid air stored in the liquid air storage module. The expansion module is used to generate electricity using the air vaporized by the vaporization module and the air cooled by the chip cooling module.

[0047] Specifically, the compression module uses a three-stage screw compressor. This type of compressor has the characteristics of multi-stage compression and stable pressure, and can adapt to the compression requirements of air from normal pressure to high pressure. After receiving the input power, the outside air is drawn into the compression chamber through the meshing rotation of the screw rotor. After three stages of gradual compression, high temperature and high pressure air is formed. The heat generated during the compression process is discharged through the compressor's own heat exchange channel to avoid the internal temperature of the module being too high and affecting the operational stability. At the same time, it provides a source of heat storage for the subsequent heat storage module.

[0048] The liquefaction module adopts a structure combining throttling expansion and plate-fin heat exchanger. After the high-temperature and high-pressure air is output from the compression module, it first enters the throttling expansion component, where the pressure drops sharply to achieve initial cooling. Then it enters the hot side flow channel of the plate-fin heat exchanger. At this time, the cold storage module delivers low-temperature cold energy to the cold side flow channel of the plate-fin heat exchanger through the cold energy delivery pipeline. The cold energy and the high-pressure air on the hot side undergo efficient heat exchange through the fins, which gradually reduces the temperature of the high-pressure air to below -196℃, and finally liquefies it to form liquid air. The entire liquefaction process relies on the high heat exchange efficiency of the plate-fin heat exchanger to reduce cold energy loss and ensure stable liquefaction effect.

[0049] The liquid air storage module uses a vacuum-insulated cryogenic storage tank. The inner wall of the tank is made of stainless steel and treated with cryogenic insulation. The outer layer is wrapped with multiple layers of insulation material, and a vacuum environment is created in the middle to minimize the transfer of external heat and prevent the liquid air from evaporating and being lost due to heat absorption. The tank is equipped with a liquid level monitoring device to provide real-time feedback on the liquid air storage volume. This provides data support for the control and energy management module to judge the energy storage status and schedule the energy release process. At the same time, the bottom of the tank is equipped with an anti-deposition structure to prevent the accumulation of impurities in the liquid air during long-term storage and to ensure the smooth flow of subsequent delivery pipelines.

[0050] The thermal storage module uses a high-temperature phase change thermal storage tank, which is filled with molten salt as the thermal storage medium. Molten salt has the characteristics of high specific heat capacity and high stability, and can store heat for a long time at high temperatures without easily deteriorating. The compression heat exported from the compression module is transferred to the molten salt through heat exchange coils, which raises the temperature of the molten salt and stores the heat. When the system enters the energy release-cooling synergy stage, the thermal storage tank is connected to the vaporization module through pipelines, releasing the stored heat to the vaporization module to provide a heat source for the vaporization of liquid air, realizing the recycling of heat and reducing additional energy consumption.

[0051] The cold storage module is a low-temperature cold storage tank filled with ethylene glycol aqueous solution as the cold storage medium. Ethylene glycol aqueous solution does not easily freeze in low-temperature environments and can stably maintain a low temperature of about -75 to -16℃. During system operation, the cold storage module is continuously connected to the liquefaction module through a cold energy circulation pipeline, providing a stable cold source for the plate-fin heat exchanger of the liquefaction module and ensuring that the high-pressure air can be liquefied smoothly. At the same time, the cold storage module is also equipped with a cold energy replenishment device. When the cold energy is insufficient, a small amount of electrical energy can be used to drive the refrigeration components to supplement the cold energy, ensuring the continuous operation of the entire liquefaction process.

[0052] The vaporization module uses a shell-and-tube vaporizer. Liquid air is transported from the storage module to the shell side of the vaporizer through a cryogenic pipeline. The heat released by the heat storage module is transferred to the liquid air in the shell side through heat exchange tubes, causing the liquid air to gradually absorb heat and vaporize, transforming into high-pressure, room-temperature air. The vaporizer has an internal flow guiding structure to ensure that the liquid air is evenly distributed in the shell side and fully contacts the heat exchange tubes, improving vaporization efficiency. At the same time, the vaporizer is also equipped with a temperature regulation component, which can fine-tune the temperature of the vaporized air according to the needs of the subsequent expansion module, ensuring stable air parameters entering the expansion module.

[0053] The expansion module uses a screw-type expander, whose inlet end is connected to the air outlet of the vaporization module and the vaporized air outlet of the chip cooling module, respectively. The two air streams merge and enter the expansion chamber of the expander. The high-pressure air drives the expander rotor to rotate, converting the air pressure energy into mechanical energy, which then drives the generator to generate electricity through a coupling. The expander outlet is equipped with an exhaust noise reduction structure to reduce the impact of exhaust noise on the data center environment. Part of the electricity generated is directly transmitted to IT equipment for its operation, and the other part is fed back to the power grid through the grid connection device, realizing flexible energy distribution and efficient utilization.

[0054] According to an embodiment of the present invention, the input power includes: prioritizing the dispatch of the electrical energy output from the renewable energy source, and then connecting the grid power source as needed; the control and energy management module is further configured to: determine that the renewable energy source has power output, prioritize the use of renewable energy power for cooling, and use the correspondingly reduced medium to increase power generation; the control and energy management module is further configured to: use a portion of the power output from the power generation for the operation of IT equipment, and feed the other portion back to the grid.

[0055] Specifically, the dispatch of input power follows a renewable energy priority logic, with the system monitoring the output status of renewable energy sources such as photovoltaics and wind power in real time. When renewable energy sources output electricity, the control and energy management module prioritizes connecting this electricity to the system and allocating it to the energy consumption links of the data center. For example, during normal daytime photovoltaic power generation, the output electricity is first used to operate the chip cooling module. Whether it directly drives the circulating pump of the cold plate cooling unit or powers the centrifugal fan of the duct-type cooling unit, renewable energy power is prioritized. This dispatch method minimizes dependence on grid power and reduces liquid air consumption. The cooling capacity that would otherwise require liquid air can be partially supplemented by renewable energy-driven cooling auxiliary equipment. The correspondingly saved liquid air is redistributed to the vaporization and expansion modules, increasing the expansion unit's power generation capacity by increasing vaporization, allowing more electricity to participate in the system's internal circulation or be fed back to the grid.

[0056] If renewable energy output is insufficient, such as when solar power stops generating at night or wind power output decreases due to insufficient wind speed, the control and energy management module will automatically draw power from the grid based on the system's real-time energy consumption needs to fill the energy gap. The grid power will prioritize the critical operation of the liquefied air energy storage module. For example, during periods of low electricity prices, even if renewable energy output is low, grid power will still be used to drive the compression and liquefaction modules to compress and liquefy air for storage, serving as a reserve medium for cooling and power generation during subsequent peak periods, thus avoiding the high-cost consumption of grid power during peak hours.

[0057] In terms of power distribution from the generated output, the control and energy management module dynamically adjusts the power supply based on the real-time load of the IT equipment. When the data center IT equipment is operating under high load, such as in scenarios involving large-scale data computing or model training, the power generated by the expansion module will be prioritized for supplying the IT equipment, ensuring the stable operation of components such as servers and storage devices, and reducing reliance on external power grid supply. When the IT equipment is operating under low load, such as during nighttime data backup or equipment maintenance, the power demand of the IT equipment decreases. At this time, the excess generated power will be fed back to the grid through the grid connection interface, which can both supplement the grid's power supply and generate additional revenue through electricity price differences, thereby improving the system's economic efficiency.

[0058] Throughout the process, the control and energy management module continuously optimizes power dispatch and distribution strategies by collecting real-time data on renewable energy output, IT equipment load, grid electricity prices, and liquid air storage levels. For example, when renewable energy output surges, its usage in the cooling process is rapidly increased to further reduce liquid air consumption; when IT equipment load suddenly drops, the grid connection ratio of generated electricity is adjusted promptly to avoid energy waste, maintaining a balance between energy supply and demand within the system and achieving a dual improvement in environmental friendliness and economy.

[0059] According to an embodiment of the present invention, the control and energy management module is also used to monitor the server IT load, chip temperature, liquid air level in the liquid air storage tank of the liquid air storage module and the power grid power supply capacity in real time, and allocate the proportion of liquid air used for cooling and power generation according to the monitoring results.

[0060] Specifically, the control and energy management module constructs a comprehensive real-time monitoring network through sensors deployed at key nodes of the system. For server IT load, the module connects to the data center's IT equipment management system to collect data on server CPU / GPU utilization, memory usage, and overall power consumption to determine the actual operating load of the IT equipment. When the IT load is at its peak, such as when utilization exceeds 80%, the equipment heat generation increases significantly, and cooling requirements rise accordingly; when the IT load is at its trough, such as when utilization is below 30%, heat generation decreases, and cooling requirements decrease accordingly. For chip temperature, the module uses temperature sensors attached to the surface of the server chips to acquire real-time chip temperature data and sets multiple temperature thresholds, such as a normal operating threshold of 35-45℃, a warning threshold of 48℃, and an emergency threshold of 52℃. Different thresholds correspond to different cooling priorities.

[0061] Regarding the liquid air storage module, the module uses built-in level and pressure sensors in the tank to monitor the remaining storage volume of liquefied air and the internal pressure of the tank in real time, thus determining the total amount of cooling and power generation media available for the system. If the liquid level is above 80%, it indicates sufficient media, and the allocation ratio for power generation can be appropriately increased; if the liquid level is below 30%, cooling needs should be prioritized, reducing the consumption of media for power generation. Regarding grid power supply capacity, the module connects to the real-time data interface of the grid dispatch system to obtain the current grid load rate, power supply stability, and electricity price signals. When the grid load rate exceeds 90%, indicating power shortages or peak electricity price periods, the system needs to increase the proportion of self-generated power to reduce dependence on grid power; when the grid load rate is below 60%, indicating ample power supply or low electricity price periods, the amount of media used for power generation can be appropriately reduced, prioritizing the replenishment of liquid air storage.

[0062] Based on the aforementioned multi-dimensional monitoring data, the control and energy management module dynamically adjusts the ratio of liquid air used for cooling and power generation through a preset intelligent allocation algorithm. When the chip temperature is detected to be close to or exceed the warning threshold, and the IT load is at its peak, the module will tilt the liquid air allocation ratio towards cooling, for example, supplying 70%-80% of the liquid air to the chip cooling module to quickly reduce the chip temperature, while the remaining 20%-30% of the liquid air is used for basic power generation to meet the power needs of IT equipment. If the chip temperature is stable within the normal operating threshold, the IT load is at a moderate level, and the tank liquid level is sufficient while the grid power supply is tight, the module will adjust the allocation ratio, using 40%-50% of the liquid air for cooling and 50%-60% for power generation, ensuring equipment heat dissipation while supplementing grid power or meeting additional power needs of IT equipment by increasing power generation output.

[0063] If the liquid level in the storage tank is detected to be low, such as below 20%, even if the power grid supply is tight, the module will prioritize using more than 60% of the liquid air for cooling, reserving only a small amount for emergency power generation to avoid IT equipment downtime due to insufficient cooling. If the power grid supply is sufficient and electricity prices are low, and the liquid level in the storage tank is high, the module will reduce the amount of liquid air used for power generation, leaving more medium in the storage tank, or only activate the cold plate cooling unit to utilize the stored cooling capacity, reducing liquid air consumption and achieving efficient medium storage. Throughout the allocation process, the module will continuously track changes in various monitoring parameters, updating the allocation ratio every 1-2 minutes to ensure that the utilization of liquid air always matches the actual needs of the system and the external energy environment, achieving a dynamic balance between cooling assurance and energy efficiency.

[0064] According to an embodiment of the present invention, a chip cooling module includes a direct immersion unit and a cold plate cooling unit; the chip cooling module is cooled using the cold energy stored in the cold storage module; liquid air is used as a supplement to the cold energy or directly as a cooling medium to cool the chip cooling module; the liquid air cools the IT equipment in the direct immersion unit, and after vaporization, it is introduced into the expansion module; the liquid air cools the IT equipment in the cold plate cooling unit, and after vaporization, it is introduced into the expansion module.

[0065] Specifically, the direct immersion unit and the cold plate cooling unit of the chip cooling module work together in structural design and operational logic to build a highly efficient cooling system relying on the cooling capacity of the cold storage module and liquid air. The direct immersion unit uses polytetrafluoroethylene (PTFE) insulation material to make a sealed cooling chamber. This material is resistant to the low-temperature environment of liquid air and can ensure the electrical insulation safety of IT equipment, avoiding corrosion or interference between the medium and the equipment. The interior of the cooling chamber is designed with a special installation structure adapted to server clusters. The IT equipment to be cooled is placed inside. The bottom of the cooling chamber is connected to the delivery pipeline of the liquid air storage module, and the top is connected to the vaporized product outlet pipeline leading to the expansion module. During operation, if the cooling capacity released by the cold storage module is sufficient to maintain the basic heat dissipation of the IT equipment, the direct immersion unit can temporarily not use liquid air. When the load of the IT equipment increases and the chip temperature approaches the threshold, liquid air enters the cooling chamber through the bottom pipeline, comes into direct contact with the IT equipment and absorbs heat, and a rapid gas-liquid phase change takes away a large amount of heat, ensuring the chip temperature is stable. The vaporized high-pressure low-temperature air is then discharged through the top pipeline and finally flows into the expansion module to participate in power generation, realizing energy recovery.

[0066] The cold plate cooling unit uses a microchannel cold plate as its heat exchange component. The cold plate is made of a high thermal conductivity metal alloy and features a dense internal microchannel design to maximize the contact area with liquid air and improve heat exchange efficiency. The cold plate is tightly bonded to the surface of heat-generating components such as the server CPU and GPU using thermally conductive silicone grease. The grease fills the tiny gaps between the cold plate and the chip surface, reducing thermal resistance and ensuring efficient heat conduction. The inlet of the cold plate connects to the liquid air storage module via branch pipes, while the outlet merges with the vaporized material outlet pipe of the direct immersion unit before connecting to the expansion module. During system operation, the cold storage module first provides basic cooling capacity to the cold plate through dedicated piping to meet the heat dissipation needs of IT equipment under low load. When the chip temperature rises and the cold storage capacity alone is insufficient to meet the heat dissipation requirements, liquid air is transported to the microchannels of the cold plate. During its flow within the channels, it absorbs heat and vaporizes, further enhancing the cooling effect. The vaporized high-pressure air also enters the expansion module through the outlet pipe, merging with the vaporized material from the direct immersion unit to drive the expander.

[0067] The liquid air supply to both cooling units is dynamically regulated by the control and energy management module. This module intelligently determines the activation timing and supply amount of liquid air by monitoring chip temperature, IT equipment load, and the remaining cooling capacity of the cold storage module in real time. For example, during off-peak hours in the data center, when IT equipment load is low, the cold plate cooling unit alone can meet heat dissipation needs using its stored cooling capacity, while the direct immersion unit remains in standby mode. When data processing peaks, the IT equipment load surges, and both units activate simultaneously. Liquid air enters the sealed cooling chamber and the cold plate channel respectively, forming a dual heat exchange mode for rapid cooling. Regardless of which unit uses liquid air, the vaporized air is introduced into the expansion module, avoiding media waste and supplementing the system's electrical energy through power generation, achieving coordinated operation of cooling and energy recovery.

[0068] According to an embodiment of the present invention, in the energy storage stage, the chip cooling module only activates the cold plate cooling unit to cool it using the cold energy provided by the cold storage module; in the energy release-cooling synergy stage, the vaporization module is used to vaporize the liquid air using the compression heat stored in the heat storage module.

[0069] Specifically, the two phases of system operation are clearly distinguished in terms of module startup logic and energy utilization methods to adapt to energy supply and demand and cooling requirements at different times. In the energy storage phase, when the grid power is abundant and electricity prices are low, the system's goal is to convert electrical energy into the chemical energy of liquid air for storage. Therefore, it is necessary to minimize liquid air consumption and focus on energy storage efficiency. The chip cooling module only activates the cold plate cooling unit, not the direct immersion unit. The cold plate cooling unit is connected to the cold storage module via dedicated piping. The ethylene glycol aqueous solution filled inside the cold storage module has already stored sufficient cooling capacity. This cooling capacity is transported to the cold plate through piping. The cold plate is in close contact with heat-generating components such as the server CPU and GPU, transferring the cooling capacity to the chip surface and removing the basic heat generated by the equipment operation. This operating mode does not consume liquid air; it relies solely on the cooling capacity of the cold storage module to meet the heat dissipation requirements of IT equipment during low-load operation. This avoids the energy storage effect being affected by the consumption of cooling medium during the energy storage phase, while also reducing additional grid power consumption and ensuring that more electrical energy can be used for air compression and liquefaction.

[0070] Upon entering the energy release-cooling synergy phase, when the grid experiences power shortages or electricity prices are at their peak, the system must simultaneously meet the cooling and power replenishment needs of IT equipment. At this point, the operating logic of the vaporization module is completely different from that of the energy storage phase. Previously, the vaporization module was in a low-load or standby state during the energy storage phase. However, in this phase, it connects to the thermal storage module via pipelines. The molten salt filling the thermal storage module has stored a significant amount of compression heat generated by the compression module during the energy storage phase, which is then transferred to the vaporization module through heat exchange pipelines. The liquid air storage module releases liquid air, which enters the vaporization module through pipelines. The liquid air comes into full contact with the compression heat transferred from the thermal storage module, rapidly absorbing heat and vaporizing to form high-temperature, high-pressure air. This method of vaporization using stored compression heat eliminates the need for additional electrical energy for heating, achieving both heat recovery and improved vaporization efficiency, providing a sufficient source of high-pressure air for subsequent expansion module power generation. Meanwhile, during this stage, the chip cooling module will flexibly activate the direct immersion unit and the cold plate cooling unit according to the load and temperature of the IT equipment. If the cold plate cooling unit alone cannot meet the heat dissipation requirements, the direct immersion unit will be activated, and liquid air will directly contact the IT equipment to enhance cooling. The vaporized air and the high-temperature and high-pressure air generated by the vaporization module will enter the expansion module together to drive the expander to generate electricity, realizing the coordinated operation of cooling and power generation. This not only ensures stable heat dissipation of IT equipment, but also supplements power to the data center and alleviates the pressure on the power grid.

[0071] According to an embodiment of the present invention, the chip cooling module is a duct-type cooling unit; the vaporization module includes a first-stage heat exchanger and a second-stage heat exchanger; the control and energy management module detects that the temperature of the IT equipment exceeds a preset threshold, and uses low-temperature air to cool the chip cooling module; wherein, the first-stage heat exchanger is pre-cooled using the cold energy stored in the cold storage module; the first-stage heat exchanger receives liquid air input from the liquid air storage module and uses the cold energy to initially vaporize it; the second-stage heat exchanger exchanges heat with the ambient air to form low-temperature air after initial vaporization.

[0072] Specifically, this embodiment corresponds to the third heat exchange method of the chip cooling module. Figure 4 This is a schematic diagram of the data center energy management system under the third heat exchange method. Figure 5 This is a schematic diagram of a duct-type chip cooling unit structure under the third heat exchange method.

[0073] from Figure 4 The energy flow path of the entire system can be seen. The first and second stage heat exchangers of the vaporization module are connected to the liquid air storage module and the cold storage module in sequence through pipelines. The duct-type cooling unit is connected in series between the second stage heat exchanger and the expansion module, forming a complete process from liquid air treatment to cooling and then to energy recovery. Figure 5It is the structure of the air duct cooling unit, showing the layout of the server array's closed air duct centrifugal fan and insulation layer, providing a structural reference for understanding the cooling process.

[0074] The design of the duct-type cooling unit is fully adapted to the indirect cooling requirements of the third heat exchange method, from Figure 5 As can be seen, a sealed air duct is arranged around the outside of the server array, and the inner wall of the air duct is fitted with a thermal insulation layer. This insulation layer can effectively block the entry of heat from the external environment and prevent the temperature of the low-temperature air from rising due to heat absorption during flow, thus ensuring cooling efficiency. The air duct inlet is connected to the outlet of the second-stage heat exchanger of the vaporization module through a dedicated pipeline to receive low-temperature air with a stable temperature. The centrifugal fan installed inside the air duct can dynamically adjust its speed according to the temperature of the IT equipment. When the control and energy management module detects that the chip temperature is close to the preset threshold, the fan speed will increase, accelerating the flow rate of the low-temperature air in the air duct and enhancing the convective heat transfer effect with the server surface. The air duct outlet is directly connected to the expansion module, allowing the air that has absorbed heat to quickly enter the power generation stage, realizing energy recovery and utilization. This structure eliminates the need for liquid air to directly contact the IT equipment, fundamentally avoiding the insulation damage or low-temperature corrosion problems that liquid media may cause to the equipment. It is particularly suitable for low- to medium-density IT equipment with strict restrictions on liquid contact, such as storage servers and network switching equipment in traditional data centers.

[0075] The staged design of the vaporization module is key to ensuring a stable output of low-temperature air. Figure 4 As can be seen from the system structure, the first-stage heat exchanger and the cold storage module are connected via a cold energy delivery pipeline. Before the control and energy management module detects that the temperature of the IT equipment exceeds a preset threshold, the cold storage module releases cold energy to pre-cool the first-stage heat exchanger, stabilizing the internal temperature of the heat exchanger to a specific range, preparing for the subsequent initial vaporization of liquid air. When the cooling process starts, the liquid air storage module delivers liquid air to the first-stage heat exchanger through a low-temperature pipeline. The liquid air comes into contact with the pre-cooled pipe wall inside the heat exchanger, quickly absorbs cold energy, and completes initial vaporization, transforming into low-temperature gaseous air. At this point, the air temperature is too low. If it is directly introduced into the air duct and comes into contact with the IT equipment, it may cause condensation on the equipment surface or damage to components due to the low temperature. Therefore, a second-stage heat exchanger is needed for temperature regulation.

[0076] from Figure 4The connection of the second-stage heat exchanger shows that one side connects to the outlet of the first-stage heat exchanger, while the other side has a channel for interaction with ambient air. After initial vaporization, the low-temperature gaseous air enters the second-stage heat exchanger and exchanges heat with the ambient air. Heat from the ambient air is transferred to the low-temperature air, gradually raising its temperature to a suitable range, ultimately forming low-temperature air that meets cooling requirements. This temperature range ensures that the low-temperature air has sufficient cooling capacity to absorb heat from the IT equipment while preventing excessively low temperatures from damaging the equipment, achieving a balance between cooling effectiveness and equipment safety.

[0077] Once the temperature has stabilized, the cooled air is transported through pipes to the inlet of the duct-type cooling unit, where it is driven by a centrifugal fan to flow along... Figure 5 The enclosed air duct shown uniformly flows across the server array surface. When the low-temperature air comes into contact with the server casing and chip heat dissipation components, it rapidly absorbs the heat generated by the equipment's operation through convection heat transfer, gradually increasing its own temperature. It then exits from the air duct outlet, flowing along... Figure 4 The air enters the expansion module through the pipeline. After entering the expansion module, this part of the air merges with the high-pressure air output from other paths of the vaporization module, and together they drive the expander to do work and generate electricity.

[0078] Throughout the process, the control and energy management module will combine Figure 4 The system monitors data at each node to adjust the operating status of each module in real time. For example, by monitoring the precooling temperature of the first-stage heat exchanger, the cooling output of the cold storage module is adjusted to ensure initial vaporization; by monitoring the air temperature at the outlet of the second-stage heat exchanger, the amount of ambient air entering is adjusted to maintain stable low-temperature air temperature; and by monitoring the air temperature and flow rate in the duct, the centrifugal fan speed is adjusted accordingly to ensure that the cooling effect is always precisely matched with the heat dissipation requirements of the IT equipment, fully leveraging the advantages of the third heat exchange method in terms of equipment compatibility and energy efficiency.

[0079] According to an embodiment of the present invention, the compression module adopts a three-stage screw compressor; the liquefaction module adopts a throttling expansion and plate-fin heat exchanger; the liquid air storage module adopts a vacuum-insulated cryogenic storage tank; the vaporization module adopts a shell-and-tube vaporizer; the expansion module adopts a screw expander; the heat storage module is a high-temperature phase change heat storage tank filled with molten salt; and the cold storage module is a low-temperature cold storage tank filled with an aqueous ethylene glycol solution.

[0080] Specifically, the compression module utilizes a three-stage screw compressor that progressively increases air pressure and temperature through a multi-stage compression structure, meeting the system's demand for high-pressure air. During operation, the compressor receives electrical input to drive the screw rotor, drawing in outside air from the inlet. After being compressed sequentially through the three compression chambers, the air pressure increases to approximately 8 MPa, and the temperature rises to approximately 150°C, forming stable high-temperature, high-pressure air. This staged compression method reduces energy loss from single-stage compression. Simultaneously, the compressor's built-in oil cooling system helps control the temperature during compression, preventing localized overheating that could affect equipment lifespan and providing a continuous and stable high-pressure air source for the subsequent air liquefaction process in the liquefaction module.

[0081] The liquefaction module combines throttling expansion with a plate-fin heat exchanger, working together to achieve efficient liquefaction of high-temperature, high-pressure air. The high-temperature, high-pressure air first enters the throttling expansion assembly, where it is rapidly depressurized through valves and initially cooled using the Joule-Thomson effect. It then enters the hot-side channel of the plate-fin heat exchanger. Simultaneously, the cold energy released by the cold storage module is transported to the heat exchanger through the cold-side channel. The cold energy and hot-side air exchange heat through the fins; the dense fin design significantly increases the heat exchange area, allowing the high-pressure air temperature to rapidly drop below -196°C, ultimately liquefying into liquid air. This combination leverages the rapid cooling advantage of throttling expansion with the high-efficiency heat exchange characteristics of the plate-fin heat exchanger, enabling air liquefaction in a short time and improving energy conversion efficiency during the energy storage phase.

[0082] The liquid air storage module utilizes a vacuum-insulated cryogenic tank. The main body consists of a stainless steel inner liner and an outer protective shell. A vacuum is created between the inner and outer shells, filled with multiple layers of insulation material to minimize heat transfer from the outside and reduce vaporization loss of the liquid air. The tank's design volume is determined based on the data center's energy storage requirements, typically using a 100m³ capacity. The operating temperature is maintained at -196℃, and the design pressure is 0.8MPa, ensuring safe storage of liquid air. The tank is equipped with level and pressure sensors to monitor the liquid air level and internal pressure in real time. When the pressure exceeds a preset value, a safety valve automatically opens to release pressure, ensuring safe storage. The bottom of the tank also features an anti-deposition structure to prevent impurities from accumulating during long-term liquid air storage, ensuring unobstructed flow in subsequent pipelines.

[0083] The vaporization module employs a shell-and-tube vaporizer, which consists of a shell and internal heat exchange tubes. Liquid air enters from an inlet on one side of the shell and flows within the shell side. The compression heat released by the heat storage module is transferred through the tube side of the heat exchange tubes. The heat is transferred through the tube walls to the liquid air in the shell side, causing the liquid air to absorb heat and rapidly vaporize, transforming into high-pressure, room-temperature air. The shell-and-tube structure has high heat exchange efficiency, ensuring complete vaporization of the liquid air flowing through the vaporizer. Simultaneously, the vaporizer is equipped with a temperature regulation device, which can fine-tune the temperature of the vaporized air according to the needs of the subsequent expansion module, avoiding temperature fluctuations that could affect power generation efficiency and providing a stable gas source for the expansion module.

[0084] The expansion module uses a screw expander, which operates on the opposite principle to a compressor. It converts energy by using high-pressure air to drive a rotor. The expander's inlet is connected to the air outlet of the vaporization module and the vaporized air outlet of the chip cooling module. The two streams of high-pressure air mix within the expander before entering the expansion chamber, driving the screw rotor to rotate and converting the air's pressure energy into mechanical energy. This mechanical energy is then used to drive a generator via a coupling. The screw expander operates stably and is highly adaptable to varying operating conditions. Even with slight fluctuations in inlet pressure or temperature, it maintains high power generation efficiency. Part of the generated electricity is directly supplied to IT equipment for its operation, while the other part is fed back to the grid through a grid connection device, enabling flexible energy distribution.

[0085] The thermal storage module utilizes a high-temperature phase-change thermal storage tank, filled with molten salt as the thermal storage medium. The selected molten salt is a mixture of sodium nitrate and potassium nitrate, possessing high specific heat capacity and a high melting point, enabling stable heat storage within a temperature range of 120℃ to 500℃ without significant deterioration. During the energy storage phase, the compression heat generated by the compression module is transferred to the molten salt through heat exchange coils, raising the salt temperature and storing the heat. When the system enters the energy release-cooling synergistic phase, the thermal storage tank is connected to the vaporization module via pipelines. The molten salt releases the stored heat, providing a heat source for the vaporization of liquid air, achieving heat recycling and reducing additional energy consumption. The thermal storage tank is externally wrapped with an insulation layer to reduce heat loss and ensure efficient heat storage.

[0086] The cold storage module is a low-temperature cold storage tank filled with an approximately 60% (w / w) ethylene glycol aqueous solution. This solution remains liquid below -40°C, exhibiting excellent low-temperature stability and cold storage capacity. During system operation, the cold storage module is connected to the liquefaction module and the chip cooling module via a cold energy circulation pipeline, providing a cold source for the air liquefaction in the liquefaction module and providing basic cooling capacity for the cold plate cooling unit during the energy storage phase. The cold storage tank employs a double-layer insulation structure to reduce cold energy loss, and an internal stirring device ensures uniform temperature of the ethylene glycol aqueous solution, guaranteeing stable cold energy output. Furthermore, the cold storage module is equipped with auxiliary refrigeration components. When the cold energy is insufficient, a small amount of electrical energy can be used to drive refrigeration to supplement the cold energy reserve, ensuring the continuity of the system's cold energy supply.

[0087] According to an embodiment of the present invention, in the chip cooling module, the direct immersion unit adopts a sealed cooling chamber, the chamber body is made of polytetrafluoroethylene insulating material, the bottom of the cooling chamber is provided with a liquid air inlet, and the top is provided with a vaporized air outlet; the cold plate cooling unit adopts a microchannel cold plate, the cold plate is attached to the surface of the server CPU / GPU with thermally conductive silicone grease; the duct-type cooling unit adopts a duct-type structure, a sealed duct is provided on the outside of the server array, the duct inlet is connected to the low temperature air outlet of the vaporization module, a centrifugal fan is provided inside the duct, and the inner wall of the duct is lined with a heat insulation layer.

[0088] Specifically, the sealed cooling chamber of the direct immersion unit is designed with materials and structure fully adapted to the cooling characteristics of liquid air. The polytetrafluoroethylene (PTFE) insulation material used in the chamber possesses excellent low-temperature resistance, maintaining structural stability in a liquid air environment down to -196°C, and also boasts good electrical insulation properties, preventing electrical interference or corrosion between the cooling medium and IT equipment, thus ensuring safe equipment operation. The internal space of the cooling chamber is customized according to the server dimensions, accommodating multiple high-density computing servers. After the servers are placed inside, the chamber remains sealed to prevent liquid air leakage or the entry of external impurities. The liquid air inlet at the bottom of the cooling chamber is connected to the liquid air storage module via branch pipes, ensuring a stable supply of liquid air into the chamber. The vaporized air outlet at the top is connected to the expansion module via insulated pipes, allowing the high-pressure, low-temperature air formed after the liquid air absorbs heat from the IT equipment and vaporizes to quickly enter the expansion module for power generation, achieving the recovery and utilization of both cold and pressure energy. This structure allows liquid air to come into direct contact with IT equipment, efficiently removing heat through gas-liquid phase change. It is suitable for the cooling needs of ultra-high-density IT equipment, such as AI computing clusters and computing modules in supercomputing centers. It can quickly control chip temperature fluctuations and meet high-precision thermal management requirements.

[0089] The microchannel cold plate in the cold plate cooling unit is structurally designed with a focus on improving heat transfer efficiency. The cold plate is made of a high thermal conductivity metal alloy and features a dense internal microchannel design with a channel diameter controlled between 0.5-2mm. This significantly increases the contact area between the liquid air and the cold plate, allowing heat to be rapidly transferred to the liquid air. The way the cold plate is bonded to heat-generating components such as the server CPU and GPU is particularly crucial. Thermal grease is applied to fill the tiny gaps between the cold plate and the chip surface, reducing thermal resistance and ensuring that the heat generated by the chip is efficiently conducted to the cold plate. The inlet of the cold plate is connected to a branch pipe of the liquid air storage module via an electromagnetic shut-off valve, while the outlet merges with the vaporized air outlet pipe of the direct immersion unit and connects to the expansion module. During operation, liquid air enters the internal flow channel of the cold plate, absorbs heat and vaporizes. The vaporized high-pressure air enters the expansion module through the outlet pipe. At the same time, the cold plate maintains the stable surface temperature of the chip through phase change cooling. It is suitable for medium and high density IT equipment and scenarios with high sealing requirements, such as financial data centers and enterprise-level server clusters, achieving efficient heat dissipation while ensuring the insulation safety of the equipment.

[0090] The duct-type cooling unit's duct structure is designed around indirect cooling requirements, perfectly adapting to the convective heat exchange between low-temperature air and IT equipment. A sealed duct surrounding the server array concentrates the low-temperature air within the duct for heat exchange with the server, preventing coolant from dissipating into the external environment. The insulation layer adhering to the inner wall of the duct uses flame-retardant heat-insulating material, effectively blocking external heat from entering the duct and preventing the low-temperature air from absorbing heat and increasing its temperature during flow, ensuring stable cooling efficiency. The duct inlet connects to the low-temperature air outlet of the vaporization module via a dedicated pipeline, accurately receiving stable low-temperature air. A centrifugal fan installed inside the duct dynamically adjusts its speed based on the IT equipment temperature. When the control and energy management module detects an increase in chip temperature, the fan speed increases, accelerating the flow of low-temperature air within the duct and enhancing the convective heat exchange with the server surface. The duct outlet connects directly to the expansion module, allowing the heat-absorbing air to quickly enter the power generation stage for energy recovery. This structure eliminates the need for liquid air to directly contact IT equipment, thus avoiding potential insulation damage or low-temperature corrosion caused by liquid media. It is suitable for low- to medium-density IT equipment with strict limitations on liquid contact, such as storage servers and network switching equipment in traditional data centers, while also extending equipment maintenance cycles and reducing operating costs.

[0091] The three cooling units of the chip cooling module can flexibly coordinate according to the load and heat dissipation requirements of the IT equipment during operation. When the data center is operating under high load and the heat generation of the IT equipment increases sharply, the direct immersion unit and the cold plate cooling unit can be started simultaneously. Liquid air cools the equipment through the sealed cooling chamber and the microchannel cold plate, forming a dual heat exchange mode of direct contact and indirect conduction. When the equipment has strict limitations on liquid contact, the duct-type cooling unit operates alone, achieving indirect cooling through low-temperature air. In the energy storage phase, only the cold plate cooling unit relies on the cooling capacity of the cold storage module to maintain basic heat dissipation, while the other units are in standby mode to avoid unnecessary consumption of liquid air and always keep the cooling effect matched with the system's operating requirements.

[0092] According to an embodiment of the present invention, in the third heat exchange mode, the vaporization module is composed of a series of shell-and-tube heat exchangers in stages. The first-stage heat exchanger is connected to the cold storage module, and the second-stage heat exchanger exchanges heat with the ambient air to ensure that the liquid air vaporizes to form low-temperature air with a stable temperature.

[0093] Specifically, the vaporization module's staged structure design revolves around the stable vaporization of liquid air and precise temperature control. Two-stage shell-and-tube heat exchangers are connected sequentially via pipelines, forming a tightly integrated vaporization process that ensures each step provides suitable air conditions for subsequent cooling needs. The first-stage heat exchanger, as the initial vaporization stage, utilizes the cooling capacity of the cold storage module to achieve preliminary vaporization of the liquid air, preventing direct entry of the liquid medium into subsequent stages and potential equipment damage. This heat exchanger is connected to the cold storage module via a dedicated cooling capacity delivery pipeline. The ethylene glycol aqueous solution filled inside the cold storage module continuously releases a stable cooling capacity. Before the system starts its cooling process, this cooling capacity enters the first-stage heat exchanger to pre-cool the heat exchange tubes, stabilizing the tube wall temperature to approximately -60°C, creating conditions for rapid vaporization of the liquid air upon entry. When liquid air is transported from the liquid air storage module to the first-stage heat exchanger through cryogenic pipelines, it will come into full contact with the pre-cooled heat exchange tubes in the shell side, quickly absorb the cold energy and complete the initial vaporization, transforming into cryogenic gaseous air. At this time, the air temperature is about -80~-100℃. Although it has left the liquid state, the temperature is too low. If it is used directly to cool IT equipment, it may cause condensation on the surface of the equipment or damage to components due to the low temperature. Therefore, a second-stage heat exchanger is needed to further regulate the temperature.

[0094] The second-stage heat exchanger receives the low-temperature gaseous air output from the first-stage heat exchanger. Through heat exchange with the ambient air, its temperature rises, bringing it to a stable cooling range suitable for the system. The shell side of this heat exchanger is connected to the outlet of the first-stage heat exchanger, receiving the initially vaporized low-temperature air. Simultaneously, its tube side is designed with airflow channels communicating with the external environment, allowing ambient air to enter naturally or through a fan. During heat exchange, heat from the ambient air in the tube side is transferred through the tube walls to the low-temperature air in the shell side, gradually raising its temperature until it stabilizes within the range of -40 to -35°C, forming the low-temperature air required for the third heat exchange method. This temperature range is precisely designed to ensure that the low-temperature air has sufficient cooling capacity to quickly absorb the heat generated by IT equipment, while preventing excessively low temperatures from damaging the equipment, achieving a balance between cooling efficiency and equipment safety.

[0095] The series connection of the two-stage heat exchangers ensures the stability and continuity of the vaporization process. The pre-cooling and initial vaporization of the first-stage heat exchanger lays the foundation for temperature regulation in the second-stage heat exchanger, preventing incomplete vaporization caused by direct entry of liquid air into the ambient air for heat exchange. Simultaneously, the heat exchange process between the second-stage heat exchanger and the ambient air requires no additional electrical energy, relying solely on ambient heat for temperature regulation, further reducing system energy consumption. Throughout the vaporization process, the control and energy management module monitors parameters such as inlet and outlet air temperature and pressure of the two-stage heat exchangers in real time. If the outlet air temperature of the first-stage heat exchanger is detected to be too low or too high, the cooling output of the cold storage module will be adjusted. If the outlet air temperature of the second-stage heat exchanger deviates from the preset range, the heat exchange intensity will be changed by adjusting the amount of ambient air entering the system, ensuring a stable final output low-temperature air temperature. This provides a continuous and suitable cooling medium for the duct-type cooling unit, guaranteeing efficient and safe cooling of IT equipment under the third heat exchange method.

[0096] To ensure the stable operation of the liquefied air energy storage module under low temperature and high pressure conditions and to avoid risks such as medium leakage and overpressure, the system is equipped with multiple safety protection mechanisms, as follows: Regarding the cryogenic pipeline system, all pipelines transporting liquid air or cryogenic gaseous air employ a double-layer vacuum insulation structure. The inner layer is made of cryogenic stainless steel, and the outer layer is made of flame-retardant insulation material. A vacuum is drawn in between to block heat conduction, minimizing cold loss and condensation on the pipeline's outer wall. Simultaneously, a cryogenic leak sensor is installed every 10 meters along the pipeline. These sensors are connected in real-time to the control and energy management module. When the temperature around the pipeline drops below -50°C or an abnormal change in oxygen content is detected, the control module immediately triggers an alarm signal, simultaneously shutting off the electromagnetic shut-off valves before and after the leak point to cut off media transport. It also activates explosion-proof ventilation fans near the pipeline to accelerate airflow in the leak area, preventing freezing damage or safety hazards caused by excessively high oxygen concentrations.

[0097] Regarding the liquid air storage module, the vacuum-insulated cryogenic storage tank is equipped with dual safety valves at the top. The main safety valve is set to open at 1.0 MPa, and the backup safety valve is set to open at 1.1 MPa, forming dual overpressure protection. When the pressure inside the tank exceeds 1.0 MPa due to the accumulation of liquid air vaporization, the main safety valve automatically opens to release pressure. The released gas is led to a safe outdoor area through a dedicated exhaust pipe to prevent the cryogenic gas from directly contacting personnel or equipment. If the main safety valve fails to activate, causing the pressure to continue to rise and reach 1.1 MPa, the backup safety valve opens simultaneously to ensure that the tank pressure remains within a safe range. In addition, an emergency drain valve is located at the bottom of the tank. When a sudden temperature rise or abnormal pressure fluctuation is detected inside the tank, the drain valve can be remotely opened via the control module to drain the liquid air to an emergency storage tank, preventing damage to the tank.

[0098] Pressure sensors and explosion-proof membranes are also installed at the connection points between the vaporization module and the expansion module. When the pressure in the pipeline exceeds 3.0 MPa due to airflow fluctuations, the pressure sensor triggers the control module to close the outlet valve of the vaporization module. If the pressure continues to rise uncontrollably, the explosion-proof membrane automatically ruptures to release pressure, protecting the expander and other equipment from high-pressure impacts and ensuring the safety and reliability of the entire liquefied air energy storage module throughout its operating cycle.

[0099] To fully utilize renewable energy sources such as photovoltaic and wind power, the system relies on the dynamic regulation capabilities of the control and energy management module to achieve precise matching between renewable energy output and energy storage cooling needs, ensuring energy utilization efficiency and system operational stability.

[0100] For photovoltaic (PV) energy, the system integrates power prediction signals and real-time output monitoring data from the PV power plant. During the daytime, when PV output is increasing and does not exceed the real-time demand of the chip cooling module, the control module prioritizes directly supplying PV power to cooling equipment such as fans in the cold plate cooling unit and duct-type cooling unit, reducing reliance on grid power or liquid air cooling. When PV output continues to rise and exceeds cooling demand, excess power is automatically directed to the liquid air storage module, driving the compression and liquefaction modules to convert excess power into liquid air for storage, replenishing the liquid air storage module's medium reserves. If cloudy weather causes a sudden drop in PV output, the control module can respond quickly by increasing the liquid air supply or utilizing the vaporization expansion of the storage module to compensate for the cooling and power supply gap, ensuring that IT equipment operation is unaffected.

[0101] For wind power, considering its stable output at night and large fluctuations during the day, the system prioritizes scheduling wind power to drive the compression module during peak nighttime wind power output periods, which often overlap with periods of low grid electricity prices. This extends the air liquefaction time and increases the amount of liquid air stored. When wind power output fluctuates significantly during the day, the control module dynamically adjusts the switching frequency between energy storage and power generation by monitoring wind power changes in real time. If wind power output suddenly increases, exceeding current cooling and compression requirements, the excess electricity is immediately used to supplement the thermal storage module, heating the molten salt to store heat and provide a heat source for the subsequent vaporization module. If wind power output suddenly decreases, the control module quickly activates the heat stored in the thermal storage module, reducing the vaporization module's reliance on grid auxiliary heating while maintaining stable power generation from the expansion module, thus preventing wind power fluctuations from affecting the overall system operation.

[0102] In addition, the control and energy management module has a renewable energy priority setting function, which can customize the power dispatch order according to the characteristics of renewable energy types in the area where the data center is located, such as prioritizing photovoltaic power in photovoltaic-rich areas and wind power in wind-rich areas. This ensures that while improving the renewable energy absorption rate, the system's ability to guarantee the cooling and power supply of IT equipment is not affected.

[0103] To adapt to the growing IT load demands of data centers, the system has reserved expansion space in its hardware architecture and control logic, enabling capacity upgrades without the need for architecture reconstruction.

[0104] Regarding hardware expansion, when IT load increases by 100%-200%, one or two vacuum-insulated cryogenic storage tanks of the same specifications as the original can be connected in parallel to increase the liquid air storage capacity from the conventional 100m³ to 200-300m³. The new tanks only need to be connected to the manifold of the original liquid air storage module through cryogenic pipelines, without modifying the structure of other sub-modules. If power generation demand increases in tandem with IT load, screw expanders of the same specifications can be connected in parallel, for example, expanding from the initial two 1.5MW expanders to four, increasing the total power generation to 6MW. The new expanders are connected to the inlet pipeline of the original expansion module through airflow distribution valves to ensure uniform airflow distribution.

[0105] Regarding control logic compatibility, the software algorithms of the control and energy management module have automatic identification and adaptation capabilities. For example, after new hardware devices such as storage tanks and expanders are connected to the system, the module can automatically read equipment parameters such as tank liquid level and expander rated power through sensors, and dynamically adjust power dispatch and media distribution strategies without rewriting the control program. For instance, after adding a cryogenic storage tank, the module will automatically recalculate the liquid air distribution ratio based on the total storage volume to ensure a balance in the supply of media for cooling and power generation, adapting to the long-term expansion requirements of the data center.

[0106] When data center IT load increases, the system can adapt through hardware expansion without requiring architecture reconstruction. If increased IT load leads to increased demand for liquid air, the number of vacuum-insulated cryogenic storage tanks can be increased on top of the existing liquid air storage modules. The new tanks are connected to the manifold of the existing storage modules via cryogenic pipelines, directly expanding the liquid air storage capacity. If increased IT load is accompanied by increased power demand, screw expanders can be connected in parallel to the existing expander modules. The new expanders are connected to the inlet pipeline of the existing expander modules via airflow distribution valves, ensuring that airflow is evenly distributed to each expander and improving the system's power generation capacity. Through this expansion method, the system can flexibly adapt to the operational needs of the data center at different stages, ensuring long-term stable operation.

[0107] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A data center energy management system, characterized in that, include: This includes an air liquefied energy storage module, a chip cooling module, and a control and energy management module; The liquefied air energy storage module is used to input electricity to compress air into a liquid state for energy storage during the energy storage phase when there is abundant power or low electricity prices, and to release the stored medium to cool the chip cooling module and / or generate electricity during the energy release-cooling synergy phase when there is a power shortage or high electricity prices. The chip cooling module is used to cool the IT equipment to be cooled using the stored medium. The control and energy management module is used to monitor the environmental status in real time, determine the signal to enter the energy release-cooling coordination phase, and coordinate the energy interaction between the power grid, renewable energy and the liquefied air energy storage module.

2. The system according to claim 1, characterized in that, The liquefied air energy storage module includes a compression module, a liquefaction module, a liquid air storage module, a vaporization module, an expansion module, a heat storage module, and a cold storage module. The compression module is used to compress the input air using the input electricity; The liquefaction module is used to liquefy compressed high-temperature and high-pressure air into a liquid state using the cold energy released by the cold storage module. The liquid air storage module is used to store the liquid air generated by the liquefaction module; The heat storage module is used to store the compression heat generated by the compression module; The vaporization module is used to vaporize the liquid air stored in the liquid air storage module; The expansion module is used to generate electricity using air vaporized by the vaporization module and air cooled by the chip cooling module.

3. The system according to claim 1, characterized in that, The input power includes: The control and energy management module prioritizes the dispatch of electricity from the renewable energy sources and then connects it to the grid as needed; the module is also used for: If the renewable energy source is determined to have power output, the renewable energy power is preferentially used for cooling, and the corresponding reduction in the medium is used to increase power generation; the control and energy management module is also used to: use part of the power output from the power generation for the operation of the IT equipment, and feed the other part back to the power grid.

4. The system according to claim 2, characterized in that, The control and energy management module is also used to monitor the server IT load, chip temperature, liquefied air tank level in the liquid air storage module, and grid power supply capacity in real time, and allocate the proportion of liquid air used for cooling and power generation according to the monitoring results.

5. The system according to claim 4, characterized in that, The chip cooling module includes a direct immersion unit and a cold plate cooling unit; The cold energy stored in the cold storage module is used to cool the chip cooling module; The liquid air is used either as a supplement to the cooling capacity or directly as a cooling medium to cool the chip cooling module. The liquid air cools the IT equipment in the direct immersion unit and is vaporized before being introduced into the expansion module. The liquid air cools the IT equipment in the cold plate cooling unit, and after vaporization, it is introduced into the expansion module.

6. The system according to claim 5, characterized in that, During the energy storage phase, the chip cooling module only activates the cold plate cooling unit, using the cooling capacity provided by the cold storage module to cool it; during the energy release-cooling synergy phase, the vaporization module uses the heat of compression stored in the heat storage module to vaporize the liquid air.

7. The system according to claim 2, characterized in that, The chip cooling module is a duct-type cooling unit; The vaporization module includes a first-stage heat exchanger and a second-stage heat exchanger. If the control and energy management module detects that the temperature of the IT device exceeds a preset threshold, it will use low-temperature air to cool the chip cooling module. Specifically, the cold energy stored in the cold storage module is used to pre-cool the first-stage heat exchanger; the first-stage heat exchanger receives the liquid air input from the liquid air storage module and uses the cold energy to initially vaporize it; the second-stage heat exchanger exchanges heat with the ambient air to form the low-temperature air after initial vaporization.

8. The system according to claim 2, characterized in that, The compression module uses a three-stage screw compressor; the liquefaction module uses a throttling expansion and plate-fin heat exchanger; the liquid air storage module uses a vacuum-insulated cryogenic storage tank; the vaporization module uses a shell-and-tube vaporizer; the expansion module uses a screw expander; the heat storage module is a high-temperature phase change heat storage tank filled with molten salt; and the cold storage module is a low-temperature cold storage tank filled with an aqueous ethylene glycol solution.

9. The system according to claim 5, characterized in that, In the chip cooling module, the direct immersion unit adopts a sealed cooling chamber, the chamber body is made of polytetrafluoroethylene insulating material, the bottom of the cooling chamber is provided with a liquid air inlet, and the top is provided with a vaporized air outlet; the cold plate cooling unit adopts a microchannel cold plate, which is attached to the surface of the server CPU / GPU through a thermal interface material.

10. The system according to claim 7, characterized in that, The chip cooling module adopts a duct-type structure. A sealed duct is provided on the outside of the server array. The duct inlet is connected to the low-temperature air outlet of the vaporization module. A centrifugal fan is installed inside the duct, and the inner wall of the duct is lined with a heat insulation layer. The vaporization module consists of a series of shell-and-tube heat exchangers in stages. The first-stage heat exchanger is connected to the cold storage module, and the second-stage heat exchanger exchanges heat with the ambient air to ensure that the liquid air vaporizes to form low-temperature air with a stable temperature.

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