Chip heat dissipation system based on elastic heat effect and microfluidic technology

Abstract

The invention provides a chip heat dissipation system based on an elastic heat effect and a micro-fluidic technology. The chip heat dissipation system comprises a chip heat dissipation module, an elastic heat refrigeration module and a micro-fluid circulation heat dissipation module, the S-shaped microchannel of the chip heat dissipation module is connected with the microfluid circulation heat dissipation module; the elastic heat refrigeration module comprises a first SMA elastic heat piece and a second SMA elastic heat piece which adopt an alternating circulation working mode, and heat absorption and heat release are carried out through an elastic heat effect generated by phase change. The microfluid circulation heat dissipation module comprises a cooling fin, a hot end heat exchanger, a piezoelectric micropump and a fluid valve. An efficient cold source is provided through the SMA elastic heat effect, rapid and continuous removal of chip heat is achieved in combination with micro-fluidic precise heat exchange, and meanwhile the chip has the advantages of being compact in structure, environmentally friendly and stable in operation.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of chip heat dissipation, and particularly relates to a chip heat dissipation system based on the elastic heat effect and microfluidic technology. BACKGROUND

[0002] With the development of semiconductor technology towards high integration and high power density, the heat generation per unit area of a chip is rapidly rising, and the traditional heat dissipation technology is gradually facing a bottleneck. The current mainstream chip heat dissipation scheme mainly has the following deficiencies: 1. The traditional passive heat dissipation relies on lattice vibration to transfer heat, has high thermal resistance, and cannot meet the heat dissipation needs of high heat flux density chips, and can only horizontally share the heat, and it is difficult to solve the local hot spot problem.

[0003] 2. The conventional liquid cooling heat dissipation system takes away heat through cooling liquid circulation, but the heat transfer path is long, the interface thermal resistance is significant, and the cooling of the cooling liquid relies on an external refrigeration source, so the heat dissipation efficiency is limited by the fluid thermal conductivity, and there are problems of leakage risk and high maintenance cost.

[0004] 3. The existing elastic heat effect heat dissipation technology mostly uses a single SMA element, and the heat dissipation has an interruption period during the phase change, and is not deeply integrated with the microfluidic technology, so that the cooling liquid does not fully contact the heat source, and the heat exchange efficiency is low; although some composite heat dissipation schemes attempt to combine SMA and fluid circuits, they lack precise alternate driving mechanisms, and cannot realize continuous and stable cold energy output.

[0005] In recent years, with the progress of microfluidic technology, although the microchannel cooling technology can shorten the heat transfer path, the microchannel is easy to be blocked by particulate matter, and has very high requirements for the cleanliness of the cooling liquid, and when used alone, it lacks a high-efficiency cold source supply, and it is difficult to match the heat dissipation needs of ultra-high power chips. Therefore, developing a chip heat dissipation system that has high heat dissipation efficiency, continuous working ability, compact structure and environmental friendliness has become the key to solving the current high heat flux density chip heat management problem.

[0006] Through retrieval, the Chinese utility model patent with the publication number CN220417720U discloses a refrigeration system based on elastic heat effect, which comprises a refrigeration device, the refrigeration device comprises a fluid circulation network, four reversing valves and two vertical shape memory alloys; the top ends of the two shape memory alloys are provided with horizontal fixing frames; the fluid circulation network comprises a heat circulation pipe and a cold circulation pipe in which a heat transfer fluid is arranged; the heat circulation pipe is connected with a heat source, and the cold circulation pipe is connected with a heat sink for absorbing heat; the heat circulation pipe is divided into two branches through a reversing valve, and the two branches pass through the two shape memory alloys and are connected with the heat sink through a reversing valve; the cold circulation pipe is divided into two branches through a reversing valve, and the two branches pass through the two shape memory alloys and are connected with the heat source through a reversing valve; the two shape memory alloys are respectively provided with axially horizontal cams, and the two cams are coaxial and reversely arranged and connected with a motor.

[0007] By comparison, the above-mentioned comparative documents and the present application have the following differences: 1. The application scene of the comparative document focuses on "general refrigeration system", and the target is to generate cold energy through the effect of elastic heat and realize the cooling of multiple heat sources, and the cold energy output is realized through the cooperation of the double loop of the heat cycle pipe and the cold cycle pipe. The application scene of the present application is focused on "chip heat dissipation", and the core target is to specifically export the concentrated heat of the chip functional layer, avoid the influence of chip overheating on performance, and belongs to the category of "special heat management". Only through the SMA elastic heat sheet alternately absorbs and releases heat to realize the directional transfer and release of chip heat, and the function is focused on "chip exclusive heat dissipation". The application scenes of the two are significantly different. 2. The comparative document adopts an indirect driving structure of "single motor + reducer + double cam", which drives the transmission shaft to rotate synchronously through the motor, and applies axial load to the SMA from bottom to top through the reversely arranged double cam. The power transmission needs to pass through multiple intermediate components such as reducers, shaft couplings and cams. The present application adopts a "double micro-step motor independent driving" mode, which directly applies linear stress to the two pieces of SMA elastic heat sheet through a connecting rod. The power source is changed from "single motor synchronous indirect driving" to "double motor independent direct driving". The structure is more simplified and can accurately control the alternating rhythm of the two pieces of SMA, which adapts to the high frequency response requirement of chip heat dissipation. The driving modes of the two are obviously different. 3. The comparative document is a conventional tubular loop, which needs to rely on four reversing valves to realize the branch switching of the heat cycle pipe and the cold cycle pipe. The fluid needs to be converted through multiple branches to complete heat exchange. The present application only needs to control the fluid flow direction through the simple on-off combination of a small number of fluid valves, and cooperates with the precise transportation of the piezoelectric micropump. The design core is the S-shaped microchannel structure in the chip substrate, which focuses on the adhesion with the chip functional layer to improve the heat exchange efficiency, rather than relying on the complex loop switching of multiple reversing valves, which is more suitable for the compact installation space of the chip. The purposes of the pipe settings of the two are completely different. 4. The heat exchange module of the comparative document takes "heat sink + double SMA heat exchange branch" as the core. The heat transfer fluid needs to first absorb the heat of the heat release end of the SMA, and then absorb the cold of the heat absorption end of the other SMA after being cooled by the heat sink. The refrigeration needs to be realized through the cooperation of the heat sink and the double SMA branch. The heat exchange system of the present application is more direct, and does not need additional heat sink and redundant heat exchange steps. The heat generated by the chip is directly transferred to the microfluid through the S-shaped microchannel, and the low-temperature microfluid is directly cooled by the SMA elastic heat sheet. The high-temperature microfluid after heat absorption is cooled by the heat end heat dissipation module. The heat exchange efficiency is more suitable for the immediacy requirement of chip heat dissipation. The heat exchange systems and paths of the two are obviously different.

[0008] According to the search, the Chinese invention patent with publication number CN223165751U discloses a heat exchange enhancement thermal power coupling elastic heat refrigeration device and system based on a topological configuration elastic micro-channel. The driving SMA bed is caused to change phase by heat energy, inducing the elastic heat effect of the elastic heat SMA. The length ratio of the elastic heat SMA to the driving SMA is 1:2. The elastic heat SMA bed can achieve greater phase change strain, and release more latent heat during the phase change process. By setting two symmetrical elastic rubbers in the fluid pipeline of the SMA bed, the control of the system flow can be realized, and the fluid can fully exchange heat with the SMA bed through convection, thereby improving the heat exchange efficiency of the refrigeration system. The heat transfer fluid realizes the transfer of cold energy. The refrigeration device is used simultaneously, and the two groups of elastic heat SMA beds realize the alternate dissipation of system cold energy and heat energy.

[0009] After comparison, the above-mentioned comparison file and the present application have the following differences: 1. The application scene of the comparison file focuses on "refrigeration system". The target is to produce low-temperature fluid through the elastic heat effect and realize the continuous output of cold energy, which belongs to the category of "active refrigeration". It needs to realize the refrigeration function through the cooperation of the refrigeration circuit and the heat power conversion circuit. The application scene of the present application is clear, which is "chip heat dissipation". The core target is to timely transfer and release the heat generated by the chip during work to avoid high temperature of the chip, which belongs to the category of "passive heat dissipation enhancement". It only needs to transfer the heat of the chip through the alternate heat absorption of the SMA elastic heat sheet and release it. The function positioning focuses on chip heat management. The application targets of the two are significantly different. 2. The comparison file adopts the heat power coupling structure of "driving SMA bed + elastic heat SMA bed". The driving SMA bed is caused to change phase under the action of high-temperature fluid to generate driving force, which drives the SMA bed displacement sliding device to slide and provides a phase change stress field for the elastic heat SMA bed to trigger the elastic heat effect. The core relies on the length difference between the driving SMA and the elastic heat SMA to realize greater phase change strain. The present application completes the loading and unloading actions through the micro stepping motor driven SMA elastic heat sheet. The power source is changed from "driving SMA phase change driving force" to "motor driving". The structure is simplified and the dependence of the driving SMA bed on high-temperature fluid is avoided. The driving methods and purposes of the two are obviously different. 3. The flow channel design of the comparison file focuses on the topological configuration elastic flow channel inside the SMA bed. The flow channel shape is optimized to increase the convection heat exchange area between the fluid and the nickel-titanium alloy sheet. The flow channel needs to cooperate with multiple reversing valves and fluid pumps to realize complex circuit switching. The core of the present application is to etch an S-shaped micro-channel on the substrate of the chip. When the cooling liquid flows through, it directly exchanges heat with the chip functional layer, improving the heat dissipation efficiency. The flow channel designs of the two are fundamentally different. SUMMARY

[0010] In view of the problems of high thermal resistance, discontinuous heat dissipation, low heat exchange efficiency and insufficient reliability existing in the existing chip heat dissipation technology, the application provides a chip heat dissipation system based on the elastic heat effect and microfluidic technology, which provides an efficient cold source through the SMA elastic heat effect, combines with the microfluidic precise heat exchange, realizes the rapid and continuous removal of chip heat, and has the advantages of compact structure, green environmental protection and stable operation.

[0011] The specific scheme is as follows: A chip heat dissipation system based on the elastic heat effect and microfluidic technology, comprising a chip heat dissipation module, an elastic heat refrigeration module and a microfluidic circulation heat dissipation module; the chip heat dissipation module comprises a chip substrate, a chip functional layer and an S-shaped microchannel; the chip functional layer is located on the upper surface of the chip substrate, and the S-shaped microchannel is embedded in the inside of the chip substrate, the inlet thereof is connected with the microfluidic circulation heat dissipation module through a first pipeline, and the outlet thereof is communicated to the first pipeline at the inlet through a second pipeline. The elastic heat refrigeration module comprises a first SMA elastic heat sheet, a second SMA elastic heat sheet, a first micro stepping motor, a second micro stepping motor, a first connecting rod and a second connecting rod; the first micro stepping motor is in transmission connection with the first SMA elastic heat sheet through the first connecting rod; the second micro stepping motor is in transmission connection with the second SMA elastic heat sheet through the second connecting rod; the first SMA elastic heat sheet and the second SMA elastic heat sheet are both made of shape memory alloy, and generate the elastic heat effect through phase change to absorb and release heat. The microfluidic circulation heat dissipation module comprises a heat dissipation fin, a hot end heat exchanger, a piezoelectric micro pump and a fluid valve; the hot end heat exchanger is provided with an inlet opening, is communicated with the first SMA elastic heat sheet and the second SMA elastic heat sheet through the first pipeline, and is communicated with the S-shaped microchannel to form a closed circulation loop; the heat dissipation fin is arranged above the surface of the hot end heat exchanger; the piezoelectric micro pump is arranged in the closed circulation loop in cooperation; the fluid valve is provided with a plurality of fluid valves, which are installed on different flow paths of the first pipeline and are used for controlling the opening and closing of different flow paths in the closed circulation loop.

[0012] Further, the first SMA elastic heat sheet and the second SMA elastic heat sheet are both made of Ni-Ti-based shape memory alloy, the phase change temperature interval of which is adapted to the working environment requirement of chip heat dissipation, and has good recoverable deformation capacity.

[0013] Further, the fluid valve comprises a first fluid valve, a second fluid valve, a third fluid valve, a fourth fluid valve and a fifth fluid valve, which respectively control the flow path opening and closing between the hot end heat exchanger and the first SMA elastic heat sheet, between the first SMA elastic heat sheet and the S-shaped microchannel, between the second pipeline, the S-shaped microchannel and the second SMA elastic heat sheet, and between the second SMA elastic heat sheet and the hot end heat exchanger; the precise flow of the cooling liquid in different heat dissipation stages can be guaranteed.

[0014] Further, the first SMA thermoelastic sheet is in a loaded state, and the second SMA thermoelastic sheet is in an unloaded state; the first SMA thermoelastic sheet is in an unloaded state, and the second SMA thermoelastic sheet is in a loaded state; the working mode of the thermoelastic refrigeration module is an alternating cycle, so that the continuous output of cold energy is realized, and the interruption of heat dissipation is avoided.

[0015] Further, the first pipeline is filled with cooling liquid; and nano heat-conducting particles are added to the cooling liquid, so that the heat conduction performance is significantly improved, and the cooling liquid has low viscosity and smooth flow in the S-shaped microchannel, and the risk of blockage is reduced.

[0016] Further, the wall surface of the S-shaped microchannel is attached to the functional layer of the chip, so that the heat transfer path is greatly shortened, and the heat transfer efficiency of the chip to the cooling liquid is improved.

[0017] Based on the above structure, the system realizes continuous heat dissipation of the chip through the alternating cycle of the first half cycle and the second half cycle. In the first half cycle, the cooling liquid is injected into the heat end heat exchanger through the water inlet, the second fluid valve and the fifth fluid valve are closed, the cooling liquid is stored in the heat end heat exchanger, two micro stepping motors are started synchronously, the connecting rod drives two SMA thermoelastic sheets to exert linear stress, the SMA thermoelastic sheets undergo austenite to martensite phase change and release latent heat, the first micro stepping motor is kept stationary, the second micro stepping motor is controlled to reverse, the stress on the second SMA thermoelastic sheet is released, the second SMA thermoelastic sheet undergoes reverse phase change from martensite to austenite and absorbs surrounding heat, the piezoelectric micro pump is started, the fifth fluid valve is opened, the cooling liquid flows through the second SMA thermoelastic sheet to be cooled, the third fluid valve is opened, the cooling liquid enters the S-shaped microchannel to absorb the heat generated by the functional layer of the chip, and finally the first fluid valve and the fourth fluid valve are opened, the high-temperature cooling liquid flows through the first SMA thermoelastic sheet to release heat, and then flows back to the heat end heat exchanger to be cooled to an appropriate temperature.

[0018] In the second half cycle, the second micro stepping motor is kept running, the first micro stepping motor is controlled to reverse, the stress on the first SMA thermoelastic sheet is released, the first SMA thermoelastic sheet undergoes reverse phase change and absorbs heat, the piezoelectric micro pump is started, the fifth fluid valve and the third fluid valve are closed, the first fluid valve and the second fluid valve are opened, the cooling liquid flows through the first SMA thermoelastic sheet to be cooled, the third fluid valve is opened, the cooling liquid enters the S-shaped microchannel to absorb the heat of the chip and is heated, the first fluid valve and the second fluid valve are closed, the fifth fluid valve and the fourth fluid valve are opened, the high-temperature cooling liquid flows through the second SMA thermoelastic sheet to release heat, and then flows back to the heat end heat exchanger to be cooled, and a complete cycle is completed.

[0019] Compared with the prior art, the present application has the following advantages: 1. The present application combines the SMA elastothermal effect and microfluidic technology, uses the reverse phase change of the SMA elastothermal sheet to realize rapid heat absorption, and cooperates with the forced convection heat exchange design of the S-shaped microchannel to greatly shorten the heat transfer path and reduce the thermal resistance, compared with the traditional heat dissipation scheme, the cold dissipation efficiency is greatly improved, the chip temperature can be stably controlled in the safe working interval, and the heat dissipation demand of the high heat flux chip is effectively met.

[0020] 2. The present application realizes the continuous output of cold energy through the alternating loading-unloading cycle mode of the double SMA elastothermal sheets, and the precise switching of the fluid valve to the flow passage, completely solves the interruption problem existing in the heat dissipation process of the single SMA element, prolongs the service life of the SMA elastothermal sheet, and guarantees the long-term stable operation of the system.

[0021] 3. The present application does not need to rely on the traditional refrigerant, avoids the greenhouse gas emission from the source, meets the environmental protection requirement, and has high integration design degree of each module, compared with the traditional liquid cooling system, the volume is greatly reduced, is suitable for the high-density packaging scene, and improves the flexibility of installation and use.

[0022] 4. In the present application, the cooling liquid adopts an insulating formula, the chip short circuit risk can be effectively avoided, the S-shaped microchannel structure design reduces the particle blocking probability, and the stable driving pressure of the piezoelectric micro pump significantly reduces the failure rate in the system operation process, and improves the safety and reliability in the use process. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 is the chip heat dissipation system structure schematic diagram based on the elastothermal effect and microfluidic technology in the present application; Figure 2 is the internal microfluid channel schematic diagram of the chip heat dissipation system based on the elastothermal effect and microfluidic technology in the present application; Figure 3 is the cooling liquid flow direction schematic diagram in the first half of the heat dissipation period in the present application; Figure 4 is the cooling liquid flow direction schematic diagram in the second half of the heat dissipation period in the present application; Figure 5 is the chip functional layer upper surface temperature change schematic diagram.

[0024] Mark for explaining the drawing: 1. Radiator 2. First fluid valve 3. First micro stepping motor 4. First connecting rod 5. First SMA elastothermal sheet 6. First pipeline 7. Second fluid valve 8. Third fluid valve 9. Second pipeline 10. Chip functional layer 11. Chip substrate 12. Fourth fluid valve 13. Second micro stepping motor 14. Second connecting rod 15. Second SMA elastothermal sheet 16. Fifth fluid valve 17. Piezoelectric micro pump 18. Water inlet 19. Hot end heat exchanger 20. S-shaped microchannel. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings. The specific implementation manners of the present application will be described in detail below with reference to the drawings and specific embodiments. Embodiment

[0026] As shown in Figure 1 , 2 , the present application is a chip heat dissipation system based on the elastic heat effect and microfluidic technology, which comprises a chip heat dissipation module, an elastic heat refrigeration module and a microfluidic circulation heat dissipation module.

[0027] The chip heat dissipation module comprises a chip substrate 11, a chip functional layer 10 and an S-shaped microchannel 20. The chip functional layer 10 is located on the upper surface of the chip substrate 11, and the S-shaped microchannel 20 is embedded in the inside of the chip substrate 11. The wall surface of the S-shaped microchannel 20 is in close contact with the chip functional layer 10, and the inlet of the S-shaped microchannel 20 is connected to the microfluidic circulation heat dissipation module through a first pipe 6, and the outlet is communicated to the first pipe 6 at the inlet through a second pipe 9. The first pipe 6 is filled with cooling liquid, and nano heat-conducting particles are added to the cooling liquid.

[0028] The elastic heat refrigeration module comprises a first SMA elastic heat sheet 5, a second SMA elastic heat sheet 15, a first micro stepping motor 3, a second micro stepping motor 13, a first connecting rod 4 and a second connecting rod 14. The first micro stepping motor 3 is drivingly connected to the first SMA elastic heat sheet 5 through the first connecting rod 4. The second micro stepping motor 13 is drivingly connected to the second SMA elastic heat sheet 15 through the second connecting rod 14. The first SMA elastic heat sheet 5 and the second SMA elastic heat sheet 15 are both made of Ni-Ti based shape memory alloy, and generate elastic heat effect through phase change to absorb heat and release heat. When the first SMA elastic heat sheet 5 is in a loaded state, the second SMA elastic heat sheet 15 is in an unloaded state. When the first SMA elastic heat sheet 5 is in an unloaded state, the second SMA elastic heat sheet 15 is in a loaded state.

[0029] The microfluidic circulating heat dissipation module includes a heat sink 1, a hot-end heat exchanger 19, a piezoelectric micropump 17, and fluid valves. The hot-end heat exchanger 19 has a water inlet 18, which is connected to the first SMA elastic heat sheet 5 and the second SMA elastic heat sheet 15 through the first pipe 6, and is connected to the S-shaped microchannel 20 to form a closed loop. The heat sink 1 is disposed above the surface of the hot-end heat exchanger 19. The piezoelectric micropump 17 is disposed in the closed loop. Several fluid valves are provided and installed on different flow paths of the first pipe 6 to control the opening and closing of different flow paths in the closed loop. The fluid valves include a first fluid valve 2, a second fluid valve 7, a third fluid valve 8, a fourth fluid valve 12, and a fifth fluid valve 16, which respectively control the flow path between the hot end heat exchanger 19 and the first SMA heat exchanger 5, between the first SMA heat exchanger 5 and the S-shaped microchannel 20, between the second pipeline 9, between the S-shaped microchannel 20 and the second SMA heat exchanger 15, and between the second SMA heat exchanger 15 and the hot end heat exchanger 19.

[0030] like Figure 3 As shown, coolant is injected into the hot-end heat exchanger 19 through inlet 18. The first fluid valve 2 and the fifth fluid valve 16 are closed, keeping the coolant in the hot-end heat exchanger 19. Simultaneously, the first micro stepper motor 3 and the second micro stepper motor 13 are started, their output shafts rotating to drive the first connecting rod 4 and the second connecting rod 14, applying linear stress to the first SMA heat exchanger 5 and the second SMA heat exchanger 15. Under stress, the first SMA heat exchanger 5 and the second SMA heat exchanger 15 undergo a martensitic phase transformation, producing an elasto-thermal effect. The entropy of the SMA alloy decreases, and latent heat is released into the surrounding environment, causing the temperature to rise. At this time, keeping the second micro stepper motor 15 unchanged, the first micro stepper motor 3 is reversed, driving the first connecting rod 4 to gradually release the stress on the first SMA heat exchanger 5. During unloading, a reverse phase transformation occurs, the entropy of the alloy increases, and it absorbs heat from the environment. The piezoelectric micro-pump 17 is started, the first fluid valve 2 is opened, and the coolant flows through the first SMA heat exchanger 5, thereby lowering the coolant temperature. Opening the second fluid valve 7 and closing the third fluid valve 8 and the fourth fluid valve 12 drives the coolant into the S-shaped microchannel 20 within the chip substrate 11, carrying away the heat generated by the relevant components in the chip functional layer 10. At this time, the coolant temperature rises. The coolant flows back to the elastic thermal cooling module through the second pipe 9. Opening the third fluid valve 8, the fourth fluid valve 12, and the fifth fluid valve 16 allows the high-temperature coolant to flow back to the hot-end exchanger 19 through the second SMA elastic thermal plate 15. Through the hot-end exchanger 19 and its upper heat sink 1, heat exchange between the high-temperature coolant and the environment is achieved, cooling the coolant to room temperature. This process constitutes the first half of the system's efficient chip heat dissipation cycle.

[0031] As shown in FIG. 4, the second half cycle is realized. The first micro stepping motor 3 is reversed, and its output shaft rotates reversely to drive the first connecting rod 4 to move, continuously exerting linear stress on the first SMA heat sheet 5. The first SMA heat sheet 5 generates martensitic transformation under the stress, and releases heat to the surrounding environment. Meanwhile, the second micro stepping motor 13 is reversed, and its output shaft rotates to drive the second connecting rod 14 to move, gradually releasing the stress on the second SMA heat sheet 15. During the unloading process, the second SMA heat sheet 15 absorbs heat from the environment. The piezoelectric micro pump 17 is started, the first fluid valve 2 and the second fluid valve 7 are closed, and the fourth fluid valve 12 and the fifth fluid valve 16 are opened. The cooling liquid is driven by the piezoelectric micro pump 17 to flow through the second SMA heat sheet 15 which is absorbing heat, so that the temperature of the cooling liquid is reduced. Then the second fluid valve 7 and the third fluid valve 8 are closed, and the low-temperature cooling liquid is driven into the S-shaped microchannel 20 in the chip substrate 11 to exchange heat with the chip functional layer 10, taking away the heat generated by the chip functional layer 10, at this time the temperature of the cooling liquid rises. The high-temperature cooling liquid flows through the second pipeline 9 back to the heat sheet refrigeration module, and the second fluid valve 7 and the third fluid valve 8 are opened to let the high-temperature cooling liquid flow through the first SMA heat sheet 5 which is releasing heat, and then the first fluid valve 2 is opened to make the high-temperature cooling liquid return to the heat exchanger 19, realizing the heat exchange between the high-temperature cooling liquid and the environment, so that the cooling liquid is cooled again to room temperature or around.

[0032] At this time, the first SMA heat sheet 5 and the second SMA heat sheet 15 complete a complete "alternate loading-unloading" cycle, and the heat dissipation process in the second half cycle is completed. By continuously repeating the operation of the first half cycle and the second half cycle, the chip is continuously and efficiently cooled, as shown in FIG. 5. Figure 5 As shown in FIG. 5, the temperature of the upper surface of the chip functional layer rapidly decreases and remains stable.

[0033] The above embodiments are only used to illustrate the patent of the present application, but not to limit the patent of the present application. Although the patent of the present application is described in detail with reference to the embodiments, those skilled in the art should understand that various combinations, modifications or equivalent replacements of the technical solutions of the patent of the present application do not deviate from the spirit and scope of the patent of the present application, and should be covered in the scope of the claims of the patent of the present application.

Claims

1. A chip heat dissipation system based on elasto-thermal effect and microfluidic technology, characterized in that, It includes a chip heat dissipation module, an elastic-thermal cooling module, and a microfluidic circulation heat dissipation module; the chip heat dissipation module includes a chip substrate, a chip functional layer, and an S-shaped microchannel; the chip functional layer is located on the upper surface of the chip substrate, the S-shaped microchannel is embedded inside the chip substrate, its inlet is connected to the microfluidic circulation heat dissipation module through a first pipe, and its outlet is connected to the first pipe at the inlet through a second pipe. The elasto-thermal cooling module includes a first SMA elasto-thermal sheet, a second SMA elasto-thermal sheet, a first micro stepper motor, a second micro stepper motor, a first connecting rod, and a second connecting rod. The first micro stepper motor is driven to the first SMA elasto-thermal sheet via the first connecting rod. The second micro stepper motor is driven to the second SMA elasto-thermal sheet via the second connecting rod. Both the first and second SMA elasto-thermal sheets are made of shape memory alloy, and absorb and release heat through phase change to generate an elasto-thermal effect. The microfluidic circulating heat dissipation module includes a heat sink, a hot-end heat exchanger, a piezoelectric micropump, and fluid valves. The hot-end heat exchanger has a water inlet and is connected to a first SMA elastic heat sink and a second SMA elastic heat sink via a first pipe, and is also connected to an S-shaped microchannel to form a closed loop. The heat sink is positioned above the surface of the hot-end heat exchanger. The piezoelectric micropump is configured in the closed loop. Several fluid valves are installed on different flow paths of the first pipe to control the on / off state of different flow paths in the closed loop.

2. The chip heat dissipation system based on elasto-thermal effect and microfluidic technology according to claim 1, characterized in that, Both the first and second SMA thermal elastic sheets are made of Ni-Ti based shape memory alloys.

3. A chip heat dissipation system based on elasto-thermal effect and microfluidic technology according to claim 2, characterized in that, The fluid valves include a first fluid valve, a second fluid valve, a third fluid valve, a fourth fluid valve, and a fifth fluid valve, which respectively control the flow path between the hot-end heat exchanger and the first SMA elastic heat plate, between the first SMA elastic heat plate and the S-shaped microchannel, the second pipeline, between the S-shaped microchannel and the second SMA elastic heat plate, and between the second SMA elastic heat plate and the hot-end heat exchanger.

4. A chip heat dissipation system based on elasto-thermal effect and microfluidic technology according to claim 3, characterized in that, When the first SMA heat exchanger is in a loaded state, the second SMA heat exchanger is in an unloaded state; when the first SMA heat exchanger is in an unloaded state, the second SMA heat exchanger is in a loaded state.

5. A chip heat dissipation system based on elasto-thermal effect and microfluidic technology according to claim 4, characterized in that, The first pipe is filled with coolant; the coolant contains nano-thermal conductive particles.

6. A chip heat dissipation system based on elasto-thermal effect and microfluidic technology according to claim 5, characterized in that, The walls of the S-shaped microchannel are attached to the functional layer of the chip.

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